CN112331586B - Automatic LED (light emitting diode) surface mounting assembly line - Google Patents
Automatic LED (light emitting diode) surface mounting assembly line Download PDFInfo
- Publication number
- CN112331586B CN112331586B CN202011149189.2A CN202011149189A CN112331586B CN 112331586 B CN112331586 B CN 112331586B CN 202011149189 A CN202011149189 A CN 202011149189A CN 112331586 B CN112331586 B CN 112331586B
- Authority
- CN
- China
- Prior art keywords
- frame
- servo motor
- side plate
- guide rail
- positioning mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 claims description 10
- 239000000428 dust Substances 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000010073 coating (rubber) Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses an LED automatic pasting assembly line, which comprises a frame, a conveying mechanism, a positioning mechanism and a pasting machine, wherein the conveying mechanism is arranged on the frame, the positioning mechanism is arranged at the middle part of the conveying mechanism, the pasting machine is arranged above the positioning mechanism, the conveying mechanism comprises a first side plate and a second side plate, the conveying second side plate is slidably connected to the frame, so that the width of the conveying mechanism can be adjusted to meet the requirement of conveying substrates with different widths, the conveying mechanism conveys the substrates to be pasted to the positioning mechanism, the positioning mechanism positions the substrates, the pasting machine pastes the substrates to ensure the pasting quality, the positioning mechanism resets after pasting is finished, the conveying mechanism outputs the substrates, the assembly line overcomes the defect of manual feeding and discharging through the conveying mechanism and the positioning mechanism, the width of the conveying mechanism is adjustable, and the adaptability is stronger.
Description
Technical Field
The invention relates to the technical field of LED production, in particular to an automatic LED surface mounting assembly line.
Background
The defect that traditional electronic component needs manual welding to the base plate is solved in the appearance of LED paster, has improved the preparation efficiency of base plate greatly, and current LED paster assembly line needs the manual work to go up the unloading to the base plate, and efficiency is lower, and current base plate conveyor can only carry the base plate of single specification, can't satisfy the production demand of the base plate of different specifications, consequently, the urgent need provides an automatic paster assembly line of LED.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the invention provides an LED automatic paster assembly line, which aims to solve the problems in the background art.
The embodiment of the application discloses: the utility model provides an automatic paster assembly line of LED, includes frame, conveying mechanism, positioning mechanism and chip mounter, conveying mechanism sets up in the frame, conveying mechanism's middle part is equipped with positioning mechanism, positioning mechanism's top is equipped with the chip mounter, conveying mechanism includes mutual parallel arrangement first curb plate and second curb plate, the inboard of second curb plate is equipped with laser range finder, first curb plate with the inboard of second curb plate is connected with drive wheel and from the driving wheel through the bearing frame, the drive wheel with from the driving wheel through the belt connection, the bottom of the first half of belt is equipped with the wear strip that matches with it, be equipped with two perpendicular to in the frame length direction's guide rail, sliding connection has the slider on the guide rail, the sliding block is connected with a base, the second side plate is fixed on the base, a threaded hole parallel to the guide rail is formed in the base, a screw rod matched with the threaded hole is connected with the threaded hole, the screw rod is connected with a first servo motor, the first servo motor is electrically connected with the laser range finder, the first servo motor is fixed on the frame, a second servo motor is fixed on the frame, the output end of the second servo motor is connected with a hexagonal rod, a driving wheel on the first side plate is connected with the end part of the hexagonal rod, a hexagonal through hole matched with the hexagonal rod is formed in the driving wheel on the second side plate, and the hexagonal rod is slidably connected in the through hole; the positioning mechanism comprises a jacking cylinder fixed on the frame, a supporting plate is fixed on a top rod of the jacking cylinder, a rubber coating is arranged on the upper end face of the supporting plate, a baffle plate extending inwards is arranged at the top end of a first side plate and the top end of a second side plate, a plurality of sleeves are arranged on the baffle plate, stepped holes are arranged in the sleeves, the small diameter of each stepped hole is short and downward, movable rods matched with the stepped holes are movably connected in the stepped holes, limiting blocks are arranged at the top ends of the movable rods, springs are connected between the upper end faces of the limiting blocks and the top ends of the stepped holes, the springs are in an extension state, the bottom ends of the movable rods are connected with pressing plates matched with the supporting plate, two position sensors are arranged at the two ends of the supporting plate, and the conveying mechanism conveys a substrate to the positioning mechanism.
