CN112601372A - Wiring printing device of frameless display device and display device - Google Patents
Wiring printing device of frameless display device and display device Download PDFInfo
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- CN112601372A CN112601372A CN202010946977.8A CN202010946977A CN112601372A CN 112601372 A CN112601372 A CN 112601372A CN 202010946977 A CN202010946977 A CN 202010946977A CN 112601372 A CN112601372 A CN 112601372A
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- 238000007639 printing Methods 0.000 title claims abstract description 135
- 238000000034 method Methods 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 203
- 230000005484 gravity Effects 0.000 claims description 17
- 238000005245 sintering Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 6
- 238000000149 argon plasma sintering Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 3
- 230000002950 deficient Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 13
- 239000010408 film Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000003334 potential effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present embodiment provides a wiring printing apparatus and a display apparatus, which minimize a frame area of the display apparatus and reduce a mask process by forming a wiring structure connecting lines of a display region and lines of a driving circuit.
Description
Technical Field
The invention belongs to the technical field of display devices and printing devices. This research relates to a project (No.2018M3A7B4071521) that obtains subsidized execution of government (department of scientific and technical information communication) with the support of the korean research foundation-nanomaterial technology development business.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
The frame surrounding the front panel of the screen is called a bezel. The frame is a portion that does not include a display Area (Active Area). The effect of a larger visual screen is achieved with a thinner frame, and a sophisticated design can be achieved.
A technique called "borderless-Less" or Zero-Bezel (Zero-Bezel) "is a technique of minimizing or eliminating a driving circuit in front of a screen. In the frame bending process, a flexible circuit connected to a driving circuit is bent and disposed behind a substrate. During the existing bending process, cracks may occur, and an inorganic/organic film etching process is required in the bending region.
Prior art documents
Patent document
Patent document 1 Korean laid-open patent publication No. 10-2017-0116845 (2017.10.20)
Patent document 2 Korean laid-open patent publication No. 10-2018-0028821 (2018.03.19)
Patent document 3 Korean laid-open patent publication No. 10-2015-0019876 (2015.02.25)
Disclosure of Invention
It is a primary object of embodiments of the present invention to provide a wiring structure for connecting lines of a display region and lines of a driving circuit by a printing process, thereby minimizing a frame area of a display device and reducing a photomask process.
Other objects of the present invention, which are not explicitly shown, can be further considered within a scope easily inferred from the following detailed description and effects thereof.
According to a side of the present embodiment, there is provided a wiring printing apparatus comprising: a substrate moving part moving the substrate along a predetermined path; a printing unit for forming wiring by discharging a conductive droplet on a part of a side surface of the substrate; and a control section for transmitting control signals to the substrate moving section and the printing section.
The substrate moving part may rotate the substrate by a preset angle.
The printing unit may eject the conductive droplet through a nozzle on a part of one surface of the substrate, a part of a side surface of the substrate, and a part of another surface opposite to the one surface.
The control unit may adjust a discharge position, a discharge time, and a discharge amount of the conductive droplet while the substrate is rotated by the angle.
The control portion may be configured such that, during a preset ejection cycle, a point at which the printing portion starts to eject the conductor droplet corresponds to a portion of one surface of the substrate, and a point at which the printing portion ends the ejection of the conductor droplet corresponds to a portion of the other surface of the substrate.
The wiring printing apparatus may include a sensor for (i) measuring a distance between the substrate and the nozzle, or (ii) measuring a rotation angle of the substrate, or (iii) measuring a weight and a center of gravity of the substrate, or (iv) a number and a connection state of the wirings.
The control part may set the following mode by measuring the state of the substrate through the sensor or referring to a stored table; (i) a first printing mode in which the substrate moving section rotates the substrate by 180 degrees around a region, not a center of gravity of the substrate, along a semicircular arc path, and the printing section fixes the nozzle or moves within a side length of the substrate; (ii) a second printing mode in which the substrate moving section rotates the substrate 180 degrees around the center of gravity of the substrate along a semicircular arc path, and the printing section moves the nozzle along a semicircular arc path; and (iii) a third printing mode in which the substrate moving section rotates the substrate by 180 degrees along an arc path formed to have a height longer than a diameter of a semicircle, and the printing section moves the nozzle along a straight path; or an integrated printing mode of a combination of these.
