CN112655099A - LED display panel manufacturing method and LED display panel - Google Patents
LED display panel manufacturing method and LED display panel Download PDFInfo
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- CN112655099A CN112655099A CN201980057901.5A CN201980057901A CN112655099A CN 112655099 A CN112655099 A CN 112655099A CN 201980057901 A CN201980057901 A CN 201980057901A CN 112655099 A CN112655099 A CN 112655099A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Abstract
The present invention is a method for manufacturing an LED display panel in which a light shielding wall (3) is provided on an LED array substrate (1) in which a plurality of LEDs are arranged in a matrix so as to surround an LED (4), the method including: a step of forming a light-shielding wall (3) by applying a transparent photosensitive resin on a transparent substrate (14), exposing and developing the photosensitive resin by photolithography to form a partition wall (7), and then providing a thin film (8) that reflects or absorbs light on the surface of the partition wall (7); a step of aligning the LED array substrate (1) and the transparent substrate (14) so that each LED (4) of the LED array substrate (1) is accommodated between the adjacent light-shielding walls (3), and then bonding the light-shielding walls (3) to the LED array substrate (1) via an adhesive layer (17); and a step of irradiating the transparent substrate (14) with laser light, and peeling off and removing the transparent substrate (14) from the light-shielding wall (3).
Description
Technical Field
The present invention relates to a method for manufacturing a full-color LED display panel (light emitting diode), and more particularly, to a method for manufacturing an LED display panel and an LED display panel that prevent color mixing between adjacent LEDs.
Background
The conventional LED display panel includes: an array of micro LED devices that emit light in a blue color (e.g., 450 nm-495 nm) or deep blue color (e.g., 420 nm-450 nm); and a wavelength conversion layer (fluorescent light emitting layer) array provided on the micro LED device array, absorbing blue light emission or deep blue light emission from the micro LED device array, and converting the emission wavelength into each of red, green, and blue light, respectively (see, for example, patent document 1).
Documents of the prior art
Patent document
Disclosure of Invention
Problems to be solved by the invention
However, in the conventional LED display panel, since the black matrix is used as a light shielding wall for partitioning the wavelength conversion layer (fluorescent light emitting layer) corresponding to each color, for example, when the layer thickness of the wavelength conversion layer is thick, if a photosensitive resin containing a black pigment is used as the black matrix, the black matrix cannot be deeply exposed due to its light shielding performance, and there is a possibility that an unexposed portion is generated. Therefore, when filling the fluorescent light emitting resist containing the fluorescent dye of the corresponding color into the opening (pixel) of the corresponding color surrounded by the light shielding wall, a part of the light shielding wall is broken and the fluorescent light emitting resist leaks into the adjacent opening of the other color, thereby causing a risk of color mixing. This problem is particularly significant in a light-shielding wall having a large height-to-width aspect ratio.
Accordingly, an object of the present invention is to provide a method of manufacturing an LED display panel and an LED display panel that address such problems and prevent color mixing between adjacent LEDs.
Means for solving the problems
In order to achieve the above object, a method for manufacturing an LED display panel according to the present invention is a method for manufacturing an LED display panel in which a light shielding wall is provided so as to surround LEDs on an LED array substrate in which the LEDs are arranged in a matrix, the method comprising: step 1, coating a transparent photosensitive resin on a transparent substrate; a 2 nd step of forming a partition wall as a base material of the light-shielding wall by exposing and developing a photosensitive resin by photolithography; a 3 rd step of forming the light shielding wall by providing a thin film that reflects or absorbs light emitted from the LED on a surface of the partition wall; a 4 th step of bonding the light-shielding walls to the LED array substrate via an adhesive layer so that the LEDs of the LED array substrate are accommodated between the adjacent light-shielding walls after aligning the LED array substrate with the transparent substrate; and a 5 th step of irradiating laser light from the transparent substrate side, and peeling and removing the transparent substrate from the light shielding wall.
In the LED display panel of the present invention, a light shielding wall is provided so as to surround LEDs on an LED array substrate in which a plurality of LEDs are arranged in a matrix, and the light shielding wall is formed by providing a thin film that reflects or absorbs light on a surface of a transparent partition wall made of a photosensitive resin, and chamfering a corner portion of an opening surrounding at least the LEDs.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a transparent photosensitive resin can be used as a resin material for a light-shielding wall. Therefore, even when a thick photosensitive resin is used as a light-shielding wall having a high aspect ratio of height to width, the light-shielding wall can be completely exposed to the deep depth of the resin, and thus, unlike the photosensitive resin for a black matrix in the related art, no unexposed portion is generated. Therefore, by increasing the stability of the light-shielding wall, when filling, for example, a fluorescent light-emitting resist into an opening surrounded by the light-shielding wall, a part of the light-shielding wall does not collapse and the fluorescent light-emitting resist does not leak into an adjacent opening. This prevents color mixing between adjacent LEDs.
Further, by chamfering the corner of the opening of the light-shielding wall, a uniform thin film can be formed in the opening, and the light-shielding performance of the light-shielding wall can be improved.