Preferably, the chip mounter's chip mounter head is connected with moving mechanism, moving mechanism locates directly over the positioning mechanism, moving mechanism is including parallel locating two first guide rails of frame top, two sliding connection has the fly frame on the first guide rail, be equipped with on the first guide rail along its length direction's first threaded rod, first threaded rod runs through the fly frame, the one end rotatable coupling of first threaded rod is in the one end of first guide rail, the other end of first threaded rod is connected with the third servo motor, the third servo motor is fixed the other end of first guide rail, be equipped with on the fly frame along its length direction's second guide rail, sliding connection has the connecting block on the second guide rail, be equipped with on the fly frame along its length direction's second threaded rod, the second guide rail runs through the connecting block, the one end rotatable coupling of second guide rail is in on the fly frame, the other end of second guide rail is connected with the fourth servo motor, the fourth servo motor is fixed on the fly frame vertical, the ejector pin is fixed with the servo motor on the cylinder.
Preferably, a pressure sensor is arranged in the stepped hole, the pressure sensor is arranged between the upper end of the spring and the top end of the stepped hole, and the pressure sensor is electrically connected with the jacking cylinder.
Preferably, the conveying mechanism is provided with a dust collector, and the dust collector is positioned at the left side of the positioning mechanism.
The beneficial effects of the invention are as follows: the automatic paster assembly line of LED is through two the leather holds to wait that the paster base plate carries, improves work efficiency greatly, first servo motor drive the lead screw is rotatory, the lead screw drive the base is followed the guide rail slides, and then drives the second curb plate is followed the guide rail slides, thereby adjusts conveying mechanism's width makes it can satisfy the demand of carrying the base plate of different specifications, jacking cylinder drive the layer board upwards holds up the base plate, the clamp plate is pressed on the up end of base plate, makes the base plate is fixed, the follow-up paster operation of being convenient for.
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments, as illustrated in the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a part of an automatic LED chip mounting assembly line.
Fig. 2 is a schematic view of a part of the structure of the conveying mechanism.
Fig. 3 is a schematic view of the positioning mechanism.
Fig. 4 is a schematic view of the movable bar structure.
Fig. 5 is a top view of the movement mechanism.
Fig. 6 is a schematic diagram of the structure of the connection block.
Reference numerals of the above drawings: 1. a frame; 2. a conveying mechanism; 3. a positioning mechanism; 4. a chip mounter; 5. a substrate; 6. a first side plate; 7. a second side plate; 8. a laser range finder; 9. a driving wheel; 10. driven wheel; 11. a belt; 12. a guide rail; 13. A slide block; 14. a base; 15. a screw rod; 16. a first servo motor; 17. a second servo motor; 18. a hexagonal rod; 19. jacking the air cylinder; 20. a supporting plate; 21. a baffle; 22. a sleeve; 23. a stepped hole; 24. a movable rod; 25. a limiting block; 26. a spring; 27. a pressing plate; 28. a position sensor; 29. a patch head; 30. a moving mechanism; 31. a first guide rail; 32. a movable frame; 33. a first threaded rod; 34. a third servo motor; 35. a second guide rail; 36. a connecting block; 37. a second threaded rod; 38. A fourth servo motor; 39. a servo cylinder; 40. a pressure sensor; 41. a dust collector.