CN112601372B - Wiring printing device for borderless display device and display device - Google Patents
Wiring printing device for borderless display device and display device Download PDFInfo
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- CN112601372B CN112601372B CN202010946977.8A CN202010946977A CN112601372B CN 112601372 B CN112601372 B CN 112601372B CN 202010946977 A CN202010946977 A CN 202010946977A CN 112601372 B CN112601372 B CN 112601372B
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- 238000005245 sintering Methods 0.000 claims description 14
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- 239000011241 protective layer Substances 0.000 claims description 3
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present embodiment provides a wiring printing apparatus and a display apparatus that minimize a frame area of the display apparatus and reduce a mask process by forming a wiring structure connecting lines of a display area and lines of a driving circuit.
Description
Technical Field
The invention belongs to the technical field of display devices and printing devices. This study relates to a project (No. 2018M3A7B4071521) of subsidized execution of the government (scientific and technical information communication part) under the support of korean study foundation-nanomaterial technology development.
Background
The statements in this section merely provide background information related to the present embodiments and may not constitute prior art.
The frame surrounding the front panel of the screen is referred to as a bezel. The bezel is a portion that does not include the display area (ACTIVE AREA). The thinner the frame is, the larger the effect of the visual screen is, and an elegant design can be realized.
The technique called "borderless (Bezel-Less) or Zero-bordering (Zero Bezel)" is a technique of minimizing or eliminating driving circuits in front of a screen. In the frame bending process, a flexible circuit connected to a driving circuit is bent and disposed at the rear of a substrate. In the existing bending process, cracks may occur, and an inorganic film/organic film etching process is required in the bending region.
Prior art documents
Patent document
Patent document 1 Korean laid-open patent publication No. 10-2017-0116845 (2017.10.20)
Patent document 2 Korean laid-open patent publication No. 10-2018-0028821 (2018.03.19)
Patent document 3 Korean laid-open patent publication No. 10-2015-0019876 (2015.02.25)
Disclosure of Invention
It is a primary object of an embodiment of the present invention to provide a method for minimizing a frame area of a display device and reducing a photomask process by forming a wiring structure connecting lines of a display area and lines of a driving circuit through a printing process.
Other objects of the present invention which are not explicitly shown can be further considered within the scope which is easily estimated from the following detailed description and the effects thereof.
According to one side of the present embodiment, there is provided a wiring printing device including: a substrate moving part for moving the substrate along a preset path; a printing section for forming a wiring by ejecting a conductive liquid droplet on a part of a side surface of the substrate; and a control section for transmitting control signals to the substrate moving section and the printing section.
The substrate moving part may rotate the substrate by a preset angle.
The printing unit may discharge the conductor droplets through a nozzle at a portion of one surface of the substrate, a portion of a side surface of the substrate, and a portion of the other surface opposite to the one surface.
The control unit may adjust a discharge position, a discharge time, and a discharge amount of the conductive liquid droplets while the substrate is rotated by the angle.
The control section may be configured such that, during a preset discharge period, a point at which the printing section starts to discharge the conductor droplets corresponds to a portion of one surface of the substrate, and a point at which the printing section ends to discharge the conductor droplets corresponds to a portion of the other surface of the substrate.
The wiring printing device may include a sensor for (i) measuring a distance between the substrate and the nozzle, or (ii) measuring a rotation angle of the substrate, or (iii) measuring a weight and a center of gravity of the substrate, or (iv) a number and a connection state of the wirings.
The control part may be set to the following mode by measuring the state of the substrate by the sensor or referring to a stored table; (i) A first printing mode in which the substrate moving section rotates the substrate by 180 degrees along a semicircular arc path not with respect to the center of gravity of the substrate but with respect to a region, the printing section fixing the nozzle or moving the substrate within a side length range; (ii) A second printing mode in which the substrate moving section rotates the substrate 180 degrees along a semicircular arc path with respect to the center of gravity of the substrate, and the printing section moves the nozzle along the semicircular arc path; and (iii) a third printing mode in which the substrate moving section rotates the substrate by 180 degrees along an arc path formed to have a height longer than a diameter of a semicircle, and the printing section moves the nozzle along a straight path; or an integrated print mode of these combinations.