The weight of the substrate is measured by the sensor, and a balance weight may be attached to the substrate moving part in order to maintain a rotational balance, considering that the substrate moving part rotates the substrate not about the center of gravity but about an area of the substrate.
The controller may send a control signal to the printing unit so that the conductor droplet is discharged after the vibration of the substrate is stabilized.
The number of the wires and the connection state are measured by the sensor, and if it is determined that the number of the wires is insufficient or the connection state is defective, the printing unit can discharge the conductor droplet again at the position corresponding to the wire.
The number of the nozzles is plural, and the width between the first nozzle and the last nozzle does not exceed the width of the substrate, and the interval between the nozzles is larger than or equal to the radius of the nozzles.
The printing portion may eject the conductive droplets by an Inkjet (Inkjet) or Electrohydrodynamics (EHD) method.
The wiring may connect (i) a plurality of first electrode lines connected to a display area formed on one surface of the substrate and (ii) a plurality of second electrode lines connected to a driving circuit formed on the other surface of the substrate.
In the wiring, a first region formed on one surface of the substrate or a third region formed on the other surface of the substrate may be set to be a plane or a radius of curvature 10R or less.
In the wiring, the second region formed at the side of the substrate may be disposed to have an angle of 60 to 120 degrees.
The wiring printing apparatus may include a sintering portion that sinters the conductor droplets by a thermal sintering method, which may be performed in a range of 50 ℃ to 200 ℃, an ultraviolet sintering method, which may be performed in a wavelength range of 200nm to 400nm, or a laser sintering method, which may be performed in a wavelength range of 450nm to 550 nm.
According to another aspect of the present embodiment, there is provided a display device, including: a substrate; a display area formed on one surface of the substrate and having a plurality of first electrode lines for transmitting signals; a driving circuit formed on the other surface of the substrate and having a plurality of second electrode lines for applying signals to the display area; and a line connecting the plurality of first electrode lines of the display region and the plurality of second electrode lines of the driving circuit, and printed on a portion of one surface of the substrate, a portion of a side surface of the substrate, and a portion of another surface opposite to the one surface.
The wiring may be printed by a wiring printing device.
The display device may include a protective layer for protecting the wiring.
Effects of the invention
As described above, according to the embodiments of the present invention, by forming the wiring structure connecting the lines of the display region and the lines of the driving circuit through the printing process, there are effects of minimizing the frame area of the display device and reducing the photomask process.
Even if an effect not explicitly mentioned here is an effect described in the following description expected from the technical features of the present invention and a potential effect thereof can be dealt with as described in the description of the present invention.
Drawings
Fig. 1 is an exemplary view of a conventional bezel curvature.
Fig. 2 and 3 are exemplary block diagrams of a wiring printing apparatus according to an embodiment of the present invention.
Fig. 4 to 6 are exemplary diagrams of various printing modes of the wiring printing apparatus according to the embodiment of the present invention.
Fig. 7 is an exemplary diagram of a counterweight mounted on a wiring printing apparatus according to an embodiment of the present invention.
Fig. 8 is a diagram showing an example of the arrangement of nozzles of the wiring printing apparatus according to an embodiment of the present invention.
Fig. 9 and 10 are exemplary views of a display device according to another embodiment of the present invention.
Description of the symbols:
200. 300, and (2) 300: wiring printing apparatus, 210, 310: substrate moving unit, 220, 320: printing section, 230, 330: control unit, 340: sensor, 350: sintering section, 900: display device, 910: substrate, 920: display area, 930: drive circuit, 940: and (6) wiring.
Detailed Description
In the following description of the present invention, when it is determined that a known function is clear to a person skilled in the art and the gist of the present invention is not clear, a detailed description thereof will be omitted, and a partial embodiment of the present invention will be described in detail with reference to an exemplary diagram.
