CN112390625A - 复合陶瓷件及其制备方法、雾化组件和电子烟 - Google Patents
复合陶瓷件及其制备方法、雾化组件和电子烟 Download PDFInfo
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- CN112390625A CN112390625A CN201910740263.9A CN201910740263A CN112390625A CN 112390625 A CN112390625 A CN 112390625A CN 201910740263 A CN201910740263 A CN 201910740263A CN 112390625 A CN112390625 A CN 112390625A
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Abstract
本发明涉及一种复合陶瓷件及其制备方法、雾化组件和电子烟。该复合陶瓷件包括依次层叠设置的第一陶瓷层、第二陶瓷层和第三陶瓷层,所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层中,所述第一陶瓷层具有最小的孔径和最高的导热率,所述第二陶瓷层具有最大的孔隙率,所述第三陶瓷层具有最高的抗压强度。本发明的复合陶瓷件具有独特的三层复合结构,具有优异的综合性能。
Description
技术领域
本发明涉及电子烟技术领域,特别是涉及一种复合陶瓷件及其制备方法、雾化组件和电子烟。
背景技术
电子烟雾化芯是电子烟的核心部件。市场上的电子烟雾化芯多采用陶瓷雾化芯。目前的陶瓷雾化芯的综合性能仍然较差,存在导油速率低、容易发生干烧失效、使用寿命短等缺陷。
发明内容
基于此,有必要提供一种综合性能较好的电子烟用复合陶瓷件。
一种复合陶瓷件,包括依次层叠设置的第一陶瓷层、第二陶瓷层和第三陶瓷层,所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层中,所述第一陶瓷层具有最小的孔径和最高的导热率,所述第二陶瓷层具有最大的孔隙率,所述第三陶瓷层具有最高的抗压强度。
在其中一个实施例中,所述第一陶瓷层的孔径为5μm~9μm,导热率为1.5W/m·K~2.0W/m·K。
在其中一个实施例中,所述第二陶瓷层的孔隙率为55%~65%。
在其中一个实施例中,所述第三陶瓷层的抗压强度为50MPa~70MPa。
在其中一个实施例中,所述第一陶瓷层的厚度为0.1mm~0.7mm。
在其中一个实施例中,所述第二陶瓷层的厚度为0.4mm~1.2mm。
在其中一个实施例中,所述第三陶瓷层的厚度为0.3mm~1.5mm。
在其中一个实施例中,所述第一陶瓷层的材质选自氧化铝陶瓷、碳化硅陶瓷、氮化硅陶瓷和氮化铝陶瓷中的至少一种。
在其中一个实施例中,所述第二陶瓷层的材质选自氧化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
在其中一个实施例中,所述第三陶瓷层的材质选自氧化硅陶瓷、碳化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
一种复合陶瓷件的制备方法,该方法包括以下步骤:
分别获取第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料,并将所述第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料分别流延成型,得到第一陶瓷层、第二陶瓷层和第三陶瓷层;所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层中,所述第一陶瓷层具有最小的孔径和最高的导热率,所述第二陶瓷层具有最大的孔隙率,所述第三陶瓷层具有最高的抗压强度;
将所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层依次层叠并进行干压成型或等静压成型,然后烧结,得到复合陶瓷件。