Drawings
Fig. 1 is a plan view showing an embodiment of an LED display panel according to the present invention.
Fig. 2 is an enlarged sectional view showing a main part of fig. 1.
Fig. 3 is a plan view showing an enlarged view of the region a in fig. 1, and is an explanatory view showing a chamfer in the opening of the light-shielding wall.
Fig. 4 is a view showing embodiment 1 of the method for manufacturing an LED display panel according to the present invention, and is an explanatory view showing a process for manufacturing an LED array substrate.
Fig. 5 is an explanatory view showing a light-shielding wall forming step of embodiment 1.
Fig. 6 is an explanatory view showing a first half of an assembly process of the LED array substrate and the light shielding wall according to embodiment 1.
Fig. 7 is an explanatory view showing a second half of an assembly process of the LED array substrate and the light shielding wall according to embodiment 1.
Fig. 8 is an explanatory view showing a filling process of the fluorescent dye according to embodiment 1.
Fig. 9 is an explanatory view showing a light-shielding wall forming step in embodiment 2 of the method for manufacturing an LED display panel according to the present invention.
Fig. 10 is an explanatory view showing a first half of an assembly process of the LED array substrate and the light shielding wall according to embodiment 2.
Fig. 11 is an explanatory view showing a second half of an assembly process of the LED array substrate and the light shielding wall according to embodiment 2.
Fig. 12 is a plan view showing a modification of the light-shielding wall, wherein (a) shows a 1 st modification and (b) shows a 2 nd modification.
Fig. 13 is a partially enlarged plan view of fig. 12 (b), and is an explanatory view showing a chamfer on the outer side surface of the light-shielding wall.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view showing an embodiment of an LED display panel according to the present invention, and fig. 2 is an enlarged cross-sectional view of a main portion of fig. 1. The LED display panel displays a color image, and is provided with: the LED array substrate comprises an LED array substrate 1, a fluorescent light-emitting layer 2 and a light shielding wall 3.
As shown in fig. 1, the LED array substrate 1 includes a plurality of micro LEDs 4 (hereinafter, abbreviated as LEDs) arranged in a matrix, the plurality of LEDs 4 are arranged on a display wiring substrate 5, the display wiring substrate 5 includes a TFT drive substrate, a flexible substrate, and the like, and the TFT drive substrate supplies a drive signal to each LED4 from a drive circuit provided outside and is provided with a wiring for individually driving each LED4 to turn on and off.
The LED4 emits light in the ultraviolet or blue wavelength band and is made of gallium nitride (GaN) as a main material. Further, the LED may emit near ultraviolet light having a wavelength of, for example, 200nm to 380nm, or may emit blue light having a wavelength of, for example, 380nm to 500 nm.
As shown in fig. 2, a fluorescent light-emitting layer 2 is provided on each LED4 of the LED array substrate 1. The fluorescent light-emitting layer 2 is excited by excitation light emitted from the LED4 to convert the wavelength of the fluorescent light FL into a corresponding color, and is a fluorescent light-emitting resist containing a fluorescent dye 6 (pigment or dye) of the corresponding color in the red fluorescent light-emitting layer 2R, the green fluorescent light-emitting layer 2G, and the blue fluorescent light-emitting layer 2B arranged in the respective LEDs 4 in correspondence with the three primary colors of red, green, and blue. Although fig. 1 shows the fluorescent light-emitting layers 2 corresponding to the respective colors being provided in a stripe pattern, the fluorescent light-emitting layers 2 may be provided so as to correspond to the respective LEDs 4 individually.
Specifically, as shown in fig. 2, the fluorescent light-emitting layer 2 is obtained by mixing and dispersing a fluorescent dye 6a having a large particle size of several tens of micrometers and a fluorescent dye 6b having a small particle size of several tens of nanometers in a resist film. Further, the fluorescent light-emitting layer 2 may be constituted only by the fluorescent dye 6a having a large particle diameter, but in this case, the filling ratio of the fluorescent dye 6 is lowered, and the light leakage of the excitation light to the display surface side is increased. On the other hand, when the fluorescent light-emitting layer 2 is composed of only the fluorescent dye 6b having a small particle diameter, there is a problem that stability such as light resistance is poor. Therefore, by forming the fluorescent light-emitting layer 2 by mixing a mixture of the fluorescent dye 6b having a small particle diameter mainly with the fluorescent dye 6a having a large particle diameter as described above, it is possible to suppress the leakage of the excitation light to the display surface side and to improve the light emission efficiency.
In this case, the mixing ratio of the fluorescent dyes 6 having different particle diameters is preferably 50 to 90 vol% with respect to the fluorescent dye 6a having a larger particle diameter, and 10 to 50 vol% with respect to the fluorescent dye 6b having a smaller particle diameter.
The LED array substrate 1 is provided with a light shielding wall 3 via an adhesive layer (hereinafter referred to as 2 nd adhesive layer 17) so as to surround the LEDs 4 and the fluorescent light-emitting layers 2 corresponding to the respective colors. The light-shielding walls 3 are provided with thin films 8 for reflecting or absorbing the excitation light emitted from the LED4 and the fluorescence FL emitted by the excitation light fluorescence-emitting layer 2, which are attached to the surface of the partition wall 7 formed by exposing and developing the transparent photosensitive resin by photolithography, while partitioning the fluorescence-emitting layers 2 corresponding to the respective colors from each other.