FIG. 1 is a plan view and a cross-sectional view A-A' of a conventional display device with frame bending. An existing display includes a display area, a Bending Block (Bending Block)120, a driving circuit 140, and a plurality of Routing areas (Routing Part)110, 130, 150.
The display Area (Active Area) may include pixels arranged in a matrix form. The bending zone is made of a flexible material and is formed as a foldable structure. A Display Driver Integrated Circuit (DDI) transmits a pixel control command, and the transistor receives the pixel control command to control the operation of the pixel.
The first routing area 110 connects the display area and the bending area 120. The first routing area 110 may include an Electrostatic Discharge (ESD) circuit. The second routing area 130 connects the bending area 120 and the driving circuit 140. The third routing area 150 connects the driving Circuit 140 and a Flexible Printed Circuit Board (FPCB) 160. The driving circuit 140 may be mounted on a flexible film. The Flexible film may be implemented by COF (chip on film) or Flexible Printed Circuit Board (FPCB).
The flexible printed circuit board 160 is connected to an Application Processor (AP). The application processor controls the overall action of the display device and may provide image data to be displayed on the screen.
Taking the size of the bezel as an example, the bending area may be about 0.5 to 1.0mm, the second routing area may be about 1.0mm, the driving circuit may be about 1.0 to 1.5mm, the third routing area may be about 0.5mm, and the flexible printed circuit board may be about 1.0 mm. That is, in the conventional display, a frame region of about 5mm or more may exist.
The wiring printing apparatus according to an embodiment of the present invention minimizes a frame area of the display apparatus by forming a wiring structure connecting lines of the display region and lines of the driving circuit through a printing process instead of a frame bending process.
Fig. 2 and 3 are exemplary block diagrams of a wiring printing apparatus according to an embodiment of the present invention.
As shown in fig. 2, the wiring printing apparatus 200 includes a substrate moving unit 210, a printing unit 220, and a control unit 230. The wiring printing apparatus 200 may omit some of the various components exemplarily shown in fig. 2 or may include other components. For example, the pattern input device 300 may further include a sensor 340, a sintered portion 350, or a combination thereof.
The wiring printing apparatus 200, 300 moves or rotates the printing object or moves or rotates the nozzle to print the wiring directly on the side of the printing object. Here, the printing target is a display device.
The substrate moving parts 210 and 310 move the substrate along a predetermined path. The substrate moving part 210, 310 may include: a holder for holding the fixed substrate or the display device; a moving body for moving the substrate or the holder; and a guide line or the like for realizing a moving path of the moving body. The movable body moves along a rotational path, a linear path, a curved path, a reciprocating path, or a moving path that is a combination thereof.
The printing units 220 and 320 form wiring by discharging conductive droplets on a part of the side surface of the substrate. The printing portions 220 and 320 discharge conductive droplets by an Inkjet (Inkjet) method or an Electrohydrodynamic (EHD) method. The conductor droplet may be a metallic material.
The control units 230 and 330 transmit control signals to the substrate moving units 210 and 310 and the printing units 210 and 310.
The control signal controls the movement of the substrate moving parts 210, 310. The control signal may comprise instructions for controlling the action of the holder to hold or place the substrate or display device. The control signal may include an instruction for adjusting the position, the moving distance, the moving speed, or the like of the moving body.
The control signal controls the movement of the printing portions 210, 310. The control signal may include an instruction for controlling the operation of starting or ending the ejection of the liquid droplets by the nozzle. The control signal may include instructions for adjusting the position, the moving distance, or the moving speed of the nozzle, etc.
The substrate moving parts 210 and 310 rotate the substrate by a predetermined angle. The printing units 220 and 320 discharge the conductive droplets through the nozzles onto a part of one surface of the substrate, a part of a side surface of the substrate, and a part of the other surface opposite to the one surface. For example, in "'or'The form forms an electrical connection path.
The substrate moving part 210, 310 may rotate the printing object by an angle of 180 degrees. The upper surface of the printing object is changed from the upward-looking position to the downward-looking position, or the lower surface of the printing object is changed from the downward-looking position to the upward-looking position.
While the substrate is rotated by a predetermined angle, the control sections 230 and 330 adjust the discharge position, discharge time, and discharge amount of the conductive droplet.