The weight of the substrate is measured by the sensor, and a counterweight is attached to the substrate moving part in order to maintain a rotation balance, considering a case where the substrate moving part rotates the substrate not with respect to the center of gravity of the substrate but with respect to a region.
When the substrate starts to rotate, vibration occurs, the vibration of the substrate is measured by the sensor, and the control section may send a control signal to the printing section so that the conductor droplet is discharged after the vibration of the substrate stabilizes.
The number of wires and the connection state are measured by the sensor, and if it is determined that the number of wires is insufficient or the connection state is poor, the printed portion can discharge the conductor droplet again at the position of the corresponding wire.
The number of the nozzles is plural, and the width between the first nozzle and the last nozzle may be set to be not more than the width of the substrate, and the interval between the nozzles is equal to or more than the radius of the nozzles.
The printing section may eject the conductor droplets by ink jet (Inkjet) or electrohydrodynamic (Electrohydrodynamics, EHD) means.
The wiring may connect (i) a plurality of first electrode lines connected to a display region formed on one surface of the substrate, and (ii) a plurality of second electrode lines connected to a driving circuit formed on the other surface of the substrate.
In the wiring, a first region formed on one surface of the substrate or a third region formed on the other surface of the substrate may be set to be a plane or a radius of curvature 10R or less.
In the wiring, the second region formed at the side of the substrate may be disposed to have an angle of 60 degrees to 120 degrees.
The wiring printing device may include a sintering section that sinters the conductor droplets by a thermal sintering method, an ultraviolet sintering method, or a laser sintering method, the thermal sintering method may be performed in a range of 50 ℃ to 200 ℃, the ultraviolet sintering method may be performed in a wavelength range of 200nm to 400nm, and the laser sintering method may be performed in a wavelength range of 450nm to 550 nm.
According to other side surfaces of the present embodiment, there is provided a display device including: a substrate; a display region formed on one surface of the substrate and having a plurality of first electrode lines for transmitting signals; a driving circuit formed on the other surface of the substrate and having a plurality of second electrode lines for applying signals to the display region; and wiring lines connecting the plurality of first electrode lines of the display region and the plurality of second electrode lines of the driving circuit, and printed on a portion of one surface of the substrate, a portion of a side surface of the substrate, and a portion of the other surface opposite to the one surface.
The wiring may be printed by a wiring printing device.
The display device may include a protective layer for protecting the wiring.
Effects of the invention
As described above, according to the embodiments of the present invention, by forming the wiring structure connecting the lines of the display area and the lines of the driving circuit through the printing process, there is an effect of minimizing the bezel area of the display device and reducing the photomask process.
Even if effects not explicitly mentioned here, effects described in the following description and potential effects thereof, which are expected from technical features of the present invention, can be handled in accordance with the description in the description of the present invention.
Drawings
Fig. 1 is an exemplary view of a conventional frame curve.
Fig. 2 and 3 are example block diagrams of a wiring printing device according to an embodiment of the present invention.
Fig. 4 to 6 are exemplary diagrams of various printing modes of the wiring printing device according to the embodiment of the present invention.
Fig. 7 is an exemplary view of a counterweight mounted on a wiring printing device according to an embodiment of the invention.
Fig. 8 is a diagram showing an example of the arrangement of nozzles of the wiring printing device according to an embodiment of the present invention.
Fig. 9 and 10 are exemplary diagrams of a display device according to another embodiment of the present invention.
Symbol description:
200. 300: wiring printing device, 210, 310: substrate moving parts, 220, 320: printing unit, 230, 330: control unit, 340: sensor, 350: sintering part, 900: display device, 910: substrate, 920: display area, 930: drive circuit, 940: and (5) wiring.
Detailed Description
In the following, in the explanation of the present invention, if it is determined that the related known functions are matters clear to those skilled in the art and the gist of the present invention is not clear, detailed explanation thereof will be omitted, and a partial embodiment of the present invention will be explained in detail by way of example only.
FIG. 1 is a plan view and A-A' cross-sectional view of a prior art display adapted for bezel bending. An existing display includes a display area, a bending area (Bending Block) 120, a driving circuit 140, and a plurality of Routing areas (Routing parts) 110, 130, 150.
The display region (ACTIVE AREA) may include pixels arranged in a matrix form. The bending region is made of a flexible material and is formed in a foldable structure. The driving Circuit (DISPLAY DRIVER INTEGRATED Circuit, DDI) transmits a pixel control command, and the transistor receives the pixel control command to control the operation of the pixel.