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 6, an automatic LED mounting assembly line comprises a frame 1, a conveying mechanism 2, a positioning mechanism 3 and a mounting machine 4, wherein the conveying mechanism 2 is arranged on the frame 1, the positioning mechanism 3 is arranged at the middle part of the conveying mechanism 2, the mounting machine 4 is arranged above the positioning mechanism 3, the conveying mechanism 2 conveys a substrate 5 to be mounted to the positioning mechanism 3, the positioning mechanism 3 positions the substrate 5, the mounting machine 4 mounts the substrate 5, after mounting is completed, the conveying mechanism 2 outputs the conveying substrate 5, the conveying mechanism 2 comprises a first side plate 6 and a second side plate 7 which are mutually parallel, a laser distance meter 8 is arranged at the inner side of the second side plate 7, the laser distance meter 8 is used for monitoring the distance between the first side plate 6 and the second side plate 7, the inner sides of the first side plate 6 and the second side plate 7 are respectively connected with a driving wheel 9 and a driven wheel 10 through bearing seats, the driving wheel 9 and the driven wheel 10 are connected through a belt 11, the bottom of the upper half part of the belt 11 is provided with a wear-resisting strip matched with the belt 11 to prevent the belt 11 from sinking and affecting the transmission effect, the frame 1 is provided with two guide rails 12 perpendicular to the length direction of the frame 1, the guide rails 12 are connected with sliding blocks 13 in a sliding manner, the sliding blocks 13 are connected with bases 14, the bases 14 can slide freely along the length direction of the guide rails 12, the second side plate 7 is fixed on the bases 14, the bases 14 are provided with threaded holes parallel to the guide rails 12, the threaded holes are connected with screw rods 15 matched with the threaded holes, the screw rods 15 are connected with first servo motors 16, the first servo motor 16 is electrically connected with the laser distance meter 8, the first servo motor 16 is fixed on the frame 1, the first servo motor 16 drives the screw rod 15 to rotate, the screw rod 15 drives the base 14 to slide along the guide rail 12, the base 14 drives the second side plate 7 to slide along the guide rail 12, thereby adjusting the distance between the first side plate 6 and the second side plate 7, the conveying laser distance meter 8 monitors and conveys the distance between the first side plate 6 and the second side plate 7 in real time, signals are transmitted to the first servo motor 16, the driving process of the first servo motor 16 is controlled, the conveying mechanism 2 meets the conveying requirements of the base plate 5 with different specifications, the second servo motor 17 is fixed on the frame 1, the output end of the second servo motor 17 is connected with a hexagonal rod 18, a driving wheel on the first side plate 6 is connected with the end of the hexagonal rod 18, a driving wheel 9 on the second side plate 7 is provided with a hexagonal rod 18, the hexagonal rod 9 is connected with the hexagonal rod 18, the hexagonal rod 9 is in sliding connection with the hexagonal rod 18, and simultaneously, the driving wheel 9 can rotate along the hexagonal rod 18, and the driving wheel 9 can rotate, and the driving wheel 18 rotates freely, and the driving wheel is driven by the hexagonal rod 18; the positioning mechanism 3 comprises a jacking cylinder 19 fixed on the frame 1, a supporting plate 20 is fixed on a top rod of the jacking cylinder 19, a rubber coating is arranged on the upper end face of the supporting plate 20 to prevent friction damage of the base plate 5, a baffle 21 extending inwards is arranged at the top end of the first side plate 6 and the top end of the second side plate 7, a plurality of sleeves 22 are arranged on the baffle 21, a stepped hole 23 is arranged in each sleeve 22, the small diameter of the stepped hole 23 is short downwards, a movable rod 24 matched with the stepped hole 23 is movably connected in the stepped hole 23, a limiting block 25 is arranged at the top end of the movable rod 24, a spring 26 is connected between the upper end face of the limiting block 25 and the top end of the stepped hole 23, the spring 26 is in an extension state, a pressing plate 27 matched with the supporting plate 20 is connected at the bottom end of the movable rod 24, two position sensors 28 are arranged on the inner side of the second side plate 7, the two position sensors 28 are located at the two ends of the sleeve 20, the position sensors are used for detecting the base plate 5, the pressing plate 5 is pressed by the servo motor 26, and the servo motor 5 is pressed by the second side plate 20, the pressing plate 5 is pressed by the spring 26, and the servo motor 5 is pressed by the pressing plate 5 to the servo motor 5, and the pressing part is prevented from being pressed by the pressing the servo motor 5, and the pressing plate 20 is pressed by the upper end face of the servo plate 5.