The control portions 230 and 330 are provided so that the point at which the printing portions 220 and 320 start to eject the conductive droplets corresponds to a part of one surface of the substrate during a preset ejection cycle. The control portions 230 and 330 are provided so that the point at which the printing portions 220 and 320 finish the discharge of the conductive droplets corresponds to a part of the other substrate during a preset discharge cycle. During one discharge cycle, wiring as an electrical connection path may be formed on three sides of the substrate.
The wiring formed by the wiring printing device connects (i) a plurality of first electrode lines connected to a display area formed on one surface of the substrate and (ii) a plurality of second electrode lines connected to a driving circuit formed on the other surface of the substrate. As a wiring material of the wiring printing apparatus, a conductive material such as silver (Ag), gold (Au), platinum (Pt), or copper (Cu) can be used.
The wiring printing device may include a sensor 340.
The sensor 340 may include a sensor that (i) measures a distance between the substrate and the nozzle, or (ii) measures a rotation angle of the substrate, or (iii) measures a weight and a center of gravity of the substrate, or (iv) the number of wires and a connection state.
The sensor 340 transmits the measured data to the control units 230 and 330. The control units 230 and 330 process the received data and transmit necessary commands to the substrate moving units 210 and 310 and the printing units 220 and 320.
The sensor 340 may be embodied by a distance measuring sensor that transmits a signal of a specific wavelength and receives a reflected signal, an encoder that measures a rotation angle, an Inertial Measurement Unit (IMU) including an acceleration sensor and a gyro sensor, a weight sensor (load sensor), an image sensor that takes an image, and the like. The sensor 340 may be attached to the substrate moving parts 210 and 310 and the printing parts 220 and 320 according to design, or may be disposed at a position spaced apart from the substrate moving parts 210 and 310 and the printing parts 220 and 320.
The wiring printing device may include a sintering portion 350 for sintering the conductor droplets.
The sintering portion 350 sinters the droplets printed on the substrate by the printing portions 220 and 320 by a thermal sintering method, an ultraviolet sintering method, or a laser sintering method. The thermal sintering may be performed in a range of 50 to 200 ℃, the ultraviolet sintering may be performed in a wavelength range of 200 to 400nm, and the laser sintering may be performed in a wavelength range of 450 to 550 nm.
Fig. 4 to 6 are exemplary diagrams of various printing modes of the wiring printing apparatus according to the embodiment of the present invention.
The control unit measures the state of the substrate or the display device to be printed by the sensor, or sets the print mode by referring to a stored table. The printing mode is classified into a first printing mode, a second printing mode, a third printing mode, or an integrated printing mode.
The first printing mode is a printing mode in which the substrate moving section rotates the substrate by 180 degrees around the region, not the center of gravity of the substrate, along the semicircular arc path to fix the nozzles of the printing section or move the substrate within the side length of the substrate. That is, in the first print mode, a semicircle is drawn while turning over with one side of the substrate as a quasi-side, as compared with the second print mode.
Referring to fig. 4, in the first printing mode, the position of the substrate and the position of the nozzle correspond in space and time. In the first printing mode, the nozzle position 401 is fixed at the first position 410, the second position 420, the third position 430, the fourth position 440, the fifth position 450 of the substrate, or moved within the lateral length of the substrate.
The second printing mode is a printing mode in which the substrate moving section rotates the substrate 180 degrees around the center of gravity of the substrate along the semicircular arc path and moves the nozzles of the printing section along the semicircular arc path. In other words, in the second printing mode, the substrate is turned over while drawing a large semicircle with the center of gravity of the substrate as a reference, as compared with the first printing mode. The nozzle also moves along a semicircular path in order to maintain a distance from the position to be printed on the substrate.
Referring to fig. 5, in the second printing mode, the position of the substrate and the position of the nozzle correspond in space and time. In the second printing mode, the first position 501 of the nozzle corresponds to the first position 510 of the substrate, the second position 502 of the nozzle corresponds to the second position 520 of the substrate, the third position 503 of the nozzle corresponds to the third position 530 of the substrate, the fourth position 504 of the nozzle corresponds to the fourth position 540 of the substrate, and the fifth position 505 of the nozzle corresponds to the fifth position 550 of the substrate.