In this case, the thickness of the transparent photosensitive resin is set to be greater at the position of the top surface of the light-shielding wall 3 formed by processing the photosensitive resin than at the position of the top surface of the LED4 disposed on the LED array substrate 1. Specifically, the thickness of the photosensitive resin is set so that the light shielding wall 3 protrudes from the top surface of the LED4 by about 10 μm to about 40 μm. In addition, in one embodiment, the height from the upper surface of the LED array substrate 1 to the top surface of the LED4 is about 10 μm, but is not limited thereto.
More specifically, in order to increase the filling rate of the fluorescent dye 6a having a large particle diameter in the fluorescent light-emitting layer 2, the transparent photosensitive resin is selected as the partition 7 so that the aspect ratio of the height to the width can be about 1 or more. More preferably, the aspect ratio can be about 3 or more. Examples of such a material include SU-83000 available from Nippon chemical Co., Ltd, a permanent film resist for MEMS (Micro Electronic Mechanical System) such as TMMR S2000 series available from Tokyo Kaisha, and V-259PHA series available from Nikkiso chemical Co., Ltd.
The photosensitive resin is generally selected based on at least one parameter selected from the group consisting of the width between the openings 20 adjacent to the partition wall 7, the height of the partition wall 7, and the aspect ratio of the height to the width of the partition wall 7.
Specifically, the thin film 8 provided on the surface of the partition wall 7 is a metal film of aluminum, aluminum alloy, nickel or the like which easily reflects excitation light, and is formed to a thickness capable of sufficiently blocking the excitation light and the fluorescence FL by a known film forming technique such as sputtering, vapor deposition, plating or the like, and is formed to have a film thickness of, for example, about 50nm or more, preferably about 100nm or more. Thus, the excitation light transmitted through the fluorescent light-emitting layer 2 toward the light-shielding wall 3 is efficiently reflected to the inside of the fluorescent light-emitting layer 2 by the thin film 8 made of a metal film such as aluminum, and can be utilized for light emission of the fluorescent light-emitting layer 2 to improve the light emission efficiency of the fluorescent light-emitting layer 2.
Fig. 3 is a plan view showing an enlarged view of the region a of fig. 1. As shown in fig. 3, at least the corner portions of the opening 20 of the light shielding wall 3 surrounding the LED4 are processed into chamfers 21. This enables the formation of a uniform thin film 8 in the opening 20, and improves the light shielding performance of the light shielding wall 3. Further, the filling ratio of the fluorescent dye 6 can be increased. The shape of the chamfer 21 may be a bevel (C chamfer) or a rounded surface (R chamfer).
In addition, "upper" in the present specification always means a display surface side of the display panel regardless of the installation state of the LED display panel.
Next, a method for manufacturing the LED display panel configured as described above will be described.
The method for manufacturing an LED display panel of the present invention is a method for manufacturing an LED display panel in which a plurality of LEDs 4 are arranged in a matrix on an LED array substrate 1, and a light-shielding wall 3 is provided so as to surround an LED4, wherein the light-shielding wall 3 is formed by exposing and developing a transparent photosensitive resin 16 by photolithography to form a partition wall 7 as a base material of the light-shielding wall 3, and then a thin film 8 for reflecting or absorbing light emitted from the LED4 is formed on the surface of the partition wall 7.
Hereinafter, embodiment 1 of the method for manufacturing an LED display panel will be described in detail.
First, the production of the LED array substrate 1 is explained. The LED array substrate 1 is manufactured by mounting a plurality of LEDs 4 that emit light in the near ultraviolet or blue wavelength band on a display wiring substrate 5 on which wiring for driving the plurality of LEDs 4 is arranged, in a state where the wiring is electrically connected to a predetermined position on the substrate.
Specifically, as shown in fig. 4 (a), a plurality of LEDs 4 emitting light in the near-ultraviolet or blue wavelength band, each having a contact 9 on the side opposite to the light extraction surface 4a, are prepared. More specifically, the LEDs 4 are arranged in a matrix at the same pitch as the LED arrangement positions on the display wiring board 5, and are provided on a sapphire substrate, not shown.
Next, as shown in fig. 4 (b), the conductive elastic protrusions 11 are patterned on the electrode pads 10 provided on the display wiring board 5. In this case, the elastic protruding portion 11 is a resin protrusion 13 having a conductive film 12 having good conductivity such as gold or aluminum adhered to the surface thereof, or a protrusion 13 formed of a conductive photoresist in which conductive fine particles such as silver are added to the photoresist, or a conductive photoresist containing a conductive polymer.