The first routing area 110 connects the display area and the bending area 120. The first routing region 110 may include electrostatic discharge (Electrostatic Discharge, ESD) circuitry. The second routing area 130 connects the bending area 120 and the driving circuit 140. The third routing area 150 connects the driving circuit 140 and the flexible printed circuit board (Flexible Printed Circuit Board, FPCB) 160. The driving circuit 140 may be mounted on the flexible film. The flexible film may be implemented by COF (chip on film) or flexible printed circuit board (Flexible Printed Circuit Board, FPCB).
The flexible printed circuit board 160 is connected to an application processor (Application Processor, AP). The application processor controls the overall action of the display device and may provide image data to be displayed on a screen.
Taking the dimensions of the bezel as an example, the bending area may be about 0.5 to 1.0mm, the second routing area may be about 1.0mm, the driving circuit may be about 1.0 to 1.5mm, the third routing area may be about 0.5mm, and the flexible printed circuit board may be about 1.0mm. That is, in the conventional display, a frame region of about 5mm or more may exist.
The wiring printing apparatus according to an embodiment of the present invention minimizes a frame area of the display apparatus by forming a wiring structure connecting lines of a display area and lines of a driving circuit through a printing process instead of a frame bending process.
Fig. 2 and 3 are example block diagrams of a wiring printing device according to an embodiment of the present invention.
As shown in fig. 2, the wiring printing device 200 includes a substrate moving unit 210, a printing unit 220, and a control unit 230. The wiring printing device 200 may omit a partial component among various components exemplarily shown in fig. 2 or may additionally include other components. For example, the pattern input device 300 may further include a sensor 340, a sintered part 350, or a combination thereof.
The wiring printing device 200, 300 moves or rotates the printing object or moves or rotates the nozzle to print the wiring directly on the side of the printing object. Here, the printing object is a display device.
The substrate moving part 210, 310 moves the substrate along a predetermined path. The substrate moving part 210, 310 may include: a holder for holding the fixed substrate or the display device; a moving body for moving the substrate or the holder; and a guide wire or the like for realizing a moving path of the moving body. The moving body moves along a movement path formed by a rotation path, a straight path, a curved path, a round trip path, or a combination thereof.
The printed portions 220 and 320 form wiring by ejecting a conductive liquid droplet on a part of the side surface of the substrate. The printing units 220 and 320 discharge the conductor droplets by an Inkjet (Inkjet) method or an electrohydrodynamic (Electrohydrodynamics, EHD) method. The conductor droplets may be a metallic material.
The control unit 230, 330 transmits a control signal to the substrate moving unit 210, 310 and the printing unit 210, 310.
The control signal controls the movement of the substrate moving parts 210, 310. The control signal may include instructions for controlling the holder to hold or place the substrate or the action of the display device. The control signal may include instructions for adjusting the position, moving distance, moving speed, or the like of the moving body.
The control signal controls the movement of the printing section 210, 310. The control signal may include an instruction for controlling the nozzle to start or end the discharge of the droplet. The control signal may include instructions for adjusting the position, distance or speed of movement of the nozzle, etc.
The substrate moving part 210, 310 rotates the substrate by a predetermined angle. The printing units 220 and 320 discharge the conductor droplets through the nozzles onto a part of one surface of the substrate, a part of the side surface of the substrate, and a part of the other surface opposite to the one surface. For example, in'"Or"/>"Morphology forms an electrical connection path.
The angle at which the substrate moving part 210, 310 rotates the printing object may be set to 180 degrees. The upper surface of the print object is changed from a position seen from above to a position seen from below, or the lower surface of the print object is changed from a position seen from below to a position seen from above.
The control units 230 and 330 adjust the discharge position, discharge time, and discharge amount of the conductive liquid droplets while the substrate is rotated by a predetermined angle.
The control sections 230, 330 are arranged so that the printing sections 220, 320 start to discharge the conductor droplets at a point corresponding to a part of one surface of the substrate during a preset discharge period. The control section 230, 330 is arranged such that the point at which the printing section 220, 320 ends the discharge of the conductor droplet corresponds to a part of the other substrate during the preset discharge period. During one ejection period, wiring as an electrical connection path may be formed on three sides of the substrate.