The third printing mode is a printing mode in which the substrate moving section rotates the substrate by 180 degrees along an arc path formed to have a height longer than the diameter of the semicircle and moves the nozzle of the printing section along a straight path. That is, in the third printing mode, the center of gravity of the substrate is inverted while moving along a parabolic path. The nozzle is also moved along a linear path in order to maintain a distance from the position to be printed on the substrate.
Referring to fig. 6, in the third printing mode, the position of the substrate and the position of the nozzle correspond in space and time. In the third printing mode, the first position 601 of the nozzle corresponds to the first position 610 of the substrate, the second position 602 of the nozzle corresponds to the second position 620 of the substrate, the third position 603 of the nozzle corresponds to the third position 630 of the substrate, the fourth position 604 of the nozzle corresponds to the fourth position 640 of the substrate, and the fifth position 605 of the nozzle corresponds to the fifth position 650 of the substrate.
The control portion may be set to an integrated printing mode in which the first printing mode, the second printing mode, and the third printing mode are combined.
In the wiring formed by various printing patterns, a first region formed on one surface of the substrate or a third region formed on the other surface of the substrate may be set to be a plane or a curvature radius 10R or less, and, in the wiring, a second region formed on a side surface of the substrate may be set to have an angle in a range of 60 degrees to 120 degrees.
Fig. 7 is an exemplary view of a counterweight mounted in a wiring printing apparatus according to an embodiment of the present invention.
The weight or center of gravity of the substrate 720 is measured by the sensor. The sensor may be attached to the substrate moving part, or may be disposed at a position spaced apart from the substrate moving part. The sensors may be provided at the holders 730, 735, the rotation shafts 740, 745, etc. The nozzle 701 prints wiring on a rotating substrate.
Considering the case where the substrate moving part rotates the substrate about the region, not the center of gravity of the substrate 720, the balancing weights 750 and 755 are attached to the substrate moving part to maintain the rotational balance. The weights of the counterweights 750, 755 are adjusted according to the weight of the base plate.
The counterweights 750, 755 may be formed as sectors with the length of the arc being longer the further away from the center. The counterweights 750, 755 may have an anchor shape, with the outer portion of the "T" having a circular shape. The balancing weight is provided in plural and can be attached to both sides.
The substrate may vibrate when it starts to rotate. The vibration of the substrate is measured by a sensor. The control section sends a control signal to the printing section to eject the conductive liquid droplets after the vibration of the substrate is stabilized. The stable time point means that the vibration amplitude is within a set range.
The lower end of the retainer may be pushed to pull the counterweight to generate torque. The lower end of the holder may be pulled to push the counterweight to generate torque. Vibration occurs when torque is generated. When the movement path and the discharge section are provided, the wiring printing apparatus starts to rotate from the first position 410 higher than the substrate in fig. 4, and the discharge start timing may be synchronized with the first position 410 of the substrate. .
The number of wirings formed on the substrate and the connection state are measured by a sensor. For example, the wiring layout acquired by the image sensor is analyzed and compared with a wiring layout stored in advance. If the number of wirings is judged to be insufficient or the connection state is judged to be poor, the printing section ejects the conductor droplet again at the position corresponding to the wiring.
Fig. 8 is a diagram showing an example of the arrangement of nozzles of the wiring printing apparatus according to an embodiment of the present invention.
The number of nozzles is plural, and may be set such that the width between the first nozzle and the last nozzle does not exceed the width of the substrate.
The spacing 860 between the nozzles may be set above the radius 870 of the nozzles.
The distance 860 between the first nozzle and the second nozzle is a distance that adds the distance 850 between the outer shell of the first nozzle and the outer shell of the second nozzle, the thickness 830 of the outer shell of the first nozzle, and the thickness 840 of the outer shell of the second nozzle. That is, the interval 860 between the first nozzle and the second nozzle may be regarded as an interval between printed wirings.