More specifically, in the case where the elastic protrusion 11 is a protrusion 13 having a conductive film 12 attached to the surface thereof, for example, after a resist for optical isolation is applied to the entire upper surface of the display wiring board 5, the protrusion 13 is patterned on the electrode pad 10 by exposure and development using a photomask, and then the conductive film 12 having good conductivity, such as gold or aluminum, is formed on the protrusion 13 and the electrode pad 10 by sputtering or vapor deposition in a state of conduction with each other, thereby forming the elastic protrusion 11.
In this case, a resist layer may be formed on the peripheral portion except on the electrode pad 10 by photolithography before the conductive film 12 is formed, the resist layer may be dissolved by a dissolving solution after the conductive film 12 is formed, and the conductive film 12 on the resist layer may be peeled off.
In the case where the elastic protruding portion 11 is a protrusion 13 formed of a conductive photoresist, the elastic protruding portion 11 is formed by coating the entire upper surface of the display wiring board 5 with a conductive photoresist having a predetermined thickness, exposing and developing the conductive photoresist using a photomask, and patterning the conductive photoresist as the protrusion 13 on the electrode pad 10.
Since the elastic protrusion 11 can be formed by photolithography in this manner, high accuracy in position and shape can be ensured, and the elastic protrusion can be easily formed even when the interval between the contacts 9 of the LED4 is smaller than about 10 μm. Therefore, a high-definition LED display panel can be manufactured.
As described later, when the elastic projection 11 presses the LED4 to electrically connect the contact 9 of the LED4 to the electrode pad 10 of the display wiring board 5, the elastic projection 11 is elastically deformed, and therefore, even when a plurality of LEDs 4 are pressed simultaneously, the respective contacts 9 of the respective LEDs 4 can be reliably brought into contact with the elastic projection 11. Therefore, contact failures between the contact 9 of the LED4 and the electrode pad 10 can be reduced, and the manufacturing yield of the LED display panel can be improved. Here, the case where the elastic protrusion 11 is a protrusion 13 having a conductive film 12 attached to the surface thereof is shown.
Next, as shown in fig. 4 (c), a photosensitive adhesive is applied to the entire upper surface of the display wiring board 5, and then exposed to light using a photomask and developed, and patterned to remove the photosensitive adhesive on the electrode pad 10, thereby forming the 1 st adhesive layer 20. In this case, the thickness of the photosensitive adhesive is larger than the height of the contact 9 including the electrode pad 10, the elastic protrusion 11, and the LED4 of the display wiring board 5.
Next, as shown in fig. 4 (d), the LED4 is positioned and arranged so that the contact 9 and the electrode pad 10 on the display wiring board 5 are aligned with each other, and then the light extraction surface 4a side of the LED4 is pressed, so that the contact 9 and the electrode pad 10 are electrically connected via the conductive elastic projection 11. Further, the 1 st adhesive 2 is cured to fix the LED4 to the display wiring board 5. After that, a laser beam is irradiated from the sapphire substrate side by a known technique, and the sapphire substrate is peeled from the LED 4. In this way, the mounting of the LEDs 4 to the wiring panel for display 5 is completed, and the LED array substrate 1 is manufactured. The 1 st adhesive layer 20 may be a heat-curable type or an ultraviolet-curable type.
On the other hand, in another step, the light-shielding wall 3 is formed. The process of forming the light-shielding wall will be described below with reference to fig. 5.
First, as shown in fig. 5 (a), a transparent photosensitive resin 16 is coated on a transparent substrate 14. In this case, the thickness of the photosensitive resin 16 may be determined so that the position of the top surface of the light-shielding wall 3 after the assembly process of the LED array substrate 1 and the light-shielding wall 3 described later is protruded from the position of the top surface of the LED4 disposed on the LED array substrate 1.
Specifically, the transparent photosensitive resin 16 is coated so that the height of the partition 7 formed by exposing and developing the transparent photosensitive resin 16 is higher than the height from the upper surface of the LED array substrate 1 to the top surface of the LED4 by about 10 to about 40 μm. Incidentally, in the embodiment, the height from the upper surface of the LED array substrate 1 to the top surface of the LED4 is about 10 μm, but is not limited thereto. The photosensitive resin 16 used herein is a material having a high aspect ratio that can have an aspect ratio of height to width of about 3 or more, and is preferably a permanent film resist for MEMS (Micro Electronic Mechanical System) such as SU-83000 manufactured by japan chemical company, or TMMR S2000 series manufactured by tokyo chemical industry co. This makes it possible to sufficiently secure the filling amount of the fluorescent dye 6 filled in the opening 20 surrounded by the partition wall 7 (or the light shielding wall 3), and to improve the wavelength conversion efficiency of the fluorescent light-emitting layer 2. Therefore, a high-luminance display screen can be realized.
Next, as shown in fig. 5 (b), the photosensitive resin 16 is exposed to light using a photomask and developed, and the partition walls 7, which are the base material of the light-shielding walls 3, are formed so as to surround the plurality of LEDs 4 of the same color shown in fig. 1, for example, so that the width between adjacent openings 20 is in the range of, for example, about 3 μm to about 15 μm, preferably about 7 μm. This makes it possible to achieve high definition of the display screen. At this time, as shown in fig. 3, at least the corner portion of the light-shielding wall 3 surrounding the opening 20 of the LED4 is processed into a chamfered corner 21.