The wiring formed by the wiring printing device connects (i) a plurality of first electrode lines connected to a display region formed on one surface of the substrate and (ii) a plurality of second electrode lines connected to a driving circuit formed on the other surface of the substrate. As the wiring material, a conductive material such as silver (Ag), gold (Au), platinum (Pt), or copper (Cu) can be used for the wiring printing device.
The wiring printing device may include a sensor 340.
The sensor 340 may include (i) a sensor that measures a distance between the substrate and the nozzle, or (ii) a rotation angle of the substrate, or (iii) a weight and a center of gravity of the substrate, or (iv) the number of wirings and a connection state.
The sensor 340 transmits the measured data to the control unit 230, 330. The control unit 230, 330 processes the received data and transmits necessary instructions to the substrate moving unit 210, 310 and the printing unit 220, 320.
The sensor 340 may be embodied by a ranging sensor that transmits a signal of a specific wavelength and receives a reflected signal, an encoder that measures a rotation angle, an inertial measurement sensor (Inertial Measurement Unit, IMU) including an acceleration sensor and a gyro sensor, a weight sensor (load sensor), an image sensor that captures an image, and the like. The sensor 340 may be attached to the substrate moving part 210, 310 and the printing part 220, 320 according to design, or may be provided at a position spaced apart from the substrate moving part 210, 310 and the printing part 220, 320.
The wiring printing device may include a firing section 350 for firing the conductor droplets.
The firing section 350 fires the droplets printed on the substrate by the printing sections 220, 320 by a thermal firing method, an ultraviolet firing method, or a laser firing method. The thermal sintering process may be performed at 50 to 200 ℃, the ultraviolet sintering process may be performed at a wavelength of 200 to 400nm, and the laser sintering process may be performed at a wavelength of 450 to 550 nm.
Fig. 4 to 6 are exemplary diagrams of various printing modes of the wiring printing device according to the embodiment of the present invention.
The control section measures the state of the substrate or the display device of the printing object by the sensor or refers to the stored table to set the printing mode. The printing mode is classified as a first printing mode, a second printing mode, a third printing mode, or an integrated printing mode.
The first printing mode is a printing mode in which the substrate moving section moves the substrate along a semicircular arc path by fixing the nozzles of the printing section or moving the substrate within a side length range of the substrate by rotating 180 degrees not about the center of gravity but about the area. That is, in the first printing mode, the large semicircle is drawn with one side of the substrate as the reference and turned over in comparison with the second printing mode.
Referring to fig. 4, in the first printing mode, the position of the substrate and the position of the nozzle correspond spatially and temporally. In the first printing mode, the position 401 of the nozzle is fixed at the first position 410, the second position 420, the third position 430, the fourth position 440, the fifth position 450 of the substrate, or is moved over the lateral length of the substrate.
The second printing mode is a printing mode in which the substrate moving section rotates the substrate 180 degrees about the center of gravity of the substrate along the arc path of the semicircle, and moves the nozzles of the printing section along the arc path of the semicircle. That is, in the second printing mode, the substrate is turned over while drawing a large semicircle with the center of gravity as the reference, compared with the first printing mode. The nozzle also moves along a semicircular path in order to maintain a distance from the location to be printed on the substrate.
Referring to fig. 5, in the second printing mode, the position of the substrate and the position of the nozzle correspond spatially and temporally. In the second printing mode, the first position 501 of the nozzle corresponds to the first position 510 of the substrate, the second position 502 of the nozzle corresponds to the second position 520 of the substrate, the third position 503 of the nozzle corresponds to the third position 530 of the substrate, the fourth position 504 of the nozzle corresponds to the fourth position 540 of the substrate, and the fifth position 505 of the nozzle corresponds to the fifth position 550 of the substrate.
The third printing mode is a printing mode in which the substrate moving section rotates the substrate 180 degrees along an arc path formed to have a height longer than the diameter of the semicircle, and moves the nozzles of the printing section along a straight path. That is, in the third printing mode, the center of gravity of the substrate is flipped while moving along the path of the parabola. The nozzle also moves along a straight path in order to maintain a distance from the location to be printed on the substrate.