According to embodiments of the present invention, the number of photomasks can be reduced by reducing the etching process of the inorganic/organic film in the bending region. Price competitiveness can be ensured by increasing chamfering efficiency within the same substrate. Reliability can be improved by reducing cracks caused by bending. A low temperature heat treatment of about 100 c can be performed, and since there is no pressing process, an alignment (Align) problem in the flexible substrate can be solved. An adhesion process of ACF (Anisotropic Conductive Film) or the like can be simplified or an adhesion process is not required, so that price competitiveness can be secured.
Fig. 9 and 10 are exemplary views of a display device according to another embodiment of the present invention.
A display device 900, comprising: substrate 910, display area 920, driver circuit 930, and wiring 940.
The substrate 910 may be implemented with a flexible material.
The display region 920 is formed on one surface of the substrate 910 and has a plurality of first electrode lines for transmitting signals.
The driving circuit 930 is formed on the other surface of the substrate 910, and has a plurality of second electrode lines that apply signals to the display area 920.
The wires 940 connect the plurality of first electrode lines of the display area 920 and the plurality of second electrode lines of the driving circuit 930. The wiring 940 is printed on a part of one surface of the substrate 910, a part of a side surface of the substrate 910, and a part of the other surface opposite to the one surface.
The wiring 940 is printed by the wiring printing apparatuses 200 and 300, which correspond to the above-described embodiments. A wiring printing apparatus comprising: a substrate moving part for moving the substrate along a preset path; a printing unit for ejecting a conductive droplet to a part of a side surface of a substrate to form a wiring; and a control section for transmitting a control signal to the substrate moving section and the printing section.
The display device 900 may include a protective layer for protecting the wiring.
For the wiring formed by the printing method, an epoxy resin may be coated on the upper portion of the wiring to prevent galvanic corrosion and corrosion. The epoxy resin is applied by a printing method. The thickness of the resin may be set to 100 μm or less.
The driving circuit 930 may be mounted on a flexible film. The Flexible film may be implemented by COF (chip on film) or a Flexible Printed Circuit Board (FPCB).
In the wiring, a first region to be formed on one surface of the substrate or a third region formed on the other surface of the substrate may be set to a plane or a radius of curvature of 10r (mm) or less, and a second region formed on a side surface of the substrate in the wiring may be set to have an angle of 60 degrees to 120 degrees.
The display may include a timing controller, a data driver, a gate driver, and a pixel circuit. The pixel circuit may include a backplane and a display area.
The timing controller receives a horizontal synchronization signal, a vertical synchronization signal, a data ENABLE (ENABLE) signal, a clock signal, and image data. The vertical synchronization signal refers to a time required to display one frame of image. The horizontal synchronization signal refers to a time required to display one horizontal line of an image, i.e., one pixel line. Accordingly, the horizontal synchronization signal includes a pulse having the same number as that of the pixels included in one pixel line. The data start signal refers to a section in which valid image data is located.
The timing controller supplies a Gate Control Signal (Gate Control Signal) to the Gate driver and supplies a Data Control Signal (Data Control Signal) to the Data driver.
The data driver receives the digital image data from the timing controller. The data driver generates a data voltage in response to a data control signal. The data driver may supply the data voltage to the data lines of the display in synchronization with the gate control signal from the gate driver.
The gate driver controls the switching of the thin film transistor array at the pixel circuit in response to a gate control signal from the timing controller. The gate driver allows the data voltage applied from the data driver to be supplied to an appropriate pixel circuit.
The Display area or the pixel circuit may be implemented by an Active Matrix Organic Light Emitting Diode (AMOLED), an Organic Light Emitting Diode (OLED), an electronic Paper (E-Paper), a Liquid Crystal Display (LCD), a Light Emitting Diode (LED), or a combination thereof. The structure of the thin film transistor array, the capacitor implementing the pixel circuit, may be implemented in various ways depending on the type of display component and the driving method used to activate the pixel.
The constituent elements included in the wiring printing apparatus may be implemented as at least one module in combination with each other. The components are connected to a communication path connecting software modules or hardware modules inside the apparatus and operate organically with each other. These components communicate using one or more communication buses or signal lines.