Next, as shown in fig. 5 (c), a thin film 8, for example, a metal film of aluminum, aluminum alloy, nickel or the like, is provided on the surface of the partition wall 7 by sputtering, vapor deposition or electroless plating to form the light-shielding wall 3, and the thin film 8 reflects or absorbs light emitted from the LED4, specifically, excitation light emitted from the LED4 and fluorescence FL emitted by the fluorescent light-emitting layer 2 excited by the excitation light. This completes the light-shielding wall forming step.
When the thin film 8 of the light-shielding wall 3 is a metal film that reflects excitation light, the excitation light that has passed through the fluorescent light-emitting layer 2 and directed toward the light-shielding wall 3 is reflected to the inside of the fluorescent light-emitting layer 2 by a metal film such as aluminum or nickel, and can be used for light emission of the fluorescent light-emitting layer 2, thereby improving the light emission efficiency of the fluorescent light-emitting layer 2.
Next, an assembling process of the LED array substrate 1 and the light shielding wall 3 will be described.
First, as shown in fig. 6 (a), a heat-curable or UV-curable adhesive is applied around the LEDs 4 on the LED array substrate 1 to form the 2 nd adhesive layer 17. The adhesive may be applied by using a dispenser or an inkjet, or after a photosensitive adhesive is applied to the entire surface of the LED array substrate 1, exposure and development may be performed using a photomask, thereby forming the 2 nd adhesive layer 17 on the display wiring panel 5 around the LEDs 4.
Next, as shown in fig. 6 (b), in a state where the side of the light-shielding wall 3 of the transparent substrate 14 on which the light-shielding wall 3 is formed faces the LED arrangement surface of the LED array substrate 1, the LED array substrate 1 and the transparent substrate 14 are aligned so that the LEDs 4 of the LED array substrate 1 are accommodated between the adjacent light-shielding walls 3, using alignment marks, not shown, formed in advance in the respective substrates.
Next, as shown in fig. 6 (c), the transparent substrate 14 is pressed in the direction of the arrow to cure the 2 nd adhesive layer 17 of the LED array substrate 1 in a state in which the distal end portion of the light-shielding wall 3 is brought into close contact with the 2 nd adhesive layer 17, thereby bonding the light-shielding wall 3 to the LED array substrate 1. The 2 nd adhesive layer 17 is cured by heat curing, UV curing, or both heat and UV curing depending on the type of adhesive used.
Next, as shown in fig. 7 (a), laser light having a wavelength in the ultraviolet region is irradiated from the transparent substrate 14 side using, for example, a YAG laser or an excimer laser, to ablate the surface of the light-shielding wall 3 at the interface with the transparent substrate 14. The laser light used at this time is a beam having a long axis in one direction, and moves from one end of the transparent substrate 14 to the other end in a direction intersecting the long axis of the beam in a state of being condensed at the interface between the transparent substrate 14 and the light-shielding wall 3.
Next, as shown in fig. 7 (b), the transparent substrate 14 is peeled from the light-shielding wall 3 in the direction of the arrow. Thereby, the light-shielding wall 3 with the thin film 8 attached to the surface thereof is left on the LED array substrate 1. A part of the film 8 is attached to the surface of the transparent substrate 14 corresponding to the opening 20 surrounded by the light shielding wall 3, and the film 8 is removed from the LED 4.
Then, as shown in fig. 8, a fluorescent light emitting resist containing a fluorescent dye 6 (pigment or dye) of the corresponding color is filled into the opening 20 of the corresponding color surrounded by the light shielding wall 3, for example, by ink jet, and then dried to form the fluorescent light emitting layer 2. Alternatively, after coating a fluorescent light emitting resist on the entire surface of the LED array substrate 1, the fluorescent light emitting resist corresponding to each color may be exposed and developed using a photomask, and the fluorescent light emitting layer 2 corresponding to each color may be formed in the opening 20 corresponding to each color surrounded by the light blocking wall 3. Thus, the LED display panel shown in fig. 1 and 2 is completed.
Next, embodiment 2 of the method for manufacturing an LED display panel will be described. Since the steps of manufacturing the LED array substrate and filling the fluorescent dye are the same as those of embodiment 1, the step of forming the light-shielding wall 3 and the step of assembling the LED array substrate and the light-shielding wall, which are different from those of embodiment 1, will be described.
Fig. 9 is an explanatory view showing a light-shielding wall forming step in embodiment 2 of the method for manufacturing an LED display panel according to the present invention.
First, as shown in fig. 9 (a), a transparent photosensitive resin 16 is coated on a transparent substrate 14 in the same manner as in embodiment 1. Specifically, the transparent photosensitive resin 16 is coated so that the height of the partition 7 formed by exposing and developing the transparent photosensitive resin 16 is higher by about 10 μm to about 40 μm than the height from the top surface of the LED array substrate 1 to the top surface of the LED 4. As described above, in the embodiment, the height from the upper surface of the LED array substrate 1 to the top surface of the LED4 is about 10 μm, but is not limited thereto. The photosensitive resin 16 used here is selected from materials that can have an aspect ratio of height to width of about 1 or more. More preferably, a material capable of having an aspect ratio of height to width of about 3 or more is selected, and for example, a permanent film resist for MEMS (Micro Electronic Mechanical System) such as SU-83000 manufactured by japan chemical co.