Referring to fig. 6, in the third printing mode, the position of the substrate and the position of the nozzle correspond spatially and temporally. In the third printing mode, the first position 601 of the nozzle corresponds to the first position 610 of the substrate, the second position 602 of the nozzle corresponds to the second position 620 of the substrate, the third position 603 of the nozzle corresponds to the third position 630 of the substrate, the fourth position 604 of the nozzle corresponds to the fourth position 640 of the substrate, and the fifth position 605 of the nozzle corresponds to the fifth position 650 of the substrate.
The control section may be set to an integrated printing mode in which the first printing mode, the second printing mode, and the third printing mode are combined.
In the wiring formed by the various printing modes, the first region formed on one surface of the substrate or the third region formed on the other surface of the substrate may be set to be a plane or a radius of curvature 10R or less, and in the wiring, the second region formed on the side surface of the substrate may be set to have an angle in the range of 60 degrees to 120 degrees.
Fig. 7 is an exemplary view of a counterweight mounted in a wiring printing device according to an embodiment of the invention.
The weight or center of gravity of the substrate 720 is measured by a sensor. The sensor may be attached to the substrate moving part or may be provided at a position spaced apart from the substrate moving part. The sensors may be provided to the holders 730, 735, the rotation shafts 740, 745, etc. The nozzle 701 prints wiring on a rotating substrate.
In consideration of the case where the substrate moving part rotates the substrate not with respect to the center of gravity of the substrate 720 but with respect to the region, the balancing weights 750 and 755 are attached to the substrate moving part to maintain the rotation balance. The weights of the counterweights 750, 755 are adjusted according to the weight of the base plate.
The counterweights 750, 755 may be formed in a sector shape that is longer the farther the length of the arc is from the center. The counterweights 750, 755 can have an anchored shape, with the outer portion of the "T" having a circular shape. The balancing weights are plural and can be attached to both sides.
Vibration occurs at the point when the substrate starts to rotate. The vibration of the substrate is measured by a sensor. The control unit sends a control signal to the printing unit to discharge the conductor droplet after the vibration of the substrate stabilizes. The stable time point means that the vibration amplitude is within the set range.
The lower end of the retainer can be pushed to pull the counterweight to generate torque. The lower end of the retainer can be pulled to push the counterweight to generate torque. Vibration occurs when torque is generated. When the movement path and the discharge section are provided, the wiring printing device starts to rotate from a position higher than the first position 410 of the substrate in fig. 4, and the discharge start time can be synchronized with the first position 410 of the substrate. .
The number of wirings formed on the substrate and the connection state are measured by the sensor. For example, a wiring layout acquired by an image sensor is analyzed and compared with a wiring layout stored in advance. If it is determined that the number of wires is insufficient or the connection state is poor, the printing section ejects the conductor droplet again at the position of the corresponding wire.
Fig. 8 is a diagram showing an example of the arrangement of nozzles of the wiring printing device according to an embodiment of the present invention.
The number of nozzles is plural, and the width between the first nozzle and the last nozzle may be set not to exceed the width of the substrate.
The spacing 860 between the nozzles may be set above the radius 870 of the nozzle.
The distance 860 between the first nozzle and the second nozzle is a distance that sums the distance 850 between the housing of the first nozzle and the housing of the second nozzle, the thickness 830 of the housing of the first nozzle, and the thickness 840 of the housing of the second nozzle. That is, the interval 860 between the first nozzle and the second nozzle may be regarded as an interval between printed wirings.
According to an embodiment of the present invention, the number of photomasks may be reduced by reducing the etching process of the inorganic/organic film in the bending region. Price competitiveness can be ensured by increasing chamfering efficiency within the same substrate. Reliability can be improved by reducing cracks caused by bending. A low temperature heat treatment of about 100 c can be performed, and since there is no extrusion process, alignment (Align) problems in the flexible substrate can be solved. The bonding process of ACF (anisotropic conductive film (Anisotropic Conductive Film)) or the like can be simplified or is not required, so that price competitiveness can be ensured.
Fig. 9 and 10 are exemplary diagrams of a display device according to another embodiment of the present invention.
The display device 900 includes: substrate 910, display region 920, driving circuit 930, and wiring 940.
The substrate 910 may be implemented with a flexible material.
The display area 920 is formed on one side of the substrate 910 and has a plurality of first electrode lines for transmitting signals.