在其中一个实施例中,以100重量份的所述第一陶瓷浆料为基准,所述第一陶瓷浆料包括55~85重量份的第一陶瓷和15~45重量份的第一造孔剂,所述第一陶瓷选自氧化铝陶瓷、碳化硅陶瓷、氮化硅陶瓷和氮化铝陶瓷中的至少一种。
在其中一个实施例中,以100重量份的所述第二陶瓷浆料为基准,所述第二陶瓷浆料包括35~65重量份的第二陶瓷和35~65重量份的第二造孔剂,所述第二陶瓷选自氧化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
在其中一个实施例中,以100重量份的所述第三陶瓷浆料为基准,所述第三陶瓷浆料包括50~75重量份的第三陶瓷和25~50重量份的第三造孔剂,所述第三陶瓷选自氧化硅陶瓷、碳化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
在其中一个实施例中,所述干压成型的条件包括:温度为70℃~80℃,压力为10MPa~30MPa,时间为3min~20min。
在其中一个实施例中,所述等静压成型的条件包括:温度为70℃~80℃,压力为50MPa~100MPa,时间为5min~20min。
在其中一个实施例中,所述烧结的条件包括:温度为1100℃~1300℃,时间为30min~90min。
一种复合陶瓷件的制备方法,该方法包括以下步骤:
分别获取第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料,并将所述第二陶瓷浆料进行注塑成型或流延成型,得到第二陶瓷层;
在所述第二陶瓷层的相对的两侧分别涂覆第一陶瓷浆料和第三陶瓷浆料,固化得到第一陶瓷层和第三陶瓷层,然后烧结,得到复合陶瓷件;所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层中,所述第一陶瓷层具有最小的孔径和最高的导热率,所述第二陶瓷层具有最大的孔隙率,所述第三陶瓷层具有最高的抗压强度。
在其中一个实施例中,以100重量份的所述第一陶瓷浆料为基准,所述第一陶瓷浆料包括55~85重量份的第一陶瓷和15~45重量份的第一造孔剂,所述第一陶瓷选自氧化铝陶瓷、碳化硅陶瓷、氮化硅陶瓷和氮化铝陶瓷中的至少一种。
在其中一个实施例中,以100重量份的所述第二陶瓷浆料为基准,所述第二陶瓷浆料包括35~65重量份的第二陶瓷和35~65重量份的第二造孔剂,所述第二陶瓷选自氧化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
在其中一个实施例中,以100重量份的所述第三陶瓷浆料为基准,所述第三陶瓷浆料包括50~75重量份的第三陶瓷和25~50重量份的第三造孔剂,所述第三陶瓷选自氧化硅陶瓷、碳化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
在其中一个实施例中,所述注塑成型的条件包括:压力为10Mpa~30Mpa,温度为70℃~80℃。
在其中一个实施例中,在所述第二陶瓷层的相对的两侧分别涂覆第一陶瓷浆料和第三陶瓷浆料包括:在所述第二陶瓷层的相对的两侧通过丝网印刷或旋涂的方式分别涂覆所述第一陶瓷浆料和所述第三陶瓷浆料。
在其中一个实施例中,所述固化的条件包括:温度为100℃~150℃,时间为60min~90min。
在其中一个实施例中,所述烧结的条件包括:温度为1100℃~1300℃,时间为30min~90min。
一种雾化组件,包括发热元件和上述复合陶瓷件;所述发热元件层叠于所述第一陶瓷层的远离所述第二陶瓷层的表面。
一种电子烟,包括上述雾化组件。
本发明提供的上述复合陶瓷件具有独特的三层复合结构,使其表现出优异的综合性能:
(1)第一陶瓷层的导热系数较高,可有效分散发热元件的热量,降低干烧温度,防止因干烧引起的产品寿命问题;同时,由于具有较小的孔径,使得发热元件的一致性更好,从而改善雾化的稳定性,优化雾化效果;
(2)第二陶瓷层具有较高的孔隙率,有利于提高导油速率,增强烟雾口感;