Next, as shown in fig. 9 (b), the photosensitive resin 16 is exposed and developed using a photomask, and the partition walls 7 as the base material of the light-shielding walls 3 are formed so as to surround the plurality of LEDs 4 of the same color as shown in fig. 1, for example, so that the width between adjacent openings 20 is in the range of, for example, about 3 μm to about 15 μm, preferably about 7 μm. At this time, at least the corner of the light shielding wall 3 surrounding the opening 20 of the LED4 is processed into a chamfer 21 as shown in fig. 3.
Next, as shown in fig. 9 (c), a thin film 8, for example, a metal film of aluminum, aluminum alloy, nickel or the like is provided on the surface of the partition wall 7 by sputtering, vapor deposition or electroless plating to form the light-shielding wall 3, and the thin film 8 reflects or absorbs light emitted from the LED4, specifically, excitation light emitted from the LED4 and fluorescence FL emitted by the fluorescent light-emitting layer 2 excited by the excitation light.
Next, as shown in fig. 9 (d), laser light in a visible region or an ultraviolet region, for example, is irradiated from the side of the light-shielding wall 3, and the surface film 8 of the transparent substrate 14 attached to the top surface of the light-shielding wall 3 and inside the opening 20 surrounded by the light-shielding wall 3 is removed. This completes the light-shielding wall forming step.
Next, an assembling process of the LED array substrate 1 and the light shielding wall 3 will be described.
First, as shown in fig. 10 (a), a heat-curable or UV-curable adhesive is applied around the LEDs 4 on the LED array substrate 1 to form the 2 nd adhesive layer 17. The adhesive may be applied by using a dispenser or an inkjet, or a photosensitive adhesive may be applied to the entire surface of the LED array substrate 1, and then exposed and developed using a photomask, thereby forming the 2 nd adhesive layer 17 on the display wiring panel 5 around the LEDs 4.
Next, as shown in fig. 10 (b), in a state where the side of the light-shielding wall 3 of the transparent substrate 14 on which the light-shielding wall 3 is formed is opposed to the LED arrangement surface of the LED array substrate 1, the LED array substrate 1 and the transparent substrate 14 are aligned so that the LEDs 4 of the LED array substrate 1 are accommodated between the adjacent light-shielding walls 3, using alignment marks (not shown) formed in advance in the respective substrates.
Next, as shown in fig. 10 (c), the transparent substrate 14 is pressed in the arrow direction to cure the 2 nd adhesive layer 17 of the LED array substrate 1 in a state where the distal end portion of the light-shielding wall 3 is in close contact with the 2 nd adhesive layer 17, thereby bonding the light-shielding wall 3 to the LED array substrate 1. The 2 nd adhesive layer 17 is cured by heat curing, UV curing, or both heat and UV curing depending on the type of adhesive used.
Next, as shown in fig. 11 (a), a laser beam having a wavelength in the ultraviolet region is irradiated from the transparent substrate 14 side using, for example, a YAG laser or an excimer laser, so as to ablate the surface of the light-shielding wall 3 at the interface with the transparent substrate 14. The laser light used at this time is a beam having a long axis in one direction, and moves from one end of the transparent substrate 14 to the other end in a direction intersecting the long axis of the beam in a state of being condensed at the interface between the transparent substrate 14 and the light-shielding wall 3.
Next, as shown in fig. 11 (b), the transparent substrate 14 is peeled from the light-shielding wall 3 in the direction of the arrow. Thereby, the light-shielding wall 3 having the thin film 8 attached to the surface thereof is left on the LED array substrate 1. In this case, unlike embodiment 1, the partition walls 7 of the light-shielding walls 3 are directly bonded to the LED array substrate 1 via the 2 nd adhesive layer 17, so that the bonding strength between the light-shielding walls 3 and the LED array substrate 1 is increased, and there is no problem that the light-shielding walls 3 are peeled from the LED array substrate 1.
Thereafter, as in embodiment 1 shown in fig. 8, the fluorescent dye 6 corresponding to each color is filled in the opening 20 corresponding to each color surrounded by the light-shielding wall 3, thereby completing the LED display panel.
Fig. 12 is an enlarged plan view of a main part showing a modification of the light shielding wall 3 formed on the LED display panel, and (a) shows a 1 st modification and (b) shows a 2 nd modification.
In the modification 1 shown in fig. 12 a, the LED4 and the fluorescent light-emitting layer 2 corresponding to three adjacent colors are used as one pixel 18, and the light-shielding wall 3 between the pixels 18 located in the X direction in the first pixel arrangement direction (hereinafter, referred to as "X direction") and the second pixel arrangement direction (hereinafter, referred to as "Y direction") orthogonal to each other is provided with a gap 19 intersecting the X direction.
