CN112382572B - Ono屏蔽栅的sgt结构及其制造方法 - Google Patents
Ono屏蔽栅的sgt结构及其制造方法 Download PDFInfo
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- CN112382572B CN112382572B CN202110055819.8A CN202110055819A CN112382572B CN 112382572 B CN112382572 B CN 112382572B CN 202110055819 A CN202110055819 A CN 202110055819A CN 112382572 B CN112382572 B CN 112382572B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 54
- 238000005530 etching Methods 0.000 claims abstract description 38
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 32
- 239000005388 borosilicate glass Substances 0.000 claims abstract description 30
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 17
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 14
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052796 boron Inorganic materials 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000000151 deposition Methods 0.000 claims description 10
- 230000003647 oxidation Effects 0.000 claims description 10
- 238000007254 oxidation reaction Methods 0.000 claims description 10
- 238000001312 dry etching Methods 0.000 claims description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 238000001259 photo etching Methods 0.000 claims description 8
- 238000001039 wet etching Methods 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- RJCRUVXAWQRZKQ-UHFFFAOYSA-N oxosilicon;silicon Chemical class [Si].[Si]=O RJCRUVXAWQRZKQ-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
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- H01L29/063—Reduced surface field [RESURF] pn-junction structures
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
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- Manufacturing & Machinery (AREA)
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Abstract
Description
Claims (8)
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CN202110055819.8A CN112382572B (zh) | 2021-01-15 | 2021-01-15 | Ono屏蔽栅的sgt结构及其制造方法 |
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CN202110055819.8A CN112382572B (zh) | 2021-01-15 | 2021-01-15 | Ono屏蔽栅的sgt结构及其制造方法 |
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CN112382572B true CN112382572B (zh) | 2021-11-02 |
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CN116544186A (zh) * | 2023-07-06 | 2023-08-04 | 捷捷微电(南通)科技有限公司 | 一种sgt-mosfet的制造方法及sgt-mosfet |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106920752A (zh) * | 2017-03-15 | 2017-07-04 | 西安龙腾新能源科技发展有限公司 | 低压超结mosfet栅源氧化层结构及制造方法 |
CN109037071A (zh) * | 2018-07-19 | 2018-12-18 | 厦门芯代集成电路有限公司 | 一种屏蔽栅功率器件的制备方法 |
CN110797412A (zh) * | 2019-10-22 | 2020-02-14 | 龙腾半导体有限公司 | Sgt mosfet结构及其工艺制造方法 |
CN111933714A (zh) * | 2020-09-25 | 2020-11-13 | 龙腾半导体股份有限公司 | 三段式氧化层屏蔽栅沟槽mosfet结构的制造方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US7989293B2 (en) * | 2009-02-24 | 2011-08-02 | Maxpower Semiconductor, Inc. | Trench device structure and fabrication |
US20110068389A1 (en) * | 2009-09-21 | 2011-03-24 | Force Mos Technology Co. Ltd. | Trench MOSFET with high cell density |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106920752A (zh) * | 2017-03-15 | 2017-07-04 | 西安龙腾新能源科技发展有限公司 | 低压超结mosfet栅源氧化层结构及制造方法 |
CN109037071A (zh) * | 2018-07-19 | 2018-12-18 | 厦门芯代集成电路有限公司 | 一种屏蔽栅功率器件的制备方法 |
CN110797412A (zh) * | 2019-10-22 | 2020-02-14 | 龙腾半导体有限公司 | Sgt mosfet结构及其工艺制造方法 |
CN111933714A (zh) * | 2020-09-25 | 2020-11-13 | 龙腾半导体股份有限公司 | 三段式氧化层屏蔽栅沟槽mosfet结构的制造方法 |
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Effective date of registration: 20220428 Address after: 710000 export processing zone, No. 1, Fengcheng 12th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee after: Longteng Semiconductor Co.,Ltd. Patentee after: Xi'an Longxiang Semiconductor Co.,Ltd. Patentee after: Xusi semiconductor (Shanghai) Co.,Ltd. Address before: 710018 export processing zone, No.1 Fengcheng 12th Road, economic and Technological Development Zone, Weiyang District, Xi'an City, Shaanxi Province Patentee before: Longteng Semiconductor Co.,Ltd. |