(3)第三陶瓷层的抗压强度较高,可以显著增强组件的整体强度,便于产品在烟具配件中的装配。
附图说明
图1为一实施方式的复合陶瓷件的结构示意图;
图2为一实施方式的复合陶瓷件的制备方法的流程图;
图3为又一实施方式的复合陶瓷件的制备方法的流程图;
图4为一实施方式的雾化组件的结构示意图。
具体实施方式
为了便于理解本发明,下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是,本发明可以以许多不同的形式来实现,并不限于本文所描述的实施例。相反地,提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本发明。
一实施方式的复合陶瓷件100,参考图1,复合陶瓷件100包括依次层叠设置的第一陶瓷层110、第二陶瓷层120和第三陶瓷层130,第一陶瓷层110、第二陶瓷层120和第三陶瓷层130中,第一陶瓷层110具有最小的孔径和最高的导热率,第二陶瓷层120具有最大的孔隙率,第三陶瓷层130具有最高的抗压强度。
复合陶瓷件100具有独特的三层复合结构,其中,第一陶瓷层110具有最高的导热率和最小的孔径。当将发热元件设置在第一陶瓷层110的远离第二陶瓷层120的一侧表面时,由于第一陶瓷层110的导热率较高,可对发热元件的热量进行有效分散,降低干烧温度,从而防止因干烧引起的产品寿命问题。此外,第一陶瓷层110具有较小的孔径,能够使发热元件的一致性更好,进而改善雾化的稳定性,优化雾化效果。
进一步地,第一陶瓷层110的孔径可以为5μm~9μm,导热率可以为1.5W/m·K~2.0W/m·K,具有上述孔径和导热率的第一陶瓷层110能够有效避免发热元件热量集中,整个雾化表面的温度分布更为均匀,且干烧温度更低,防止焦味的产生,对于改善雾化效果、延长产品使用寿命是有利的。第一陶瓷层110的厚度可以为0.1mm~0.7mm,第一陶瓷层110的厚度在上述范围内时,可以最好地发挥上述作用。第一陶瓷层110的材质可以选自氧化铝陶瓷、碳化硅陶瓷、氮化硅陶瓷和氮化铝陶瓷中的至少一种。
其中,第二陶瓷层120具有最大的孔隙率,有利于提高复合陶瓷件的导油速率,增强烟雾口感,改善用户的抽吸体验。进一步地,第二陶瓷层120的孔隙率可以为55%~65%,当第二陶瓷层120的孔隙率在上述范围内时,能够达到较好的导油效果。第二陶瓷层120的孔径可以在较大范围内调整,例如可以为20μm~200μm。第二陶瓷层120的厚度可以为0.4mm~1.2mm,第二陶瓷层120的厚度在上述范围内时,可以最好地发挥上述作用。第二陶瓷层120的材质可以选自氧化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
其中,第三陶瓷层130具有最高的抗压强度,这样可以显著增强复合陶瓷件的整体强度,便于在烟具配件中进行装配。进一步地,第三陶瓷层130的抗压强度可以为50MPa~70MPa。第三陶瓷层130的孔隙率可以为30%~50%,孔径可以为10μm~100μm。第三陶瓷层130的厚度为0.3mm~1.5mm。第三陶瓷层130的材质可以选自氧化硅陶瓷、碳化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
一实施方式的上述复合陶瓷件的制备方法,该方法包括以下步骤:
S101:分别获取第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料,并将第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料分别流延成型,得到第一陶瓷层110、第二陶瓷层120和第三陶瓷层130。
第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料可通过将陶瓷、造孔剂和可选的辅料混合后球磨得到。为了使得到的第一陶瓷层110、第二陶瓷层120和第三陶瓷层130具备上述特性,在一个实施例中,以100重量份的第一陶瓷浆料为基准,第一陶瓷浆料包括55~85重量份的第一陶瓷和15~45重量份的第一造孔剂,其中,第一陶选自氧化铝陶瓷、碳化硅陶瓷、氮化硅陶瓷和氮化铝陶瓷中的至少一种。