The chip head 29 of the chip mounter 4 is connected with a moving mechanism 30, the moving mechanism 30 is arranged right above the positioning mechanism 3, the moving mechanism 30 comprises two first guide rails 31 which are arranged above the frame 1 in parallel, a movable frame 32 is connected to the two first guide rails 31 in a sliding manner, a first threaded rod 33 along the length direction of the first guide rails 31 is arranged on the first guide rails 31, the first threaded rod 33 penetrates through the movable frame 32, one end of the first threaded rod 33 is rotatably connected with one end of the first guide rails 31, the other end of the first threaded rod 33 is connected with a third servo motor 34, the third servo motor 34 is fixed at the other end of the first guide rails 31, the third servo motor 34 drives the first threaded rod 33 to rotate, the first threaded rod 33 drives the movable frame to slide back and forth along the first guide rails 31, the movable frame 32 is provided with a second guide rail 35 along the length direction thereof, the second guide rail 35 is connected with a connecting block 36 in a sliding manner, the movable frame 32 is provided with a second threaded rod 37 along the length direction thereof, the second threaded rod 37 penetrates through the connecting block 36, one end of the second threaded rod 37 is rotatably connected with the movable frame 32, the other end of the second threaded rod 37 is connected with a fourth servo motor 38, the fourth servo motor 38 is fixed on the movable frame 32, the fourth servo motor 38 drives the second threaded rod 37 to rotate, the second threaded rod 37 drives the connecting block 36 to slide left and right along the second guide rail 35, a servo cylinder 39 is vertically fixed on the connecting block 36, the patch head 29 is fixed on a mandril of the servo cylinder 39, the servo cylinder 39 drives the patch head 29 to move up and down, the substrate 5 is subjected to a bonding process.
The pressure sensor 40 is arranged in the stepped hole 23, the pressure sensor 40 is arranged between the upper end of the spring 26 and the top end of the stepped hole 23, the pressure sensor 40 is electrically connected with the jacking cylinder 19, the pressure sensor 40 is used for monitoring the compression condition of the spring 26 and transmitting signals to the jacking cylinder 19, and controlling the progress of the jacking cylinder 19 to prevent the substrate 5 from being damaged due to overlarge compression.
The conveying mechanism 2 is provided with a dust collector 41, the dust collector 41 is positioned at the left side of the positioning mechanism 3, and the dust collector 41 is used for sucking impurities attached to the surface of the substrate 5 and ensuring the quality of the patch.
The working process of the pipeline is as follows: the first servo motor drives the screw rod 15 to rotate, the screw rod drives the second side plate 7 to slide along the guide rail 12, so that the width of the conveying mechanism 2 is adjusted to meet the width requirement of the substrate 5, the second servo motor 17 drives the belt 11 to operate, the substrate 5 is conveyed to the right side, the dust collector 41 sucks impurities attached to the surface of the substrate 5, when the position sensor 28 detects the substrate 5, the position sensor 28 sends a signal to the second servo motor 17, the second servo motor stops rotating, meanwhile, the jacking cylinder 19 drives the supporting plate 20 to upwards jack up the substrate 5 for positioning, the third servo motor 34 drives the movable frame 32 to slide back and forth along the first guide rail 31, the movable frame 32 drives the connecting block 36 to slide back and forth, and then drives the patch head 29 to slide back and forth, the fourth servo motor 38 drives the connecting block 36 to slide left and right along the second guide rail 35, so as to drive the patch head 29 to slide left and right, and thus the patch head 29 can move freely in the horizontal plane, the servo cylinder 39 drives the patch head 29 to move up and down, the substrate 5 is subjected to patch, after patch is completed, the jacking cylinder 19 drives the supporting plate 20 to reset, the substrate 5 returns to the upper end surface of the belt 11, the second servo motor 17 continues to drive the belt 11 to operate, and the substrate 5 is output.
