CN112737543A - 一种基于poi结构的高性能声表面波谐振器及制造方法 - Google Patents
一种基于poi结构的高性能声表面波谐振器及制造方法 Download PDFInfo
- Publication number
- CN112737543A CN112737543A CN202011508066.3A CN202011508066A CN112737543A CN 112737543 A CN112737543 A CN 112737543A CN 202011508066 A CN202011508066 A CN 202011508066A CN 112737543 A CN112737543 A CN 112737543A
- Authority
- CN
- China
- Prior art keywords
- layer
- acoustic wave
- velocity material
- electrode
- wave resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011508066.3A CN112737543A (zh) | 2020-12-18 | 2020-12-18 | 一种基于poi结构的高性能声表面波谐振器及制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011508066.3A CN112737543A (zh) | 2020-12-18 | 2020-12-18 | 一种基于poi结构的高性能声表面波谐振器及制造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112737543A true CN112737543A (zh) | 2021-04-30 |
Family
ID=75603436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011508066.3A Pending CN112737543A (zh) | 2020-12-18 | 2020-12-18 | 一种基于poi结构的高性能声表面波谐振器及制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112737543A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114362710A (zh) * | 2021-12-03 | 2022-04-15 | 中国科学院上海微***与信息技术研究所 | 一种声波谐振器 |
WO2023087211A1 (zh) * | 2021-11-18 | 2023-05-25 | 华为技术有限公司 | 一种saw谐振器及saw滤波器 |
CN117118388A (zh) * | 2023-08-21 | 2023-11-24 | 天通瑞宏科技有限公司 | 一种多层复合晶圆及薄膜弹性波器件 |
WO2024001872A1 (zh) * | 2022-06-30 | 2024-01-04 | 华为技术有限公司 | 声表面波滤波器、装置和电子设备 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1037382A2 (en) * | 1999-03-11 | 2000-09-20 | Murata Manufacturing Co., Ltd. | Surface acoustic wave resonator, surface acoustic wave filter, duplexer, communication apparatus, and surface acoustic wave device |
JP2001077654A (ja) * | 1999-08-31 | 2001-03-23 | Mitsubishi Materials Corp | 表面弾性波素子 |
US7285894B1 (en) * | 2004-02-13 | 2007-10-23 | University Of Maine System Board Of Trustees | Surface acoustic wave devices for high temperature applications |
CN106411285A (zh) * | 2015-07-29 | 2017-02-15 | 太阳诱电株式会社 | 声波器件和模块 |
WO2017052646A1 (en) * | 2015-09-25 | 2017-03-30 | Intel Corporation | Island transfer for optical, piezo and rf applications |
JP2019097145A (ja) * | 2017-11-22 | 2019-06-20 | 住友金属鉱山株式会社 | 表面弾性波素子用複合基板とその製造方法 |
JP2019153992A (ja) * | 2018-03-06 | 2019-09-12 | 株式会社Piezo Studio | 弾性表面波デバイス |
JP2019161634A (ja) * | 2018-03-07 | 2019-09-19 | 住友金属鉱山株式会社 | 表面弾性波素子用複合基板とその製造方法 |
JP2019193242A (ja) * | 2018-04-23 | 2019-10-31 | 住友金属鉱山株式会社 | 表面弾性波素子用複合基板とその製造方法 |
CN111510106A (zh) * | 2020-05-06 | 2020-08-07 | 中电科技德清华莹电子有限公司 | 一种声表面波谐振结构滤波器 |
CN111587534A (zh) * | 2018-01-12 | 2020-08-25 | 株式会社村田制作所 | 弹性波装置、多工器、高频前端电路以及通信装置 |
CN111865250A (zh) * | 2020-07-10 | 2020-10-30 | 中国科学院上海微***与信息技术研究所 | 一种poi衬底、高频声波谐振器及其制备方法 |
CN112088490A (zh) * | 2018-05-08 | 2020-12-15 | Rf360欧洲有限责任公司 | 用于超高频的具有复合衬底的saw装置 |
-
2020
- 2020-12-18 CN CN202011508066.3A patent/CN112737543A/zh active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1037382A2 (en) * | 1999-03-11 | 2000-09-20 | Murata Manufacturing Co., Ltd. | Surface acoustic wave resonator, surface acoustic wave filter, duplexer, communication apparatus, and surface acoustic wave device |
JP2001077654A (ja) * | 1999-08-31 | 2001-03-23 | Mitsubishi Materials Corp | 表面弾性波素子 |
US7285894B1 (en) * | 2004-02-13 | 2007-10-23 | University Of Maine System Board Of Trustees | Surface acoustic wave devices for high temperature applications |
CN106411285A (zh) * | 2015-07-29 | 2017-02-15 | 太阳诱电株式会社 | 声波器件和模块 |
WO2017052646A1 (en) * | 2015-09-25 | 2017-03-30 | Intel Corporation | Island transfer for optical, piezo and rf applications |
JP2019097145A (ja) * | 2017-11-22 | 2019-06-20 | 住友金属鉱山株式会社 | 表面弾性波素子用複合基板とその製造方法 |
CN111587534A (zh) * | 2018-01-12 | 2020-08-25 | 株式会社村田制作所 | 弹性波装置、多工器、高频前端电路以及通信装置 |
JP2019153992A (ja) * | 2018-03-06 | 2019-09-12 | 株式会社Piezo Studio | 弾性表面波デバイス |
JP2019161634A (ja) * | 2018-03-07 | 2019-09-19 | 住友金属鉱山株式会社 | 表面弾性波素子用複合基板とその製造方法 |