The driving circuit 930 is formed on the other surface of the substrate 910 and has a plurality of second electrode lines applying signals to the display area 920.
The wiring 940 connects the plurality of first electrode lines of the display area 920 and the plurality of second electrode lines of the driving circuit 930. Wiring 940 is printed on a part of one surface of substrate 910, a part of a side surface of substrate 910, and a part of the other surface opposite to the one surface.
The wiring 940 is printed by the wiring printing devices 200, 300, which correspond to the above-described embodiments. A wiring printing device includes: a substrate moving part for moving the substrate along a preset path; a printing section for ejecting a conductive liquid droplet to a part of a side surface of the substrate to form a wiring; and a control part for transmitting the control signal to the substrate moving part and the printing part.
The display device 900 may include a protective layer for protecting the wiring.
For the wiring formed by the printing method, an epoxy resin may be coated on the upper portion of the wiring to prevent galvanic corrosion and corrosion. The epoxy resin is applied by a printing method. The thickness of the resin may be set to 100 μm or less.
The drive circuit 930 may be mounted on a flexible film. The flexible film may be realized by COF (chip on film) or flexible printed circuit board (Flexible Printed Circuit Board, FPCB).
In the wiring, a first region to be formed on one surface of the substrate or a third region to be formed on the other surface of the substrate may be set to be a plane or a radius of curvature of 10R (mm) or less, and a second region to be formed on a side surface of the substrate in the wiring may be set to have an angle of 60 degrees to 120 degrees.
The display may include a timing controller, a data driver, a gate driver, and pixel circuits. The pixel circuit may include a back plane and a display area.
The timing controller receives a horizontal synchronization signal, a vertical synchronization signal, a data ENABLE (ENABLE) signal, a clock signal, and image data. The vertical synchronization signal refers to a time required to display one frame of image. The horizontal synchronization signal refers to the time required for displaying a horizontal line, i.e., a pixel line, of an image. Accordingly, the horizontal synchronization signal includes pulses having the same number as that of the pixels included in one pixel line. The data enable signal refers to an interval in which valid image data is located.
The timing controller provides gate control signals (Gate Control Signal) to the gate drivers and data control signals (Data Control Signal) to the data drivers.
The data driver receives digital image data from the timing controller. The data driver generates a data voltage in response to a data control signal. The data driver may supply the data voltage to the data line of the display in synchronization with a gate control signal from the gate driver.
The gate driver controls switching of the thin film transistor array at the pixel circuit in response to a gate control signal from the timing controller. The gate driver allows the data voltage applied from the data driver to be supplied to an appropriate pixel circuit.
The display area or the pixel circuit may be implemented by an Active Matrix Organic Light Emitting Diode (AMOLED), an Organic LIGHT EMITTING Diode (OLED), an electronic Paper (E-Paper), a Liquid crystal display (Liquid CRYSTAL DISPLAY, LCD), a light emitting Diode (LIGHT EMITTING Diode, LED), a combination thereof, or the like. The structure of the thin film transistor array, the capacitor, which implements the pixel circuit can be implemented in various ways depending on the type of display assembly and the driving method for activating the pixel.
The constituent elements included in the wiring printing apparatus may be implemented as at least one module in combination with each other. The constituent elements are connected to communication paths of software modules or hardware modules inside the connection device to operate organically with each other. These components communicate using one or more communication buses or signal lines.
The wiring printing device and the display device may include logic circuits through hardware, firmware, software, or a combination thereof, and may be implemented using a general-purpose or special-purpose computer. The apparatus may be implemented using a Hardwired (HARDWIRED) device, a field programmable gate array (Field Programmable GATE ARRAY, FPGA), an Application SPECIFIC INTEGRATED Circuit (ASIC), or the like. In addition, the apparatus may be implemented by a System on Chip (SoC) including more than one processor and controller.
The wiring printing device and the display device are installed on a computing device provided with hardware elements in the form of software, hardware, or a combination thereof. The computing device may refer to various means including all or part of communication means such as a communication modem for communicating with various devices or a wired/wireless communication network, a memory for storing data for executing a program, and a microprocessor for executing a program to perform calculations and commands, and the like.
The present embodiment is for explaining the technical idea of the present embodiment, and the scope of the technical idea of the present embodiment is not limited to these embodiments. The scope of the present embodiment should be interpreted by the scope of the claims, and all technical ideas within the equivalent scope thereof should be interpreted as being included in the scope of the claims of the present embodiment.