The wiring printing device and the display device may include logic circuits by hardware, firmware, software, or a combination thereof, and may be implemented by a general-purpose or special-purpose computer. The apparatus may be implemented using Hardwired (hard) devices, Field Programmable Gate Arrays (FPGAs), Application Specific Integrated Circuits (ASICs), or the like. In addition, the apparatus may be implemented by a System on Chip (SoC) including one or more processors and controllers.
The wiring printing device and the display device are mounted on a computing apparatus provided with hardware elements in the form of software, hardware, or a combination thereof. The computing device may refer to various devices including all or part of a communication means such as a communication modem for communicating with various devices or a wired/wireless communication network, a memory for storing data for executing a program, a microprocessor for executing calculations and commands of the program, and the like.
The present embodiment is for explaining the technical ideas of the present embodiment, and the scope of the technical ideas of the present embodiment is not limited to these embodiments. The scope of protection of the present embodiment should be interpreted by the scope of claims, and all technical ideas within the scope equivalent thereto should be interpreted to be included in the scope of claims of the present embodiment.
Claims (14)
1. A wiring printing apparatus, comprising:
a substrate moving part moving the substrate along a predetermined path;
a printing unit for forming wiring by discharging a conductive droplet on a part of a side surface of the substrate; and
a control part for transmitting control signals to the substrate moving part and the printing part,
the substrate moving part rotates the substrate by a preset angle,
the printing section ejects the conductive liquid droplets through a nozzle on a part of one surface of the substrate, a part of a side surface of the substrate, and a part of another surface opposite to the one surface,
the control unit adjusts the discharge position, discharge time, and discharge amount of the conductive droplet while the substrate is rotated by the angle,
including sensors for (i) measuring a distance between the substrate and the nozzle, or (ii) measuring a rotation angle of the substrate, or (iii) measuring a weight and a center of gravity of the substrate, or (iv) the number of the wirings and a connection state,
vibration occurs when the substrate starts to rotate,
measuring the vibration of the substrate by the sensor,
the control unit sends a control signal to the printing unit so that the conductive liquid droplets are discharged after the vibration of the substrate is stabilized.
2. The wiring printing apparatus according to claim 1, wherein the control section is configured such that, during a preset ejection cycle, a point at which the printing section starts to eject the conductor droplet corresponds to a part of one surface of the substrate, and a point at which the printing section ends to eject the conductor droplet corresponds to a part of the other surface of the substrate.
3. The wiring printing apparatus according to claim 1, wherein the control section sets the following mode by the sensor measuring the state of the substrate or referring to a stored table;
(i) a first printing mode in which the substrate moving section rotates the substrate by 180 degrees around a region, not a center of gravity of the substrate, along a semicircular arc path, and the printing section fixes the nozzle or moves within a side length of the substrate;
(ii) a second printing mode in which the substrate moving section rotates the substrate 180 degrees around the center of gravity of the substrate along a semicircular arc path, and the printing section moves the nozzle along a semicircular arc path; and
(iii) and a third printing mode in which the substrate moving unit rotates the substrate by 180 degrees along an arc path formed to have a height longer than a diameter of a semicircle and the printing unit moves the nozzle along a linear path.
4. The wiring printing apparatus according to claim 1, wherein the weight of the substrate is measured by the sensor,
in consideration of the case where the substrate moving part rotates the substrate not about the center of gravity but about the region of the substrate, a balance weight is attached to the substrate moving part in order to maintain the rotational balance.
5. The wiring printing apparatus according to claim 1, wherein the number of wirings and the connection state are measured by the sensor, and when it is determined that the number of wirings is insufficient or the connection state is defective, the printing unit ejects the conductor droplet again at a position corresponding to the wiring.
6. The wiring printing apparatus according to claim 1, wherein the number of the nozzles is plural and is set such that a width between a first nozzle and a last nozzle does not exceed a width of the substrate, and a space between the nozzles is equal to or larger than a radius of the nozzles.
7. The wiring printing apparatus according to claim 1, wherein the printing portion ejects the conductor droplets by ink jet or electrohydrodynamics.
