CN108323037B - PCB processing technology of double-sided step position electro-gold - Google Patents
PCB processing technology of double-sided step position electro-gold Download PDFInfo
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- CN108323037B CN108323037B CN201810045409.3A CN201810045409A CN108323037B CN 108323037 B CN108323037 B CN 108323037B CN 201810045409 A CN201810045409 A CN 201810045409A CN 108323037 B CN108323037 B CN 108323037B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a PCB processing technology of double-sided step position electro-gold, which comprises an inner daughter board and an outer daughter board, and comprises the following steps: manufacturing an inner layer circuit and an inner layer electroplating lead on the inner layer sub-board; manufacturing a solder mask layer on the inner-layer daughter board corresponding to the step platform; pasting a protective adhesive tape on the inner-layer daughter board corresponding to the step platform; pressing the inner layer sub-board and the outer layer sub-board together to form a multi-layer board; the multilayer board is sequentially subjected to the working procedures of drilling, copper deposition, full-board electroplating, outer-layer circuit manufacturing and solder mask manufacturing, and outer-layer electroplating leads are manufactured during the outer-layer circuit manufacturing; routing outer daughter boards at positions, corresponding to the step platforms, on the multilayer board to form double-sided step platforms; pasting a film on the multilayer board to protect a non-solder-resisting windowing position, and sequentially electroplating nickel gold and thick gold on the solder-resisting windowing position; and then sequentially carrying out the processes of forming and electrical property testing on the multilayer board to obtain the step board. The method can electroplate the electrogilding positions of the inner layer and the outer layer at one time, and saves the electrogilding process of the inner layer at one time.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a PCB processing technology of double-sided step position electro-gold.
Background
In the manufacturing process of some printed circuit boards with special requirements, step platforms need to be designed on two sides of the circuit board, and the gold-plated surfaces need to be exposed at the step platforms.
Most of the existing step plates are plate edge golden finger step plates, and the step plates can be formed by a post-process to remove electroplating leads (electric gold leads); the method for removing the electroplated lead is only suitable for the step plate with neat top ends of the golden fingers and the golden fingers positioned at the edge of the plate, and is not suitable for the step plate which needs the electric gold in the plate locally; and for the product of which the electrogilding surface is required to be exposed at the step platform, the inner layer and the outer layer are required to be respectively subjected to one-time electrogilding process, the process is long, and the production efficiency is low.
Disclosure of Invention
Aiming at the problem that the existing step plate has the defects, the invention provides the PCB processing technology of double-sided step position electro-gold.
In order to solve the technical problem, the invention provides a PCB processing technology of double-sided step position gold, which comprises an inner daughter board and an outer daughter board, and the processing technology comprises the following steps:
s1, manufacturing an inner layer circuit on the inner layer daughter board, and manufacturing an inner layer electroplating lead;
s2, manufacturing a solder mask layer on the inner-layer daughter board corresponding to the step platform, and performing solder mask windowing on the area needing electroplating;
s3: pasting a protective adhesive tape on the inner-layer daughter board corresponding to the step platform;
s4, pressing the inner-layer sub-board and the outer-layer sub-board together through the non-flowing glue PP to form a multi-layer board, and windowing the non-flowing glue PP at a position corresponding to the step platform;
s5, drilling the multilayer board, and metallizing the holes through copper deposition and full board electroplating;
s6, sequentially manufacturing an outer layer circuit and a solder mask layer on the multilayer board, and manufacturing an outer layer electroplating lead when manufacturing the outer layer circuit; when the solder mask layer is manufactured, performing solder mask windowing on a region needing electroplating;
s7, routing outer-layer daughter boards at positions, corresponding to the step platforms, on the multilayer board to form double-sided step platforms;
s8, removing the protective adhesive tape at the step platform, then pasting a film on the multilayer board, and windowing at the solder-resisting windowing position;
s9, sequentially electroplating nickel gold and thick gold at the position of the solder mask windowing;
and S10, sequentially carrying out the processes of forming and electrical property testing on the multilayer board to obtain the step board.
Preferably, in step S3, the protective tape is attached to the inner layer sub-board by quick press.
Preferably, the step S31 is further included between the steps S3 and S4: and milling blind grooves on the outer layer daughter board corresponding to the peripheries of the step platforms.