In addition, in the 2 nd modification shown in fig. 12 (b), the light-shielding walls 3 between the pixels 18 positioned in the X direction are provided with the gaps 19 intersecting with the X direction, and the light-shielding walls 3 between the pixels 18 positioned in the Y direction are provided with the gaps 19 intersecting with the Y direction.
Accordingly, for example, in the case where the display wiring board 5 of the LED array substrate 1 is a flexible substrate having flexibility, the LED display panel of modification 1 shown in fig. 12 (a) can be easily rolled up in the X direction. Further, the LED display panel of modification 2 shown in fig. 12 (b) can be easily rolled up in either the X direction or the Y direction. Therefore, the carrying of the LED display panel becomes easy.
In the above embodiment, the case where the chamfer 21 is provided at the corner of the opening 20 of the light-shielding wall 3 has been described, but the present invention is not limited to this, and the chamfer 21 may be further provided at the corner of the outer surface of the light-shielding wall 3 as shown in the region B shown in fig. 13. This can prevent the light-shielding wall 3 from being damaged.
In the above embodiment, the light-shielding wall 3 formed on the transparent substrate 14 is transferred to the LED array substrate 1, but the present invention is not limited thereto, and the light-shielding wall 3 may be formed directly on the LED array substrate 1. In this case, after the LED array substrate 1 is coated with the transparent photosensitive resin 16, exposure and development are performed using a photomask, the partition 7 is formed so as to surround the LED4, the thin film 8 is formed on the surface of the partition 7 by forming a film from the partition 7 side, and the thin film 8 attached to the LED4 and the periphery of the LED4 is removed by irradiation with laser light.
Further, in the above description, the case where the plurality of LEDs 4 emit light in the ultraviolet or blue wavelength band, and the fluorescent light emitting layer 2 is provided on the plurality of LEDs 4 corresponding to the three primary colors, and the fluorescent light emitting layer 2 is excited by excitation light emitted from each LED4 and wavelength-converted into fluorescent light of a corresponding color, respectively, has been described, but the present invention is not limited thereto, and the plurality of LEDs 4 may individually emit light of red, green, and blue colors. Alternatively, some of the LEDs 4 corresponding to three colors may be LEDs 4 which are a combination of the LED4 emitting light in the ultraviolet or blue wavelength band and the fluorescent light-emitting layer 2.
Description of the symbols
1 … LED array substrate, 2 … fluorescent light emitting layer, 3 … light shielding wall, 4 … LED, 7 … partition wall, 8 … film, 14 … transparent substrate, 16 … photosensitive resin, 17 … 2 nd adhesive layer (adhesive layer), 18 … pixel, 19 … gap, 20 … opening, 21 … chamfer, X … 1 st pixel arrangement direction, Y … 2 nd pixel arrangement direction.
Claims (12)
1. A method for manufacturing an LED display panel in which a light shielding wall is provided so as to surround a plurality of LEDs on an LED array substrate on which the LEDs are arranged in a matrix, the method comprising:
step 1, coating a transparent photosensitive resin on a transparent substrate;
a 2 nd step of forming partition walls as a base material of the light-shielding walls by exposing and developing the photosensitive resin by photolithography;
a 3 rd step of forming the light shielding wall by providing a thin film that reflects or absorbs light emitted from the LED on a surface of the partition wall;
a 4 th step of aligning the LED array substrate and the transparent substrate so that the LEDs of the LED array substrate are accommodated between the adjacent light-shielding walls, and then bonding the light-shielding walls to the LED array substrate via an adhesive layer; and
and a 5 th step of irradiating laser light from the transparent substrate side, and peeling and removing the transparent substrate from the light shielding wall.
2. The method of manufacturing an LED display panel according to claim 1,
after the step 3 is completed, the thin film attached to the top surface of the light-shielding wall and the surface of the transparent substrate in the opening surrounded by the light-shielding wall is removed before the step 4 is performed.
3. The method of manufacturing an LED display panel according to claim 1 or 2,
a plurality of said LEDs emit light at ultraviolet or blue wavelengths,
fluorescent light-emitting layers are provided on the plurality of LEDs corresponding to the three primary colors of light, and the fluorescent light-emitting layers are excited by excitation light emitted from the respective LEDs and wavelength-converted into fluorescent light of the corresponding colors, respectively.
4. The method of manufacturing an LED display panel according to claim 1 or 2,
the thickness of the photosensitive resin is determined so that the position of the top surface of the light shielding wall after completion of the step 5 is protruded from the position of the top surface of the LED arranged on the LED array substrate.
5. The method of manufacturing an LED display panel according to claim 1 or 2,
the photosensitive resin is selected based on at least one parameter of a width between the openings adjacent to the partition wall, a height of the partition wall, and an aspect ratio of the height to the width of the partition wall.
6. The method of manufacturing an LED display panel according to claim 1 or 2,
at least a corner portion of the light shielding wall surrounding the opening of the LED is processed to be chamfered.
7. The method of manufacturing an LED display panel according to claim 1 or 2,
the adjacent LEDs corresponding to three colors are used as one pixel, and a gap crossing the 1 st pixel arrangement direction is arranged on the light shielding wall between at least the pixels in the 1 st pixel arrangement direction in the orthogonal 1 st pixel arrangement direction and the 2 nd pixel arrangement direction.