8. The wiring printing apparatus according to claim 1, wherein the wiring is used to connect (i) a plurality of first electrode lines connected to a display area formed on one surface of the substrate and (ii) a plurality of second electrode lines connected to a driving circuit formed on the other surface of the substrate.
9. The wiring printing apparatus according to claim 8, wherein in the wiring, a first region formed on one surface of the substrate or a third region formed on the other surface of the substrate is set to be a plane or a radius of curvature of 10R or less,
in the wiring, a second region formed on a side surface of the substrate is provided to have an angle of 60 to 120 degrees.
10. The wiring printing apparatus according to claim 1, comprising a sintering portion for sintering the conductor droplet by a thermal sintering method, an ultraviolet sintering method, or a laser sintering method,
the thermal sintering mode is performed in the range of 50 ℃ to 200 ℃, the ultraviolet sintering mode is performed in the wavelength range of 200nm to 400nm, and the laser sintering mode is performed in the wavelength range of 450nm to 550 nm.
11. A display device, comprising:
a substrate;
a display area formed on one surface of the substrate and having a plurality of first electrode lines for transmitting signals;
a driving circuit formed on the other surface of the substrate and having a plurality of second electrode lines for applying signals to the display area; and
a wiring that connects the plurality of first electrode lines of the display area and the plurality of second electrode lines of the driving circuit and is printed on a portion of one surface of the substrate, a portion of a side surface of the substrate, and a portion of another surface opposite to the one surface,
the wiring is printed by a wiring printing device,
the wiring printing apparatus includes:
a substrate moving part moving the substrate along a preset path;
a printing unit for forming wiring by discharging a conductive droplet on a part of a side surface of the substrate; and
a control part for transmitting control signals to the substrate moving part and the printing part,
the substrate moving part rotates the substrate by a preset angle,
the printing section ejects the conductive liquid droplets through a nozzle on a part of one surface of the substrate, a part of a side surface of the substrate, and a part of another surface opposite to the one surface,
the control unit adjusts the discharge position, discharge time, and discharge amount of the conductive droplet while the substrate is rotated by the angle,
including sensors for (i) measuring a distance between the substrate and the nozzle, or (ii) measuring a rotation angle of the substrate, or (iii) measuring a weight and a center of gravity of the substrate, or (iv) the number of the wirings and a connection state,
vibration occurs when the substrate starts to rotate,
measuring the vibration of the substrate by the sensor,
the control unit sends a control signal to the printing unit so that the conductive liquid droplets are discharged after the vibration of the substrate is stabilized.
12. The display device according to claim 11, comprising a protective layer for protecting the wiring.
13. The display device according to claim 11, wherein in the wiring, a first region formed on one surface of the substrate or a third region formed on the other surface of the substrate is set to be a plane or a curvature radius 10R or less,
in the wiring, a second region formed on a side surface of the substrate is provided to have an angle of 60 to 120 degrees.
14. The display device according to claim 11, wherein the wiring printing device measures the weight of the substrate by the sensor,
considering the case where the substrate moving part rotates the substrate not about the center of gravity but about the region of the substrate, a balance weight is additionally attached to the substrate moving part in order to maintain the rotational balance.
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KR1020190114082A KR102205125B1 (en) | 2019-09-17 | 2019-09-17 | Apparatus for Printing Wires of Bezel-Less Display, and Display |
KR10-2019-0114082 | 2019-09-17 |
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CN112601372A true CN112601372A (en) | 2021-04-02 |
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KR20170116845A (en) | 2016-04-12 | 2017-10-20 | 엘지디스플레이 주식회사 | Liquid crystal display and manufacturing method of the same |
KR20180028821A (en) | 2016-09-09 | 2018-03-19 | 엘지디스플레이 주식회사 | Borderless-type liquid crystal display device |
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US20100060680A1 (en) * | 2008-09-10 | 2010-03-11 | Samsung Electro-Mechanics Co., Ltd. | Method of printing line by using inkjet apparatus |
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CN112601372B (en) | 2024-05-24 |
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