Preferably, in step S4, during the pressing, one surface of the outer daughter board, on which the blind groove is milled, is placed on the inner side to be attached to the non-flowing PP.
Preferably, in step S4, the size of the window is one side 0.2-0.5mm larger than the size of the step platform.
Preferably, the inner plating lead and the outer plating lead are both arranged between the two unit boards on the side close to the pad on the forming line, and in step S10, the inner plating lead and the outer plating lead are removed in a set shape during forming.
Preferably, the inner sub-board is a single core board or formed by laminating a plurality of core boards.
Preferably, the outer sub-board is a single core board or formed by laminating a plurality of core boards.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, by optimizing the process production flow, after the inner circuit is manufactured on the inner sub-board, the solder mask is manufactured at the position corresponding to the step platform, the solder mask windowing position is exposed and protected by the protective adhesive tape to prevent oxidation, and then the nickel and gold are electroplated together with the solder mask windowing position on the outer circuit, so that the process of once inner layer gold electroplating is saved, and the production efficiency is improved; and the electroplating lead is arranged between the two unit plates on one side close to the bonding pad on the forming line, and can be removed through later-stage routing of set shapes, so that the method disclosed by the invention can be suitable for products with local electrogilding in the plates.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The manufacturing method of the step plate, in particular to the PCB processing technology of the double-sided step position electro-gold, shown in this embodiment, includes an inner core plate and an outer core plate, and the manufacturing method sequentially includes the following processing procedures:
(1) cutting, namely cutting an inner core plate and an outer core plate according to the size of a jointed board of 320mm × 420mm, wherein the thicknesses of the inner core plate and the outer core plate are both 0.5mm, and the thicknesses of the outer copper surfaces of the inner core plate and the outer core plate are both 0.5 OZ.
(2) And manufacturing an inner layer circuit (negative film process): coating photosensitive films on the inner core plate and the outer core plate respectively by using a vertical coating machine according to the pattern positioning holes, controlling the film thickness of the photosensitive films to be 8 mu m, and completing the exposure of inner layer lines by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching the exposed and developed inner layer core board and outer layer core board to form inner layer circuits, and manufacturing inner layer electroplating leads on the inner layer core board together, wherein the inner layer line width is 3mil, and the inner layer circuits comprise areas (such as golden fingers) to be electroplated and bonding pads; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And windowing: according to design requirements, a solder mask layer is manufactured on the inner core board corresponding to the step platform, a solder-resisting window is formed in an area (such as a gold finger) needing electroplating, and the solder mask layer protects circuits at a position of the step platform, which is not the solder-resisting window.
(4) And quick pressing: the protective adhesive tape is pasted on the inner core board corresponding to the step platform, the electroplating area is protected from being oxidized and the later-stage cover uncovering is facilitated, the protective adhesive tape and the inner core board are pasted together through rapid pressing, and the parameters of the rapid pressing are shown in the following table:
| temperature (. degree.C.) | Pressure (kg) | Preheating time(s) | Molding time(s) |
| 110±5 | 5-35 | 5-20 | 20-45 |
(5) Milling a blind groove: and milling blind grooves on the periphery of the outer-layer core plate corresponding to the step platforms in a depth-control groove milling mode according to design requirements.
(6) Windowing: and (4) windowing at the position corresponding to the step platform on the non-flowing glue PP, wherein the unilateral size of the window is 0.2-0.5mm larger than that of the step platform, so that the later-stage cover uncovering is facilitated.
(7) And pressing: the browning speed is according to the brown of the bottom copper and copper, after the inner core plate and the outer core plate are overlapped in sequence through the no-flow glue PP, the inner core plate and the outer core plate are pressed together under proper laminating conditions according to the characteristics of the plate, a multilayer plate is formed, and one surface of the outer core plate, which is provided with the blind groove and is milled, is arranged on the inner side and is attached to the no-flow glue PP.
(8) And outer layer drilling: and drilling the multilayer board by using the drilling data.
(9) And copper deposition, namely metallizing the holes on the multilayer board, and testing the backlight to 10 levels, wherein the thickness of the copper deposition in the holes is 0.5 mu m.
(10) And electroplating the whole plate: according to the prior art and according to the design requirement, full-plate electroplating is carried out on the multilayer board, and the board surface and the copper layer in the hole are thickened.