8. An LED display panel in which a light shielding wall is provided so as to surround a plurality of LEDs on an LED array substrate in which the LEDs are arranged in a matrix,
the light shielding wall is provided with a thin film that reflects or absorbs light on a surface of a transparent partition wall made of a photosensitive resin, and corners that surround at least an opening of the LED are processed to be chamfered.
9. The LED display panel of claim 8,
the LED array substrate is a substrate in which a plurality of LEDs for emitting light in an ultraviolet or blue wavelength band are arranged in a matrix on a substrate,
a plurality of fluorescent light emitting layers which are excited by excitation light emitted from the LEDs and wavelength-converted into fluorescent light of the corresponding color, respectively, are provided on the plurality of LEDs in the opening surrounded by the light shielding wall so as to correspond to the three primary colors of light,
the thin film of the light shielding wall reflects or absorbs the excitation light and the fluorescence.
10. The LED display panel according to claim 8 or 9,
the top surface of the light shielding wall is higher than the top surface of the LED arranged on the LED array substrate.
11. The LED display panel according to claim 8 or 9,
the photosensitive resin is selected based on at least one parameter of a width between the openings adjacent to the partition wall, a height of the partition wall, and an aspect ratio of the height to the width of the partition wall.
12. The LED display panel according to claim 8 or 9,
the adjacent LEDs 1 corresponding to three colors are used as one pixel, and a gap crossing the 1 st pixel arrangement direction is provided between the light shielding walls located in at least the 1 st pixel arrangement direction out of the 1 st pixel arrangement direction and the 2 nd pixel arrangement direction which are orthogonal to each other.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018167241A JP2020043140A (en) | 2018-09-06 | 2018-09-06 | Method for manufacturing led display panel and led display panel |
| JP2018-167241 | 2018-09-06 | ||
| PCT/JP2019/029601 WO2020049896A1 (en) | 2018-09-06 | 2019-07-29 | Method for manufacturing led display panel, and led display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112655099A true CN112655099A (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980057901.5A Pending CN112655099A (en) | 2018-09-06 | 2019-07-29 | LED display panel manufacturing method and LED display panel |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2020043140A (en) |
| KR (1) | KR20210055676A (en) |
| CN (1) | CN112655099A (en) |
| TW (1) | TW202025474A (en) |
| WO (1) | WO2020049896A1 (en) |
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| CN111681985B (en) * | 2020-06-23 | 2023-06-23 | 广东聚华印刷显示技术有限公司 | Display panel peeling method |
| CN112164334B (en) * | 2020-10-27 | 2022-08-26 | 湖北长江新型显示产业创新中心有限公司 | Display panel, display device and preparation method of display panel |
| CN112802949B (en) * | 2021-03-30 | 2021-07-06 | 北京芯海视界三维科技有限公司 | Manufacturing method of display device |
| JP2024017711A (en) * | 2022-07-28 | 2024-02-08 | デクセリアルズ株式会社 | Manufacturing method of light emitting device and black transfer film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010087224A (en) * | 2008-09-30 | 2010-04-15 | Toyoda Gosei Co Ltd | Led display device and method of manufacturing barrier for led display device |
| TWI594661B (en) * | 2013-04-19 | 2017-08-01 | 隆達電子股份有限公司 | Led display and manufacturing method thereof |
| US8987765B2 (en) * | 2013-06-17 | 2015-03-24 | LuxVue Technology Corporation | Reflective bank structure and method for integrating a light emitting device |
| US9111464B2 (en) | 2013-06-18 | 2015-08-18 | LuxVue Technology Corporation | LED display with wavelength conversion layer |
| JP2015215429A (en) * | 2014-05-09 | 2015-12-03 | 株式会社明電舎 | Led display device and manufacturing method of led display device |
| KR102427644B1 (en) * | 2015-11-16 | 2022-08-02 | 삼성전자주식회사 | Light source, method of manufacturing the same, and display apparatus having the same |
| US10606121B2 (en) * | 2016-09-12 | 2020-03-31 | Seoul Semiconductor Co., Ltd. | Display apparatus |
| JP2019102664A (en) * | 2017-12-04 | 2019-06-24 | 株式会社ブイ・テクノロジー | Method for manufacturing led display panel |
-
2018
- 2018-09-06 JP JP2018167241A patent/JP2020043140A/en active Pending
-
2019
- 2019-07-29 KR KR1020217004277A patent/KR20210055676A/en unknown
- 2019-07-29 WO PCT/JP2019/029601 patent/WO2020049896A1/en active Application Filing
- 2019-07-29 CN CN201980057901.5A patent/CN112655099A/en active Pending
- 2019-08-08 TW TW108128223A patent/TW202025474A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210055676A (en) | 2021-05-17 |
| WO2020049896A1 (en) | 2020-03-12 |
| JP2020043140A (en) | 2020-03-19 |
| TW202025474A (en) | 2020-07-01 |
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