Claims (12)
1. A wiring printing device, comprising:
a substrate moving part for moving the substrate along a preset path;
A printing section for forming a wiring by ejecting a conductive liquid droplet on a part of a side surface of the substrate; and
A control part for transmitting control signals to the substrate moving part and the printing part,
The substrate moving part rotates the substrate by a preset angle,
The printing section ejects the conductive liquid droplets through a nozzle on a part of one surface of the substrate, a part of a side surface of the substrate, and a part of the other surface opposite to the one surface,
The control unit adjusts the discharge position, discharge time, and discharge amount of the conductor droplet while the substrate is rotated by the angle,
Comprising sensors for (i) measuring the distance between the substrate and the nozzle, or (ii) measuring the rotation angle of the substrate, or (iii) measuring the weight and the center of gravity of the substrate, or (iv) the number of wires and the connection state,
Vibration occurs when the substrate starts to rotate,
Measuring the vibration of the substrate by the sensor,
The control section sends a control signal to the printing section so that the conductor droplet is discharged after the vibration of the substrate is stabilized,
The weight of the substrate is measured by the sensor,
Considering that the substrate moving part rotates the substrate not with respect to the center of gravity but with respect to a region, in order to maintain a rotation balance, a balancing weight is attached to the substrate moving part,
The balancing weights are formed in a fan shape having a longer arc length from the center, and a plurality of balancing weights are attached to both sides of the base plate moving part,
The control part pushes the lower end of the holder of the substrate moving part to pull the balancing weight to generate torque or pulls the lower end of the holder to push the balancing weight to generate torque so as to control vibration and control the time of discharging the conductor liquid drops.
2. The wiring printing device according to claim 1, wherein the control section is configured such that, during a preset discharge period, a point at which the printing section starts to discharge the conductor droplets corresponds to a portion of one surface of the substrate, and a point at which the printing section ends to discharge the conductor droplets corresponds to a portion of the other surface of the substrate.
3. The wiring printing device according to claim 1, wherein the control section measures a state of the substrate by the sensor or sets the following mode with reference to a stored table;
(i) A first printing mode in which the substrate moving section rotates the substrate by 180 degrees along a semicircular arc path not with respect to the center of gravity of the substrate but with respect to a region, the printing section fixing the nozzle or moving the substrate within a side length range;
(ii) A second printing mode in which the substrate moving section rotates the substrate 180 degrees along a semicircular arc path with respect to the center of gravity of the substrate, and the printing section moves the nozzle along the semicircular arc path; and
(Iii) In the third printing mode, the substrate moving section rotates the substrate 180 degrees along an arc path formed to have a height longer than a diameter of a semicircle, and the printing section moves the nozzle along a straight path.
4. The wiring printing device according to claim 1, wherein the sensor measures the number of the wirings and the connection state, and if it is determined that the number of the wirings is insufficient or the connection state is poor, the printing section ejects the conductor droplet again at the position of the corresponding wiring.
5. The wiring printing device according to claim 1, wherein the number of the nozzles is plural, and the width between the first nozzle and the last nozzle is set to be not more than the width of the substrate, and the interval between the nozzles is equal to or more than the radius of the nozzles.
6. The wiring printing device according to claim 1, wherein the printing portion ejects the conductor droplets by inkjet or electrohydrodynamic means.
7. The wiring printing device according to claim 1, wherein the wiring is configured to connect (i) a plurality of first electrode lines connected to a display region formed on one surface of the substrate and (ii) a plurality of second electrode lines connected to a driving circuit formed on the other surface of the substrate.
8. The wiring printing device according to claim 7, wherein in the wiring, a first region formed on one surface of the substrate or a third region formed on the other surface of the substrate is set to be a plane or a radius of curvature of 10R or less,
In the wiring, a second region formed at a side of the substrate is provided to have an angle of 60 degrees to 120 degrees.
9. The wiring printing device according to claim 1, comprising a sintering section for sintering the conductor droplets by a thermal sintering method, an ultraviolet sintering method, or a laser sintering method,
The thermal sintering mode is performed in a range of 50 ℃ to 200 ℃, the ultraviolet sintering mode is performed in a wavelength range of 200nm to 400nm, and the laser sintering mode is performed in a wavelength range of 450nm to 550 nm.