(11) And outer layer circuit manufacturing (positive process): transferring an outer layer pattern, completing outer layer circuit exposure by using a full-automatic exposure machine and a positive film circuit film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer circuit pattern on the multilayer board through development; electroplating an outer layer pattern, and then respectively plating copper and tin on the multilayer board, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, etching an outer layer circuit on the multilayer board, and manufacturing an outer layer electroplating lead together, wherein the outer layer circuit comprises an electroplating area (such as a gold finger) and a bonding pad; and (4) performing outer layer AOI, then checking the defects of an outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, performing defective scrapping treatment, and discharging a defect-free product to the next flow.
(12) Solder resist and silk screen printing of characters: according to the prior art and according to design requirements, a solder mask layer is manufactured on a multilayer board and characters are silk-screened, and solder mask windowing is carried out on an area needing plating (such as a gold finger).
(13) The gong platform: and milling outer-layer core boards corresponding to the step platforms on the two sides of the multilayer board to form the double-sided step platforms.
Specifically, the outer side surface of the outer layer core plate in the multilayer plate is internally deeply milled to a blind groove at a position corresponding to the step platform, and a double-sided step platform is formed after cover uncovering (removing the milled part of the multilayer plate by a cover uncovering tool).
(14) Film pasting: and removing the protective adhesive tape at the step platform, then pasting a dry film on the multilayer board, and windowing at the solder-resisting windowing positions on the outer layer surface and the step platform.
(15) And electroplating nickel and gold: according to the prior art, the solder mask windowing position is electroplated by utilizing the inner-layer electroplating lead and the outer-layer electroplating lead, and a nickel layer and a gold layer with certain required thickness are uniformly electroplated.
(16) Electroplating thick gold: and electroplating the thickness of the gold layer to the thickness required by the design through thick gold electroplating treatment.
(17) And forming: according to the prior art and according to the design requirement, the step board is manufactured.
In the above, the inner plating lead and the outer plating lead are both provided between the two set boards (unit boards) at a side close to the pad on the forming line and connected to the board edges, and the inner plating lead and the outer plating lead are removed by routing the set boards.
(18) And electrical performance testing: detecting the electrical performance of the step plate, and enabling the qualified step plate to enter the next processing link;
(19) and final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
Example 2
The manufacturing method of the step plate, particularly the PCB processing technology of the double-sided step position electro-gold, shown in this embodiment, includes an inner daughter board and an outer daughter board, and the manufacturing method sequentially includes the following processing procedures:
(1) cutting, namely cutting a core plate according to the size of the jointed plate of 320mm × 420mm, wherein the thickness of the core plate is 0.5mm, and the thickness of the outer copper surface of the core plate is 0.5 OZ.
(2) And manufacturing an inner layer circuit (negative film process): coating a photosensitive film on the core plate by using a vertical coating machine according to the pattern positioning hole, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of the inner layer circuit by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And pressing: according to design requirements, the inner-layer sub-board is formed by laminating a plurality of core boards, and the outer-layer sub-board is formed by laminating other different core boards.
(4) And manufacturing an inner layer circuit (negative film process): coating photosensitive films on the inner layer sub-board and the outer layer sub-board respectively by using a vertical coating machine according to the pattern positioning holes, controlling the film thickness of the photosensitive films to be 8 mu m, and completing the exposure of inner layer circuits by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, namely etching the exposed and developed inner layer daughter board and the exposed and developed outer layer daughter board to form an inner layer circuit respectively, and manufacturing an inner layer electroplating lead on the inner layer daughter board together, wherein the inner layer line width is measured to be 3mil, and the inner layer circuit comprises an area (such as a golden finger) to be electroplated and a bonding pad; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(5) And windowing: according to design requirements, a solder mask is manufactured on the inner-layer daughter board corresponding to the step platform, a solder-resisting window is formed in an area (such as a gold finger) needing electroplating, and the solder mask protects a circuit at a position where the step platform is not the solder-resisting window.