在一个实施例中,以100重量份的第二陶瓷浆料为基准,第二陶瓷浆料包括35~65重量份的第二陶瓷和35~65重量份的第二造孔剂,其中,第二陶选自氧化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
在一个实施例中,以100重量份的第三陶瓷浆料为基准,第三陶瓷浆料包括50~75重量份的第三陶瓷和25~50重量份的第三造孔剂,其中,第三陶选自氧化硅陶瓷、碳化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
上述第一造孔剂、第二造孔剂、第三造孔剂均为本领域的常规种类,例如选自淀粉、石墨、PS微球和PMMA微球中的至少一种。第一造孔剂、第二造孔剂、第三造孔剂可以相同,也可以不同。
本领域技术人员可以理解的是,上述第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料各自还可以含有本领域的各种常见辅料,例如有机溶剂等,辅料的具体种类和用量均为常规的,此处不再赘述。
流延成型的操作方法为本领域技术人员所熟知,本发明没有特殊的限制。
S102:将第一陶瓷层110、第二陶瓷层120和第三陶瓷层130依次层叠并进行干压成型或等静压成型,然后烧结,得到复合陶瓷件。
其中,干压成型的条件可以包括:温度为70℃~80℃,压力为10MPa~30MPa,时间为3min~20min。
其中,等静压成型的条件可以包括:温度为70℃~80℃,压力为50MPa~100MPa,时间为5min~20min。
其中,在进行烧结前,还可以进行排胶的步骤,排胶的条件包括:在空气气氛下进行,温度为260℃~450℃,时间为2h~5h。烧结的条件可以包括:温度为1100℃~1300℃,时间为30min~90min。
另一实施方式的上述复合陶瓷件的制备方法,该方法包括以下步骤:
S201:分别获取第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料,并将第二陶瓷浆料进行注塑成型或流延成型,得到第二陶瓷层120。
其中,第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料的制备方法和配方可参见上文的描述。
其中,注塑成型的条件可以包括:压力为10MPa~30MPa,温度为70℃~80℃。当通过注塑成型的方式制备第二陶瓷层120时,步骤S201中还包括对注塑成型获得的生坯进行固化的步骤,固化的条件可以包括:温度为100℃~150℃。
其中,当通过流延成型的方式制备第二陶瓷层120时,步骤S201中还包括对流延成型获得的生坯进行烧结的步骤,烧结的温度可以为1100℃~1300℃,时间可以为30min~90min。
S202:在第二陶瓷层120的相对的两侧分别涂覆第一陶瓷浆料和第三陶瓷浆料,固化得到第一陶瓷层110和第三陶瓷层130,然后烧结,得到复合陶瓷件。
其中,可以通过丝网印刷或旋涂的方式分别涂覆第一陶瓷浆料和第三陶瓷浆料。
其中,固化的条件可以包括:温度为100℃~150℃,时间为60min~120min。
其中,在进行烧结前,还可以进行排胶的步骤,排胶的条件包括:在空气气氛下进行,温度为260℃~450℃,时间为2h~5h。烧结的条件可以包括:温度为1100℃~1300℃,时间为30min~90min。
其中,烧结的条件可以包括:温度为1100℃~1300℃,时间为30min~90min。
一实施方式的电子烟,包括雾化组件,该雾化组件包括上述复合陶瓷件100和发热元件200,参考图4,发热元件200层叠于第一陶瓷层110的远离所述第二陶瓷层120的表面。其中,发热元件200可以为导电膜。该雾化组件具有较强的耐干烧性能,同时具备较高的基体抗压强度以及较快的导油速度,综合性能优异。
以下通过实施例进一步说明本发明,但不用于限定本发明。