10. A display device, comprising:
a substrate;
A display region formed on one surface of the substrate and having a plurality of first electrode lines for transmitting signals;
A driving circuit formed on the other surface of the substrate and having a plurality of second electrode lines for applying signals to the display region; and
Wiring lines connecting the plurality of first electrode lines of the display region and the plurality of second electrode lines of the driving circuit and printed on a portion of one surface of the substrate, a portion of a side surface of the substrate, and a portion of the other surface opposite to the one surface,
The wiring is printed by a wiring printing device,
The wiring printing device includes:
a substrate moving part moving the substrate along a preset path;
A printing section for forming a wiring by ejecting a conductive liquid droplet on a part of a side surface of the substrate; and
A control part for transmitting control signals to the substrate moving part and the printing part,
The substrate moving part rotates the substrate by a preset angle,
The printing section ejects the conductive liquid droplets through a nozzle on a part of one surface of the substrate, a part of a side surface of the substrate, and a part of the other surface opposite to the one surface,
The control unit adjusts the discharge position, discharge time, and discharge amount of the conductor droplet while the substrate is rotated by the angle,
Comprising sensors for (i) measuring the distance between the substrate and the nozzle, or (ii) measuring the rotation angle of the substrate, or (iii) measuring the weight and the center of gravity of the substrate, or (iv) the number of wires and the connection state,
Vibration occurs when the substrate starts to rotate,
Measuring the vibration of the substrate by the sensor,
The control section sends a control signal to the printing section so that the conductor droplet is discharged after the vibration of the substrate is stabilized,
The wiring printing device measures the weight of the substrate by the sensor,
In order to maintain the rotation balance, considering the case where the substrate moving part rotates the substrate not with respect to the center of gravity but with respect to the area, a counterweight is additionally attached to the substrate moving part,
The control part pushes the lower end of the holder of the substrate moving part to pull the balancing weight to generate torque or pulls the lower end of the holder to push the balancing weight to generate torque so as to control vibration and control the time of discharging the conductor liquid drops.
11. The display device according to claim 10, comprising a protective layer for protecting the wiring.
12. The display device according to claim 10, wherein in the wiring, a first region formed on one surface of the substrate or a third region formed on the other surface of the substrate is set to be a plane or a radius of curvature of 10R or less,
In the wiring, a second region formed at a side of the substrate is provided to have an angle of 60 degrees to 120 degrees.
Applications Claiming Priority (2)
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KR1020190114082A KR102205125B1 (en) | 2019-09-17 | 2019-09-17 | Apparatus for Printing Wires of Bezel-Less Display, and Display |
KR10-2019-0114082 | 2019-09-17 |
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CN112601372A CN112601372A (en) | 2021-04-02 |
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KR100999920B1 (en) * | 2008-09-10 | 2010-12-13 | 삼성전기주식회사 | Method of printing a circuit wire using inkjet apparatus |
KR102158630B1 (en) | 2013-08-16 | 2020-09-22 | 엘지디스플레이 주식회사 | Display device and manufacturing method thereof |
KR20170116845A (en) | 2016-04-12 | 2017-10-20 | 엘지디스플레이 주식회사 | Liquid crystal display and manufacturing method of the same |
KR20180028821A (en) | 2016-09-09 | 2018-03-19 | 엘지디스플레이 주식회사 | Borderless-type liquid crystal display device |
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JP2009076529A (en) * | 2007-09-19 | 2009-04-09 | Seiko Epson Corp | Patterning method, wiring substrate, and electronic apparatus |
CN110099513A (en) * | 2011-07-27 | 2019-08-06 | 住友重机械工业株式会社 | Apparatus for manufacturing substrate and manufacture of substrates |
CN108267903A (en) * | 2016-12-30 | 2018-07-10 | 乐金显示有限公司 | Display device, multiscreen display apparatus and its manufacturing method using it |
CN110176475A (en) * | 2018-02-21 | 2019-08-27 | 三星显示有限公司 | OLED display with reduced frame |
CN208721945U (en) * | 2018-10-08 | 2019-04-09 | 惠科股份有限公司 | Display device |
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KR102205125B1 (en) | 2021-01-19 |
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