JP2019193242A (ja) * | 2018-04-23 | 2019-10-31 | 住友金属鉱山株式会社 | 表面弾性波素子用複合基板とその製造方法 |
CN112088490A (zh) * | 2018-05-08 | 2020-12-15 | Rf360欧洲有限责任公司 | 用于超高频的具有复合衬底的saw装置 |
CN111510106A (zh) * | 2020-05-06 | 2020-08-07 | 中电科技德清华莹电子有限公司 | 一种声表面波谐振结构滤波器 |
CN111865250A (zh) * | 2020-07-10 | 2020-10-30 | 中国科学院上海微***与信息技术研究所 | 一种poi衬底、高频声波谐振器及其制备方法 |
Non-Patent Citations (2)
Title |
---|
DMITRY ROSHCHUPKIN等: "Investigation of Surface and Pseudo-Surface Acoustic Waves Excitation and Propagation in La3Ga5SiO14 Crystal", 《2013 JOINT EUROPEAN FREQUENCY AND TIME FORUM & INTERNATIONAL FREQUENCY CONTROL SYMPOSIUM》, pages 687 - 690 * |
舒琳: "声表面波谐振器的高温无线传感特性研究", 《中国博士学位论文全文数据库信息科技辑》, no. 01, pages 135 - 50 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023087211A1 (zh) * | 2021-11-18 | 2023-05-25 | 华为技术有限公司 | 一种saw谐振器及saw滤波器 |
CN114362710A (zh) * | 2021-12-03 | 2022-04-15 | 中国科学院上海微***与信息技术研究所 | 一种声波谐振器 |
CN114362710B (zh) * | 2021-12-03 | 2024-03-29 | 中国科学院上海微***与信息技术研究所 | 一种声波谐振器 |
WO2024001872A1 (zh) * | 2022-06-30 | 2024-01-04 | 华为技术有限公司 | 声表面波滤波器、装置和电子设备 |
CN117118388A (zh) * | 2023-08-21 | 2023-11-24 | 天通瑞宏科技有限公司 | 一种多层复合晶圆及薄膜弹性波器件 |
CN117118388B (zh) * | 2023-08-21 | 2024-04-16 | 天通瑞宏科技有限公司 | 一种多层复合晶圆及薄膜弹性波器件 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112737543A (zh) | 一种基于poi结构的高性能声表面波谐振器及制造方法 | |
US11552615B2 (en) | Acoustic wave device | |
KR101516653B1 (ko) | 탄성 표면파 필터장치 | |
JP5648695B2 (ja) | 弾性波装置及びその製造方法 | |
JP5099151B2 (ja) | 弾性境界波装置の製造方法 | |
CN110120794B (zh) | 弹性波装置、高频前端电路以及通信装置 | |
EP1990915B1 (en) | Acoustic wave device and method for fabricating the same | |
JP5672050B2 (ja) | 弾性表面波フィルタ装置 | |
US20230261633A1 (en) | Layered temperature-compensated surface acoustic wave resonator and packaging method | |
CN112653415A (zh) | 一种多层膜声表面波谐振器及制造方法 | |
WO2010116783A1 (ja) | 弾性波装置 | |
WO2000076067A1 (fr) | Filtre a ondes de surface | |
CN108449066B (zh) | 一种基于固体反射层的声表面波谐振器及其制造方法 | |
CN112787620A (zh) | 一种具有多层膜结构的声表面波谐振器及制造方法 | |
CN112600531A (zh) | 一种高频近零频率温度系数的窄带滤波器及制造方法 | |
CN112653420A (zh) | 一种高声速高频低频率温度系数窄带滤波器及制造方法 | |
CN112653421A (zh) | 一种高声速高频高性能的窄带滤波器 | |
CN112615603B (zh) | 一种具有poi结构的掺钪氮化铝高频谐振器及制造方法 | |
CN112702035A (zh) | 一种高频大宽带低插损高性能声表面波谐振器及制造方法 | |
CN112615601A (zh) | 一种具有poi结构的高fom值兰姆波谐振器 | |
CN112511128A (zh) | 一种具有poi结构的兰姆波谐振器及其制造方法 | |
JP2024505742A (ja) | 共振器及び電子機器 | |
JP2004235886A (ja) | 圧電薄膜素子 | |
Kadota et al. | Acoustic Devices (PAW, SAW, and BAW) using Wafer Bonding Technology | |
CN117526897B (zh) | 双模声表面波器件及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210714 Address after: 510700 Room 202, building D, No. 136, Kaiyuan Avenue, Huangpu District, Guangzhou City, Guangdong Province Applicant after: Guangdong Guangna Technology Development Co.,Ltd. Address before: 510700 room 1004, building D, 136 Kaiyuan Avenue, Huangpu District, Guangzhou City, Guangdong Province Applicant before: Guangdong guangnaixin Technology Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210812 Address after: 510535 Room 201, building D, 136 Kaiyuan Avenue, Huangpu District, Guangzhou City, Guangdong Province Applicant after: Guangdong Guangdong Guangdong Hong Kong Macao Dawan District National Nanotechnology Innovation Research Institute Address before: 510700 Room 202, building D, No. 136, Kaiyuan Avenue, Huangpu District, Guangzhou City, Guangdong Province Applicant before: Guangdong Guangna Technology Development Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210913 Address after: 510700 room 1004, building D, 136 Kaiyuan Avenue, Huangpu District, Guangzhou City, Guangdong Province Applicant after: Guangdong guangnaixin Technology Co.,Ltd. Address before: 510535 Room 201, building D, 136 Kaiyuan Avenue, Huangpu District, Guangzhou City, Guangdong Province Applicant before: Guangdong Guangdong Guangdong Hong Kong Macao Dawan District National Nanotechnology Innovation Research Institute |
|
TA01 | Transfer of patent application right |