实施例中,陶瓷层的厚度采用游标卡尺进行测试;孔径采用PSDA-20型微滤膜孔径分布仪进行测试,测试方法为运用泡压法;孔隙率采用密度天平进行测试;电阻值采用HIOKI的RM3544型微阻计仪器进行测试,测试方法为采用电桥原理进行四线法测量;抗压强度采用抗压强度试验机仪器进行测试,测试方法为GB/T 4740-1999陶瓷材料抗压强度试验方法。
实施例1
采用行星球磨机,分别配制第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料。其中,第一陶瓷浆料为含30重量%造孔剂的氧化铝浆料,第二陶瓷浆料为含50重量%造孔剂的氧化硅浆料,第三陶瓷浆料为含30重量%造孔剂的氧化硅浆料。以PE膜为承载膜,采用流延机将上述第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料分别流延成型为厚度为0.4mm的第一陶瓷层、厚度为0.6mm的第二陶瓷层和厚度为1mm的第三陶瓷层。将上述第一陶瓷层、第二陶瓷层和第三陶瓷层依次堆叠,然后于温水等静压机中进行等静压成型,水温为70℃,最高压力为100MPa,保压15min,得到三层复合结构的陶瓷生坯体。然后在通有空气气氛的马弗炉中对该陶瓷生坯体进行排胶,排胶最高温度为450℃,保温5h,随后关闭氧气进气阀,于1200℃下烧结1h,得到复合陶瓷件。该复合陶瓷件的结构如图1所示,检测得到第一陶瓷层(氧化铝陶瓷层)的孔径为6μm,孔隙率为50%,导热率为1.7W/m·K,抗压强度为50Mpa;第二陶瓷层(氧化硅陶瓷层)的孔径为30μm,孔隙率为60%,导热率为0.5W/m·K,抗压强度为45Mpa;第三陶瓷层(氧化硅陶瓷层)的抗压强度为60Mpa,孔径为10μm,孔隙率为40%,导热率为0.6W/m·K。
实施例2
本实施例的复合陶瓷件的制备步骤与实施例1大致相同,区别在于,第一陶瓷浆料为含35重量%造孔剂的碳化硅浆料,第二陶瓷浆料为含50重量%造孔剂的氧化硅浆料,第三陶瓷浆料为含30重量%造孔剂的氧化硅浆料;通过流延成型得到的第一陶瓷层的厚度为0.6mm,第二陶瓷层的厚度为0.9mm,第三陶瓷层的厚度为1.5mm。所制备的复合陶瓷件中,第一陶瓷层(碳化硅陶瓷层)的孔径为8μm,孔隙率为51%,导热率为1.8W/m·K,抗压强度为48Mpa;第二陶瓷层(氧化硅陶瓷层)的孔径为60μm,孔隙率为63%,导热率为0.3W/m·K,抗压强度为40Mpa;第三陶瓷层(氧化硅陶瓷层)的抗压强度为60Mpa,孔径为18μm,孔隙率为41%,导热率为0.35W/m·K。
实施例3
采用行星球磨机,分别配制第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料。其中,第一陶瓷浆料为含40重量%造孔剂的氧化铝浆料,第二陶瓷浆料为含50重量%造孔剂的氧化硅浆料,第三陶瓷浆料为含30重量%造孔剂的碳化硅浆料。将第二陶瓷浆料在80℃,20MPa下进行热注塑成型,然后于120℃烘箱中固化,得到厚度为0.4mm的第二陶瓷层。在第二陶瓷层的一侧通过丝网印刷的方式涂覆第一陶瓷浆料,在烘箱中100℃保温1h,从而在第二陶瓷层的一侧得到厚度为0.6mm的第一陶瓷层。在第二陶瓷层的另一侧通过丝网印刷的方式涂覆第三陶瓷浆料,在烘箱中100℃保温1h,从而在第二陶瓷层的另一侧得到厚度为0.4mm的第三陶瓷层。在通有空气气氛的马弗炉中对三层复合结构的陶瓷生坯体进行排胶,排胶最高温度为450℃,保温4h,随后关闭氧气进气阀,于1280℃下烧结2h,得到复合陶瓷件。该复合陶瓷件的结构如图1所示,检测得到第一陶瓷层(氧化铝陶瓷层)的孔径为6μm,孔隙率为47%,导热率为1.6W/m·K,抗压强度为50Mpa;第二陶瓷层(氧化硅陶瓷层)的孔径为75μm,孔隙率为61%,导热率为0.4W/m·K,抗压强度为42Mpa;第三陶瓷层(碳化硅陶瓷层)的抗压强度为65Mpa,孔径为11μm,孔隙率为40%,导热率为1.5W/m·K。
实施例4