The principles and embodiments of the present invention have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (4)
1. An automatic paster assembly line of LED, its characterized in that: the device comprises a frame, a conveying mechanism, a positioning mechanism and a chip mounter, wherein the conveying mechanism is arranged on the frame, the positioning mechanism is arranged at the middle part of the conveying mechanism, the chip mounter is arranged above the positioning mechanism, the conveying mechanism comprises a first side plate and a second side plate which are arranged in parallel, a laser distance meter is arranged on the inner side of the second side plate, the inner sides of the first side plate and the second side plate are both connected with a driving wheel and a driven wheel through bearing seats, the driving wheel and the driven wheel are connected through a belt, a wear-resisting strip matched with the driving wheel is arranged at the bottom of the upper half part of the belt, two guide rails perpendicular to the length direction of the frame are arranged on the frame, a sliding block is connected onto the guide rails in a sliding manner, a base is connected onto the sliding block, the second side plate is fixed onto the base, a threaded hole parallel to the guide rails is formed in the base, a lead screw matched with the threaded hole is connected with the first servo motor, the first servo motor is electrically connected with the laser distance meter, the first servo motor is fixed onto the frame, the hexagonal motor is fixedly arranged on the hexagonal motor, the second servo motor is fixedly connected with the hexagonal rod, and the hexagonal rod is fixedly connected with the end of the driving wheel, and is connected with a hexagonal rod through hole on the driving wheel; the positioning mechanism comprises a jacking cylinder fixed on the frame, a supporting plate is fixed on a top rod of the jacking cylinder, a rubber coating is arranged on the upper end face of the supporting plate, a baffle plate extending inwards is arranged at the top end of a first side plate and the top end of a second side plate, a plurality of sleeves are arranged on the baffle plate, stepped holes are arranged in the sleeves, the small diameter of each stepped hole is short and downward, movable rods matched with the stepped holes are movably connected in the stepped holes, limiting blocks are arranged at the top ends of the movable rods, springs are connected between the upper end faces of the limiting blocks and the top ends of the stepped holes, the springs are in an extension state, the bottom ends of the movable rods are connected with pressing plates matched with the supporting plate, two position sensors are arranged at the two ends of the supporting plate, and the conveying mechanism conveys a substrate to the positioning mechanism.
2. An LED automatic die bonding pipeline as claimed in claim 1, wherein: the utility model discloses a patch machine, including the frame, the chip mounter, the positioning mechanism, the mobile mechanism is located directly over the positioning mechanism, the mobile mechanism is including parallel locating two first guide rails of frame top, two sliding connection has the movable frame on the first guide rail, be equipped with on the first guide rail along its length direction's first threaded rod, first threaded rod runs through the movable frame, the one end rotatable coupling of first threaded rod is in the one end of first guide rail, the other end of first threaded rod is connected with the third servo motor, the third servo motor is fixed the other end of first guide rail, be equipped with the second guide rail along its length direction on the movable frame, sliding connection has the connecting block on the second guide rail, be equipped with on the movable frame along its length direction's second threaded rod, the second guide rail runs through the connecting block, the one end rotatable coupling of second guide rail is in on the movable frame, the other end of second guide rail is connected with the fourth servo motor, the fourth servo motor is fixed on the movable frame, it is fixed with the servo motor on the cylinder to go up the top of the paster.
3. An LED automatic die bonding pipeline as claimed in claim 1, wherein: the pressure sensor is arranged in the stepped hole and is arranged between the upper end of the spring and the top end of the stepped hole, and the pressure sensor is electrically connected with the jacking cylinder.
4. An LED automatic die bonding pipeline as claimed in claim 1, wherein: the conveying mechanism is provided with a dust collector, and the dust collector is positioned at the left side of the positioning mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011149189.2A CN112331586B (en) | 2020-10-23 | 2020-10-23 | Automatic LED (light emitting diode) surface mounting assembly line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011149189.2A CN112331586B (en) | 2020-10-23 | 2020-10-23 | Automatic LED (light emitting diode) surface mounting assembly line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112331586A CN112331586A (en) | 2021-02-05 |