(6) And quick pressing: the protection sticky tape is pasted to the department that corresponds the ladder platform on the inlayer daughter board, and the protection is electroplated the region and is not by oxidation and make things convenient for the later stage to take off the lid, will protect sticky tape and inlayer daughter board through quick pressfitting and paste together, and the parameter of quick pressfitting is shown as follows:
| temperature (. degree.C.) | Pressure (kg) | Preheating time(s) | Molding time(s) |
| 110±5 | 5-35 | 5-20 | 20-45 |
(7) Milling a blind groove: and milling blind grooves on the periphery of the outer-layer daughter board corresponding to the step platforms in a depth-control groove milling mode according to design requirements.
(8) Windowing: and (4) windowing at the position corresponding to the step platform on the non-flowing glue PP, wherein the unilateral size of the window is 0.2-0.5mm larger than that of the step platform, so that the later-stage cover uncovering is facilitated.
(9) And pressing: the browning speed is according to the thick brown of end copper, through not flowing gluey PP with the back inlayer daughter board with outer daughter board coincide in proper order, choose suitable lamination condition to carry out the pressfitting according to the characteristic of sheet material, form the multiply wood, the one side of milling blind groove on the outer core board is arranged in the inboard and is laminated with not flowing gluey PP.
(10) And outer layer drilling: and drilling the multilayer board by using the drilling data.
(11) And copper deposition, namely metallizing the holes on the multilayer board, and testing the backlight to 10 levels, wherein the thickness of the copper deposition in the holes is 0.5 mu m.
(12) And electroplating the whole plate: according to the prior art and according to the design requirement, full-plate electroplating is carried out on the multilayer board, and the board surface and the copper layer in the hole are thickened.
(13) And outer layer circuit manufacturing (positive process): transferring an outer layer pattern, completing outer layer circuit exposure by using a full-automatic exposure machine and a positive film circuit film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer circuit pattern on the multilayer board through development; electroplating an outer layer pattern, and then respectively plating copper and tin on the multilayer board, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, etching an outer layer circuit on the multilayer board, and manufacturing an outer layer electroplating lead together, wherein the outer layer circuit comprises an area (such as a gold finger) needing electroplating and a bonding pad; and (4) performing outer layer AOI, then checking the defects of an outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, performing defective scrapping treatment, and discharging a defect-free product to the next flow.
(14) Solder resist and silk screen printing of characters: according to the prior art and according to design requirements, a solder mask layer is manufactured on a multilayer board and characters are silk-screened, and solder mask windowing is carried out on an area needing plating (such as a gold finger).
(15) The gong platform: and milling outer-layer core boards corresponding to the step platforms on the two sides of the multilayer board to form the double-sided step platforms.
Specifically, the outer side surface of the outer layer core plate in the multilayer plate is internally deeply milled to a blind groove at a position corresponding to the step platform, and a double-sided step platform is formed after cover uncovering (removing the milled part of the multilayer plate by a cover uncovering tool).
(16) Film pasting: and removing the protective adhesive tape at the step platform, then pasting a dry film on the multilayer board, and windowing at the solder-resisting windowing positions on the outer layer surface and the step platform.
(17) And electroplating nickel and gold: according to the prior art, the solder mask windowing position is electroplated by utilizing the inner-layer electroplating lead and the outer-layer electroplating lead, and a nickel layer and a gold layer with certain required thickness are uniformly electroplated.
(18) Electroplating thick gold: and electroplating the thickness of the gold layer to the thickness required by the design through thick gold electroplating treatment.
(19) And forming: according to the prior art and according to the design requirement, the step board is manufactured.
In the above, the inner plating lead and the outer plating lead are both provided between the two set boards (unit boards) at a side close to the pad on the forming line and connected to the board edges, and the inner plating lead and the outer plating lead are removed by routing the set boards.
(20) And electrical performance testing: detecting the electrical performance of the step plate, and enabling the qualified step plate to enter the next processing link;
(21) and final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (7)
1. A double-sided step position electro-gold PCB processing technology comprises an inner layer sub-board and an outer layer sub-board, and is characterized by comprising the following steps:
s1, manufacturing an inner layer circuit on the inner layer daughter board, and manufacturing an inner layer electroplating lead;
s2, manufacturing a solder mask layer on the inner-layer daughter board corresponding to the step platform, and performing solder mask windowing on the area needing electroplating;
s3: pasting a protective adhesive tape on the inner-layer daughter board corresponding to the step platform;
s4, pressing the inner-layer sub-board and the outer-layer sub-board together through the non-flowing glue PP to form a multi-layer board, and windowing the non-flowing glue PP at a position corresponding to the step platform;
s5, drilling the multilayer board, and metallizing the holes through copper deposition and full board electroplating;
s6, sequentially manufacturing an outer layer circuit and a solder mask layer on the multilayer board, and manufacturing an outer layer electroplating lead when manufacturing the outer layer circuit; when the solder mask layer is manufactured, performing solder mask windowing on a region needing electroplating;
s7, routing outer-layer daughter boards at positions, corresponding to the step platforms, on the multilayer board to form double-sided step platforms;
s8, removing the protective adhesive tape at the step platform, then pasting a film on the multilayer board, and windowing at the solder-resisting windowing position;
s9, nickel and gold electroplating and thick gold electroplating are sequentially carried out at the step platform and the solder resisting windowing level of the outer layer at the same time;
s10, sequentially carrying out the working procedures of forming and electrical performance testing on the multilayer board to obtain a step board;
and in the step S10, the inner-layer electroplating lead and the outer-layer electroplating lead are removed in a mode of routing the shapes of the cell boards during forming.
2. The PCB processing technology of double-sided step-level electro-gold of claim 1, wherein in step S3, the protective tape is attached to the inner layer sub-board by rapid press-fitting.
3. The PCB processing technology of double-sided step-position electro-gold of claim 1 or 2, wherein between the steps S3 and S4, further comprising the step S31: and milling blind grooves on the outer layer daughter board corresponding to the peripheries of the step platforms.
4. The PCB processing technology of claim 3, wherein in step S4, during pressing, the surface of the outer daughter board with the milled blind groove is arranged on the inner side and attached to the non-flowing glue PP.
5. The PCB processing technology of the double-sided step-level electro-gold of claim 1, wherein in step S4, the one-sided dimension of the window is 0.2-0.5mm larger than the step platform dimension.
6. The PCB processing technology of double-sided stepped gold wires according to claim 1, wherein the inner daughter board is a single core board or is formed by laminating a plurality of core boards.
7. The PCB processing technology of double-sided stepped gold wires according to claim 1, wherein the outer sub-board is a single core board or is formed by laminating a plurality of core boards.
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| CN108966532A (en) * | 2018-08-20 | 2018-12-07 | 深圳崇达多层线路板有限公司 | A kind of production method of three rank HDI plates of the golden finger containing ladder |
| CN109041458A (en) * | 2018-09-25 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of wiring board and its manufacturing method |
| CN109302802B (en) * | 2018-12-03 | 2019-12-03 | 深圳市博敏电子有限公司 | A kind of manufacturing method exempted from V-cut and stamp hole and spell stepped groove wiring board more |
| CN110290641A (en) * | 2019-06-14 | 2019-09-27 | 广合科技（广州）有限公司 | A kind of high thickness to diameter ratio ladder method for manufacturing gold finger and preparation method thereof |
| CN112218449B (en) * | 2019-07-09 | 2021-08-27 | 梅州市鸿利线路板有限公司 | Double-sided circuit board processing technology |
| CN110933872B (en) * | 2019-11-19 | 2021-09-21 | 广州广合科技股份有限公司 | Stepped gold-plated plug type PCB (printed circuit board) based sectional board manufacturing method |
| CN111757603B (en) * | 2020-06-08 | 2023-09-12 | 大连崇达电路有限公司 | Processing method for improving oxidation of small PCS (process control System) plate metal surface |
| CN112752443A (en) * | 2020-12-05 | 2021-05-04 | 深圳市强达电路有限公司 | Processing method of printed circuit board with step position containing bonding structure |
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
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| CN104768332B (en) * | 2014-01-08 | 2017-10-10 | 深圳崇达多层线路板有限公司 | Printed wiring board with long and short golden finger and preparation method thereof |
| CN205611065U (en) * | 2016-03-17 | 2016-09-28 | 上海嘉捷通电路科技股份有限公司 | Ladder golden finger PCB |
| CN106231816A (en) * | 2016-09-06 | 2016-12-14 | 深圳崇达多层线路板有限公司 | A kind of manufacture method of golden fingerboard without lead wire |
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