采用行星球磨机,分别配制第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料。其中,第一陶瓷浆料为含30重量%造孔剂的氧化铝浆料,第二陶瓷浆料为含50重量%造孔剂的氧化硅浆料,第三陶瓷浆料为含30重量%造孔剂的氧化硅浆料。以PE膜为承载膜,采用流延机将上述第二陶瓷浆料流延成型为厚度为0.6mm的第二陶瓷层。采用旋涂机在第二陶瓷层的一侧涂覆第一陶瓷浆料,再在第二陶瓷层的另一侧涂覆第三陶瓷浆料,从而在第二陶瓷层的一侧得到厚度为0.6mm的第一陶瓷层,并在第二陶瓷层的另一侧得到厚度为0.8mm的第三陶瓷层。在通有空气气氛的马弗炉中对三层复合结构的陶瓷生坯体进行排胶,排胶最高温度为450℃,保温4h,随后关闭氧气进气阀,于1280℃下烧结1.5h,得到复合陶瓷件。该复合陶瓷件的结构如图1所示,检测得到第一陶瓷层(氧化铝陶瓷层)的孔径为8μm,孔隙率为48%,导热率为1.9W/m·K,抗压强度为48Mpa;第二陶瓷层(氧化硅陶瓷层)的孔径为65μm,孔隙率为60%,导热率为0.45W/m·K,抗压强度为40Mpa;第三陶瓷层(氧化硅陶瓷层)的抗压强度为55Mpa,孔径为15μm,孔隙率为45%,导热率为0.5W/m·K。
对比例1
本对比例为一层结构的氧化铝陶瓷体,具体制备步骤为:采用行星球磨机,配制含50重量%造孔剂的氧化铝浆料,以PE膜为承载膜,采用流延机将上述浆料流延、叠压及烧结成型为厚度为2mm的陶瓷体。检测得到该氧化铝陶瓷体的孔径为50μm,孔隙率为65%,导热率为1.7W/m·K,抗压强度为30Mpa。
对比例2
本对比例为一层结构的氧化硅陶瓷体,具体制备步骤为:采用行星球磨机,配制含50重量%造孔剂的氧化硅浆料,以PE膜为承载膜,采用流延机将上述浆料流延、叠压及烧结成型为厚度为2mm的陶瓷体。检测得到该氧化硅陶瓷体的孔径为45μm,孔隙率为40%,导热率为0.4W/m·K,抗压强度为60Mpa。
测试例1
采用半自动印刷机、200目丝网和镍铬导电浆料分别在实施例1~4制备的复合陶瓷件和对比例1~2制备的陶瓷体表面印刷导电膜,印刷得到导电膜阻值为1Ω,测试基体强度和导油速度,然后在直流恒压电源(负载功率为6.5W)下进行电流冲击试验,采用电子万能试验机进行抗压强度测试,采用自制导油速度测试设备进行测试,采用安捷伦直流稳压电源进行电流通断实验,测试结果如表1所示。
表1
通断电循环次数 | 基体抗压强度,MPa | 导油速度,mg/(cm<sup>2</sup>·min) | |
实施例1 | 1600次开路失效 | 60 | 13~15 |
实施例2 | 1650次开路失效 | 61 | 12~14 |
实施例3 | 1550次开路失效 | 62 | 11~13 |
实施例4 | 1700次开路失效 | 61 | 13~15 |
对比例1 | 500次开路失效 | 30 | 13~15 |
对比例2 | 1500次开路失效 | 60 | 8~10 |
由表1可见,实施例1~4的复合陶瓷件在电流冲击试验中的通断电流循环次数均超出对比例1~2,证明本发明的复合陶瓷件具有较强的通电抗干烧能力,同时具备较高的基体抗压强度以及较快的导油速度。
测试例2
分别按照实施例1和对比例1~2的方法制备1000件复合陶瓷件样品,并分别按照测试例1的方法在样品表面印刷导电膜,采用HIOKI的RM3544型微阻计测量导电膜的电阻一致性,测试结果如表2所示。
表2
样品目标阻值,Ω | 统计1000pcs产品平均值 | 统计1000pcs产品标准偏差 | |
实施例1 | 1.10 | 1.10 | 0.032 |
对比例1 | 1.10 | 1.15 | 0.224 |
对比例2 | 1.10 | 1.16 | 0.320 |
由表2可见,本发明的复合陶瓷件表面印刷导电膜后的电阻一致性更好,有利于改善雾化的稳定性,优化雾化效果。
测试例3
按照测试例1的方法在实施例1~4制备的复合陶瓷件和对比例1~2制备的陶瓷体表面印刷导电膜,然后进行雾化测试测试,采用PI红外热像仪测温检测导电膜于6.5W功率下的干烧最高温度和温度梯度,测试结果如表3所示。
表3
最高温度,℃ | 雾化面温度梯度,K/mm | |
实施例1 | 548.65 | 253.31 |
实施例2 | 523.44 | 235.22 |
实施例3 | 573.46 | 238.06 |
实施例4 | 500.28 | 219.39 |
对比例1 | 912.75 | 448.11 |
对比例2 | 838.65 | 485.05 |
由表3可见,本发明的复合陶瓷件可有效分散导电膜的热量,使温度分布更加均匀,且干烧温度更低,有利于防止焦味的产生。
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。
Claims (25)
1.一种复合陶瓷件,其特征在于,包括依次层叠设置的第一陶瓷层、第二陶瓷层和第三陶瓷层,所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层中,所述第一陶瓷层具有最小的孔径和最高的导热率,所述第二陶瓷层具有最大的孔隙率,所述第三陶瓷层具有最高的抗压强度。
2.根据权利要求1所述的复合陶瓷件,其特征在于,所述第一陶瓷层的孔径为5μm~9μm,导热率为1.5W/m·K~2.0W/m·K。
3.根据权利要求1所述的复合陶瓷件,其特征在于,所述第二陶瓷层的孔隙率为55%~65%。
4.根据权利要求1所述的复合陶瓷件,其特征在于,所述第三陶瓷层的抗压强度为50MPa~70MPa。
5.根据权利要求1所述的复合陶瓷件,其特征在于,所述第一陶瓷层的厚度为0.1mm~0.7mm。
6.根据权利要求1所述的复合陶瓷件,其特征在于,所述第二陶瓷层的厚度为0.4mm~1.2mm。
7.根据权利要求1所述的复合陶瓷件,其特征在于,所述第三陶瓷层的厚度为0.3mm~1.5mm。
8.根据权利要求1所述的复合陶瓷件,其特征在于,所述第一陶瓷层的材质选自氧化铝陶瓷、碳化硅陶瓷、氮化硅陶瓷和氮化铝陶瓷中的至少一种。
9.根据权利要求1所述的复合陶瓷件,其特征在于,所述第二陶瓷层的材质选自氧化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
10.根据权利要求1所述的复合陶瓷件,其特征在于,所述第三陶瓷层的材质选自氧化硅陶瓷、碳化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
11.一种复合陶瓷件的制备方法,其特征在于,该方法包括以下步骤:
分别获取第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料,并将所述第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料分别流延成型,得到第一陶瓷层、第二陶瓷层和第三陶瓷层;所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层中,所述第一陶瓷层具有最小的孔径和最高的导热率,所述第二陶瓷层具有最大的孔隙率,所述第三陶瓷层具有最高的抗压强度;
将所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层依次层叠并进行干压成型或等静压成型,然后烧结,得到复合陶瓷件。
12.根据权利要求11所述的方法,其特征在于,以100重量份的所述第一陶瓷浆料为基准,所述第一陶瓷浆料包括55~85重量份的第一陶瓷和15~45重量份的第一造孔剂,所述第一陶瓷选自氧化铝陶瓷、碳化硅陶瓷、氮化硅陶瓷和氮化铝陶瓷中的至少一种;及/或,
以100重量份的所述第二陶瓷浆料为基准,所述第二陶瓷浆料包括35~65重量份的第二陶瓷和35~65重量份的第二造孔剂,所述第二陶瓷选自氧化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种;及/或,
以100重量份的所述第三陶瓷浆料为基准,所述第三陶瓷浆料包括50~75重量份的第三陶瓷和25~50重量份的第三造孔剂,所述第三陶瓷选自氧化硅陶瓷、碳化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
13.根据权利要求11所述的方法,其特征在于,所述第一陶瓷层的孔径为5μm~9μm,导热率为1.5W/m·K~2.0W/m·K;及/或,所述第二陶瓷层的孔隙率为55%~65%;及/或,所述第三陶瓷层的抗压强度为50MPa~70MPa。
14.根据权利要求11所述的方法,其特征在于,所述第一陶瓷层的厚度为0.1mm~0.7mm;及/或,所述第二陶瓷层的厚度为0.4mm~1.2mm;及/或,所述第三陶瓷层的厚度为0.3mm~1.5mm。
15.根据权利要求11所述的方法,其特征在于,所述干压成型的条件包括:温度为70℃~80℃,压力为10MPa~30MPa,时间为3min~20min;及/或,所述等静压成型的条件包括:温度为70℃~80℃,压力为50Mpa~100Mpa,时间为5min~20min。
16.根据权利要求11所述的方法,其特征在于,所述烧结的条件包括:温度为1100℃~1300℃,时间为30min~90min。
17.一种复合陶瓷件的制备方法,其特征在于,该方法包括以下步骤:
分别获取第一陶瓷浆料、第二陶瓷浆料和第三陶瓷浆料,并将所述第二陶瓷浆料进行注塑成型或流延成型,得到第二陶瓷层;
在所述第二陶瓷层的相对的两侧分别涂覆第一陶瓷浆料和第三陶瓷浆料,固化得到第一陶瓷层和第三陶瓷层,然后烧结,得到复合陶瓷件;所述第一陶瓷层、所述第二陶瓷层和所述第三陶瓷层中,所述第一陶瓷层具有最小的孔径和最高的导热率,所述第二陶瓷层具有最大的孔隙率,所述第三陶瓷层具有最高的抗压强度。
18.根据权利要求17所述的方法,其特征在于,以100重量份的所述第一陶瓷浆料为基准,所述第一陶瓷浆料包括55~85重量份的第一陶瓷和15~45重量份的第一造孔剂,所述第一陶瓷选自氧化铝陶瓷、碳化硅陶瓷、氮化硅陶瓷和氮化铝陶瓷中的至少一种;及/或,
以100重量份的所述第二陶瓷浆料为基准,所述第二陶瓷浆料包括35~65重量份的第二陶瓷和35~65重量份的第二造孔剂,所述第二陶瓷选自氧化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种;及/或,
以100重量份的所述第三陶瓷浆料为基准,所述第三陶瓷浆料包括50~75重量份的第三陶瓷和25~50重量份的第三造孔剂,所述第三陶瓷选自氧化硅陶瓷、碳化硅陶瓷、氧化铝陶瓷、堇青石陶瓷和氮化硅陶瓷中的至少一种。
19.根据权利要求17所述的方法,其特征在于,所述注塑成型的条件包括:压力为10Mpa~30Mpa,温度为70℃~80℃。
20.根据权利要求17所述的方法,其特征在于,在所述第二陶瓷层的相对的两侧分别涂覆第一陶瓷浆料和第三陶瓷浆料包括:在所述第二陶瓷层的相对的两侧通过丝网印刷或旋涂的方式分别涂覆所述第一陶瓷浆料和所述第三陶瓷浆料。
21.根据权利要求17所述的方法,其特征在于,所述固化的条件包括:温度为100℃~150℃,时间为60min~90min;及/或,所述烧结的条件包括:温度为1100℃~1300℃,时间为30min~90min。
22.根据权利要求17所述的方法,其特征在于,所述第一陶瓷层的孔径为5μm~9μm,导热率为1.5W/m·K~2.0W/m·K;及/或,所述第二陶瓷层的孔隙率为55%~65%;及/或,所述第三陶瓷层的抗压强度为50MPa~70MPa。
23.根据权利要求17所述的方法,其特征在于,所述第一陶瓷层的厚度为0.1mm~0.7mm;及/或,所述第二陶瓷层的厚度为0.4mm~1.2mm;及/或,所述第三陶瓷层的厚度为0.3mm~1.5mm。
24.一种雾化组件,其特征在于,包括发热元件和复合陶瓷件;所述复合陶瓷件为权利要求1~10任意一项所述的复合陶瓷件,或者由权利要求11~16任意一项所述的方法制备得到的复合陶瓷件,或者由权利要求17~23任意一项所述的方法制备得到的复合陶瓷件;所述发热元件层叠于所述第一陶瓷层的远离所述第二陶瓷层的表面。
25.一种电子烟,其特征在于,包括权利要求24所述的雾化组件。
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