| CN112331586B true CN112331586B (en) | 2024-04-09 |
Family
ID=74310834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011149189.2A Active CN112331586B (en) | 2020-10-23 | 2020-10-23 | Automatic LED (light emitting diode) surface mounting assembly line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112331586B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112993715B (en) * | 2021-04-19 | 2024-06-21 | 青岛鑫圣林电子有限公司 | Automatic chip mounter |
| CN116978819B (en) * | 2023-07-04 | 2024-06-11 | 深圳源明杰科技股份有限公司 | Wafer paster mechanism and wafer paster device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6571530B1 (en) * | 1997-01-17 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd | Component taping method and apparatus |
| CN104386508A (en) * | 2014-09-05 | 2015-03-04 | 常州先进制造技术研究所 | Automatic plate feeding device of LED chip mounter |
| CN105307471A (en) * | 2015-11-03 | 2016-02-03 | 江苏海天微电子科技有限公司 | Automatic chip mounting production line |
| CN108538753A (en) * | 2018-03-06 | 2018-09-14 | 绍兴舜宇照明工程有限公司 | A kind of LED chip mounter |
| CN208222296U (en) * | 2018-06-21 | 2018-12-11 | 江苏辉皓正电气有限公司 | Pendent lamp structure and dust free room pendent lamp |
| CN208657178U (en) * | 2018-07-05 | 2019-03-26 | 深圳市世纪兴电子有限公司 | A kind of full-automatic precision site machine |
| CN209336228U (en) * | 2018-11-23 | 2019-09-03 | 天津必利优科技发展有限公司 | A kind of chip mounter |
| CN110958833A (en) * | 2019-12-23 | 2020-04-03 | 深圳市易通自动化设备有限公司 | Improved full-automatic efficient chip mounter |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102052667B1 (en) * | 2015-10-27 | 2019-12-05 | 히라따기꼬오 가부시키가이샤 | Transfer unit, mobile mounting device and mobile mounting method |
-
2020
- 2020-10-23 CN CN202011149189.2A patent/CN112331586B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6571530B1 (en) * | 1997-01-17 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd | Component taping method and apparatus |
| CN104386508A (en) * | 2014-09-05 | 2015-03-04 | 常州先进制造技术研究所 | Automatic plate feeding device of LED chip mounter |
| CN105307471A (en) * | 2015-11-03 | 2016-02-03 | 江苏海天微电子科技有限公司 | Automatic chip mounting production line |
| CN108538753A (en) * | 2018-03-06 | 2018-09-14 | 绍兴舜宇照明工程有限公司 | A kind of LED chip mounter |
| CN208222296U (en) * | 2018-06-21 | 2018-12-11 | 江苏辉皓正电气有限公司 | Pendent lamp structure and dust free room pendent lamp |
| CN208657178U (en) * | 2018-07-05 | 2019-03-26 | 深圳市世纪兴电子有限公司 | A kind of full-automatic precision site machine |
| CN209336228U (en) * | 2018-11-23 | 2019-09-03 | 天津必利优科技发展有限公司 | A kind of chip mounter |
| CN110958833A (en) * | 2019-12-23 | 2020-04-03 | 深圳市易通自动化设备有限公司 | Improved full-automatic efficient chip mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112331586A (en) | 2021-02-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112331586B (en) | Automatic LED (light emitting diode) surface mounting assembly line | |
| CN108341112B (en) | Double-station automatic line for labeling auxiliary materials by sticking foam and labels on mobile phone | |
| CN108135121B (en) | Chip mounter | |
| CN109592157B (en) | Mounting equipment | |
| CN110615136A (en) | Wireless accessory pad pasting equipment that charges | |
| CN212542373U (en) | Multi-chip intelligent mounting equipment | |
| CN108857207A (en) | A kind of door-plate latasuture apparatus for welding and positioning | |
| CN203214517U (en) | Adhesive sticking mechanism of cooling fin assembly machine | |
| CN112040645A (en) | Circuit board rubberizing method and circuit board rubberizing equipment | |
| CN111867267A (en) | Positioning and conveying device of circuit board rubberizing equipment | |
| CN212355960U (en) | Work piece rubberizing equipment | |
| CN111977112A (en) | Multi-station automatic labeling equipment | |
| CN112027265A (en) | Double-station automatic labeling method | |
| CN218142666U (en) | Adhesive tape detection transfer machine | |
| CN114423272B (en) | PCB force-controlled electric clamping device | |
| CN213324136U (en) | Double-station feeding device of labeling equipment and multi-station labeling equipment | |
| CN110143324B (en) | Novel rubberizing mechanism | |
| CN109592156B (en) | Bending and mounting equipment and bending method thereof | |
| CN114506503A (en) | Automatic film sticking machine | |
| CN219698060U (en) | SMT material receiving device | |
| CN112040644A (en) | Rubberizing device of circuit board rubberizing machine | |
| CN215551044U (en) | Ferrite pasting mechanism | |
| CN211894004U (en) | Automatic production equipment for earphones | |
| CN220921442U (en) | Cell-phone shell antenna mounting mechanism | |
| CN221253342U (en) | Adhesive tape sticking device and adhesive tape sticking machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |