WO2022057296A1 - Integrated silicon rod cutting-grinding machine - Google Patents
Integrated silicon rod cutting-grinding machine Download PDFInfo
- Publication number
- WO2022057296A1 WO2022057296A1 PCT/CN2021/094827 CN2021094827W WO2022057296A1 WO 2022057296 A1 WO2022057296 A1 WO 2022057296A1 CN 2021094827 W CN2021094827 W CN 2021094827W WO 2022057296 A1 WO2022057296 A1 WO 2022057296A1
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- Prior art keywords
- cutting
- silicon rod
- driving
- grinding
- wheel
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Definitions
- the present application relates to the technical field of silicon workpiece processing, in particular to an integrated machine for cutting and grinding silicon rods.
- the existing manufacturing process of silicon wafers taking monocrystalline silicon products as an example, generally, the rough operation process can include: first, use a silicon rod cutting machine to cut off the original long silicon rods to form multi-section short silicon rods; After that, the cut-off short silicon rods are squared by a silicon rod squarer to form rectangular cut silicon rods; The surface shaping of the rod meets the corresponding flatness and dimensional tolerance requirements; the silicon rod is then sliced with a slicing machine to obtain a single crystal silicon wafer.
- the purpose of the present application is to provide an integrated machine for cutting and grinding a silicon rod and a method for cutting and grinding a silicon rod, which are used to solve the inefficiency of each process operation and the processing of silicon rods that exist in the prior art. Poor work performance, etc.
- a silicon rod cutting and grinding integrated machine comprising:
- the machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing location and a second processing location;
- the first transfer device located in the first transfer channel, includes a first silicon rod holder and a first transfer drive mechanism, and the first transfer drive mechanism is used to drive the first silicon rod holder and the silicon rod edge it clamps. moving in the first direction and transferring between the first processing location and the second processing location;
- a second transfer device located in the second transfer channel, includes a second silicon rod holder and a second transfer drive mechanism, the second transfer drive mechanism is used to drive the second silicon rod holder and the silicon rod edge it holds. moving in the first direction and transferring between the first processing location and the second processing location;
- the silicon rod cutting device is arranged at the first processing area of the silicon rod processing platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or on the second transfer channel.
- the silicon rod to be cut held by the second transfer device is cut;
- the silicon rod grinding device is arranged at the second processing area of the silicon rod processing platform, and is used for grinding the cut silicon rod clamped by the first transfer device on the first transfer channel or on the second transfer channel.
- the cut silicon rod held by the second transfer device is subjected to a grinding operation.
- the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, or the first transfer device is arranged through a first mounting frame Above the silicon rod processing platform and the second transfer device is arranged above the silicon rod processing platform through a second mounting frame.
- the first silicon rod holder includes: a first clamping arm mounting seat; at least one pair of first clamping arms, opposite to the first clamping arm mounting seat along a first direction , for clamping the two end faces of the silicon rod; wherein, any one of the at least one pair of first clamping arms is provided with a clamping part; the first clamping arm driving mechanism is used to drive at least one At least one of the pair of first clamp arms is moved along the first direction to adjust the clamping distance between the at least one pair of the first clamp arms.
- the first transfer driving mechanism includes: a first transfer guide rail, arranged along a first direction, for setting the first clamp arm mounting seat; a first transfer driving unit for The first clamp arm mounting seat and at least a pair of first clamp arms are driven to move along the first transfer guide rail.
- the first transfer driving unit includes: a moving rack, arranged along a first direction; a driving gear, which is disposed on the first clamp arm mounting seat and meshes with the moving rack a drive source for driving the drive gear to move the associated first clamp arm mount and at least a pair of the first clamp arms along the first transfer guide rail.
- the first transfer driving unit includes: a moving screw rod disposed along a first direction and associated with the first clamping arm mounting seat; a driving source for driving the moving screw The lever rotates to move the associated second clamp arm mount and its at least one pair of first clamp arms along the first transfer rail.
- the at least one pair of the first clamping arms is a rotating structure;
- the first silicon rod clamp further includes a first clamping arm rotating mechanism, and the first clamping arm rotating mechanism is located at At least one of the at least one pair of first clamping arms is used to drive the clamping part of the at least one first clamping arm to rotate.
- the second silicon rod holder includes: a second clamping arm mounting seat; at least a pair of second clamping arms, opposite to the second clamping arm mounting seat along a first direction , used for clamping the two end faces of the silicon rod; wherein, any second clamping arm in the at least a pair of second clamping arms is provided with a clamping part; the second clamping arm driving mechanism is used to drive at least one At least one of the pair of second clamp arms is moved along the first direction to adjust the clamping distance between the at least one pair of second clamp arms.
- the second transfer driving mechanism includes: a second transfer guide rail, arranged along a first direction, for setting the second clamp arm mounting seat; a second transfer driving unit, for The second clamp arm mounting base and at least a pair of second clamp arms are driven to move along the second transfer guide rail.
- the second transfer driving unit includes: a moving rack, disposed along a first direction; a driving gear, disposed on the second clamp arm mounting seat and engaged with the moving rack a drive source for driving the drive gear to move the associated second clamp arm mount and at least a pair of the second clamp arms along the second transfer guide rail.
- the second transfer driving unit includes: a moving screw rod disposed along a first direction and associated with the second clamping arm mounting seat; a driving source for driving the moving screw The lever rotates to move the associated second clamp arm mount and its at least one pair of second clamp arms along the second transfer rail.
- the at least one pair of second clamping arms is a rotating structure;
- the second silicon rod clamp further includes a second clamping arm rotating mechanism, and the second clamping arm rotating mechanism is located in At least one of the at least one pair of second clamping arms is used to drive the clamping part of the at least one second clamping arm to rotate.
- the silicon rod cutting device includes: a cutting frame; at least one wire cutting unit is provided on the cutting frame; the wire cutting unit includes: at least two cutting wheels, a transition wheel, and a cutting wire, which is wound around the at least two cutting wheels and the transition wheel to form at least one cutting wire saw; a cutting conversion mechanism for driving the cutting frame and the at least one wire cutting unit on the first Switch between the transfer channel and the second transfer channel.
- the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel a cutting wheel to form a cutting wire saw; wherein the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; the first transition wheel, adjacent to the first cutting wheel, is used for cutting The state of the wire makes the cutting lines of the first cutting wheel and the first transition wheel lie in the plane of the first cutting wire groove for winding the cutting wire in the first cutting wheel; the second transition wheel is adjacent to the second cutting wheel wheel, in the state of pulling the cutting line, the cutting line of the second cutting wheel and the second transition wheel is located in the plane of the second cutting wire groove for winding the cutting line in the second cutting wheel; at least one third transition wheel, set Between the first transition wheel and the second transition wheel, it is used for pulling the cutting line between the first transition wheel and the second transition wheel, so that a cutting accommodating space
- the first transition wheel, the second transition wheel, and the at least one third transition wheel are used to draw the cutting wire away from the cutting accommodation space.
- the cutting wire is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form an end-to-end connection Closed loop cutting line.
- the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, and the second transition wheel in sequence , a third transition wheel, another third transition wheel, a first transition wheel, and a first cutting wheel to form an end-to-end closed-loop cutting line.
- the silicon rod cutting device further includes a cutting wire driving device for driving the cutting wire to run to cut the silicon rod to be cut.
- the cutting wire driving device is an electric motor having a power take-off shaft, and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel.
- the silicon rod cutting device further comprises: at least one distance adjustment mechanism, which is arranged in the at least one wire cutting unit and is used to drive at least two cutting wheels in the wire cutting unit to be opposite to each other.
- the cutting frame moves in a direction perpendicular to the surface of the cutting wheel.
- the silicon rod cutting device includes a single-wire cutting unit
- the distance adjustment mechanism includes: a screw rod, which is disposed along the orthogonal direction of the cutting wheel surface and is threadedly connected to the single-wire cutting unit ; Drive source for driving the screw to rotate.
- the silicon rod cutting device includes a single-wire cutting unit
- the distance adjustment mechanism includes: a telescopic element, which is arranged along the orthogonal direction of the cutting wheel surface and is associated with the single-wire cutting unit;
- the driving source is used to drive the telescopic element to telescopically move along the orthogonal direction of the wheel surface of the cutting wheel.
- the silicon rod cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, at least one of the first wire cutting unit and the second wire cutting unit It is driven to move in the orthogonal direction of the wheel surface of the cutting wheel by the distance adjustment mechanism.
- the distance adjustment mechanism includes: a screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected to the first wire cutting unit or the second wire cutting unit; a driving source, Used to drive the screw to rotate.
- the distance adjustment mechanism includes: a telescopic element, which is arranged in the orthogonal direction of the cutting wheel surface and is associated with the first wire cutting unit or the second wire cutting unit; a driving source, which uses The telescopic element is driven to perform telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.
- the distance adjustment mechanism includes: a bidirectional screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected with the first wire cutting unit and the second wire cutting unit; a driving source is used to drive the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the wheel surface of the cutting wheel.
- the cutting conversion mechanism includes: a cutting conversion guide rail, arranged along a second direction, for setting the cutting frame; the second direction is perpendicular to the first direction; the cutting conversion The driving unit is used for driving the cutting frame and its at least one line cutting unit to move along the cutting conversion guide rail.
- the cutting conversion driving unit includes: a moving rack, arranged along the second direction; a driving gear, which is arranged on the cutting frame and meshes with the moving rack; for driving the drive gear to move the associated cutting frame and its at least one line cutting unit along the cutting conversion guide rail.
- the cutting conversion driving unit includes: a moving screw rod, which is arranged in the second direction and is associated with the cutting frame; a driving source for driving the moving screw rod to rotate so as to make the The associated cutting carriage and its at least one line of cutting units move along the cutting transition rails.
- the integrated silicon rod cutting and grinding machine further includes a side skin discharge device, and the edge skin discharge device includes a side skin support mechanism for abutting against the outside of the silicon rod and supporting Cut the formed hem.
- the side panel supporting mechanism includes: a supporting part; and a driving unit connected to the supporting part to control the supporting part to move away from or abut against the side panel.
- the bearing portion includes: at least two bearing blocks, which are arranged at intervals along the first direction and have bearing surfaces for contacting and bearing the edge skin.
- the supporting part includes: at least two supporting rods, arranged along the first direction, for contacting and supporting the edge skin; two connecting parts, respectively disposed on the cutting frame The opposite sides in the first direction correspond to the opposite ends of the at least two support rods, and are used for connecting the at least two support rods and the drive unit.
- the supporting portion includes at least two supporting wheel sets spaced along the first direction, wherein the supporting wheel set includes: at least two supporting wheels, The at least two supporting wheels are arranged at intervals for contacting and supporting the edge skin; the supporting base is used for disposing the at least two supporting wheels and connecting with the driving unit.
- the driving unit includes: an air cylinder or a hydraulic pump; a telescopic part, connected to the bearing part, and driven by the air cylinder or hydraulic pump to telescopically move to control the distance of the bearing part or against the edge skin.
- the driving unit includes: a driving motor; a screw assembly, connected to the bearing part, and driven to move by the driving motor to control the bearing part to move away from or against the side skin.
- the edge skin unloading device further includes a edge skin dislocation mechanism, which is arranged on the machine base or the silicon rod cutting device, and is used for pushing the edge skin along a first direction to make the edge skin The edge skin is separated from the edge skin supporting mechanism.
- the side skin dislocation mechanism includes: a push top; an air cylinder or a hydraulic pump for driving the push top to push a telescopic rod of the side skin along a first direction along a first direction set up.
- the edge skin unloading device further includes a edge skin conveying mechanism, which is used for receiving the edge skin formed by cutting and transferring the edge skin to the discharge area.
- the edge skin conveying mechanism includes: a conveying part for carrying the edge skin; a conveying driving source for driving the conveying part to move in a first direction to convey the edge skin Skin.
- the silicon rod grinding device includes: a grinding tool mounting seat; at least one pair of grinding tools, which are arranged oppositely on the grinding tool mounting seat; and a grinding tool advancing and retreating mechanism for driving the At least one abrasive tool in the at least one pair of abrasive tools moves along a second direction, wherein the second direction is perpendicular to the first direction; an abrasive tool conversion mechanism is used to drive the at least one pair of abrasive tools to move in the first direction Switch between a transfer channel and a second transfer channel.
- any one of the at least one pair of abrasive tools includes a coarse grinding wheel and a fine grinding wheel that are nested in each other.
- the rough grinding wheel is nested inside the fine grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism; or, The fine grinding wheel is nested inside the rough grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism.
- the abrasive tool conversion mechanism includes: an abrasive tool conversion guide rail, arranged along the second direction, for setting the abrasive tool mounting seat; an abrasive tool conversion drive unit for driving the abrasive tool
- the abrasive tool mount and its at least one pair of abrasive tools move along the abrasive tool transfer rail.
- the grinding tool conversion drive unit includes: a moving rack, arranged along the second direction; a driving gear, disposed on the grinding tool mounting seat and meshing with the moving rack; driving A source for driving the drive gear to move the associated abrasive tool mount and its at least one pair of abrasive tools along the abrasive tool transfer rail.
- the grinding tool conversion driving unit includes: a moving screw, which is arranged in the second direction and is associated with the grinding tool mounting seat; a driving source for driving the moving screw to rotate to move the associated abrasive tool mounting seat and at least one pair of abrasive tools along the abrasive tool conversion guide rail.
- the silicon rod grinding device further includes: at least one pair of chamfering grinding tools, which are arranged on the grinding tool mounting seat opposite to each other.
- any one of the first silicon rod holder and the second silicon rod holder further includes: a grinding and repairing device for grinding at least one of the corresponding silicon rod grinding devices to abrasives.
- the integrated silicon rod cutting and grinding machine further comprises: a silicon rod transferring device, which is arranged at the loading area of the silicon rod processing platform, and is used for transferring the silicon rod to be processed to the The first processing location of the silicon rod processing platform.
- the silicon rod transfer device includes: a silicon rod bearing structure for carrying the silicon rod to be processed; a centering adjustment mechanism for adjusting the position of the silicon rod to be processed to The axis line is corresponding to the predetermined center line; the feeding driving mechanism is used to drive the silicon rod carrying structure and the silicon rod to be processed to be carried along the second direction to move from the loading position to the first processing position.
- the centering adjustment mechanism includes a vertical lifting mechanism, which is used to drive the silicon rod supporting structure and the supported silicon rods to perform vertical lifting and lowering motions, so as to make the The axis line of the silicon rod to be processed is vertically aligned with the predetermined center line.
- the vertical lifting mechanism includes: a vertical lifting guide rail, which is provided on the bearing base; a sliding block, which is arranged on the bearing member; and a vertical lifting driving unit.
- the vertical lift mechanism includes: a vertical lift guide rod for setting the silicon rod supporting structure; a vertical lift driving unit for driving the silicon rod supporting structure along the The vertical lift guide rod moves up and down.
- the vertical lift driving unit comprises: a driving motor and a screw assembly vertically arranged and driven by the driving motor, or, a driving motor and a vertically arranged and driven screw assembly Motor driven rack and pinion drive assembly.
- the silicon rod transfer device further includes a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that it is located at the position of the silicon rod supporting structure. Centered area.
- the centering adjustment mechanism includes: a bracket, arranged on the machine base or the silicon rod bearing structure; an adjustment guide rail, arranged on the bracket along a first direction; at least two two ejectors, respectively disposed on opposite sides of the bracket; an adjustment drive unit for driving the at least two ejectors to move toward each other along the adjustment guide rails to push the silicon rod to be placed on the silicon rod
- the central area of the load-bearing structure includes: a bracket, arranged on the machine base or the silicon rod bearing structure; an adjustment guide rail, arranged on the bracket along a first direction; at least two two ejectors, respectively disposed on opposite sides of the bracket; an adjustment drive unit for driving the at least two ejectors to move toward each other along the adjustment guide rails to push the silicon rod to be placed on the silicon rod The central area of the load-bearing structure.
- the adjustment driving unit comprises: a driving motor and a screw assembly arranged in a first direction and driven by the driving motor, or a driving motor and a driving motor and a driving motor arranged in the first direction and driven by the The rack and pinion drive assembly driven by the drive motor.
- the silicon rod transfer device further includes a silicon rod clamping mechanism provided on the silicon rod supporting structure.
- the silicon rod clamping mechanism includes: a clamp mounting member, disposed on the silicon rod supporting structure along a first direction; at least two silicon rod clamping members, along the The distance setting of the fixture mounting pieces is described above.
- the silicon rod clamping member includes: a clamping arm mounting seat, which is arranged on the clamping arm mounting member; two clamping arms, which are movably arranged on the clamping arm mounting seat;
- the arm driving mechanism is used to drive the two clamping arms to open and close.
- the clamping arm driving mechanism includes: an opening and closing gear, which is provided on the clamping arm mounting seat; two racks, each of which is associated with a clamping arm and is The opening and closing gears are engaged; the driving source is associated with the opening and closing gears, and is used for driving the opening and closing gears to rotate.
- At least one silicon rod clamping member of the at least two silicon rod clamping members is provided with a spacing adjustment driving mechanism for driving it along the The clamp mounts are moved to adjust the spacing of the at least two silicon rod clamps.
- the distance adjustment driving mechanism is a screw adjustment mechanism, a chain conveying mechanism, a double-speed chain mechanism, or a transmission belt mechanism.
- the feeding drive mechanism includes: a feeding guide rod or a feeding guide rail, arranged along the second direction, for setting the silicon rod supporting structure; a feeding driving unit for The silicon rod carrying structure is driven to move along the feed guide rod or feed rail.
- the silicon rod transfer device further includes a crystal wire detection unit.
- the integrated silicon rod cutting and grinding machine further comprises: a silicon rod unloading device, which is arranged in the workpiece unloading area of the silicon rod processing platform, and is used for removing the ground silicon rods from the Unloading of the ingot processing platform.
- the silicon rod cutting and grinding integrated machine disclosed in the present application integrates a silicon rod cutting device and a grinding device, and the silicon rod cutting device and the grinding device are respectively arranged in the first processing area and the second processing area of the silicon rod processing platform, and are provided with At the same time, the first transfer device and the second transfer device running through the first processing area and the second processing area are respectively equipped with a silicon rod clamp and a driving mechanism for the first and second transfer devices.
- the silicon rod cutting device and the grinding device make the silicon rod cutting device located in the first processing area and the grinding device located in the second processing area in the working state at the same time, so as to complete the integration of the multi-process of silicon rod squaring and grinding operation, improve production efficiency and the quality of product processing operations.
- FIG. 1 is a schematic structural diagram of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application from a first viewing angle.
- FIG. 2 is a schematic structural diagram of the integrated silicon rod cutting and grinding machine according to an embodiment of the present application from a second viewing angle.
- FIG. 3 shows a top view of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application.
- FIG. 4 is a schematic structural diagram of the first silicon rod holder or the second silicon rod holder in the integrated silicon rod cutting and grinding machine of the present application.
- FIG. 5 is a schematic diagram of an embodiment of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine of the present application.
- FIG. 6 is an enlarged schematic view of B in FIG. 5 .
- FIG. 7 is a schematic diagram showing the structure of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application.
- FIG. 8 is a cross-sectional view of the grinding tool of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application.
- FIG. 9 is an enlarged schematic view of A in FIG. 1 .
- first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
- a first transfer device could be referred to as a second transfer device, and similarly, a second transfer device could be referred to as a first transfer device without departing from the scope of the various described embodiments.
- Both the first transfer device and the second transfer device are describing a transfer device, but unless the context clearly indicates otherwise, they are not the same transfer device. Similar situations also include the first transfer guide rail and the second transfer guide rail, the first processing area and the second processing area, the first transfer driving mechanism and the second transfer driving mechanism, the first silicon rod holder and the second silicon rod holder, and the like.
- A, B or C or “A, B and/or C” means “any of the following: A; B; C; A and B; A and C; B and C; A, B and C” . Exceptions to this definition arise only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.
- the existing silicon rods have a cylindrical structure, and the silicon rods are cut by the silicon rod cutting equipment, so that the cross-section of the silicon rods is rectangular-like (including square-like) after the cutting process, and the processed silicon rods are
- the rod is in the shape of a cuboid as a whole.
- the formation process of the single crystal silicon rod may include: firstly use a silicon rod cutting machine to cut the original long silicon rod to form a multi-section short silicon rod; after the cutting is completed, use the silicon rod to square The machine performs a square root operation on the truncated short silicon rod to form a single crystal silicon rod with a rectangular cross-section.
- the specific implementation method of using a silicon rod cutting machine to cut off the original long silicon rod to form a multi-segment short silicon rod can refer to patent publications such as CN105856445A, CN105946127A, and CN105196433A.
- the formation process of the single crystal silicon rod is not limited to the above-mentioned technology.
- the formation process of the single crystal silicon rod may also include: firstly, using a full silicon rod cutting machine to perform a squaring operation on the original long silicon rod to A long single crystal silicon rod with a rectangular-like cross section is formed; after the squaring is completed, a silicon rod cutting machine is used to cut the long single crystal silicon rod after the square cutting to form a short crystal silicon rod.
- grinding equipment can be used to grind and chamfer the rectangular-like silicon rod.
- the inventors of the present application have found that in the related processing technology for silicon rods, the processing devices such as squaring and grinding (such as surface grinding, chamfering, etc.) are dispersed and arranged independently of each other.
- the conversion of silicon rods requires transportation and preparation and preprocessing before processing, which has problems such as complicated procedures and low efficiency.
- the present application proposes an integrated machine for cutting and grinding silicon rods and a method for cutting and grinding silicon rods.
- a plurality of processing devices are assembled in one device, which can automatically realize the square cutting and grinding of silicon rods.
- the seamless connection between various processing operations saves labor costs, improves production efficiency, and improves the quality of silicon ingot processing operations.
- a three-dimensional space defined by a first direction, a second direction and a third direction is defined.
- the direction and the third direction are both straight and perpendicular to each other.
- the length extension direction of the silicon rod cutting and grinding machine that is, the length direction when the silicon rod is placed on it, is defined as the first direction (ie, the front-rear direction or the transfer direction), and the width extension direction of the silicon rod cutting and grinding machine is also called.
- the left-right direction is defined as the second direction (ie, the left-right direction or the feeding direction)
- the vertical direction that is, the vertical direction, the vertical direction, the vertical direction, or the lifting direction is defined as the third direction.
- the present application discloses an integrated silicon rod cutting and grinding machine.
- the silicon rod cutting and grinding integrated machine of the present application is used to perform squaring and grinding operations on silicon rods, that is, the cross section is circular (or approximately circular).
- silicon rods are cut to form quasi-rectangular (including quasi-square) silicon rods, and grinding operations are performed on silicon rods with quasi-rectangular (including quasi-square) cross-sections, wherein most of the silicon rods can be, for example, single crystals
- a single crystal silicon rod is used as an example for description.
- FIG. 1 shows a schematic structural diagram of the integrated silicon rod cutting and grinding machine of the present application from a first perspective in an embodiment
- FIG. 2 shows the integrated silicon rod cutting and grinding machine of the present application in A schematic view of the structure from a second viewing angle in an embodiment
- FIG. 3 shows a top view of the integrated silicon rod cutting and grinding machine of the present application in an embodiment.
- the integrated silicon rod cutting and grinding machine includes a machine base 1 , a first transfer device 2 , a second transfer device 3 , a silicon rod cutting device 4 , and a silicon rod grinding device 5 .
- the machine base has a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area and a second processing area.
- the silicon rod processing platform is arranged on the upper surface of the machine base.
- the machine base 1 is of a rectangular structure
- the processing platform is designed to be a rectangle conforming to the shape of the machine base 1
- the first processing area and the second processing area respectively correspond to the square root processing area.
- the grinding processing area as shown in the figure, the first processing area and the second processing area are arranged on the front and rear sides of the silicon rod processing platform, and can be processed independently on the first processing area and the second processing area. Loaded monocrystalline silicon rods.
- the first transfer device is arranged in the first transfer channel, and is used for transferring the silicon rods between the first processing area and the second processing area through the first transfer channel.
- the second transfer device is arranged in the second transfer channel, and is used for transferring the silicon rods between the first processing area and the second processing area through the second transfer channel.
- the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, and the mounting frame is arranged on the machine base to form a vertical frame structure, and the upper surface of the frame is higher than the
- the silicon rod processing platform carries the first transfer device and the second transfer device.
- a mounting frame is provided above the silicon rod processing platform, and the first transfer device 2 and the second transfer device 3 are arranged in parallel on the mounting frame. the left and right sides of the frame.
- the support structure of the installation frame is arranged on the upper surface of the machine base 1.
- the upper surface of the machine base 1 is rectangular, and the support structure of the installation frame is on the outer edge of the rectangle.
- the frame is approximately the same in shape and size as the base 1 .
- a first mounting frame and a second mounting frame are provided above the silicon rod processing platform, and the first mounting frame and the second mounting frame are provided on the silicon rod Opposite sides of the processing platform along the second direction, wherein the first transfer device is arranged above the silicon rod processing platform through a first installation frame, and the second transfer device is arranged through the second installation frame. above the silicon rod processing platform.
- the shape and size of the first installation frame and the second installation frame are the same or approximately the same, for example, the shape of the first installation frame and the second installation frame is a rectangle.
- the first transfer device provided in the first transfer channel includes a first silicon rod holder and a first transfer drive mechanism.
- the first silicon rod clamp is used to hold the silicon rod, and the silicon rod is horizontal after being clamped by the first silicon rod clamp, that is, the axis line of the silicon rod is consistent with the first direction way to be clamped.
- the first transfer driving mechanism is used for driving the first silicon rod holder and the silicon rod held by it to move along a first direction and transfer between the first processing area and the second processing area.
- the first rotation driving mechanism further includes a first transfer guide rail and a first transfer driving unit, wherein the first transfer guide rail is arranged along a first direction for setting the first silicon rod holder, the first transfer guide The driving unit is used for driving the first silicon rod holder and the silicon rod held by it to move along the first transfer guide rail.
- the first silicon rod holder includes a first clamping arm mounting seat, and at least a pair of first clamping arms is arranged on the first clamping arm mounting seat, and the at least one pair of first clamping arms face each other along a first direction It is arranged on the first clamping arm mounting seat and is used for clamping the two end faces of the silicon rod. At least one first clamping arm in the at least one pair of first clamping arms can be driven along the first clamping arm drive mechanism. The first direction moves to adjust the clamping distance between the at least one pair of the first clamping arms.
- FIG. 4 is a schematic structural diagram of the first silicon rod holder or the second silicon rod holder in the integrated silicon rod cutting and grinding machine of the present application.
- the first silicon rod holder 21 as a whole presents a first clamping arm mounting seat 211 disposed above, and the part outside the first clamping arm mounting seat 211 Including the first clamp arm 213 in a suspended state, the first clamp arm mounting seat 211 is mounted on the mounting frame, and the first clamp arm 213 is located under the hollow part of the mounting frame from the first clamp arm mounting seat 211
- the cantilever is extended to realize that the silicon rod (eg, the silicon rod to be cut 101 or the cut silicon rod) held by the first clamping arm 213 is on the processing surface of the silicon rod processing platform.
- the first clamp arm mounting seat is arranged on the first transfer guide rail.
- a guide groove structure matching the first transfer guide rail is provided at the bottom of the first clamp arm mounting seat.
- the first transfer guide rail is arranged along the first direction, and the length of the first transfer guide rail in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the The transfer of the silicon rod held by the first silicon rod holder between the two working areas.
- the first transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.
- the first clamp arm mounting seat is also provided with a first guide structure along the first direction, and the at least one pair of first clamp arms are arranged on the first clamp arm mounting seat through the first guide structure and can be generated in the first direction movement.
- the first guide structure may be, for example, a first clamp arm guide rail, a first clamp arm guide groove, or a first clamp arm guide rod.
- the at least one pair of first clamping arms are disposed opposite to each other along the first direction, and are used for clamping two end faces of the silicon rod.
- the silicon rod is a cylindrical structure with a certain length, and its length direction is placed along the first direction, and the end faces are the sections at both ends of the length direction.
- the silicon rod is a cuboid structure with a certain length (its cross section is rectangular or quasi-rectangular), and its length direction is placed along the first direction, and the end faces are the cross sections at both ends of the length direction. .
- the first clamping arm hangs down from the first clamping arm mounting seat, and a clamping portion is included under the first clamping arm for directly contacting and clamping the silicon rod.
- one end of the first clamping arm 213 is connected to the first clamping arm mounting seat 211
- the other end of the first clamping arm 213 is connected to a silicon rod for contacting the silicon rod (for example, the silicon rod 101 to be cut) or cut silicon rod) end face of the clamping part 215.
- the first clamp arm mounting seat 211 is movably arranged on the first transfer guide rail and moves along the first transfer guide rail driven by the first transfer drive unit, thereby driving the first clamp arm 213 along the first transfer guide rail.
- a transfer rail moves.
- the first silicon rod holder further includes a first clamping arm driving mechanism, and the first clamping arm driving mechanism can drive at least one first clamping arm of the at least one pair of first clamping arms along the first direction move to adjust the clamping distance between the pair of oppositely arranged first clamping arms, so that the clamping parts of the at least one pair of first clamping arms can approach each other or move closer to each other under the action of the first clamping arm driving mechanism away to perform a gripping or releasing action on the silicon rod.
- the clamping parts of the two first clamping arms arranged opposite to each other along the first direction are driven by the driving mechanism of the first clamping arm to clamp the silicon rod toward each other, and keep the clamping state to keep the silicon rod between different working areas. Transfer and carry out processing operations, after the processing operation, the silicon rods are transported to the bearing position and then moved away from each other under the driving of the first clamping arm driving mechanism to release the processed silicon rods.
- the first clamp arm driving mechanism includes a driving motor, a driving gear and a pair of racks.
- the drive motor drives the gear to rotate, and the pair of racks meshes with opposite ends of the drive gear.
- the pair of racks are driven by the opposite linear speeds at both ends of the gear. Appears close to each other or away from each other.
- one end of each of the pair of racks is engaged with the driving gear, and the other end is connected to a first clamp arm, so that the at least one pair of the first clamp arms is in the first clamp arm. In one direction, the guide rails of the first clamp arm mounting seat are away from each other or approach each other.
- the first clamping arm driving mechanism includes a screw rod and a driving source, wherein the first screw rod is arranged along a first direction and is connected to any one of the pair of first clamping arms.
- a first clamp arm is associated, and the drive source is connected to the screw rod for driving the screw rod to rotate so that the associated first clamp arm moves in a first direction.
- the screw rod of the first clamping arm driving mechanism has a distal end and a proximal end.
- the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, so the The distal end of the screw rod is threadedly connected to any one of the first clamping arms of the pair of first clamping arms, and the screw rod can rotate based on the drive source transmission by means of the connection between the two ends of the screw rod
- the rotation of the lead screw is converted into an axial displacement by means of a threaded connection, and the axial displacement direction is the setting direction of the lead screw, that is, the first direction; the distal end of the lead screw can be realized by driving the lead screw to rotate by the driving source.
- the connected first clamp arm moves in the first direction, and the rotation direction of the lead screw is driven to change, so that the associated first clamp arm can move forward or backward in the first direction.
- the first clamping arm driving mechanism includes: a bidirectional screw rod, which is arranged in a first direction and is threadedly connected to the at least one pair of the first clamping arms at both ends; a driving source, which uses The at least one pair of the first clamping arms is driven to rotate toward or away from each other along the first direction.
- the bidirectional screw rod of the first clamping arm driving mechanism is threadedly connected with the pair of first clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod with opposite thread directions at both ends.
- the drive source can be arranged at either end of the two-way screw or connected to the two-way screw to drive the two-way screw to rotate along the screw shaft.
- the motion of the two ends of the bidirectional screw rod is converted into linear motion in opposite directions along the axial direction of the screw rod and the first direction when it is rotated under the driving of the driving source.
- the pair of first clamping arms can move toward or away from each other in a first direction.
- the first clamp arm mounting seat may be a plurality of mounting seats connected by the first clamp arm driving mechanism, and any one of the pair of first clamp arms corresponds to a mounting seat,
- the driving source is arranged between a pair of first clamping arms, where any of the first clamping arms can move along the guide structure; when the first silicon rod holder needs to move along the guide structure as a whole, for example, it can be
- the driving source of the first clamping arm driving mechanism controls the pair of first clamping arms to be relatively stationary. At this time, the connection of the first clamping arm driving mechanism can make different mounting seats relatively stationary.
- the power source of the rod clamp can drive any mounting seat to move along the guide structure, so as to realize the overall movement of the first silicon rod clamp.
- the first clamping arm driving mechanism includes a first rack, a second rack and a driving gear; the first rack and the second rack are respectively linked to a first clamping arm, so
- the drive gear is connected to the power output shaft (not shown) of the drive motor and meshes with the first rack and the second rack, and the drive gear is used to drive the first rack during forward rotation.
- the first clamping arms are moved toward each other to perform a clamping action, and the pair of first clamping arms are driven to move backwards to perform a releasing action during reverse rotation.
- the first clamping arm has a rotary structure.
- the first silicon rod holder further includes a first clamping arm rotating mechanism for driving the first clamping arm to rotate.
- any one clamping part of the at least one pair of first clamping arms or two clamping parts of a pair of first clamping arms is provided with a rotatable structure, and a rotatable structure is provided in the first clamping part.
- the clamping part of the first clamping arm rotates with the length direction of the silicon rod, that is, the first direction as the axis line, and the clamped silicon rod is correspondingly rotated with the first direction as the axis line. rotation.
- the rotation mechanism of the first clamp arm may be, for example, a rotating motor, and the clamping portions of the two first clamp arms of the pair of first clamp arms are both provided with rotatable structures, and the two first clamp arms are provided with rotatable structures.
- the clamping part of a clamping arm or the clamping part of one of the first clamping arms is connected to the output shaft of the rotating motor.
- the clamping parts of the two first clamping arms are respectively connected to a rotating motor, and the two rotating motors are respectively connected
- the clamping part of the corresponding first clamping arm is driven to rotate, or, the clamping part of one of the first clamping arms is connected to a rotating motor, and the clamping part of the corresponding first clamping arm is driven by the rotating motor to rotate, And using friction force, through the conduction of the clamped silicon rod, the clamping part of the other first clamping arm is also driven to rotate according to the trend.
- the clamping portions of the at least one pair of the first clamping arms have a contact surface for clamping the silicon rod.
- the contact surfaces of the clamping parts can be set as the contact surfaces in the direction of the re-perpendicular line or a plane including the direction of the re-perpendicular line.
- the contact surface is set on a rotatable platform, and the section of the platform can be set as a custom regular geometric figure or irregular geometric figure.
- the rotatable platform can be provided as a whole hinged by a hinge device with a locking function, and can rotate along the axis line in the first direction.
- the axis line of the rotating shaft is connected to the first clamping arm rotating mechanism.
- the clamping portion of the first clamping arm can be set as a rotatable circular truncated cone, the circular plane of the circular truncated cone is in contact with the end face of the silicon rod, and remains in contact with the end face of the silicon rod after it is in close contact with the end face of the silicon rod.
- the end face of the silicon rod is relatively stationary.
- the clamping portion further includes a locking structure, and the clamping portion is in a locked state when a corresponding processing operation is performed on the silicon rod (the processing operation may be, for example, cutting, grinding, chamfering, etc.).
- the clamping portion is driven by the rotation mechanism of the first clamping arm to rotate along the center of the circular frustum.
- the clamping portion of the first clamping arm includes a rotatable truncated cone and a series of protruding contacts disposed on the truncated cone, each of the contacts having a contact plane.
- the circular platform is driven by the first clamping arm rotating mechanism to rotate.
- the protruding length of the contact point can be adjusted in the first direction, so that when the silicon rod is clamped, the protruding length of the contact can be adjusted.
- the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface and the end face of the silicon rod are in a close state.
- the protruding length is the length in the first direction from the circular plane of the circular frustum to the contact plane of the contact.
- the clamping portion of the first silicon rod holder is provided with a pressure sensor, so as to adjust the protruding length of the contact point based on the detected pressure state.
- a pair of first clamping arms of the first silicon rod clamp are driven by the first clamping arm driving mechanism to approach each other along the first direction, and the clamping portion reaches the edge of the clamping portion.
- the contact surface is in contact with the end surface of the silicon rod to be clamped.
- the clamping degree can be changed by adjusting the protruding length of the contact (generally toward the approaching direction of the end face of the silicon rod); alternatively, each of the pair of first clamping arms of the first silicon rod clamp
- the clamping parts are all set as a contact surface.
- the first clamping arm driving mechanism drives the end faces of the pair of first clamping arms toward the two ends of the silicon rod to approach each other to achieve.
- the clamping degree of the silicon rod is detected by the pressure sensor.
- the first clamping arm driving mechanism controls and stops the relative movement of the pair of first clamping arms. .
- the first clamp arm rotation mechanism can be arranged on one of the pair of first clamp arms (the other first clamp arm only has a rotation function) to drive the clamp of the pair of first clamp arms.
- the holding part rotates with the clamped silicon rod; or the first clamp arm rotation mechanism is arranged on each first clamp arm of a pair of first clamp arms, and controls the movement of the pair of first clamp arms in coordination with the movement.
- the two clamping parts rotate in the same angle and direction.
- the first clamp arm rotation mechanism may be configured as a drive motor.
- the clamping part When the silicon rod is cut by the silicon rod cutting device, the clamping part can be driven to rotate by the first clamping arm rotation mechanism.
- the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, so that one side or two opposite sides of the silicon rod can be cut by the silicon rod cutting device. Cut on the side.
- the first clamping arm rotating mechanism drives the clamping part to rotate to achieve this.
- the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, which can be achieved.
- a certain angle such as 90°
- chamfering different edges which can be realized by controlling the rotation of the clamping part to a certain angle, such as 45°, 135°, etc.
- the first clamping arm rotation mechanism can control the rotation angle of the holding part and the silicon rod held by it to rotate at different angles.
- Secondary chamfering can be achieved, for example, after grinding one side of the silicon rod, the opposite edge of an edge adjacent to the side can be rotated by a certain angle such as 40°, 45°, 50° Perform multiple chamfering to obtain a silicon rod with a smoother transition at the junction of different sides.
- the angles are all rotation angles from the initial position of grinding.
- patent publications such as CN108942570A.
- the first silicon rod holder is a lift-type silicon rod holder.
- the first silicon rod holder includes a lifting guide rail and a driving device in the lifting direction, and the first clamping arm of the first silicon rod holder and the first clamping arm mounting seat carry a first clamping arm.
- the clamp arm guide can move along the lift guide in the third direction (ie, the direction of the heavy vertical line), which can be used to control the relative position of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the direction of the heavy vertical line , to select the cut surface of the silicon rod and the cutting area of the silicon rod cutting device for cutting, or the ground surface of the silicon rod and the grinding area of the grinding tool for grinding.
- the lifting guide rail is arranged on the upright surface of the first clamping arm mounting seat, and the first clamping arm is correspondingly provided with a guide groove and a driving guide matched with the lifting guide rail
- a driving mechanism for the lifting movement of the first clamping arm includes a traveling screw and a traveling motor, and the traveling screw is arranged along the lifting guide rail and is connected to the traveling motor, and is driven by the traveling motor.
- the first clamp arm moves in a third direction.
- each first clamping arm cantilever of the pair of first clamping arms is configured as a telescopic device, and is simultaneously moved up and down under the driving of the telescopic drive mechanism.
- the first transfer drive mechanism includes: a first transfer guide rail and a first transfer drive unit, wherein the first transfer guide rail is arranged along a first direction for setting the first transfer guide A clamp arm mounting seat, the first transfer driving unit is used to drive the first clamp arm mounting seat and at least a pair of first clamp arms to move along the first transfer guide rail.
- the first transfer driving unit includes a first moving rack, a first driving gear and a first driving source.
- the first moving rack is arranged along a first direction and is parallel to the first transfer guide rail.
- the first moving rack is fixed on the upper surface, side surface or lower surface of the mounting frame, and is set to approximately the same first direction dimension as the first transfer guide rail, which is the same as the first transfer guide rail.
- the guide rails are arranged in parallel and adjacent.
- the first driving gear is arranged on the first silicon rod holder and meshes with the first moving rack, so as to drive the first silicon rod holder to move along the first transfer guide rail.
- the first drive source is used to drive the first drive gear.
- the first drive gear is disposed on the first clamping arm mounting seat of the first silicon rod holder, the first drive gear is driven to rotate by a first drive source, and the first drive gear is rotated by a first drive source.
- the teeth of a driving gear mesh with the first moving rack and travel in accordance with the first moving rack, so that the first silicon rod clamp connected to the first driving gear moves correspondingly on the first transfer rail. .
- the first transfer driving unit may be disposed on the first silicon rod holder, and includes a first moving screw and a first driving source, wherein the first moving screw is along the The first direction is arranged and associated with the first clamp arm mounting seat, and the first driving source is used to drive the first moving screw to rotate so as to make the associated first clamp arm mounting seat and at least a pair of first A clamp arm moves along the first transfer rail.
- the first driving source may be set as a driving motor, and the power output shaft of the driving motor is axially connected to the first driving gear to control the motion state of the first driving gear, and then the The first driving source controls the movement of the first silicon rod holder and the silicon rod held by it in a first direction.
- the second transfer device provided in the second transfer channel includes a second silicon rod holder and a second transfer drive mechanism.
- the second silicon rod clamp is used to hold the silicon rod, and the silicon rod is horizontal after being clamped by the second silicon rod clamp, that is, the axis line of the silicon rod is consistent with the first direction way to be clamped.
- the second transfer driving mechanism is used for driving the second silicon rod holder and the silicon rod held by it to move along the first direction and to transfer between the second processing area and the second processing area.
- the second rotational drive mechanism further includes a second transfer guide rail and a second transfer drive unit, wherein the second transfer guide rail is arranged along the first direction for setting the second silicon rod holder, the second transfer guide The driving unit is used for driving the second silicon rod holder and the silicon rod held by it to move along the second transfer guide rail.
- the second silicon rod holder includes a second clamping arm mounting seat, and at least a pair of second clamping arms is arranged on the second clamping arm mounting seat, and the at least one pair of second clamping arms face each other along the first direction It is arranged on the second clamping arm mounting seat and is used to clamp the two end faces of the silicon rod. At least one second clamping arm in the at least one pair of second clamping arms can be driven along the second clamping arm by the second clamping arm driving mechanism. The first direction moves to adjust the clamping distance between the at least one pair of second clamping arms.
- the second silicon rod holder 31 is shown as a whole with the second clamping arm mounting seat 311 disposed above, and the part outside the second clamping arm mounting seat 311 Including the second clamp arm 313 in a suspended state, the second clamp arm mounting seat 311 is mounted on the mounting frame, and the second clamp arm 313 is located under the hollow part of the mounting frame from the second clamp arm mounting seat 311
- the cantilever is extended to realize that the silicon rod (for example, the silicon rod to be cut 101 or the cut silicon rod) held by the second clamping arm 313 is on the processing surface of the silicon rod processing platform.
- the second clamp arm mounting seat is arranged on the second transfer guide rail.
- the bottom of the second clamp arm mounting seat is provided with a guide groove structure matching the second transfer guide rail.
- the second transfer guide rail is arranged along the first direction, and the length of the second transfer guide rail in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the The transfer of the silicon rod held by the second silicon rod holder between the two working areas.
- the second transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.
- the second clamp arm mounting seat is also provided with a second guide structure along the first direction, and the at least one pair of second clamp arms is disposed on the second clamp arm mounting seat through the second guide structure and can be generated in the first direction movement.
- the second guide structure may be, for example, a second clamp arm guide rail, a second clamp arm guide groove, or a second clamp arm guide rod.
- the at least one pair of second clamping arms are disposed opposite to each other along the first direction, and are used for clamping two end faces of the silicon rod.
- the silicon rod is a cylindrical structure with a certain length, and its length direction is placed along the first direction, and the end faces are the sections at both ends of the length direction.
- the silicon rod is a cuboid structure with a certain length (its cross section is rectangular or quasi-rectangular), and its length direction is placed along the first direction, and the end faces are the cross sections at both ends of the length direction. .
- the second clamping arm hangs down from the second clamping arm mounting seat, and a clamping portion is included under the second clamping arm for directly contacting and clamping the silicon rod.
- one end of the second clamping arm 313 is connected to the second clamping arm mounting seat 311 , and the other end of the second clamping arm 313 is connected to a silicon rod for contacting the silicon rod (for example, the silicon rod 101 to be cut) or cut silicon rod) end face of the clamping part 315.
- the second clamp arm mounting seat 311 is movably arranged on the second transfer guide rail and moves along the second transfer guide rail under the driving of the second transfer drive unit, thereby driving the second clamp arm 313 along the second transfer guide rail. Two transfer rails move.
- the second silicon rod holder further includes a second clamping arm driving mechanism, and the second clamping arm driving mechanism can drive at least one second clamping arm of the at least one pair of second clamping arms along the first direction move to adjust the clamping distance between the pair of oppositely arranged second clamping arms, so that the clamping parts of the at least one pair of second clamping arms can approach each other under the action of the second clamping arm driving mechanism or away to perform a gripping or releasing action on the silicon rod.
- the clamping portions of the two second clamping arms arranged opposite to each other along the first direction are driven by the driving mechanism of the second clamping arms to clamp the silicon rod toward each other, and keep the clamping state to keep the silicon rod between different working areas. Transfer and carry out processing operations, after the processing operation is completed, the silicon rods are transported to the bearing position and then moved away from each other under the driving of the second clamping arm driving mechanism to release the processed silicon rods.
- the second clamp arm driving mechanism includes a driving motor, a driving gear and a pair of racks.
- the drive motor drives the gear to rotate, and the pair of racks meshes with opposite ends of the drive gear.
- the pair of racks are driven by the opposite linear speeds at both ends of the gear. Appears close to each other or away from each other.
- one end of each rack in the pair of racks is engaged with the driving gear, and the other end is connected with a second clamping arm, so that the at least one pair of the second clamping arms is in the first In one direction, the guide rails of the second clamp arm mounting seat are away from each other or approach each other.
- the second clamp arm driving mechanism includes a screw rod and a drive source, wherein the first screw rod is disposed along a first direction and is connected to any one of the pair of second clamp arms A second clamp arm is associated, and the drive source is connected to the screw rod for driving the screw rod to rotate so that the associated second clamp arm moves in a first direction.
- the screw rod of the second clamping arm driving mechanism has a distal end and a proximal end.
- the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, so the The distal end of the screw rod is threadedly connected to any one of the pair of second clamping arms, and the screw rod can be rotated based on the drive source transmission by means of the connection between the two ends of the screw rod
- the rotation of the lead screw is converted into an axial displacement by means of a threaded connection, and the axial displacement direction is the setting direction of the lead screw, that is, the first direction; the distal end of the lead screw can be realized by driving the lead screw to rotate by the driving source.
- the second clamp arm driving mechanism includes: a bidirectional screw rod, disposed along the first direction and threadedly connected to the at least one pair of second clamp arms at both ends; a drive source, using to drive the screw to rotate so that the at least one pair of second clamping arms move toward or away from each other along the first direction.
- the bidirectional screw rod of the second clamping arm driving mechanism is threadedly connected to the pair of second clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod with opposite thread directions at both ends.
- the drive source can be arranged at either end of the two-way screw or connected to the two-way screw to drive the two-way screw to rotate along the screw shaft.
- the motion of the two ends of the bidirectional screw rod is converted into linear motion in opposite directions along the axial direction of the screw rod and the first direction when it is rotated under the driving of the driving source.
- the pair of second clamping arms can move toward or away from each other in the first direction.
- the second clamp arm mounting seat may be a plurality of mounting seats connected by the second clamp arm driving mechanism, and any one of the pair of second clamp arms corresponds to a mounting seat,
- the driving source is arranged between a pair of second clamping arms, where any second clamping arm can move along the guide structure; when the second silicon rod holder needs to move along the guide structure as a whole, for example, it can be
- the driving source of the second clamping arm driving mechanism controls the pair of second clamping arms to be relatively stationary. At this time, the connection of the second clamping arm driving mechanism can make different mounting seats relatively stationary, and the second clamping arm is relatively stationary.
- the power source of the rod clamp can drive any mounting seat to move along the guide structure, so as to realize the overall movement of the second silicon rod clamp.
- the second clamping arm driving mechanism includes a first rack, a second rack and a driving gear; the first rack and the second rack are respectively linked to a second clamping arm, so
- the drive gear is connected to the power output shaft (not shown) of the drive motor and meshes with the first rack and the second rack, and the drive gear is used to drive the first rack during forward rotation.
- the second clamping arms are moved toward each other to perform the clamping action, and the pair of second clamping arms are driven to move back to perform the releasing action during the reverse rotation.
- the second clamping arm has a rotary structure.
- the second silicon rod holder further includes a second clamping arm rotating mechanism for driving the second clamping arm to rotate.
- any one clamping part of the at least one pair of second clamping arms or two clamping parts of a pair of second clamping arms is provided with a rotatable structure, and the second clamping part is rotatable.
- the clamping arm rotation mechanism the clamping part of the second clamping arm rotates with the length direction of the silicon rod, that is, the first direction as the axis line, and the clamped silicon rod is correspondingly rotated with the first direction as the axis line. rotation.
- the rotation mechanism of the second clamping arm may be, for example, a rotating motor, the clamping parts of the two second clamping arms in the pair of second clamping arms are both provided with rotatable structures, and the two second clamping arms are provided with rotatable structures.
- the clamping parts of the two clamping arms or the clamping part of one of the second clamping arms are connected to the output shaft of the rotating motor.
- the clamping parts of the two second clamping arms are respectively connected to a rotating motor, and the two rotating motors are respectively connected
- the clamping part of the corresponding second clamping arm is driven to rotate, or, the clamping part of one of the second clamping arms is connected to a rotating motor, and the clamping part of the corresponding second clamping arm is driven by the rotating motor to rotate, And using friction force, through the conduction of the clamped silicon rod, the clamping part of the other second clamping arm is also driven to rotate according to the trend.
- the clamping portions of the at least one pair of second clamping arms have contact surfaces for clamping the silicon rod.
- the contact surfaces of the clamping parts can be set as the contact surfaces in the direction of the re-perpendicular line or a plane including the direction of the re-perpendicular line.
- Contact surfaces. The contact surface is set on a rotatable platform, and the section of the platform can be set as a custom regular geometric figure or irregular geometric figure.
- the rotatable platform can be provided as a whole hinged by a hinge device with a locking function, and can rotate along the axis line in the first direction.
- the axis line of the rotating shaft is connected to the second clamping arm rotating mechanism.
- the clamping portion of the second clamping arm can be set as a rotatable circular truncated cone, the circular plane of the circular truncated cone is in contact with the end face of the silicon rod, and remains in contact with the end face of the silicon rod after being abutted against the end face of the silicon rod.
- the end face of the silicon rod is relatively stationary.
- the clamping portion further includes a locking structure, and the clamping portion is in a locked state when a corresponding processing operation is performed on the silicon rod (the processing operation may be, for example, cutting, grinding, chamfering, etc.).
- the clamping portion is driven by the second clamping arm rotating mechanism to rotate along the center of the circular frustum.
- the clamping portion of the second clamping arm includes a rotatable circular cone and a series of protruding contacts disposed on the circular cone, each of the contacts having a contact plane.
- the circular platform is rotated under the driving of the second clamping arm rotating mechanism.
- the protruding length of the contact point can be adjusted in the first direction, so that when the silicon rod is clamped, the protruding length of the contact can be adjusted.
- the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface and the end face of the silicon rod are in a close state.
- the protruding length is the length in the first direction from the circular plane of the circular frustum to the contact plane of the contact.
- the clamping portion of the second silicon rod holder is provided with a pressure sensor, so as to adjust the protruding length of the contact point based on the detected pressure state.
- a pair of second clamping arms of the second silicon rod clamp approach each other along the first direction under the driving of the second clamping arm driving mechanism, and the clamping portion reaches the edge of the clamping portion.
- the contact surface is in contact with the end surface of the silicon rod to be clamped.
- the clamping part When the clamping part is provided with a plurality of contacts and detects that the pressure value of some contacts in contact with the end surface of the contacted silicon rod is less than a set value or When setting the area, the degree of clamping can be changed by adjusting the protruding length of the contact (generally toward the approaching direction of the end face of the silicon rod); alternatively, each of the pair of second clamping arms of the second silicon rod clamp
- the clamping parts are all set as a contact surface, and in the process of clamping the silicon rod, the end faces of the pair of second clamping arms toward the two ends of the silicon rod are driven by the second clamping arm driving mechanism to approach each other to achieve, in the process of clamping the silicon rod.
- the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the second clamping arm driving mechanism controls and stops the relative movement of the pair of second clamping arms. .
- the second clamping arm rotation mechanism can be arranged on one second clamping arm of a pair of second clamping arms (the other second clamping arm only has a rotation function) to drive the clamping of the pair of second clamping arms.
- the holding part rotates with the clamped silicon rod; or the second clamp arm rotation mechanism is arranged on each second clamp arm of a pair of second clamp arms, and controls the movement of the pair of second clamp arms in coordination with the movement.
- the two clamping parts rotate in the same angle and direction.
- the second clamp arm rotation mechanism may be configured as a drive motor.
- the clamping part When the silicon rod is cut by the silicon rod cutting device, the clamping part can be driven to rotate by the second clamping arm rotation mechanism.
- the second clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, so that one side or two opposite sides of the silicon rod can be cut by the silicon rod cutting device. Cut on the side.
- the clamping part is driven to rotate by the second clamping arm rotating mechanism.
- the second clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, which can be achieved.
- chamfering different edges which can be realized by controlling the rotation of the clamping part to a certain angle, such as 45°, 135°, etc.
- the second clamping arm rotation mechanism can control the rotation angle of the holding part and the silicon rod held by it to rotate at different angles.
- Secondary chamfering can be achieved, for example, after grinding one side of the silicon rod, the opposite edge of an edge adjacent to the side can be rotated by a certain angle such as 40°, 45°, 50° Perform multiple chamfering to obtain a silicon rod with a smoother transition at the junction of different sides.
- the angles are all rotation angles from the initial position of grinding.
- patent publications such as CN108942570A.
- the second silicon rod holder is a lift-type silicon rod holder.
- the second silicon rod clamp includes a lifting guide rail and a driving device in the lifting direction, and the second clamp arm of the second silicon rod clamp and the second clamp arm mounting seat carry a second clamp arm.
- the clamping arm guide rail can move in the third direction along the lifting guide rail, which can be used to control the relative position of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the direction of the heavy vertical line, so as to select the cutting of the silicon rod.
- the face and silicon rod cutting device is used to cut the cutting area or select the ground surface of the silicon rod and the grinding area of the grinding tool for grinding.
- the lifting guide rail is arranged on the upright surface of the second clamping arm mounting seat, and the second clamping arm is correspondingly provided with a guide groove and a driving guide matched with the lifting guide rail
- a driving mechanism for the lifting movement of the second clamping arm includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and is connected to the traveling motor, and is driven by the traveling motor.
- the second clamp arm moves in a third direction.
- each second clamping arm cantilever of the pair of second clamping arms is configured as a telescopic device, and is simultaneously moved up and down under the driving of the telescopic drive mechanism.
- the second transfer drive mechanism includes a second transfer guide rail and a second transfer drive unit, wherein the second transfer guide rail is arranged along a first direction for setting the second transfer guide rail.
- a clamp arm mounting seat, the second transfer driving unit is used to drive the second clamp arm mounting seat and at least a pair of second clamp arms to move along the second transfer guide rail.
- the second transfer driving unit includes a second moving rack, a second driving gear and a second driving source.
- the second moving rack is arranged along the first direction and is parallel to the second transfer guide rail.
- the second moving rack is fixed on the upper surface, the side surface or the lower surface of the installation frame, and is set to approximately the same first direction dimension as the second transfer guide rail, which is the same as the second transfer guide rail.
- the guide rails are arranged in parallel and adjacent.
- the second driving gear is arranged on the second silicon rod holder and meshes with the second moving rack, so as to drive the second silicon rod holder to move along the second transfer guide rail.
- the second drive source is used to drive the second drive gear.
- the second driving gear is disposed on the second clamping arm mounting seat of the second silicon rod holder, the second driving gear is driven to rotate by a second driving source, and the first The teeth of the two driving gears mesh with the second moving rack, and travel in accordance with the second moving rack, so that the second silicon rod clamp connected to the second driving gear moves accordingly on the second transfer rail. .
- the second transfer driving unit may be disposed on the second silicon rod holder, and includes a second moving screw and a second driving source, wherein the second moving screw is along the The first direction is set and associated with the second clamp arm mounting seat, and the second driving source is used to drive the second moving screw to rotate so as to make the associated second clamp arm mounting seat and its at least a pair of first The two clamp arms move along the second transfer guide rail.
- the second driving source may be set as a driving motor, and the power output shaft of the driving motor is axially connected with the second driving gear to control the motion state of the second driving gear, and then the The second driving source controls the movement of the second silicon rod holder and the silicon rod clamped in the first direction.
- the second transfer guide rail in the second transfer device and the first transfer guide rail in the first transfer device are both arranged in parallel along the first direction, and the first silicon rod clamp of the first transfer device and The second silicon rod holders of the second transfer device move on mutually parallel paths defined by the first transfer guide rail and the second transfer guide rail, respectively.
- the first silicon rod holder and the silicon rod held by it are transferred from different processing positions
- the second silicon rod holder and the silicon rod held by it can also be transferred between different processing positions, and the said The movements of the first silicon rod holder and the second silicon rod holder are independent of each other, and the first transfer guide rail and the second transfer guide rail, which limit the movement range thereof, are respectively arranged in different spatial positions without interfering with each other.
- the top view of the stand and the mounting frame of the integrated silicon rod cutting and grinding machine are both shown as regular rectangles, and the first transfer guide rail and the second transfer guide rail are both along the The arrangement in the first direction is parallel and symmetrical, and the symmetry line is the center line of the machine base in the first direction.
- the first transfer device and the second transfer device are used to control the motion of the silicon rod.
- the first transfer device is used to clamp the silicon rod and drive the silicon rod to move in the first direction.
- the second transfer device clamps the silicon rod and drives the silicon rod to move in the first direction, so that any silicon rod can move along the first direction relative to the silicon rod cutting device located in the first processing area or the grinding device located in the second processing area.
- the silicon rod cutting device is provided at the first processing area of the silicon rod processing platform, and is used for the first transfer channel to be clamped by the first transfer device.
- the silicon rod held by the second transfer channel or the silicon rod held by the second transfer device performs the cutting operation.
- the silicon rod cutting device includes a plurality of cutting wheels and a cutting wire saw formed around the plurality of cutting wheels, and the silicon rod is driven to move in a first direction by the first silicon rod clamp or the second silicon rod clamp Therefore, the silicon rod cutting device can be set in a fixed state when performing the cutting operation, so as to realize the relative feeding between the cutting wire saw and the silicon rod.
- Silicon rod feeding here, the structure of the silicon rod cutting device of the present application can be simplified, the cutting wheel can be fixed on the main body of the silicon rod cutting device, such as a cutting frame, and the cutting wheel can be omitted to be along the axis of the silicon rod.
- the moving guide structure and the driving device can reduce the structure of the silicon rod cutting device and the equipment space occupied.
- the silicon rod cutting device is arranged at the first processing area of the silicon rod processing platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or on the second transfer channel. The cutting operation is performed on the silicon rod to be cut held by the second transfer device.
- the silicon rod cutting device includes: a cutting frame, at least one wire cutting unit, and a cutting conversion mechanism; wherein, the at least one wire cutting unit is provided on the cutting frame, and the cutting conversion mechanism uses The cutting frame and at least one wire cutting unit thereon are switched between the first transfer channel and the second transfer channel.
- the at least one wire cutting unit is arranged on the cutting frame, and the wire cutting unit includes: a plurality of cutting wheels, a transition wheel, and a cutting wire, and the cutting wire is wound around the plurality of cutting wheels and the transition wheel to form at least one A cutting wire saw.
- the cutting frame is used to set the wire cutting unit.
- the specific structure of the cutting frame can be set in different forms based on the arrangement requirements of the cutting wheel and the transition wheel, such as a column, a beam, and a plate frame.
- a plurality of cutting wheels and transition wheels in the wire cutting unit are connected to the cutting frame, or, the plurality of cutting wheels and transition wheels are arranged through a bracket, a connecting plate, or a mounting frame.
- the carrier for arranging a plurality of cutting wheels and transition wheels can be in different forms, which is not limited in this application.
- FIG. 5 is a schematic diagram of an embodiment of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine of the present application.
- the silicon rod cutting device 4 includes: a cutting frame 41 , at least a wire cutting unit 43 , and a cutting conversion mechanism, wherein the wire cutting unit 43 uses a wire
- the cutting support 430 is provided on the cutting frame 41 .
- the wire cutting support 430 serves as a carrier for associating a plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the specific form of the wire cutting support 430 can be a beam body, a plate frame, bracket etc.
- the wire cutting support is arranged on the cutting frame through a guide structure such as a guide rail or a guide post, wherein the guide rail or guide post is arranged along the vertical direction of the wheel surface of the cutting wheel in the wire cutting unit, so as to
- the set wire cutting unit has the freedom to move along the vertical direction of the cutting wheel surface; under this setting, the wire cutting support can move along the orthogonal direction of the cutting wheel surface under the action of the driving source .
- the cutting wire saw in the wire cutting unit moves along the vertical direction of the cutting wheel surface, and the cutting wire saw is relatively
- the distance or closeness of the axis of the silicon rod can adjust the cutting amount or cutting position of the silicon rod.
- the cutting wheel is provided with at least one cutting wire groove for winding the cutting wire, and the cutting wire groove can define the position of the cutting wire to control the cutting precision.
- Any of the cutting wire saws are formed by winding a cutting wire between two cutting wheels, and the positions of the two cutting wheels and the positional relationship between the cutting wheels can be used to determine the direction of the cutting wire saw.
- the transition wheel is used for reversing or guiding the cutting line, or the transition wheel can be used for adjusting the tension of the cutting line.
- the cutting line is driven to run along the winding direction, and the first silicon rod clamp or the second silicon rod clamp drives the clamped silicon rod along the axis of the silicon rod.
- the center line direction ie, the first direction, is moved to realize the feeding relative to the cutting wire saw, wherein the cutting wire saw can be set in the second direction or the re-perpendicular direction.
- the cutting wire saw can be cut only when the direction of the cutting wire is perpendicular to the axial direction of the silicon rod. Therefore, in a specific scenario, the direction of the cutting wire saw is on the vertical plane of the first direction.
- the following embodiment uses a cutting wire saw to be set in the No. The two-direction or the double-perpendicular direction is taken as an example for description.
- the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form Cutting wire saw; wherein, the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; the first transition wheel, adjacent to the first cutting wheel, is ordered in the state of pulling the cutting wire
- the cutting lines of the first cutting wheel and the first transition wheel are located in the plane of the first cutting wire groove for winding the cutting line in the first cutting wheel; the second transition wheel, adjacent to the second cutting wheel, is in the traction
- the state of the cutting line makes the cutting line of the second cutting wheel and the second transition wheel located in the plane of the second cutting wire groove used for winding the cutting line in the second cutting wheel; at least one third transition wheel is arranged on the first A transition wheel and a second transition wheel are used for pulling the cutting wire between the first transition wheel and the second transition wheel, so that a cutting accommodating space is formed in the wire
- the direction of the cutting wheel surface has a corresponding relationship with the direction of the cutting wire saw. It should be understood that the cutting wheel surface is parallel to the plane where any cutting wire groove in the cutting wheel is located, in order to control the cutting accuracy and the stability of the cutting process. , the cutting wire saw should be located in the plane of the cutting wire groove used for winding the cutting wire; at the same time, during the cutting process, the direction of the force applied by the silicon rod to the cutting wire should be parallel to the cutting wire groove, that is The surface of the cutting wheel is parallel to the cutting direction, and the cutting direction is the direction of the axis of the silicon rod in the squaring operation.
- the cutting wire saw is located in the second direction or the re-perpendicular direction.
- the cutting wheel surface is parallel to the second direction and the silicon rod axis direction, that is, the cutting The wheel surface is located in the direction of the horizontal plane, or the cutting wheel surface is parallel to the direction of the heavy vertical line and the axis of the silicon rod, that is, the cutting wheel surface is located in the vertical plane direction.
- the silicon rod cutting device includes two wire cutting units arranged opposite each other, and each wire cutting unit has at least one cutting wire saw. Therefore, the two wire cutting units form at least two parallel cutting wire saws.
- the silicon rod cutting device includes two wire cutting units 43 arranged opposite to each other along the second direction, each wire cutting unit 43 has a cutting wire saw 439 , and the cutting wire saw 439 can In the re-perpendicular direction, in this way, the two cutting wire saws 439 belonging to the two wire cutting units 43 are both arranged in the re-perpendicular direction.
- FIG. 6 is an enlarged schematic view of B in FIG. 5 .
- any one of the wire cutting units 43 includes a first cutting wheel 431 and a second cutting wheel 433 , and a cutting wire 438 is wound around the first cutting wheel 431 and the second cutting wheel 433 to form A cutting wire saw 439.
- the first cutting wheel includes at least one first cutting line groove, and the plane where any of the first cutting line grooves is located is parallel to the surface of the first cutting wheel wheel; the second cutting wheel includes at least one second cutting line The plane where any of the second cutting line grooves is located is parallel to the surface of the second cutting wheel.
- the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel, so that when the cutting wire is wound on the first cutting wheel and the second cutting wheel, it is respectively used for winding
- the first cutting wire groove and the second cutting wire groove of the cutting wire are located in the same plane, so that the direction of the cutting wire saw can be located in the plane where the first cutting wire groove and the second cutting wire groove for winding the cutting wire are at the same time.
- the cutting wire is in a running state during the cutting action, so the cutting wire saw is defined by its spatial position.
- the cutting wire is the cutting wire saw.
- the cutting wires on both sides of the cutting wheel should all be located in the plane of the cutting wire groove for winding the cutting wire in the cutting wheel.
- the cutting wire at one end of the first cutting wire slot is wound to the second cutting wheel to form a cutting wire saw, and the cutting wire at the other end of the first cutting wire slot is wound to the The first transition wheel.
- the first transition wheel 432 is adjacent to the first cutting wheel 431 , and is ordered to go around the first cutting wheel 431 in a state of pulling the cutting line around the first cutting wheel 431 .
- the cutting line is located in the plane where the first cutting line groove for winding the cutting line in the first cutting wheel 431 is located.
- the cutting wire at one end of the second cutting wire groove is wound to the first cutting wheel to form a cutting wire saw, and the cutting wire at the other end of the second cutting wire groove is wound to the Second transition wheel.
- the second transition wheel 434 is adjacent to the second cutting wheel 433 , and is ordered to go around the second cutting wheel 433 in the state of pulling the cutting line around the second cutting wheel 433
- the cutting line is located in the plane of the second cutting line groove in the second cutting wheel 433 for winding the cutting line.
- the first transition wheel and the second transition wheel respectively have at least one wire groove for pulling the cutting wire.
- the first transition wheel and the second transition wheel are respectively arranged adjacent to the first cutting wheel and the second cutting wheel, and here, the adjacent arrangement can be the left side, the right side, the upper side, the lower side, etc. Applications are not limited.
- the direction of the cutting wire wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting wire groove or wire groove.
- the at least one third transition wheel 436 is disposed between the first transition wheel 432 and the second transition wheel 434 for pulling the first transition wheel 432 and the second transition wheel 434 434, so that a cutting accommodating space is formed in the wire cutting unit, the cutting accommodating space can accommodate the silicon rod to be cut, and the silicon rod cutting device has only the cutting wire saw and the The cutting accommodation spaces intersect.
- the first silicon rod clamp or the second silicon rod clamp drives the clamped silicon rod to feed along the axis of the silicon rod relative to the cutting wire saw, and the cutting accommodating space is the silicon rod to be cut.
- the cutting accommodating space can accommodate the silicon rod to be cut, and in the silicon rod cutting device, only the cutting wire saw intersects the cutting accommodating space.
- the first silicon rod holder or the second silicon rod holder and the silicon rod to be cut held by the first silicon rod holder and the other parts of the integrated silicon rod cutting and grinding machine include the cutting line (herein) during movement.
- the collision of the cutting wire (removing the cutting wire saw) is a problem that needs to be avoided; at the same time, in order to achieve cutting, the cutting wire saw and the silicon rod are relatively fed during the movement of the first silicon rod clamp or the second silicon rod clamp to clamp the silicon rod, so , it should be ensured that the cutting accommodating space includes and only includes silicon rods and cutting wire saws.
- the first transition wheel, the second transition wheel, and the at least one third transition wheel can all be used to pull the cutting line, and the third transition wheel is used to pull the cutting between the first transition wheel and the second transition wheel. line to form the cut receiving space.
- the first transition wheel, the second transition wheel and the at least one third transition wheel are used for pulling the cutting wire away from the silicon rod to be cut.
- the cutting line between the first cutting wheel and the first transition wheel and the cutting line between the second cutting wheel and the second transition wheel are located in the first cutting line groove ( or the second cutting slot) in the plane.
- the lengths of the cutting lines between the first cutting wheel and the first transition wheel and between the second cutting wheel and the second transition The length of the silicon rod is cut, but under this setting, the cutting frame occupies too much equipment space and the layout is unreasonable.
- the first transition wheel, the second transition wheel, and at least one third transition wheel are used to draw the cutting wire away from the cutting receiving space.
- the present application provides an embodiment in which the cutting accommodating space is formed by the first transition wheel, the second transition wheel and the third transition wheel.
- the wheel surface of at least one of the first transition wheel, the second transition wheel and the third transition wheel forms a certain angle with the wheel surface of the first cutting wheel or the second cutting wheel,
- the deviation The direction of can be selected as the direction away from the cutting accommodating space.
- the first transition wheel 432 , the second transition wheel 434 and the third transition wheel 436 It is set to be inclined in the direction away from the cutting accommodation space, or each transition wheel is arranged on the side of the cutting frame away from the cutting accommodation space, so that the cutting line can be kept away from the cutting accommodation space.
- the equipment space required by the wire cutting unit can be effectively reduced, and it is beneficial to the overall equipment layout of the silicon rod cutting and grinding integrated machine.
- the direction away from the cutting accommodating space is the vector of the vertical direction of the cutting wheel surface.
- two opposite wire cutting The corresponding directions of the units 43 away from the cutting accommodating space point in opposite directions, which are respectively the directions shown by the arrows in the figure.
- the wheel surface of the first transition wheel and the direction of the wheel surface of the first cutting wheel may form a certain angle
- the wheel surface of the second transition wheel and the direction of the wheel surface of the second cutting wheel may form a certain angle a certain angle.
- the direction in which the first transition wheel is arranged is only when the cutting line at the other end of the first cutting wheel is located in the plane where the first cutting line groove for winding the cutting line is located and the wire used for winding the cutting line in the first transition wheel.
- the direction of the setting of the second transition wheel is only when the cutting line at the other end of the second cutting wheel is located in the plane where the second cutting line groove for winding the cutting line is located and the second cutting line.
- the wire groove used for winding the cutting wire is located in the intersection of the plane.
- the direction of the angle is to make the first transition wheel or the second transition wheel
- the transition wheel is inclined toward the direction away from the cutting accommodating space, which is beneficial to reduce the required number of the third transition wheel and the length of the wire cutting support in the first direction.
- the cutting line is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel in an end-to-end manner to form a closed loop Cutting line.
- the cutting line 438 is a closed-loop cutting line.
- the cutting wheel and the transition wheel in the wire cutting unit are wound by an annular cutting wire.
- the wire storage drum can be omitted from the silicon rod cutting device, and the annular cutting wire can be realized by running the driving device. cut.
- the cutting wire is wound from the pay-off drum to between the cutting wheel and the transition wheel in the wire cutting unit, and is wound from the wire cutting unit to the wire take-up drum.
- the cutting line is driven to run, and the running process of the cutting line is an alternate acceleration and deceleration process.
- the annular cutting wire in the wire cutting unit can maintain continuous high-speed running, and at the same time, the annular cutting wire can run in the same running direction during the cutting operation.
- the wire cutting unit of the present application can realize high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the annular cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit, reducing production costs.
- the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, the second transition wheel, and the first cutting wheel in turn. There are three transition wheels, another third transition wheel, a first transition wheel, and a first cutting wheel to form an end-to-end annular cutting line.
- the cutting wire is wound from the first cutting wheel 431 to the second cutting wheel 433 and is formed between the two cutting wheels The cutting wire saw 439; the cutting wire is wound from the second cutting wheel 433 to the second transition wheel 434, a third transition wheel 436, another third transition wheel 436, a first transition wheel 432, and a first cutting wheel. 431 , thereby forming an end-to-end annular winding, and at the same time, through the pulling and guiding of the cutting wire by a plurality of transition wheels, the cutting accommodating space is formed in the wire cutting unit.
- the positions of the first transition wheel, the second transition wheel and the third transition wheel relative to the cutting wheel and the inclination direction of the wheel surface are not limited to the embodiment shown in the figure, only when cutting
- the cutting accommodating space may be formed when the wire is wound between the plurality of cutting wheels and the transition wheel of the wire cutting unit.
- the third transition wheel of the wire cutting unit can also be set to three, four, etc., which is not limited in this application.
- the silicon rod cutting device further includes a cutting wire driving device for driving the cutting wire to run to cut the silicon rod.
- the principle of wire cutting is that the high-speed running steel wire drives the cutting blade material attached to the steel wire or directly uses the diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting.
- the cutting wire driving device is used to realize the running of the cutting wire.
- the cutting wire driving device is a motor with a power take-off shaft and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel, so that the cutting wire can be wound by The cutting wheel is driven to run along the winding direction.
- the cutting wire driving device may also be another driving source, such as a hydraulic motor, only when the cutting wire is driven to run, which is not limited in this application.
- the silicon rod cutting device further includes a tension detection mechanism.
- the tension of the cutting wire affects the yield and processing accuracy of the cutting.
- the tension detection mechanism performs tension detection and adjusts so that the tension of the cutting wire reaches a certain threshold set and maintains a constant value or a constant value during cutting.
- the constant value is a certain range allowed by the center of the value.
- the transition wheel in the wire cutting unit simultaneously serves as a tensioning wheel for adjusting the tension of the cutting wire when realizing the guiding and pulling of the cutting wire.
- the tensioning wheel is used to adjust the tension of the cutting line, which can reduce the probability of breaking the cutting line and reduce the consumables.
- the role of the cutting wire is very important, but even the best cutting wire has limited elongation and wear resistance, which means that the cutting wire will gradually become thinner during continuous operation until it is finally broken. . Therefore, the current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the extension of the cutting wire when it travels back and forth.
- the tension detection mechanism at least includes: a tension sensor, a servo motor and a lead screw; the tension sensor is arranged on the transition wheel, and continuously senses the tension of the cutting wire on the transition wheel value, and send out a drive signal when the tension value is less than the preset value; the servo motor is electrically connected to the tension sensor to start working after receiving the drive signal sent by the tension sensor; one end of the lead screw is connected to The other end of the tension wheel is connected to the servo motor, and when the servo motor works, the transition wheel is pulled to perform one-way displacement, so as to adjust the tension of the cutting line.
- the silicon rod cutting device further includes: at least one distance adjusting mechanism, which is provided in the at least one wire cutting unit and is used to drive a plurality of cutting wheels in the wire cutting unit relative to the edge of the cutting frame. Move perpendicular to the face of the cut-off wheel.
- the silicon rod cutting device can realize the switching of the cutting wire between different cutting grooves of the cutting wheel based on the distance adjustment mechanism, or adjust the position of the cutting wire saw to change the cutting position (or processing specification) relative to the silicon rod.
- the wire cutting unit includes a plurality of cutting wheels and transition wheels.
- the carrier for carrying the plurality of cutting wheels and transition wheels is, for example, the wire cutting support 430 shown in FIG. 5 , and the distance adjustment mechanism can be used to drive the wire cutting support 430 as a whole along the vertical line of the cutting wheel surface moving in the direction, the transition wheel and the cutting wheel together follow the wire cutting support to move along the vertical direction (ie, the second direction) of the cutting wheel surface, in this state, the plurality of cutting wheels and transition wheels It is relatively static, that is, the positional relationship between the transition wheel and the cutting wheel does not change.
- the distance adjusting mechanism is used to adjust the cutting position of the at least one wire cutting wire saw relative to the silicon rod in the at least one wire cutting unit.
- each cutting wheel has at least two cutting line grooves, different cutting line grooves are parallel to each other and there is a cutting offset in the vertical direction of the cutting wheel surface between different cutting line grooves.
- the distance adjusting mechanism is used to drive the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the positions of the wire grooves on which the cutting wire is wound around the cutting wheels can be changed.
- a plurality of cutting wheels in the wire cutting unit can be connected to a bracket, for example, wherein the bracket is movably arranged on the wire cutting support and is driven by the distance adjustment mechanism to follow the direction of the cutting wheel surface. Move in the vertical direction.
- the corresponding cutting lines before and after the groove changing can be determined in advance.
- Cutting wire groove for example, the position of the cutting wire before the groove change is the cutting wire groove a1, after the groove changing, the cutting wire is wound around the cutting wire groove a2, based on the cutting offset between the cutting wire groove a1 and the cutting wire groove a2.
- the displacement amount that the at least one distance adjusting mechanism drives the movement of the plurality of cutting wheels in the wire cutting unit is set as the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, which can be used to realize cutting Replacing the wire cutting wire groove a1 to the cutting wire groove a2; it should be noted that the at least one distance adjustment mechanism drives the multiple cutting wheels in the wire cutting unit to move in the direction of the vertical line of the cutting wheel surface.
- the wire groove a2 points to the direction of the cutting wire groove a1.
- the cutting position of the cutting wire saw in the space remains unchanged, and the step of further calibrating the position of the cutting wheel or other components is omitted, and the preset cutting amount can be The silicon rods are cut so that the slot changing process is simplified.
- the present application provides the following embodiments.
- the specific form of the at least one distance adjusting mechanism can be changed accordingly.
- the wire silicon rod cutting device includes a single wire cutting unit; the distance adjustment mechanism includes: a screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected to the single wire cutting unit; a driving source , used to drive the screw to rotate.
- the single wire cutting unit is a wire cutting unit
- the single wire cutting unit in the wire silicon rod cutting device includes a plurality of cutting wheels, and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting wire saw.
- the screw rod of the distance adjustment mechanism has a distal end and a proximal end.
- the proximal end of the screw rod can be connected to a driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to the Single wire cutting unit, by means of the connection at both ends of the screw rod, the screw rod can rotate based on the drive source transmission and convert the rotation of the screw rod into the displacement of the axis line by means of threaded connection, and the axial displacement direction is the setting of the screw rod
- the direction is the orthogonal direction of the wheel surface of the cutting wheel; the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the cutting wheel can be realized by the rotation of the lead screw driven by the driving source in the distance adjustment mechanism, and the rotation direction of the lead screw is driven to rotate.
- the cutting wheel of the single-wire cutting unit can be advanced or retreated in the orthogonal direction of the cutting wheel surface.
- the wire silicon rod cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a telescopic member, which is arranged along the orthogonal direction of the cutting wheel surface and is associated with the single-wire cutting unit; a driving source , which is used to drive the telescopic element to perform telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel.
- the telescopic piece can be configured as a rod body structure, and the extending direction of the rod body is the orthogonal direction of the wheel surface of the cutting wheel.
- the drive source, the retractable free end is associated with the single wire cutting unit, and can drive the cutting wheel of the single wire cutting unit to move in the orthogonal direction of the cutting wheel surface under the action of the driving source.
- the telescopic element is, for example, an electric telescopic rod, or a connecting rod connected to a cylinder taper rod, and the cylinder can be used as a driving source, which is not limited in this application.
- the way the telescopic rod is connected to the single-wire cutting unit can be a linear connection or an indirect connection, for example, it can be directly connected to the wire-cutting support or cutting wheel support of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or bearing.
- the single wire cutting unit It should be understood that the expansion or contraction of the telescopic element can correspond to the advance or retreat of the single-wire cutting unit along the orthogonal direction of the cutting wheel surface.
- the association can be realized by, for example, one or more of snapping, screw locking, gluing, and welding.
- the telescopic rod can be The wire cutting unit is associated with one or more ways of snapping, screwing, gluing, and welding; of course, the realization of the association is not limited to this, and is intended to be realized in the second direction transmission.
- the wire silicon rod cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a rack, which is arranged on the single-wire cutting unit along the orthogonal direction of the surface of the cutting wheel; a transmission gear, and The rack is meshed; a driving source is used to drive the transmission gear to rotate.
- the transmission gear rotates under the drive of the driving source, and the rack meshing with the transmission gear moves along the step direction of the rack accordingly.
- the rotational motion of the drive is converted into wire transportation along the direction of the rack, and the rack is arranged on the single-wire cutting unit along the orthogonal direction of the cutting wheel surface, so that the cutting wheel of the single-wire cutting unit can be driven along the cutting wheel. Orthogonal direction of the face.
- the rotation direction of the transmission gear is controlled and switched by the driving source, so that the plurality of cutting wheels of the single-wire cutting unit can advance or retreat along the orthogonal direction of the cutting wheel surface.
- the silicon rod cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, and at least one of the first wire cutting unit and the second wire cutting unit passes through the At least one distance adjustment mechanism is driven to move in the orthogonal direction of the wheel surface of the cutting wheel, and is used to adjust the wire between at least one cutting wire saw in the first wire cutting unit and at least one cutting wire saw in the second wire cutting unit
- the secant saw spacing, or the changing cutting wire is wound around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.
- the at least one distance adjusting mechanism can be configured to be connected to the first wire cutting unit or the second wire cutting unit, or to be associated with the first wire cutting unit and the second wire cutting unit at the same time, so as to drive the connected or associated wire cutting unit.
- the plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit move in orthogonal directions of the cutting wheel surfaces.
- the distance adjusting mechanism includes: a screw rod, which is arranged in the orthogonal direction of the wheel surface of the cutting wheel and is threadedly connected with the first wire cutting unit or the second wire cutting unit; to drive the screw to rotate.
- the manner in which the screw rod and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the cutting wheel surface is similar to that in the previous embodiment, and all the cutting wheels driven by the distance adjusting mechanism
- the first cutting unit or the second wire cutting unit may be regarded as a single wire cutting unit, which will not be repeated here. It should be understood that by setting the distance adjustment mechanism on any wire cutting unit, the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit can be increased and decreased.
- the silicon rod can be cut into different specifications.
- the distance adjusting mechanism includes: a telescopic element, which is arranged in the orthogonal direction of the cutting wheel surface and is associated with the first wire cutting unit or the second wire cutting unit; a driving source for driving The telescopic element performs telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel.
- the first cutting unit or the second wire cutting unit provided with the distance adjusting mechanism may be regarded as a single wire cutting unit, and the specific implementation can refer to the foregoing embodiments, which will not be repeated here.
- the distance adjusting mechanism comprises: a rack, along the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear, connected with the The rack is meshed; the driving source is used to drive the transmission gear to rotate. Through the meshing transmission gear and rack, the driving source can control the rack to move linearly in the direction of the rack, and the first wire cutting unit or the second wire cutting unit associated with the rack can use the teeth
- the strip drives the plurality of cutting wheels to move in orthogonal directions to the surfaces of the cutting wheels.
- the distance adjusting mechanism includes: a bidirectional screw rod, which is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is threadedly connected with the first wire cutting unit and the second wire cutting unit; and a driving source, It is used to drive the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the surface of the cutting wheel.
- the two-way screw is a double-threaded screw, two ends of the two-way screw are respectively provided with threads and the thread directions are opposite, and the driving source can be arranged at either end of the two-way screw to Drive the two-way screw to rotate along the screw shaft.
- the axial direction is the orthogonal direction of the cutting wheel surface of the bidirectional screw rod.
- the plurality of cutting wheels corresponding to the first wire cutting unit and the second wire cutting unit respectively can move toward each other or move toward each other.
- the distance adjusting mechanism is a servo motor provided in the at least one wire cutting unit.
- a servo motor is set on at least one wire cutting unit or each wire cutting unit of the wire silicon rod cutting device, and the servo motor controls the corresponding wire cutting unit in the orthogonal direction of the cutting wheel surface. displacement.
- the wire cutting unit can pre-determine the cutting offset for changing grooves or the adjustment amount for changing the cutting position of the cutting wire, and the precise positioning function of the servo motor drives the plurality of cutting wheels in the wire cutting unit to a preset displacement. Movement in the direction orthogonal to the face of the cut-off wheel.
- the wire silicon rod cutting device is provided with a single wire cutting unit, and a servo motor is provided on the single wire cutting unit to drive the single wire cutting unit to move in the orthogonal direction of the cutting wheel surface;
- the silicon rod cutting device is provided with a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or/and the second wire cutting unit are driven by the corresponding servo motors to be relatively independent along the positive direction of the cutting wheel surface. Move in the opposite direction.
- the servo motor can also be replaced with a traveling motor and a traveling lead screw.
- the distance adjustment mechanism is a driving device that drives a plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame. Form This application is not limited.
- the cutting switching mechanism is used to drive the cutting frame and at least one wire cutting unit on it to switch between the first transfer channel and the second transfer channel.
- the silicon rod processing platform is provided with a first processing area and a second processing area in sequence along the first direction, and the first processing area and the second processing area straddle the silicon in the second direction.
- the first transfer device and the second transfer device are arranged in parallel along the first direction, wherein the first transfer channel in the first transfer device passes through the first processing area and the second processing area along the first direction, and the second transfer device passes through the first processing area and the second processing area along the first direction.
- the second transfer passage passes through the first processing location and the second processing location in the first direction.
- the silicon rod cutting device is provided with a cutting conversion mechanism, and by using the cutting conversion mechanism, the cutting frame and the at least one line cutting unit on the cutting frame can be driven to move in the second direction, so as to move in the second direction in the first To switch between a transfer channel and a second transfer channel, for example, the cutting frame and at least one wire cutting unit on it are driven by the cutting conversion mechanism to move in the second direction to switch from the first transfer channel to the second transfer channel Alternatively, the cutting frame and the at least one wire cutting unit on the cutting frame are driven to move in the second direction by the cutting conversion mechanism to be converted from the second transfer passage to the first transfer passage.
- the cutting conversion mechanism includes: a cutting conversion guide rail and a cutting conversion driving unit.
- the cutting conversion guide rail is arranged along the second direction for setting the cutting frame.
- the cutting conversion guide rail is arranged on the silicon rod processing platform along the second direction, and the cutting frame is erected on the cutting conversion guide rail through, for example, a sliding block.
- a cutting conversion driving unit is used for driving the cutting frame and its at least one line cutting unit to move along the cutting conversion guide rail.
- the cutting conversion driving unit includes: a moving rack, a driving gear and a driving source.
- the moving rack is arranged along the second direction and is parallel to the cutting conversion guide rail.
- the moving rack is fixed on the silicon rod processing platform, is set to approximately the same second direction dimension as the cutting conversion guide rail, and is parallel to and adjacent to the cutting conversion guide rail.
- the driving gear is arranged on the cutting frame and meshes with the moving rack, so as to drive the cutting frame to move along the cutting conversion guide rail.
- the drive source is used to drive the drive gear.
- the driving gear is provided on the cutting frame, the driving gear is driven to rotate by a driving source, and the gear teeth of the driving gear mesh with the moving rack to conform to the movement The rack travels, whereby the cutting frame connected to the drive gear and at least one cutting unit thereon produce a corresponding movement on the cutting transition rail.
- the cutting conversion drive unit may be disposed on the cutting frame, and includes a moving screw and a drive source, wherein the moving screw is disposed along the second direction and associated with the cutting frame,
- the driving source is used for driving the moving screw to rotate so that the associated cutting frame and at least one cutting unit on it move along the cutting conversion guide rail.
- the integrated silicon rod cutting and grinding machine of the present application may further include an edge skin discharging device, which is used for discharging the edge skin formed by cutting the silicon rod by the silicon rod cutting device.
- the edge skin discharging device may include a edge skin supporting mechanism for abutting against the outer side of the silicon rod and supporting the edge skin formed by cutting.
- the silicon rod clamped by the first silicon rod holder in the first transfer device or the second silicon rod holder in the second transfer device is horizontal, That is, the axis line of the silicon rod is consistent with the first direction. Therefore, the edge skin formed by cutting the silicon rod by the silicon rod cutting device is also horizontal, and the edge skin unloading mechanism supports the edge skin to assist in unloading the edge skin.
- the edge skin supporting mechanism comprises: a support part; and a driving unit connected with the support part to control the support part to move away from or abut against the edge skin.
- the silicon rod cutting device in the integrated silicon rod cutting and grinding machine can switch the cutting position during the processing of the silicon rod.
- the silicon rod processing platform is provided with a first processing area and a second processing area
- the silicon rod cutting device is arranged on the base by a cutting conversion mechanism, and can switch positions between the first processing area and the second processing area under the driving of the cutting conversion mechanism.
- the edge skin supporting mechanism can, for example, be provided on the silicon rod cutting device through a mounting portion, so that the edge skin supporting mechanism remains relatively stationary relative to the cutting assembly when the silicon rod cutting device changes the processing position.
- the mounting portion is detachably connected to the cutting frame, and the mounting portion can be arranged at different positions on the silicon rod cutting device based on the requirement of the position for supporting the silicon rod.
- the position of the edge skin supporting mechanism on the silicon rod cutting device can be determined based on the specific structure of the wire cutting unit in the silicon rod cutting device.
- FIG. 5 is a schematic structural diagram of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine in one embodiment.
- the silicon rod cutting device includes a cutting frame 41 and a wire cutting unit 43 , and the wire cutting unit 43 is provided on the cutting frame 41 by a wire cutting support 430 .
- the wire cutting support 430 serves as a carrier for associating a plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the specific form of the wire cutting support 430 can be a beam body, a plate frame, bracket etc.
- the edge skin supporting mechanism can be provided on the wire cutting support 430 through the mounting portion.
- the edge skin supporting mechanism may be provided on the machine base through the mounting portion, for example, the mounting portion It is a support column or bracket for setting the edge skin supporting mechanism, so that the supporting part in the edge skin supporting mechanism can realize the supporting of the edge skin under the driving of the driving unit.
- the edge skin supporting mechanism includes a support portion, which is used for contacting and abutting against the silicon rod to achieve a supporting effect on the edge skin. It should be noted that, in each embodiment of the present application, the The supporting function is to apply force to the edge skin to maintain a stable state. Taking the cutting wire saw as an example in the horizontal direction (ie, the second direction), the edge skin formed by cutting is located on the silicon rod.
- the support part can provide a supporting force to the edge skin on the lower side of the silicon rod to prevent the edge skin from breaking, so that the edge skin can be maintained in a stable state;
- the edge skin formed by cutting is located beside the silicon rod (the left side, the right side, or the left side and the right side), and the supporting part can be set to be connected with the silicon rod.
- the structure of the outer arc surface of the rod is adapted to provide a support force to the edge skin, or to maintain a stable state by abutting against the edge skin so that the edge skin is subjected to frictional force. In the example shown in FIG.
- the silicon rod cutting device includes two wire cutting units 43 arranged opposite to each other along the second direction, each wire cutting unit 43 has a cutting wire saw 439 , and the cutting wire saw 439 can In the re-perpendicular direction, in this way, the two cutting wire saws 439 belonging to the two wire cutting units 43 are both arranged in the re-perpendicular direction.
- the edge skins formed by cutting are located on the left and right sides of the silicon rod, and the supporting portion can be set to a structure adapted to the outer arc surface of the silicon rod to provide a supporting force for the edge skin, or by abutting against the edge skin to provide support for the edge skin.
- the edge skin is subjected to friction to maintain a stable state.
- the driving unit is used for driving the bearing portion away from or against the side skin.
- the directions of moving away from or abutting against the edge skin can be in multiple directions, for example, abutting the edge skin means that the supporting portion moves from a state of being separated from the edge skin to a state of contacting the edge skin under the driving of the driving unit, and
- the specific movement direction of the supporting portion is not limited in this application.
- the driving unit includes: an air cylinder or a hydraulic pump; a telescopic part, connected to the bearing part, and driven by the air cylinder or hydraulic pump to telescopically move to control the bearing part to move away from or against the supporting part; Said edge skin.
- the telescopic part can be telescopically moved under the driving of a cylinder or a hydraulic pump, so that the telescopic part is connected to the supporting part, and the telescopic direction of the telescopic part is, for example, a direction away from or close to the axis of the silicon rod, thereby driving the connected supporting part.
- the support part is away from or abuts against the side skin.
- the drive unit includes a drive motor and a lead screw assembly driven by the drive motor.
- the screw assembly can be threadedly connected with the bearing part at one end, the driving motor drives the screw to rotate to make the bearing part move along the direction of the screw, and the rotation direction of the screw is controlled by the driving motor to control
- the support part is close to or away from the edge skin.
- the supporting portion can be set in different structures to achieve the supporting effect.
- the supporting portion can be a supporting plate and has an arc surface for contacting the edge skin, or the supporting portion has a folded surface.
- a support plate that prevents the edge skin from rolling for example, the support plate has a trapezoidal groove structure (where the notch is a trapezoidal lower bottom); it should be understood that the support portion that can be used to support the edge skin has many This can be implemented, which is not limited in this application.
- the application also provides the following implementation methods:
- the supporting portion includes at least two supporting blocks, which are arranged at intervals along the first direction and have a bearing surface for contacting and bearing the edge skin.
- the bearing surface of the supporting block can be set to have an arc surface to adapt to the supported edge skin, or can be set to be composed of contact planes with different levels to prevent the edge skin from rolling.
- one drive unit may be configured for each support block.
- the edge skin can be supported by one supporting block; here, the present application also provides that the edge skin can be realized by at least two supporting blocks arranged at intervals along the first direction
- the edge skin can be realized by at least two supporting blocks arranged at intervals along the first direction
- the provided support block supports the edge skin so that the edge skin can be subjected to the force of the support part in different length directions (ie, the first direction), thereby helping to prevent the cutting wire saw from breaking through the front edge skin of the silicon rod.
- the at least two supporting blocks arranged at intervals can be used to support the edge skin to prevent the edge skin from tilting and falling over.
- the supporting part of the side skin discharge mechanism is a supporting wheel set, wherein there may be at least two supporting wheel sets, and at least two of the supporting wheel sets are along the first The directions are arranged at intervals or spans, and each of the supporting wheel sets includes: at least two supporting wheels, the at least two supporting wheels are arranged at intervals along the second direction, and are used for contacting to support the edge skin a supporting base, connected to the driving unit, for setting the at least two supporting wheels to drive the at least two supporting wheels away from or abutting against the edge skin.
- the edge skin supporting mechanism includes at least two supporting parts, and the at least two supporting parts are disposed on the silicon rod cutting device or the machine base at intervals along the first direction.
- the supporting part is a supporting wheel set, and any of the supporting wheel sets includes at least two supporting wheels, which are arranged at intervals along the second direction, so that the center of gravity of the supported side skin can be in the second direction.
- the location is between the at least two support wheels.
- the support wheel is used for contacting and supporting the edge skin, and the tangential direction of the support wheel in contact with the silicon rod edge skin is along the first direction.
- the support wheel can roll along the axis of the support wheel, and the axis of the support wheel is arranged in the second direction.
- the cutting wire saw penetrates the silicon rod to form an independent edge skin, and when the edge skin is to be subsequently transported, when the edge skin moves relative to the supporting wheel set along the first direction, the edge skin and the support There is rolling friction between the wheels, which facilitates the subsequent conveying of the edge skin along the first direction.
- the edge skin supporting mechanism further includes a driving unit, and the driving unit is used for driving the supporting wheel set to move away from or against the edge skin.
- the cutting wire saw of the rod cutting device is arranged in the second direction, and the driving unit drives the supporting wheel set to move in the direction of the heavy vertical line to abut against and support the edge skin during the cutting process.
- the driving unit is, for example, an air cylinder or a driving motor, etc., the air cylinder or driving motor is connected to the supporting base of the supporting wheel set to drive the whole supporting wheel set to move up and down in the direction of the heavy vertical line.
- the supporting part includes: at least two supporting rods, arranged along the first direction, for contacting and supporting the edge skin; two connecting parts, respectively disposed on the edges of the supporting rods The opposite ends in the first direction are used for connecting the at least two supporting rods and the driving unit.
- FIG. 5 and FIG. 6 are schematic diagrams showing a part of the structure of an embodiment of the side skin supporting mechanism of the present application.
- the support portion 611 includes two support rods 6111 arranged at intervals along the second direction, and the rod bodies of the support rods 6111 are along the first direction.
- the at least two support rods 6111 can be used to support the edge skin. It should be understood that the center of gravity of the edge skin formed by cutting is located between the at least two support rods 6111 At the same time, any of the supporting rods 6111 is in line contact with the supported edge skin, and under this setting, the frictional force between the supporting portion 611 and the edge skin can be reduced. .
- the connecting parts 6113 are located on both sides of the support rod 6111, so that the support rod 6111 is symmetrical in force when the support part 611 is away from or close to the silicon rod, which is beneficial to improve the structural stability of the support part. .
- the connecting portion 6113 is respectively connected to the supporting rod 6111 and the driving unit, wherein the driving unit 613 is connected to the wire cutting support through the mounting portion.
- the free end of the base 430 or the cutting frame 41 which can be telescopically moved, is connected to the connecting portion 6113 to drive the entire supporting portion 611 to move in the telescopic direction driven by the driving unit 613 .
- the driving unit 613 is an air cylinder having a telescopic portion, and the telescopic portion of the air cylinder 613 is connected to the connecting portion 6113 .
- the supporting portion 611 is controlled to move in the second direction to move away from or close to the edge skin.
- the driving unit in the corresponding edge skin supporting mechanism can be arranged in different directions to adapt to In order to support the needs of the edge skin.
- the driving unit can be set, for example, the direction of its telescopic movement is the second direction, so that the supporting portion moves in the second direction to approach or away from the edge.
- the driving unit can be set, for example, to set the direction of its telescopic movement to be the third direction (ie, the direction of the heavy vertical line), so that the supporting portion can be moved along the second direction. Movement in the third direction to approach or move away from the edge skin.
- the direction of the controlled movement of the supporting portion is not limited in the present application, and it is only required that the supporting portion can support the edge skin.
- the number of the supporting parts can be set according to the need for supporting the edge skin.
- the silicon rod cutting device includes a cutting wire saw
- the edge skin is formed correspondingly in one cutting operation.
- a support part can be provided on the rod cutting device to support the opposite side skin;
- the silicon rod cutting device includes two parallel cutting wire saws, the two side skins are formed correspondingly in one cutting operation,
- the silicon rod cutting device can be provided with two supporting parts to respectively support the edge skins on both sides of the silicon rod.
- the edge skin unloading device further includes a edge skin dislocation mechanism, which is arranged on the machine base or the silicon rod cutting device, and is used for pushing the edge skin along a first direction to make the edge skin Disengage the edge skin support mechanism.
- a edge skin dislocation mechanism which is arranged on the machine base or the silicon rod cutting device, and is used for pushing the edge skin along a first direction to make the edge skin Disengage the edge skin support mechanism.
- the edge and skin dislocation mechanism is disposed on the machine base or the silicon rod cutting device at a predetermined interval relative to the cutting wire saw along a first direction, wherein the first direction is parallel to the axis of the silicon rod direction. It should be understood that when the cutting wire saw penetrates the silicon rod, an edge skin independent of the silicon rod can be formed. At this time, an end surface of the edge skin supported by the supporting portion is aligned with the cutting wire saw in the first direction. By determining the distance between the edge skin dislocation mechanism and the cutting wire saw in the first direction, the distance that the edge skin is pushed can be determined by the displacement amount of the edge skin dislocation mechanism moving in the first direction.
- the edge skin dislocation mechanism can be set on the machine base or the silicon rod cutting device, and in a specific scenario, it can be determined based on the silicon rod cutting and grinding integrated machine. For example, if the position of the silicon rod cutting device in the first direction does not change during the processing of the silicon rod, the edge and skin dislocation mechanism can be arranged on either the machine base or the silicon rod cutting device; when the silicon rod is cut and ground into one piece The position of the silicon rod cutting device in the machine in the first direction is not a fixed value in different processing states or cutting processes. For example, the silicon rod cutting device moves along the first direction to realize feeding and cutting of the silicon rod, and the edge skin can be cut. The dislocation mechanism is set in the silicon rod cutting device.
- the axial direction of the silicon rod to be cut is along the first direction
- the edge skin formed during cutting is also along the first direction in the supported state.
- the edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin
- the skin moves relative to the edge skin supporting mechanism, so that the edge skin can be separated from the edge skin supporting mechanism and the subsequent transfer process can be performed on the edge skin.
- the side skin dislocation mechanism includes: a power source; and a telescopic rod, which is arranged along the first direction and is used for telescopic movement driven by the power source to push the side skin.
- the power source of the side skin dislocation mechanism is an air cylinder or a hydraulic pump, wherein the telescopic rod of the air cylinder or the hydraulic pump is arranged along the first direction.
- the silicon rod cutting device is provided with two parallel wire cutting units
- the edge skin discharging device includes two edge skin dislocation mechanisms, which are respectively installed in the cutting device.
- the left side line cutting unit and the right side line cutting unit of the frame, the edge skin dislocation mechanism is an air cylinder with a telescopic rod, and the telescopic rod is arranged along the first direction and aligned to the edge skin end surface.
- the edge skin dislocation mechanism moves in the first direction to abut against the edge skin end face and push the edge skin to move, so that the edge skin can be separated from the edge skin support mechanism or Detach the silicon rod after cutting.
- the telescopic range of the telescopic rod of the edge-skin dislocation mechanism may be determined based on the length specification of the silicon rod, or determined based on the span of the support part in the edge-skin support mechanism in the first direction, so as to control the edge and skin The travel of the skin being pushed in the first direction ensures that the edge skin can be disengaged.
- the edge skin dislocation mechanism may also be provided on the silicon rod.
- the base of the cutting and grinding machine the edge skin dislocation mechanism can be applied to different types of support parts.
- the edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin disengage from the support part.
- the specific form of the supporting portion is not necessarily limited to the embodiment shown in FIG. 5 and FIG. 6 .
- the edge skin unloading device further comprises a edge skin conveying mechanism, which is used for receiving the edge skin formed by cutting and transferring the edge skin to the discharge area.
- the discharge area is the side skin discharge area.
- the position of the edge skin conveying structure in the second direction can be set to be aligned with the silicon rod cutting device in the integrated silicon rod cutting and grinding machine, so that the edge skin formed by cutting the silicon rod can be formed by the corresponding edge skin.
- the edge skin conveying structure is conveyed, thereby reducing the transfer of the edge skin.
- the direction and position of the edge skin conveying mechanism can be determined by the positional relationship between the cutting area and the edge skin discharge area.
- the edge skin discharge area and the cutting area are disposed adjacent to the first direction, and here, the edge skin conveying structure can be disposed along the first direction, and is connected to the silicon rod cutting device, So that after the silicon rod is cut to form the edge skin, the edge skin is pushed in the first direction to be separated from the cut silicon rod or the edge skin support mechanism and then transferred to the edge skin conveying structure, which can simplify the transportation of the edge skin path.
- the number of the edge skin conveying mechanisms may also be determined according to the number, structure or working mode of the silicon rod cutting devices in the integrated silicon rod cutting and grinding machine.
- the integrated silicon rod cutting and grinding machine is provided with different processing locations , wherein a plurality of processing areas are provided with silicon rod cutting devices, and the edge skin conveying mechanism can be correspondingly set on a plurality of processing areas to correspond to the silicon rod cutting devices;
- the silicon rod cutting devices can simultaneously A silicon rod is squared and cut, and there are multiple edge skin conveying mechanisms, so that each edge skin conveying mechanism corresponds to one silicon rod.
- the edge skin conveying mechanism is a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.
- the edge skin conveying mechanism includes: a conveying part for carrying the edge skin; a conveying driving source for driving the conveying part to move to convey the edge skin.
- the conveying part can be arranged along a first direction, and is driven by the conveying driving source to convey the carried side skins along the first direction.
- the moving direction of the conveying part can be set to be toward the direction of the edge skin discharge area, so as to transport the carried edge skin to the edge skin discharge area.
- the conveying driving source is, for example, a motor, which is used to drive the conveying part to move and control the conveying speed of the conveying part.
- the conveying part in order to prevent the edge skin from being worn due to collision during the conveying process, in some embodiments, is provided with a buffer pad for contacting the edge skin, or, the conveying part Made of cushioning material.
- the cushioning pad or cushioning material is, for example, elastic rubber, silicone or other materials with elastic deformation, damping properties or cushioning properties. In this way, the risk of breakage of the side skin during transportation is reduced, which is beneficial to the reuse of the side skin.
- the present application provides an embodiment in which the integrated silicon rod cutting and grinding machine is provided with an edge strip discharging device, and the edge strip discharging device includes an edge strip supporting mechanism, and the supporting part is driven by a driving source to abut the edge strip to realize For the support of the edge skin, in the process of square-cutting the horizontal silicon rod, the edge skin support mechanism can prevent the edge skin from collapsing through the supporting function of the support part.
- the support portion can be used to receive the edge skin to prevent the edge skin from falling, so that a complete edge skin can be formed to assist in the subsequent process of edge skin transfer; in some examples, the edge skin discharge device is also provided with edge skin dislocation
- the mechanism can be used to push the edge skin along the first direction to make the edge skin detach from the support part, and the edge skin can also be transported from the support part to the unloading area by the edge skin conveying mechanism, so as to realize the unloading of the edge skin removal and subsequent transfer.
- the integrated silicon rod cutting and grinding machine in the embodiment of the present application further includes a silicon rod grinding device, and the silicon rod grinding device is arranged at the second processing area of the silicon rod processing platform, and is used for grinding the silicon rod on the first transfer channel. Grinding is performed on the cut silicon rod held by the first transfer device or the cut silicon rod held by the second transfer device on the second transfer channel.
- the silicon rod grinding device includes at least a pair of grinding tools, and the silicon rod is driven to move in a first direction by the first silicon rod clamp or the second silicon rod clamp, so that the silicon rod grinding device can be ground during grinding. During operation, it can be set to a fixed state to realize the relative feeding between the abrasive tool and the silicon rod.
- the silicon rod grinding device includes a grinding tool mounting seat, at least one pair of grinding tools, a grinding tool advancing and retreating mechanism, and a grinding tool converting mechanism.
- the grinding tool mounting seat is used to set at least one pair of grinding tools.
- the specific structure of the grinding tool mounting seat can be set in different forms based on the arrangement requirements of the grinding tools, for example, a beam body, a plate frame, and the like.
- the at least one pair of abrasive tools is erected on the abrasive tool mounting seat, or, the at least one pair of abrasive tools is erected on the abrasive tool mounting seat through a bracket, a connecting plate, or a mounting frame,
- the carrier for arranging the at least one pair of abrasives can be in different forms, which is not limited in this application.
- the abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool in the at least one pair of abrasive tools to move in the second direction, so as to adjust the distance between two abrasive tools in the at least one pair of abrasive tools in the second direction
- the relative distance, and then control the feed amount during the grinding process also determines the grinding amount.
- one or two grinding tools in at least one pair of grinding tools are driven to move a predetermined distance in the second direction by the grinding tool advancing and retracting mechanism, and the feeding amount is adjusted.
- the first silicon rod holder or The second silicon rod holder drives the silicon rod to move in the first direction and contacts with at least one pair of grinding tools of the silicon rod grinding device and feeds relatively to realize the grinding of the silicon rod.
- the abrasive tool conversion mechanism is used to drive the abrasive tool mounting seat and at least a pair of abrasive tools on it to switch between the first transfer channel and the second transfer channel, so that the at least one pair of abrasive tools is connected to the first transfer channel.
- the silicon rod held by the first silicon rod holder is subjected to grinding operation or the silicon rod held by the second silicon rod holder on the second transfer channel is ground.
- FIG. 7 is a schematic structural diagram of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application. 1 and 7 , as shown in FIGS. 1 and 7 , the silicon rod grinding device 5 includes a grinding tool mounting seat 51 , at least one pair of grinding tools 53 , a grinding tool advancing and retreating mechanism, and a grinding tool converting mechanism.
- the grinding tool mounting seat 51 is arranged on the second processing area of the silicon rod processing platform, and is used to install at least one pair of grinding tools 53 .
- the tool mount 51 spans the width dimension of the silicon rod processing platform in the second direction.
- the at least one pair of grinding tools 53 are disposed on the grinding tool mounting seat 51 , and the at least one pair of grinding tools appear to be opposite to each other in the second direction.
- any one of the grinding tools 53 can be mounted on the grinding tool mounting seat 51 through a grinding tool support.
- any one of the abrasive tools includes a rotating shaft and a grinding wheel.
- the grinding wheel has a certain particle size and roughness, and the two grinding wheels arranged opposite to each other are respectively provided to the two symmetrical grinding surfaces of the clamped silicon rod.
- any one of the at least one pair of grinding tools includes a rough grinding wheel and a fine grinding wheel nested in each other.
- the rough grinding wheel is nested within the fine grinding wheel, or, the fine grinding wheel is nested within the rough grinding wheel.
- FIG. 8 is a cross-sectional view of the grinding tool of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application.
- the grinding tool 53 includes a grinding head seat 531 and a rough grinding wheel 533 and a fine grinding wheel 535 arranged on the grinding head seat 531 , wherein the rough grinding wheel 533 is nested in the fine grinding wheel In the wheel 535, the fine grinding wheel 535 is larger than the rough grinding wheel 533, the fine grinding wheel 535 is circular and the middle is empty (ie, a ring structure), and the rough grinding wheel 533 can be The circular structure or the rough grinding wheel 533 may be circular with a hollow center (ie, a ring structure).
- the grinding wheel is formed by the consolidation of abrasive grains and a bonding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground.
- the grinding wheel has a certain grain size and density, and there are pores in the grinding wheel.
- the abrasive of the grinding wheel can be set to abrasive grains with hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is larger than that of the rough grinding wheel.
- the grinding tool When the grinding tool includes a rough grinding wheel and a fine grinding wheel, the grinding tool can be used to perform rough grinding and fine grinding operations on the silicon rod clamped by the first silicon rod holder or the second silicon rod holder. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism.
- the rough grinding wheel when the rough grinding wheel is nested in the fine grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, and the telescopic driving mechanism is used to drive the rough grinding wheel during rough grinding.
- the wheel protrudes and protrudes from the fine grinding wheel, so as to use the protruding rough grinding wheel to perform rough grinding on the silicon rod, and during the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding
- the wheel is retracted and recessed in the fine grinding wheel, so that the silicon rod can be finely ground by the fine grinding wheel.
- a telescopic driving mechanism may be provided on the fine grinding wheel, and the telescopic driving mechanism is used to drive the fine grinding wheel during rough grinding.
- the wheel shrinks and is recessed in the rough grinding wheel, so as to use the rough grinding wheel to perform rough grinding work on the silicon rod, and during the fine grinding operation, the telescopic driving mechanism is used to drive the fine grinding wheel to protrude and protrude. From the rough grinding wheel, a fine grinding operation is performed on the silicon rod with the protruding fine grinding wheel.
- the fine grinding wheel is nested within the rough grinding wheel, the rough grinding wheel is larger than the fine grinding wheel, and the rough grinding wheel is circular with an empty center (ie , ring structure), the fine grinding wheel may be a circular structure or the fine grinding wheel may be circular with an empty center (ie, a ring structure).
- the grinding wheel is formed by the consolidation of abrasive grains and a bonding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground.
- the grinding wheel has a certain grain size and density, and there are pores in the grinding wheel.
- the abrasive of the grinding wheel can be set to abrasive grains with hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods.
- silicon materials such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc.
- the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is larger than that of the rough grinding wheel.
- the grinding tool When the grinding tool includes a rough grinding wheel and a fine grinding wheel, the grinding tool can be used to perform rough grinding and fine grinding operations on the silicon rod clamped by the first silicon rod holder or the second silicon rod holder. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism.
- the rough grinding wheel when the fine grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, and the telescopic driving mechanism is used to drive the rough grinding wheel during rough grinding.
- the wheel protrudes and protrudes from the fine grinding wheel, so as to use the protruding rough grinding wheel to perform rough grinding on the silicon rod, and during the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding
- the wheel is retracted and recessed in the fine grinding wheel, so that the silicon rod can be finely ground by the fine grinding wheel.
- a telescopic driving mechanism may be provided on the fine grinding wheel, and the telescopic driving mechanism is used to drive the fine grinding wheel during rough grinding.
- the wheel shrinks and is recessed in the rough grinding wheel, so as to use the rough grinding wheel to perform rough grinding work on the silicon rod, and during the fine grinding operation, the telescopic driving mechanism is used to drive the fine grinding wheel to protrude and protrude. From the rough grinding wheel, a fine grinding operation is performed on the silicon rod with the protruding fine grinding wheel.
- the abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool in the at least one pair of abrasive tools to move in the second direction.
- the abrasive tool advancing and retracting mechanism controls at least one abrasive tool in the at least one pair of abrasive tools to move along the second direction, so as to adjust the relative distance between the two abrasive tools in the at least one pair of abrasive tools in the second direction, Further, controlling the feed amount during the grinding process also determines the grinding amount.
- each pair of grinding tools is equipped with a grinding tool advancing and retracting mechanism.
- the grinding tool advancing and retreating mechanism includes an advancing and retreating guide rail and an advancing and retreating drive unit.
- the advancing and retreating mechanism of the abrasive tool includes an advancing and retreating guide rail and an advancing and retreating driving unit (not shown in the drawings), wherein the advancing and retreating guide rail is arranged on the abrasive tool along the second direction.
- the bottom of the grinding tool is provided with a guide groove structure or a guide block structure along the second direction that cooperates with the advancing and retreating guide rails.
- the advancing and retreating driving unit may further include, for example, a ball screw and a driving motor, the ball screw is arranged along the advancing and retreating guide rail, and the ball screw is associated with a corresponding grinding tool and is axially connected with the driving motor.
- one of the at least one pair of abrasives is configured with a ball screw and a drive motor, the ball screw is disposed along the second direction and is associated with the one abrasive.
- the drive motor is used to drive the ball screw to rotate in the forward direction, so that the one grinding tool associated with the ball screw moves along the advancing and retreating guide rail to face the other opposite grinding tool to reduce the two grinding tools.
- the grinding distance between them or adjust the grinding feed
- each abrasive tool in the at least one pair of abrasive tools is configured with a ball screw and a drive motor, and for each abrasive tool, the ball screw and the ball screw are arranged along the The second direction is disposed and associated with the abrasive tool.
- the drive motor is used to drive the ball screw to rotate in the forward direction, so that the one grinding tool associated with the ball screw moves along the advancing and retreating guide rail to face the other opposite grinding tool to reduce the two grinding tools.
- the grinding distance between them or adjust the grinding feed
- two grinding tools in the at least one pair of grinding tools share a ball screw and a driving motor.
- the body of the bidirectional screw rod is provided with two threads with opposite directions of rotation.
- the two-way screw rotates, so that the two grinding tools associated with the two-way screw move toward or away from each other along the advancing and retreating guide rails based on a certain cooperative relationship. For example, if the drive motor drives the two-way screw to rotate in the forward direction, then the two associated abrasives are driven to move toward each other along the heavy vertical line (that is, move closer to each other), reducing the grinding distance between the two abrasives (or adjusting the grinding distance).
- Feed amount or, the drive motor drives the screw to rotate in the opposite direction, then the two associated abrasives are driven to move away from each other (ie, move away from each other) along the heavy vertical line, increasing the difference between the two abrasives. grinding distance between.
- the grinding tool conversion mechanism is used to drive the at least one pair of grinding tools to switch between the first transfer channel and the second transfer channel along the grinding tool mounting seat.
- the silicon rod processing platform is provided with a first processing area and a second processing area in sequence along the first direction, and the first processing area and the second processing area straddle the silicon in the second direction.
- the first transfer device and the second transfer device are arranged in parallel along the first direction, wherein the first transfer channel in the first transfer device passes through the first processing area and the second processing area along the first direction, and the second transfer device passes through the first processing area and the second processing area along the first direction.
- the second transfer passage passes through the first processing location and the second processing location in the first direction.
- the silicon rod grinding device includes a grinding tool mounting seat and at least one pair of grinding tools disposed on the grinding tool mounting seat, and the at least one grinding tool can be driven by the grinding tool conversion mechanism.
- moving the pair of abrasive tools in the second direction to switch between the first transfer channel and the second transfer channel for example, using the grinding conversion mechanism to drive the at least one pair of abrasive tools on the abrasive tool mount in the second direction Move to be converted from the first transfer channel to the second transfer channel, or, use the grinding conversion mechanism to drive the at least one pair of grinding tools to move on the grinding tool mounting seat in the second direction to be converted from the second transfer channel to on the first transfer channel.
- the grinding tool conversion mechanism includes: a grinding tool conversion guide rail and a grinding tool conversion driving unit.
- the grinding tool conversion guide rail is arranged along the second direction for setting the grinding tool.
- the grinding tool conversion guide rail is arranged on the silicon rod processing platform along the second direction, and the at least one pair of grinding tools is mounted on the grinding tool conversion guide rail through a slider, for example.
- An abrasive tool conversion driving unit is used for driving the at least one pair of abrasive tools to move along the abrasive tool conversion guide rail.
- the grinding tool conversion driving unit includes: a moving rack, a driving gear and a driving source.
- the moving rack is arranged along the second direction and is parallel to the grinding tool conversion guide rail.
- the moving rack is fixed on the silicon rod processing platform, is set to approximately the same first direction dimension as the grinding tool conversion guide rail, and is parallel to and adjacent to the grinding tool conversion guide rail.
- the driving gear is arranged on the grinding tool mounting seat and meshes with the moving rack, so as to drive the at least one pair of grinding tools to move along the grinding tool conversion guide rail.
- the drive source is used to drive the drive gear.
- the drive gear is provided on the abrasive tool mounting seat, the drive gear is driven to rotate by a drive source, and the gear teeth of the drive gear mesh with the moving rack, conforming to the The moving rack travels, whereby at least one pair of abrasives connected to the drive gear produces a corresponding movement on the abrasive transition rails.
- the grinding tool conversion drive unit may be disposed on the grinding tool mounting seat, and includes a moving screw and a driving source, wherein the moving screw is disposed along the second direction and is connected with the at least A pair of abrasive tools is associated, and the driving source is used to drive the moving screw to rotate so as to make the associated at least one pair of abrasive tools move along the abrasive tool conversion guide rail.
- the abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool of the at least one pair of abrasive tools to move in the second direction
- the abrasive tool conversion mechanism is used to drive the at least one pair of abrasive tools to move along the second direction. It is converted between the first transfer channel and the second transfer channel in the second direction. Therefore, in some embodiments, the grinding tool advancing and retreating mechanism and the grinding tool converting mechanism can be combined into one, that is, a set of The driving mechanism realizes the functions of the grinding tool advancing and retreating mechanism and the grinding tool converting mechanism.
- the grinding tool in the at least one pair of grinding tools is driven by the grinding tool advancing and retracting mechanism of the grinding tool to move in the second direction, so as to determine the grinding tool.
- the feed amount for grinding the grinding surface of the tool and the silicon rod, the at least one pair of grinding tools is driven by the grinding tool traveling mechanism to move along the horizontal line until the entire silicon rod is passed through, and the grinding tool traveling mechanism can also drive the grinding tool if necessary.
- At least one pair of abrasive tools reciprocates along the horizontal line to ensure sufficient grinding of the silicon rod in the length direction.
- the feed amount for grinding the grinding surface In the embodiment shown in FIG. 1 and FIG.
- At least one pair of the abrasives is disposed opposite to each other along the second direction, and the grinding surfaces of the at least one pair of abrasives are located in opposite vertical planes , wherein the vertical plane is perpendicular to the horizontal line, and when grinding the silicon rod (the cut silicon rod 102 shown in FIG. 3 ), the grinding wheel advancing and retreating mechanism is used to drive the at least one pair of grinding tools. At least one grinding tool moves up and down along the second direction to adjust the feed amount, so as to grind the left and right sides of the silicon rod along the second direction.
- the silicon rod grinding device can also be used to perform a chamfering operation on the silicon rod.
- any one of the at least one pair of grinding tools includes a rough grinding wheel and a fine grinding wheel nested in each other, and the silicon rod can be chamfered by the fine grinding wheel.
- the silicon rod grinding device further includes a chamfering device
- the chamfering device further includes at least a pair of chamfering grinders and a chamfering grinder advancing and retreating mechanism.
- Each chamfering grinder in the at least one pair of chamfering grinders is arranged adjacent to the grinder, and two chamfering grinders in the at least one pair of chamfering grinders are oppositely arranged on the grinder installation On the seat, the grinding surfaces of the at least one pair of chamfering grinders are located in opposite vertical planes, that is, the grinding surfaces of the two chamfering grinders in the at least one pair of chamfering grinders are respectively located in the first vertical plane. face inward and second vertical face inward.
- the chamfering grinder includes a chamfering grinding wheel and a rotating motor connected to the chamfering grinding wheel.
- the chamfering grinding wheel has a certain particle size and roughness, and the two oppositely arranged chamfering grinding wheels in the at least one pair of chamfering grinding tools are respectively provided to the two symmetrical grinding surfaces of the clamped silicon rod, in some embodiments , the chamfering grinding wheel is circular. Since the chamfering grinder is used to chamfer the edge of the silicon rod, the amount of grinding required for the edge of the silicon rod is smaller than that of the side surface of the silicon rod.
- the chamfering grinding wheel used as a chamfering grinder The size of the can be set to be smaller than the size of the rough grinding wheel as a rough grinding tool (or the fine grinding wheel as a fine grinding tool).
- the chamfering grinding wheel is formed by the consolidation of abrasive grains and a binding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground.
- the chamfering grinding wheel has a certain size and density of abrasive grains, and at the same time, the chamfering grinding wheel has pores.
- the abrasive of the chamfering grinding wheel can be set to abrasive grains whose hardness is greater than that of silicon material, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods.
- the rotating motor is connected with the chamfering grinding wheel through a rotating shaft, and is used for driving the chamfering grinding wheel to rotate at a predetermined rotational speed.
- the chamfering grinder advancing and retracting mechanism is used to drive at least one chamfering grinder of the at least one pair of chamfering grinders to move in the second direction.
- the chamfering grinder advancing and retreating mechanism controls at least one chamfering grinder in the at least one pair of chamfering grinders to move along the second direction, so as to adjust one of the two chamfering grinders in the at least one pair of chamfering grinders.
- the relative distance between them in the second direction, and then controlling the feed amount during the grinding process also determines the grinding amount.
- the chamfering grinder in the at least one pair of chamfering grinders is driven by the chamfering grinder advancing and retracting mechanism of the chamfering grinder.
- the grinding tool moves in the second direction to determine the feed amount of the chamfering tool and the edge of the silicon rod.
- the silicon rod is driven by the first silicon rod holder or the second silicon rod holder to move in the first direction until the whole silicon rod is completely Through the chamfering grinding tool, if necessary, the first silicon rod holder or the second silicon rod holder can drive the silicon rod to reciprocate in the first direction to ensure that it is fully ground in the length direction of the silicon rod.
- the clamping part rotating mechanism in the silicon rod clamp or the second silicon rod clamp drives the clamping part to rotate to drive the clamped silicon rod to rotate a declination angle, and at least a pair of oppositely arranged at least one pair is driven by the chamfering tool advancing and retreating mechanism
- the chamfering grinder moves in the second direction to determine the feed amount of the chamfering grinder and the edge grinding of the silicon rod.
- At least one of the first silicon rod holder and the second silicon rod holder may be further configured with a grinding repair device for grinding the corresponding grinding tool, that is, grinding the corresponding rough grinding The rough grinding tool in the device, the finishing grinding tool in the corresponding finishing grinding device, or the rough grinding grinding tool in the corresponding rough grinding device and the finishing grinding tool in the finishing grinding device.
- a grinding repair device for grinding the corresponding grinding tool, that is, grinding the corresponding rough grinding The rough grinding tool in the device, the finishing grinding tool in the corresponding finishing grinding device, or the rough grinding grinding tool in the corresponding rough grinding device and the finishing grinding tool in the finishing grinding device.
- the grinding and repairing device includes an installation body and at least one grinding part, the installation body can be set on the silicon rod holder, the at least one grinding part is set on the installation body, and is used for for grinding the corresponding at least one grinding tool.
- the mounting body 56 of the grinding and repairing device is disposed on at least one clamping arm of the silicon rod holder, for example, the first clamping arm 213 of the first silicon rod holder 21 or the second clamping arm 213 of the second silicon rod holder 31
- the clamping arm 313 is provided with a grinding part 58 on two opposite sides of the mounting body 56 respectively.
- the fine grinding device includes a pair of fine grinding tools, and the opposite pair of fine grinding tools are arranged along the second direction. Move to the outside of the grinding part, and drive the silicon rod holder to move along the horizontal line to make the two repair parts on both sides of the installation body reciprocate along the first direction. In this state, a pair of The refining abrasives approach (eg, along the second direction) the dressing portion toward each other to contact the surface of the dressing portion to achieve grinding.
- the grinding part can be, for example, a whetstone.
- the whetstone is, for example, diamond whetstone, boron carbide whetstone, refined whetstone, common whetstone, and the like.
- the whetstone can adjust the surface of the grinding tool in contact with the grain size of the whetstone surface. In the grinding process, the surface of the whetstone contacts the grinding tool, and the surface of the grinding tool is trimmed to a uniform particle size and the flatness and verticality of the grinding tool plane are improved.
- the silicon rod grinding device further includes a cooling device to cool the at least one pair of grinding tools, reduce the damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and use of the grinding wheel. life.
- the cooling device includes a cooling water pipe, a guide groove and a guide hole.
- the outer periphery of the grinding wheel is provided with a protective cover for placing cooling water into the rotary drive motor of the grinding wheel.
- One end of the cooling water pipe is connected to the cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel.
- the guide groove is arranged on the protective cover as a contact point between the protective cover and the cooling water pipe, and the guide hole is provided in the cooling tank.
- the coolant of the cooling device can be common cooling water.
- the cooling water pipe is connected to the cooling water source.
- the cooling water pumped through the cooling water pipe is directed to the guide grooves and guide holes on the surface of the grinding wheel, and is guided directly to the grinding wheel and the ground silicon rod.
- the contact surface of the grinding wheel is cooled.
- the cooling water from the rotating guide hole of the grinding wheel enters the interior of the grinding wheel by centrifugal action for sufficient cooling.
- the integrated silicon rod cutting and grinding machine further includes a silicon rod transfer device, which is arranged at the loading area of the silicon rod processing platform and is used for transferring the silicon rod to be processed to the silicon rod The first processing location of the processing platform.
- the silicon rod transfer device can move the silicon rod to be processed from the loading area to the first processing area and can make the silicon rod complete the centering operation before the cutting operation.
- the silicon rod cutting and grinding integrated machine includes a silicon rod transfer device, and the silicon rod transfer device includes: a silicon rod bearing structure, a centering adjustment mechanism, and a feeding drive mechanism.
- the silicon rod supporting structure is used to carry the silicon rod to be processed.
- the silicon rod supporting structure is used to carry the silicon rod to be processed.
- the silicon rod carrying structure 71 includes a carrying base and a first loading part and a second loading part oppositely arranged along the second direction, wherein the first loading part and the second loading part cooperate to use
- each of the first loading part and the second loading part can be provided with a plurality of rollers arranged in the first direction, so that a row of rollers on the first loading part and the second loading part A row of rollers on the upper part is used to carry the silicon rods together.
- the silicon rod supporting structure may be, for example, a plate-like structure as a whole, such as a rectangular supporting plate, the rectangular supporting plate may be provided with a certain arc or a depression, and the rectangular supporting plate may There are pillow strips, which can be made of flexible materials, such as rubber, acrylic, plastic, etc., in order to protect the loaded silicon rods.
- the silicon rod transfer device disclosed in the present application can adjust the position of the silicon rod carried by the silicon rod carrying structure through the centering adjustment structure, so that the axis line of the silicon rod corresponds to the predetermined center line.
- the centering operation specifically refers to making the axis line of the silicon rod and the clamping center line of the first silicon rod holder or the second silicon rod holder on the same straight line, that is, the The axis line coincides with the clamping center line of the first silicon rod holder or the second silicon rod holder.
- the first silicon rod holder is the same as the second silicon rod holder, and the clamping centerline of the first silicon rod holder and the clamping centerline of the second silicon rod holder are in the direction of the re-perpendicular line Consistent.
- the first silicon rod holder and the second silicon rod holder may be different, and the clamping center line of the first silicon rod holder and the clamping center line of the second silicon rod holder are on the heavy vertical line inconsistent in direction.
- the clamping centerline of the first silicon rod holder (or the clamping centerline of the second silicon rod holder) can be pre-determined, and based on the clamping centerline of the first silicon rod holder
- the center line (or the clamping center line of the second silicon rod holder) determines a predetermined center line, wherein the predetermined center line and the clamping center line of the first silicon rod holder (or the clamping center line of the second silicon rod holder) centerline) are the same in the direction of the re-perpendicular line (ie, the height is the same).
- the centering adjustment mechanism is used to adjust the position of the silicon rod to be processed so that its axis line corresponds to the predetermined center line, and is used to adjust the position of the silicon rod to be processed in the direction of the heavy vertical line So that its axis line is consistent with the predetermined center line in the direction of the heavy vertical line.
- the centering adjustment mechanism includes a vertical lifting mechanism for driving the silicon rod bearing structure and the silicon rods it carries to perform vertical lifting and lowering motions So that the axis line of the silicon rod is aligned with the predetermined center line in the direction of the heavy vertical line.
- the vertical lift mechanism as the centering adjustment mechanism further comprises: a vertical lift guide rail, a sliding block, and a vertical lift drive unit.
- the vertical lift driving unit is used for driving the silicon rod supporting structure to move up and down along the vertical lift guide rail.
- the above-mentioned vertical lift drive unit includes a drive motor and a lead screw assembly driven by the drive motor.
- the drive motor can be arranged on the installation structure, and the lead screw assembly is connected to the drive motor and the bearing base in the silicon rod bearing structure.
- the drive motor drives the connected lead screw assembly to rotate in the forward direction, and then drives the silicon rod bearing structure to move up along the vertical lift guide rail, or the drive motor drives the connected
- the screw assembly rotates in the opposite direction, and then drives the silicon rod bearing structure to perform a descending action along the vertical lifting guide rail.
- the vertical lift drive unit may also include a drive motor and a rack and pinion drive assembly driven by the drive motor, wherein , the rack and pinion transmission assembly may include a driving gear and a lifting rack, the driving motor may be arranged on the installation structure, the lifting rack is arranged in the direction of the heavy vertical line and is connected with the bearing base of the silicon rod bearing structure, The drive gear meshes with the lift rack and is controlled by the drive motor.
- the rack and pinion transmission assembly may include a driving gear and a lifting rack
- the driving motor may be arranged on the installation structure
- the lifting rack is arranged in the direction of the heavy vertical line and is connected with the bearing base of the silicon rod bearing structure
- the drive gear meshes with the lift rack and is controlled by the drive motor.
- the drive motor drives the drive gear to rotate in the forward direction, and then drives the lift rack and its connected silicon rod supporting structure to move up along the vertical lift guide rail, or , the drive motor drives the drive gear to rotate in the reverse direction, and then drives the lift rack and its connected silicon rod bearing structure to perform a descending action along the vertical lift guide rail.
- the vertical lift mechanism includes: a vertical lift guide rod and a vertical lift drive unit.
- the vertical lift guide rod can be arranged on the bearing base of the silicon rod carrying structure along the direction of the heavy vertical line.
- the silicon rod transfer device further includes a mounting structure, and the vertical lift guide rod is arranged on the mounting structure. on and through the carrier base of the silicon rod carrier structure.
- the number of the vertical lifting guide rods can be multiple, for example, the vertical lifting guide rods can be four, corresponding to The four corners of the bearing base in the silicon rod bearing structure.
- the number of vertical lift guide rods can also be other, for example, three, five, six, or more, taking three as an example, the three vertical lift guide rods can be arranged in the form of an isosceles triangle, for example , taking five as an example, the five vertical lift guide rods can be based on the layout of the aforementioned four vertical lift guide rods, and another vertical lift guide rod can be added in the central area, and so on.
- the vertical lift driving unit is used for driving the silicon rod supporting structure to move up and down along the vertical lift guide rod.
- the above-mentioned vertical lift drive unit includes a drive motor and a lead screw assembly driven by the drive motor.
- the drive motor can be arranged on the installation structure, and the lead screw assembly is connected to the drive motor and the bearing base in the silicon rod bearing structure.
- the drive motor drives the connected lead screw assembly to rotate in the forward direction, and then drives the silicon rod supporting structure to move up along the vertical lift guide rod, or the drive motor drives the connection
- the screw assembly rotates in the opposite direction, and then drives the silicon rod bearing structure to perform a downward movement along the vertical lifting guide rod.
- the vertical lift drive unit may also include a drive motor and a rack and pinion drive assembly driven by the drive motor, wherein , the rack and pinion transmission assembly may include a driving gear and a lifting rack, the driving motor may be arranged on the installation structure, the lifting rack is arranged in the direction of the heavy vertical line and is connected with the bearing base of the silicon rod bearing structure, The drive gear meshes with the lift rack and is controlled by the drive motor.
- the rack and pinion transmission assembly may include a driving gear and a lifting rack
- the driving motor may be arranged on the installation structure
- the lifting rack is arranged in the direction of the heavy vertical line and is connected with the bearing base of the silicon rod bearing structure
- the drive gear meshes with the lift rack and is controlled by the drive motor.
- the drive motor drives the drive gear to rotate in the forward direction, and then drives the lift rack and its connected silicon rod bearing structure to move up along the vertical lift guide rod
- the driving motor drives the driving gear to rotate in the opposite direction, and then drives the lifting rack and its connected silicon rod supporting structure to perform a downward movement along the vertical lifting guide rod.
- the vertical lift drive unit may further include an auxiliary lift assembly
- the auxiliary lift assembly further includes a cylinder and a lift rod connected to the cylinder, wherein the cylinder may be arranged on the installation structure, and the lift rod is connected to the cylinder.
- the association between the lifting mandrel and the bearing base in the silicon rod bearing structure can be implemented in various ways.
- the lifting mandrel is connected to the bearing base, and in another The lifting top rod is kept in contact with the bearing base. In this way, when the vertical lift drive unit is used, the adjusted auxiliary lift assembly can assist the carrying base to perform the lifting action along the vertical lift guide rod, thereby ensuring the stability of the carrying base in the lifting action.
- the axis line of the silicon rod can be aligned with the predetermined center line. Aligned in the direction of the heavy vertical line, wherein the predetermined center line can be obtained according to the clamping center of the first silicon rod holder or the clamping center of the second silicon rod holder.
- the predetermined center line is also determined (if the clamping center line of the first silicon rod clamp and the clamping center line of the second silicon rod clamp If the vertical line direction is inconsistent, it may include a first predetermined center line corresponding to the clamping center line of the first silicon rod holder and a second predetermined center line corresponding to the clamping center line of the second silicon rod holder). In this way, when using the vertical lifting mechanism, in order to ensure the lifting value of the silicon rod carried by the driving silicon rod bearing structure in the direction of the heavy vertical line, it is also necessary to determine the current size of the silicon rod in the direction of the heavy vertical line or the size of the silicon rod.
- the centering adjustment mechanism further includes a height detector for detecting the position information of the axis line of the silicon rod carried by the silicon rod supporting structure in the direction of the heavy vertical line.
- the silicon rod transfer device further includes a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that the silicon rod is located in the center area of the silicon rod supporting structure in the first direction .
- the silicon rod transfer device may further include a centering adjustment mechanism 73
- the centering adjustment mechanism 73 may include: a bracket 731, an adjustment guide rail 733 arranged on the bracket, relatively arranged on both sides of the bracket and capable of The two ejectors 735 that move relatively on the adjustment guide rail and the ejection drive unit, wherein the adjustment guide rail 733 is arranged along the first direction, and the two ejection members 735 are arranged on the adjustment guide rail and are respectively arranged opposite to each other.
- the ejector drive unit further includes a bidirectional screw and a drive source, wherein the bidirectional screw is arranged along the first direction and two ejectors are screwed at both ends, and the drive source is connected to the drive source.
- the two-way screw connection is used to drive the two-way screw to rotate so that the two ejectors 735 move toward each other or move toward each other along the first direction.
- the driving source drives the bidirectional screw to rotate in the forward direction, so that the two ejectors are along the adjusting guide rail (the adjusting guide rail is arranged along the first direction) Move toward each other to perform the closing action, or make the driving source drive the two-way screw to rotate in the opposite direction, so that the two ejectors move opposite to each other along the adjusting guide rail (the adjusting guide rail is arranged along the first direction) to perform the closing operation.
- the control source may be, for example, a servo motor.
- the centering adjustment mechanism further includes a height detector for detecting the position information of the axis line of the silicon rod carried by the silicon rod supporting structure in the direction of the heavy vertical line.
- the centering adjustment mechanism includes a height detector, and the height detector is configured on the centering adjustment mechanism.
- a height detector is arranged on the adjustment guide rail of the centering adjustment mechanism, which can be controlled by a control source (eg, a servo motor) to perform movement along the vertical direction and the first direction and/or the second direction.
- the height detector may be, for example, a touch sensor or a ranging sensor.
- the touch sensor has a probe head for making contact with a silicon rod.
- the probe head of the contact sensor can also be provided with a telescopic spring. When the probe head contacts the silicon rod, it can retreat under the drive of the telescopic spring, which can be used to protect the probe head and avoid detection. The head is damaged by hard touching or pressing.
- the height of the silicon rod can be obtained after multi-point detection of the silicon rod, and then the position information of the axis line of the silicon rod in the direction of the heavy vertical line can be obtained, so as to facilitate the subsequent use of centering.
- the adjustment mechanism adjusts accordingly.
- the silicon rod transfer device also includes a silicon rod clamping mechanism, the silicon rod clamping mechanism is arranged on the silicon rod carrying structure, and is used for clamping the silicon rod carried by the silicon rod carrying structure, and makes the axial center of the silicon rod.
- the line corresponds to the centerline of the silicon rod carrying structure.
- the silicon rod clamping mechanism includes: a clamp mounting member and a silicon rod clamping member.
- the silicon rod clamping mechanism 75 includes a clamp mounting member 751 and a silicon rod clamping member 753 .
- the fixture mounting member 751 is disposed on the silicon rod supporting structure 71 along the first direction.
- the silicon rod clamping member 753 is arranged on the clamping member 751 .
- each silicon rod clamping member may further include: a clamping arm mounting seat, two clamping arms, and a clamping arm driving mechanism.
- the clamping arm mounting seat is arranged on the clamp mounting member, and the two clamping arms are movably arranged on the clamping arm mounting seat and are oppositely arranged along the second direction, and the clamping arm driving mechanism is used for to drive the two clamping arms to open and close.
- the clamping arms in the two silicon rod clamping members in the silicon rod clamping mechanism are released, and the silicon rod to be processed is located in each silicon rod.
- the clamping arm driving mechanism in the silicon rod clamping piece is used to drive the two clamping arms for clamping action, so that the silicon rod is clamped. clamped.
- the clamp arm driving mechanism may include: an opening and closing gear disposed on the clamp arm mounting seat; two racks, each of which is associated with a corresponding clamp arm and is associated with the opener
- the closing gear is meshed;
- the driving source is associated with the opening and closing gear, and is used to drive the opening and closing gear to rotate.
- two racks are arranged in parallel, and the opening and closing gear is located between the two racks, and the side of the rack facing the opening and closing gear is provided with teeth.
- the drive source may be, for example, a servo motor.
- the opening and closing gear is driven by the driving source to rotate in the forward direction, thereby driving the two racks meshing with the opening and closing gears and their associated gears.
- the two clamping arms move toward each other to perform the clamping action, or the driving source drives the opening and closing gear to rotate in the opposite direction, which in turn drives the two racks meshing with the opening and closing gear and the two associated clamping arms to move back to open. action.
- clamping arm driving mechanism is not limited to this.
- the clamping arm driving mechanism can still make other changes.
- the clamping arm driving mechanism can also use a screw adjustment mechanism, a chain Conveying mechanism, or double-speed chain mechanism, etc.
- At least one silicon rod clamping member in the at least two silicon rod clamping members is provided with a spacing adjustment driving mechanism for driving the at least one silicon rod clamping member along the The clamp mount moves to adjust the spacing of the at least two silicon rod clamps.
- the at least two silicon rod clamps are motor-driven chain conveyor mechanisms.
- the chain conveying mechanism includes: an endless chain and a sprocket for driving the endless chain.
- the endless chain is arranged along the first direction, and two ends of the endless chain are respectively provided with sprockets, the teeth of the sprockets are engaged with the chain, and drive the chain to run when rotating.
- One of the two sprockets is used as the drive sprocket, the drive sprocket can be dynamically coupled to the motor shaft, that is, the power output shaft, and the drive sprocket meshes with the sprockets of the two endless chains, and is then driven by the drive.
- the motor controls the conveying speed of the chain, that is, the speed at which the at least one silicon rod clamping piece on the fixture mounting piece moves can be controlled.
- the distance adjustment driving mechanism may also be configured as a double-speed chain mechanism, a transmission belt mechanism, or the like.
- the silicon rod transfer device further includes a feeding driving mechanism, which is used to drive the silicon rod carrying structure and the silicon rod to be processed to be carried along the second direction to move from the loading position to the first processing position.
- the feeding drive mechanism is arranged below the silicon rod bearing structure, and includes: a feeding guide rod or a feeding guide rail, and a feeding driving unit, wherein the feeding guide rod or the feeding guide rail is arranged along the second direction for The silicon rod bearing structure is provided, and the feed guide rod or the feed guide rail is arranged across the machine base along the second direction.
- the feeding and driving unit is used to drive the silicon rod supporting structure to move along the feeding guide rod or the feeding guide rail.
- the feeding and driving unit includes: a driving motor and a second A lead screw assembly arranged in a direction and driven by a drive motor, the drive motor can be arranged at one end of the lead screw assembly, and the lead screw assembly is controlled by the drive motor and is screwed with the silicon rod bearing structure.
- the lead screw assembly is driven by the drive motor to rotate in the forward direction, and then the silicon rod bearing structure connected with the lead screw assembly is driven along the feeding guide rod or the feeding guide rail (along the first Two directions) move toward the first processing area, or, the drive motor drives the screw assembly to rotate in the opposite direction, and then drives the silicon rod supporting structure connected with the screw assembly along the feed guide rod or feed guide rail (in the second direction). ) moves towards the loading and unloading area, so that the silicon rods carried by the silicon rod carrying structure are transferred between the loading and unloading area and the first processing area.
- the silicon rod transfer device further includes a crystal line detection unit for performing crystal line detection on the silicon rod to be processed to determine the crystal line position of the silicon rod.
- the crystal wire detection unit 77 can be arranged on the silicon ingot supporting structure or the silicon ingot clamping mechanism. Taking the silicon ingot clamping mechanism as an example, the crystal wire detection unit 77 can be arranged on the silicon ingot clamping mechanism.
- the specific operation process may roughly include: the silicon rod carrying structure is located at the initial position of the loading and unloading area, and the silicon rod to be processed is placed on the silicon rod carrying structure;
- the adjusting mechanism adjusts the position of the silicon rod to be processed in the first direction so that the silicon rod is located in the central area of the silicon rod supporting structure in the first direction, and at the same time, the silicon rod clamping mechanism is used to clamp the silicon rod
- the silicon rod carried by the rod bearing structure makes the axis line of the silicon rod correspond to the center line of the silicon rod bearing structure;
- the silicon rod is detected by a height detector, and it is obtained that the axis line of the silicon rod is in the direction of the heavy vertical line
- the position information of the axis line of the silicon rod in the direction of the heavy vertical line and the clamping center line of the first silicon rod holder or the second silicon rod holder at the first processing location in the direction of the heavy vertical line position information determine the difference between the two, and use the vertical
- the line detection unit performs crystal line detection on the silicon rod to determine the crystal line position of the silicon rod. According to the determined crystal line position of the silicon rod, the first silicon rod clamp or the second silicon rod clamp adjusts the clamped silicon rod in place. , complete the loading of silicon rods.
- the integrated silicon rod cutting and grinding machine further includes a silicon rod unloading device, which is arranged in the workpiece unloading area of the silicon rod processing platform, and is used for removing the ground silicon rod from the silicon rod.
- the processing platform is unloaded.
- the direction and position of the silicon rod unloading device can be determined by the positional relationship of the workpiece unloading area.
- the workpiece unloading areas are disposed adjacent to each other along the first direction.
- the silicon rod unloading device can be disposed along the first direction, and is connected to the silicon rod grinding device, so that the silicon rod can be After being ground, the ground silicon rod is transported out in the first direction.
- the number of the silicon rod unloading devices can also be determined according to the number, structure or working mode of the silicon rod grinding devices or the transfer channels in the integrated silicon rod cutting and grinding machine, for example, in the embodiment shown in FIG. 1 and FIG. 3 . middle,
- the silicon rod grinding device can be switched between different transfer channels and perform grinding operations on the silicon rods on the different transfer channels.
- the silicon rod unloading devices can be set to two corresponding to the transfer channels, and each silicon rod unloading device is connected to one transfer channel, so that each silicon rod unloading device can be connected to the corresponding transfer channel.
- the silicon rod is unloaded, or, in another embodiment, as shown in the silicon rod cutting device and the silicon rod grinding device, only one silicon rod unloading device is provided, and the silicon rod unloading device can be used for example by an unloading conversion mechanism.
- the transfer channel and the second transfer channel are switched, so that the silicon rod unloading device can unload the silicon rods on different transfer channels.
- the silicon rod unloading device may employ a silicon rod conveying device.
- the silicon rod conveying device can be, for example, a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.
- the silicon rod conveying mechanism includes: a conveying part for carrying the silicon rod; and a conveying driving source for driving the conveying part to move to convey the silicon rod.
- the conveying part can be arranged along a first direction, and is driven by the conveying driving source to convey the carried silicon rods along the first direction.
- the moving direction of the conveying part may be set to be toward the workpiece unloading area, so as to transport the carried silicon rods to the workpiece unloading area.
- the conveying driving source is, for example, a motor, which is used to drive the conveying part to move and control the conveying speed of the conveying part.
- the conveying part in order to prevent the silicon rods from being worn due to collision during the conveying process, in some embodiments, is provided with a buffer pad for contacting the silicon rods, or the conveying part is Made of cushioning material.
- the cushioning pad or cushioning material is, for example, elastic rubber, silica gel, or other materials with elastic deformation, damping properties or cushioning properties, so as to reduce the risk of damage of the silicon rod being transported.
- the silicon rod unloading device may employ a silicon rod pinch device.
- the silicon rod clamping device includes: a clamping part for clamping the silicon rod; and a conveying driving source for driving the clamping part to move to convey the silicon rod.
- the clamping portion may be disposed along the first direction for clamping two end faces of the silicon rod, and transporting the carried silicon rod along the first direction under the driving of the conveying driving source.
- the conveying driving source is, for example, a motor, which is used to drive the gripping part to move and control the conveying speed of the gripping part.
- the silicon rod cutting and grinding integrated machine disclosed in this application integrates a silicon rod cutting device and a grinding device, and the silicon rod cutting device and the grinding device are respectively arranged in the first processing area and the second processing area of the silicon rod processing platform, A first transfer device and a second transfer device are provided that penetrate the first processing area and the second processing area at the same time, and the silicon rod clamp and the driving mechanism are respectively configured for the first and second transfer devices, and the first and second transfer devices are controlled by coordination.
- the transfer device, the silicon rod cutting device and the grinding device make the silicon rod cutting device located in the first processing area and the grinding device located in the second processing area in the working state at the same time, so as to complete the multi-process of squaring and grinding the silicon rod It can improve the production efficiency and the quality of product processing operations.
- the first silicon rod is placed on the silicon rod transfer device 7 located at the loading and unloading area.
- the first silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the first silicon rod is clamped by the first silicon rod holder 2 located on the first transfer channel in the first processing area to complete the loading.
- the axis line of the first silicon rod and the clamping center line of the first silicon rod holder 2 are on the same straight line.
- the silicon rod cutting device 4 is located on the first transfer channel
- the silicon rod grinding device 5 is located on the second transfer channel.
- the first silicon rod holder 2 and the first silicon rod held by it are driven to move along the first direction, so that the silicon rod cutting device 4 performs the cutting operation on the first silicon rod.
- the first silicon rod is cut by the silicon rod cutting device, the first silicon rod is first cut by two parallel cutting wire saws formed in the silicon rod cutting device, so that the first silicon rod is cut for the first time.
- the two opposite side cut planes are cut, remove the edge skin left by the cutting, drive the first silicon rod holder to return to the initial position along the first direction, and use the first silicon rod holder to rotate the first silicon rod 90° to adjust the cutting Continue to drive the first silicon rod clamp and the first silicon rod held by it to move in the first direction, so that the silicon rod cutting device cuts the remaining two side sections of the first silicon rod, and removes the remaining two sides of the cutting.
- the edge skin is formed to form a silicon rod with a rectangular cross-section, and the square of the silicon rod is completed.
- the silicon rod cutting device 4 is switched from the first transfer channel to the second channel and the silicon rod grinding device 5 is switched from the second transfer channel to the first channel.
- the second silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the second silicon rod is clamped by the second silicon rod holder 3 located on the second transfer channel in the first processing area to complete the loading.
- the axis line of the second silicon rod and the clamping center line of the second silicon rod holder 3 are on the same straight line.
- the grinding operation includes a rough grinding operation and a fine grinding operation.
- the first silicon rod is first subjected to the rough grinding operation by the rough grinding tool in the silicon rod grinding device, and then the silicon rod grinding device is used for rough grinding.
- the fine grinding tool in the first silicon rod performs fine grinding work.
- the grinding operation includes a rough grinding operation, a fine grinding operation, and a chamfering operation.
- the first silicon rod is roughly ground by the rough grinding tool in the silicon rod grinding device, and then the first silicon rod is finely ground by the fine grinding tool in the silicon rod grinding device.
- the fine grinding tool or the chamfering tool in the rod grinding device performs the chamfering operation on the first silicon rod.
- the second silicon rod holder 3 and the second silicon rod held by it are driven to move in the first direction, so that the silicon rod cutting device 4 cuts the second silicon rod to form a silicon rod with a rectangular cross-section. Complete the square of the silicon rod.
- the third silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the third silicon rod is clamped by the first silicon rod holder located on the first transfer channel in the first processing area to complete the loading.
- the second silicon rod holder 3 and the second silicon rod held by it are driven to move in the first direction, so that the silicon rod grinding device 5 is used to grind the second silicon rod.
- the first silicon rod holder 2 and the third silicon rod held by it are driven to move in the first direction, so that the silicon rod cutting device 4 performs the cutting operation on the third silicon rod.
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Abstract
An integrated silicon rod cutting-grinding machine. A silicon rod cutting device (4) and a silicon rod grinding device (5) are respectively arranged in a first processing area and a second processing area on a silicon rod processing platform. A first transfer device (2) and a second transfer device (3) pass simultaneously through the first processing area and the second processing area. The first transfer device and the second transfer device are respectively equipped with a silicon rod clamp and a driving mechanism. The first transfer device, the second transfer device, the silicon rod cutting device and the silicon rod grinding device are controlled in a coordinated fashion such that the silicon rod cutting device in the first processing area and the silicon rod grinding device in the second processing area are both in a working state at the same moment. Silicon rods are squared and ground in an integrated operation of multiple processes, and the productivity and the product processing quality are improved.
Description
本申请涉及硅工件加工技术领域,特别是涉及一种硅棒切磨一体机。The present application relates to the technical field of silicon workpiece processing, in particular to an integrated machine for cutting and grinding silicon rods.
目前,随着社会对绿色可再生能源利用的重视和开放,光伏太阳能发电领域越来越得到重视和发展。光伏发电领域中,通常的晶体硅太阳能电池是在高质量硅片上制成的,这种硅片从提拉或浇铸的硅锭后通过多线锯切割及后续加工而成。At present, with the attention and opening of the society to the utilization of green and renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, common crystalline silicon solar cells are fabricated on high-quality silicon wafers, which are cut and subsequently processed by a multi-wire saw from a pulled or cast silicon ingot.
现有硅片的制作流程,以单晶硅产品为例,一般地,大致的作业工序可包括:先使用硅棒截断机对原初的长硅棒进行截断作业以形成多段短硅棒;截断完成后,又使用硅棒开方机对截断后的短硅棒进行开方作业后形成呈矩形状的切割后硅棒;再对各个切割后硅棒进行磨面、倒角等加工作业,使得硅棒的表面整形达到相应的平整度及尺寸公差要求;后续再使用切片机对硅棒进行切片作业,则得到单晶硅片。The existing manufacturing process of silicon wafers, taking monocrystalline silicon products as an example, generally, the rough operation process can include: first, use a silicon rod cutting machine to cut off the original long silicon rods to form multi-section short silicon rods; After that, the cut-off short silicon rods are squared by a silicon rod squarer to form rectangular cut silicon rods; The surface shaping of the rod meets the corresponding flatness and dimensional tolerance requirements; the silicon rod is then sliced with a slicing machine to obtain a single crystal silicon wafer.
不过,在一般情形下,在相关技术中,每个工序作业(例如开方切割、磨面、倒角等)所需的作业是独立布置,相应的加工装置分散在不同的生产单位或生产车间或生产车间的不同生产区域,执行不同工序作业的工件的转换需要进行搬运调配,且在执行每一工序作业之前可能都需要进行预处理工作,这样,工序繁杂,效率低下,且易影响硅棒加工作业的品质,需更多的人力或转运设备,安全隐患大,另外,各个工序的作业设备之间的流动环节多,在工件转移过程中提高了工件损伤的风险,易产生非生产因素造成的不合格,降低了产品的合格率及现有的加工方式所带来的不合理损耗,是各个公司面临的重大改善课题。However, in general, in the related art, the operations required for each process operation (such as square cutting, grinding, chamfering, etc.) are arranged independently, and the corresponding processing devices are scattered in different production units or production workshops Or in different production areas of the production workshop, the conversion of workpieces that perform different processes needs to be transported and deployed, and pre-processing may be required before each process is performed, so the process is complicated, low in efficiency, and easy to affect the silicon rod. The quality of the processing operation requires more manpower or transfer equipment, and there are great potential safety hazards. In addition, there are many flow links between the operation equipment of each process, which increases the risk of workpiece damage during the workpiece transfer process, and is prone to non-production factors. It reduces the qualified rate of products and the unreasonable loss caused by the existing processing methods, which is a major improvement problem faced by each company.
发明内容SUMMARY OF THE INVENTION
鉴于以上所述相关技术的不足,本申请的目的在于提供一种硅棒切磨一体机及硅棒切磨方法,用于解决现有相关技术中存在的各个工序作业间效率低下及硅棒加工作业效果欠佳等问题。In view of the above-mentioned deficiencies of the related art, the purpose of the present application is to provide an integrated machine for cutting and grinding a silicon rod and a method for cutting and grinding a silicon rod, which are used to solve the inefficiency of each process operation and the processing of silicon rods that exist in the prior art. Poor work performance, etc.
为实现上述目的及其他相关目的,本申请公开一种硅棒切磨一体机,包括:In order to achieve the above purpose and other related purposes, the present application discloses a silicon rod cutting and grinding integrated machine, comprising:
机座,具有硅棒加工平台;所述硅棒加工平台设有第一加工区位和第二加工区位;The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing location and a second processing location;
第一转移装置,设于第一转移通道,包括第一硅棒夹具和第一转移驱动机构,所述第一转移驱动机构用于驱动所述第一硅棒夹具及其夹持的硅棒沿着第一方向移动并在第一加工区位和第二加工区位之间转移;The first transfer device, located in the first transfer channel, includes a first silicon rod holder and a first transfer drive mechanism, and the first transfer drive mechanism is used to drive the first silicon rod holder and the silicon rod edge it clamps. moving in the first direction and transferring between the first processing location and the second processing location;
第二转移装置,设于第二转移通道,包括第二硅棒夹具和第二转移驱动机构,所述第二转移驱动机构用于驱动所述第二硅棒夹具及其夹持的硅棒沿着第一方向移动并在第一加工区位和第二加工区位之间转移;A second transfer device, located in the second transfer channel, includes a second silicon rod holder and a second transfer drive mechanism, the second transfer drive mechanism is used to drive the second silicon rod holder and the silicon rod edge it holds. moving in the first direction and transferring between the first processing location and the second processing location;
硅棒切割装置,设于所述硅棒加工平台的第一加工区位处,用于对第一转移通道上由所述第一转移装置所夹持的待切割硅棒或者第二转移通道上由所述第二转移装置所夹持的待切割硅棒进行切割作业;以及The silicon rod cutting device is arranged at the first processing area of the silicon rod processing platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or on the second transfer channel. The silicon rod to be cut held by the second transfer device is cut; and
硅棒研磨装置,设于所述硅棒加工平台的第二加工区位处,用于对第一转移通道上由所述第一转移装置所夹持的切割后硅棒或者第二转移通道上由所述第二转移装置所夹持的切割后硅棒进行研磨作业。The silicon rod grinding device is arranged at the second processing area of the silicon rod processing platform, and is used for grinding the cut silicon rod clamped by the first transfer device on the first transfer channel or on the second transfer channel. The cut silicon rod held by the second transfer device is subjected to a grinding operation.
在本申请的某些实施方式中,所述第一转移装置和第二转移装置通过一安装框架设于所述硅棒加工平台的上方,或者,所述第一转移装置通过第一安装框架设于所述硅棒加工平台的上方且所述第二转移装置通过第二安装框架设于所述硅棒加工平台的上方。In some embodiments of the present application, the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, or the first transfer device is arranged through a first mounting frame Above the silicon rod processing platform and the second transfer device is arranged above the silicon rod processing platform through a second mounting frame.
在本申请的某些实施方式中,所述第一硅棒夹具包括:第一夹臂安装座;至少一对第一夹臂,沿第一方向对向设于所述第一夹臂安装座上,用于夹持硅棒的两个端面;其中,所述至少一对第一夹臂中的任一个第一夹臂设有夹持部;第一夹臂驱动机构,用于驱动至少一对第一夹臂中的至少一个第一夹臂沿着所述第一方向移动以调节所述至少一对第一夹臂之间的夹持间距。In some embodiments of the present application, the first silicon rod holder includes: a first clamping arm mounting seat; at least one pair of first clamping arms, opposite to the first clamping arm mounting seat along a first direction , for clamping the two end faces of the silicon rod; wherein, any one of the at least one pair of first clamping arms is provided with a clamping part; the first clamping arm driving mechanism is used to drive at least one At least one of the pair of first clamp arms is moved along the first direction to adjust the clamping distance between the at least one pair of the first clamp arms.
在本申请的某些实施方式中,所述第一转移驱动机构包括:第一转移导轨,沿第一方向布设,用于设置所述第一夹臂安装座;第一转移驱动单元,用于驱动所述第一夹臂安装座及其至少一对第一夹臂沿所述第一转移导轨移动。In some embodiments of the present application, the first transfer driving mechanism includes: a first transfer guide rail, arranged along a first direction, for setting the first clamp arm mounting seat; a first transfer driving unit for The first clamp arm mounting seat and at least a pair of first clamp arms are driven to move along the first transfer guide rail.
在本申请的某些实施方式中,所述第一转移驱动单元包括:移动齿轨,沿第一方向设置;驱动齿轮,设于所述第一夹臂安装座且与所述移动齿轨啮合;驱动源,用于驱动所述驱动齿轮以使所关联的第一夹臂安装座及其至少一对第一夹臂沿所述第一转移导轨移动。In some embodiments of the present application, the first transfer driving unit includes: a moving rack, arranged along a first direction; a driving gear, which is disposed on the first clamp arm mounting seat and meshes with the moving rack a drive source for driving the drive gear to move the associated first clamp arm mount and at least a pair of the first clamp arms along the first transfer guide rail.
在本申请的某些实施方式中,所述第一转移驱动单元包括:移动丝杆,沿第一方向设置且与所述第一夹臂安装座关联;驱动源,用于驱动所述移动丝杆转动以使所关联的第二夹臂安装座及其至少一对第一夹臂沿所述第一转移导轨移动。In some embodiments of the present application, the first transfer driving unit includes: a moving screw rod disposed along a first direction and associated with the first clamping arm mounting seat; a driving source for driving the moving screw The lever rotates to move the associated second clamp arm mount and its at least one pair of first clamp arms along the first transfer rail.
在本申请的某些实施方式中,所述至少一对第一夹臂为转动式结构;所述第一硅棒夹具还包括第一夹臂转动机构,所述第一夹臂转动机构设于所述至少一对第一夹臂中的至少一个第一夹臂上,用于驱动所述至少一个第一夹臂的夹持部转动。In some embodiments of the present application, the at least one pair of the first clamping arms is a rotating structure; the first silicon rod clamp further includes a first clamping arm rotating mechanism, and the first clamping arm rotating mechanism is located at At least one of the at least one pair of first clamping arms is used to drive the clamping part of the at least one first clamping arm to rotate.
在本申请的某些实施方式中,所述第二硅棒夹具包括:第二夹臂安装座;至少一对第二 夹臂,沿第一方向对向设于所述第二夹臂安装座上,用于夹持硅棒的两个端面;其中,所述至少一对第二夹臂中的任一个第二夹臂设有夹持部;第二夹臂驱动机构,用于驱动至少一对第二夹臂中的至少一个第二夹臂沿着所述第一方向移动以调节所述至少一对第二夹臂之间的夹持间距。In some embodiments of the present application, the second silicon rod holder includes: a second clamping arm mounting seat; at least a pair of second clamping arms, opposite to the second clamping arm mounting seat along a first direction , used for clamping the two end faces of the silicon rod; wherein, any second clamping arm in the at least a pair of second clamping arms is provided with a clamping part; the second clamping arm driving mechanism is used to drive at least one At least one of the pair of second clamp arms is moved along the first direction to adjust the clamping distance between the at least one pair of second clamp arms.
在本申请的某些实施方式中,所述第二转移驱动机构包括:第二转移导轨,沿第一方向布设,用于设置所述第二夹臂安装座;第二转移驱动单元,用于驱动所述第二夹臂安装座及其至少一对第二夹臂沿所述第二转移导轨移动。In some embodiments of the present application, the second transfer driving mechanism includes: a second transfer guide rail, arranged along a first direction, for setting the second clamp arm mounting seat; a second transfer driving unit, for The second clamp arm mounting base and at least a pair of second clamp arms are driven to move along the second transfer guide rail.
在本申请的某些实施方式中,所述第二转移驱动单元包括:移动齿轨,沿第一方向设置;驱动齿轮,设于所述第二夹臂安装座且与所述移动齿轨啮合;驱动源,用于驱动所述驱动齿轮以使所关联的第二夹臂安装座及其至少一对第二夹臂沿所述第二转移导轨移动。In some embodiments of the present application, the second transfer driving unit includes: a moving rack, disposed along a first direction; a driving gear, disposed on the second clamp arm mounting seat and engaged with the moving rack a drive source for driving the drive gear to move the associated second clamp arm mount and at least a pair of the second clamp arms along the second transfer guide rail.
在本申请的某些实施方式中,所述第二转移驱动单元包括:移动丝杆,沿第一方向设置且与所述第二夹臂安装座关联;驱动源,用于驱动所述移动丝杆转动以使所关联的第二夹臂安装座及其至少一对第二夹臂沿所述第二转移导轨移动。In some embodiments of the present application, the second transfer driving unit includes: a moving screw rod disposed along a first direction and associated with the second clamping arm mounting seat; a driving source for driving the moving screw The lever rotates to move the associated second clamp arm mount and its at least one pair of second clamp arms along the second transfer rail.
在本申请的某些实施方式中,所述至少一对第二夹臂为转动式结构;所述第二硅棒夹具还包括第二夹臂转动机构,所述第二夹臂转动机构设于所述至少一对第二夹臂中的至少一个第二夹臂上,用于驱动所述至少一个第二夹臂的夹持部转动。In some embodiments of the present application, the at least one pair of second clamping arms is a rotating structure; the second silicon rod clamp further includes a second clamping arm rotating mechanism, and the second clamping arm rotating mechanism is located in At least one of the at least one pair of second clamping arms is used to drive the clamping part of the at least one second clamping arm to rotate.
在本申请的某些实施方式中,所述硅棒切割装置包括:切割架;至少一线切割单元,设于所述切割架上;所述线切割单元包括:至少两个切割轮、过渡轮、以及切割线,所述切割线绕于所述至少两个切割轮及过渡轮以形成至少一切割线锯;切割转换机构,用于驱动所述切割架及其上的至少一线切割单元在第一转移通道和第二转移通道之间转换。In some embodiments of the present application, the silicon rod cutting device includes: a cutting frame; at least one wire cutting unit is provided on the cutting frame; the wire cutting unit includes: at least two cutting wheels, a transition wheel, and a cutting wire, which is wound around the at least two cutting wheels and the transition wheel to form at least one cutting wire saw; a cutting conversion mechanism for driving the cutting frame and the at least one wire cutting unit on the first Switch between the transfer channel and the second transfer channel.
在本申请的某些实施方式中,所述线切割单元包括:切割线;第一切割轮及第二切割轮,设于所述切割架,切割线绕于所述第一切割轮及第二切割轮以形成切割线锯;其中,所述第一切割轮的轮面与第二切割轮的轮面相平行或共面;第一过渡轮,邻设于所述第一切割轮,在牵引切割线的状态下令第一切割轮和第一过渡轮的切割线位于第一切割轮中用于缠绕切割线的第一切割线槽所在平面内;第二过渡轮,邻设于所述第二切割轮,在牵引切割线的状态下令第二切割轮和第二过渡轮的切割线位于第二切割轮中用于缠绕切割线的第二切割线槽所在平面内;至少一第三过渡轮,设于所述第一过渡轮及第二过渡轮之间,用于牵引所述第一过渡轮与所述第二过渡轮之间的切割线,以令所述线切割单元中形成一切割容纳空间,所述切割容纳空间可容纳所述硅棒且所述硅棒切割装置中仅有所述切割线锯与所述切割容纳空间相交。In some embodiments of the present application, the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel a cutting wheel to form a cutting wire saw; wherein the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; the first transition wheel, adjacent to the first cutting wheel, is used for cutting The state of the wire makes the cutting lines of the first cutting wheel and the first transition wheel lie in the plane of the first cutting wire groove for winding the cutting wire in the first cutting wheel; the second transition wheel is adjacent to the second cutting wheel wheel, in the state of pulling the cutting line, the cutting line of the second cutting wheel and the second transition wheel is located in the plane of the second cutting wire groove for winding the cutting line in the second cutting wheel; at least one third transition wheel, set Between the first transition wheel and the second transition wheel, it is used for pulling the cutting line between the first transition wheel and the second transition wheel, so that a cutting accommodating space is formed in the wire cutting unit , the cutting accommodating space can accommodate the silicon rod, and in the silicon rod cutting device, only the cutting wire saw intersects the cutting accommodating space.
在本申请的某些实施方式中,所述第一过渡轮、第二过渡轮、及至少一第三过渡轮用于将所述切割线牵引远离所述切割容纳空间。In some embodiments of the present application, the first transition wheel, the second transition wheel, and the at least one third transition wheel are used to draw the cutting wire away from the cutting accommodation space.
在本申请的某些实施方式中,所述切割线绕于所述第一切割轮、第二切割轮、第一过渡轮、第二过渡轮及第三过渡轮之间以形成首尾相接的闭环切割线。In certain embodiments of the present application, the cutting wire is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form an end-to-end connection Closed loop cutting line.
在本申请的某些实施方式中,所述线切割单元中包括两个第三过渡轮,其中,所述切割线顺次缠绕于所述第一切割轮、第二切割轮、第二过渡轮、一第三过渡轮、另一第三过渡轮、第一过渡轮、第一切割轮以形成首尾相接的闭环切割线。In some embodiments of the present application, the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, and the second transition wheel in sequence , a third transition wheel, another third transition wheel, a first transition wheel, and a first cutting wheel to form an end-to-end closed-loop cutting line.
在本申请的某些实施方式中,所述硅棒切割装置还包括切割线驱动装置,用于驱动所述切割线运行以对待切割硅棒进行切割。In some embodiments of the present application, the silicon rod cutting device further includes a cutting wire driving device for driving the cutting wire to run to cut the silicon rod to be cut.
在本申请的某些实施方式中,所述切割线驱动装置为电机,具有动力输出轴且所述动力输出轴轴连接于所述第一切割轮或第二切割轮。In some embodiments of the present application, the cutting wire driving device is an electric motor having a power take-off shaft, and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel.
在本申请的某些实施方式中,所述硅棒切割装置还包括:至少一调距机构,设于所述至少一线切割单元,用于驱动所述线切割单元中至少两个切割轮相对所述切割架沿垂直于切割轮轮面的方向移动。In some embodiments of the present application, the silicon rod cutting device further comprises: at least one distance adjustment mechanism, which is arranged in the at least one wire cutting unit and is used to drive at least two cutting wheels in the wire cutting unit to be opposite to each other. The cutting frame moves in a direction perpendicular to the surface of the cutting wheel.
在本申请的某些实施方式中,所述硅棒切割装置包括单线切割单元,所述调距机构包括:丝杆,沿切割轮轮面的正交方向设置且与所述单线切割单元螺纹连接;驱动源,用于驱动所述丝杆转动。In some embodiments of the present application, the silicon rod cutting device includes a single-wire cutting unit, and the distance adjustment mechanism includes: a screw rod, which is disposed along the orthogonal direction of the cutting wheel surface and is threadedly connected to the single-wire cutting unit ; Drive source for driving the screw to rotate.
在本申请的某些实施方式中,所述硅棒切割装置包括单线切割单元,所述调距机构包括:伸缩件,沿切割轮轮面的正交方向设置且与所述单线切割单元关联;驱动源,用于驱动所述伸缩件沿切割轮轮面的正交方向伸缩运动。In some embodiments of the present application, the silicon rod cutting device includes a single-wire cutting unit, and the distance adjustment mechanism includes: a telescopic element, which is arranged along the orthogonal direction of the cutting wheel surface and is associated with the single-wire cutting unit; The driving source is used to drive the telescopic element to telescopically move along the orthogonal direction of the wheel surface of the cutting wheel.
在本申请的某些实施方式中,所述硅棒切割装置包括平行且相对设置的第一线切割单元和第二线切割单元,所述第一线切割单元和第二线切割单元中的至少一者通过所述调距机构驱动沿切割轮轮面的正交方向移动。In some embodiments of the present application, the silicon rod cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, at least one of the first wire cutting unit and the second wire cutting unit It is driven to move in the orthogonal direction of the wheel surface of the cutting wheel by the distance adjustment mechanism.
在本申请的某些实施方式中,所述调距机构包括:丝杆,沿切割轮轮面的正交方向设置且与所述第一线切割单元或第二线切割单元螺纹连接;驱动源,用于驱动所述丝杆转动。In some embodiments of the present application, the distance adjustment mechanism includes: a screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected to the first wire cutting unit or the second wire cutting unit; a driving source, Used to drive the screw to rotate.
在本申请的某些实施方式中,所述调距机构包括:伸缩件,沿切割轮轮面的正交方向设置且与所述第一线切割单元或第二线切割单元关联;驱动源,用于驱动所述伸缩件沿切割轮轮面的正交方向作伸缩运动。In some embodiments of the present application, the distance adjustment mechanism includes: a telescopic element, which is arranged in the orthogonal direction of the cutting wheel surface and is associated with the first wire cutting unit or the second wire cutting unit; a driving source, which uses The telescopic element is driven to perform telescopic motion along the orthogonal direction of the wheel surface of the cutting wheel.
在本申请的某些实施方式中,所述调距机构包括:双向丝杆,沿切割轮轮面的正交方向设置且与所述第一线切割单元和第二线切割单元螺纹连接;驱动源,用于驱动所述丝杆转动 以使得所述第一线切割单元和所述第二线切割单元沿切割轮轮面的正交方向相向移动或相背移动。In some embodiments of the present application, the distance adjustment mechanism includes: a bidirectional screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected with the first wire cutting unit and the second wire cutting unit; a driving source is used to drive the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the wheel surface of the cutting wheel.
在本申请的某些实施方式中,所述切割转换机构包括:切割转换导轨,沿第二方向布设,用于设置所述切割架;所述第二方向垂直于所述第一方向;切割转换驱动单元,用于驱动所述切割架及其至少一线切割单元沿所述切割转换导轨移动。In some embodiments of the present application, the cutting conversion mechanism includes: a cutting conversion guide rail, arranged along a second direction, for setting the cutting frame; the second direction is perpendicular to the first direction; the cutting conversion The driving unit is used for driving the cutting frame and its at least one line cutting unit to move along the cutting conversion guide rail.
在本申请的某些实施方式中,所述切割转换驱动单元包括:移动齿轨,沿第二方向设置;驱动齿轮,设于所述切割架且与所述移动齿轨啮合;驱动源,用于驱动所述驱动齿轮以使所关联的切割架及其至少一线切割单元沿所述切割转换导轨移动。In some embodiments of the present application, the cutting conversion driving unit includes: a moving rack, arranged along the second direction; a driving gear, which is arranged on the cutting frame and meshes with the moving rack; for driving the drive gear to move the associated cutting frame and its at least one line cutting unit along the cutting conversion guide rail.
在本申请的某些实施方式中,所述切割转换驱动单元包括:移动丝杆,沿第二方向设置且与所述切割架关联;驱动源,用于驱动所述移动丝杆转动以使所关联的切割架及其至少一线切割单元沿所述切割转换导轨移动。In some embodiments of the present application, the cutting conversion driving unit includes: a moving screw rod, which is arranged in the second direction and is associated with the cutting frame; a driving source for driving the moving screw rod to rotate so as to make the The associated cutting carriage and its at least one line of cutting units move along the cutting transition rails.
在本申请的某些实施方式中,所述硅棒切磨一体机还包括边皮卸料装置,所述边皮卸料装置包括边皮承托机构,用于抵靠硅棒外侧并承托切割形成的边皮。In certain embodiments of the present application, the integrated silicon rod cutting and grinding machine further includes a side skin discharge device, and the edge skin discharge device includes a side skin support mechanism for abutting against the outside of the silicon rod and supporting Cut the formed hem.
在本申请的某些实施方式中,所述边皮承托机构包括:承托部;驱动单元,连接所述承托部以控制所述承托部远离或抵靠所述边皮。In some embodiments of the present application, the side panel supporting mechanism includes: a supporting part; and a driving unit connected to the supporting part to control the supporting part to move away from or abut against the side panel.
在本申请的某些实施方式中,所述承托部包括:至少两个承托块,沿所述第一方向间隔设置,具有用于接触并承载边皮的承载面。In some embodiments of the present application, the bearing portion includes: at least two bearing blocks, which are arranged at intervals along the first direction and have bearing surfaces for contacting and bearing the edge skin.
在本申请的某些实施方式中,所述承托部包括:至少两个承托杆,沿第一方向设置,用于接触并承托边皮;两个连接部,分设于所述切割架第一方向的相对两侧以对应所述至少两个承托杆的相对两端,用于连接所述至少两个承托杆并与所述驱动单元连接。In some embodiments of the present application, the supporting part includes: at least two supporting rods, arranged along the first direction, for contacting and supporting the edge skin; two connecting parts, respectively disposed on the cutting frame The opposite sides in the first direction correspond to the opposite ends of the at least two support rods, and are used for connecting the at least two support rods and the drive unit.
在本申请的某些实施方式中,所述承托部包括沿所述第一方向间隔设置的至少两个承托轮组,其中,所述承托轮组包括:至少两个承托轮,所述至少两个承托轮间隔设置,用于接触并承托边皮;承托底座,用于设置所述至少两个承托轮并与所述驱动单元连接。In some embodiments of the present application, the supporting portion includes at least two supporting wheel sets spaced along the first direction, wherein the supporting wheel set includes: at least two supporting wheels, The at least two supporting wheels are arranged at intervals for contacting and supporting the edge skin; the supporting base is used for disposing the at least two supporting wheels and connecting with the driving unit.
在本申请的某些实施方式中,所述驱动单元包括:气缸或液压泵;伸缩部,连接所述承托部,在所述气缸或液压泵驱动下伸缩运动以控制所述承托部远离或抵靠所述边皮。In some embodiments of the present application, the driving unit includes: an air cylinder or a hydraulic pump; a telescopic part, connected to the bearing part, and driven by the air cylinder or hydraulic pump to telescopically move to control the distance of the bearing part or against the edge skin.
在本申请的某些实施方式中,所述驱动单元包括:驱动电机;丝杆组件,连接所述承托部,由所述驱动电机驱动运动以控制所述承托部远离或抵靠所述边皮。In some embodiments of the present application, the driving unit includes: a driving motor; a screw assembly, connected to the bearing part, and driven to move by the driving motor to control the bearing part to move away from or against the side skin.
在本申请的某些实施方式中,所述边皮卸料装置还包括边皮错位机构,设于所述机座或硅棒切割装置,用于沿第一方向推动所述边皮以令所述边皮脱离所述边皮承托机构。In some embodiments of the present application, the edge skin unloading device further includes a edge skin dislocation mechanism, which is arranged on the machine base or the silicon rod cutting device, and is used for pushing the edge skin along a first direction to make the edge skin The edge skin is separated from the edge skin supporting mechanism.
在本申请的某些实施方式中,所述边皮错位机构包括:推顶部;气缸或液压泵,用于驱 动所述推顶部沿第一方向推顶所述边皮的伸缩杆沿第一方向设置。In some embodiments of the present application, the side skin dislocation mechanism includes: a push top; an air cylinder or a hydraulic pump for driving the push top to push a telescopic rod of the side skin along a first direction along a first direction set up.
在本申请的某些实施方式中,所述边皮卸料装置还包括边皮输送机构,用于承接切割形成的边皮并将所述边皮转运至卸料区。In some embodiments of the present application, the edge skin unloading device further includes a edge skin conveying mechanism, which is used for receiving the edge skin formed by cutting and transferring the edge skin to the discharge area.
在本申请的某些实施方式中,所述边皮输送机构包括:输送部,用于承载所述边皮;输送驱动源,用于驱动所述输送部沿第一方向运动以输送所述边皮。In some embodiments of the present application, the edge skin conveying mechanism includes: a conveying part for carrying the edge skin; a conveying driving source for driving the conveying part to move in a first direction to convey the edge skin Skin.
在本申请的某些实施方式中,所述硅棒研磨装置包括:磨具安装座;至少一对磨具,对向设置于所述磨具安装座上;磨具进退机构,用于驱动所述至少一对磨具中的至少一个磨具沿第二方向移动,其中,所述第二方向垂直于所述第一方向;磨具转换机构,用于驱动所述至少一对磨具在第一转移通道和第二转移通道之间转换。In some embodiments of the present application, the silicon rod grinding device includes: a grinding tool mounting seat; at least one pair of grinding tools, which are arranged oppositely on the grinding tool mounting seat; and a grinding tool advancing and retreating mechanism for driving the At least one abrasive tool in the at least one pair of abrasive tools moves along a second direction, wherein the second direction is perpendicular to the first direction; an abrasive tool conversion mechanism is used to drive the at least one pair of abrasive tools to move in the first direction Switch between a transfer channel and a second transfer channel.
在本申请的某些实施方式中,所述至少一对磨具中的任一个磨具包括相互嵌套的粗磨砂轮和精磨砂轮。In certain embodiments of the present application, any one of the at least one pair of abrasive tools includes a coarse grinding wheel and a fine grinding wheel that are nested in each other.
在本申请的某些实施方式中,所述粗磨砂轮嵌套于所述精磨砂轮之内,且所述粗磨砂轮和所述精磨砂轮中的至少一个设有伸缩驱动机构;或者,所述精磨砂轮嵌套于所述粗磨砂轮之内,且所述粗磨砂轮和所述精磨砂轮中的至少一个设有伸缩驱动机构。In some embodiments of the present application, the rough grinding wheel is nested inside the fine grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism; or, The fine grinding wheel is nested inside the rough grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism.
在本申请的某些实施方式中,所述磨具转换机构包括:磨具转换导轨,沿第二方向布设,用于设置所述磨具安装座;磨具转换驱动单元,用于驱动所述磨具安装座及其至少一对磨具沿所述磨具转换导轨移动。In some embodiments of the present application, the abrasive tool conversion mechanism includes: an abrasive tool conversion guide rail, arranged along the second direction, for setting the abrasive tool mounting seat; an abrasive tool conversion drive unit for driving the abrasive tool The abrasive tool mount and its at least one pair of abrasive tools move along the abrasive tool transfer rail.
在本申请的某些实施方式中,所述磨具转换驱动单元包括:移动齿轨,沿第二方向设置;驱动齿轮,设于所述磨具安装座且与所述移动齿轨啮合;驱动源,用于驱动所述驱动齿轮以使所关联的磨具安装座及其至少一对磨具沿所述磨具转换导轨移动。In some embodiments of the present application, the grinding tool conversion drive unit includes: a moving rack, arranged along the second direction; a driving gear, disposed on the grinding tool mounting seat and meshing with the moving rack; driving A source for driving the drive gear to move the associated abrasive tool mount and its at least one pair of abrasive tools along the abrasive tool transfer rail.
在本申请的某些实施方式中,所述磨具转换驱动单元包括:移动丝杆,沿第二方向设置且与所述磨具安装座关联;驱动源,用于驱动所述移动丝杆转动以使所关联的磨具安装座及其至少一对磨具沿所述磨具转换导轨移动。In some embodiments of the present application, the grinding tool conversion driving unit includes: a moving screw, which is arranged in the second direction and is associated with the grinding tool mounting seat; a driving source for driving the moving screw to rotate to move the associated abrasive tool mounting seat and at least one pair of abrasive tools along the abrasive tool conversion guide rail.
在本申请的某些实施方式中,所述硅棒研磨装置还包括:至少一对倒角磨具,对向设置于所述磨具安装座上。In some embodiments of the present application, the silicon rod grinding device further includes: at least one pair of chamfering grinding tools, which are arranged on the grinding tool mounting seat opposite to each other.
在本申请的某些实施方式中,所述第一硅棒夹具和第二硅棒夹具中任一者还包括:研磨修复装置,用于修磨对应的所述硅棒研磨装置中的至少一对磨具。In some embodiments of the present application, any one of the first silicon rod holder and the second silicon rod holder further includes: a grinding and repairing device for grinding at least one of the corresponding silicon rod grinding devices to abrasives.
在本申请的某些实施方式中,所述硅棒切磨一体机还包括:硅棒移送装置,设于所述硅棒加工平台的装载区位,用于将待加工的硅棒转移至所述硅棒加工平台的第一加工区位。In some embodiments of the present application, the integrated silicon rod cutting and grinding machine further comprises: a silicon rod transferring device, which is arranged at the loading area of the silicon rod processing platform, and is used for transferring the silicon rod to be processed to the The first processing location of the silicon rod processing platform.
在本申请的某些实施方式中,所述硅棒移送装置包括:硅棒承载结构,用于承载待加工 的硅棒;对中调节机构,用于调节所述待加工的硅棒的位置以使其轴心线与预定中心线对应;进给驱动机构,用于驱动所述硅棒承载结构及其承载的所述待加工的硅棒沿第二方向由装载区位移动至第一加工区位。In some embodiments of the present application, the silicon rod transfer device includes: a silicon rod bearing structure for carrying the silicon rod to be processed; a centering adjustment mechanism for adjusting the position of the silicon rod to be processed to The axis line is corresponding to the predetermined center line; the feeding driving mechanism is used to drive the silicon rod carrying structure and the silicon rod to be processed to be carried along the second direction to move from the loading position to the first processing position.
在本申请的某些实施方式中,所述对中调节机构包括垂向升降机构,用于驱动所述硅棒承载结构及承载的所述待加工的硅棒作垂向升降运动以使得所述待加工的硅棒的轴心线与预定中心线在垂向上对齐。In some embodiments of the present application, the centering adjustment mechanism includes a vertical lifting mechanism, which is used to drive the silicon rod supporting structure and the supported silicon rods to perform vertical lifting and lowering motions, so as to make the The axis line of the silicon rod to be processed is vertically aligned with the predetermined center line.
在本申请的某些实施方式中,所述垂向升降机构包括:垂向升降导轨,设于所述承载底座;滑块,设于所述承载部件;垂向升降驱动单元。In some embodiments of the present application, the vertical lifting mechanism includes: a vertical lifting guide rail, which is provided on the bearing base; a sliding block, which is arranged on the bearing member; and a vertical lifting driving unit.
在本申请的某些实施方式中,所述垂向升降机构包括:垂向升降导杆,用于设置所述硅棒承载结构;垂向升降驱动单元,用于驱动所述硅棒承载结构沿着所述垂向升降导杆作升降移动。In some embodiments of the present application, the vertical lift mechanism includes: a vertical lift guide rod for setting the silicon rod supporting structure; a vertical lift driving unit for driving the silicon rod supporting structure along the The vertical lift guide rod moves up and down.
在本申请的某些实施方式中,所述垂向升降驱动单元包括:驱动电机以及垂向设置且由所述驱动电机驱动的丝杆组件,或者,驱动电机以及垂向设置且由所述驱动电机驱动的齿轮齿条传动组件。In some embodiments of the present application, the vertical lift driving unit comprises: a driving motor and a screw assembly vertically arranged and driven by the driving motor, or, a driving motor and a vertically arranged and driven screw assembly Motor driven rack and pinion drive assembly.
在本申请的某些实施方式中,所述硅棒移送装置还包括居中调节机构,用于调节所述待加工的硅棒在第一方向上的位置以使其位于所述硅棒承载结构的居中区域。In some embodiments of the present application, the silicon rod transfer device further includes a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that it is located at the position of the silicon rod supporting structure. Centered area.
在本申请的某些实施方式中,所述居中调节机构包括:支架,设于所述机座或所述硅棒承载结构上;调节导轨,沿第一方向设于所述支架上;至少两个推顶件,分别设于所述支架的相对两侧;调节驱动单元,用于驱动所述至少两个推顶件沿着所述调节导轨相向移动以推顶硅棒置于所述硅棒承载结构的居中区域。In some embodiments of the present application, the centering adjustment mechanism includes: a bracket, arranged on the machine base or the silicon rod bearing structure; an adjustment guide rail, arranged on the bracket along a first direction; at least two two ejectors, respectively disposed on opposite sides of the bracket; an adjustment drive unit for driving the at least two ejectors to move toward each other along the adjustment guide rails to push the silicon rod to be placed on the silicon rod The central area of the load-bearing structure.
在本申请的某些实施方式中,所述调节驱动单元包括:驱动电机以及沿第一方向设置且由所述驱动电机驱动的丝杆组件,或者,驱动电机以及沿第一方向设置且由所述驱动电机驱动的齿轮齿条传动组件。In some embodiments of the present application, the adjustment driving unit comprises: a driving motor and a screw assembly arranged in a first direction and driven by the driving motor, or a driving motor and a driving motor and a driving motor arranged in the first direction and driven by the The rack and pinion drive assembly driven by the drive motor.
在本申请的某些实施方式中,所述硅棒移送装置还包括设于所述硅棒承载结构上的硅棒夹紧机构。In some embodiments of the present application, the silicon rod transfer device further includes a silicon rod clamping mechanism provided on the silicon rod supporting structure.
在本申请的某些实施方式中,所述硅棒夹紧机构包括:夹具安装件,沿着第一方向设于所述硅棒承载结构上;至少两个硅棒夹紧件,沿着所述夹具安装件间距设置。In some embodiments of the present application, the silicon rod clamping mechanism includes: a clamp mounting member, disposed on the silicon rod supporting structure along a first direction; at least two silicon rod clamping members, along the The distance setting of the fixture mounting pieces is described above.
在本申请的某些实施方式中,所述硅棒夹紧件包括:夹臂安装座,设于所述夹具安装件上;两个夹臂,活动设于所述夹臂安装座上;夹臂驱动机构,用于驱动所述两个夹臂作开合动作。In some embodiments of the present application, the silicon rod clamping member includes: a clamping arm mounting seat, which is arranged on the clamping arm mounting member; two clamping arms, which are movably arranged on the clamping arm mounting seat; The arm driving mechanism is used to drive the two clamping arms to open and close.
在本申请的某些实施方式中,所述夹臂驱动机构包括:开合齿轮,设于所述夹臂安装座上;两个齿条,每一个齿条与一个夹臂关联且与所述开合齿轮啮合;驱动源,关联于所述开合齿轮,用于驱动所述开合齿轮转动。In some embodiments of the present application, the clamping arm driving mechanism includes: an opening and closing gear, which is provided on the clamping arm mounting seat; two racks, each of which is associated with a clamping arm and is The opening and closing gears are engaged; the driving source is associated with the opening and closing gears, and is used for driving the opening and closing gears to rotate.
在本申请的某些实施方式中,在所述硅棒夹紧机构中,至少两个硅棒夹紧件中的至少一个硅棒夹紧件设有间距调整驱动机构,用于驱动其沿着所述夹具安装件运动,以调整所述至少两个硅棒夹紧件的间距。In some embodiments of the present application, in the silicon rod clamping mechanism, at least one silicon rod clamping member of the at least two silicon rod clamping members is provided with a spacing adjustment driving mechanism for driving it along the The clamp mounts are moved to adjust the spacing of the at least two silicon rod clamps.
在本申请的某些实施方式中,所述间距调整驱动机构为丝杆调整机构、链条输送机构、倍速链机构、或传动带机构。In some embodiments of the present application, the distance adjustment driving mechanism is a screw adjustment mechanism, a chain conveying mechanism, a double-speed chain mechanism, or a transmission belt mechanism.
在本申请的某些实施方式中,所述进给驱动机构包括:进给导杆或进给导轨,沿第二方向布设,用于设置所述硅棒承载结构;进给驱动单元,用于驱动所述硅棒承载结构沿着所述进给导杆或进给导轨移动。In some embodiments of the present application, the feeding drive mechanism includes: a feeding guide rod or a feeding guide rail, arranged along the second direction, for setting the silicon rod supporting structure; a feeding driving unit for The silicon rod carrying structure is driven to move along the feed guide rod or feed rail.
在本申请的某些实施方式中,所述硅棒移送装置还包括晶线检测单元。In some embodiments of the present application, the silicon rod transfer device further includes a crystal wire detection unit.
在本申请的某些实施方式中,所述硅棒切磨一体机还包括:硅棒卸载装置,设于所述硅棒加工平台的工件卸料区,用于将研磨后硅棒自所述硅棒加工平台卸载。In some embodiments of the present application, the integrated silicon rod cutting and grinding machine further comprises: a silicon rod unloading device, which is arranged in the workpiece unloading area of the silicon rod processing platform, and is used for removing the ground silicon rods from the Unloading of the ingot processing platform.
本申请公开的硅棒切磨一体机,集合了硅棒切割装置和研磨装置且将硅棒切割装置和研磨装置分别设置在硅棒加工平台的第一加工区位与第二加工区位,并设置有同时贯穿第一加工区位与第二加工区位的第一转移装置和第二转移装置,为第一、第二转移装置分别配置硅棒夹具与驱动机构,通过协调控制第一、第二转移装置以及硅棒切割装置和研磨装置,使得在同一时刻位于第一加工区位的硅棒切割装置和位于第二加工区位的研磨装置均处于工作状态,从而完成硅棒的开方及研磨多工序的一体化作业,提高生产效率及产品加工作业的品质。The silicon rod cutting and grinding integrated machine disclosed in the present application integrates a silicon rod cutting device and a grinding device, and the silicon rod cutting device and the grinding device are respectively arranged in the first processing area and the second processing area of the silicon rod processing platform, and are provided with At the same time, the first transfer device and the second transfer device running through the first processing area and the second processing area are respectively equipped with a silicon rod clamp and a driving mechanism for the first and second transfer devices. The silicon rod cutting device and the grinding device make the silicon rod cutting device located in the first processing area and the grinding device located in the second processing area in the working state at the same time, so as to complete the integration of the multi-process of silicon rod squaring and grinding operation, improve production efficiency and the quality of product processing operations.
本申请所涉及的发明的具体特征如所附权利要求书所显示。通过参考下文中详细描述的示例性实施方式和附图能够更好地理解本申请所涉及发明的特点和优势。对附图简要说明书如下:The invention to which this application relates is set forth with particularity characteristic of the appended claims. The features and advantages of the inventions involved in this application can be better understood by reference to the exemplary embodiments described in detail hereinafter and the accompanying drawings. A brief description of the drawings is as follows:
图1显示为本申请的硅棒切磨一体机在一实施例中第一视角下的结构示意图。FIG. 1 is a schematic structural diagram of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application from a first viewing angle.
图2显示为本申请的硅棒切磨一体机在一实施例中第二视角下的结构示意图。FIG. 2 is a schematic structural diagram of the integrated silicon rod cutting and grinding machine according to an embodiment of the present application from a second viewing angle.
图3显示显示为本申请的硅棒切磨一体机在一实施例中的俯视图。FIG. 3 shows a top view of an integrated silicon rod cutting and grinding machine according to an embodiment of the present application.
图4显示为本申请的硅棒切磨一体机中第一硅棒夹具或第二硅棒夹具的结构示意图。FIG. 4 is a schematic structural diagram of the first silicon rod holder or the second silicon rod holder in the integrated silicon rod cutting and grinding machine of the present application.
图5显示为本申请的硅棒切磨一体机中硅棒切割装置在一实施例中的示意图。FIG. 5 is a schematic diagram of an embodiment of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine of the present application.
图6显示为图5中B处的放大示意图。FIG. 6 is an enlarged schematic view of B in FIG. 5 .
图7显示为本申请硅棒切磨一体机中硅棒研磨装置的结构示意图。FIG. 7 is a schematic diagram showing the structure of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application.
图8显示为本申请硅棒切磨一体机中硅棒研磨装置的磨具的剖视图。FIG. 8 is a cross-sectional view of the grinding tool of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application.
图9显示为图1中A处的放大示意图。FIG. 9 is an enlarged schematic view of A in FIG. 1 .
以下由特定的具体实施例说明本申请的实施方式,熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本申请的其他优点及功效。The embodiments of the present application are described below by specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.
在下述描述中,参考附图描述了本申请的若干实施例。应当理解,还可使用其他实施例,并且可以在不背离本公开的精神和范围的情况下进行机械组成、结构以及操作上的改变。下面的详细描述不应该被认为是限制性的,并且本申请的实施例的范围仅由公布的专利的权利要求书所限定。这里使用的术语仅是为了描述特定实施例,而并非旨在限制本申请。空间相关的术语,例如“上”、“下”、“左”、“右”、“下面”、“下方”、“下部”、“上方”、“上部”等,可在文中使用以便于说明图中所示的一个元件或特征与另一元件或特征的关系。In the following description, several embodiments of the present application are described with reference to the accompanying drawings. It is to be understood that other embodiments may be utilized and mechanical, structural, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered limiting, and the scope of embodiments of the present application is limited only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. Spatially related terms, such as "upper," "lower," "left," "right," "below," "below," "lower," "above," "upper," etc., may be used in the text for ease of description The relationship of one element or feature shown in the figures to another element or feature.
虽然在一些实例中术语第一、第二等在本文中用来描述各种元件,但是这些元件不应当被这些术语限制。这些术语仅用来将一个元件与另一个元件进行区分。例如,第一转移装置可以被称作第二转移装置,并且类似地,第二转移装置可以被称作第一转移装置,而不脱离各种所描述的实施例的范围。第一转移装置和第二转移装置均是在描述某一个转移装置,但是除非上下文以其他方式明确指出,否则它们不是同一个转移装置。相似的情况还包括第一转移导轨与第二转移导轨、第一加工区位与第二加工区位、第一转移驱动机构与第二转移驱动机构、第一硅棒夹具与第二硅棒夹具等。Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first transfer device could be referred to as a second transfer device, and similarly, a second transfer device could be referred to as a first transfer device without departing from the scope of the various described embodiments. Both the first transfer device and the second transfer device are describing a transfer device, but unless the context clearly indicates otherwise, they are not the same transfer device. Similar situations also include the first transfer guide rail and the second transfer guide rail, the first processing area and the second processing area, the first transfer driving mechanism and the second transfer driving mechanism, the first silicon rod holder and the second silicon rod holder, and the like.
再者,如同在本文中所使用的,单数形式“一”、“一个”和“该”旨在也包括复数形式,除非上下文中有相反的指示。应当进一步理解,术语“包含”、“包括”表明存在所述的特征、步骤、操作、元件、组件、项目、种类、和/或组,但不排除一个或多个其他特征、步骤、操作、元件、组件、项目、种类、和/或组的存在、出现或添加。此处使用的术语“或”和“和/或”被解释为包括性的,或意味着任一个或任何组合。因此,“A、B或C”或者“A、B和/或C”意味着“以下任一个:A;B;C;A和B;A和C;B和C;A、B和C”。仅当元件、功能、步骤或操作的组合在某些方式下内在地互相排斥时,才会出现该定义的例外。Also, as used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context dictates otherwise. It should be further understood that the terms "comprising", "comprising" indicate the presence of stated features, steps, operations, elements, components, items, kinds, and/or groups, but do not exclude one or more other features, steps, operations, The existence, appearance or addition of elements, assemblies, items, categories, and/or groups. The terms "or" and "and/or" as used herein are to be construed to be inclusive or to mean any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C" . Exceptions to this definition arise only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.
在相关的针对硅棒的加工作业技术中,会涉及到例如开方切割、磨面、倒角等若干道工序。In the related processing technology for silicon rods, several processes such as square root cutting, surface grinding, and chamfering are involved.
一般地,现有的硅棒大多为圆柱形结构,通过硅棒开方设备对硅棒进行开方切割,使得硅棒在开方处理后截面呈类矩形(包括类正方形),而已加工的硅棒整体呈类长方体形。Generally, most of the existing silicon rods have a cylindrical structure, and the silicon rods are cut by the silicon rod cutting equipment, so that the cross-section of the silicon rods is rectangular-like (including square-like) after the cutting process, and the processed silicon rods are The rod is in the shape of a cuboid as a whole.
以单晶硅棒为例,单晶硅棒的形成工艺可包括:先使用硅棒截断机对原始的长硅棒进行截断作业以形成多段短硅棒;截断完成后,又使用硅棒开方机对截断后的短硅棒进行开方作业形成截面呈类矩形的单晶硅棒。其中,使用硅棒截断机对原初的长硅棒进行截断作业以形成多段短硅棒的具体实现方式可参考例如为CN105856445A、CN105946127A、以及CN105196433A等专利公开文献,使用硅棒开方机对截断后的短硅棒进行开方作业后形成截面呈类矩形的单晶硅棒的具体实施方式则可参考CN105818285A等专利公开文献。但单晶硅棒的形成工艺并不见限于前述技术,在可选实例中,单晶硅棒的形成工艺还可包括:先使用全硅棒开方机对原初的长硅棒进行开方作业以形成截面呈类矩形的长单晶硅棒;开方完成后,又使用硅棒截断机对开方切割后的长单晶硅棒进行截断作业形成短晶硅棒。其中,上述中使用全硅棒开方机对原始的长硅棒进行开方作业以形成呈类矩形的长单晶硅棒的具体实现方式可参考例如为CN106003443A等专利公开文献。Taking the single crystal silicon rod as an example, the formation process of the single crystal silicon rod may include: firstly use a silicon rod cutting machine to cut the original long silicon rod to form a multi-section short silicon rod; after the cutting is completed, use the silicon rod to square The machine performs a square root operation on the truncated short silicon rod to form a single crystal silicon rod with a rectangular cross-section. Among them, the specific implementation method of using a silicon rod cutting machine to cut off the original long silicon rod to form a multi-segment short silicon rod can refer to patent publications such as CN105856445A, CN105946127A, and CN105196433A. For specific embodiments of forming a single-crystal silicon rod with a rectangular-like cross section after squaring the short silicon rod, reference may be made to patent publications such as CN105818285A. However, the formation process of the single crystal silicon rod is not limited to the above-mentioned technology. In an optional example, the formation process of the single crystal silicon rod may also include: firstly, using a full silicon rod cutting machine to perform a squaring operation on the original long silicon rod to A long single crystal silicon rod with a rectangular-like cross section is formed; after the squaring is completed, a silicon rod cutting machine is used to cut the long single crystal silicon rod after the square cutting to form a short crystal silicon rod. Wherein, for the specific implementation of the above-mentioned use of an all-silicon ingot squarer to perform the squaring operation on an original long silicon rod to form a rectangular-like long single crystal silicon rod, reference may be made to patent publications such as CN106003443A.
在利用开方设备将圆柱形的单晶硅棒经开方切割形成类矩形的硅棒之后,可再利用研磨设备对类矩形的硅棒进行磨面、倒角等作业。After the cylindrical monocrystalline silicon rod is squared and cut to form a rectangular-like silicon rod by using a square-cutting device, grinding equipment can be used to grind and chamfer the rectangular-like silicon rod.
本申请的发明人发现,在相关的针对硅棒的加工作业技术中,涉及的开方、研磨(例如磨面、倒角等)等加工装置是彼此分散及独立布置的,执行不同工序作业的硅棒的转换需要进行搬运调配及加工前的预处理,存在工序繁杂及效率低下等问题。The inventors of the present application have found that in the related processing technology for silicon rods, the processing devices such as squaring and grinding (such as surface grinding, chamfering, etc.) are dispersed and arranged independently of each other. The conversion of silicon rods requires transportation and preparation and preprocessing before processing, which has problems such as complicated procedures and low efficiency.
有鉴于此,本申请提出了一种硅棒切磨一体机及硅棒切磨方法,通过设备改造,在一个设备中集合了多个加工装置,能自动化实现硅棒的开方切割和研磨,各个加工作业之间无缝衔接,节省人工成本且提高生产效率,提高硅棒加工作业的品质。In view of this, the present application proposes an integrated machine for cutting and grinding silicon rods and a method for cutting and grinding silicon rods. Through equipment modification, a plurality of processing devices are assembled in one device, which can automatically realize the square cutting and grinding of silicon rods. The seamless connection between various processing operations saves labor costs, improves production efficiency, and improves the quality of silicon ingot processing operations.
在本申请提供的实施例中,为明确方向的定义与不同结构之间运作的方式,定义一个由第一方向、第二方向、第三方向定义的三维空间,所述第一方向、第二方向、第三方向均为直线方向且相互两两垂直。将硅棒切磨一体机的长度延伸方向也即硅棒放置于其上时的长度方向定义为第一方向(即前后方向或转移方向),将硅棒切磨一体机的宽度延伸方向也即左右方向定义为第二方向(即左右方向或进给方向),将竖直方向也即垂向、重垂线方向、上下方向或升降方向定义为第三方向。In the embodiments provided in this application, in order to clarify the definition of the direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined. The direction and the third direction are both straight and perpendicular to each other. The length extension direction of the silicon rod cutting and grinding machine, that is, the length direction when the silicon rod is placed on it, is defined as the first direction (ie, the front-rear direction or the transfer direction), and the width extension direction of the silicon rod cutting and grinding machine is also called. The left-right direction is defined as the second direction (ie, the left-right direction or the feeding direction), and the vertical direction, that is, the vertical direction, the vertical direction, the vertical direction, or the lifting direction is defined as the third direction.
本申请在一方面公开一种硅棒切磨一体机,本申请的硅棒切磨一体机用于对硅棒进行开方作业和研磨作业,即,对截面呈圆形(或近似为圆形)的硅棒进行切割作业以形成截面呈类矩形(包括类正方形)的硅棒、以及对截面呈类矩形(包括类正方形)的硅棒进行研磨作业,其中,多数硅棒可例如为单晶硅棒或多晶硅棒,在本申请实施例中,以单晶硅棒为例进行说明。In one aspect, the present application discloses an integrated silicon rod cutting and grinding machine. The silicon rod cutting and grinding integrated machine of the present application is used to perform squaring and grinding operations on silicon rods, that is, the cross section is circular (or approximately circular). ) silicon rods are cut to form quasi-rectangular (including quasi-square) silicon rods, and grinding operations are performed on silicon rods with quasi-rectangular (including quasi-square) cross-sections, wherein most of the silicon rods can be, for example, single crystals For the silicon rod or polycrystalline silicon rod, in the embodiments of the present application, a single crystal silicon rod is used as an example for description.
请参阅图1至图3,其中,图1显示为本申请的硅棒切磨一体机在一实施例中第一视角下的结构示意图,图2显示为本申请的硅棒切磨一体机在一实施例中第二视角下的结构示意图,图3显示显示为本申请的硅棒切磨一体机在一实施例中的俯视图。如图所示,所述硅棒切磨一体机包括机座1、第一转移装置2、第二转移装置3、硅棒切割装置4、以及硅棒研磨装置5。Please refer to FIG. 1 to FIG. 3 , wherein, FIG. 1 shows a schematic structural diagram of the integrated silicon rod cutting and grinding machine of the present application from a first perspective in an embodiment, and FIG. 2 shows the integrated silicon rod cutting and grinding machine of the present application in A schematic view of the structure from a second viewing angle in an embodiment, FIG. 3 shows a top view of the integrated silicon rod cutting and grinding machine of the present application in an embodiment. As shown in the figure, the integrated silicon rod cutting and grinding machine includes a machine base 1 , a first transfer device 2 , a second transfer device 3 , a silicon rod cutting device 4 , and a silicon rod grinding device 5 .
所述机座具有硅棒加工平台,硅棒加工平台设有第一加工区位和第二加工区位。所述硅棒加工平台设置于机座上表面。如图所示,在本实施例一实现方式中,机座1为矩形结构,所述加工平台顺应机座1形状设计为矩形,其第一加工区位和第二加工区位分别对应开方加工区与研磨加工区,如图所示,所述第一加工区位和第二加工区位设置在硅棒加工平台的前后两侧,可分别独立地在第一加工区位和第二加工区位上加工所对应承载的单晶硅棒。The machine base has a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area and a second processing area. The silicon rod processing platform is arranged on the upper surface of the machine base. As shown in the figure, in the first implementation of this embodiment, the machine base 1 is of a rectangular structure, the processing platform is designed to be a rectangle conforming to the shape of the machine base 1, and the first processing area and the second processing area respectively correspond to the square root processing area. With the grinding processing area, as shown in the figure, the first processing area and the second processing area are arranged on the front and rear sides of the silicon rod processing platform, and can be processed independently on the first processing area and the second processing area. Loaded monocrystalline silicon rods.
所述第一转移装置设于第一转移通道,用于带着硅棒通过第一转移通道在第一加工区位和第二加工区位之间转移。所述第二转移装置设于第二转移通道,用于带着硅棒通过第二转移通道在第一加工区位和第二加工区位之间转移。The first transfer device is arranged in the first transfer channel, and is used for transferring the silicon rods between the first processing area and the second processing area through the first transfer channel. The second transfer device is arranged in the second transfer channel, and is used for transferring the silicon rods between the first processing area and the second processing area through the second transfer channel.
所述第一转移装置和第二转移装置通过一安装框设置在所述硅棒加工平台的上方,所述安装框架设在机座上呈一立式框体结构,框体上表面高于所述硅棒加工平台并承载所述第一转移装置和第二转移装置。在本申请的某些实施例中,如图1所示,在所述硅棒加工平台的上方设置有安装框,所述第一转移装置2与第二转移装置3平行地设置在所述安装框的左右两侧。所述安装框的支撑结构设置在所述机座1上表面,在图示实施例中,所述机座1上表面呈矩形,所述安装框的支撑结构在矩形外沿上,所述安装框与所述机座1在形状与大小上近似相同。在本申请的某些实施例中,在所述硅棒加工平台的上方设置有第一安装框和第二安装框,所述第一安装框和所述第二安装框设置于所述硅棒加工平台中沿第二方向的相对两侧,其中,所述第一转移装置通过第一安装框架设于所述硅棒加工平台的上方,所述第二转移装置通过第二安装框架设于所述硅棒加工平台的上方。所述第一安装框和所述第二安装框的形状和大小相同和近似相同,例如,所述第一安装框和所述第二安装框的形状为矩形。The first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, and the mounting frame is arranged on the machine base to form a vertical frame structure, and the upper surface of the frame is higher than the The silicon rod processing platform carries the first transfer device and the second transfer device. In some embodiments of the present application, as shown in FIG. 1 , a mounting frame is provided above the silicon rod processing platform, and the first transfer device 2 and the second transfer device 3 are arranged in parallel on the mounting frame. the left and right sides of the frame. The support structure of the installation frame is arranged on the upper surface of the machine base 1. In the illustrated embodiment, the upper surface of the machine base 1 is rectangular, and the support structure of the installation frame is on the outer edge of the rectangle. The frame is approximately the same in shape and size as the base 1 . In some embodiments of the present application, a first mounting frame and a second mounting frame are provided above the silicon rod processing platform, and the first mounting frame and the second mounting frame are provided on the silicon rod Opposite sides of the processing platform along the second direction, wherein the first transfer device is arranged above the silicon rod processing platform through a first installation frame, and the second transfer device is arranged through the second installation frame. above the silicon rod processing platform. The shape and size of the first installation frame and the second installation frame are the same or approximately the same, for example, the shape of the first installation frame and the second installation frame is a rectangle.
关于第一转移装置,在本申请中,设于第一转移通道的第一转移装置包括第一硅棒夹具和第一转移驱动机构。其中,所述第一硅棒夹具用于夹持硅棒,所述硅棒被所述第一硅棒夹具夹持后呈卧式,即,所述硅棒的轴心线与第一方向一致的方式被夹持。所述第一转移驱动机构用于驱动所述第一硅棒夹具及其夹持的硅棒沿着第一方向移动并在第一加工区位和第二加工区位之间转移。其中,所述第一转动驱动机构更包括第一转移导轨和第一转移驱动单元,其中,第一转移导轨沿第一方向布设,用于设置所述第一硅棒夹具,所述第一转移驱动单元 用于驱动所述第一硅棒夹具及其所夹持的硅棒沿所述第一转移导轨移动。Regarding the first transfer device, in this application, the first transfer device provided in the first transfer channel includes a first silicon rod holder and a first transfer drive mechanism. Wherein, the first silicon rod clamp is used to hold the silicon rod, and the silicon rod is horizontal after being clamped by the first silicon rod clamp, that is, the axis line of the silicon rod is consistent with the first direction way to be clamped. The first transfer driving mechanism is used for driving the first silicon rod holder and the silicon rod held by it to move along a first direction and transfer between the first processing area and the second processing area. Wherein, the first rotation driving mechanism further includes a first transfer guide rail and a first transfer driving unit, wherein the first transfer guide rail is arranged along a first direction for setting the first silicon rod holder, the first transfer guide The driving unit is used for driving the first silicon rod holder and the silicon rod held by it to move along the first transfer guide rail.
所述第一硅棒夹具包括第一夹臂安装座,在所述第一夹臂安装座上设有至少一对第一夹臂,所述至少一对第一夹臂沿第一方向对向设于所述第一夹臂安装座上,用于夹持硅棒的两个端面,所述至少一对第一夹臂中的至少一个第一夹臂可通过第一夹臂驱动机构沿着第一方向移动以调节所述至少一对第一夹臂之间的夹持间距。The first silicon rod holder includes a first clamping arm mounting seat, and at least a pair of first clamping arms is arranged on the first clamping arm mounting seat, and the at least one pair of first clamping arms face each other along a first direction It is arranged on the first clamping arm mounting seat and is used for clamping the two end faces of the silicon rod. At least one first clamping arm in the at least one pair of first clamping arms can be driven along the first clamping arm drive mechanism. The first direction moves to adjust the clamping distance between the at least one pair of the first clamping arms.
请参阅图4,显示为本申请的硅棒切磨一体机中第一硅棒夹具或第二硅棒夹具的结构示意图。在本申请的某些实施例中,如图4所示,所述第一硅棒夹具21整体上呈现为第一夹臂安装座211设置在上方,所述第一夹臂安装座211以外部分包括第一夹臂213呈下悬状态,所述第一夹臂安装座211安装于所述安装框上,所述第一夹臂213从第一夹臂安装座211处于安装框的中空部分下悬延伸,以实现所述第一夹臂213所夹持的硅棒(例如,待切割的硅棒101或已切割的硅棒)处于所述硅棒加工平台的加工面上。Please refer to FIG. 4 , which is a schematic structural diagram of the first silicon rod holder or the second silicon rod holder in the integrated silicon rod cutting and grinding machine of the present application. In some embodiments of the present application, as shown in FIG. 4 , the first silicon rod holder 21 as a whole presents a first clamping arm mounting seat 211 disposed above, and the part outside the first clamping arm mounting seat 211 Including the first clamp arm 213 in a suspended state, the first clamp arm mounting seat 211 is mounted on the mounting frame, and the first clamp arm 213 is located under the hollow part of the mounting frame from the first clamp arm mounting seat 211 The cantilever is extended to realize that the silicon rod (eg, the silicon rod to be cut 101 or the cut silicon rod) held by the first clamping arm 213 is on the processing surface of the silicon rod processing platform.
所述第一夹臂安装座设置在第一转移导轨上,在本实施例的一实现方式中,所述第一夹臂安装座底部设置有与所述第一转移导轨相匹配的导槽结构,所述第一转移导轨沿第一方向布置,所述第一转移导轨在第一方向的长度范围至少覆盖所述第一工作区与第二工作区在第一方向的位置,以确保所述第一硅棒夹具所夹持的硅棒在两个工作区之间的移送。在本实施例的一实现方式中,所述第一转移导轨设置为跨越所述安装框在第一方向的完整长度。The first clamp arm mounting seat is arranged on the first transfer guide rail. In an implementation of this embodiment, a guide groove structure matching the first transfer guide rail is provided at the bottom of the first clamp arm mounting seat. , the first transfer guide rail is arranged along the first direction, and the length of the first transfer guide rail in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the The transfer of the silicon rod held by the first silicon rod holder between the two working areas. In an implementation of this embodiment, the first transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.
第一夹臂安装座上还设有沿第一方向的第一导向结构,所述至少一对第一夹臂通过第一导向结构设置在第一夹臂安装座上并可产生在第一方向的移动。在实际应用中,所述第一导向结构可例如为第一夹臂导轨、第一夹臂导槽、或第一夹臂导杆等。The first clamp arm mounting seat is also provided with a first guide structure along the first direction, and the at least one pair of first clamp arms are arranged on the first clamp arm mounting seat through the first guide structure and can be generated in the first direction movement. In practical applications, the first guide structure may be, for example, a first clamp arm guide rail, a first clamp arm guide groove, or a first clamp arm guide rod.
所述至少一对第一夹臂沿第一方向对向设置,用于夹持硅棒的两个端面。The at least one pair of first clamping arms are disposed opposite to each other along the first direction, and are used for clamping two end faces of the silicon rod.
对于待切割的硅棒而言,所述硅棒为具有一定长度的圆柱结构,且其长度方向沿第一方向放置,所述端面即为长度方向两端的截面。对于已切割的硅棒而言,所述硅棒为具有一定长度的长方体结构(其截面呈矩形或类矩形),且其长度方向沿第一方向放置,所述端面即为长度方向两端的截面。For the silicon rod to be cut, the silicon rod is a cylindrical structure with a certain length, and its length direction is placed along the first direction, and the end faces are the sections at both ends of the length direction. For the cut silicon rod, the silicon rod is a cuboid structure with a certain length (its cross section is rectangular or quasi-rectangular), and its length direction is placed along the first direction, and the end faces are the cross sections at both ends of the length direction. .
所述第一夹臂从第一夹臂安装座处下垂,所述第一夹臂下方包括夹持部,用于直接接触及夹持硅棒。如图4所示,所述第一夹臂213的一端连接于第一夹臂安装座211,所述第一夹臂213的另一端连接有用于接触硅棒(例如,待切割的硅棒101或已切割的硅棒)端面的夹持部215。所述第一夹臂安装座211活动设置于所述第一转移导轨并在第一转移驱动单元驱动下沿所述第一转移导轨移动,由此带动所述第一夹臂213沿所述第一转移导轨移动。The first clamping arm hangs down from the first clamping arm mounting seat, and a clamping portion is included under the first clamping arm for directly contacting and clamping the silicon rod. As shown in FIG. 4 , one end of the first clamping arm 213 is connected to the first clamping arm mounting seat 211 , and the other end of the first clamping arm 213 is connected to a silicon rod for contacting the silicon rod (for example, the silicon rod 101 to be cut) or cut silicon rod) end face of the clamping part 215. The first clamp arm mounting seat 211 is movably arranged on the first transfer guide rail and moves along the first transfer guide rail driven by the first transfer drive unit, thereby driving the first clamp arm 213 along the first transfer guide rail. A transfer rail moves.
所述第一硅棒夹具还包括第一夹臂驱动机构,所述第一夹臂驱动机构可驱动所述至少一 对第一夹臂中的至少一个第一夹臂沿着所述第一方向移动,以调节所述一对相对设置的第一夹臂之间的夹持间距,如此所述至少一对第一夹臂的夹持部即可在第一夹臂驱动机构作用下相互靠近或远离,以执行对硅棒的夹持或释放动作。例如,沿第一方向相对设置的两个第一夹臂的夹持部在第一夹臂驱动机构的驱动下相向靠近夹紧硅棒,并保持夹紧状态将硅棒在不同工作区之间移送和进行加工作业,在加工作业结束后将硅棒转运至承载位置后在第一夹臂驱动机构的驱动下相互远离以释放加工后硅棒。The first silicon rod holder further includes a first clamping arm driving mechanism, and the first clamping arm driving mechanism can drive at least one first clamping arm of the at least one pair of first clamping arms along the first direction move to adjust the clamping distance between the pair of oppositely arranged first clamping arms, so that the clamping parts of the at least one pair of first clamping arms can approach each other or move closer to each other under the action of the first clamping arm driving mechanism away to perform a gripping or releasing action on the silicon rod. For example, the clamping parts of the two first clamping arms arranged opposite to each other along the first direction are driven by the driving mechanism of the first clamping arm to clamp the silicon rod toward each other, and keep the clamping state to keep the silicon rod between different working areas. Transfer and carry out processing operations, after the processing operation, the silicon rods are transported to the bearing position and then moved away from each other under the driving of the first clamping arm driving mechanism to release the processed silicon rods.
在本申请的某些实施方式中,所述第一夹臂驱动机构包括驱动电机、驱动齿轮和一对齿条。所述驱动电机带动齿轮旋转,所述一对齿条与所述驱动齿轮相对的两端啮合,当所述驱动齿轮旋转时所述一对齿条在齿轮两端方向相反的线速度的带动下表现为相互靠近或相互远离。在本实施例一实现方式中,所述一对齿条中每一齿条一端与所述驱动齿轮啮合,另一端分别连接一第一夹臂,使所述至少一对第一夹臂在第一方向沿第一夹臂安装座导轨相互远离或相互靠近。In some embodiments of the present application, the first clamp arm driving mechanism includes a driving motor, a driving gear and a pair of racks. The drive motor drives the gear to rotate, and the pair of racks meshes with opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven by the opposite linear speeds at both ends of the gear. Appears close to each other or away from each other. In an implementation of this embodiment, one end of each of the pair of racks is engaged with the driving gear, and the other end is connected to a first clamp arm, so that the at least one pair of the first clamp arms is in the first clamp arm. In one direction, the guide rails of the first clamp arm mounting seat are away from each other or approach each other.
在本申请的某些实施方式中,所述第一夹臂驱动机构包括丝杆和驱动源,其中,所述第丝杆沿第一方向设置且与所述一对第一夹臂中的任意一个第一夹臂关联,所述驱动源与所述丝杆连接,用于驱动所述丝杆转动以使得关联的第一夹臂沿第一方向移动。In some embodiments of the present application, the first clamping arm driving mechanism includes a screw rod and a driving source, wherein the first screw rod is arranged along a first direction and is connected to any one of the pair of first clamping arms. A first clamp arm is associated, and the drive source is connected to the screw rod for driving the screw rod to rotate so that the associated first clamp arm moves in a first direction.
所述第一夹臂驱动机构的丝杆具有远端及近端,在具体实现方式中,例如可将所述丝杆近端连接至所述驱动源并在所述驱动源驱动下转动,所述丝杆远端以螺纹连接至所述一对第一夹臂中的任意一个第一夹臂,藉由所述丝杆两端的连接方式,所述丝杆可基于所述驱动源传动发生转动并借助螺纹连接将所述丝杆转动转化为轴线位移,所述轴向位移方向为丝杆的设置方向即第一方向;通过所述驱动源驱动所诉丝杠转动即可实现丝杆远端所连接的所述第一夹臂在第一方向的移动,所述丝杠被驱动转动的旋向变更,即可实现所关联的第一夹臂在第一方向的前进或后退。The screw rod of the first clamping arm driving mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, so the The distal end of the screw rod is threadedly connected to any one of the first clamping arms of the pair of first clamping arms, and the screw rod can rotate based on the drive source transmission by means of the connection between the two ends of the screw rod The rotation of the lead screw is converted into an axial displacement by means of a threaded connection, and the axial displacement direction is the setting direction of the lead screw, that is, the first direction; the distal end of the lead screw can be realized by driving the lead screw to rotate by the driving source. The connected first clamp arm moves in the first direction, and the rotation direction of the lead screw is driven to change, so that the associated first clamp arm can move forward or backward in the first direction.
在本申请的某些实施方式中,所述第一夹臂驱动机构包括:双向丝杆,沿第一方向设置且在两端与所述至少一对第一夹臂螺纹连接;驱动源,用于驱动所述丝杆转动以使得所述至少一对第一夹臂沿第一方向相向移动或相背移动。In some embodiments of the present application, the first clamping arm driving mechanism includes: a bidirectional screw rod, which is arranged in a first direction and is threadedly connected to the at least one pair of the first clamping arms at both ends; a driving source, which uses The at least one pair of the first clamping arms is driven to rotate toward or away from each other along the first direction.
在一实现方式中,所述第一夹臂驱动机构的双向丝杆在两端与所述一对第一夹臂螺纹连接,及所述双向丝杆为双螺纹丝杆且两端的螺纹方向相反,所述驱动源可设置在双向丝杆的任意一端或连接至所述双向丝杆以带动双向丝杆沿丝杆轴转动,藉由双向丝杆两端方向相反的螺纹,所述双向丝杆在所述驱动源驱动下转动时双向丝杆两端的运动被转化为方向相反的沿丝杠轴向及第一方向的线运动。在所述驱动源驱动下,所述一对第一夹臂即可在第一方向 相向运动或相背运动。In an implementation manner, the bidirectional screw rod of the first clamping arm driving mechanism is threadedly connected with the pair of first clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod with opposite thread directions at both ends. , the drive source can be arranged at either end of the two-way screw or connected to the two-way screw to drive the two-way screw to rotate along the screw shaft. The motion of the two ends of the bidirectional screw rod is converted into linear motion in opposite directions along the axial direction of the screw rod and the first direction when it is rotated under the driving of the driving source. Driven by the driving source, the pair of first clamping arms can move toward or away from each other in a first direction.
在一实施方式中,所述第一夹臂安装座可以为通过所述第一夹臂驱动机构连接的多个安装座,所述一对第一夹臂中的任一个对应于一安装座,所述驱动源设于一对第一夹臂之间,在此,任一第一夹臂可沿所述导向结构移动;当所述第一硅棒夹具需整体沿导向结构移动时,例如可令所述第一夹臂驱动机构的驱动源控制所述一对第一夹臂相对静止,此时可藉由第一夹臂驱动机构的连接作用使得不同安装座相对静止,所述第一硅棒夹具的动力源可驱动任一安装座沿导向结构移动即可实现第一硅棒夹具发生整体移动。In one embodiment, the first clamp arm mounting seat may be a plurality of mounting seats connected by the first clamp arm driving mechanism, and any one of the pair of first clamp arms corresponds to a mounting seat, The driving source is arranged between a pair of first clamping arms, where any of the first clamping arms can move along the guide structure; when the first silicon rod holder needs to move along the guide structure as a whole, for example, it can be The driving source of the first clamping arm driving mechanism controls the pair of first clamping arms to be relatively stationary. At this time, the connection of the first clamping arm driving mechanism can make different mounting seats relatively stationary. The power source of the rod clamp can drive any mounting seat to move along the guide structure, so as to realize the overall movement of the first silicon rod clamp.
在又一实现方式中,所述第一夹臂驱动机构包括第一齿条、第二齿条以及驱动齿轮;所述第一齿条与第二齿条分别联动于一第一夹臂,所述驱动齿轮连接于驱动电机的动力输出轴(未予以图示)并与所述第一齿条和所述第二齿条相啮合,所述驱动齿轮用于在正向转动时带动所述一对第一夹臂相向运动以执行夹持动作,在逆向转动时带动所述一对第一夹臂背向运动以执行释放动作。In yet another implementation manner, the first clamping arm driving mechanism includes a first rack, a second rack and a driving gear; the first rack and the second rack are respectively linked to a first clamping arm, so The drive gear is connected to the power output shaft (not shown) of the drive motor and meshes with the first rack and the second rack, and the drive gear is used to drive the first rack during forward rotation. The first clamping arms are moved toward each other to perform a clamping action, and the pair of first clamping arms are driven to move backwards to perform a releasing action during reverse rotation.
在本申请的一实施例中,所述第一夹臂呈旋转式结构,例如,所述第一硅棒夹具还包括第一夹臂转动机构,用于驱动所述第一夹臂转动。在本实施例的一实现方式中,所述至少一对第一夹臂的任意一个夹持部或一对第一夹臂的两个夹持部设置有可转动的结构,在所述第一夹臂转动机构的驱动下使得第一夹臂的夹持部以所述硅棒的长度方向即第一方向为轴心线旋转,被夹持硅棒发生相应的以第一方向为轴心线的旋转。例如,在某些示例中,第一夹臂转动机构可例如为转动电机,所述一对第一夹臂中两个第一夹臂的夹持部均设置有可转动的结构,两个第一夹臂的夹持部或者其中一个第一夹臂的夹持部与转动电机的输出轴连接,例如,两个第一夹臂的夹持部分别连接一转动电机,由两个转动电机分别驱动对应的第一夹臂的夹持部转动,或者,其中一个第一夹臂的夹持部与转动电机连接,由所述转动电机驱动对应的那一个第一夹臂的夹持部转动,并利用摩擦力,通过夹持的硅棒的传导,带动另一个第一夹臂的夹持部也顺势转动。In an embodiment of the present application, the first clamping arm has a rotary structure. For example, the first silicon rod holder further includes a first clamping arm rotating mechanism for driving the first clamping arm to rotate. In an implementation of this embodiment, any one clamping part of the at least one pair of first clamping arms or two clamping parts of a pair of first clamping arms is provided with a rotatable structure, and a rotatable structure is provided in the first clamping part. Driven by the rotation mechanism of the clamping arm, the clamping part of the first clamping arm rotates with the length direction of the silicon rod, that is, the first direction as the axis line, and the clamped silicon rod is correspondingly rotated with the first direction as the axis line. rotation. For example, in some examples, the rotation mechanism of the first clamp arm may be, for example, a rotating motor, and the clamping portions of the two first clamp arms of the pair of first clamp arms are both provided with rotatable structures, and the two first clamp arms are provided with rotatable structures. The clamping part of a clamping arm or the clamping part of one of the first clamping arms is connected to the output shaft of the rotating motor. For example, the clamping parts of the two first clamping arms are respectively connected to a rotating motor, and the two rotating motors are respectively connected The clamping part of the corresponding first clamping arm is driven to rotate, or, the clamping part of one of the first clamping arms is connected to a rotating motor, and the clamping part of the corresponding first clamping arm is driven by the rotating motor to rotate, And using friction force, through the conduction of the clamped silicon rod, the clamping part of the other first clamping arm is also driven to rotate according to the trend.
在本实施例的某些实施方式中,所述至少一对第一夹臂的夹持部具有用于夹持硅棒的接触面。当所述硅棒的夹持端为在细长型结构两端的两个端面时,所述夹持部的接触面可以设置为在重垂线方向的接触面或包括重垂线方向的平面的接触面。所述接触面设置在可旋转的平台上,所述平台的截面可设置为自定义的规则几何图形或不规则几何图形。In some implementations of this embodiment, the clamping portions of the at least one pair of the first clamping arms have a contact surface for clamping the silicon rod. When the clamping ends of the silicon rods are two end faces at both ends of the elongated structure, the contact surfaces of the clamping parts can be set as the contact surfaces in the direction of the re-perpendicular line or a plane including the direction of the re-perpendicular line. Contact surfaces. The contact surface is set on a rotatable platform, and the section of the platform can be set as a custom regular geometric figure or irregular geometric figure.
在本申请的一实施例中,所述可旋转的平台可设置为具有锁定功能的铰接装置铰接成的整体,可沿第一方向的轴心线旋转。旋转轴的轴心线连接于所述第一夹臂转动机构。In an embodiment of the present application, the rotatable platform can be provided as a whole hinged by a hinge device with a locking function, and can rotate along the axis line in the first direction. The axis line of the rotating shaft is connected to the first clamping arm rotating mechanism.
在本申请的一实施例中,所述第一夹臂的夹持部可设置为一可旋转的圆台,所述圆台的 圆形平面与硅棒端面接触,在贴紧硅棒端面后保持与硅棒端面相对静止。所述夹持部还包括锁紧结构,在对硅棒进行相应加工作业(所述加工作业可例如为切割、磨面、倒角等)时所述夹持部处于锁紧状态。在硅棒的切换例如切割位置切换或研磨面切换中,所述夹持部在第一夹臂转动机构的带动下沿圆台圆心旋转。In an embodiment of the present application, the clamping portion of the first clamping arm can be set as a rotatable circular truncated cone, the circular plane of the circular truncated cone is in contact with the end face of the silicon rod, and remains in contact with the end face of the silicon rod after it is in close contact with the end face of the silicon rod. The end face of the silicon rod is relatively stationary. The clamping portion further includes a locking structure, and the clamping portion is in a locked state when a corresponding processing operation is performed on the silicon rod (the processing operation may be, for example, cutting, grinding, chamfering, etc.). During switching of the silicon rod, such as switching of cutting positions or switching of grinding surfaces, the clamping portion is driven by the rotation mechanism of the first clamping arm to rotate along the center of the circular frustum.
在一种实施例中,所述第一夹臂的夹持部包括可旋转的圆台与设置在圆台上的一系列凸出触点,所述每一触点具有一接触平面。所述圆台在第一夹臂转动机构的带动下旋转,在本实施例的一实现方式中,所述触点的凸出长度即在第一方向的位置可调节,使得在对夹持硅棒的过程中,对端面平整度较低的硅棒,可根据硅棒端面调整触点的凸出长度,使得每一接触面与硅棒端面处于贴紧状态。所述凸出长度即从圆台的圆平面至触点的接触平面间第一方向的长度。In one embodiment, the clamping portion of the first clamping arm includes a rotatable truncated cone and a series of protruding contacts disposed on the truncated cone, each of the contacts having a contact plane. The circular platform is driven by the first clamping arm rotating mechanism to rotate. In an implementation of this embodiment, the protruding length of the contact point can be adjusted in the first direction, so that when the silicon rod is clamped, the protruding length of the contact can be adjusted. During the process, for the silicon rod with low flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface and the end face of the silicon rod are in a close state. The protruding length is the length in the first direction from the circular plane of the circular frustum to the contact plane of the contact.
在本申请的一实施例中,所述第一硅棒夹具的夹持部设置有压力传感器,以基于所检测的压力状态调整触点的凸出长度。通常地,在夹持硅棒的过程中,所述第一硅棒夹具的一对第一夹臂在第一夹臂驱动机构的驱动下沿第一方向相互靠近,至所述夹持部的接触面与所需夹持的硅棒的端面相互接触,当所述夹持部设置有多个触点并探测到部分触点与所接触硅棒的端面接触的压力值小于一设定值或设定区域时,可通过调整触点的凸出长度(一般为朝向硅棒端面靠近方向)以改变夹紧度;又或者,所述第一硅棒夹具的一对第一夹臂的每一夹持部均设置为一个接触面,在对硅棒进行夹持的过程中,通过所述第一夹臂驱动机构驱动一对第一夹臂朝向硅棒两端的端面相互靠近以实现,在所述夹持部与硅棒端面接触后,由压力传感器检测硅棒的夹紧程度,当达到设定的压力范围时即第一夹臂驱动机构控制停止所述一对第一夹臂的相向运动。In an embodiment of the present application, the clamping portion of the first silicon rod holder is provided with a pressure sensor, so as to adjust the protruding length of the contact point based on the detected pressure state. Usually, in the process of clamping the silicon rod, a pair of first clamping arms of the first silicon rod clamp are driven by the first clamping arm driving mechanism to approach each other along the first direction, and the clamping portion reaches the edge of the clamping portion. The contact surface is in contact with the end surface of the silicon rod to be clamped. When the clamping part is provided with a plurality of contacts and detects that the pressure value of some contacts in contact with the end surface of the contacted silicon rod is less than a set value or When setting the area, the clamping degree can be changed by adjusting the protruding length of the contact (generally toward the approaching direction of the end face of the silicon rod); alternatively, each of the pair of first clamping arms of the first silicon rod clamp The clamping parts are all set as a contact surface. In the process of clamping the silicon rod, the first clamping arm driving mechanism drives the end faces of the pair of first clamping arms toward the two ends of the silicon rod to approach each other to achieve. After the clamping part is in contact with the end face of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor. When the set pressure range is reached, the first clamping arm driving mechanism controls and stops the relative movement of the pair of first clamping arms. .
所述第一夹臂转动机构可设置在一对第一夹臂中的一个第一夹臂上(另一个第一夹臂仅具有转动功能),以带动所述一对第一夹臂的夹持部与所夹持的硅棒旋转;或者所述第一夹臂转动机构设置在一对第一夹臂的每一第一夹臂上,并协同运动控制所述一对第一夹臂的两个夹持部发生相同角度与方向的转动。在某些实现方式中,所述第一夹臂转动机构可设置为一驱动电机。The first clamp arm rotation mechanism can be arranged on one of the pair of first clamp arms (the other first clamp arm only has a rotation function) to drive the clamp of the pair of first clamp arms. The holding part rotates with the clamped silicon rod; or the first clamp arm rotation mechanism is arranged on each first clamp arm of a pair of first clamp arms, and controls the movement of the pair of first clamp arms in coordination with the movement. The two clamping parts rotate in the same angle and direction. In some implementations, the first clamp arm rotation mechanism may be configured as a drive motor.
在由硅棒切割装置对硅棒的进行切割时,可通过所述第一夹臂转动机构驱动夹持部旋转以实现。通常对单晶硅棒进行切割时,所述第一夹臂转动机构控制夹持部旋转一定角度例如90°即可实现,以利用所述硅棒切割装置对硅棒的一个侧面或相对两个侧面进行切割。When the silicon rod is cut by the silicon rod cutting device, the clamping part can be driven to rotate by the first clamping arm rotation mechanism. Usually, when cutting a single crystal silicon rod, the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, so that one side or two opposite sides of the silicon rod can be cut by the silicon rod cutting device. Cut on the side.
在由所述硅棒切磨一体机对硅棒的不同侧面进行磨面或对棱边进行倒角时,通过所述第一夹臂转动机构驱动夹持部旋转以实现。通常对经过开方的单晶硅棒,在对不同侧面进行研 磨时,所述第一夹臂转动机构控制夹持部旋转一定角度例如90°即可实现,在对不同棱边进行倒角时,可通过控制夹持部旋转一定角度例如45°、135°等角度实现。在研磨装置所提供的研磨面为平面的情况下,在进行对硅棒的倒角时,所述第一夹臂转动机构可控制夹持部与其所夹持的硅棒旋转不同的角度进行多次倒角实现,例如,对硅棒在完成一个侧面的研磨后,对该侧面相邻的一条棱边与该棱边相对的棱边,可通过旋转一定角度例如40°、45°、50°进行多次倒角,得到在不同侧面交界处过渡更为圆滑的硅棒。所述角度均为从研磨的初始位置起始的旋转角度。所述实现倒角的方式可参考例如CN108942570A等专利公开文献,通过带动硅棒转动一定角度,磨具配合进行在第二方向的横向进给实现对棱角的磨削。When the silicon rod cutting and grinding integrated machine is used to grind different sides of the silicon rod or to chamfer the edges, the first clamping arm rotating mechanism drives the clamping part to rotate to achieve this. Usually, when grinding different sides of a single crystal silicon rod that has been squared, the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, which can be achieved. When chamfering different edges , which can be realized by controlling the rotation of the clamping part to a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a flat surface, when chamfering the silicon rod, the first clamping arm rotation mechanism can control the rotation angle of the holding part and the silicon rod held by it to rotate at different angles. Secondary chamfering can be achieved, for example, after grinding one side of the silicon rod, the opposite edge of an edge adjacent to the side can be rotated by a certain angle such as 40°, 45°, 50° Perform multiple chamfering to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles from the initial position of grinding. For the method of realizing chamfering, reference may be made to patent publications such as CN108942570A. By driving the silicon rod to rotate by a certain angle, the grinding tool cooperates with the lateral feed in the second direction to realize the grinding of the edges and corners.
在本申请的一实施例中,所述第一硅棒夹具为升降式硅棒夹具。在一实现方式中,所述第一硅棒夹具包括升降导轨与升降方向的驱动装置,所述第一硅棒夹具的第一夹臂与所述第一夹臂安装座上承载第一夹臂的夹臂导轨可沿着所述升降导轨在第三方向(即,重垂线方向)运动,可用于控制硅棒外表面与硅棒切割装置或硅棒研磨装置在重垂线方向的相对位置,以选择硅棒的被切割面与硅棒切割装置用于进行切割的切割区域或选择硅棒的被研磨面与研磨工具用于进行研磨的研磨区域。在本实施例的一实现方式中,所述升降导轨设置在所述第一夹臂安装座的直立面上,所述第一夹臂上对应设置有与所述升降导轨配合的导槽及驱动所述第一夹臂发生升降运动的驱动机构;所述驱动机构包括行进丝杠与行进电机,所述行进丝杠沿所述升降导轨设置并连接所述行进电机,在行进电机的带动下驱动所述第一夹臂在第三方向运动。在另一实现方式中,所述一对第一夹臂的每一第一夹臂悬臂设置为一伸缩装置,在伸缩驱动机构的带动下同时进行升降运动。In an embodiment of the present application, the first silicon rod holder is a lift-type silicon rod holder. In an implementation manner, the first silicon rod holder includes a lifting guide rail and a driving device in the lifting direction, and the first clamping arm of the first silicon rod holder and the first clamping arm mounting seat carry a first clamping arm. The clamp arm guide can move along the lift guide in the third direction (ie, the direction of the heavy vertical line), which can be used to control the relative position of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the direction of the heavy vertical line , to select the cut surface of the silicon rod and the cutting area of the silicon rod cutting device for cutting, or the ground surface of the silicon rod and the grinding area of the grinding tool for grinding. In an implementation of this embodiment, the lifting guide rail is arranged on the upright surface of the first clamping arm mounting seat, and the first clamping arm is correspondingly provided with a guide groove and a driving guide matched with the lifting guide rail A driving mechanism for the lifting movement of the first clamping arm; the driving mechanism includes a traveling screw and a traveling motor, and the traveling screw is arranged along the lifting guide rail and is connected to the traveling motor, and is driven by the traveling motor. The first clamp arm moves in a third direction. In another implementation manner, each first clamping arm cantilever of the pair of first clamping arms is configured as a telescopic device, and is simultaneously moved up and down under the driving of the telescopic drive mechanism.
关于所述第一转移驱动机构,所述第一转移驱动机构包括:第一转移导轨和第一转移驱动单元,其中,所述第一转移导轨沿第一方向布设,用于设置所述第一夹臂安装座,所述第一转移驱动单元用于驱动所述第一夹臂安装座及其至少一对第一夹臂沿所述第一转移导轨移动。Regarding the first transfer drive mechanism, the first transfer drive mechanism includes: a first transfer guide rail and a first transfer drive unit, wherein the first transfer guide rail is arranged along a first direction for setting the first transfer guide A clamp arm mounting seat, the first transfer driving unit is used to drive the first clamp arm mounting seat and at least a pair of first clamp arms to move along the first transfer guide rail.
所述第一转移驱动单元包括第一移动齿轨、第一驱动齿轮与第一驱动源。所述第一移动齿轨沿第一方向设置,与所述第一转移导轨平行。在一实施例中,所述第一移动齿轨固定在所述安装框的上表面、侧表面或下表面,设置为与所述第一转移导轨近似相同的第一方向尺度,与第一转移导轨平行且相邻设置。The first transfer driving unit includes a first moving rack, a first driving gear and a first driving source. The first moving rack is arranged along a first direction and is parallel to the first transfer guide rail. In one embodiment, the first moving rack is fixed on the upper surface, side surface or lower surface of the mounting frame, and is set to approximately the same first direction dimension as the first transfer guide rail, which is the same as the first transfer guide rail. The guide rails are arranged in parallel and adjacent.
所述第一驱动齿轮设置于所述第一硅棒夹具上,并且与第一移动齿轨啮合,用于带动第一硅棒夹具沿第一转移导轨的运动。所述第一驱动源用于驱动所述第一驱动齿轮。在本申请的一实现方式中,所述第一驱动齿轮设置在所述第一硅棒夹具的第一夹臂安装座上,所述第 一驱动齿轮由第一驱动源带动旋转,所述第一驱动齿轮的轮齿与所述第一移动齿轨啮合,顺应所述第一移动齿轨行进,与第一驱动齿轮连接的第一硅棒夹具由此在第一转移导轨上产生相应的移动。The first driving gear is arranged on the first silicon rod holder and meshes with the first moving rack, so as to drive the first silicon rod holder to move along the first transfer guide rail. The first drive source is used to drive the first drive gear. In an implementation manner of the present application, the first drive gear is disposed on the first clamping arm mounting seat of the first silicon rod holder, the first drive gear is driven to rotate by a first drive source, and the first drive gear is rotated by a first drive source. The teeth of a driving gear mesh with the first moving rack and travel in accordance with the first moving rack, so that the first silicon rod clamp connected to the first driving gear moves correspondingly on the first transfer rail. .
在本申请的一实施例中,所述第一转移驱动单元可设置在所述第一硅棒夹具上,包括第一移动丝杆和第一驱动源,其中,所述第一移动丝杆沿第一方向设置且与所述第一夹臂安装座关联,所述第一驱动源用于驱动所述第一移动丝杆转动以使所关联的第一夹臂安装座及其至少一对第一夹臂沿所述第一转移导轨移动。In an embodiment of the present application, the first transfer driving unit may be disposed on the first silicon rod holder, and includes a first moving screw and a first driving source, wherein the first moving screw is along the The first direction is arranged and associated with the first clamp arm mounting seat, and the first driving source is used to drive the first moving screw to rotate so as to make the associated first clamp arm mounting seat and at least a pair of first A clamp arm moves along the first transfer rail.
在本实施例一实现方式中,所述第一驱动源可设置为驱动电机,所述驱动电机的动力输出轴与所述第一驱动齿轮轴接,控制第一驱动齿轮的运动状态,继而所述第一驱动源控制所述第一硅棒夹具与其所夹持的硅棒在第一方向的移动。In an implementation manner of this embodiment, the first driving source may be set as a driving motor, and the power output shaft of the driving motor is axially connected to the first driving gear to control the motion state of the first driving gear, and then the The first driving source controls the movement of the first silicon rod holder and the silicon rod held by it in a first direction.
关于第二转移装置,在本申请中,设于第二转移通道的第二转移装置包括第二硅棒夹具和第二转移驱动机构。其中,所述第二硅棒夹具用于夹持硅棒,所述硅棒被所述第二硅棒夹具夹持后呈卧式,即,所述硅棒的轴心线与第一方向一致的方式被夹持。所述第二转移驱动机构用于驱动所述第二硅棒夹具及其夹持的硅棒沿着第一方向移动并在第二加工区位和第二加工区位之间转移。其中,所述第二转动驱动机构更包括第二转移导轨和第二转移驱动单元,其中,第二转移导轨沿第一方向布设,用于设置所述第二硅棒夹具,所述第二转移驱动单元用于驱动所述第二硅棒夹具及其所夹持的硅棒沿所述第二转移导轨移动。Regarding the second transfer device, in the present application, the second transfer device provided in the second transfer channel includes a second silicon rod holder and a second transfer drive mechanism. Wherein, the second silicon rod clamp is used to hold the silicon rod, and the silicon rod is horizontal after being clamped by the second silicon rod clamp, that is, the axis line of the silicon rod is consistent with the first direction way to be clamped. The second transfer driving mechanism is used for driving the second silicon rod holder and the silicon rod held by it to move along the first direction and to transfer between the second processing area and the second processing area. Wherein, the second rotational drive mechanism further includes a second transfer guide rail and a second transfer drive unit, wherein the second transfer guide rail is arranged along the first direction for setting the second silicon rod holder, the second transfer guide The driving unit is used for driving the second silicon rod holder and the silicon rod held by it to move along the second transfer guide rail.
所述第二硅棒夹具包括第二夹臂安装座,在所述第二夹臂安装座上设有至少一对第二夹臂,所述至少一对第二夹臂沿第一方向对向设于所述第二夹臂安装座上,用于夹持硅棒的两个端面,所述至少一对第二夹臂中的至少一个第二夹臂可通过第二夹臂驱动机构沿着第一方向移动以调节所述至少一对第二夹臂之间的夹持间距。The second silicon rod holder includes a second clamping arm mounting seat, and at least a pair of second clamping arms is arranged on the second clamping arm mounting seat, and the at least one pair of second clamping arms face each other along the first direction It is arranged on the second clamping arm mounting seat and is used to clamp the two end faces of the silicon rod. At least one second clamping arm in the at least one pair of second clamping arms can be driven along the second clamping arm by the second clamping arm driving mechanism. The first direction moves to adjust the clamping distance between the at least one pair of second clamping arms.
在本申请的某些实施例中,如图4所示,所述第二硅棒夹具31整体上呈现为第二夹臂安装座311设置在上方,所述第二夹臂安装座311以外部分包括第二夹臂313呈下悬状态,所述第二夹臂安装座311安装于所述安装框上,所述第二夹臂313从第二夹臂安装座311处于安装框的中空部分下悬延伸,以实现所述第二夹臂313所夹持的硅棒(例如待切割的硅棒101或已切割的硅棒)处于所述硅棒加工平台的加工面上。In some embodiments of the present application, as shown in FIG. 4 , the second silicon rod holder 31 is shown as a whole with the second clamping arm mounting seat 311 disposed above, and the part outside the second clamping arm mounting seat 311 Including the second clamp arm 313 in a suspended state, the second clamp arm mounting seat 311 is mounted on the mounting frame, and the second clamp arm 313 is located under the hollow part of the mounting frame from the second clamp arm mounting seat 311 The cantilever is extended to realize that the silicon rod (for example, the silicon rod to be cut 101 or the cut silicon rod) held by the second clamping arm 313 is on the processing surface of the silicon rod processing platform.
所述第二夹臂安装座设置在第二转移导轨上,在本实施例的一实现方式中,所述第二夹臂安装座底部设置有与所述第二转移导轨相匹配的导槽结构,所述第二转移导轨沿第一方向布置,所述第二转移导轨在第一方向的长度范围至少覆盖所述第一工作区与第二工作区在第一方向的位置,以确保所述第二硅棒夹具所夹持的硅棒在两个工作区之间的移送。在本实施 例的一实现方式中,所述第二转移导轨设置为跨越所述安装框在第一方向的完整长度。The second clamp arm mounting seat is arranged on the second transfer guide rail. In an implementation of this embodiment, the bottom of the second clamp arm mounting seat is provided with a guide groove structure matching the second transfer guide rail. , the second transfer guide rail is arranged along the first direction, and the length of the second transfer guide rail in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the The transfer of the silicon rod held by the second silicon rod holder between the two working areas. In an implementation of this embodiment, the second transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.
第二夹臂安装座上还设有沿第一方向的第二导向结构,所述至少一对第二夹臂通过第二导向结构设置在第二夹臂安装座上并可产生在第一方向的移动。在实际应用中,所述第二导向结构可例如为第二夹臂导轨、第二夹臂导槽、或第二夹臂导杆等。The second clamp arm mounting seat is also provided with a second guide structure along the first direction, and the at least one pair of second clamp arms is disposed on the second clamp arm mounting seat through the second guide structure and can be generated in the first direction movement. In practical applications, the second guide structure may be, for example, a second clamp arm guide rail, a second clamp arm guide groove, or a second clamp arm guide rod.
所述至少一对第二夹臂沿第一方向对向设置,用于夹持硅棒的两个端面。The at least one pair of second clamping arms are disposed opposite to each other along the first direction, and are used for clamping two end faces of the silicon rod.
对于待切割的硅棒而言,所述硅棒为具有一定长度的圆柱结构,且其长度方向沿第一方向放置,所述端面即为长度方向两端的截面。对于已切割的硅棒而言,所述硅棒为具有一定长度的长方体结构(其截面呈矩形或类矩形),且其长度方向沿第一方向放置,所述端面即为长度方向两端的截面。For the silicon rod to be cut, the silicon rod is a cylindrical structure with a certain length, and its length direction is placed along the first direction, and the end faces are the sections at both ends of the length direction. For the cut silicon rod, the silicon rod is a cuboid structure with a certain length (its cross section is rectangular or quasi-rectangular), and its length direction is placed along the first direction, and the end faces are the cross sections at both ends of the length direction. .
所述第二夹臂从第二夹臂安装座处下垂,所述第二夹臂下方包括夹持部,用于直接接触及夹持硅棒。如图4所示,所述第二夹臂313的一端连接于第二夹臂安装座311,所述第二夹臂313的另一端连接有用于接触硅棒(例如,待切割的硅棒101或已切割的硅棒)端面的夹持部315。所述第二夹臂安装座311活动设置于所述第二转移导轨并在第二转移驱动单元驱动下沿所述第二转移导轨移动,由此带动所述第二夹臂313沿所述第二转移导轨移动。The second clamping arm hangs down from the second clamping arm mounting seat, and a clamping portion is included under the second clamping arm for directly contacting and clamping the silicon rod. As shown in FIG. 4 , one end of the second clamping arm 313 is connected to the second clamping arm mounting seat 311 , and the other end of the second clamping arm 313 is connected to a silicon rod for contacting the silicon rod (for example, the silicon rod 101 to be cut) or cut silicon rod) end face of the clamping part 315. The second clamp arm mounting seat 311 is movably arranged on the second transfer guide rail and moves along the second transfer guide rail under the driving of the second transfer drive unit, thereby driving the second clamp arm 313 along the second transfer guide rail. Two transfer rails move.
所述第二硅棒夹具还包括第二夹臂驱动机构,所述第二夹臂驱动机构可驱动所述至少一对第二夹臂中的至少一个第二夹臂沿着所述第一方向移动,以调节所述一对相对设置的第二夹臂之间的夹持间距,如此所述至少一对第二夹臂的夹持部即可在第二夹臂驱动机构作用下相互靠近或远离,以执行对硅棒的夹持或释放动作。例如,沿第一方向相对设置的两个第二夹臂的夹持部在第二夹臂驱动机构的驱动下相向靠近夹紧硅棒,并保持夹紧状态将硅棒在不同工作区之间移送和进行加工作业,在加工作业结束后将硅棒转运至承载位置后在第二夹臂驱动机构的驱动下相互远离以释放加工后硅棒。The second silicon rod holder further includes a second clamping arm driving mechanism, and the second clamping arm driving mechanism can drive at least one second clamping arm of the at least one pair of second clamping arms along the first direction move to adjust the clamping distance between the pair of oppositely arranged second clamping arms, so that the clamping parts of the at least one pair of second clamping arms can approach each other under the action of the second clamping arm driving mechanism or away to perform a gripping or releasing action on the silicon rod. For example, the clamping portions of the two second clamping arms arranged opposite to each other along the first direction are driven by the driving mechanism of the second clamping arms to clamp the silicon rod toward each other, and keep the clamping state to keep the silicon rod between different working areas. Transfer and carry out processing operations, after the processing operation is completed, the silicon rods are transported to the bearing position and then moved away from each other under the driving of the second clamping arm driving mechanism to release the processed silicon rods.
在本申请的某些实施方式中,所述第二夹臂驱动机构包括驱动电机、驱动齿轮和一对齿条。所述驱动电机带动齿轮旋转,所述一对齿条与所述驱动齿轮相对的两端啮合,当所述驱动齿轮旋转时所述一对齿条在齿轮两端方向相反的线速度的带动下表现为相互靠近或相互远离。在本实施例一实现方式中,所述一对齿条中每一齿条一端与所述驱动齿轮啮合,另一端分别连接一第二夹臂,使所述至少一对第二夹臂在第一方向沿第二夹臂安装座导轨相互远离或相互靠近。In some embodiments of the present application, the second clamp arm driving mechanism includes a driving motor, a driving gear and a pair of racks. The drive motor drives the gear to rotate, and the pair of racks meshes with opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven by the opposite linear speeds at both ends of the gear. Appears close to each other or away from each other. In an implementation of this embodiment, one end of each rack in the pair of racks is engaged with the driving gear, and the other end is connected with a second clamping arm, so that the at least one pair of the second clamping arms is in the first In one direction, the guide rails of the second clamp arm mounting seat are away from each other or approach each other.
在本申请的某些实施方式中,所述第二夹臂驱动机构包括丝杆和驱动源,其中,所述第丝杆沿第一方向设置且与所述一对第二夹臂中的任意一个第二夹臂关联,所述驱动源与所述丝杆连接,用于驱动所述丝杆转动以使得关联的第二夹臂沿第一方向移动。In some embodiments of the present application, the second clamp arm driving mechanism includes a screw rod and a drive source, wherein the first screw rod is disposed along a first direction and is connected to any one of the pair of second clamp arms A second clamp arm is associated, and the drive source is connected to the screw rod for driving the screw rod to rotate so that the associated second clamp arm moves in a first direction.
所述第二夹臂驱动机构的丝杆具有远端及近端,在具体实现方式中,例如可将所述丝杆近端连接至所述驱动源并在所述驱动源驱动下转动,所述丝杆远端以螺纹连接至所述一对第二夹臂中的任意一个第二夹臂,藉由所述丝杆两端的连接方式,所述丝杆可基于所述驱动源传动发生转动并借助螺纹连接将所述丝杆转动转化为轴线位移,所述轴向位移方向为丝杆的设置方向即第一方向;通过所述驱动源驱动所诉丝杠转动即可实现丝杆远端所连接的所述第二夹臂在第一方向的移动,所述丝杠被驱动转动的旋向变更,即可实现所关联的第二夹臂在第一方向的前进或后退。The screw rod of the second clamping arm driving mechanism has a distal end and a proximal end. In a specific implementation, for example, the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, so the The distal end of the screw rod is threadedly connected to any one of the pair of second clamping arms, and the screw rod can be rotated based on the drive source transmission by means of the connection between the two ends of the screw rod The rotation of the lead screw is converted into an axial displacement by means of a threaded connection, and the axial displacement direction is the setting direction of the lead screw, that is, the first direction; the distal end of the lead screw can be realized by driving the lead screw to rotate by the driving source. When the connected second clamping arm moves in the first direction, and the rotation direction of the lead screw is driven and rotated, the associated second clamping arm can move forward or backward in the first direction.
在本申请的某些实施方式中,所述第二夹臂驱动机构包括:双向丝杆,沿第一方向设置且在两端与所述至少一对第二夹臂螺纹连接;驱动源,用于驱动所述丝杆转动以使得所述至少一对第二夹臂沿第一方向相向移动或相背移动。In some embodiments of the present application, the second clamp arm driving mechanism includes: a bidirectional screw rod, disposed along the first direction and threadedly connected to the at least one pair of second clamp arms at both ends; a drive source, using to drive the screw to rotate so that the at least one pair of second clamping arms move toward or away from each other along the first direction.
在一实现方式中,所述第二夹臂驱动机构的双向丝杆在两端与所述一对第二夹臂螺纹连接,及所述双向丝杆为双螺纹丝杆且两端的螺纹方向相反,所述驱动源可设置在双向丝杆的任意一端或连接至所述双向丝杆以带动双向丝杆沿丝杆轴转动,藉由双向丝杆两端方向相反的螺纹,所述双向丝杆在所述驱动源驱动下转动时双向丝杆两端的运动被转化为方向相反的沿丝杠轴向及第一方向的线运动。在所述驱动源驱动下,所述一对第二夹臂即可在第一方向相向运动或相背运动。In one implementation, the bidirectional screw rod of the second clamping arm driving mechanism is threadedly connected to the pair of second clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod with opposite thread directions at both ends. , the drive source can be arranged at either end of the two-way screw or connected to the two-way screw to drive the two-way screw to rotate along the screw shaft. The motion of the two ends of the bidirectional screw rod is converted into linear motion in opposite directions along the axial direction of the screw rod and the first direction when it is rotated under the driving of the driving source. Driven by the driving source, the pair of second clamping arms can move toward or away from each other in the first direction.
在一实施方式中,所述第二夹臂安装座可以为通过所述第二夹臂驱动机构连接的多个安装座,所述一对第二夹臂中的任一个对应于一安装座,所述驱动源设于一对第二夹臂之间,在此,任一第二夹臂可沿所述导向结构移动;当所述第二硅棒夹具需整体沿导向结构移动时,例如可令所述第二夹臂驱动机构的驱动源控制所述一对第二夹臂相对静止,此时可藉由第二夹臂驱动机构的连接作用使得不同安装座相对静止,所述第二硅棒夹具的动力源可驱动任一安装座沿导向结构移动即可实现第二硅棒夹具发生整体移动。In one embodiment, the second clamp arm mounting seat may be a plurality of mounting seats connected by the second clamp arm driving mechanism, and any one of the pair of second clamp arms corresponds to a mounting seat, The driving source is arranged between a pair of second clamping arms, where any second clamping arm can move along the guide structure; when the second silicon rod holder needs to move along the guide structure as a whole, for example, it can be The driving source of the second clamping arm driving mechanism controls the pair of second clamping arms to be relatively stationary. At this time, the connection of the second clamping arm driving mechanism can make different mounting seats relatively stationary, and the second clamping arm is relatively stationary. The power source of the rod clamp can drive any mounting seat to move along the guide structure, so as to realize the overall movement of the second silicon rod clamp.
在又一实现方式中,所述第二夹臂驱动机构包括第一齿条、第二齿条以及驱动齿轮;所述第一齿条与第二齿条分别联动于一第二夹臂,所述驱动齿轮连接于驱动电机的动力输出轴(未予以图示)并与所述第一齿条和所述第二齿条相啮合,所述驱动齿轮用于在正向转动时带动所述一对第二夹臂相向运动以执行夹持动作,在逆向转动时带动所述一对第二夹臂背向运动以执行释放动作。In yet another implementation manner, the second clamping arm driving mechanism includes a first rack, a second rack and a driving gear; the first rack and the second rack are respectively linked to a second clamping arm, so The drive gear is connected to the power output shaft (not shown) of the drive motor and meshes with the first rack and the second rack, and the drive gear is used to drive the first rack during forward rotation. The second clamping arms are moved toward each other to perform the clamping action, and the pair of second clamping arms are driven to move back to perform the releasing action during the reverse rotation.
在本申请的一实施例中,所述第二夹臂呈旋转式结构,例如,所述第二硅棒夹具还包括第二夹臂转动机构,用于驱动所述第二夹臂转动。在本实施例的一实现方式中,所述至少一 对第二夹臂的任意一个夹持部或一对第二夹臂的两个夹持部设置有可转动的结构,在所述第二夹臂转动机构的驱动下使得第二夹臂的夹持部以所述硅棒的长度方向即第一方向为轴心线旋转,被夹持硅棒发生相应的以第一方向为轴心线的旋转。例如,在某些示例中,第二夹臂转动机构可例如为转动电机,所述一对第二夹臂中两个第二夹臂的夹持部均设置有可转动的结构,两个第二夹臂的夹持部或者其中一个第二夹臂的夹持部与转动电机的输出轴连接,例如,两个第二夹臂的夹持部分别连接一转动电机,由两个转动电机分别驱动对应的第二夹臂的夹持部转动,或者,其中一个第二夹臂的夹持部与转动电机连接,由所述转动电机驱动对应的那一个第二夹臂的夹持部转动,并利用摩擦力,通过夹持的硅棒的传导,带动另一个第二夹臂的夹持部也顺势转动。In an embodiment of the present application, the second clamping arm has a rotary structure. For example, the second silicon rod holder further includes a second clamping arm rotating mechanism for driving the second clamping arm to rotate. In an implementation of this embodiment, any one clamping part of the at least one pair of second clamping arms or two clamping parts of a pair of second clamping arms is provided with a rotatable structure, and the second clamping part is rotatable. Driven by the clamping arm rotation mechanism, the clamping part of the second clamping arm rotates with the length direction of the silicon rod, that is, the first direction as the axis line, and the clamped silicon rod is correspondingly rotated with the first direction as the axis line. rotation. For example, in some examples, the rotation mechanism of the second clamping arm may be, for example, a rotating motor, the clamping parts of the two second clamping arms in the pair of second clamping arms are both provided with rotatable structures, and the two second clamping arms are provided with rotatable structures. The clamping parts of the two clamping arms or the clamping part of one of the second clamping arms are connected to the output shaft of the rotating motor. For example, the clamping parts of the two second clamping arms are respectively connected to a rotating motor, and the two rotating motors are respectively connected The clamping part of the corresponding second clamping arm is driven to rotate, or, the clamping part of one of the second clamping arms is connected to a rotating motor, and the clamping part of the corresponding second clamping arm is driven by the rotating motor to rotate, And using friction force, through the conduction of the clamped silicon rod, the clamping part of the other second clamping arm is also driven to rotate according to the trend.
在本实施例的某些实施方式中,所述至少一对第二夹臂的夹持部具有用于夹持硅棒的接触面。当所述硅棒的夹持端为在细长型结构两端的两个端面时,所述夹持部的接触面可以设置为在重垂线方向的接触面或包括重垂线方向的平面的接触面。所述接触面设置在可旋转的平台上,所述平台的截面可设置为自定义的规则几何图形或不规则几何图形。In some implementations of this embodiment, the clamping portions of the at least one pair of second clamping arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rods are two end faces at both ends of the elongated structure, the contact surfaces of the clamping parts can be set as the contact surfaces in the direction of the re-perpendicular line or a plane including the direction of the re-perpendicular line. Contact surfaces. The contact surface is set on a rotatable platform, and the section of the platform can be set as a custom regular geometric figure or irregular geometric figure.
在本申请的一实施例中,所述可旋转的平台可设置为具有锁定功能的铰接装置铰接成的整体,可沿第一方向的轴心线旋转。旋转轴的轴心线连接于所述第二夹臂转动机构。In an embodiment of the present application, the rotatable platform can be provided as a whole hinged by a hinge device with a locking function, and can rotate along the axis line in the first direction. The axis line of the rotating shaft is connected to the second clamping arm rotating mechanism.
在本申请的一实施例中,所述第二夹臂的夹持部可设置为一可旋转的圆台,所述圆台的圆形平面与硅棒端面接触,在贴紧硅棒端面后保持与硅棒端面相对静止。所述夹持部还包括锁紧结构,在对硅棒进行相应加工作业(所述加工作业可例如为切割、磨面、倒角等)时所述夹持部处于锁紧状态。在硅棒的切换例如切割位置切换或研磨面切换中,所述夹持部在第二夹臂转动机构的带动下沿圆台圆心旋转。In an embodiment of the present application, the clamping portion of the second clamping arm can be set as a rotatable circular truncated cone, the circular plane of the circular truncated cone is in contact with the end face of the silicon rod, and remains in contact with the end face of the silicon rod after being abutted against the end face of the silicon rod. The end face of the silicon rod is relatively stationary. The clamping portion further includes a locking structure, and the clamping portion is in a locked state when a corresponding processing operation is performed on the silicon rod (the processing operation may be, for example, cutting, grinding, chamfering, etc.). During switching of the silicon rod, such as switching of cutting positions or switching of grinding surfaces, the clamping portion is driven by the second clamping arm rotating mechanism to rotate along the center of the circular frustum.
在一种实施例中,所述第二夹臂的夹持部包括可旋转的圆台与设置在圆台上的一系列凸出触点,所述每一触点具有一接触平面。所述圆台在第二夹臂转动机构的带动下旋转,在本实施例的一实现方式中,所述触点的凸出长度即在第一方向的位置可调节,使得在对夹持硅棒的过程中,对端面平整度较低的硅棒,可根据硅棒端面调整触点的凸出长度,使得每一接触面与硅棒端面处于贴紧状态。所述凸出长度即从圆台的圆平面至触点的接触平面间第一方向的长度。In one embodiment, the clamping portion of the second clamping arm includes a rotatable circular cone and a series of protruding contacts disposed on the circular cone, each of the contacts having a contact plane. The circular platform is rotated under the driving of the second clamping arm rotating mechanism. In an implementation of this embodiment, the protruding length of the contact point can be adjusted in the first direction, so that when the silicon rod is clamped, the protruding length of the contact can be adjusted. During the process, for the silicon rod with low flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface and the end face of the silicon rod are in a close state. The protruding length is the length in the first direction from the circular plane of the circular frustum to the contact plane of the contact.
在本申请的一实施例中,所述第二硅棒夹具的夹持部设置有压力传感器,以基于所检测的压力状态调整触点的凸出长度。通常地,在夹持硅棒的过程中,所述第二硅棒夹具的一对第二夹臂在第二夹臂驱动机构的驱动下沿第一方向相互靠近,至所述夹持部的接触面与所需夹持的硅棒的端面相互接触,当所述夹持部设置有多个触点并探测到部分触点与所接触硅棒 的端面接触的压力值小于一设定值或设定区域时,可通过调整触点的凸出长度(一般为朝向硅棒端面靠近方向)以改变夹紧度;又或者,所述第二硅棒夹具的一对第二夹臂的每一夹持部均设置为一个接触面,在对硅棒进行夹持的过程中,通过所述第二夹臂驱动机构驱动一对第二夹臂朝向硅棒两端的端面相互靠近以实现,在所述夹持部与硅棒端面接触后,由压力传感器检测硅棒的夹紧程度,当达到设定的压力范围时即第二夹臂驱动机构控制停止所述一对第二夹臂的相向运动。In an embodiment of the present application, the clamping portion of the second silicon rod holder is provided with a pressure sensor, so as to adjust the protruding length of the contact point based on the detected pressure state. Generally, in the process of clamping the silicon rod, a pair of second clamping arms of the second silicon rod clamp approach each other along the first direction under the driving of the second clamping arm driving mechanism, and the clamping portion reaches the edge of the clamping portion. The contact surface is in contact with the end surface of the silicon rod to be clamped. When the clamping part is provided with a plurality of contacts and detects that the pressure value of some contacts in contact with the end surface of the contacted silicon rod is less than a set value or When setting the area, the degree of clamping can be changed by adjusting the protruding length of the contact (generally toward the approaching direction of the end face of the silicon rod); alternatively, each of the pair of second clamping arms of the second silicon rod clamp The clamping parts are all set as a contact surface, and in the process of clamping the silicon rod, the end faces of the pair of second clamping arms toward the two ends of the silicon rod are driven by the second clamping arm driving mechanism to approach each other to achieve, in the process of clamping the silicon rod. After the clamping part is in contact with the end face of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the second clamping arm driving mechanism controls and stops the relative movement of the pair of second clamping arms. .
所述第二夹臂转动机构可设置在一对第二夹臂中的一个第二夹臂上(另一个第二夹臂仅具有转动功能),以带动所述一对第二夹臂的夹持部与所夹持的硅棒旋转;或者所述第二夹臂转动机构设置在一对第二夹臂的每一第二夹臂上,并协同运动控制所述一对第二夹臂的两个夹持部发生相同角度与方向的转动。在某些实现方式中,所述第二夹臂转动机构可设置为一驱动电机。The second clamping arm rotation mechanism can be arranged on one second clamping arm of a pair of second clamping arms (the other second clamping arm only has a rotation function) to drive the clamping of the pair of second clamping arms. The holding part rotates with the clamped silicon rod; or the second clamp arm rotation mechanism is arranged on each second clamp arm of a pair of second clamp arms, and controls the movement of the pair of second clamp arms in coordination with the movement. The two clamping parts rotate in the same angle and direction. In some implementations, the second clamp arm rotation mechanism may be configured as a drive motor.
在由硅棒切割装置对硅棒的进行切割时,可通过所述第二夹臂转动机构驱动夹持部旋转以实现。通常对单晶硅棒进行切割时,所述第二夹臂转动机构控制夹持部旋转一定角度例如90°即可实现,以利用所述硅棒切割装置对硅棒的一个侧面或相对两个侧面进行切割。When the silicon rod is cut by the silicon rod cutting device, the clamping part can be driven to rotate by the second clamping arm rotation mechanism. Usually, when cutting a single crystal silicon rod, the second clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, so that one side or two opposite sides of the silicon rod can be cut by the silicon rod cutting device. Cut on the side.
在由所述硅棒切磨一体机对硅棒的不同侧面进行磨面或对棱边进行倒角时,通过所述第二夹臂转动机构驱动夹持部旋转以实现。通常对经过开方的单晶硅棒,在对不同侧面进行研磨时,所述第二夹臂转动机构控制夹持部旋转一定角度例如90°即可实现,在对不同棱边进行倒角时,可通过控制夹持部旋转一定角度例如45°、135°等角度实现。在研磨装置所提供的研磨面为平面的情况下,在进行对硅棒的倒角时,所述第二夹臂转动机构可控制夹持部与其所夹持的硅棒旋转不同的角度进行多次倒角实现,例如,对硅棒在完成一个侧面的研磨后,对该侧面相邻的一条棱边与该棱边相对的棱边,可通过旋转一定角度例如40°、45°、50°进行多次倒角,得到在不同侧面交界处过渡更为圆滑的硅棒。所述角度均为从研磨的初始位置起始的旋转角度。所述实现倒角的方式可参考例如CN108942570A等专利公开文献,通过带动硅棒转动一定角度,磨具配合进行在第二方向的横向进给实现对棱角的磨削。When the silicon rod cutting and grinding integrated machine is used to grind different sides of the silicon rod or to chamfer the edges, the clamping part is driven to rotate by the second clamping arm rotating mechanism. Usually, when grinding different sides of a single crystal silicon rod that has been squared, the second clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90°, which can be achieved. When chamfering different edges , which can be realized by controlling the rotation of the clamping part to a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a flat surface, when chamfering the silicon rod, the second clamping arm rotation mechanism can control the rotation angle of the holding part and the silicon rod held by it to rotate at different angles. Secondary chamfering can be achieved, for example, after grinding one side of the silicon rod, the opposite edge of an edge adjacent to the side can be rotated by a certain angle such as 40°, 45°, 50° Perform multiple chamfering to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles from the initial position of grinding. For the method of realizing chamfering, reference may be made to patent publications such as CN108942570A. By driving the silicon rod to rotate by a certain angle, the grinding tool cooperates with the lateral feed in the second direction to realize the grinding of the edges and corners.
在本申请的一实施例中,所述第二硅棒夹具为升降式硅棒夹具。在一实现方式中,所述第二硅棒夹具包括升降导轨与升降方向的驱动装置,所述第二硅棒夹具的第二夹臂与所述第二夹臂安装座上承载第二夹臂的夹臂导轨可沿着所述升降导轨在第三方向运动,可用于控制硅棒外表面与硅棒切割装置或硅棒研磨装置在重垂线方向的相对位置,以选择硅棒的被切割面与硅棒切割装置用于进行切割的切割区域或选择硅棒的被研磨面与研磨工具用于进行研磨的研磨区域。在本实施例的一实现方式中,所述升降导轨设置在所述第二夹臂安装座的直立 面上,所述第二夹臂上对应设置有与所述升降导轨配合的导槽及驱动所述第二夹臂发生升降运动的驱动机构;所述驱动机构包括行进丝杠与行进电机,所述行进丝杠沿所述升降导轨设置并连接所述行进电机,在行进电机的带动下驱动所述第二夹臂在第三方向运动。在另一实现方式中,所述一对第二夹臂的每一第二夹臂悬臂设置为一伸缩装置,在伸缩驱动机构的带动下同时进行升降运动。In an embodiment of the present application, the second silicon rod holder is a lift-type silicon rod holder. In an implementation manner, the second silicon rod clamp includes a lifting guide rail and a driving device in the lifting direction, and the second clamp arm of the second silicon rod clamp and the second clamp arm mounting seat carry a second clamp arm. The clamping arm guide rail can move in the third direction along the lifting guide rail, which can be used to control the relative position of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the direction of the heavy vertical line, so as to select the cutting of the silicon rod. The face and silicon rod cutting device is used to cut the cutting area or select the ground surface of the silicon rod and the grinding area of the grinding tool for grinding. In an implementation of this embodiment, the lifting guide rail is arranged on the upright surface of the second clamping arm mounting seat, and the second clamping arm is correspondingly provided with a guide groove and a driving guide matched with the lifting guide rail A driving mechanism for the lifting movement of the second clamping arm; the driving mechanism includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and is connected to the traveling motor, and is driven by the traveling motor. The second clamp arm moves in a third direction. In another implementation manner, each second clamping arm cantilever of the pair of second clamping arms is configured as a telescopic device, and is simultaneously moved up and down under the driving of the telescopic drive mechanism.
关于所述第二转移驱动机构,所述第二转移驱动机构包括:第二转移导轨和第二转移驱动单元,其中,所述第二转移导轨沿第一方向布设,用于设置所述第二夹臂安装座,所述第二转移驱动单元用于驱动所述第二夹臂安装座及其至少一对第二夹臂沿所述第二转移导轨移动。Regarding the second transfer drive mechanism, the second transfer drive mechanism includes a second transfer guide rail and a second transfer drive unit, wherein the second transfer guide rail is arranged along a first direction for setting the second transfer guide rail. A clamp arm mounting seat, the second transfer driving unit is used to drive the second clamp arm mounting seat and at least a pair of second clamp arms to move along the second transfer guide rail.
所述第二转移驱动单元包括第二移动齿轨、第二驱动齿轮与第二驱动源。所述第二移动齿轨沿第一方向设置,与所述第二转移导轨平行。在一实施例中,所述第二移动齿轨固定在所述安装框的上表面、侧表面或下表面,设置为与所述第二转移导轨近似相同的第一方向尺度,与第二转移导轨平行且相邻设置。The second transfer driving unit includes a second moving rack, a second driving gear and a second driving source. The second moving rack is arranged along the first direction and is parallel to the second transfer guide rail. In one embodiment, the second moving rack is fixed on the upper surface, the side surface or the lower surface of the installation frame, and is set to approximately the same first direction dimension as the second transfer guide rail, which is the same as the second transfer guide rail. The guide rails are arranged in parallel and adjacent.
所述第二驱动齿轮设置于所述第二硅棒夹具上,并且与第二移动齿轨啮合,用于带动第二硅棒夹具沿第二转移导轨的运动。所述第二驱动源用于驱动所述第二驱动齿轮。在本申请的一实现方式中,所述第二驱动齿轮设置在所述第二硅棒夹具的第二夹臂安装座上,所述第二驱动齿轮由第二驱动源带动旋转,所述第二驱动齿轮的轮齿与所述第二移动齿轨啮合,顺应所述第二移动齿轨行进,与第二驱动齿轮连接的第二硅棒夹具由此在第二转移导轨上产生相应的移动。The second driving gear is arranged on the second silicon rod holder and meshes with the second moving rack, so as to drive the second silicon rod holder to move along the second transfer guide rail. The second drive source is used to drive the second drive gear. In an implementation manner of the present application, the second driving gear is disposed on the second clamping arm mounting seat of the second silicon rod holder, the second driving gear is driven to rotate by a second driving source, and the first The teeth of the two driving gears mesh with the second moving rack, and travel in accordance with the second moving rack, so that the second silicon rod clamp connected to the second driving gear moves accordingly on the second transfer rail. .
在本申请的一实施例中,所述第二转移驱动单元可设置在所述第二硅棒夹具上,包括第二移动丝杆和第二驱动源,其中,所述第二移动丝杆沿第一方向设置且与所述第二夹臂安装座关联,所述第二驱动源用于驱动所述第二移动丝杆转动以使所关联的第二夹臂安装座及其至少一对第二夹臂沿所述第二转移导轨移动。In an embodiment of the present application, the second transfer driving unit may be disposed on the second silicon rod holder, and includes a second moving screw and a second driving source, wherein the second moving screw is along the The first direction is set and associated with the second clamp arm mounting seat, and the second driving source is used to drive the second moving screw to rotate so as to make the associated second clamp arm mounting seat and its at least a pair of first The two clamp arms move along the second transfer guide rail.
在本实施例一实现方式中,所述第二驱动源可设置为驱动电机,所述驱动电机的动力输出轴与所述第二驱动齿轮轴接,控制第二驱动齿轮的运动状态,继而所述第二驱动源控制所述第二硅棒夹具与其所夹持的硅棒在第一方向的移动。In an implementation manner of this embodiment, the second driving source may be set as a driving motor, and the power output shaft of the driving motor is axially connected with the second driving gear to control the motion state of the second driving gear, and then the The second driving source controls the movement of the second silicon rod holder and the silicon rod clamped in the first direction.
结合前述的第一转移装置,第二转移装置中的第二转移导轨与第一转移装置中的第一转移导轨均为沿第一方向的平行设置,第一转移装置的第一硅棒夹具和第二转移装置的第二硅棒夹具分别在由第一转移导轨和第二转移导轨所限定的相互平行的路径上移动。当第一硅棒夹具及其所夹持的硅棒从不同加工区位之间转移时,第二硅棒夹具及其所夹持的硅棒也可在 不同加工区位之间转移,且,所述第一硅棒夹具与所述第二硅棒夹具的运动相互独立,限定其运动范围的第一转移导轨和第二转移导轨分别设置于不同的空间位置,互不干扰。在本申请的一实施例中,所述硅棒切磨一体机的机座与所述安装框的俯视图均显示为规则的矩形,所述第一转移导轨与第二转移导轨均沿着所述第一方向布置,为平行且对称的设置,所述对称线即为机座在第一方向的中线轴心线。Combined with the aforementioned first transfer device, the second transfer guide rail in the second transfer device and the first transfer guide rail in the first transfer device are both arranged in parallel along the first direction, and the first silicon rod clamp of the first transfer device and The second silicon rod holders of the second transfer device move on mutually parallel paths defined by the first transfer guide rail and the second transfer guide rail, respectively. When the first silicon rod holder and the silicon rod held by it are transferred from different processing positions, the second silicon rod holder and the silicon rod held by it can also be transferred between different processing positions, and the said The movements of the first silicon rod holder and the second silicon rod holder are independent of each other, and the first transfer guide rail and the second transfer guide rail, which limit the movement range thereof, are respectively arranged in different spatial positions without interfering with each other. In an embodiment of the present application, the top view of the stand and the mounting frame of the integrated silicon rod cutting and grinding machine are both shown as regular rectangles, and the first transfer guide rail and the second transfer guide rail are both along the The arrangement in the first direction is parallel and symmetrical, and the symmetry line is the center line of the machine base in the first direction.
由上可知,所述第一转移装置和第二转移装置用于实现对硅棒的运动控制,例如,利用第一转移装置夹持硅棒并带动所述硅棒沿第一方向运动,利用第二转移装置夹持硅棒并带动所述硅棒沿第一方向运动,即可使得任意一个硅棒相对于位于第一加工区位的硅棒切割装置或位于第二加工区位的研磨装置沿第一方向运动,以实现预设的切割作业或研磨作业。It can be seen from the above that the first transfer device and the second transfer device are used to control the motion of the silicon rod. For example, the first transfer device is used to clamp the silicon rod and drive the silicon rod to move in the first direction. The second transfer device clamps the silicon rod and drives the silicon rod to move in the first direction, so that any silicon rod can move along the first direction relative to the silicon rod cutting device located in the first processing area or the grinding device located in the second processing area. Directional movement to achieve preset cutting or grinding jobs.
在本申请的硅棒切磨一体机中,所述硅棒切割装置设于所述硅棒加工平台的第一加工区位处,用于对第一转移通道上由所述第一转移装置所夹持的硅棒或者第二转移通道上由所述第二转移装置所夹持的硅棒进行切割作业。In the integrated silicon rod cutting and grinding machine of the present application, the silicon rod cutting device is provided at the first processing area of the silicon rod processing platform, and is used for the first transfer channel to be clamped by the first transfer device. The silicon rod held by the second transfer channel or the silicon rod held by the second transfer device performs the cutting operation.
所述硅棒切割装置中包括多个切割轮及绕于所述多个切割轮以形成的切割线锯,通过所述第一硅棒夹具或第二硅棒夹具带动硅棒沿第一方向运动,由此可将所述硅棒切割装置在执行切割作业时可设置为固定状态即可实现切割线锯与硅棒间的相对进给。传统的硅棒切磨一体机中需要通过令切割线锯在空间中移动以实现对待切割硅棒的切割的方式,由此需要为切割轮及切割线配置驱动装置及导向结构以实现切割线锯相对硅棒进给;在此,本申请硅棒切割装置的结构即可化简,切割轮可固定于硅棒切割装置的主体例如切割架上,并可省略令切割轮沿硅棒轴心线方向运动的导向结构及驱动装置,即可缩减硅棒切割装置的结构与所占据的设备空间。The silicon rod cutting device includes a plurality of cutting wheels and a cutting wire saw formed around the plurality of cutting wheels, and the silicon rod is driven to move in a first direction by the first silicon rod clamp or the second silicon rod clamp Therefore, the silicon rod cutting device can be set in a fixed state when performing the cutting operation, so as to realize the relative feeding between the cutting wire saw and the silicon rod. In the traditional integrated silicon rod cutting and grinding machine, it is necessary to move the cutting wire saw in the space to realize the cutting of the silicon rod to be cut. Therefore, it is necessary to configure a driving device and a guiding structure for the cutting wheel and the cutting wire to realize the relative relationship between the cutting wire saw. Silicon rod feeding; here, the structure of the silicon rod cutting device of the present application can be simplified, the cutting wheel can be fixed on the main body of the silicon rod cutting device, such as a cutting frame, and the cutting wheel can be omitted to be along the axis of the silicon rod. The moving guide structure and the driving device can reduce the structure of the silicon rod cutting device and the equipment space occupied.
所述硅棒切割装置设于所述硅棒加工平台的第一加工区位处,用于对第一转移通道上由所述第一转移装置所夹持的待切割硅棒或者第二转移通道上由所述第二转移装置所夹持的待切割硅棒进行切割作业。The silicon rod cutting device is arranged at the first processing area of the silicon rod processing platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or on the second transfer channel. The cutting operation is performed on the silicon rod to be cut held by the second transfer device.
在某些实施方式中,所述硅棒切割装置包括:切割架、至少一线切割单元、以及切割转换机构;其中,所述至少一线切割单元设于所述切割架上,所述切割转换机构用于驱动所述切割架及其上的至少一线切割单元在第一转移通道和第二转移通道之间转换。In some embodiments, the silicon rod cutting device includes: a cutting frame, at least one wire cutting unit, and a cutting conversion mechanism; wherein, the at least one wire cutting unit is provided on the cutting frame, and the cutting conversion mechanism uses The cutting frame and at least one wire cutting unit thereon are switched between the first transfer channel and the second transfer channel.
所述至少一线切割单元设于所述切割架,所述线切割单元包括:多个切割轮、过渡轮、以及切割线,所述切割线绕于所述多个切割轮及过渡轮以形成至少一切割线锯。The at least one wire cutting unit is arranged on the cutting frame, and the wire cutting unit includes: a plurality of cutting wheels, a transition wheel, and a cutting wire, and the cutting wire is wound around the plurality of cutting wheels and the transition wheel to form at least one A cutting wire saw.
所述切割架用于设置所述线切割单元,在此,切割架的具体结构可基于切割轮及过渡轮的布置需求设为不同形式,例如为柱体、梁体、板架。The cutting frame is used to set the wire cutting unit. Here, the specific structure of the cutting frame can be set in different forms based on the arrangement requirements of the cutting wheel and the transition wheel, such as a column, a beam, and a plate frame.
在某些实施方式中,所述线切割单元中的多个切割轮及过渡轮连接于所述切割架,又或,所述多个切割轮及过渡轮通过支架、连接板、或安装框架设于所述切割架,在此,用于设置多个切割轮及过渡轮的载体可以为不同形式,本申请不作限制。In some embodiments, a plurality of cutting wheels and transition wheels in the wire cutting unit are connected to the cutting frame, or, the plurality of cutting wheels and transition wheels are arranged through a bracket, a connecting plate, or a mounting frame. Regarding the cutting frame, the carrier for arranging a plurality of cutting wheels and transition wheels can be in different forms, which is not limited in this application.
请参阅图5,显示为本申请的硅棒切磨一体机中硅棒切割装置在一实施例中的示意图。Please refer to FIG. 5 , which is a schematic diagram of an embodiment of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine of the present application.
在某些实施方式中,如图5所示实施例,所述硅棒切割装置4包括:切割架41、至少一线切割单元43、以及切割转换机构,其中,所述线切割单元43藉由线切割支座430设于所述切割架41。在此,所述线切割支座430作为将线切割单元43中多个切割轮及过渡轮关联于切割架41的载体,所述线切割支座430的具体形式可以为梁体、板架、支架等。In some embodiments, as shown in the embodiment shown in FIG. 5 , the silicon rod cutting device 4 includes: a cutting frame 41 , at least a wire cutting unit 43 , and a cutting conversion mechanism, wherein the wire cutting unit 43 uses a wire The cutting support 430 is provided on the cutting frame 41 . Here, the wire cutting support 430 serves as a carrier for associating a plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the specific form of the wire cutting support 430 can be a beam body, a plate frame, bracket etc.
在一实现方式中,所述线切割支座通过导轨或导柱等导向结构设于所述切割架,其中,所述导轨或导柱沿线切割单元中切割轮轮面的垂线方向设置,以令所设置的线切割单元具有沿切割轮轮面的垂线方向移动的自由度;在此设置下,所述线切割支座即可在驱动源作用下沿切割轮轮面的正交方向移动。In an implementation manner, the wire cutting support is arranged on the cutting frame through a guide structure such as a guide rail or a guide post, wherein the guide rail or guide post is arranged along the vertical direction of the wheel surface of the cutting wheel in the wire cutting unit, so as to The set wire cutting unit has the freedom to move along the vertical direction of the cutting wheel surface; under this setting, the wire cutting support can move along the orthogonal direction of the cutting wheel surface under the action of the driving source .
当所述线切割单元沿切割轮轮面的垂线方向移动,对应地,所述线切割单元中的切割线锯沿切割轮轮面的垂线方向移动,所述切割线锯即实现相对于硅棒的轴心的远离或靠近,由此可调整对硅棒的切割量或切割位置。When the wire cutting unit moves along the vertical direction of the cutting wheel surface, correspondingly, the cutting wire saw in the wire cutting unit moves along the vertical direction of the cutting wheel surface, and the cutting wire saw is relatively The distance or closeness of the axis of the silicon rod can adjust the cutting amount or cutting position of the silicon rod.
所述切割轮中设有可用于缠绕切割线的至少一切割线槽,所述切割线槽可限定切割线位置从而控制切割精度。任一所述切割线锯由切割线缠绕于两个切割轮间形成,所述两个切割轮的位置及切割轮间的位置关系可用于确定所述切割线锯的方向。The cutting wheel is provided with at least one cutting wire groove for winding the cutting wire, and the cutting wire groove can define the position of the cutting wire to control the cutting precision. Any of the cutting wire saws are formed by winding a cutting wire between two cutting wheels, and the positions of the two cutting wheels and the positional relationship between the cutting wheels can be used to determine the direction of the cutting wire saw.
所述过渡轮用于对切割线进行换向或导向,又或,所述过渡轮可用于调节所述切割线的张力。The transition wheel is used for reversing or guiding the cutting line, or the transition wheel can be used for adjusting the tension of the cutting line.
在本申请的硅棒切磨一体机中,在切割过程中,驱动所述切割线沿绕线方向运行,由第一硅棒夹具或第二硅棒夹具带动夹持的硅棒沿硅棒轴心线方向即第一方向移动以实现相对切割线锯的进给,其中,所述切割线锯可设于第二方向或重垂线方向。In the integrated silicon rod cutting and grinding machine of the present application, during the cutting process, the cutting line is driven to run along the winding direction, and the first silicon rod clamp or the second silicon rod clamp drives the clamped silicon rod along the axis of the silicon rod. The center line direction, ie, the first direction, is moved to realize the feeding relative to the cutting wire saw, wherein the cutting wire saw can be set in the second direction or the re-perpendicular direction.
应当说明的是,所述切割线锯的方向仅当正交于所述硅棒轴心线方向即可实现切割,因此,在具体场景中所述切割线锯的方向位于第一方向的垂面内即可,为便于控制对硅棒的切割量及切割轮、过渡轮布置,以及为便于描述本申请的硅棒切割装置的结构及部件的布置方式,以下实施例以切割线锯设于第二方向或重垂线方向为例进行说明。It should be noted that the cutting wire saw can be cut only when the direction of the cutting wire is perpendicular to the axial direction of the silicon rod. Therefore, in a specific scenario, the direction of the cutting wire saw is on the vertical plane of the first direction. In order to facilitate the control of the cutting amount of the silicon rod and the arrangement of the cutting wheel and the transition wheel, as well as to facilitate the description of the structure of the silicon rod cutting device and the arrangement of the components of the present application, the following embodiment uses a cutting wire saw to be set in the No. The two-direction or the double-perpendicular direction is taken as an example for description.
在一实施例中,所述线切割单元包括:切割线;第一切割轮及第二切割轮,设于所述切割架,切割线绕于所述第一切割轮及第二切割轮以形成切割线锯;其中,所述第一切割轮的轮面与第二切割轮的轮面相平行或共面;第一过渡轮,邻设于所述第一切割轮,在牵引切割 线的状态下令第一切割轮与第一过渡轮的切割线位于第一切割轮中用于缠绕切割线的第一切割线槽所在平面内;第二过渡轮,邻设于所述第二切割轮,在牵引切割线的状态下令第二切割轮与第二过渡轮的切割线位于第二切割轮中用于缠绕切割线的第二切割线槽所在平面内;至少一第三过渡轮,设于所述第一过渡轮及第二过渡轮之间,用于牵引所述第一过渡轮与所述第二过渡轮之间的切割线,以令所述线切割单元中形成一切割容纳空间,所述切割容纳空间可容纳所述待切割硅棒且所述硅棒切割装置中仅有所述切割线锯与所述切割容纳空间相交。In one embodiment, the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form Cutting wire saw; wherein, the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; the first transition wheel, adjacent to the first cutting wheel, is ordered in the state of pulling the cutting wire The cutting lines of the first cutting wheel and the first transition wheel are located in the plane of the first cutting wire groove for winding the cutting line in the first cutting wheel; the second transition wheel, adjacent to the second cutting wheel, is in the traction The state of the cutting line makes the cutting line of the second cutting wheel and the second transition wheel located in the plane of the second cutting wire groove used for winding the cutting line in the second cutting wheel; at least one third transition wheel is arranged on the first A transition wheel and a second transition wheel are used for pulling the cutting wire between the first transition wheel and the second transition wheel, so that a cutting accommodating space is formed in the wire cutting unit, and the cutting The accommodating space can accommodate the silicon rod to be cut, and in the silicon rod cutting device, only the cutting wire saw intersects the cutting accommodating space.
所述切割轮轮面的方向与切割线锯的方向具有对应关系,应理解地,切割轮轮面与切割轮中任一切割线槽所在平面相平行,为控制切割精度及切割过程的稳定性,所述切割线锯应当位于用于缠绕切割线的切割线槽所在平面内;同时,在切割过程中,需令所述硅棒对切割线的施力方向平行于所述切割线槽,即所述切割轮轮面平行于切割方向,所述切割方向在开方作业中即为硅棒轴心线方向。The direction of the cutting wheel surface has a corresponding relationship with the direction of the cutting wire saw. It should be understood that the cutting wheel surface is parallel to the plane where any cutting wire groove in the cutting wheel is located, in order to control the cutting accuracy and the stability of the cutting process. , the cutting wire saw should be located in the plane of the cutting wire groove used for winding the cutting wire; at the same time, during the cutting process, the direction of the force applied by the silicon rod to the cutting wire should be parallel to the cutting wire groove, that is The surface of the cutting wheel is parallel to the cutting direction, and the cutting direction is the direction of the axis of the silicon rod in the squaring operation.
在本申请的硅棒切割装置中,所述切割线锯位于第二方向或重垂线方向,对应地,所述切割轮轮面平行于第二方向及硅棒轴心线方向即所述切割轮轮面位于水平面方向,或所述切割轮轮面平行于重垂线方向及硅棒轴心线方向即所述切割轮轮面位于垂平面方向。In the silicon rod cutting device of the present application, the cutting wire saw is located in the second direction or the re-perpendicular direction. Correspondingly, the cutting wheel surface is parallel to the second direction and the silicon rod axis direction, that is, the cutting The wheel surface is located in the direction of the horizontal plane, or the cutting wheel surface is parallel to the direction of the heavy vertical line and the axis of the silicon rod, that is, the cutting wheel surface is located in the vertical plane direction.
所述硅棒切割装置包括相对设置的两线切割单元,每一个线切割单元具有至少一切割线锯,因此,所述两线切割单元至少形成相平行的两切割线锯。在图5所示示例中,所述硅棒切割装置包括沿第二方向相对设置的两线切割单元43,每一个线切割单元43均具有一切割线锯439,所述切割线锯439可设于重垂线方向,如此,分属于所述两线切割单元43中的两切割线锯439均设于重垂线方向。The silicon rod cutting device includes two wire cutting units arranged opposite each other, and each wire cutting unit has at least one cutting wire saw. Therefore, the two wire cutting units form at least two parallel cutting wire saws. In the example shown in FIG. 5 , the silicon rod cutting device includes two wire cutting units 43 arranged opposite to each other along the second direction, each wire cutting unit 43 has a cutting wire saw 439 , and the cutting wire saw 439 can In the re-perpendicular direction, in this way, the two cutting wire saws 439 belonging to the two wire cutting units 43 are both arranged in the re-perpendicular direction.
请参阅图6,图6显示为图5中B处的放大示意图。在图5所示示例中,任一所述线切割单元43中包括第一切割轮431及第二切割轮433,切割线438缠绕于所述第一切割轮431及第二切割轮433以形成一切割线锯439。Please refer to FIG. 6 . FIG. 6 is an enlarged schematic view of B in FIG. 5 . In the example shown in FIG. 5 , any one of the wire cutting units 43 includes a first cutting wheel 431 and a second cutting wheel 433 , and a cutting wire 438 is wound around the first cutting wheel 431 and the second cutting wheel 433 to form A cutting wire saw 439.
所述第一切割轮中包括至少一第一切割线槽,任一所述第一切割线槽所在平面平行于第一切割轮轮面;所述第二切割轮中包括至少一第二切割线槽,任一所述第二切割线槽所在平面平行于第二切割轮轮面。The first cutting wheel includes at least one first cutting line groove, and the plane where any of the first cutting line grooves is located is parallel to the surface of the first cutting wheel wheel; the second cutting wheel includes at least one second cutting line The plane where any of the second cutting line grooves is located is parallel to the surface of the second cutting wheel.
所述第一切割轮的轮面与第二切割轮的轮面相平行或共面,以令所述切割线在缠绕于所述第一切割轮及第二切割轮时,分别对应地用于缠绕切割线的第一切割线槽及第二切割线槽位于同一平面内,如此可令所述切割线锯的方向同时位于用于缠绕切割线的第一切割线槽及第二切割线槽所在平面内。应当理解,切割线在切割作用中处于运行状态,因此所述切割线锯由其所处的空间位置定义,在本申请的实施例中,缠绕与第一切割轮与第二切割轮之间的 切割线即为切割线锯。The wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel, so that when the cutting wire is wound on the first cutting wheel and the second cutting wheel, it is respectively used for winding The first cutting wire groove and the second cutting wire groove of the cutting wire are located in the same plane, so that the direction of the cutting wire saw can be located in the plane where the first cutting wire groove and the second cutting wire groove for winding the cutting wire are at the same time. Inside. It should be understood that the cutting wire is in a running state during the cutting action, so the cutting wire saw is defined by its spatial position. The cutting wire is the cutting wire saw.
应理解地,当切割线绕于任一切割轮时,应当令所述切割轮两侧的切割线均位于所述切割轮中用于缠绕切割线的切割线槽所在平面内。It should be understood that when the cutting wire is wound around any cutting wheel, the cutting wires on both sides of the cutting wheel should all be located in the plane of the cutting wire groove for winding the cutting wire in the cutting wheel.
当切割线绕于所述第一切割轮,第一切割线槽一端的切割线由缠绕至所述第二切割轮以形成切割线锯,第一切割线槽另一端的切割线缠绕至所述第一过渡轮。如图6所示,所述第一过渡轮432邻设于所述第一切割轮431,在牵引绕于所述第一切割轮431的切割线的状态下令绕于所述第一切割轮431的切割线位于第一切割轮431中用于缠绕切割线的第一切割线槽所在平面内。When the cutting wire is wound around the first cutting wheel, the cutting wire at one end of the first cutting wire slot is wound to the second cutting wheel to form a cutting wire saw, and the cutting wire at the other end of the first cutting wire slot is wound to the The first transition wheel. As shown in FIG. 6 , the first transition wheel 432 is adjacent to the first cutting wheel 431 , and is ordered to go around the first cutting wheel 431 in a state of pulling the cutting line around the first cutting wheel 431 . The cutting line is located in the plane where the first cutting line groove for winding the cutting line in the first cutting wheel 431 is located.
当切割线绕于所述第二切割轮,第二切割线槽一端的切割线由缠绕至所述第一切割轮以形成切割线锯,第二切割线槽另一端的切割线缠绕至所述第二过渡轮。如图6所示,所述第二过渡轮434邻设于所述第二切割轮433,在牵引绕于所述第二切割轮433的切割线的状态下令绕于所述第二切割轮433的切割线位于第二切割轮433中用于缠绕切割线的第二切割线槽所在平面内。When the cutting wire is wound around the second cutting wheel, the cutting wire at one end of the second cutting wire groove is wound to the first cutting wheel to form a cutting wire saw, and the cutting wire at the other end of the second cutting wire groove is wound to the Second transition wheel. As shown in FIG. 6 , the second transition wheel 434 is adjacent to the second cutting wheel 433 , and is ordered to go around the second cutting wheel 433 in the state of pulling the cutting line around the second cutting wheel 433 The cutting line is located in the plane of the second cutting line groove in the second cutting wheel 433 for winding the cutting line.
所述第一过渡轮及第二过渡轮分别具有至少一导线槽,用于牵引所述切割线。所述第一过渡轮及第二过渡轮分别邻设于所述第一切割轮及第二切割轮,在此,所述邻设可以是左侧,右侧,上侧,下侧等,本申请不作限制。The first transition wheel and the second transition wheel respectively have at least one wire groove for pulling the cutting wire. The first transition wheel and the second transition wheel are respectively arranged adjacent to the first cutting wheel and the second cutting wheel, and here, the adjacent arrangement can be the left side, the right side, the upper side, the lower side, etc. Applications are not limited.
应理解地,当切割线绕于任一切割轮或过渡轮时,缠绕于切割轮或过渡轮的切割线方向均为对应的切割线槽或导线槽切线方向。It should be understood that when the cutting wire is wound around any cutting wheel or transition wheel, the direction of the cutting wire wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting wire groove or wire groove.
如图6所示,所述至少一第三过渡轮436设于所述第一过渡轮432及第二过渡轮434之间,用于牵引所述第一过渡轮432与所述第二过渡轮434之间的切割线,以令所述线切割单元中形成一切割容纳空间,所述切割容纳空间可容纳所述待切割硅棒且所述硅棒切割装置中仅有所述切割线锯与所述切割容纳空间相交。As shown in FIG. 6 , the at least one third transition wheel 436 is disposed between the first transition wheel 432 and the second transition wheel 434 for pulling the first transition wheel 432 and the second transition wheel 434 434, so that a cutting accommodating space is formed in the wire cutting unit, the cutting accommodating space can accommodate the silicon rod to be cut, and the silicon rod cutting device has only the cutting wire saw and the The cutting accommodation spaces intersect.
在切割作业中,所述第一硅棒夹具或第二硅棒夹具带动所夹持的硅棒相对切割线锯沿硅棒轴心线方向进给,所述切割容纳空间即为待切割硅棒从开始接触切割线至移动到切割线贯穿硅棒形成边皮的过程中硅棒的运动范围。During the cutting operation, the first silicon rod clamp or the second silicon rod clamp drives the clamped silicon rod to feed along the axis of the silicon rod relative to the cutting wire saw, and the cutting accommodating space is the silicon rod to be cut. The range of motion of the silicon rod from the start of contact with the cutting line to the movement to the process when the cutting line runs through the silicon rod to form a skin.
所述切割容纳空间可容纳待切割硅棒且所述硅棒切割装置中仅有所述切割线锯与所述切割容纳空间相交。应理解地,在切割过程中,第一硅棒夹具或第二硅棒夹具及其所夹持的待切割硅棒在运动中与硅棒切磨一体机中其他部件包括切割线(此处的切割线除却切割线锯)碰撞是需要避免的问题;同时,为实现切割,在第一硅棒夹具或第二硅棒夹具夹持硅棒移动过程中切割线锯与硅棒相对进给,因此,应当确保所述切割容纳空间中包括且仅包括硅棒与 切割线锯。The cutting accommodating space can accommodate the silicon rod to be cut, and in the silicon rod cutting device, only the cutting wire saw intersects the cutting accommodating space. It should be understood that, during the cutting process, the first silicon rod holder or the second silicon rod holder and the silicon rod to be cut held by the first silicon rod holder and the other parts of the integrated silicon rod cutting and grinding machine include the cutting line (herein) during movement. The collision of the cutting wire (removing the cutting wire saw) is a problem that needs to be avoided; at the same time, in order to achieve cutting, the cutting wire saw and the silicon rod are relatively fed during the movement of the first silicon rod clamp or the second silicon rod clamp to clamp the silicon rod, so , it should be ensured that the cutting accommodating space includes and only includes silicon rods and cutting wire saws.
所述第一过渡轮、第二过渡轮及至少一第三过渡轮均可用于实现对切割线方向的牵引,通过所述第三过渡轮牵引第一过渡轮与第二过渡轮之间的切割线以形成所述切割容纳空间。The first transition wheel, the second transition wheel, and the at least one third transition wheel can all be used to pull the cutting line, and the third transition wheel is used to pull the cutting between the first transition wheel and the second transition wheel. line to form the cut receiving space.
在某些实施方式中,所述第一过渡轮、第二过渡轮及至少一第三过渡轮用于将所述切割线牵引于远离待切割硅棒的方向。应理解地,所述第一切割轮与第一过渡轮间的切割线、以及所述第二切割轮与第二过渡轮间的切割线均位于用于缠绕切割线的第一切割线槽(或第二切割线槽)所在平面内。为形成所述切割容纳空间,在一种实现方式中,可令第一切割轮与第一过渡轮之间、以及第二切割轮与第二过渡轮之间的切割线长度足够长例如大于待切割硅棒长度,但在此设置下切割架所占设备空间过大,布局不合理。In some embodiments, the first transition wheel, the second transition wheel and the at least one third transition wheel are used for pulling the cutting wire away from the silicon rod to be cut. It should be understood that the cutting line between the first cutting wheel and the first transition wheel and the cutting line between the second cutting wheel and the second transition wheel are located in the first cutting line groove ( or the second cutting slot) in the plane. In order to form the cutting accommodating space, in an implementation manner, the lengths of the cutting lines between the first cutting wheel and the first transition wheel and between the second cutting wheel and the second transition The length of the silicon rod is cut, but under this setting, the cutting frame occupies too much equipment space and the layout is unreasonable.
在某些实施方式中,所述第一过渡轮、第二过渡轮、及至少一第三过渡轮用于将所述切割线牵引远离所述切割容纳空间。In some embodiments, the first transition wheel, the second transition wheel, and at least one third transition wheel are used to draw the cutting wire away from the cutting receiving space.
本申请提供了通过所述第一过渡轮、第二过渡轮及第三过渡轮以形成所述切割容纳空间的实施方式。在一实现方式中,所述第一过渡轮、第二过渡轮及第三过渡轮中至少一者的轮面与所述第一切割轮或第二切割轮的轮面间呈一定夹角,以使得切割线偏离于用于缠绕切割线的第一切割线槽(或第二切割线槽)所在平面,为优化所述硅棒切割装置与硅棒切磨一体机整体的结构布局,所偏离的方向可选为远离所述切割容纳空间的方向。The present application provides an embodiment in which the cutting accommodating space is formed by the first transition wheel, the second transition wheel and the third transition wheel. In an implementation manner, the wheel surface of at least one of the first transition wheel, the second transition wheel and the third transition wheel forms a certain angle with the wheel surface of the first cutting wheel or the second cutting wheel, In order to make the cutting line deviate from the plane of the first cutting line groove (or the second cutting line groove) used for winding the cutting line, in order to optimize the overall structural layout of the silicon rod cutting device and the silicon rod cutting and grinding machine, the deviation The direction of can be selected as the direction away from the cutting accommodating space.
以所述硅棒切割装置中包括相对设置的两个线切割单元为例,呈如图6所示实施例,通过将所述第一过渡轮432、第二过渡轮434及第三过渡轮436设置为朝向远离所述切割容纳空间的方向倾斜,又或将各个过渡轮设置在切割架上远离切割容纳空间的一侧,即可令所述切割线远离所述切割容纳空间,在此布局下即可有效缩减线切割单元所需的设备空间,并有益于硅棒切磨一体机整体的设备布局。Taking the silicon rod cutting device including two oppositely arranged wire cutting units as an example, in the embodiment shown in FIG. 6 , the first transition wheel 432 , the second transition wheel 434 and the third transition wheel 436 It is set to be inclined in the direction away from the cutting accommodation space, or each transition wheel is arranged on the side of the cutting frame away from the cutting accommodation space, so that the cutting line can be kept away from the cutting accommodation space. Under this layout The equipment space required by the wire cutting unit can be effectively reduced, and it is beneficial to the overall equipment layout of the silicon rod cutting and grinding integrated machine.
在此,对任一所述线切割单元,所述远离所述切割容纳空间的方向为切割轮轮面的垂线方向的矢量,以图5所示实施例为例,相对的两个线切割单元43对应的所述远离所述切割容纳空间的方向指向相反,分别为图示箭头所示方向。Here, for any of the wire cutting units, the direction away from the cutting accommodating space is the vector of the vertical direction of the cutting wheel surface. Taking the embodiment shown in FIG. 5 as an example, two opposite wire cutting The corresponding directions of the units 43 away from the cutting accommodating space point in opposite directions, which are respectively the directions shown by the arrows in the figure.
在某些实施方式中,所述第一过渡轮的轮面与第一切割轮的轮面方向可呈一定角度,所述第二过渡轮的轮面与第二切割轮的轮面方向可呈一定角度。所述第一过渡轮设置的方向仅当令所述第一切割轮另一端的切割线位于用于缠绕切割线的第一切割线槽所在平面与第一过渡轮中用于缠绕切割线的导线槽所在平面的交线内即可;以及所述第二过渡轮设置的方向仅当令所述第二切割轮另一端的切割线位于用于缠绕切割线的第二切割线槽所在平面与第二过渡轮中用于缠绕切割线的导线槽所在平面的交线内即可。In some embodiments, the wheel surface of the first transition wheel and the direction of the wheel surface of the first cutting wheel may form a certain angle, and the wheel surface of the second transition wheel and the direction of the wheel surface of the second cutting wheel may form a certain angle a certain angle. The direction in which the first transition wheel is arranged is only when the cutting line at the other end of the first cutting wheel is located in the plane where the first cutting line groove for winding the cutting line is located and the wire used for winding the cutting line in the first transition wheel. And the direction of the setting of the second transition wheel is only when the cutting line at the other end of the second cutting wheel is located in the plane where the second cutting line groove for winding the cutting line is located and the second cutting line. In the second transition wheel, the wire groove used for winding the cutting wire is located in the intersection of the plane.
通过将所述第一过渡轮及第二过渡轮设置为与所述第一切割轮或第二切割轮的轮面间呈一定夹角,所述夹角方向为令第一过渡轮或第二过渡轮朝向远离所述切割容纳空间的方向倾斜,有利于减小所需的所述第三过渡轮的数量,以及有益于减小所述线切割支座在第一方向的长度。By arranging the first transition wheel and the second transition wheel to form a certain angle with the wheel surface of the first cutting wheel or the second cutting wheel, the direction of the angle is to make the first transition wheel or the second transition wheel The transition wheel is inclined toward the direction away from the cutting accommodating space, which is beneficial to reduce the required number of the third transition wheel and the length of the wire cutting support in the first direction.
在某些实施方式中,所述切割线以首尾相接的方式绕于所述第一切割轮、第二切割轮、第一过渡轮、第二过渡轮及第三过渡轮之间以形成闭环切割线。如图6所示,所述切割线438为闭环切割线。In some embodiments, the cutting line is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel in an end-to-end manner to form a closed loop Cutting line. As shown in FIG. 6 , the cutting line 438 is a closed-loop cutting line.
线切割单元中的切割轮及过渡轮通过一环形切割线进行缠绕,在此示例下,所述硅棒切割装置即可省去贮丝筒,所述环形切割线藉由驱动装置运行即可实现切割。The cutting wheel and the transition wheel in the wire cutting unit are wound by an annular cutting wire. In this example, the wire storage drum can be omitted from the silicon rod cutting device, and the annular cutting wire can be realized by running the driving device. cut.
在现有的硅棒切割装置中,切割线从放线筒缠绕至线切割单元中的切割轮及过渡轮间,并从所述线切割单元缠绕至收线筒,在切割作业中,所述切割线被驱动运行,切割线运行过程为交替进行的加速与减速过程。在本申请的硅棒切割装置中,线切割单元中的环形切割线可保持持续高速运行,同时,环形切割线在切割作业中可以同一运转方向运行。如此,本申请的线切割单元可实现高精度的切割作业,避免了现有的切割方式中切割线运行换向或运行速度导致的切割面具有波纹等问题;同时,所述环形切割线可有效减小线切割单元所需的切割线总长,降低生产成本。In the existing silicon rod cutting device, the cutting wire is wound from the pay-off drum to between the cutting wheel and the transition wheel in the wire cutting unit, and is wound from the wire cutting unit to the wire take-up drum. During the cutting operation, the The cutting line is driven to run, and the running process of the cutting line is an alternate acceleration and deceleration process. In the silicon rod cutting device of the present application, the annular cutting wire in the wire cutting unit can maintain continuous high-speed running, and at the same time, the annular cutting wire can run in the same running direction during the cutting operation. In this way, the wire cutting unit of the present application can realize high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the annular cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit, reducing production costs.
在某些实施方式中,所述线切割单元中包括两个第三过渡轮,其中,所述切割线顺次缠绕于所述第一切割轮、第二切割轮、第二过渡轮、一第三过渡轮、另一第三过渡轮、第一过渡轮、第一切割轮以形成首尾相接的环形切割线。In some embodiments, the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, the second transition wheel, and the first cutting wheel in turn. There are three transition wheels, another third transition wheel, a first transition wheel, and a first cutting wheel to form an end-to-end annular cutting line.
请结合参阅图6,以所述第一切割轮431为环形切割线绕线的起点为例,所述切割线从第一切割轮431缠绕至第二切割轮433,形成在两个切割轮间的切割线锯439;从第二切割轮433处切割线顺次缠绕至第二过渡轮434、一第三过渡轮436、另一第三过渡轮436、第一过渡轮432、第一切割轮431,由此形成首尾相接的环形绕线,同时,通过多个过渡轮对切割线的牵引导向,所述线切割单元中形成所述切割容纳空间。Please refer to FIG. 6 , taking the first cutting wheel 431 as the starting point of the winding of the annular cutting wire as an example, the cutting wire is wound from the first cutting wheel 431 to the second cutting wheel 433 and is formed between the two cutting wheels The cutting wire saw 439; the cutting wire is wound from the second cutting wheel 433 to the second transition wheel 434, a third transition wheel 436, another third transition wheel 436, a first transition wheel 432, and a first cutting wheel. 431 , thereby forming an end-to-end annular winding, and at the same time, through the pulling and guiding of the cutting wire by a plurality of transition wheels, the cutting accommodating space is formed in the wire cutting unit.
当然,应理解地,所述第一过渡轮、第二过渡轮及第三过渡轮相对于所述切割轮设置的位置及轮面的倾斜方向不以图示实施例为限,仅当令切割线缠绕于线切割单元的多个切割轮及过渡轮之间时形成所述切割容纳空间即可。同时,所述线切割单元第三过渡轮还可设置为三个、四个等,本申请不作限制。Of course, it should be understood that the positions of the first transition wheel, the second transition wheel and the third transition wheel relative to the cutting wheel and the inclination direction of the wheel surface are not limited to the embodiment shown in the figure, only when cutting The cutting accommodating space may be formed when the wire is wound between the plurality of cutting wheels and the transition wheel of the wire cutting unit. At the same time, the third transition wheel of the wire cutting unit can also be set to three, four, etc., which is not limited in this application.
在某些实施方式中,所述硅棒切割装置中还包括切割线驱动装置,用于驱动所述切割线运行以对硅棒进行切割。In some embodiments, the silicon rod cutting device further includes a cutting wire driving device for driving the cutting wire to run to cut the silicon rod.
线切割的原理是由高速运行的钢线带动附着在钢线上的切割刃料或者直接采用金刚线对待加工工件进行摩擦,从而达到线切割的目的。在此,所述切割线驱动装置即用于实现切割线运行。The principle of wire cutting is that the high-speed running steel wire drives the cutting blade material attached to the steel wire or directly uses the diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. Here, the cutting wire driving device is used to realize the running of the cutting wire.
在某些实施方式中,所述切割线驱动装置为电机,具有动力输出轴且所述动力输出轴轴连接于所述第一切割轮或第二切割轮,如此,切割线可藉由所缠绕的切割轮带动以沿绕线方向运行。当然,在具体实现方式中,所述切割线驱动装置还可为别的驱动源例如液力马达,仅当实现带动所述切割线运行即可,本申请不作限制。In some embodiments, the cutting wire driving device is a motor with a power take-off shaft and the power take-off shaft is connected to the first cutting wheel or the second cutting wheel, so that the cutting wire can be wound by The cutting wheel is driven to run along the winding direction. Of course, in a specific implementation manner, the cutting wire driving device may also be another driving source, such as a hydraulic motor, only when the cutting wire is driven to run, which is not limited in this application.
在某些实施方式中,所述硅棒切割装置中还包括张力检测机构。在线切割加工中,切割线张力大小影响切割中的成品率和加工精度,所述张力检测机构进行张力检测并调整使切割线的张力达到设定的一定阈值并在切割中保持一恒定值或以恒定值为数值中心所允许的一定范围。In some embodiments, the silicon rod cutting device further includes a tension detection mechanism. In the wire cutting process, the tension of the cutting wire affects the yield and processing accuracy of the cutting. The tension detection mechanism performs tension detection and adjusts so that the tension of the cutting wire reaches a certain threshold set and maintains a constant value or a constant value during cutting. The constant value is a certain range allowed by the center of the value.
在一实现方式中,所述线切割单元中的过渡轮在实现对切割线的导向牵引时,同时作为切割线张力调节的张紧轮。In an implementation manner, the transition wheel in the wire cutting unit simultaneously serves as a tensioning wheel for adjusting the tension of the cutting wire when realizing the guiding and pulling of the cutting wire.
张紧轮用于调整切割线的张力,可以减少切割线的断线概率以减少耗材。在切割作业中,切割线的作用举足轻重,但即便最好的切割线,其延伸度及耐磨度也是有限度的,也就是说切割线在持续运行中会逐渐变细,直至最终被拉断。因此,现在的线切割设备一般都会设计切割线张力补偿机构,用于弥补切割线往返行走中的延伸度,采用张紧轮即是一种实施手段。The tensioning wheel is used to adjust the tension of the cutting line, which can reduce the probability of breaking the cutting line and reduce the consumables. In the cutting operation, the role of the cutting wire is very important, but even the best cutting wire has limited elongation and wear resistance, which means that the cutting wire will gradually become thinner during continuous operation until it is finally broken. . Therefore, the current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the extension of the cutting wire when it travels back and forth.
在申请的某些实施例中,所述张力检测机构至少包括:张力传感器,伺服电机以及丝杆;所述张力传感器设置于所述过渡轮上,不断感测所述过渡轮上切割线的张力值,并于该张力值小于预设值时发出驱动信号;所述伺服电机电性连接所述张力传感器,用于接收到所述张力传感器发出的驱动信号后开始工作;所述丝杆一端连接所述张紧轮,另一端连接所述伺服电机,并于伺服电机工作时牵引所述过渡轮进行单向位移,以调整所述切割线的张力。In some embodiments of the application, the tension detection mechanism at least includes: a tension sensor, a servo motor and a lead screw; the tension sensor is arranged on the transition wheel, and continuously senses the tension of the cutting wire on the transition wheel value, and send out a drive signal when the tension value is less than the preset value; the servo motor is electrically connected to the tension sensor to start working after receiving the drive signal sent by the tension sensor; one end of the lead screw is connected to The other end of the tension wheel is connected to the servo motor, and when the servo motor works, the transition wheel is pulled to perform one-way displacement, so as to adjust the tension of the cutting line.
在某些实施方式中,所述硅棒切割装置还包括:至少一调距机构,设于所述至少一线切割单元,用于驱动所述线切割单元中多个切割轮相对所述切割架沿垂直于切割轮轮面的方向移动。所述硅棒切割装置可基于调距机构实现切割线在切割轮不同切割槽之间的切换,又或调整切割线锯的位置以改变相对于硅棒的切割位置(或加工规格)。In some embodiments, the silicon rod cutting device further includes: at least one distance adjusting mechanism, which is provided in the at least one wire cutting unit and is used to drive a plurality of cutting wheels in the wire cutting unit relative to the edge of the cutting frame. Move perpendicular to the face of the cut-off wheel. The silicon rod cutting device can realize the switching of the cutting wire between different cutting grooves of the cutting wheel based on the distance adjustment mechanism, or adjust the position of the cutting wire saw to change the cutting position (or processing specification) relative to the silicon rod.
在某些实现方式中,请结合图5和图6,以硅棒切割装置中的一个线切割单元为例进行说明,线切割单元中包括多个切割轮及过渡轮。用于承载所述多个切割轮及过渡轮的载体例如图5所示的线切割支座430,所述调距机构可用于驱动所述线切割支座430整体沿切割轮轮面的垂线方向移动,所述过渡轮与切割轮共同跟随线切割支座发生沿切割轮轮面的垂线方 向(即,第二方向)的移动,在此状态下,所述多个切割轮及过渡轮为相对静止,即,过渡轮与切割轮之间的位置关系不变。此时,所述调距机构即用于调整所述至少一线切割单元中至少一线割线锯相对于硅棒的切割位置。In some implementations, please refer to FIG. 5 and FIG. 6 , taking a wire cutting unit in the silicon rod cutting device as an example for description, and the wire cutting unit includes a plurality of cutting wheels and transition wheels. The carrier for carrying the plurality of cutting wheels and transition wheels is, for example, the wire cutting support 430 shown in FIG. 5 , and the distance adjustment mechanism can be used to drive the wire cutting support 430 as a whole along the vertical line of the cutting wheel surface moving in the direction, the transition wheel and the cutting wheel together follow the wire cutting support to move along the vertical direction (ie, the second direction) of the cutting wheel surface, in this state, the plurality of cutting wheels and transition wheels It is relatively static, that is, the positional relationship between the transition wheel and the cutting wheel does not change. At this time, the distance adjusting mechanism is used to adjust the cutting position of the at least one wire cutting wire saw relative to the silicon rod in the at least one wire cutting unit.
在某些实施中,每一切割轮上具有至少两个切割线槽,不同切割线槽相互平行且不同切割线槽间具有切割轮轮面的垂线方向的切割偏移量。当所述调距机构用于驱动所述线切割单元中的多个切割轮相对于线切割支座移动,即可变换切割线绕于所述切割轮上的线槽位置。在一实现方式中,线切割单元中的多个切割轮例如可连接于支架,其中所述支架并活动设置于所述线切割支座并由所述调距机构驱动以沿切割轮轮面的垂线方向移动。In some implementations, each cutting wheel has at least two cutting line grooves, different cutting line grooves are parallel to each other and there is a cutting offset in the vertical direction of the cutting wheel surface between different cutting line grooves. When the distance adjusting mechanism is used to drive the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the positions of the wire grooves on which the cutting wire is wound around the cutting wheels can be changed. In one implementation, a plurality of cutting wheels in the wire cutting unit can be connected to a bracket, for example, wherein the bracket is movably arranged on the wire cutting support and is driven by the distance adjustment mechanism to follow the direction of the cutting wheel surface. Move in the vertical direction.
当所述至少一调距机构用于实现变换切割线绕于所述至少一线切割单元中多个切割轮的切割线槽,在实际场景中,可预先确定的换槽前后切割线所分别对应的切割线槽,例如,换槽前切割线所在位置为切割线槽a1,换槽后切割线绕于切割线槽a2,基于切割线槽a1与切割线槽a2之间的切割偏移量确定所述至少一调距机构驱动线切割单元中的多个切割轮移动的位移量,即将所述位移量设置为切割线槽a1与切割线槽a2之间的切割偏移量,即可用于实现切割线用切割线槽a1至切割线槽a2的更换;应当说明的是,所述至少一调距机构驱动线切割单元中多个切割轮在沿切割轮轮面的垂线方向移动的指向为切割线槽a2指向切割线槽a1的方向,换槽后所述切割线锯在空间中的切割位置不变,则省去了进一步校准切割轮或其他部件位置的步骤即可按照预设的切割量对硅棒进行切割,使得换槽过程被简化。When the at least one distance adjusting mechanism is used to realize the changing of the cutting line around the cutting line grooves of the plurality of cutting wheels in the at least one line cutting unit, in the actual scene, the corresponding cutting lines before and after the groove changing can be determined in advance. Cutting wire groove, for example, the position of the cutting wire before the groove change is the cutting wire groove a1, after the groove changing, the cutting wire is wound around the cutting wire groove a2, based on the cutting offset between the cutting wire groove a1 and the cutting wire groove a2. The displacement amount that the at least one distance adjusting mechanism drives the movement of the plurality of cutting wheels in the wire cutting unit, that is, the displacement amount is set as the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, which can be used to realize cutting Replacing the wire cutting wire groove a1 to the cutting wire groove a2; it should be noted that the at least one distance adjustment mechanism drives the multiple cutting wheels in the wire cutting unit to move in the direction of the vertical line of the cutting wheel surface. The wire groove a2 points to the direction of the cutting wire groove a1. After the groove is changed, the cutting position of the cutting wire saw in the space remains unchanged, and the step of further calibrating the position of the cutting wheel or other components is omitted, and the preset cutting amount can be The silicon rods are cut so that the slot changing process is simplified.
为进一步说明所述至少一调距机构实现对线切割单元中多个切割轮相对所述切割架沿垂直于切割轮轮面的方向移动的实现方式,本申请提供了以下实施例。当所述硅棒切割装置中的线切割单元数量不同,所述至少一调距机构的具体形式可作相应变化。In order to further illustrate the manner in which the at least one distance adjusting mechanism realizes the movement of the plurality of cutting wheels in the wire cutting unit relative to the cutting frame in a direction perpendicular to the wheel surface of the cutting wheel, the present application provides the following embodiments. When the number of wire cutting units in the silicon rod cutting device is different, the specific form of the at least one distance adjusting mechanism can be changed accordingly.
在一实施例中,所述线硅棒切割装置包括单线切割单元;所述调距机构包括:丝杆,沿切割轮轮面的正交方向设置且与所述单线切割单元螺纹连接;驱动源,用于驱动所述丝杆转动。In one embodiment, the wire silicon rod cutting device includes a single wire cutting unit; the distance adjustment mechanism includes: a screw rod, which is arranged in the orthogonal direction of the cutting wheel surface and is threadedly connected to the single wire cutting unit; a driving source , used to drive the screw to rotate.
在此,所述单线切割单元即为一个线切割单元,线硅棒切割装置中的单线切割单元中包括多个切割轮,切割线缠绕于多个切割轮由此形成至少一切割线锯。所述调距机构的丝杆具有远端及近端,在具体实现方式中,例如可将丝杆近端连接至驱动源并在驱动源驱动下转动,丝杆远端以螺纹连接至所述单线切割单元,藉由丝杆两端的连接方式,所述丝杆可基于驱动源传动发生转动并借助螺纹连接将丝杆转动转化为轴心线位移,所述轴向位移方向为丝杆的设置方向即切割轮轮面的正交方向;通过调距机构中驱动源驱动丝杠转动即可实现单线切割单元在切割轮轮面的正交方向的位移,所述丝杠被驱动转动的旋向不同,即可实现单线切割 单元的切割轮在切割轮轮面的正交方向的前进或后退。Here, the single wire cutting unit is a wire cutting unit, and the single wire cutting unit in the wire silicon rod cutting device includes a plurality of cutting wheels, and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting wire saw. The screw rod of the distance adjustment mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the screw rod can be connected to a driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to the Single wire cutting unit, by means of the connection at both ends of the screw rod, the screw rod can rotate based on the drive source transmission and convert the rotation of the screw rod into the displacement of the axis line by means of threaded connection, and the axial displacement direction is the setting of the screw rod The direction is the orthogonal direction of the wheel surface of the cutting wheel; the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the cutting wheel can be realized by the rotation of the lead screw driven by the driving source in the distance adjustment mechanism, and the rotation direction of the lead screw is driven to rotate. If different, the cutting wheel of the single-wire cutting unit can be advanced or retreated in the orthogonal direction of the cutting wheel surface.
在另一实施例中,所述线硅棒切割装置包括单线切割单元;所述调距机构包括:伸缩件,沿切割轮轮面的正交方向设置且与所述单线切割单元关联;驱动源,用于驱动所述伸缩件沿切割轮轮面的正交方向作伸缩运动。在此,所述伸缩件可设置为杆体结构且杆体延伸方向即为切割轮轮面的正交方向,所述伸缩件在驱动源驱动下可沿其延伸方向伸缩运动,伸缩件一端可连接至所述驱动源,可伸缩的自由端关联所述单线切割单元,即可在驱动源作用下带动所述单线切割单元的切割轮在切割轮轮面的正交方向移动。所述伸缩件例如为电动伸缩杆,又如为连接至气缸锥杆的连接杆,所述气缸即可作为驱动源,本申请不作限制。所述伸缩杆关联至所述单线切割单元的方式可为直线连接或间接连接,例如可直接连接至单线切割单元的线切割支座或切割轮支架,又或通过支座或轴承间接连接至所述单线切割单元。应当理解,所述伸缩件伸张或收缩即可对应于单线切割单元沿切割轮轮面的正交方向的前进或回退。In another embodiment, the wire silicon rod cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a telescopic member, which is arranged along the orthogonal direction of the cutting wheel surface and is associated with the single-wire cutting unit; a driving source , which is used to drive the telescopic element to perform telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel. Here, the telescopic piece can be configured as a rod body structure, and the extending direction of the rod body is the orthogonal direction of the wheel surface of the cutting wheel. The drive source, the retractable free end is associated with the single wire cutting unit, and can drive the cutting wheel of the single wire cutting unit to move in the orthogonal direction of the cutting wheel surface under the action of the driving source. The telescopic element is, for example, an electric telescopic rod, or a connecting rod connected to a cylinder taper rod, and the cylinder can be used as a driving source, which is not limited in this application. The way the telescopic rod is connected to the single-wire cutting unit can be a linear connection or an indirect connection, for example, it can be directly connected to the wire-cutting support or cutting wheel support of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or bearing. The single wire cutting unit. It should be understood that the expansion or contraction of the telescopic element can correspond to the advance or retreat of the single-wire cutting unit along the orthogonal direction of the cutting wheel surface.
在此,在本申请提供的实施例中,所述关联例如可通过卡合、螺锁、粘接、及焊接中的一种或多种实现,例如在上述实施例中,所述伸缩杆可通过卡合、螺锁、粘接、及焊接中的一种或多种方式关联所述线切割单元;当然,所述关联的实现方式并不以此为限,而旨在于实现在第二方向的传动。Here, in the embodiments provided in the present application, the association can be realized by, for example, one or more of snapping, screw locking, gluing, and welding. For example, in the above-mentioned embodiments, the telescopic rod can be The wire cutting unit is associated with one or more ways of snapping, screwing, gluing, and welding; of course, the realization of the association is not limited to this, and is intended to be realized in the second direction transmission.
在又一实施例中,所述线硅棒切割装置包括单线切割单元;所述调距机构包括:齿条,沿切割轮轮面的正交方向设置于所述单线切割单元;传动齿轮,与所述齿条啮合;驱动源,用于驱动所述传动齿轮转动。所述传动齿轮在驱动源驱动下转动,啮合于所述传动齿轮的齿条相应的沿齿条步骤方向移动,在此示例中,藉由所述齿条与传动齿轮配合,即可将驱动源驱动的转动运动转化为沿齿条方向的线运送,所述齿条沿切割轮轮面的正交方向设于所述单线切割单元,即可带动所述单线切割单元的切割轮沿切割轮轮面的正交方向移动。同时,由所述驱动源控制切换所述传动齿轮的旋向,即可使得所述单线切割单元的多个切割轮沿切割轮轮面的正交方向前进或回退。In yet another embodiment, the wire silicon rod cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a rack, which is arranged on the single-wire cutting unit along the orthogonal direction of the surface of the cutting wheel; a transmission gear, and The rack is meshed; a driving source is used to drive the transmission gear to rotate. The transmission gear rotates under the drive of the driving source, and the rack meshing with the transmission gear moves along the step direction of the rack accordingly. The rotational motion of the drive is converted into wire transportation along the direction of the rack, and the rack is arranged on the single-wire cutting unit along the orthogonal direction of the cutting wheel surface, so that the cutting wheel of the single-wire cutting unit can be driven along the cutting wheel. Orthogonal direction of the face. At the same time, the rotation direction of the transmission gear is controlled and switched by the driving source, so that the plurality of cutting wheels of the single-wire cutting unit can advance or retreat along the orthogonal direction of the cutting wheel surface.
在一实施例中,所述硅棒切割装置包括沿平行且相对设置的第一线切割单元和第二线切割单元,所述第一线切割单元和第二线切割单元中的至少一者通过所述至少一调距机构驱动沿切割轮轮面的正交方向移动,用于调整所述第一线切割单元中至少一切割线锯与所述第二线切割单元中至少一切割线锯之间的线割线锯间距、或者变换切割线绕于所述第一线切割单元中多个切割轮的切割线槽和/或所述第二线切割单元中多个切割轮的切割线槽。In one embodiment, the silicon rod cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, and at least one of the first wire cutting unit and the second wire cutting unit passes through the At least one distance adjustment mechanism is driven to move in the orthogonal direction of the wheel surface of the cutting wheel, and is used to adjust the wire between at least one cutting wire saw in the first wire cutting unit and at least one cutting wire saw in the second wire cutting unit The secant saw spacing, or the changing cutting wire is wound around the cutting wire grooves of the plurality of cutting wheels in the first wire cutting unit and/or the cutting wire grooves of the plurality of cutting wheels in the second wire cutting unit.
所述至少一调距机构即可设置为连接至所述第一线切割单元或第二线切割单元,又或同时关联所述第一线切割单元和第二线切割单元,以驱动所连接或关联的第一线切割单元或/及 第二线切割单元中的多个切割轮沿切割轮轮面的正交方向移动。The at least one distance adjusting mechanism can be configured to be connected to the first wire cutting unit or the second wire cutting unit, or to be associated with the first wire cutting unit and the second wire cutting unit at the same time, so as to drive the connected or associated wire cutting unit. The plurality of cutting wheels in the first wire cutting unit or/and the second wire cutting unit move in orthogonal directions of the cutting wheel surfaces.
在一实施例中,所述调距机构包括:丝杆,沿切割轮轮面的正交方向设置且与所述第一线切割单元或所述第二线切割单元螺纹连接;以及驱动源,用于驱动所述丝杆转动。所述丝杆与驱动源驱动第一线切割单元或所述第二线切割单元中多个切割轮在切割轮轮面的正交方向移动的方式与前述实施例类似,被调距机构驱动的所述第一切割单元或所述第二线切割单元可看作单线切割单元,此处不做赘述。应当理解,在任一线切割单元上设置所述调距机构,即可实现第一线切割单元与第二线切割单元间形成的相平行的切割线锯间距增加及减小,所述线硅棒切割装置即可将硅棒切割为不同规格。In one embodiment, the distance adjusting mechanism includes: a screw rod, which is arranged in the orthogonal direction of the wheel surface of the cutting wheel and is threadedly connected with the first wire cutting unit or the second wire cutting unit; to drive the screw to rotate. The manner in which the screw rod and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the cutting wheel surface is similar to that in the previous embodiment, and all the cutting wheels driven by the distance adjusting mechanism The first cutting unit or the second wire cutting unit may be regarded as a single wire cutting unit, which will not be repeated here. It should be understood that by setting the distance adjustment mechanism on any wire cutting unit, the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit can be increased and decreased. The silicon rod can be cut into different specifications.
在另一实施例中,所述调距机构包括:伸缩件,沿切割轮面的正交方向设置且与所述第一线切割单元或所述第二线切割单元关联;驱动源,用于驱动所述伸缩件沿切割轮轮面的正交方向作伸缩运动。在此,设置有所述调距机构的所述第一切割单元或所述第二线切割单元即可看作单线切割单元,具体实现方式可参照前述实施例,此处不再赘述。In another embodiment, the distance adjusting mechanism includes: a telescopic element, which is arranged in the orthogonal direction of the cutting wheel surface and is associated with the first wire cutting unit or the second wire cutting unit; a driving source for driving The telescopic element performs telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel. Here, the first cutting unit or the second wire cutting unit provided with the distance adjusting mechanism may be regarded as a single wire cutting unit, and the specific implementation can refer to the foregoing embodiments, which will not be repeated here.
在又一实施例中,所述调距机构包括:齿条,沿切割轮轮面的正交方向且与所述第一线切割单元或所述第二线切割单元关联;传动齿轮,与所述齿条啮合;驱动源,用于驱动所述传动齿轮转动。通过相啮合的传动齿轮与齿条,所述驱动源可控制所述齿条沿齿条方向线运动,关联于所述齿条的第一线切割单元或第二线切割单元可藉由所述齿条带动多个切割轮沿切割轮轮面的正交方向移动。In yet another embodiment, the distance adjusting mechanism comprises: a rack, along the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear, connected with the The rack is meshed; the driving source is used to drive the transmission gear to rotate. Through the meshing transmission gear and rack, the driving source can control the rack to move linearly in the direction of the rack, and the first wire cutting unit or the second wire cutting unit associated with the rack can use the teeth The strip drives the plurality of cutting wheels to move in orthogonal directions to the surfaces of the cutting wheels.
在一实施例中,所述调距机构包括:双向丝杆,沿切割轮轮面的正交方向设置且与所述第一线切割单元和所述第二线切割单元螺纹连接;以及驱动源,用于驱动所述丝杆转动以使得所述第一线切割单元和所述第二线切割单元沿切割轮轮面的正交方向相向移动或相背移动。在一种实施方式中,所述双向丝杆为双螺纹丝杆,所述双向丝杆两端分别设有螺纹且螺纹方向相反,所述驱动源可设置在双向丝杆的任一一端以带动双向丝杆沿丝杆轴转动,藉由双向丝杆两端方向相反的螺纹,所述双向丝杆在驱动源驱动下转动时双向丝杆两端的运动被转化为方向相反的轴向线运动,所述轴向即设置双向丝杆的切割轮轮面的正交方向。在所述驱动源驱动下,所述第一线切割单元与第二线切割单元所分别对应的多个切割轮即可相向运动或相背运动。In one embodiment, the distance adjusting mechanism includes: a bidirectional screw rod, which is arranged along the orthogonal direction of the wheel surface of the cutting wheel and is threadedly connected with the first wire cutting unit and the second wire cutting unit; and a driving source, It is used to drive the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the surface of the cutting wheel. In one embodiment, the two-way screw is a double-threaded screw, two ends of the two-way screw are respectively provided with threads and the thread directions are opposite, and the driving source can be arranged at either end of the two-way screw to Drive the two-way screw to rotate along the screw shaft. With the threads in opposite directions at both ends of the two-way screw, when the two-way screw is rotated under the drive of the driving source, the movement of the two ends of the two-way screw is converted into the axial line movement in the opposite direction. , the axial direction is the orthogonal direction of the cutting wheel surface of the bidirectional screw rod. Driven by the driving source, the plurality of cutting wheels corresponding to the first wire cutting unit and the second wire cutting unit respectively can move toward each other or move toward each other.
在某些实施方式中,所述调距机构为设于所述至少一线切割单元的伺服电机。在实际场景中,在所述线硅棒切割装置的至少一线切割单元上或每一线切割单元上设置伺服电机,由所述伺服电机控制对应的线切割单元在切割轮轮面的正交方向的位移。所述线切割单元可预先确定的换槽的切割偏移量或切割线变换切割位置的调整量,藉由伺服电机精确定位的功能 带动所述线切割单元中多个切割轮以预设位移量沿切割轮轮面的正交方向运动。例如,所述线硅棒切割装置中设有单线切割单元,所述单线切割单元上设有伺服电机以带动所述单线切割单元沿切割轮轮面的正交方向移动;又如,所述线硅棒切割装置中设有第一线切割单元和第二线切割单元,所述第一线切割单元或/和第二线切割单元在其对应的伺服电机带动下相对独立的沿切割轮轮面的正交方向移动。在某些示例中,所述伺服电机也可更换为行进电机与行进丝杠,应理解地,所述调距机构为驱动线切割单元中多个切割轮相对切割架移动的驱动装置,其具体形式本申请不作限制。In some embodiments, the distance adjusting mechanism is a servo motor provided in the at least one wire cutting unit. In an actual scene, a servo motor is set on at least one wire cutting unit or each wire cutting unit of the wire silicon rod cutting device, and the servo motor controls the corresponding wire cutting unit in the orthogonal direction of the cutting wheel surface. displacement. The wire cutting unit can pre-determine the cutting offset for changing grooves or the adjustment amount for changing the cutting position of the cutting wire, and the precise positioning function of the servo motor drives the plurality of cutting wheels in the wire cutting unit to a preset displacement. Movement in the direction orthogonal to the face of the cut-off wheel. For example, the wire silicon rod cutting device is provided with a single wire cutting unit, and a servo motor is provided on the single wire cutting unit to drive the single wire cutting unit to move in the orthogonal direction of the cutting wheel surface; The silicon rod cutting device is provided with a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or/and the second wire cutting unit are driven by the corresponding servo motors to be relatively independent along the positive direction of the cutting wheel surface. Move in the opposite direction. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw. It should be understood that the distance adjustment mechanism is a driving device that drives a plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame. Form This application is not limited.
在本申请的一实施例中所述切割转换机构用于驱动所述切割架及其上的至少一线切割单元在第一转移通道和第二转移通道之间转换。In an embodiment of the present application, the cutting switching mechanism is used to drive the cutting frame and at least one wire cutting unit on it to switch between the first transfer channel and the second transfer channel.
在本申请实施例中,所述硅棒加工平台沿第一方向依序设有第一加工区位和第二加工区位,所述第一加工区位和第二加工区位在第二方向上横跨硅棒加工平台的宽度尺寸。第一转移装置和第二转移装置沿第一方向并行设置,其中,第一转移装置中的第一转移通道沿第一方向穿过第一加工区位和第二加工区位,第二转移装置中的第二转移通道沿第一方向穿过第一加工区位和第二加工区位。在本申请的实施例中,所述硅棒切割装置设有切割转换机构,利用所述切割转换机构,可驱动所述切割架及其上的至少一线切割单元沿第二方向移动,以在第一转移通道和第二转移通道之间转换,例如,利用所述切割转换机构驱动所述切割架及其上的至少一线切割单元沿第二方向移动以由第一转移通道转换至第二转移通道上,或者,利用所述切割转换机构驱动所述切割架及其上的至少一线切割单元沿第二方向移动以由第二转移通道转换至第一转移通道上。In the embodiment of the present application, the silicon rod processing platform is provided with a first processing area and a second processing area in sequence along the first direction, and the first processing area and the second processing area straddle the silicon in the second direction. The width dimension of the bar processing platform. The first transfer device and the second transfer device are arranged in parallel along the first direction, wherein the first transfer channel in the first transfer device passes through the first processing area and the second processing area along the first direction, and the second transfer device passes through the first processing area and the second processing area along the first direction. The second transfer passage passes through the first processing location and the second processing location in the first direction. In the embodiment of the present application, the silicon rod cutting device is provided with a cutting conversion mechanism, and by using the cutting conversion mechanism, the cutting frame and the at least one line cutting unit on the cutting frame can be driven to move in the second direction, so as to move in the second direction in the first To switch between a transfer channel and a second transfer channel, for example, the cutting frame and at least one wire cutting unit on it are driven by the cutting conversion mechanism to move in the second direction to switch from the first transfer channel to the second transfer channel Alternatively, the cutting frame and the at least one wire cutting unit on the cutting frame are driven to move in the second direction by the cutting conversion mechanism to be converted from the second transfer passage to the first transfer passage.
在一实施例中,所述切割转换机构包括:切割转换导轨和切割转换驱动单元。In one embodiment, the cutting conversion mechanism includes: a cutting conversion guide rail and a cutting conversion driving unit.
所述切割转换导轨沿第二方向布设,用于设置所述切割架。在某些实施方式中,所述切割转换导轨沿第二方向布设在硅棒加工平台上,所述切割架通过例如滑块等架设于所述切割转换导轨上。The cutting conversion guide rail is arranged along the second direction for setting the cutting frame. In some embodiments, the cutting conversion guide rail is arranged on the silicon rod processing platform along the second direction, and the cutting frame is erected on the cutting conversion guide rail through, for example, a sliding block.
切割转换驱动单元,用于驱动所述切割架及其至少一线切割单元沿所述切割转换导轨移动。A cutting conversion driving unit is used for driving the cutting frame and its at least one line cutting unit to move along the cutting conversion guide rail.
在某些实施方式中,所述切割转换驱动单元包括:移动齿轨、驱动齿轮与驱动源。所述移动齿轨沿第二方向设置,与所述切割转换导轨平行。其中,所述移动齿轨固定在所述硅棒加工平台上,设置为与所述切割转换导轨近似相同的第二方向尺度,与切割转换导轨平行且相邻设置。In some embodiments, the cutting conversion driving unit includes: a moving rack, a driving gear and a driving source. The moving rack is arranged along the second direction and is parallel to the cutting conversion guide rail. Wherein, the moving rack is fixed on the silicon rod processing platform, is set to approximately the same second direction dimension as the cutting conversion guide rail, and is parallel to and adjacent to the cutting conversion guide rail.
所述驱动齿轮设置于所述切割架上,并且与所述移动齿轨啮合,用于带动所述切割架沿 切割转换导轨运动。所述驱动源用于驱动所述驱动齿轮。在本申请的一实现方式中,所述驱动齿轮设置在所述切割架上,所述驱动齿轮由驱动源带动旋转,所述驱动齿轮的轮齿与所述移动齿轨啮合,顺应所述移动齿轨行进,与驱动齿轮连接的切割架及其上的至少一切割单元由此在切割转换导轨上产生相应的移动。The driving gear is arranged on the cutting frame and meshes with the moving rack, so as to drive the cutting frame to move along the cutting conversion guide rail. The drive source is used to drive the drive gear. In an implementation manner of the present application, the driving gear is provided on the cutting frame, the driving gear is driven to rotate by a driving source, and the gear teeth of the driving gear mesh with the moving rack to conform to the movement The rack travels, whereby the cutting frame connected to the drive gear and at least one cutting unit thereon produce a corresponding movement on the cutting transition rail.
在某些实施方式中,所述切割转换驱动单元可设置在所述切割架上,包括移动丝杆和驱动源,其中,所述移动丝杆沿第二方向设置且与所述切割架关联,所述驱动源用于驱动所述移动丝杆转动以使所关联的切割架及其上的至少一切割单元沿切割转换导轨移动。In some embodiments, the cutting conversion drive unit may be disposed on the cutting frame, and includes a moving screw and a drive source, wherein the moving screw is disposed along the second direction and associated with the cutting frame, The driving source is used for driving the moving screw to rotate so that the associated cutting frame and at least one cutting unit on it move along the cutting conversion guide rail.
本申请硅棒切磨一体机还可包括边皮卸料装置,用于将通过硅棒切割装置对硅棒进行切割作业形成的边皮予以卸料。The integrated silicon rod cutting and grinding machine of the present application may further include an edge skin discharging device, which is used for discharging the edge skin formed by cutting the silicon rod by the silicon rod cutting device.
所述边皮卸料装置可包括边皮承托机构,用于抵靠硅棒外侧并承托切割形成的边皮。The edge skin discharging device may include a edge skin supporting mechanism for abutting against the outer side of the silicon rod and supporting the edge skin formed by cutting.
应当理解,无论是第一转移装置还是第二转移装置,所述第一转移装置中第一硅棒夹具或所述第二转移装置中第二硅棒夹具所夹持的硅棒呈卧式,即,所述硅棒的轴心线与第一方向一致。因此,利用硅棒切割装置对所述硅棒进行切割作业形成的边皮也呈卧式,边皮卸料机构对边皮承托以协助将边皮予以卸载。It should be understood that, no matter it is the first transfer device or the second transfer device, the silicon rod clamped by the first silicon rod holder in the first transfer device or the second silicon rod holder in the second transfer device is horizontal, That is, the axis line of the silicon rod is consistent with the first direction. Therefore, the edge skin formed by cutting the silicon rod by the silicon rod cutting device is also horizontal, and the edge skin unloading mechanism supports the edge skin to assist in unloading the edge skin.
所述边皮承托机构包括:承托部;驱动单元,连接所述承托部以控制所述承托部远离或抵靠所述边皮。The edge skin supporting mechanism comprises: a support part; and a driving unit connected with the support part to control the support part to move away from or abut against the edge skin.
在一些示例中,所述硅棒切磨一体机中的硅棒切割装置在硅棒加工过程中可转换切割位置,例如,所述硅棒加工平台上设有第一加工区位及第二加工区位,硅棒切割装置藉由一切割转换机构设于所述机座,并可在所述切割转换机构驱动下在第一加工区位和第二加工区位之间转换位置。在此设置下,所述边皮承托机构例如可通过一安装部设于所述硅棒切割装置,如此在硅棒切割装置转换加工区位时所述边皮承托机构相对切割组件保持相对静止。在某些示例中,所述安装部与所述切割架可拆卸连接,基于对所述硅棒承托位置需要,可将所述安装部设于硅棒切割装置上的不同位置。In some examples, the silicon rod cutting device in the integrated silicon rod cutting and grinding machine can switch the cutting position during the processing of the silicon rod. For example, the silicon rod processing platform is provided with a first processing area and a second processing area , the silicon rod cutting device is arranged on the base by a cutting conversion mechanism, and can switch positions between the first processing area and the second processing area under the driving of the cutting conversion mechanism. Under this arrangement, the edge skin supporting mechanism can, for example, be provided on the silicon rod cutting device through a mounting portion, so that the edge skin supporting mechanism remains relatively stationary relative to the cutting assembly when the silicon rod cutting device changes the processing position. . In some examples, the mounting portion is detachably connected to the cutting frame, and the mounting portion can be arranged at different positions on the silicon rod cutting device based on the requirement of the position for supporting the silicon rod.
所述边皮承托机构设于硅棒切割装置上的位置可基于硅棒切割装置中线切割单元的具体结构确定。请参阅图5,显示为一实施例中所述硅棒切磨一体机中硅棒切割装置的结构示意图。如图5所示,所述硅棒切割装置包括切割架41及线切割单元43,所述线切割单元43藉由线切割支座430设于所述切割架41。在此,所述线切割支座430作为将线切割单元43中多个切割轮及过渡轮关联于切割架41的载体,所述线切割支座430的具体形式可以为梁体、板架、支架等。在此示例下,所述边皮承托机构可藉由所述安装部设于所述线切割支座430。The position of the edge skin supporting mechanism on the silicon rod cutting device can be determined based on the specific structure of the wire cutting unit in the silicon rod cutting device. Please refer to FIG. 5 , which is a schematic structural diagram of a silicon rod cutting device in the integrated silicon rod cutting and grinding machine in one embodiment. As shown in FIG. 5 , the silicon rod cutting device includes a cutting frame 41 and a wire cutting unit 43 , and the wire cutting unit 43 is provided on the cutting frame 41 by a wire cutting support 430 . Here, the wire cutting support 430 serves as a carrier for associating a plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the specific form of the wire cutting support 430 can be a beam body, a plate frame, bracket etc. In this example, the edge skin supporting mechanism can be provided on the wire cutting support 430 through the mounting portion.
在另一些示例中,例如当所述硅棒切割装置在第一方向的位置保持不变,所述边皮承托机构可通过所述安装部设于所述机座,例如,所述安装部为一支撑柱或支架,用于设置所述边皮承托机构以令边皮承托机构中承托部在驱动单元带动下可实现对边皮的承托。In other examples, for example, when the position of the silicon rod cutting device in the first direction remains unchanged, the edge skin supporting mechanism may be provided on the machine base through the mounting portion, for example, the mounting portion It is a support column or bracket for setting the edge skin supporting mechanism, so that the supporting part in the edge skin supporting mechanism can realize the supporting of the edge skin under the driving of the driving unit.
所述边皮承托机构包括承托部,所述承托部用于接触并抵靠硅棒以实现对边皮的承托作用,应当说明的是,在本申请的各实施例中,所述承托作用即为施力于所述边皮以令边皮维持稳定的状态,以所述切割线锯设于水平线方向(即,第二方向)为例,切割形成的边皮位于硅棒上侧、下侧、或者上侧和下侧,此时所述承托部可对硅棒下侧的边皮提供支持力以防止边皮断裂,由此可令所述边皮维持稳定状态;又或当所述切割线锯设于重垂线方向,切割形成的边皮位于硅棒旁侧(左侧、右侧、或者左侧和右侧),所述承托部可设置为与硅棒外侧弧面相适应的结构以提供对边皮的支持力,或通过抵靠所述边皮以令所述边皮受到摩擦力而维持稳定状态。在图5所示示例中,所述硅棒切割装置包括沿第二方向相对设置的两线切割单元43,每一个线切割单元43均具有一切割线锯439,所述切割线锯439可设于重垂线方向,如此,分属于所述两线切割单元43中的两切割线锯439均设于重垂线方向。切割形成的边皮位于硅棒的左侧和右侧,所述承托部可设置为与硅棒外侧弧面相适应的结构以提供对边皮的支持力,或通过抵靠所述边皮以令所述边皮受到摩擦力而维持稳定状态。The edge skin supporting mechanism includes a support portion, which is used for contacting and abutting against the silicon rod to achieve a supporting effect on the edge skin. It should be noted that, in each embodiment of the present application, the The supporting function is to apply force to the edge skin to maintain a stable state. Taking the cutting wire saw as an example in the horizontal direction (ie, the second direction), the edge skin formed by cutting is located on the silicon rod. The upper side, the lower side, or the upper side and the lower side, at this time, the support part can provide a supporting force to the edge skin on the lower side of the silicon rod to prevent the edge skin from breaking, so that the edge skin can be maintained in a stable state; Or when the cutting wire saw is set in the direction of the heavy vertical line, the edge skin formed by cutting is located beside the silicon rod (the left side, the right side, or the left side and the right side), and the supporting part can be set to be connected with the silicon rod. The structure of the outer arc surface of the rod is adapted to provide a support force to the edge skin, or to maintain a stable state by abutting against the edge skin so that the edge skin is subjected to frictional force. In the example shown in FIG. 5 , the silicon rod cutting device includes two wire cutting units 43 arranged opposite to each other along the second direction, each wire cutting unit 43 has a cutting wire saw 439 , and the cutting wire saw 439 can In the re-perpendicular direction, in this way, the two cutting wire saws 439 belonging to the two wire cutting units 43 are both arranged in the re-perpendicular direction. The edge skins formed by cutting are located on the left and right sides of the silicon rod, and the supporting portion can be set to a structure adapted to the outer arc surface of the silicon rod to provide a supporting force for the edge skin, or by abutting against the edge skin to provide support for the edge skin. The edge skin is subjected to friction to maintain a stable state.
所述驱动单元用于驱动所述承托部远离或抵靠所述边皮。所述的远离或抵靠边皮的方向可以为多个方向,例如,抵靠边皮即为所述承托部在驱动单元的驱动下从与边皮相离的状态运动至接触边皮的状态,而所述承托部具体的运动方向本申请不做限制。The driving unit is used for driving the bearing portion away from or against the side skin. The directions of moving away from or abutting against the edge skin can be in multiple directions, for example, abutting the edge skin means that the supporting portion moves from a state of being separated from the edge skin to a state of contacting the edge skin under the driving of the driving unit, and The specific movement direction of the supporting portion is not limited in this application.
在一实现方式中,所述驱动单元包括:气缸或液压泵;伸缩部,连接所述承托部,在所述气缸或液压泵驱动下伸缩运动以控制所述承托部远离或抵靠所述边皮。In an implementation manner, the driving unit includes: an air cylinder or a hydraulic pump; a telescopic part, connected to the bearing part, and driven by the air cylinder or hydraulic pump to telescopically move to control the bearing part to move away from or against the supporting part; Said edge skin.
所述伸缩部可在气缸或液压泵驱动下伸缩运动,令伸缩部连接所述承托部,所述伸缩部的伸缩方向例如为远离或靠近硅棒轴线的方向,由此带动所连接的承托部远离或抵靠边皮。The telescopic part can be telescopically moved under the driving of a cylinder or a hydraulic pump, so that the telescopic part is connected to the supporting part, and the telescopic direction of the telescopic part is, for example, a direction away from or close to the axis of the silicon rod, thereby driving the connected supporting part. The support part is away from or abuts against the side skin.
在又一实现方式中,所述驱动单元包括驱动电机以及由所述驱动电机驱动的丝杆组件。所述丝杆组件可在一端与所述承托部螺纹连接,所述驱动电机驱动丝杆转动以令所述承托部沿丝杆方向移动,通过驱动电机控制丝杆旋向,即可控制承托部靠近或远离边皮。In yet another implementation, the drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The screw assembly can be threadedly connected with the bearing part at one end, the driving motor drives the screw to rotate to make the bearing part move along the direction of the screw, and the rotation direction of the screw is controlled by the driving motor to control The support part is close to or away from the edge skin.
所述承托部可设置为不同结构以实现承托作用,例如所述承托部可为承托板并具有用于接触所述边皮的弧面,又或所述承托部为具有折边以防止边皮滚动的承托板,例如承托板截面为呈梯形的槽结构(其中槽口为梯形的下底);应理解地,可用于实现边皮承托的承托部具有多种可实现方式,本申请不做限制。The supporting portion can be set in different structures to achieve the supporting effect. For example, the supporting portion can be a supporting plate and has an arc surface for contacting the edge skin, or the supporting portion has a folded surface. A support plate that prevents the edge skin from rolling, for example, the support plate has a trapezoidal groove structure (where the notch is a trapezoidal lower bottom); it should be understood that the support portion that can be used to support the edge skin has many This can be implemented, which is not limited in this application.
为实现将切割形成的边皮稳妥承托以防止边皮断裂,又或为简化边皮卸料转运,本申请还提供了以下实现方式:In order to securely support the edge skin formed by cutting to prevent the edge skin from breaking, or to simplify the unloading and transportation of the edge skin, the application also provides the following implementation methods:
在一实施例中,所述承托部包括至少两个承托块,沿所述第一方向间隔设置,具有用于接触并承载边皮的承载面。所述承托块的承载面可设置为具有弧面以适应所承托的边皮,又或可设置为由不同水平度的接触平面组成以防止边皮滚动。其中,在某些实现方式中,可为每一个承托块配置一个所述驱动单元。In one embodiment, the supporting portion includes at least two supporting blocks, which are arranged at intervals along the first direction and have a bearing surface for contacting and bearing the edge skin. The bearing surface of the supporting block can be set to have an arc surface to adapt to the supported edge skin, or can be set to be composed of contact planes with different levels to prevent the edge skin from rolling. Wherein, in some implementations, one drive unit may be configured for each support block.
应理解地,在一些加工场景中,通过一个承托块即可实现对边皮的承托;在此,本申请还提供了通过沿第一方向间隔设置的至少两个承托块实现边皮承托的实施例,通过设置所述至少两个承托块之间沿第一方向的间隔或跨距即可实现对不同长度规格的硅棒切割形成的边皮的承托,同时,由间隔设置的承托块对边皮进行承托可使边皮在不同长度方向(即第一方向)受到承托部的作用力,由此有利于防止切割线锯未贯穿硅棒前边皮发生断裂。在切割线锯贯穿硅棒以形成与硅棒相独立的边皮后,间隔设置的所述至少两个承托块可用于承托边皮以防止边皮倾斜以致坠覆。It should be understood that, in some processing scenarios, the edge skin can be supported by one supporting block; here, the present application also provides that the edge skin can be realized by at least two supporting blocks arranged at intervals along the first direction In the supporting embodiment, by setting the interval or span between the at least two supporting blocks along the first direction, the supporting of the edge skin formed by cutting silicon rods of different lengths and specifications can be realized. The provided support block supports the edge skin so that the edge skin can be subjected to the force of the support part in different length directions (ie, the first direction), thereby helping to prevent the cutting wire saw from breaking through the front edge skin of the silicon rod. After the wire saw is cut through the silicon rod to form the edge skin independent of the silicon rod, the at least two supporting blocks arranged at intervals can be used to support the edge skin to prevent the edge skin from tilting and falling over.
在某些实施方式中,所述边皮卸料机构的承托部为承托轮组,其中,所述承托轮组可为至少两个,至少两个所述承托轮组沿第一方向的间隔或跨距设置,且,每一个所述承托轮组包括:至少两个承托轮,所述至少两个承托轮沿第二方向间隔设置,用于接触以承托边皮;承托底座,连接所述驱动单元,用于设置所述至少两个承托轮以带动所述至少两个承托轮远离或抵靠所述边皮。In some embodiments, the supporting part of the side skin discharge mechanism is a supporting wheel set, wherein there may be at least two supporting wheel sets, and at least two of the supporting wheel sets are along the first The directions are arranged at intervals or spans, and each of the supporting wheel sets includes: at least two supporting wheels, the at least two supporting wheels are arranged at intervals along the second direction, and are used for contacting to support the edge skin a supporting base, connected to the driving unit, for setting the at least two supporting wheels to drive the at least two supporting wheels away from or abutting against the edge skin.
在另一实施例中,所述边皮承托机构包括至少两个承托部,所述至少两个承托部沿第一方向间隔设于所述硅棒切割装置或所述机座。其中,所述承托部为承托轮组,任一所述承托轮组包括至少两个承托轮,沿第二方向间隔设置,如此可令所承托的边皮重心在第二方向位置位于所述至少两个承托轮之间。所述承托轮用于接触并承托边皮,且与硅棒边皮接触的承托轮的切线方向沿第一方向。In another embodiment, the edge skin supporting mechanism includes at least two supporting parts, and the at least two supporting parts are disposed on the silicon rod cutting device or the machine base at intervals along the first direction. Wherein, the supporting part is a supporting wheel set, and any of the supporting wheel sets includes at least two supporting wheels, which are arranged at intervals along the second direction, so that the center of gravity of the supported side skin can be in the second direction. The location is between the at least two support wheels. The support wheel is used for contacting and supporting the edge skin, and the tangential direction of the support wheel in contact with the silicon rod edge skin is along the first direction.
在一些实现方式中,所述承托轮可沿承托轮轴心滚动,所述承托轮轴心设于第二方向。在此设置下,当切割线锯贯穿硅棒形成独立的边皮,要将边皮进行后续转运时,当所述边皮沿第一方向与承托轮组相对移动时,边皮与承托轮间为滚动摩擦,则便于实现沿第一方向对边皮的后续输送。In some implementations, the support wheel can roll along the axis of the support wheel, and the axis of the support wheel is arranged in the second direction. Under this setting, when the cutting wire saw penetrates the silicon rod to form an independent edge skin, and when the edge skin is to be subsequently transported, when the edge skin moves relative to the supporting wheel set along the first direction, the edge skin and the support There is rolling friction between the wheels, which facilitates the subsequent conveying of the edge skin along the first direction.
所述边皮承托机构还包括驱动单元,所述驱动单元用于驱动所述承托轮组运动以远离或抵靠边皮,在一实现方式中,当所述硅棒切磨一体机中硅棒切割装置的切割线锯设于第二方 向,所述驱动单元驱动所述承托轮组沿重垂线方向运动以在切割过程中抵靠并承托边皮。所述驱动单元例如为气缸或驱动电机等,所述气缸或驱动电机连接至所述承托轮组的承托底座,以驱动所述承托轮组整体沿重垂线方向升降运动。The edge skin supporting mechanism further includes a driving unit, and the driving unit is used for driving the supporting wheel set to move away from or against the edge skin. The cutting wire saw of the rod cutting device is arranged in the second direction, and the driving unit drives the supporting wheel set to move in the direction of the heavy vertical line to abut against and support the edge skin during the cutting process. The driving unit is, for example, an air cylinder or a driving motor, etc., the air cylinder or driving motor is connected to the supporting base of the supporting wheel set to drive the whole supporting wheel set to move up and down in the direction of the heavy vertical line.
在又一实施例中,所述承托部包括:至少两个承托杆,沿第一方向设置,用于接触并承托边皮;两个连接部,分设于所述承托杆的沿第一方向的相对两端,用于连接所述至少两个承托杆及所述驱动单元。In yet another embodiment, the supporting part includes: at least two supporting rods, arranged along the first direction, for contacting and supporting the edge skin; two connecting parts, respectively disposed on the edges of the supporting rods The opposite ends in the first direction are used for connecting the at least two supporting rods and the driving unit.
请参阅图5和图6,显示为本申请的边皮承托机构在一实施例中的部分结构示意图。如图所示,所述承托部611包括沿第二方向间隔设置两个承托杆6111,承托杆6111杆体沿第一方向。Please refer to FIG. 5 and FIG. 6 , which are schematic diagrams showing a part of the structure of an embodiment of the side skin supporting mechanism of the present application. As shown in the figure, the support portion 611 includes two support rods 6111 arranged at intervals along the second direction, and the rod bodies of the support rods 6111 are along the first direction.
在此,通过所述至少两个承托杆6111即可实现对边皮的承托作用,应理解地,令切割形成的所述边皮的重心位于所述至少两个承托杆6111之间即可实现对边皮的承托;同时,任一所述承托杆6111与所承托的边皮为线接触,在此设置下,可减小承托部611与边皮接触的摩擦力。Here, the at least two support rods 6111 can be used to support the edge skin. It should be understood that the center of gravity of the edge skin formed by cutting is located between the at least two support rods 6111 At the same time, any of the supporting rods 6111 is in line contact with the supported edge skin, and under this setting, the frictional force between the supporting portion 611 and the edge skin can be reduced. .
所述连接部6113分设于承托杆6111两侧可使得所述承托部611在受力远离或靠近硅棒时承托杆6111受力对称,有利于提高所述承托部的结构稳定性。如图5和图6所示实施例中,所述连接部6113分别连接所述承托杆6111及所述驱动单元,其中,所述驱动单元613通过所述安装部连接于所述线切割支座430或切割架41,可伸缩运动的自由端即连接至所述连接部6113以驱动所述承托部611整体沿驱动单元613驱动的伸缩方向移动。在图5和图6所示示例中,所述驱动单元613为具有伸缩部的气缸,所述气缸613的伸缩部连接至所述连接部6113。The connecting parts 6113 are located on both sides of the support rod 6111, so that the support rod 6111 is symmetrical in force when the support part 611 is away from or close to the silicon rod, which is beneficial to improve the structural stability of the support part. . In the embodiment shown in FIG. 5 and FIG. 6 , the connecting portion 6113 is respectively connected to the supporting rod 6111 and the driving unit, wherein the driving unit 613 is connected to the wire cutting support through the mounting portion. The free end of the base 430 or the cutting frame 41 , which can be telescopically moved, is connected to the connecting portion 6113 to drive the entire supporting portion 611 to move in the telescopic direction driven by the driving unit 613 . In the example shown in FIGS. 5 and 6 , the driving unit 613 is an air cylinder having a telescopic portion, and the telescopic portion of the air cylinder 613 is connected to the connecting portion 6113 .
在图5和图6所示示例中,所述承托部611受控沿第二方向运动以远离或靠近边皮。应理解地,当所述硅棒切割装置中切割线锯的方向不同,又或当所述承托部的结构不同,对应的所述边皮承托机构中驱动单元可设置在不同方向以适应于承托边皮的需要。例如,当所述硅棒切割装置中切割线锯沿重垂线方向,所述驱动单元例如可设置为其伸缩运动的方向为第二方向,以令承托部沿第二方向运动以靠近或远离所述边皮。例如,当所述硅棒切割装置中切割线锯沿第二方向,所述驱动单元例如可设置为其伸缩运动的方向为第三方向(即,重垂线方向),以令承托部沿第三方向运动以靠近或远离所述边皮。对所述承托部受控运动的方向,本申请不做限制,仅当令所述承托部实现对边皮的承托作用即可。In the example shown in FIG. 5 and FIG. 6 , the supporting portion 611 is controlled to move in the second direction to move away from or close to the edge skin. It should be understood that when the direction of the cutting wire saw in the silicon rod cutting device is different, or when the structure of the supporting portion is different, the driving unit in the corresponding edge skin supporting mechanism can be arranged in different directions to adapt to In order to support the needs of the edge skin. For example, when the cutting wire saw in the silicon rod cutting device is in the direction of the heavy vertical line, the driving unit can be set, for example, the direction of its telescopic movement is the second direction, so that the supporting portion moves in the second direction to approach or away from the edge. For example, when the cutting wire saw in the silicon rod cutting device is along the second direction, the driving unit can be set, for example, to set the direction of its telescopic movement to be the third direction (ie, the direction of the heavy vertical line), so that the supporting portion can be moved along the second direction. Movement in the third direction to approach or move away from the edge skin. The direction of the controlled movement of the supporting portion is not limited in the present application, and it is only required that the supporting portion can support the edge skin.
所述承托部的数量可对应于对边皮的承托需要设置,例如,当所述硅棒切割装置中包括 一切割线锯,则在一次切割作业中在对应形成一边皮,所述硅棒切割装置上可设置一承托部以实现对边皮的承托;又如,当所述硅棒切割装置中包括平行的两条切割线锯,在一次切割作业中对应的形成两边皮,所述硅棒切割装置上可设置两个承托部以分别对硅棒两侧的边皮进行承托。The number of the supporting parts can be set according to the need for supporting the edge skin. For example, when the silicon rod cutting device includes a cutting wire saw, the edge skin is formed correspondingly in one cutting operation. A support part can be provided on the rod cutting device to support the opposite side skin; another example, when the silicon rod cutting device includes two parallel cutting wire saws, the two side skins are formed correspondingly in one cutting operation, The silicon rod cutting device can be provided with two supporting parts to respectively support the edge skins on both sides of the silicon rod.
在某些实施方式中,所述边皮卸料装置还包括边皮错位机构,设于所述机座或硅棒切割装置,用于沿第一方向推动所述边皮以令所述边皮脱离所述边皮承托机构。In some embodiments, the edge skin unloading device further includes a edge skin dislocation mechanism, which is arranged on the machine base or the silicon rod cutting device, and is used for pushing the edge skin along a first direction to make the edge skin Disengage the edge skin support mechanism.
在某些实施方式中,所述边皮错位机构以相对切割线锯沿第一方向的预设间隔设于所述机座或硅棒切割装置,其中,所述第一方向平行于硅棒轴线方向。应当理解,当切割线锯贯穿硅棒时即可形成与硅棒相独立的边皮,此时,被承托部承托的边皮的一端面在第一方向的位置与切割线锯对齐,确定所述边皮错位机构与切割线锯之间在第一方向的间距,即可由边皮错位机构沿第一方向运动的位移量确定边皮被推动的距离。In some embodiments, the edge and skin dislocation mechanism is disposed on the machine base or the silicon rod cutting device at a predetermined interval relative to the cutting wire saw along a first direction, wherein the first direction is parallel to the axis of the silicon rod direction. It should be understood that when the cutting wire saw penetrates the silicon rod, an edge skin independent of the silicon rod can be formed. At this time, an end surface of the edge skin supported by the supporting portion is aligned with the cutting wire saw in the first direction. By determining the distance between the edge skin dislocation mechanism and the cutting wire saw in the first direction, the distance that the edge skin is pushed can be determined by the displacement amount of the edge skin dislocation mechanism moving in the first direction.
所述边皮错位机构可设于机座或硅棒切割装置,在具体场景中,可基于硅棒切磨一体机确定。例如,硅棒切割装置在硅棒加工过程中在第一方向的位置不变,即可将边皮错位机构设于机座或硅棒切割装置中任一者;当所述硅棒切磨一体机中硅棒切割装置在第一方向的位置在不同加工状态或切割过程中不为定值,例如硅棒切割装置沿第一方向移动以实现对硅棒进给切割,可将所述边皮错位机构设于硅棒切割装置。The edge skin dislocation mechanism can be set on the machine base or the silicon rod cutting device, and in a specific scenario, it can be determined based on the silicon rod cutting and grinding integrated machine. For example, if the position of the silicon rod cutting device in the first direction does not change during the processing of the silicon rod, the edge and skin dislocation mechanism can be arranged on either the machine base or the silicon rod cutting device; when the silicon rod is cut and ground into one piece The position of the silicon rod cutting device in the machine in the first direction is not a fixed value in different processing states or cutting processes. For example, the silicon rod cutting device moves along the first direction to realize feeding and cutting of the silicon rod, and the edge skin can be cut. The dislocation mechanism is set in the silicon rod cutting device.
应理解地,待切割硅棒轴线方向沿第一方向,切割中形成的边皮在被承托状态下也沿第一方向,所述边皮错位机构可沿第一方向推动边皮以令边皮相对边皮承托机构运动,以令边皮脱离边皮承托机构即可对边皮进行后续的转运流程。It should be understood that the axial direction of the silicon rod to be cut is along the first direction, and the edge skin formed during cutting is also along the first direction in the supported state. The edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin The skin moves relative to the edge skin supporting mechanism, so that the edge skin can be separated from the edge skin supporting mechanism and the subsequent transfer process can be performed on the edge skin.
在某些实施方式中,所述边皮错位机构包括:动力源;伸缩杆,沿第一方向设置,用于在动力源驱动下伸缩运动以推动所述边皮。In some embodiments, the side skin dislocation mechanism includes: a power source; and a telescopic rod, which is arranged along the first direction and is used for telescopic movement driven by the power source to push the side skin.
在一实现方式中,所述边皮错位机构的动力源为气缸或液压泵,其中,所述气缸或液压泵的伸缩杆沿第一方向设置。例如图5或图6所示实施例,所述硅棒切割装置中设有相平行的两个线切割单元,所述边皮卸料装置中包括两个边皮错位机构,分设于所述切割架的左侧线切割单元及右侧线切割单元,所述边皮错位机构为具有伸缩杆的气缸,所述伸缩杆沿第一方向设置并对齐至所述边皮端面。当切割线锯贯穿硅棒以形成独立的边皮后,通过边皮错位机构沿第一方向运动以抵靠至边皮端面并推动边皮运动,由此边皮可脱离边皮承托机构或脱离切割后硅棒。在此,所述边皮错位机构的伸缩杆的伸缩范围可基于硅棒的长度规格确定,又或基于边皮承托机构中承托部在第一方向的跨距确定,以控制所述边皮在第一方向被推动 的行程以确保所述边皮可实现脱离。In an implementation manner, the power source of the side skin dislocation mechanism is an air cylinder or a hydraulic pump, wherein the telescopic rod of the air cylinder or the hydraulic pump is arranged along the first direction. For example, in the embodiment shown in FIG. 5 or FIG. 6 , the silicon rod cutting device is provided with two parallel wire cutting units, and the edge skin discharging device includes two edge skin dislocation mechanisms, which are respectively installed in the cutting device. The left side line cutting unit and the right side line cutting unit of the frame, the edge skin dislocation mechanism is an air cylinder with a telescopic rod, and the telescopic rod is arranged along the first direction and aligned to the edge skin end surface. After the cutting wire saw penetrates the silicon rod to form an independent edge skin, the edge skin dislocation mechanism moves in the first direction to abut against the edge skin end face and push the edge skin to move, so that the edge skin can be separated from the edge skin support mechanism or Detach the silicon rod after cutting. Here, the telescopic range of the telescopic rod of the edge-skin dislocation mechanism may be determined based on the length specification of the silicon rod, or determined based on the span of the support part in the edge-skin support mechanism in the first direction, so as to control the edge and skin The travel of the skin being pushed in the first direction ensures that the edge skin can be disengaged.
当然,应理解地,所述边皮错位机构的具体结构及位置不以图5和图6所示实施例为限,例如,在一些示例中,所述边皮错位机构也可设于硅棒切磨一体机的机座。同时,所述边皮错位机构可适用于不同类型的承托部,通常地,所述边皮错位机构可沿第一方向推动边皮以令边皮脱离承托部即可,此时所述承托部的具体形式不必要以图5和图6所实施例为限。Of course, it should be understood that the specific structure and position of the edge and skin dislocation mechanism are not limited to the embodiments shown in FIG. 5 and FIG. 6 . For example, in some examples, the edge skin dislocation mechanism may also be provided on the silicon rod. The base of the cutting and grinding machine. At the same time, the edge skin dislocation mechanism can be applied to different types of support parts. Generally, the edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin disengage from the support part. The specific form of the supporting portion is not necessarily limited to the embodiment shown in FIG. 5 and FIG. 6 .
在某些实施方式中,所述边皮卸料装置还包括边皮输送机构,用于承接切割形成的所述边皮并将所述边皮转运至卸料区。在此,所述卸料区即边皮卸料区。In some embodiments, the edge skin unloading device further comprises a edge skin conveying mechanism, which is used for receiving the edge skin formed by cutting and transferring the edge skin to the discharge area. Here, the discharge area is the side skin discharge area.
在一实施例中,所述边皮输送结构在第二方向的位置可设置为与所述硅棒切磨一体机中的硅棒切割装置对齐,以令切割硅棒形成的边皮可由对应的边皮输送结构予以输送,由此可减少对边皮的转运。In one embodiment, the position of the edge skin conveying structure in the second direction can be set to be aligned with the silicon rod cutting device in the integrated silicon rod cutting and grinding machine, so that the edge skin formed by cutting the silicon rod can be formed by the corresponding edge skin. The edge skin conveying structure is conveyed, thereby reducing the transfer of the edge skin.
所述边皮输送机构设置的方向及位置可由所述切割区与边皮卸料区的位置关系确定。The direction and position of the edge skin conveying mechanism can be determined by the positional relationship between the cutting area and the edge skin discharge area.
在一实施方式中,所述边皮卸料区与切割区沿第一方向相邻设置,在此,所述边皮输送结构可沿第一方向设置,并对接于所述硅棒切割装置,以令硅棒在被切割形成边皮后,将边皮沿第一方向推动以脱离切割后硅棒或边皮承托机构后即被转移至边皮输送结构,由此可简化边皮的转运路径。所述边皮输送机构的数量还可依所述硅棒切磨一体机中硅棒切割装置的数量、结构或工作方式确定,例如,当所述硅棒切磨一体机中设有不同加工区位,其中多个加工区位上设有硅棒切割装置,所述边皮输送机构可对应设于多个加工区位上以对应硅棒切割装置;又如,当所述硅棒切割装置同时可对多根硅棒进行开方切割,所述边皮输送机构以设为多个,以使每一边皮输送机构对应一硅棒。In one embodiment, the edge skin discharge area and the cutting area are disposed adjacent to the first direction, and here, the edge skin conveying structure can be disposed along the first direction, and is connected to the silicon rod cutting device, So that after the silicon rod is cut to form the edge skin, the edge skin is pushed in the first direction to be separated from the cut silicon rod or the edge skin support mechanism and then transferred to the edge skin conveying structure, which can simplify the transportation of the edge skin path. The number of the edge skin conveying mechanisms may also be determined according to the number, structure or working mode of the silicon rod cutting devices in the integrated silicon rod cutting and grinding machine. For example, when the integrated silicon rod cutting and grinding machine is provided with different processing locations , wherein a plurality of processing areas are provided with silicon rod cutting devices, and the edge skin conveying mechanism can be correspondingly set on a plurality of processing areas to correspond to the silicon rod cutting devices; another example, when the silicon rod cutting devices can simultaneously A silicon rod is squared and cut, and there are multiple edge skin conveying mechanisms, so that each edge skin conveying mechanism corresponds to one silicon rod.
在某些实施方式中,所述边皮输送机构为链条输送机构、倍速链机构、或传送带机构。In some embodiments, the edge skin conveying mechanism is a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.
在一实施方式中,所述边皮输送机构包括:输送部,用于承载所述边皮;输送驱动源,用于驱动所述输送部运动以输送所述边皮。In one embodiment, the edge skin conveying mechanism includes: a conveying part for carrying the edge skin; a conveying driving source for driving the conveying part to move to convey the edge skin.
所述输送部可沿第一方向设置,并在所述输送驱动源的驱动下沿第一方向运输所承载的边皮。所述输送部的运动方向可设置为朝向所述边皮卸料区的方向,以将所承载的边皮运送至边皮卸料区。The conveying part can be arranged along a first direction, and is driven by the conveying driving source to convey the carried side skins along the first direction. The moving direction of the conveying part can be set to be toward the direction of the edge skin discharge area, so as to transport the carried edge skin to the edge skin discharge area.
所述输送驱动源例如为电机,用于驱动输送部运动并控制输送部的运输速度。The conveying driving source is, for example, a motor, which is used to drive the conveying part to move and control the conveying speed of the conveying part.
在一些示例中,为了避免所述边皮在输送过程中收碰撞被磨损,在一些实施例中,所述输送部设有用于与所述边皮接触的缓冲垫,又或,所述输送部采用缓冲材料制成。所述缓冲垫或缓冲材料例如为具有弹性的橡胶、硅胶或由其他具有弹性形变、阻尼特性或缓冲特性的 材料。如此以减小边皮输送的破损风险,有利于边皮复用。In some examples, in order to prevent the edge skin from being worn due to collision during the conveying process, in some embodiments, the conveying part is provided with a buffer pad for contacting the edge skin, or, the conveying part Made of cushioning material. The cushioning pad or cushioning material is, for example, elastic rubber, silicone or other materials with elastic deformation, damping properties or cushioning properties. In this way, the risk of breakage of the side skin during transportation is reduced, which is beneficial to the reuse of the side skin.
在此,本申请提供了硅棒切磨一体机中具有边皮卸料装置的实施例,所述边皮卸料装置包括边皮承托机构,通过驱动源驱动承托部抵靠边皮以实现对边皮的承托,在对卧式硅棒进行开方切割的过程中,所述边皮承托机构可藉由其承托部的承托作用避免边皮崩边,同时,所述承托部可用于承接边皮以防止边皮掉落,由此可形成完整边皮以协助实现后续的边皮转运过程;在一些示例中,所述边皮卸料装置中还设有边皮错位机构,可用于沿第一方向推动边皮以使边皮脱离承托部,还可藉由边皮输送机构将脱离了承托部的边皮转运至卸料区,即可实现对边皮的卸除及后续转运。Here, the present application provides an embodiment in which the integrated silicon rod cutting and grinding machine is provided with an edge strip discharging device, and the edge strip discharging device includes an edge strip supporting mechanism, and the supporting part is driven by a driving source to abut the edge strip to realize For the support of the edge skin, in the process of square-cutting the horizontal silicon rod, the edge skin support mechanism can prevent the edge skin from collapsing through the supporting function of the support part. The support portion can be used to receive the edge skin to prevent the edge skin from falling, so that a complete edge skin can be formed to assist in the subsequent process of edge skin transfer; in some examples, the edge skin discharge device is also provided with edge skin dislocation The mechanism can be used to push the edge skin along the first direction to make the edge skin detach from the support part, and the edge skin can also be transported from the support part to the unloading area by the edge skin conveying mechanism, so as to realize the unloading of the edge skin removal and subsequent transfer.
本申请实施例中的硅棒切磨一体机还包括硅棒研磨装置,所述硅棒研磨装置设于所述硅棒加工平台的第二加工区位处,用于对第一转移通道上由所述第一转移装置所夹持的切割后硅棒或者第二转移通道上由所述第二转移装置所夹持的切割后硅棒进行研磨作业。The integrated silicon rod cutting and grinding machine in the embodiment of the present application further includes a silicon rod grinding device, and the silicon rod grinding device is arranged at the second processing area of the silicon rod processing platform, and is used for grinding the silicon rod on the first transfer channel. Grinding is performed on the cut silicon rod held by the first transfer device or the cut silicon rod held by the second transfer device on the second transfer channel.
所述硅棒研磨装置中包括至少一对磨具,通过所述第一硅棒夹具或第二硅棒夹具带动硅棒沿第一方向运动,由此可将所述硅棒研磨装置在执行研磨作业时可设置为固定状态即可实现磨具与硅棒间的相对进给。The silicon rod grinding device includes at least a pair of grinding tools, and the silicon rod is driven to move in a first direction by the first silicon rod clamp or the second silicon rod clamp, so that the silicon rod grinding device can be ground during grinding. During operation, it can be set to a fixed state to realize the relative feeding between the abrasive tool and the silicon rod.
在一实施例中,所述硅棒研磨装置包括磨具安装座、至少一对磨具、磨具进退机构、以及磨具转换机构。In one embodiment, the silicon rod grinding device includes a grinding tool mounting seat, at least one pair of grinding tools, a grinding tool advancing and retreating mechanism, and a grinding tool converting mechanism.
所述磨具安装座用于设置至少一对磨具,在此,所述磨具安装座的具体结构可基于磨具的布置需求设为不同形式,例如为梁体、板架等。The grinding tool mounting seat is used to set at least one pair of grinding tools. Here, the specific structure of the grinding tool mounting seat can be set in different forms based on the arrangement requirements of the grinding tools, for example, a beam body, a plate frame, and the like.
在一些实施方式中,所述至少一对磨具架设于所述磨具安装座,又或,所述至少一对磨具通过支架、连接板、或安装框架架设于所述磨具安装座,在此,用于设置至少一对磨具的载体可以为不同形式,本申请不作限制。In some embodiments, the at least one pair of abrasive tools is erected on the abrasive tool mounting seat, or, the at least one pair of abrasive tools is erected on the abrasive tool mounting seat through a bracket, a connecting plate, or a mounting frame, Here, the carrier for arranging the at least one pair of abrasives can be in different forms, which is not limited in this application.
所述磨具进退机构用于驱动所述至少一对磨具中的至少一个磨具沿第二方向移动,以调整所述至少一对磨具中的两个磨具之间在第二方向上的相对距离,进而控制在研磨过程中的进给量也即决定了磨削量。根据研磨要求,通过磨具进退机构驱动至少一对磨具中的一个磨具或两个磨具沿第二方向移动一预定距离,调整进给量,如此,通过所述第一硅棒夹具或第二硅棒夹具带动硅棒沿第一方向运动并与所述硅棒研磨装置的至少一对磨具接触并相对进给以实现硅棒的研磨。The abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool in the at least one pair of abrasive tools to move in the second direction, so as to adjust the distance between two abrasive tools in the at least one pair of abrasive tools in the second direction The relative distance, and then control the feed amount during the grinding process also determines the grinding amount. According to the grinding requirements, one or two grinding tools in at least one pair of grinding tools are driven to move a predetermined distance in the second direction by the grinding tool advancing and retracting mechanism, and the feeding amount is adjusted. In this way, the first silicon rod holder or The second silicon rod holder drives the silicon rod to move in the first direction and contacts with at least one pair of grinding tools of the silicon rod grinding device and feeds relatively to realize the grinding of the silicon rod.
所述磨具转换机构用于驱动所述磨具安装座及其上的至少一对磨具在第一转移通道和第二转移通道之间转换,使得至少一对磨具对第一转移通道上第一硅棒夹具所夹持的硅棒进行研磨作业或对第二转移通道上第二硅棒夹具所夹持的硅棒进行研磨作业。The abrasive tool conversion mechanism is used to drive the abrasive tool mounting seat and at least a pair of abrasive tools on it to switch between the first transfer channel and the second transfer channel, so that the at least one pair of abrasive tools is connected to the first transfer channel. The silicon rod held by the first silicon rod holder is subjected to grinding operation or the silicon rod held by the second silicon rod holder on the second transfer channel is ground.
请参阅图7,显示为本申请硅棒切磨一体机中硅棒研磨装置的结构示意图。结合图1和图7,如图1和图7所示,所述硅棒研磨装置5包括磨具安装座51、至少一对磨具53、磨具进退机构、以及磨具转换机构。Please refer to FIG. 7 , which is a schematic structural diagram of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application. 1 and 7 , as shown in FIGS. 1 and 7 , the silicon rod grinding device 5 includes a grinding tool mounting seat 51 , at least one pair of grinding tools 53 , a grinding tool advancing and retreating mechanism, and a grinding tool converting mechanism.
磨具安装座51设于硅棒加工平台的第二加工区位上,用于设置至少一对磨具53。在某些实施方式中,磨具安装座51在第二方向上横跨硅棒加工平台的宽度尺寸。The grinding tool mounting seat 51 is arranged on the second processing area of the silicon rod processing platform, and is used to install at least one pair of grinding tools 53 . In certain embodiments, the tool mount 51 spans the width dimension of the silicon rod processing platform in the second direction.
所述至少一对磨具53设置于磨具安装座51上,且所述至少一对磨具呈现为在第二方向对向设置。在某些实现方式中,任一个磨具53可通过一磨具支座而架设于磨具安装座51上。The at least one pair of grinding tools 53 are disposed on the grinding tool mounting seat 51 , and the at least one pair of grinding tools appear to be opposite to each other in the second direction. In some implementations, any one of the grinding tools 53 can be mounted on the grinding tool mounting seat 51 through a grinding tool support.
在某些实施例中,任一个磨具包括旋转轴和砂轮。所述砂轮具有一定颗粒度与粗糙度,相对设置的两砂轮分别提供给被夹持硅棒对称的两个磨面。In certain embodiments, any one of the abrasive tools includes a rotating shaft and a grinding wheel. The grinding wheel has a certain particle size and roughness, and the two grinding wheels arranged opposite to each other are respectively provided to the two symmetrical grinding surfaces of the clamped silicon rod.
在本申请的实施例中,所述至少一对磨具中的任一个磨具包括相互嵌套的粗磨砂轮和精磨砂轮。例如,所述粗磨砂轮嵌套于所述精磨砂轮之内,或者,所述,所述精磨砂轮嵌套于所述粗磨砂轮之内。In the embodiments of the present application, any one of the at least one pair of grinding tools includes a rough grinding wheel and a fine grinding wheel nested in each other. For example, the rough grinding wheel is nested within the fine grinding wheel, or, the fine grinding wheel is nested within the rough grinding wheel.
在某些实施方式中,请参阅图8,显示为本申请硅棒切磨一体机中硅棒研磨装置的磨具的剖视图。如图8所示,所述磨具53包括磨头座531以及设于磨头座531上的粗磨砂轮533和精磨砂轮535,其中,所述粗磨砂轮533嵌套于所述精磨砂轮535之内,所述精磨砂轮535要大于所述粗磨砂轮533,所述精磨砂轮535为圆形且中间为空(即,圆环结构),所述粗磨砂轮533则可以是圆形结构或者所述粗磨砂轮533可以是圆形且中间为空(即,圆环结构)。一般地,无论是粗磨砂轮还是精磨砂轮,砂轮是由磨粒与结合剂固结而成,形成具有磨粒部的表面与待磨削的硅棒表面接触旋转。砂轮具有一定的磨粒尺寸与磨粒密度,同时砂轮中具有气孔。所述砂轮的磨料根据研磨硅棒的需要可设置为三氧化二铝、碳化硅、金刚石、立方氮化硼等硬度大于硅材料硬度的磨粒。其中,所述精磨砂轮的磨粒尺寸要小于所述粗磨砂轮的磨粒尺寸,所述精磨砂轮的磨粒密度要大于所述粗磨砂轮的磨粒密度。In some embodiments, please refer to FIG. 8 , which is a cross-sectional view of the grinding tool of the silicon rod grinding device in the silicon rod cutting and grinding integrated machine of the present application. As shown in FIG. 8 , the grinding tool 53 includes a grinding head seat 531 and a rough grinding wheel 533 and a fine grinding wheel 535 arranged on the grinding head seat 531 , wherein the rough grinding wheel 533 is nested in the fine grinding wheel In the wheel 535, the fine grinding wheel 535 is larger than the rough grinding wheel 533, the fine grinding wheel 535 is circular and the middle is empty (ie, a ring structure), and the rough grinding wheel 533 can be The circular structure or the rough grinding wheel 533 may be circular with a hollow center (ie, a ring structure). Generally, whether it is a rough grinding wheel or a fine grinding wheel, the grinding wheel is formed by the consolidation of abrasive grains and a bonding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground. The grinding wheel has a certain grain size and density, and there are pores in the grinding wheel. The abrasive of the grinding wheel can be set to abrasive grains with hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is larger than that of the rough grinding wheel.
当所述磨具包括粗磨砂轮和精磨砂轮时,利用所述磨具可对第一硅棒夹具或第二硅棒夹具所夹持的硅棒进行粗磨作业及精磨作业。因此,所述粗磨砂轮和所述精磨砂轮中的至少一个设有伸缩驱动机构。例如,当所述粗磨砂轮嵌套于所述精磨砂轮之内时,所述粗磨砂轮可设置一个伸缩驱动机构,在进行粗磨作业时,利用所述伸缩驱动机构驱动所述粗磨砂轮伸出并凸出于所述精磨砂轮,以利用所述凸出的粗磨砂轮对硅棒进行粗磨作业,而在进行精磨作业时,利用所述伸缩驱动机构驱动所述粗磨砂轮收缩并凹陷于所述精磨砂轮,以利用所述精磨砂轮对硅棒进行精磨作业。或者,当所述粗磨砂轮嵌套于所述精磨砂轮之内时,所述精磨砂轮可设置一个伸缩驱动机构,在进行粗磨作业时,利用所述伸缩驱动机构驱动所述精磨砂 轮收缩并凹陷于所述粗磨砂轮,以利用所述粗磨砂轮对硅棒进行粗磨作业,而在进行精磨作业时,利用所述伸缩驱动机构驱动所述精磨砂轮伸出并凸出于所述粗磨砂轮,以利用所述凸出的精磨砂轮对硅棒进行精磨作业。When the grinding tool includes a rough grinding wheel and a fine grinding wheel, the grinding tool can be used to perform rough grinding and fine grinding operations on the silicon rod clamped by the first silicon rod holder or the second silicon rod holder. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the rough grinding wheel is nested in the fine grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, and the telescopic driving mechanism is used to drive the rough grinding wheel during rough grinding. The wheel protrudes and protrudes from the fine grinding wheel, so as to use the protruding rough grinding wheel to perform rough grinding on the silicon rod, and during the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding The wheel is retracted and recessed in the fine grinding wheel, so that the silicon rod can be finely ground by the fine grinding wheel. Alternatively, when the rough grinding wheel is nested in the fine grinding wheel, a telescopic driving mechanism may be provided on the fine grinding wheel, and the telescopic driving mechanism is used to drive the fine grinding wheel during rough grinding. The wheel shrinks and is recessed in the rough grinding wheel, so as to use the rough grinding wheel to perform rough grinding work on the silicon rod, and during the fine grinding operation, the telescopic driving mechanism is used to drive the fine grinding wheel to protrude and protrude. From the rough grinding wheel, a fine grinding operation is performed on the silicon rod with the protruding fine grinding wheel.
在某些实施方式中,所述精磨砂轮嵌套于所述粗磨砂轮之内,所述粗磨砂轮要大于所述精磨砂轮,所述粗磨砂轮为圆形且中间为空(即,圆环结构),所述精磨砂轮则可以是圆形结构或者所述精磨砂轮可以是圆形且中间为空(即,圆环结构)。一般地,无论是粗磨砂轮还是精磨砂轮,砂轮是由磨粒与结合剂固结而成,形成具有磨粒部的表面与待磨削的硅棒表面接触旋转。砂轮具有一定的磨粒尺寸与磨粒密度,同时砂轮中具有气孔。所述砂轮的磨料根据研磨硅棒的需要可设置为三氧化二铝、碳化硅、金刚石、立方氮化硼等硬度大于硅材料硬度的磨粒。其中,所述精磨砂轮的磨粒尺寸要小于所述粗磨砂轮的磨粒尺寸,所述精磨砂轮的磨粒密度要大于所述粗磨砂轮的磨粒密度。In certain embodiments, the fine grinding wheel is nested within the rough grinding wheel, the rough grinding wheel is larger than the fine grinding wheel, and the rough grinding wheel is circular with an empty center (ie , ring structure), the fine grinding wheel may be a circular structure or the fine grinding wheel may be circular with an empty center (ie, a ring structure). Generally, whether it is a rough grinding wheel or a fine grinding wheel, the grinding wheel is formed by the consolidation of abrasive grains and a bonding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground. The grinding wheel has a certain grain size and density, and there are pores in the grinding wheel. The abrasive of the grinding wheel can be set to abrasive grains with hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is larger than that of the rough grinding wheel.
当所述磨具包括粗磨砂轮和精磨砂轮时,利用所述磨具可对第一硅棒夹具或第二硅棒夹具所夹持的硅棒进行粗磨作业及精磨作业。因此,所述粗磨砂轮和所述精磨砂轮中的至少一个设有伸缩驱动机构。例如,当所述精磨砂轮嵌套于所述粗磨砂轮之内时,所述粗磨砂轮可设置一个伸缩驱动机构,在进行粗磨作业时,利用所述伸缩驱动机构驱动所述粗磨砂轮伸出并凸出于所述精磨砂轮,以利用所述凸出的粗磨砂轮对硅棒进行粗磨作业,而在进行精磨作业时,利用所述伸缩驱动机构驱动所述粗磨砂轮收缩并凹陷于所述精磨砂轮,以利用所述精磨砂轮对硅棒进行精磨作业。或者,当所述精磨砂轮嵌套于所述粗磨砂轮之内时,所述精磨砂轮可设置一个伸缩驱动机构,在进行粗磨作业时,利用所述伸缩驱动机构驱动所述精磨砂轮收缩并凹陷于所述粗磨砂轮,以利用所述粗磨砂轮对硅棒进行粗磨作业,而在进行精磨作业时,利用所述伸缩驱动机构驱动所述精磨砂轮伸出并凸出于所述粗磨砂轮,以利用所述凸出的精磨砂轮对硅棒进行精磨作业。When the grinding tool includes a rough grinding wheel and a fine grinding wheel, the grinding tool can be used to perform rough grinding and fine grinding operations on the silicon rod clamped by the first silicon rod holder or the second silicon rod holder. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the fine grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, and the telescopic driving mechanism is used to drive the rough grinding wheel during rough grinding. The wheel protrudes and protrudes from the fine grinding wheel, so as to use the protruding rough grinding wheel to perform rough grinding on the silicon rod, and during the fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding The wheel is retracted and recessed in the fine grinding wheel, so that the silicon rod can be finely ground by the fine grinding wheel. Alternatively, when the fine grinding wheel is nested in the rough grinding wheel, a telescopic driving mechanism may be provided on the fine grinding wheel, and the telescopic driving mechanism is used to drive the fine grinding wheel during rough grinding. The wheel shrinks and is recessed in the rough grinding wheel, so as to use the rough grinding wheel to perform rough grinding work on the silicon rod, and during the fine grinding operation, the telescopic driving mechanism is used to drive the fine grinding wheel to protrude and protrude. From the rough grinding wheel, a fine grinding operation is performed on the silicon rod with the protruding fine grinding wheel.
所述磨具进退机构用于驱动所述至少一对磨具中的至少一个磨具沿第二方向移动。所述磨具进退机构控制所述至少一对磨具中至少一个磨具沿第二方向移动,以实现调整至少一对磨具中的两个磨具之间在第二方向上的相对距离,进而控制在研磨过程中的进给量也即决定了磨削量。The abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool in the at least one pair of abrasive tools to move in the second direction. The abrasive tool advancing and retracting mechanism controls at least one abrasive tool in the at least one pair of abrasive tools to move along the second direction, so as to adjust the relative distance between the two abrasive tools in the at least one pair of abrasive tools in the second direction, Further, controlling the feed amount during the grinding process also determines the grinding amount.
例如,每一对磨具配置有磨具进退机构。在一实施例中,所述磨具进退机构包括进退导轨和进退驱动单元。在如图1和图3所示的实施例中,所述磨具进退机构包括进退导轨和进退驱动单元(未在图式中显示),其中,所述进退导轨沿第二方向设置于磨具安装座的第一安装侧,磨具的底部设置有与所述进退导轨配合的沿第二方向的导槽结构或导块结构。所述 进退驱动单元更可例如包括滚珠丝杆和驱动电机,所述滚珠丝杆沿所述进退导轨设置,所述滚珠丝杆与相应的磨具关联并与所述驱动电机轴接。For example, each pair of grinding tools is equipped with a grinding tool advancing and retracting mechanism. In one embodiment, the grinding tool advancing and retreating mechanism includes an advancing and retreating guide rail and an advancing and retreating drive unit. In the embodiment shown in FIG. 1 and FIG. 3 , the advancing and retreating mechanism of the abrasive tool includes an advancing and retreating guide rail and an advancing and retreating driving unit (not shown in the drawings), wherein the advancing and retreating guide rail is arranged on the abrasive tool along the second direction. On the first mounting side of the mounting seat, the bottom of the grinding tool is provided with a guide groove structure or a guide block structure along the second direction that cooperates with the advancing and retreating guide rails. The advancing and retreating driving unit may further include, for example, a ball screw and a driving motor, the ball screw is arranged along the advancing and retreating guide rail, and the ball screw is associated with a corresponding grinding tool and is axially connected with the driving motor.
在本申请的一实施例中,所述至少一对磨具中的一个磨具配置有滚珠丝杆和驱动电机,所述滚珠丝杆沿第二方向设置且与所述一磨具相关联。如此,利用驱动电机驱动滚珠丝杆作正向转动以使得与所述滚珠丝杆相关联的那一个磨具沿着所述进退导轨面向相对设置的另一个磨具移动以减小两个磨具之间的研磨间距(或调整研磨的进给量),或者,利用驱动电机驱动滚珠丝杆作反向转动以使得与所述滚珠丝杆相关联的那一个磨具沿着所述进退导轨背向相对设置的另一个磨具移动以增大两个磨具之间的研磨间距。In an embodiment of the present application, one of the at least one pair of abrasives is configured with a ball screw and a drive motor, the ball screw is disposed along the second direction and is associated with the one abrasive. In this way, the drive motor is used to drive the ball screw to rotate in the forward direction, so that the one grinding tool associated with the ball screw moves along the advancing and retreating guide rail to face the other opposite grinding tool to reduce the two grinding tools. The grinding distance between them (or adjust the grinding feed), or, use the drive motor to drive the ball screw to rotate in the opposite direction so that the grinding tool associated with the ball screw is along the back of the advance and retreat guide rail. Move to another grinding tool opposite to increase the grinding distance between the two grinding tools.
在本申请的一实施例中,所述至少一对磨具中的每一个磨具配置有滚珠丝杆和驱动电机,对于每一个磨具而言,所述滚珠丝杆所述滚珠丝杆沿第二方向设置且与所述磨具相关联。如此,利用驱动电机驱动滚珠丝杆作正向转动以使得与所述滚珠丝杆相关联的那一个磨具沿着所述进退导轨面向相对设置的另一个磨具移动以减小两个磨具之间的研磨间距(或调整研磨的进给量),或者,利用驱动电机驱动滚珠丝杆作反向转动以使得与所述滚珠丝杆相关联的那一个磨具沿着所述进退导轨背向相对设置的另一个磨具移动以增大两个磨具之间的研磨间距。In an embodiment of the present application, each abrasive tool in the at least one pair of abrasive tools is configured with a ball screw and a drive motor, and for each abrasive tool, the ball screw and the ball screw are arranged along the The second direction is disposed and associated with the abrasive tool. In this way, the drive motor is used to drive the ball screw to rotate in the forward direction, so that the one grinding tool associated with the ball screw moves along the advancing and retreating guide rail to face the other opposite grinding tool to reduce the two grinding tools. The grinding distance between them (or adjust the grinding feed), or, use the drive motor to drive the ball screw to rotate in the opposite direction so that the grinding tool associated with the ball screw is along the back of the advance and retreat guide rail. Move to another grinding tool opposite to increase the grinding distance between the two grinding tools.
在本申请的一实施例中,所述至少一对磨具中的两个磨具共用滚珠丝杆和驱动电机,所述滚珠丝杆可例如为双向丝杆,所述双向丝杆沿第二方向设置,所述双向丝杆的杆身上布设有旋向相反的两段螺纹,这两段螺纹分别与两个磨具关联,所述驱动电机与所述双向丝杆关联,利用驱动电机驱动所述双向丝杆转动,使得与所述双向丝杆相关联的两个磨具基于一定的协同关系沿着所述进退导轨作相向移动或相背移动。例如,驱动电机驱动双向丝杆正向转动,则驱动所关联的两个磨具沿着重垂线相向移动(即,相互靠近),减小两个磨具之间的研磨间距(或调整研磨的进给量),或者,所述驱动电机驱动所述丝杆反向转动,则驱动所关联的两个磨具沿着重垂线相背移动(即,相互远离),增大两个磨具之间的研磨间距。In an embodiment of the present application, two grinding tools in the at least one pair of grinding tools share a ball screw and a driving motor. Direction setting, the body of the bidirectional screw rod is provided with two threads with opposite directions of rotation. The two-way screw rotates, so that the two grinding tools associated with the two-way screw move toward or away from each other along the advancing and retreating guide rails based on a certain cooperative relationship. For example, if the drive motor drives the two-way screw to rotate in the forward direction, then the two associated abrasives are driven to move toward each other along the heavy vertical line (that is, move closer to each other), reducing the grinding distance between the two abrasives (or adjusting the grinding distance). Feed amount), or, the drive motor drives the screw to rotate in the opposite direction, then the two associated abrasives are driven to move away from each other (ie, move away from each other) along the heavy vertical line, increasing the difference between the two abrasives. grinding distance between.
在本申请的一实施例中所述磨具转换机构用于驱动所述至少一对磨具沿着所述磨具安装座在第一转移通道和第二转移通道之间转换。In an embodiment of the present application, the grinding tool conversion mechanism is used to drive the at least one pair of grinding tools to switch between the first transfer channel and the second transfer channel along the grinding tool mounting seat.
在本申请实施例中,所述硅棒加工平台沿第一方向依序设有第一加工区位和第二加工区位,所述第一加工区位和第二加工区位在第二方向上横跨硅棒加工平台的宽度尺寸。第一转移装置和第二转移装置沿第一方向并行设置,其中,第一转移装置中的第一转移通道沿第一方向穿过第一加工区位和第二加工区位,第二转移装置中的第二转移通道沿第一方向穿过第一加工区位和第二加工区位。在本申请的实施例中,所述硅棒研磨装置包括磨具安装座和设 置于所述磨具安装座上的至少一对磨具,利用所述磨具转换机构,可驱动所述至少一对磨具沿第二方向移动,以在第一转移通道和第二转移通道之间转换,例如,利用所述研磨转换机构驱动所述至少一对磨具沿第二方向在磨具安装座上移动以由第一转移通道转换至第二转移通道上,或者,利用所述研磨转换机构驱动所述至少一对磨具沿第二方向在磨具安装座上移动以由第二转移通道转换至第一转移通道上。In the embodiment of the present application, the silicon rod processing platform is provided with a first processing area and a second processing area in sequence along the first direction, and the first processing area and the second processing area straddle the silicon in the second direction. The width dimension of the bar processing platform. The first transfer device and the second transfer device are arranged in parallel along the first direction, wherein the first transfer channel in the first transfer device passes through the first processing area and the second processing area along the first direction, and the second transfer device passes through the first processing area and the second processing area along the first direction. The second transfer passage passes through the first processing location and the second processing location in the first direction. In the embodiment of the present application, the silicon rod grinding device includes a grinding tool mounting seat and at least one pair of grinding tools disposed on the grinding tool mounting seat, and the at least one grinding tool can be driven by the grinding tool conversion mechanism. moving the pair of abrasive tools in the second direction to switch between the first transfer channel and the second transfer channel, for example, using the grinding conversion mechanism to drive the at least one pair of abrasive tools on the abrasive tool mount in the second direction Move to be converted from the first transfer channel to the second transfer channel, or, use the grinding conversion mechanism to drive the at least one pair of grinding tools to move on the grinding tool mounting seat in the second direction to be converted from the second transfer channel to on the first transfer channel.
在一实施例中,所述磨具转换机构包括:磨具转换导轨和磨具转换驱动单元。In one embodiment, the grinding tool conversion mechanism includes: a grinding tool conversion guide rail and a grinding tool conversion driving unit.
所述磨具转换导轨沿第二方向布设,用于设置所述研磨磨具。在某些实施方式中,所述磨具转换导轨沿第二方向布设在硅棒加工平台上,所述至少一对磨具通过例如滑块等架设于所述磨具转换导轨上。The grinding tool conversion guide rail is arranged along the second direction for setting the grinding tool. In some embodiments, the grinding tool conversion guide rail is arranged on the silicon rod processing platform along the second direction, and the at least one pair of grinding tools is mounted on the grinding tool conversion guide rail through a slider, for example.
磨具转换驱动单元,用于驱动所述至少一对磨具沿所述磨具转换导轨移动。An abrasive tool conversion driving unit is used for driving the at least one pair of abrasive tools to move along the abrasive tool conversion guide rail.
在某些实施方式中,所述磨具转换驱动单元包括:移动齿轨、驱动齿轮与驱动源。所述移动齿轨沿第二方向设置,与所述磨具转换导轨平行。其中,所述移动齿轨固定在所述硅棒加工平台上,设置为与所述磨具转换导轨近似相同的第一方向尺度,与磨具转换导轨平行且相邻设置。In some embodiments, the grinding tool conversion driving unit includes: a moving rack, a driving gear and a driving source. The moving rack is arranged along the second direction and is parallel to the grinding tool conversion guide rail. Wherein, the moving rack is fixed on the silicon rod processing platform, is set to approximately the same first direction dimension as the grinding tool conversion guide rail, and is parallel to and adjacent to the grinding tool conversion guide rail.
所述驱动齿轮设置于所述磨具安装座上,并且与所述移动齿轨啮合,用于带动所述至少一对磨具沿磨具转换导轨运动。所述驱动源用于驱动所述驱动齿轮。在本申请的一实现方式中,所述驱动齿轮设置在所述磨具安装座上,所述驱动齿轮由驱动源带动旋转,所述驱动齿轮的轮齿与所述移动齿轨啮合,顺应所述移动齿轨行进,与驱动齿轮连接的至少一对磨具由此在磨具转换导轨上产生相应的移动。The driving gear is arranged on the grinding tool mounting seat and meshes with the moving rack, so as to drive the at least one pair of grinding tools to move along the grinding tool conversion guide rail. The drive source is used to drive the drive gear. In an implementation manner of the present application, the drive gear is provided on the abrasive tool mounting seat, the drive gear is driven to rotate by a drive source, and the gear teeth of the drive gear mesh with the moving rack, conforming to the The moving rack travels, whereby at least one pair of abrasives connected to the drive gear produces a corresponding movement on the abrasive transition rails.
在某些实施方式中,所述磨具转换驱动单元可设置在所述磨具安装座上,包括移动丝杆和驱动源,其中,所述移动丝杆沿第二方向设置且与所述至少一对磨具关联,所述驱动源用于驱动所述移动丝杆转动以使所关联的至少一对磨具沿磨具转换导轨移动。In some embodiments, the grinding tool conversion drive unit may be disposed on the grinding tool mounting seat, and includes a moving screw and a driving source, wherein the moving screw is disposed along the second direction and is connected with the at least A pair of abrasive tools is associated, and the driving source is used to drive the moving screw to rotate so as to make the associated at least one pair of abrasive tools move along the abrasive tool conversion guide rail.
如前所述,所述磨具进退机构用于驱动所述至少一对磨具中的至少一个磨具沿第二方向移动,所述磨具转换机构用于驱动所述至少一对磨具沿着第二方向在第一转移通道和第二转移通道之间转换,因此,在某些实施方式中,所述磨具进退机构和所述磨具转换机构可合二为一,即采用一套驱动机构实现所述磨具进退机构和所述磨具转换机构的功能。As mentioned above, the abrasive tool advancing and retracting mechanism is used to drive at least one abrasive tool of the at least one pair of abrasive tools to move in the second direction, and the abrasive tool conversion mechanism is used to drive the at least one pair of abrasive tools to move along the second direction. It is converted between the first transfer channel and the second transfer channel in the second direction. Therefore, in some embodiments, the grinding tool advancing and retreating mechanism and the grinding tool converting mechanism can be combined into one, that is, a set of The driving mechanism realizes the functions of the grinding tool advancing and retreating mechanism and the grinding tool converting mechanism.
在利用所述磨具对位于第二加工区位处的硅棒进行研磨作业时,由磨具的磨具进退机构驱动所述至少一对磨具中的磨具沿第二方向移动,以确定磨具与硅棒研磨面研磨的进给量,由磨具行进机构驱动所述至少一对磨具沿水平线移动直至完成穿过整个的硅棒,若有必要,还可由磨具行进机构驱动所述至少一对磨具沿水平线往复移动保证在硅棒长度方向上对其充 分研磨,同时,由磨具进退机构驱动相对设置的至少一对磨具在第二方向移动,以确定磨具与硅棒研磨面研磨的进给量。在如图1和图3所示的实施例中,所述磨具中至少一对磨具以沿第二方向对向设置,所述至少一对磨具的研磨面位于相对的垂向面内,其中,所述垂向面与水平线相垂直,在对硅棒(如图3所示的已切割硅棒102)进行研磨时,是通过磨具进退机构驱动所述至少一对磨具中的至少一个磨具沿第二方向作升降移动来调整进给量,以对硅棒沿第二方向的左侧面和右侧面进行研磨。When the grinding tool is used to grind the silicon rod located at the second processing area, the grinding tool in the at least one pair of grinding tools is driven by the grinding tool advancing and retracting mechanism of the grinding tool to move in the second direction, so as to determine the grinding tool. The feed amount for grinding the grinding surface of the tool and the silicon rod, the at least one pair of grinding tools is driven by the grinding tool traveling mechanism to move along the horizontal line until the entire silicon rod is passed through, and the grinding tool traveling mechanism can also drive the grinding tool if necessary. At least one pair of abrasive tools reciprocates along the horizontal line to ensure sufficient grinding of the silicon rod in the length direction. The feed amount for grinding the grinding surface. In the embodiment shown in FIG. 1 and FIG. 3 , at least one pair of the abrasives is disposed opposite to each other along the second direction, and the grinding surfaces of the at least one pair of abrasives are located in opposite vertical planes , wherein the vertical plane is perpendicular to the horizontal line, and when grinding the silicon rod (the cut silicon rod 102 shown in FIG. 3 ), the grinding wheel advancing and retreating mechanism is used to drive the at least one pair of grinding tools. At least one grinding tool moves up and down along the second direction to adjust the feed amount, so as to grind the left and right sides of the silicon rod along the second direction.
在本申请一实施例中,还可利用所述硅棒研磨装置对硅棒进行倒角作业。In an embodiment of the present application, the silicon rod grinding device can also be used to perform a chamfering operation on the silicon rod.
在某些实施方式中,所述至少一对磨具中的任一个磨具包括相互嵌套的粗磨砂轮和精磨砂轮,可利用所述精磨砂轮对硅棒进行倒角作业。In some embodiments, any one of the at least one pair of grinding tools includes a rough grinding wheel and a fine grinding wheel nested in each other, and the silicon rod can be chamfered by the fine grinding wheel.
在某些实施方式中,所述硅棒研磨装置还包括倒角装置,所述倒角装置更包括至少一对倒角磨具和倒角磨具进退机构。所述至少一对倒角磨具中的每一个倒角磨具相邻设置于磨具,所述至少一对倒角磨具中的两个倒角磨具对向设置于所述磨具安装座上,所述至少一对倒角磨具的研磨面位于相对的垂向面内,即,所述至少一对倒角磨具中的两个倒角磨具的研磨面分别位于第一垂向面内和第二垂向面内。In some embodiments, the silicon rod grinding device further includes a chamfering device, and the chamfering device further includes at least a pair of chamfering grinders and a chamfering grinder advancing and retreating mechanism. Each chamfering grinder in the at least one pair of chamfering grinders is arranged adjacent to the grinder, and two chamfering grinders in the at least one pair of chamfering grinders are oppositely arranged on the grinder installation On the seat, the grinding surfaces of the at least one pair of chamfering grinders are located in opposite vertical planes, that is, the grinding surfaces of the two chamfering grinders in the at least one pair of chamfering grinders are respectively located in the first vertical plane. face inward and second vertical face inward.
关于所述倒角磨具,在某些实现方式中,所述倒角磨具包括倒角砂轮和与所述倒角砂轮连接的旋转电机。所述倒角砂轮具有一定颗粒度与粗糙度,所述至少一对倒角磨具中相对设置的两倒角砂轮分别提供给被夹持硅棒对称的两个磨面,在某些实施方式中,所述倒角砂轮为圆形。由于所述倒角磨具是对硅棒的棱边进行倒角,相对于硅棒的侧面,硅棒的棱边所需的磨削量较小,因此,作为倒角磨具的倒角砂轮的尺寸可设置为比作为粗磨磨具的粗磨砂轮(或作为精磨磨具的精磨砂轮)的尺寸要小。所述倒角砂轮由磨粒与结合剂固结而成,形成具有磨粒部的表面与待研磨的硅棒表面接触旋转。所述倒角砂轮具有一定的磨粒尺寸与磨粒密度,同时倒角砂轮中具有气孔。所述倒角砂轮的磨料根据研磨硅棒的需要可设置为三氧化二铝、碳化硅、金刚石、立方氮化硼等硬度大于硅材料硬度的磨粒。所述旋转电机通过旋转轴与所述倒角砂轮连接,用于驱动所述倒角砂轮以预定的转速旋转。Regarding the chamfering grinder, in some implementations, the chamfering grinder includes a chamfering grinding wheel and a rotating motor connected to the chamfering grinding wheel. The chamfering grinding wheel has a certain particle size and roughness, and the two oppositely arranged chamfering grinding wheels in the at least one pair of chamfering grinding tools are respectively provided to the two symmetrical grinding surfaces of the clamped silicon rod, in some embodiments , the chamfering grinding wheel is circular. Since the chamfering grinder is used to chamfer the edge of the silicon rod, the amount of grinding required for the edge of the silicon rod is smaller than that of the side surface of the silicon rod. Therefore, the chamfering grinding wheel used as a chamfering grinder The size of the can be set to be smaller than the size of the rough grinding wheel as a rough grinding tool (or the fine grinding wheel as a fine grinding tool). The chamfering grinding wheel is formed by the consolidation of abrasive grains and a binding agent, and the surface with the abrasive grain portion is formed to contact and rotate with the surface of the silicon rod to be ground. The chamfering grinding wheel has a certain size and density of abrasive grains, and at the same time, the chamfering grinding wheel has pores. The abrasive of the chamfering grinding wheel can be set to abrasive grains whose hardness is greater than that of silicon material, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods. The rotating motor is connected with the chamfering grinding wheel through a rotating shaft, and is used for driving the chamfering grinding wheel to rotate at a predetermined rotational speed.
所述倒角磨具进退机构用于驱动所述至少一对倒角磨具中的至少一个倒角磨具沿第二方向移动。所述倒角磨具进退机构控制所述至少一对倒角磨具中至少一个倒角磨具沿第二方向移动,以实现调整至少一对倒角磨具中的两个倒角磨具之间在第二方向上的相对距离,进而控制在磨削过程中的进给量也即决定了磨削量。The chamfering grinder advancing and retracting mechanism is used to drive at least one chamfering grinder of the at least one pair of chamfering grinders to move in the second direction. The chamfering grinder advancing and retreating mechanism controls at least one chamfering grinder in the at least one pair of chamfering grinders to move along the second direction, so as to adjust one of the two chamfering grinders in the at least one pair of chamfering grinders. The relative distance between them in the second direction, and then controlling the feed amount during the grinding process, also determines the grinding amount.
在利用所述倒角磨具对位于第二加工区位处的硅棒进行倒角作业时,由倒角磨具的倒角磨具进退机构驱动所述至少一对倒角磨具中的倒角磨具沿第二方向移动,以确定倒角磨具与 硅棒棱边研磨的进给量,由第一硅棒夹具或第二硅棒夹具驱动硅棒沿第一方向移动直至整个硅棒完全穿过倒角磨具,若有必要,还可由第一硅棒夹具或第二硅棒夹具驱动硅棒沿第一方向往复移动保证在硅棒长度方向上对其充分研磨,另外,由第一硅棒夹具或第二硅棒夹具中的夹持部转动机构驱动夹持部转动以带动所夹持的硅棒转动一偏角,且,由倒角磨具进退机构驱动相对设置的至少一对倒角磨具在第二方向移动,以确定倒角磨具与硅棒棱边研磨的进给量。When using the chamfering grinder to perform chamfering work on the silicon rod located at the second processing area, the chamfering grinder in the at least one pair of chamfering grinders is driven by the chamfering grinder advancing and retracting mechanism of the chamfering grinder. The grinding tool moves in the second direction to determine the feed amount of the chamfering tool and the edge of the silicon rod. The silicon rod is driven by the first silicon rod holder or the second silicon rod holder to move in the first direction until the whole silicon rod is completely Through the chamfering grinding tool, if necessary, the first silicon rod holder or the second silicon rod holder can drive the silicon rod to reciprocate in the first direction to ensure that it is fully ground in the length direction of the silicon rod. The clamping part rotating mechanism in the silicon rod clamp or the second silicon rod clamp drives the clamping part to rotate to drive the clamped silicon rod to rotate a declination angle, and at least a pair of oppositely arranged at least one pair is driven by the chamfering tool advancing and retreating mechanism The chamfering grinder moves in the second direction to determine the feed amount of the chamfering grinder and the edge grinding of the silicon rod.
在本申请的一实施例中,在第一硅棒夹具和第二硅棒夹具中至少一个还可配置有研磨修复装置,用于修磨对应的研磨磨具,即,修磨对应的粗磨装置中的粗磨磨具、修磨对应的精磨装置中的精磨磨具、或者修磨对应的粗磨装置中的粗磨磨具和精磨装置中的精磨磨具。利用所述研磨修复装置,通过对研磨磨具进行研磨修复,可确保所述研磨磨具用于进行硅棒研磨后可达到所需的精度。In an embodiment of the present application, at least one of the first silicon rod holder and the second silicon rod holder may be further configured with a grinding repair device for grinding the corresponding grinding tool, that is, grinding the corresponding rough grinding The rough grinding tool in the device, the finishing grinding tool in the corresponding finishing grinding device, or the rough grinding grinding tool in the corresponding rough grinding device and the finishing grinding tool in the finishing grinding device. Using the grinding and repairing device, by grinding and repairing the grinding tool, it can be ensured that the grinding tool can achieve the required precision after the grinding tool is used for grinding the silicon rod.
在一种实现方式中,所述研磨修复装置包括安装主体和至少一修磨部,所述安装主体可设于硅棒夹具上,所述至少一修磨部设于所述安装主体上,用于修磨对应的所述至少一研磨磨具。请参阅图4,所述研磨修复装置中的安装主体56设于硅棒夹具的至少一个夹臂上,例如第一硅棒夹具21的第一夹臂213或第二硅棒夹具31的第二夹臂313,在所述安装主体56的相对两侧分别设有一修磨部58。以利用所述研磨修复装置对精磨装置中的精磨磨具进行修磨为例,所述精磨装置包括一对精磨磨具,令相对设置的一对精磨磨具沿第二方向移动至修磨部外侧,驱动硅棒夹具沿着水平线移动以使得安装主体两侧的两个修复部沿第一方向作往复运动,在此状态下,可令所述精磨装置中的一对精磨磨具相向靠近(例如沿着第二方向)修磨部至接触修磨部表面以实现研磨。In an implementation manner, the grinding and repairing device includes an installation body and at least one grinding part, the installation body can be set on the silicon rod holder, the at least one grinding part is set on the installation body, and is used for for grinding the corresponding at least one grinding tool. Please refer to FIG. 4 , the mounting body 56 of the grinding and repairing device is disposed on at least one clamping arm of the silicon rod holder, for example, the first clamping arm 213 of the first silicon rod holder 21 or the second clamping arm 213 of the second silicon rod holder 31 The clamping arm 313 is provided with a grinding part 58 on two opposite sides of the mounting body 56 respectively. Taking the use of the grinding and repairing device for grinding the fine grinding tools in the fine grinding device as an example, the fine grinding device includes a pair of fine grinding tools, and the opposite pair of fine grinding tools are arranged along the second direction. Move to the outside of the grinding part, and drive the silicon rod holder to move along the horizontal line to make the two repair parts on both sides of the installation body reciprocate along the first direction. In this state, a pair of The refining abrasives approach (eg, along the second direction) the dressing portion toward each other to contact the surface of the dressing portion to achieve grinding.
所述修磨部可例如为油石。在此,所述油石例如为金刚石油石、碳化硼油石、精磨油石、普通油石等。所述油石可借助于油石表面的粒度实现对所接触的研磨磨具表面的修整。在修磨过程中,油石表面接触研磨磨具,将研磨磨具的表面修整为均匀的颗粒度以及提高磨具平面的平整度、垂直度。The grinding part can be, for example, a whetstone. Here, the whetstone is, for example, diamond whetstone, boron carbide whetstone, refined whetstone, common whetstone, and the like. The whetstone can adjust the surface of the grinding tool in contact with the grain size of the whetstone surface. In the grinding process, the surface of the whetstone contacts the grinding tool, and the surface of the grinding tool is trimmed to a uniform particle size and the flatness and verticality of the grinding tool plane are improved.
在本申请的一实施例中,所述硅棒研磨装置还包括冷却装置,以对所述至少一对磨具降温,降低磨削过程中硅棒表面层损伤,提高砂轮的磨削效率与使用寿命。在本实施例的一实现方式中,所述冷却装置包括冷却水管、导流槽和导流孔。在某些实施方式中,所述砂轮圆周外沿设置有用于放置冷却水进入砂轮的旋转驱动电机的防护罩。所述冷却水管一端连接冷却水源,另一端连接至所述砂轮的防护罩表面,所述导流槽设置于防护罩上,作为所述防护罩与冷却水管的接触点,所述导流孔设置在所述冷却槽内。所述冷却装置冷却剂可为常见的 冷却水,冷却水管连接冷却水源,经过冷却水管抽吸的冷却水至砂轮表面的导流槽和导流孔,被引导至直达砂轮和所磨削硅棒的接触面进行冷却,在砂轮的磨削中藉由砂轮旋转导流孔的冷却水由离心作用进入砂轮内部进行充分的冷却。In an embodiment of the present application, the silicon rod grinding device further includes a cooling device to cool the at least one pair of grinding tools, reduce the damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and use of the grinding wheel. life. In an implementation of this embodiment, the cooling device includes a cooling water pipe, a guide groove and a guide hole. In some embodiments, the outer periphery of the grinding wheel is provided with a protective cover for placing cooling water into the rotary drive motor of the grinding wheel. One end of the cooling water pipe is connected to the cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The guide groove is arranged on the protective cover as a contact point between the protective cover and the cooling water pipe, and the guide hole is provided in the cooling tank. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source. The cooling water pumped through the cooling water pipe is directed to the guide grooves and guide holes on the surface of the grinding wheel, and is guided directly to the grinding wheel and the ground silicon rod. The contact surface of the grinding wheel is cooled. During the grinding of the grinding wheel, the cooling water from the rotating guide hole of the grinding wheel enters the interior of the grinding wheel by centrifugal action for sufficient cooling.
在本申请的一实施例中,所述硅棒切磨一体机还包括硅棒移送装置,设于所述硅棒加工平台的装载区位,用于将待加工的硅棒转移至所述硅棒加工平台的第一加工区位。In an embodiment of the present application, the integrated silicon rod cutting and grinding machine further includes a silicon rod transfer device, which is arranged at the loading area of the silicon rod processing platform and is used for transferring the silicon rod to be processed to the silicon rod The first processing location of the processing platform.
在本申请中,所述硅棒移送装置可将待加工的硅棒由装载区位移动至第一加工区位并可使得硅棒在进行切割作业之前完成对中操作。In the present application, the silicon rod transfer device can move the silicon rod to be processed from the loading area to the first processing area and can make the silicon rod complete the centering operation before the cutting operation.
请参阅图9,显示为图1中A处的放大示意图。所述硅棒切磨一体机包括硅棒移送装置,所述硅棒移送装置包括:硅棒承载结构、对中调节机构、以及进给驱动机构。Please refer to FIG. 9 , which is an enlarged schematic view of A in FIG. 1 . The silicon rod cutting and grinding integrated machine includes a silicon rod transfer device, and the silicon rod transfer device includes: a silicon rod bearing structure, a centering adjustment mechanism, and a feeding drive mechanism.
所述硅棒承载结构用于承载待加工的硅棒。在本申请的一实施例中,硅棒承载结构用于承载待加工的硅棒。在图9所示的实施例中,硅棒承载结构71包括承载底座和沿第二方向相对设置的第一装载部件和第二装载部件,其中,第一装载部件和第二装载部件配合以用于承载待加工的硅棒,且,第一装载部件和第二装载部件中的每一个可设置沿第一方向设置的多个滚轮,这样,第一装载部件上的一排滚轮和第二装载部上的一排滚轮共同用来承载硅棒。其他实施例中,所述硅棒承载结构可整体例如为板状结构,例如为矩形承载板,所述矩形承载板可设有一定的弧度或具有一凹陷,在所述矩形承载板上可设置有枕条,为保护承载的硅棒,所述枕条可由柔性材料制作而成,所述柔性材料可例如为橡胶、亚力克、塑料等。The silicon rod supporting structure is used to carry the silicon rod to be processed. In an embodiment of the present application, the silicon rod supporting structure is used to carry the silicon rod to be processed. In the embodiment shown in FIG. 9 , the silicon rod carrying structure 71 includes a carrying base and a first loading part and a second loading part oppositely arranged along the second direction, wherein the first loading part and the second loading part cooperate to use In order to carry the silicon rods to be processed, and each of the first loading part and the second loading part can be provided with a plurality of rollers arranged in the first direction, so that a row of rollers on the first loading part and the second loading part A row of rollers on the upper part is used to carry the silicon rods together. In other embodiments, the silicon rod supporting structure may be, for example, a plate-like structure as a whole, such as a rectangular supporting plate, the rectangular supporting plate may be provided with a certain arc or a depression, and the rectangular supporting plate may There are pillow strips, which can be made of flexible materials, such as rubber, acrylic, plastic, etc., in order to protect the loaded silicon rods.
本申请所公开的硅棒移送装置,通过对中调节结构,可调节所述硅棒承载结构所承载的硅棒的位置以使得所述硅棒的轴心线与预定中心线对应。The silicon rod transfer device disclosed in the present application can adjust the position of the silicon rod carried by the silicon rod carrying structure through the centering adjustment structure, so that the axis line of the silicon rod corresponds to the predetermined center line.
如前所述,所述对中操作具体指的是使得硅棒的轴心线与第一硅棒夹具或第二硅棒夹具的夹持中心线在同一直线上,即,所述硅棒的轴心线与第一硅棒夹具或第二硅棒夹具的夹持中心线重合。在一种实现方式中,所述第一硅棒夹具与第二硅棒夹具相同,则第一硅棒夹具的夹持中心线与第二硅棒夹具的夹持中心线在重垂线方向上一致。在另一种实现方式中,所述第一硅棒夹具与第二硅棒夹具可不相同,则第一硅棒夹具的夹持中心线与第二硅棒夹具的夹持中心线在重垂线方向上不一致。As mentioned above, the centering operation specifically refers to making the axis line of the silicon rod and the clamping center line of the first silicon rod holder or the second silicon rod holder on the same straight line, that is, the The axis line coincides with the clamping center line of the first silicon rod holder or the second silicon rod holder. In an implementation manner, the first silicon rod holder is the same as the second silicon rod holder, and the clamping centerline of the first silicon rod holder and the clamping centerline of the second silicon rod holder are in the direction of the re-perpendicular line Consistent. In another implementation manner, the first silicon rod holder and the second silicon rod holder may be different, and the clamping center line of the first silicon rod holder and the clamping center line of the second silicon rod holder are on the heavy vertical line inconsistent in direction.
在实际应用中,以第一硅棒夹具为例,可预先确定第一硅棒夹具的夹持中心线(或第二硅棒夹具的夹持中心线),基于第一硅棒夹具的夹持中心线(或第二硅棒夹具的夹持中心线)确定预定中心线,其中,所述预定中心线与所述第一硅棒夹具的夹持中心线(或第二硅棒夹具的夹持中心线)在重垂线方向上相同(即,高度一致)。因此,所述对中调节机构用于调节所述待加工的硅棒的位置以使其轴心线与预定中心线对应是用于调节所述待加工的硅棒在重 垂线方向上的位置以使其轴心线与预定中心线在重垂线方向上一致。In practical applications, taking the first silicon rod holder as an example, the clamping centerline of the first silicon rod holder (or the clamping centerline of the second silicon rod holder) can be pre-determined, and based on the clamping centerline of the first silicon rod holder The center line (or the clamping center line of the second silicon rod holder) determines a predetermined center line, wherein the predetermined center line and the clamping center line of the first silicon rod holder (or the clamping center line of the second silicon rod holder) centerline) are the same in the direction of the re-perpendicular line (ie, the height is the same). Therefore, the centering adjustment mechanism is used to adjust the position of the silicon rod to be processed so that its axis line corresponds to the predetermined center line, and is used to adjust the position of the silicon rod to be processed in the direction of the heavy vertical line So that its axis line is consistent with the predetermined center line in the direction of the heavy vertical line.
关于所述对中调节机构,在本申请的一实施例中,所述对中调节机构包括垂向升降机构,用于驱动所述硅棒承载结构及其所承载的硅棒作垂向升降运动以使得所述硅棒的轴心线与预定中心线在重垂线方向上对齐。Regarding the centering adjustment mechanism, in an embodiment of the present application, the centering adjustment mechanism includes a vertical lifting mechanism for driving the silicon rod bearing structure and the silicon rods it carries to perform vertical lifting and lowering motions So that the axis line of the silicon rod is aligned with the predetermined center line in the direction of the heavy vertical line.
在某些实施方式中,所述作为对中调节机构的垂向升降机构更包括:垂向升降导轨、滑块、以及垂向升降驱动单元。In some embodiments, the vertical lift mechanism as the centering adjustment mechanism further comprises: a vertical lift guide rail, a sliding block, and a vertical lift drive unit.
所述垂向升降驱动单元用于驱动所述硅棒承载结构沿着所述垂向升降导轨作升降移动。在上述垂向升降驱动单元中,包括驱动电机以及由驱动电机驱动的丝杆组件,驱动电机可设置于安装结构上,丝杆组件与驱动电机和硅棒承载结构中的承载底座连接。在使用所述垂向升降驱动单元时,所述驱动电机驱动连接的丝杆组件正向转动,继而带动硅棒承载结构沿着垂向升降导轨作上升动作,或者,所述驱动电机驱动连接的丝杆组件反向转动,继而带动硅棒承载结构沿着垂向升降导轨作下降动作。The vertical lift driving unit is used for driving the silicon rod supporting structure to move up and down along the vertical lift guide rail. The above-mentioned vertical lift drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The drive motor can be arranged on the installation structure, and the lead screw assembly is connected to the drive motor and the bearing base in the silicon rod bearing structure. When using the vertical lift drive unit, the drive motor drives the connected lead screw assembly to rotate in the forward direction, and then drives the silicon rod bearing structure to move up along the vertical lift guide rail, or the drive motor drives the connected The screw assembly rotates in the opposite direction, and then drives the silicon rod bearing structure to perform a descending action along the vertical lifting guide rail.
当然,所垂向升降驱动单元仍可作其他的变化,例如,在一实施例中,所述垂向升降驱动单元也可包括驱动电机以及由所述驱动电机驱动的齿轮齿条传动组件,其中,所述齿轮齿条传动组件可包括驱动齿轮和升降齿条,所述驱动电机可设置于安装结构上,所述升降齿条沿重垂线方向设置并与硅棒承载结构的承载底座连接,所述驱动齿轮与所述升降齿条啮合且受控于所述驱动电机。在使用所述垂向升降驱动单元时,所述驱动电机驱动所述驱动齿轮正向转动,继而带动所述升降齿条及其连接的硅棒承载结构沿着垂向升降导轨作上升动作,或者,所述驱动电机驱动所述驱动齿轮反向转动,继而带动所述升降齿条及其连接的硅棒承载结构沿着垂向升降导轨作下降动作。Of course, other changes can be made to the vertical lift drive unit. For example, in one embodiment, the vertical lift drive unit may also include a drive motor and a rack and pinion drive assembly driven by the drive motor, wherein , the rack and pinion transmission assembly may include a driving gear and a lifting rack, the driving motor may be arranged on the installation structure, the lifting rack is arranged in the direction of the heavy vertical line and is connected with the bearing base of the silicon rod bearing structure, The drive gear meshes with the lift rack and is controlled by the drive motor. When using the vertical lift drive unit, the drive motor drives the drive gear to rotate in the forward direction, and then drives the lift rack and its connected silicon rod supporting structure to move up along the vertical lift guide rail, or , the drive motor drives the drive gear to rotate in the reverse direction, and then drives the lift rack and its connected silicon rod bearing structure to perform a descending action along the vertical lift guide rail.
在某些实施方式中,所述垂向升降机构包括:垂向升降导杆和垂向升降驱动单元。In some embodiments, the vertical lift mechanism includes: a vertical lift guide rod and a vertical lift drive unit.
所述垂向升降导杆可沿重垂线方向设置于硅棒承载结构的承载底座上,例如,硅棒移送装置还包括一安装结构,所述垂向升降导杆即设置在所述安装结构上并穿过硅棒承载结构的承载底座。为确保硅棒上料承载架构能沿着垂向升降导杆作升降移动的稳定性,垂向升降导杆的数量可为多个,例如,垂向升降导杆可以是四个,分别对应于硅棒承载结构中承载底座的四个边角处。当然,垂向升降导杆也可以是其他数量,例如,三个、五个、六个、或更多个,以三个为例,三个垂向升降导杆可以例如等腰三角形的方式设置,以五个为例,五个垂向升降导杆可在前述四个垂向升降导杆的布局基础上可在中央区域再增设一个垂向升降导杆,等。The vertical lift guide rod can be arranged on the bearing base of the silicon rod carrying structure along the direction of the heavy vertical line. For example, the silicon rod transfer device further includes a mounting structure, and the vertical lift guide rod is arranged on the mounting structure. on and through the carrier base of the silicon rod carrier structure. In order to ensure the stability of the lifting and lowering movement of the silicon rod loading support structure along the vertical lifting guide rods, the number of the vertical lifting guide rods can be multiple, for example, the vertical lifting guide rods can be four, corresponding to The four corners of the bearing base in the silicon rod bearing structure. Of course, the number of vertical lift guide rods can also be other, for example, three, five, six, or more, taking three as an example, the three vertical lift guide rods can be arranged in the form of an isosceles triangle, for example , taking five as an example, the five vertical lift guide rods can be based on the layout of the aforementioned four vertical lift guide rods, and another vertical lift guide rod can be added in the central area, and so on.
所述垂向升降驱动单元用于驱动所述硅棒承载结构沿着所述垂向升降导杆作升降移动。 在上述垂向升降驱动单元中,包括驱动电机以及由驱动电机驱动的丝杆组件,驱动电机可设置于安装结构上,丝杆组件与驱动电机和硅棒承载结构中的承载底座连接。在使用所述垂向升降驱动单元时,所述驱动电机驱动连接的丝杆组件正向转动,继而带动硅棒承载结构沿着垂向升降导杆作上升动作,或者,所述驱动电机驱动连接的丝杆组件反向转动,继而带动硅棒承载结构沿着垂向升降导杆作下降动作。The vertical lift driving unit is used for driving the silicon rod supporting structure to move up and down along the vertical lift guide rod. The above-mentioned vertical lift drive unit includes a drive motor and a lead screw assembly driven by the drive motor. The drive motor can be arranged on the installation structure, and the lead screw assembly is connected to the drive motor and the bearing base in the silicon rod bearing structure. When using the vertical lift drive unit, the drive motor drives the connected lead screw assembly to rotate in the forward direction, and then drives the silicon rod supporting structure to move up along the vertical lift guide rod, or the drive motor drives the connection The screw assembly rotates in the opposite direction, and then drives the silicon rod bearing structure to perform a downward movement along the vertical lifting guide rod.
当然,所垂向升降驱动单元仍可作其他的变化,例如,在一实施例中,所述垂向升降驱动单元也可包括驱动电机以及由所述驱动电机驱动的齿轮齿条传动组件,其中,所述齿轮齿条传动组件可包括驱动齿轮和升降齿条,所述驱动电机可设置于安装结构上,所述升降齿条沿重垂线方向设置并与硅棒承载结构的承载底座连接,所述驱动齿轮与所述升降齿条啮合且受控于所述驱动电机。在使用所述垂向升降驱动单元时,所述驱动电机驱动所述驱动齿轮正向转动,继而带动所述升降齿条及其连接的硅棒承载结构沿着垂向升降导杆作上升动作,或者,所述驱动电机驱动所述驱动齿轮反向转动,继而带动所述升降齿条及其连接的硅棒承载结构沿着垂向升降导杆作下降动作。Of course, other changes can be made to the vertical lift drive unit. For example, in one embodiment, the vertical lift drive unit may also include a drive motor and a rack and pinion drive assembly driven by the drive motor, wherein , the rack and pinion transmission assembly may include a driving gear and a lifting rack, the driving motor may be arranged on the installation structure, the lifting rack is arranged in the direction of the heavy vertical line and is connected with the bearing base of the silicon rod bearing structure, The drive gear meshes with the lift rack and is controlled by the drive motor. When using the vertical lift drive unit, the drive motor drives the drive gear to rotate in the forward direction, and then drives the lift rack and its connected silicon rod bearing structure to move up along the vertical lift guide rod, Alternatively, the driving motor drives the driving gear to rotate in the opposite direction, and then drives the lifting rack and its connected silicon rod supporting structure to perform a downward movement along the vertical lifting guide rod.
另外,所述垂向升降驱动单元还可包括辅助升降组件,所述辅助升降组件更包括气缸以及与气缸相连的升降顶杆,其中,气缸可设置于安装结构上,所述升降顶杆与气缸相连且与硅棒承载结构中的承载底座关联。所述升降顶杆与硅棒承载结构中的承载底座关联可采用多种实现方式,例如,在一种实现方式中,所述升降顶杆与承载底座连接,在另一种实现方式中,所述升降顶杆与承载底座保持接触。如此,在使用垂向升降驱动单元时,其中调节的辅助升降组件可辅助承载底座沿着垂向升降导杆作升降动作,可确保承载底座作升降动作的稳定性。In addition, the vertical lift drive unit may further include an auxiliary lift assembly, and the auxiliary lift assembly further includes a cylinder and a lift rod connected to the cylinder, wherein the cylinder may be arranged on the installation structure, and the lift rod is connected to the cylinder. Connected and associated with the carrier base in the silicon rod carrier structure. The association between the lifting mandrel and the bearing base in the silicon rod bearing structure can be implemented in various ways. For example, in one implementation, the lifting mandrel is connected to the bearing base, and in another The lifting top rod is kept in contact with the bearing base. In this way, when the vertical lift drive unit is used, the adjusted auxiliary lift assembly can assist the carrying base to perform the lifting action along the vertical lift guide rod, thereby ensuring the stability of the carrying base in the lifting action.
在本申请中,利用前述作为对中调节机构的垂向升降机构,通过驱动硅棒承载结构所承载的硅棒作垂向升降运动,可使得所述硅棒的轴心线与预定中心线在重垂线方向上对齐,其中,所述预定中心线可根据第一硅棒夹具的夹持中心或第二硅棒夹具的夹持中心来得到,一般地,由于第一硅棒夹具的夹持中心或第二硅棒夹具的夹持中心是确定的,因此,所述预定中心线也是确定的(若第一硅棒夹具的夹持中心线与第二硅棒夹具的夹持中心线在重垂线方向上不一致,那么就可包括与第一硅棒夹具的夹持中心线对应的第一预定中心线和与第二硅棒夹具的夹持中心线对应的第二预定中心线)。如此,在使用垂向升降机构时,为确保驱动硅棒承载结构所承载的硅棒在重垂线方向作升降动作的升降数值,还需要确定硅棒当前在重垂线方向的尺度或者硅棒与第一硅棒夹具的夹持中心或第二硅棒夹具的夹持中心在重垂线方向上的高度差值。因此,在本申请的一实施例中,所述对中调节机构还包括高度检测仪,用于 检测硅棒承载结构所承载的硅棒的轴心线在重垂线方向上的位置信息。In the present application, using the aforementioned vertical lifting mechanism as the centering adjustment mechanism, by driving the silicon rod carried by the silicon rod supporting structure to perform vertical lifting motion, the axis line of the silicon rod can be aligned with the predetermined center line. Aligned in the direction of the heavy vertical line, wherein the predetermined center line can be obtained according to the clamping center of the first silicon rod holder or the clamping center of the second silicon rod holder. Generally, due to the clamping of the first silicon rod holder The center or the clamping center of the second silicon rod clamp is determined, so the predetermined center line is also determined (if the clamping center line of the first silicon rod clamp and the clamping center line of the second silicon rod clamp If the vertical line direction is inconsistent, it may include a first predetermined center line corresponding to the clamping center line of the first silicon rod holder and a second predetermined center line corresponding to the clamping center line of the second silicon rod holder). In this way, when using the vertical lifting mechanism, in order to ensure the lifting value of the silicon rod carried by the driving silicon rod bearing structure in the direction of the heavy vertical line, it is also necessary to determine the current size of the silicon rod in the direction of the heavy vertical line or the size of the silicon rod. The height difference between the clamping center of the first silicon rod holder or the clamping center of the second silicon rod holder in the direction of the heavy vertical line. Therefore, in an embodiment of the present application, the centering adjustment mechanism further includes a height detector for detecting the position information of the axis line of the silicon rod carried by the silicon rod supporting structure in the direction of the heavy vertical line.
所述硅棒移送装置还包括居中调节机构,用于调节所述待加工的硅棒在第一方向上的位置以使所述硅棒位于所述硅棒承载结构在第一方向上的居中区域。The silicon rod transfer device further includes a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that the silicon rod is located in the center area of the silicon rod supporting structure in the first direction .
如图9所示,所述硅棒移送装置还可包括居中调节机构73,所述居中调节机构73可包括:支架731、配置在支架上的调节导轨733、相对布置在支架两侧且能在调节导轨上相对移动的两个推顶件735、以及推顶驱动单元,其中,所述调节导轨733沿第一方向设置,所述两个推顶件735设于调节导轨上且分别相对布置在支架的两侧,所述推顶驱动单元更包括双向丝杠和驱动源,其中,所述双向丝杆沿第一方向设置且在两端分别两个推顶件螺纹连接,所述驱动源与双向丝杆连接,用于驱动所述双向丝杆转动以使得两个推顶件735沿第一方向相向移动或相背移动。在使用所述实施例所公开的居中调节机构时,令所述驱动源驱动所述双向丝杆正向转动,使得两个推顶件沿着调节导轨(所述调节导轨沿第一方向布设)相向移动以执行合拢动作,或者,令所述驱动源驱动所述双向丝杆反向转动,使得两个推顶件沿着调节导轨(所述调节导轨沿第一方向布设)相背移动以执行张开动作。所述控制源可例如为伺服电机。As shown in FIG. 9 , the silicon rod transfer device may further include a centering adjustment mechanism 73, and the centering adjustment mechanism 73 may include: a bracket 731, an adjustment guide rail 733 arranged on the bracket, relatively arranged on both sides of the bracket and capable of The two ejectors 735 that move relatively on the adjustment guide rail and the ejection drive unit, wherein the adjustment guide rail 733 is arranged along the first direction, and the two ejection members 735 are arranged on the adjustment guide rail and are respectively arranged opposite to each other. On both sides of the bracket, the ejector drive unit further includes a bidirectional screw and a drive source, wherein the bidirectional screw is arranged along the first direction and two ejectors are screwed at both ends, and the drive source is connected to the drive source. The two-way screw connection is used to drive the two-way screw to rotate so that the two ejectors 735 move toward each other or move toward each other along the first direction. When the centering adjustment mechanism disclosed in the embodiment is used, the driving source drives the bidirectional screw to rotate in the forward direction, so that the two ejectors are along the adjusting guide rail (the adjusting guide rail is arranged along the first direction) Move toward each other to perform the closing action, or make the driving source drive the two-way screw to rotate in the opposite direction, so that the two ejectors move opposite to each other along the adjusting guide rail (the adjusting guide rail is arranged along the first direction) to perform the closing operation. open action. The control source may be, for example, a servo motor.
由上可知,利用居中调节机构,通过两个推顶件推顶硅棒承载结构上所承载硅棒在第一方向上的位置,使得硅棒调整至硅棒承载结构的居中区域。It can be seen from the above that the position of the silicon rod carried on the silicon rod carrying structure in the first direction is pushed up by the two ejector members by using the centering adjustment mechanism, so that the silicon rod is adjusted to the center area of the silicon rod carrying structure.
如前所述,所述对中调节机构还包括高度检测仪,用于检测硅棒承载结构所承载的硅棒的轴心线在重垂线方向上的位置信息。如图所示,在本申请的实施例中,所述对中调节机构包括高度检测仪,所述高度检测仪配置在居中调节机构上。例如,高度检测仪设置在所述居中调节机构的调节导轨上,其可受控于一控制源(例如伺服电机)而执行沿重垂线方向以及第一方向和/或第二方向的移动。在一实现方式中,高度检测仪可例如为接触式传感器或测距传感器。以接触式传感器为例,所述接触式传感器具有探测头,用于与硅棒接触。在某些实施例中,所述接触式传感器的探测头上还可设置有伸缩弹簧,在探测头接触到硅棒时,可在伸缩弹簧的带动下回退,可用于保护探测头,避免探测头被硬性触碰或顶压而损坏。As mentioned above, the centering adjustment mechanism further includes a height detector for detecting the position information of the axis line of the silicon rod carried by the silicon rod supporting structure in the direction of the heavy vertical line. As shown in the figure, in the embodiment of the present application, the centering adjustment mechanism includes a height detector, and the height detector is configured on the centering adjustment mechanism. For example, a height detector is arranged on the adjustment guide rail of the centering adjustment mechanism, which can be controlled by a control source (eg, a servo motor) to perform movement along the vertical direction and the first direction and/or the second direction. In one implementation, the height detector may be, for example, a touch sensor or a ranging sensor. Taking a touch sensor as an example, the touch sensor has a probe head for making contact with a silicon rod. In some embodiments, the probe head of the contact sensor can also be provided with a telescopic spring. When the probe head contacts the silicon rod, it can retreat under the drive of the telescopic spring, which can be used to protect the probe head and avoid detection. The head is damaged by hard touching or pressing.
由上可知,利用所述高度检测仪,可通过对硅棒多点检测后得到硅棒的高度,继而获得硅棒的轴心线在重垂线方向上的位置信息,以便于后续利用对中调节机构据此进行调整。It can be seen from the above that using the height detector, the height of the silicon rod can be obtained after multi-point detection of the silicon rod, and then the position information of the axis line of the silicon rod in the direction of the heavy vertical line can be obtained, so as to facilitate the subsequent use of centering. The adjustment mechanism adjusts accordingly.
所述硅棒移送装置还包括硅棒夹紧机构,所述硅棒夹紧机构设置于硅棒承载结构上,用于夹紧硅棒承载结构所承载的硅棒,并使得硅棒的轴心线与所述硅棒承载结构的中心线对应。在本申请的一实施例中,所述硅棒夹紧机构包括:夹具安装件和硅棒夹紧件。The silicon rod transfer device also includes a silicon rod clamping mechanism, the silicon rod clamping mechanism is arranged on the silicon rod carrying structure, and is used for clamping the silicon rod carried by the silicon rod carrying structure, and makes the axial center of the silicon rod. The line corresponds to the centerline of the silicon rod carrying structure. In an embodiment of the present application, the silicon rod clamping mechanism includes: a clamp mounting member and a silicon rod clamping member.
如图9所示,所述硅棒夹紧机构75包括夹具安装件751和硅棒夹紧件753。As shown in FIG. 9 , the silicon rod clamping mechanism 75 includes a clamp mounting member 751 and a silicon rod clamping member 753 .
所述夹具安装件751沿着第一方向设于所述硅棒承载结构71上。The fixture mounting member 751 is disposed on the silicon rod supporting structure 71 along the first direction.
所述硅棒夹紧件753设于所述夹具安装件751上。其中,所述硅棒夹紧件可至少两个,所述至少两个硅棒夹紧件可沿着所述夹具安装件间距设置。在某些实施方式中,每一个硅棒夹紧件更可包括:夹臂安装座、两个夹臂、以及夹臂驱动机构。其中,所述夹臂安装座设于所述夹具安装件上,所述两个夹臂则活动设于所述夹臂安装座上且沿第二方向对向设置,所述夹臂驱动机构用于驱动所述两个夹臂作开合动作。The silicon rod clamping member 753 is arranged on the clamping member 751 . Wherein, there may be at least two silicon rod clamping members, and the at least two silicon rod clamping members may be arranged along the distance between the fixture mounting members. In some embodiments, each silicon rod clamping member may further include: a clamping arm mounting seat, two clamping arms, and a clamping arm driving mechanism. Wherein, the clamping arm mounting seat is arranged on the clamp mounting member, and the two clamping arms are movably arranged on the clamping arm mounting seat and are oppositely arranged along the second direction, and the clamping arm driving mechanism is used for to drive the two clamping arms to open and close.
如此,当将待加工的硅棒置放于硅棒承载结构上时,所述硅棒夹紧机构中两个硅棒夹紧件中的夹臂松开,待加工的硅棒位于每一个硅棒夹紧件中两个夹臂之间,针对每一个硅棒夹紧件,利用硅棒夹紧件中的夹臂驱动机构驱动所述两个夹臂作夹合动作,从而将硅棒予以夹紧。In this way, when the silicon rod to be processed is placed on the silicon rod supporting structure, the clamping arms in the two silicon rod clamping members in the silicon rod clamping mechanism are released, and the silicon rod to be processed is located in each silicon rod. Between the two clamping arms in the rod clamping piece, for each silicon rod clamping piece, the clamping arm driving mechanism in the silicon rod clamping piece is used to drive the two clamping arms for clamping action, so that the silicon rod is clamped. clamped.
在某些实现方式中,所述夹臂驱动机构可包括:开合齿轮,设于所述夹臂安装座上;两个齿条,每一个齿条与对应的夹臂关联且与所述开合齿轮啮合;驱动源,关联于所述开合齿轮,用于驱动所述开合齿轮转动。其中,两个齿条并行设置且所述开合齿轮位于两个齿条之间,所述齿条中面向所述开合齿轮的那一面设有齿牙。所述驱动源可例如为伺服电机。In some implementations, the clamp arm driving mechanism may include: an opening and closing gear disposed on the clamp arm mounting seat; two racks, each of which is associated with a corresponding clamp arm and is associated with the opener The closing gear is meshed; the driving source is associated with the opening and closing gear, and is used to drive the opening and closing gear to rotate. Wherein, two racks are arranged in parallel, and the opening and closing gear is located between the two racks, and the side of the rack facing the opening and closing gear is provided with teeth. The drive source may be, for example, a servo motor.
如此,当利用所述夹臂驱动机构驱动所述两个夹臂作开合动作时,由驱动源驱动开合齿轮正向转动,继而带动与开合齿轮啮合的两个齿条及其关联的两个夹臂相向移动作夹合动作,或者,由驱动源驱动开合齿轮反向转动,继而带动与开合齿轮啮合的两个齿条及其关联的两个夹臂背向移动作张开动作。In this way, when the two clamping arms are driven by the clamping arm driving mechanism to perform the opening and closing action, the opening and closing gear is driven by the driving source to rotate in the forward direction, thereby driving the two racks meshing with the opening and closing gears and their associated gears. The two clamping arms move toward each other to perform the clamping action, or the driving source drives the opening and closing gear to rotate in the opposite direction, which in turn drives the two racks meshing with the opening and closing gear and the two associated clamping arms to move back to open. action.
当然,上述夹臂驱动机构并不以此为限,在其他实施例中,所述夹臂驱动机构仍可作其他的变化,例如,所述夹臂驱动机构也可采用丝杆调整机构、链条输送机构、或倍速链机构等。Of course, the above-mentioned clamping arm driving mechanism is not limited to this. In other embodiments, the clamping arm driving mechanism can still make other changes. For example, the clamping arm driving mechanism can also use a screw adjustment mechanism, a chain Conveying mechanism, or double-speed chain mechanism, etc.
另外,在所述硅棒夹紧机构中,至少两个硅棒夹紧件中的至少一个硅棒夹紧件设有间距调整驱动机构,用于驱动至少一个硅棒夹紧件沿着所述夹具安装件运动,以调整所述至少两个硅棒夹紧件的间距。In addition, in the silicon rod clamping mechanism, at least one silicon rod clamping member in the at least two silicon rod clamping members is provided with a spacing adjustment driving mechanism for driving the at least one silicon rod clamping member along the The clamp mount moves to adjust the spacing of the at least two silicon rod clamps.
在一示例中,所述至少两个硅棒夹紧件是由电机驱动的链条输送机构。所述的链条输送机构包括:环状链条以及用于驱动所述环状链条的链轮。所述环状链条沿第一方向设置,所述环状链条的两端分别配置有链轮,所述链轮的轮齿啮合于所述链条,并在转动时带动所述链条运行。所述两个链轮中的其中一个链轮作为主动链轮,所述主动链轮可动力联接至电机轴即动力输出轴,主动链轮与两条环状链的链轮啮合,进而由驱动电机控制链条输送速度,即可控制在夹具安装件上的至少一个硅棒夹紧件移动的速度。In one example, the at least two silicon rod clamps are motor-driven chain conveyor mechanisms. The chain conveying mechanism includes: an endless chain and a sprocket for driving the endless chain. The endless chain is arranged along the first direction, and two ends of the endless chain are respectively provided with sprockets, the teeth of the sprockets are engaged with the chain, and drive the chain to run when rotating. One of the two sprockets is used as the drive sprocket, the drive sprocket can be dynamically coupled to the motor shaft, that is, the power output shaft, and the drive sprocket meshes with the sprockets of the two endless chains, and is then driven by the drive. The motor controls the conveying speed of the chain, that is, the speed at which the at least one silicon rod clamping piece on the fixture mounting piece moves can be controlled.
在另一些可行的示例中,所述间距调整驱动机构还可设置为倍速链机构、或传动带机构等。In some other feasible examples, the distance adjustment driving mechanism may also be configured as a double-speed chain mechanism, a transmission belt mechanism, or the like.
所述硅棒移送装置还包括进给驱动机构,所述用于驱动所述硅棒承载结构及其承载的所述待加工的硅棒沿第二方向由装载区位移动至第一加工区位。The silicon rod transfer device further includes a feeding driving mechanism, which is used to drive the silicon rod carrying structure and the silicon rod to be processed to be carried along the second direction to move from the loading position to the first processing position.
所述进给驱动机构设置于硅棒承载结构的下方,包括:进给导杆或进给导轨、和进给驱动单元,其中,进给导杆或进给导轨沿第二方向布设,用于设置所述硅棒承载结构,进给导杆或进给导轨沿第二方向跨设于机座。所述进给驱动单元用于驱动所述硅棒承载结构沿着所述进给导杆或进给导轨移动,在一种实现方式中,所述进给驱动单元包括:驱动电机以及沿第二方向设置且由驱动电机驱动的丝杆组件,所述驱动电机可设置于丝杆组件的一端,所述丝杆组件受控于驱动电机且与硅棒承载结构螺接。如此,当使用所述进给驱动机构时,由驱动电机驱动丝杆组件正向转动,继而带动与丝杆组件连接的硅棒承载结构沿着进给进给导杆或进给导轨(沿第二方向)面向第一加工区位移动,或者,由驱动电机驱动丝杆组件反向转动,继而带动与丝杆组件连接的硅棒承载结构沿着进给导杆或进给导轨(沿第二方向)面向装卸区位移动,从而将硅棒承载结构所承载的硅棒在装卸区位和第一加工区位之间移送。The feeding drive mechanism is arranged below the silicon rod bearing structure, and includes: a feeding guide rod or a feeding guide rail, and a feeding driving unit, wherein the feeding guide rod or the feeding guide rail is arranged along the second direction for The silicon rod bearing structure is provided, and the feed guide rod or the feed guide rail is arranged across the machine base along the second direction. The feeding and driving unit is used to drive the silicon rod supporting structure to move along the feeding guide rod or the feeding guide rail. In an implementation, the feeding and driving unit includes: a driving motor and a second A lead screw assembly arranged in a direction and driven by a drive motor, the drive motor can be arranged at one end of the lead screw assembly, and the lead screw assembly is controlled by the drive motor and is screwed with the silicon rod bearing structure. In this way, when the feeding drive mechanism is used, the lead screw assembly is driven by the drive motor to rotate in the forward direction, and then the silicon rod bearing structure connected with the lead screw assembly is driven along the feeding guide rod or the feeding guide rail (along the first Two directions) move toward the first processing area, or, the drive motor drives the screw assembly to rotate in the opposite direction, and then drives the silicon rod supporting structure connected with the screw assembly along the feed guide rod or feed guide rail (in the second direction). ) moves towards the loading and unloading area, so that the silicon rods carried by the silicon rod carrying structure are transferred between the loading and unloading area and the first processing area.
所述硅棒移送装置还包括晶线检测单元,用于对待加工的硅棒进行晶线检测以确定所述硅棒的晶线位置。如图9所示,所述晶线检测单元77可设置于硅棒承载结构或硅棒夹紧机构上,以硅棒夹紧机构为例,所述晶线检测单元77可设置于硅棒夹紧件753,例如,硅棒夹紧件753的夹臂安装座或夹臂上。The silicon rod transfer device further includes a crystal line detection unit for performing crystal line detection on the silicon rod to be processed to determine the crystal line position of the silicon rod. As shown in FIG. 9 , the crystal wire detection unit 77 can be arranged on the silicon ingot supporting structure or the silicon ingot clamping mechanism. Taking the silicon ingot clamping mechanism as an example, the crystal wire detection unit 77 can be arranged on the silicon ingot clamping mechanism. The clamping member 753, for example, on the clamping arm mounting seat or clamping arm of the silicon rod clamping member 753.
在实际应用中,当使用前述的硅棒移送装置时,具体操作流程可大致包括:硅棒承载结构位于装卸区位的初始位置处,将待加工的硅棒置于硅棒承载结构上;利用居中调节机构调节所述待加工的硅棒在第一方向上的位置以使所述硅棒位于所述硅棒承载结构在第一方向上的居中区域,同时,利用硅棒夹紧机构夹紧硅棒承载结构所承载的硅棒,使得硅棒的轴心线与所述硅棒承载结构的中心线对应;利用高度检测仪对硅棒进行检测,得到硅棒的轴心线在重垂线方向上的位置信息,根据硅棒的轴心线在重垂线方向上的位置信息和第一加工区位处的第一硅棒夹具或第二硅棒夹具的夹持中心线在重垂线方向上的位置信息,确定两者的差值,利用垂向升降机构驱动硅棒承载结构及其所承载的硅棒沿重垂线方向执行升降动作,使得硅棒的轴心线与第一加工区位处的第一硅棒夹具或第二硅棒夹具的夹持中心线在重垂线方向上对齐;利用进给驱动机构驱动硅棒承载结构及其所承载的硅棒沿着第二方向移动至第一加工区位,以令第一加工区位处第一硅棒夹具或第二硅棒夹持所述硅棒;利用第一硅棒夹具或第二硅棒夹具以预订转速带动硅棒转动,令晶线检测单元对硅棒进行晶线检测以确定所述硅棒 的晶线位置,根据确定的硅棒的晶线位置,第一硅棒夹具或第二硅棒夹具将夹持的硅棒调整到位,完成硅棒的装载。In practical applications, when the aforementioned silicon rod transfer device is used, the specific operation process may roughly include: the silicon rod carrying structure is located at the initial position of the loading and unloading area, and the silicon rod to be processed is placed on the silicon rod carrying structure; The adjusting mechanism adjusts the position of the silicon rod to be processed in the first direction so that the silicon rod is located in the central area of the silicon rod supporting structure in the first direction, and at the same time, the silicon rod clamping mechanism is used to clamp the silicon rod The silicon rod carried by the rod bearing structure makes the axis line of the silicon rod correspond to the center line of the silicon rod bearing structure; the silicon rod is detected by a height detector, and it is obtained that the axis line of the silicon rod is in the direction of the heavy vertical line According to the position information of the axis line of the silicon rod in the direction of the heavy vertical line and the clamping center line of the first silicon rod holder or the second silicon rod holder at the first processing location in the direction of the heavy vertical line position information, determine the difference between the two, and use the vertical lifting mechanism to drive the silicon rod bearing structure and the silicon rod carried by it to perform lifting and lowering in the direction of the heavy vertical line, so that the axis line of the silicon rod and the first processing area are The clamping centerlines of the first silicon rod clamp or the second silicon rod clamp are aligned in the direction of the heavy vertical line; the feeding drive mechanism is used to drive the silicon rod carrying structure and the silicon rods it carries to move along the second direction to the second position. a processing area, so that the first silicon rod clamp or the second silicon rod clamps the silicon rod at the first processing position; the first silicon rod clamp or the second silicon rod clamp is used to drive the silicon rod to rotate at a predetermined speed to make the crystal The line detection unit performs crystal line detection on the silicon rod to determine the crystal line position of the silicon rod. According to the determined crystal line position of the silicon rod, the first silicon rod clamp or the second silicon rod clamp adjusts the clamped silicon rod in place. , complete the loading of silicon rods.
在本申请的一实施例中,所述硅棒切磨一体机还包括硅棒卸载装置,设于所述硅棒加工平台的工件卸料区,用于将研磨后硅棒自所述硅棒加工平台卸载。In an embodiment of the present application, the integrated silicon rod cutting and grinding machine further includes a silicon rod unloading device, which is arranged in the workpiece unloading area of the silicon rod processing platform, and is used for removing the ground silicon rod from the silicon rod. The processing platform is unloaded.
所述硅棒卸载装置的方向及位置可由所述工件卸料区的位置关系确定。The direction and position of the silicon rod unloading device can be determined by the positional relationship of the workpiece unloading area.
在一实施方式中,所述工件卸料区沿第一方向相邻设置,在此,所述硅棒卸载装置可沿第一方向设置,并对接于所述硅棒研磨装置,以令硅棒在被研磨后,将研磨后硅棒沿第一方向转运出去。所述硅棒卸载装置的数量还可依所述硅棒切磨一体机中硅棒研磨装置或转移通道的数量、结构或工作方式确定,例如,在如图1和图3所示的实施例中,In one embodiment, the workpiece unloading areas are disposed adjacent to each other along the first direction. Here, the silicon rod unloading device can be disposed along the first direction, and is connected to the silicon rod grinding device, so that the silicon rod can be After being ground, the ground silicon rod is transported out in the first direction. The number of the silicon rod unloading devices can also be determined according to the number, structure or working mode of the silicon rod grinding devices or the transfer channels in the integrated silicon rod cutting and grinding machine, for example, in the embodiment shown in FIG. 1 and FIG. 3 . middle,
当所述硅棒切磨一体机中设有第一转移通道和第二转移通道,所述硅棒研磨装置可在不同转移通道上转换并对不同转移通道上的硅棒进行研磨作业,在一种实施方式中,所述硅棒卸载装置可以为设为与转移通道对应的两个,每一个硅棒卸载装置对接于一个转移通道,以使得每一个硅棒卸载装置可对对应转移通道上的硅棒进行卸载,或者,在另一种实施方式中,如图硅棒切割装置和硅棒研磨装置,仅提供一个硅棒卸载装置,所述硅棒卸载装置可通过例如卸载转换机构在第一转移通道和第二转移通道之间转换,以使得所述硅棒卸载装置可对不同转移通道上的硅棒进行卸载。When the integrated silicon rod cutting and grinding machine is provided with a first transfer channel and a second transfer channel, the silicon rod grinding device can be switched between different transfer channels and perform grinding operations on the silicon rods on the different transfer channels. In this embodiment, the silicon rod unloading devices can be set to two corresponding to the transfer channels, and each silicon rod unloading device is connected to one transfer channel, so that each silicon rod unloading device can be connected to the corresponding transfer channel. The silicon rod is unloaded, or, in another embodiment, as shown in the silicon rod cutting device and the silicon rod grinding device, only one silicon rod unloading device is provided, and the silicon rod unloading device can be used for example by an unloading conversion mechanism. The transfer channel and the second transfer channel are switched, so that the silicon rod unloading device can unload the silicon rods on different transfer channels.
在某些实施方式中,所述硅棒卸载装置可采用硅棒输送装置。In certain embodiments, the silicon rod unloading device may employ a silicon rod conveying device.
所述硅棒输送装置可例如为链条输送机构、倍速链机构、或传送带机构。The silicon rod conveying device can be, for example, a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.
在一实施方式中,所述硅棒输送机构包括:输送部,用于承载所述硅棒;输送驱动源,用于驱动所述输送部运动以输送所述硅棒。In one embodiment, the silicon rod conveying mechanism includes: a conveying part for carrying the silicon rod; and a conveying driving source for driving the conveying part to move to convey the silicon rod.
所述输送部可沿第一方向设置,并在所述输送驱动源的驱动下沿第一方向运输所承载的硅棒。所述输送部的运动方向可设置为朝向所述工件卸料区的方向,以将所承载的硅棒运送至工件卸料区。The conveying part can be arranged along a first direction, and is driven by the conveying driving source to convey the carried silicon rods along the first direction. The moving direction of the conveying part may be set to be toward the workpiece unloading area, so as to transport the carried silicon rods to the workpiece unloading area.
所述输送驱动源例如为电机,用于驱动输送部运动并控制输送部的运输速度。The conveying driving source is, for example, a motor, which is used to drive the conveying part to move and control the conveying speed of the conveying part.
在一些示例中,为了避免所述硅棒在输送过程中收碰撞被磨损,在一些实施例中,所述输送部设有用于与所述硅棒接触的缓冲垫,又或,所述输送部采用缓冲材料制成。所述缓冲垫或缓冲材料例如为具有弹性的橡胶、硅胶或由其他具有弹性形变、阻尼特性或缓冲特性的材料,以减小硅棒输送的破损风险。In some examples, in order to prevent the silicon rods from being worn due to collision during the conveying process, in some embodiments, the conveying part is provided with a buffer pad for contacting the silicon rods, or the conveying part is Made of cushioning material. The cushioning pad or cushioning material is, for example, elastic rubber, silica gel, or other materials with elastic deformation, damping properties or cushioning properties, so as to reduce the risk of damage of the silicon rod being transported.
在某些实施方式中,所述硅棒卸载装置可采用硅棒夹送装置。In certain embodiments, the silicon rod unloading device may employ a silicon rod pinch device.
所述硅棒夹送装置包括:夹持部,用于夹持所述硅棒;输送驱动源,用于驱动所述夹持部运动以输送所述硅棒。The silicon rod clamping device includes: a clamping part for clamping the silicon rod; and a conveying driving source for driving the clamping part to move to convey the silicon rod.
所述夹持部可沿第一方向设置,用于夹持硅棒的两个端面,并在所述输送驱动源的驱动下沿第一方向运输所承载的硅棒。The clamping portion may be disposed along the first direction for clamping two end faces of the silicon rod, and transporting the carried silicon rod along the first direction under the driving of the conveying driving source.
所述输送驱动源例如为电机,用于驱动夹持部运动并控制夹持部的运输速度。The conveying driving source is, for example, a motor, which is used to drive the gripping part to move and control the conveying speed of the gripping part.
在此,本申请公开的硅棒切磨一体机,集合了硅棒切割装置和研磨装置且将硅棒切割装置和研磨装置分别设置在硅棒加工平台的第一加工区位与第二加工区位,并设置有同时贯穿第一加工区位与第二加工区位的第一转移装置和第二转移装置,为第一、第二转移装置分别配置硅棒夹具与驱动机构,通过协调控制第一、第二转移装置以及硅棒切割装置和研磨装置,使得在同一时刻位于第一加工区位的硅棒切割装置和位于第二加工区位的研磨装置均处于工作状态,从而完成硅棒的开方及研磨多工序的一体化作业,提高生产效率及产品加工作业的品质。Here, the silicon rod cutting and grinding integrated machine disclosed in this application integrates a silicon rod cutting device and a grinding device, and the silicon rod cutting device and the grinding device are respectively arranged in the first processing area and the second processing area of the silicon rod processing platform, A first transfer device and a second transfer device are provided that penetrate the first processing area and the second processing area at the same time, and the silicon rod clamp and the driving mechanism are respectively configured for the first and second transfer devices, and the first and second transfer devices are controlled by coordination. The transfer device, the silicon rod cutting device and the grinding device make the silicon rod cutting device located in the first processing area and the grinding device located in the second processing area in the working state at the same time, so as to complete the multi-process of squaring and grinding the silicon rod It can improve the production efficiency and the quality of product processing operations.
当利用所述图1和图2所示实施例中的硅棒切磨一体机进行硅棒加工作业时,具体的流程可大致如下:When using the integrated silicon rod cutting and grinding machine in the embodiment shown in FIG. 1 and FIG. 2 to process the silicon rod, the specific process can be roughly as follows:
将第一硅棒置放于位于装卸区位处的硅棒移送装置7。The first silicon rod is placed on the silicon rod transfer device 7 located at the loading and unloading area.
由硅棒移送装置7将第一硅棒移送至第一加工区位,由第一加工区位中位于第一转移通道上的第一硅棒夹具2夹持住第一硅棒以完成装载。其中,第一硅棒的轴心线与第一硅棒夹具2的夹持中心线在同一直线上。此时,硅棒切割装置4位于第一转移通道上,硅棒研磨装置5位于第二转移通道上。The first silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the first silicon rod is clamped by the first silicon rod holder 2 located on the first transfer channel in the first processing area to complete the loading. Wherein, the axis line of the first silicon rod and the clamping center line of the first silicon rod holder 2 are on the same straight line. At this time, the silicon rod cutting device 4 is located on the first transfer channel, and the silicon rod grinding device 5 is located on the second transfer channel.
驱动第一硅棒夹具2及其所夹持的第一硅棒沿第一方向移动,令硅棒切割装置4对第一硅棒进行切割作业。在令硅棒切割装置对第一硅棒进行切割作业时,首先由硅棒切割装置中所形成的两个平行的切割线锯对第一硅棒进行第一次切割,使得第一硅棒中相对的两个侧切面被切割,去除切割所留下的边皮,驱动第一硅棒夹具沿第一方向回退至初始位置,利用第一硅棒夹具转动第一硅棒90°以调整切割面,继续驱动第一硅棒夹具及其所夹持的第一硅棒沿第一方向移动,令硅棒切割装置对第一硅棒进行剩余两个侧切面的切割,去除切割所留下的边皮,形成截面呈矩形的硅棒,完成硅棒的开方。The first silicon rod holder 2 and the first silicon rod held by it are driven to move along the first direction, so that the silicon rod cutting device 4 performs the cutting operation on the first silicon rod. When the first silicon rod is cut by the silicon rod cutting device, the first silicon rod is first cut by two parallel cutting wire saws formed in the silicon rod cutting device, so that the first silicon rod is cut for the first time. The two opposite side cut planes are cut, remove the edge skin left by the cutting, drive the first silicon rod holder to return to the initial position along the first direction, and use the first silicon rod holder to rotate the first silicon rod 90° to adjust the cutting Continue to drive the first silicon rod clamp and the first silicon rod held by it to move in the first direction, so that the silicon rod cutting device cuts the remaining two side sections of the first silicon rod, and removes the remaining two sides of the cutting. The edge skin is formed to form a silicon rod with a rectangular cross-section, and the square of the silicon rod is completed.
将硅棒切割装置4由第一转移通道转换至第二通道以及将硅棒研磨装置5由第二转移通道转换至第一通道。The silicon rod cutting device 4 is switched from the first transfer channel to the second channel and the silicon rod grinding device 5 is switched from the second transfer channel to the first channel.
由硅棒移送装置7将第二硅棒移送至第一加工区位,由第一加工区位中位于第二转移通道上的第二硅棒夹具3夹持住第二硅棒以完成装载。其中,第二硅棒的轴心线与第二硅棒夹 具3的夹持中心线在同一直线上。The second silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the second silicon rod is clamped by the second silicon rod holder 3 located on the second transfer channel in the first processing area to complete the loading. Wherein, the axis line of the second silicon rod and the clamping center line of the second silicon rod holder 3 are on the same straight line.
驱动第一硅棒夹具2及其所夹持的第一硅棒沿第一方向移动,令硅棒研磨装置5对第一硅棒进行研磨作业。在某些实施方式中,所述研磨作业包括粗磨作业和精磨作业,例如,先由硅棒研磨装置中的粗磨磨具对第一硅棒进行粗磨作业,再由硅棒研磨装置中的精磨磨具对第一硅棒进行精磨作业。在某些实施方式中,所述研磨作业包括粗磨作业、精磨作业、以及倒角作业。例如,先由硅棒研磨装置中的粗磨磨具对第一硅棒进行粗磨作业,再由硅棒研磨装置中的精磨磨具对第一硅棒进行精磨作业,最后,由硅棒研磨装置中的精磨磨具或倒角磨具对第一硅棒进行倒角作业。与此同时,驱动第二硅棒夹具3及其所夹持的第二硅棒沿第一方向移动,令硅棒切割装置4对第二硅棒进行切割作业,形成截面呈矩形的硅棒,完成硅棒的开方。The first silicon rod holder 2 and the first silicon rod held by it are driven to move along the first direction, so that the silicon rod grinding device 5 is used to grind the first silicon rod. In some embodiments, the grinding operation includes a rough grinding operation and a fine grinding operation. For example, the first silicon rod is first subjected to the rough grinding operation by the rough grinding tool in the silicon rod grinding device, and then the silicon rod grinding device is used for rough grinding. The fine grinding tool in the first silicon rod performs fine grinding work. In certain embodiments, the grinding operation includes a rough grinding operation, a fine grinding operation, and a chamfering operation. For example, the first silicon rod is roughly ground by the rough grinding tool in the silicon rod grinding device, and then the first silicon rod is finely ground by the fine grinding tool in the silicon rod grinding device. The fine grinding tool or the chamfering tool in the rod grinding device performs the chamfering operation on the first silicon rod. At the same time, the second silicon rod holder 3 and the second silicon rod held by it are driven to move in the first direction, so that the silicon rod cutting device 4 cuts the second silicon rod to form a silicon rod with a rectangular cross-section. Complete the square of the silicon rod.
将完成研磨作业的第一硅棒予以卸载,将硅棒切割装置2由第二转移通道转换至第一转移通道以及将硅棒研磨装置3由第一转移通道转换至第二转移通道。Unload the first silicon rod that has completed the grinding operation, switch the silicon rod cutting device 2 from the second transfer channel to the first transfer channel, and switch the silicon rod grinding device 3 from the first transfer channel to the second transfer channel.
由硅棒移送装置7将第三硅棒移送至第一加工区位,由第一加工区位中位于第一转移通道上的第一硅棒夹具夹持住第三硅棒以完成装载。The third silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the third silicon rod is clamped by the first silicon rod holder located on the first transfer channel in the first processing area to complete the loading.
驱动第二硅棒夹具3及其所夹持的第二硅棒沿第一方向移动,令硅棒研磨装置5对第二硅棒进行研磨作业。此时,驱动第一硅棒夹具2及其所夹持的第三硅棒沿第一方向移动,令硅棒切割装置4对第三硅棒进行切割作业。The second silicon rod holder 3 and the second silicon rod held by it are driven to move in the first direction, so that the silicon rod grinding device 5 is used to grind the second silicon rod. At this time, the first silicon rod holder 2 and the third silicon rod held by it are driven to move in the first direction, so that the silicon rod cutting device 4 performs the cutting operation on the third silicon rod.
重复上述作业流程,完成硅棒的开方及研磨多工序的一体化作业。Repeat the above operation process to complete the multi-process integrated operation of silicon rod squaring and grinding.
上述实施例仅例示性说明本申请的原理及其功效,而非用于限制本申请。任何熟悉此技术的人士皆可在不违背本申请的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本申请所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本申请的权利要求所涵盖。The above-mentioned embodiments merely illustrate the principles and effects of the present application, but are not intended to limit the present application. Anyone skilled in the art can make modifications or changes to the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed in this application should still be covered by the claims of this application.
Claims (66)
- 一种硅棒切磨一体机,其特征在于,包括:A silicon rod cutting and grinding integrated machine is characterized in that, comprising:机座,具有硅棒加工平台;所述硅棒加工平台设有第一加工区位和第二加工区位;The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing location and a second processing location;第一转移装置,设于第一转移通道,包括第一硅棒夹具和第一转移驱动机构,所述第一转移驱动机构用于驱动所述第一硅棒夹具及其夹持的硅棒沿着第一方向移动并在第一加工区位和第二加工区位之间转移;The first transfer device, located in the first transfer channel, includes a first silicon rod holder and a first transfer drive mechanism, and the first transfer drive mechanism is used to drive the first silicon rod holder and the silicon rod edge it clamps. moving in the first direction and transferring between the first processing location and the second processing location;第二转移装置,设于第二转移通道,包括第二硅棒夹具和第二转移驱动机构,所述第二转移驱动机构用于驱动所述第二硅棒夹具及其夹持的硅棒沿着第一方向移动并在第一加工区位和第二加工区位之间转移;A second transfer device, located in the second transfer channel, includes a second silicon rod holder and a second transfer drive mechanism, the second transfer drive mechanism is used to drive the second silicon rod holder and the silicon rod edge it holds. moving in the first direction and transferring between the first processing location and the second processing location;硅棒切割装置,设于所述硅棒加工平台的第一加工区位处,用于对第一转移通道上由所述第一转移装置所夹持的待切割硅棒或者第二转移通道上由所述第二转移装置所夹持的待切割硅棒进行切割作业;以及The silicon rod cutting device is arranged at the first processing area of the silicon rod processing platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or on the second transfer channel. The silicon rod to be cut held by the second transfer device is cut; and硅棒研磨装置,设于所述硅棒加工平台的第二加工区位处,用于对第一转移通道上由所述第一转移装置所夹持的切割后硅棒或者第二转移通道上由所述第二转移装置所夹持的切割后硅棒进行研磨作业。The silicon rod grinding device is arranged at the second processing area of the silicon rod processing platform, and is used for grinding the cut silicon rod clamped by the first transfer device on the first transfer channel or on the second transfer channel. The cut silicon rod held by the second transfer device is subjected to a grinding operation.
- 根据权利要求1所述的硅棒切磨一体机,其特征在于,所述第一转移装置和第二转移装置通过一安装框架设于所述硅棒加工平台的上方,或者,所述第一转移装置通过第一安装框架设于所述硅棒加工平台的上方且所述第二转移装置通过第二安装框架设于所述硅棒加工平台的上方。The integrated silicon rod cutting and grinding machine according to claim 1, wherein the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, or the first transfer device The transfer device is disposed above the silicon rod processing platform through a first mounting frame, and the second transfer device is disposed above the silicon rod processing platform through a second mounting frame.
- 根据权利要求1所述的硅棒切磨一体机,其特征在于,所述第一硅棒夹具包括:The integrated silicon rod cutting and grinding machine according to claim 1, wherein the first silicon rod holder comprises:第一夹臂安装座;The first clamp arm mounting seat;至少一对第一夹臂,沿第一方向对向设于所述第一夹臂安装座上,用于夹持硅棒的两个端面;其中,所述至少一对第一夹臂中的任一个第一夹臂设有夹持部;以及At least a pair of first clamping arms are oppositely arranged on the first clamping arm mounting seat along the first direction, and are used for clamping two end faces of the silicon rod; wherein, the at least one pair of the first clamping arms any one of the first clamping arms is provided with a clamping portion; and第一夹臂驱动机构,用于驱动至少一对第一夹臂中的至少一个第一夹臂沿着所述第一方向移动以调节所述至少一对第一夹臂之间的夹持间距。A first clamping arm driving mechanism for driving at least one first clamping arm of at least one pair of first clamping arms to move along the first direction to adjust the clamping distance between the at least one pair of first clamping arms .
- 根据权利要求3所述的硅棒切磨一体机,其特征在于,所述第一转移驱动机构包括:The integrated silicon rod cutting and grinding machine according to claim 3, wherein the first transfer driving mechanism comprises:第一转移导轨,沿第一方向布设,用于设置所述第一夹臂安装座;以及a first transfer guide rail disposed along a first direction for setting the first clamp arm mount; and第一转移驱动单元,用于驱动所述第一夹臂安装座及其至少一对第一夹臂沿所述第一转移导轨移动。The first transfer driving unit is used for driving the first clamp arm mounting seat and its at least one pair of first clamp arms to move along the first transfer guide rail.
- 根据权利要求4所述的硅棒切磨一体机,其特征在于,所述第一转移驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 4, wherein the first transfer driving unit comprises:第一移动齿轨,沿第一方向设置;the first moving rack, arranged along the first direction;第一驱动齿轮,设于所述第一夹臂安装座且与所述移动齿轨啮合;以及a first drive gear, disposed on the first clamp arm mounting seat and engaged with the moving rack; and第一驱动源,用于驱动所述驱动齿轮以使所关联的第一夹臂安装座及其至少一对第一夹臂沿所述第一转移导轨移动。A first drive source for driving the drive gear to move the associated first clamp arm mount and its at least one pair of first clamp arms along the first transfer rail.
- 根据权利要求4所述的硅棒切磨一体机,其特征在于,所述第一转移驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 4, wherein the first transfer driving unit comprises:第一移动丝杆,沿第一方向设置且与所述第一夹臂安装座关联;以及a first moving screw disposed along a first direction and associated with the first clamp arm mount; and第一驱动源,用于驱动所述第一移动丝杆转动以使所关联的第一夹臂安装座及其至少一对第一夹臂沿所述第一转移导轨移动。The first driving source is used for driving the first moving screw to rotate so as to make the associated first clamping arm mounting seat and its at least one pair of first clamping arms move along the first transfer guide rail.
- 根据权利要求3所述的硅棒切磨一体机,其特征在于,所述至少一对第一夹臂为转动式结构;所述第一硅棒夹具还包括第一夹臂转动机构,所述第一夹臂转动机构设于所述至少一对第一夹臂中的至少一个第一夹臂上,用于驱动所述至少一个第一夹臂的夹持部转动。The integrated silicon rod cutting and grinding machine according to claim 3, wherein the at least one pair of the first clamping arms is a rotating structure; the first silicon rod clamp further comprises a first clamping arm rotating mechanism, the The first clamping arm rotation mechanism is arranged on at least one first clamping arm of the at least one pair of first clamping arms, and is used for driving the clamping part of the at least one first clamping arm to rotate.
- 根据权利要求1所述的硅棒切磨一体机,其特征在于,所述第二硅棒夹具包括:The integrated silicon rod cutting and grinding machine according to claim 1, wherein the second silicon rod holder comprises:第二夹臂安装座;The second clamp arm mounting seat;至少一对第二夹臂,沿第一方向对向设于所述第二夹臂安装座上,用于夹持硅棒的两个端面;其中,所述至少一对第二夹臂中的任一个第二夹臂设有夹持部;以及At least a pair of second clamping arms are oppositely arranged on the mounting seat of the second clamping arms along the first direction, and are used for clamping two end faces of the silicon rod; wherein, the at least one pair of the second clamping arms any one of the second clamping arms is provided with a clamping portion; and第二夹臂驱动机构,用于驱动至少一对第二夹臂中的至少一个第二夹臂沿着所述第一方向移动以调节所述至少一对第二夹臂之间的夹持间距。A second clamping arm driving mechanism for driving at least one second clamping arm of at least one pair of second clamping arms to move along the first direction to adjust the clamping distance between the at least one pair of second clamping arms .
- 根据权利要求8所述的硅棒切磨一体机,其特征在于,所述第二转移驱动机构包括:The integrated silicon rod cutting and grinding machine according to claim 8, wherein the second transfer driving mechanism comprises:第二转移导轨,沿第一方向布设,用于设置所述第二夹臂安装座;以及a second transfer rail disposed along the first direction for setting the second clamp arm mount; and第二转移驱动单元,用于驱动所述第二夹臂安装座及其至少一对第二夹臂沿所述第二转移导轨移动。The second transfer driving unit is used for driving the second clamp arm mounting seat and its at least a pair of second clamp arms to move along the second transfer guide rail.
- 根据权利要求9所述的硅棒切磨一体机,其特征在于,所述第二转移驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 9, wherein the second transfer driving unit comprises:第二移动齿轨,沿第一方向设置;the second moving rack, arranged along the first direction;第二驱动齿轮,设于所述第二夹臂安装座且与所述移动齿轨啮合;以及a second drive gear, disposed on the second clamp arm mounting seat and engaged with the moving rack; and第二驱动源,用于驱动所述驱动齿轮以使所关联的第二夹臂安装座及其至少一对第二夹臂沿所述第二转移导轨移动。A second drive source for driving the drive gear to move the associated second clamp arm mount and at least a pair of the second clamp arms along the second transfer rail.
- 根据权利要求9所述的硅棒切磨一体机,其特征在于,所述第二转移驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 9, wherein the second transfer driving unit comprises:第二移动丝杆,沿第一方向设置且与所述第二夹臂安装座关联;以及a second moving screw disposed along the first direction and associated with the second clamp arm mount; and第二驱动源,用于驱动所述移动丝杆转动以使所关联的第二夹臂安装座及其至少一对第二夹臂沿所述第二转移导轨移动。The second driving source is used for driving the moving screw to rotate so as to move the associated second clamping arm mounting seat and its at least a pair of second clamping arms along the second transfer guide rail.
- 根据权利要求8所述的硅棒切磨一体机,其特征在于,所述至少一对第二夹臂为转动式结构;所述第二硅棒夹具还包括第二夹臂转动机构,所述第二夹臂转动机构设于所述至少一对第二夹臂中的至少一个第二夹臂上,用于驱动所述至少一个第二夹臂的夹持部转动。The integrated silicon rod cutting and grinding machine according to claim 8, wherein the at least one pair of second clamping arms is a rotary structure; the second silicon rod clamp further comprises a second clamping arm rotating mechanism, the The second clamping arm rotation mechanism is provided on at least one second clamping arm in the at least one pair of second clamping arms, and is used for driving the clamping part of the at least one second clamping arm to rotate.
- 根据权利要求1所述的硅棒切磨一体机,其特征在于,所述硅棒切割装置包括:The integrated silicon rod cutting and grinding machine according to claim 1, wherein the silicon rod cutting device comprises:切割架;cutting frame;至少一线切割单元,设于所述切割架上;所述线切割单元包括:至少两个切割轮、过渡轮、以及切割线,所述切割线绕于所述至少两个切割轮及过渡轮以形成至少一切割线锯;以及At least one wire cutting unit is arranged on the cutting frame; the wire cutting unit includes: at least two cutting wheels, a transition wheel, and a cutting wire, and the cutting wire is wound around the at least two cutting wheels and the transition wheel to forming at least one cutting wire saw; and切割转换机构,用于驱动所述切割架及其上的至少一线切割单元在第一转移通道和第二转移通道之间转换。A cutting conversion mechanism is used to drive the cutting frame and at least one wire cutting unit on it to switch between the first transfer channel and the second transfer channel.
- 根据权利要求13所述的硅棒切磨一体机,其特征在于,所述线切割单元包括:The integrated silicon rod cutting and grinding machine according to claim 13, wherein the wire cutting unit comprises:切割线;Cutting line;第一切割轮及第二切割轮,设于所述切割架,切割线绕于所述第一切割轮及第二切割轮以形成切割线锯;其中,所述第一切割轮的轮面与第二切割轮的轮面相平行或共面;The first cutting wheel and the second cutting wheel are arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; wherein, the wheel surface of the first cutting wheel and the The surfaces of the second cutting wheel are parallel or coplanar;第一过渡轮,邻设于所述第一切割轮,在牵引切割线的状态下令第一切割轮和第一过渡轮的切割线位于第一切割轮中用于缠绕切割线的第一切割线槽所在平面内;The first transition wheel is adjacent to the first cutting wheel, and in the state of pulling the cutting line, the first cutting wheel and the cutting line of the first transition wheel are located in the first cutting wheel for winding the first cutting line of the cutting line in the plane of the groove;第二过渡轮,邻设于所述第二切割轮,在牵引切割线的状态下令第二切割轮和第二过渡轮的切割线位于第二切割轮中用于缠绕切割线的第二切割线槽所在平面内;以及The second transition wheel is adjacent to the second cutting wheel, and in the state of pulling the cutting wire, the second cutting wheel and the cutting wire of the second transition wheel are located in the second cutting wheel for winding the second cutting wire of the cutting wire in the plane of the slot; and至少一第三过渡轮,设于所述第一过渡轮及第二过渡轮之间,用于牵引所述第一过渡 轮与所述第二过渡轮之间的切割线,以令所述线切割单元中形成一切割容纳空间。At least one third transition wheel, arranged between the first transition wheel and the second transition wheel, is used for pulling the cutting line between the first transition wheel and the second transition wheel, so as to make the line A cutting accommodating space is formed in the cutting unit.
- 根据权利要求14所述的硅棒切磨一体机,其特征在于,所述第一过渡轮、第二过渡轮、及至少一第三过渡轮用于将所述切割线牵引远离所述切割容纳空间。The integrated silicon rod cutting and grinding machine according to claim 14, wherein the first transition wheel, the second transition wheel, and the at least one third transition wheel are used for pulling the cutting wire away from the cutting container space.
- 根据权利要求14所述的硅棒切磨一体机,其特征在于,所述切割线绕于所述第一切割轮、第二切割轮、第一过渡轮、第二过渡轮及第三过渡轮之间以形成首尾相接的闭环切割线。The integrated silicon rod cutting and grinding machine according to claim 14, wherein the cutting wire is wound around the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel between them to form an end-to-end closed-loop cutting line.
- 根据权利要求16所述的硅棒切磨一体机,其特征在于,所述线切割单元中包括两个第三过渡轮,其中,所述切割线顺次缠绕于所述第一切割轮、第二切割轮、第二过渡轮、一第三过渡轮、另一第三过渡轮、第一过渡轮、第一切割轮以形成首尾相接的闭环切割线。The integrated silicon rod cutting and grinding machine according to claim 16, wherein the wire cutting unit includes two third transition wheels, wherein the cutting wire is wound around the first cutting wheel, the second Two cutting wheels, a second transition wheel, a third transition wheel, another third transition wheel, a first transition wheel, and a first cutting wheel to form a closed-loop cutting line connected end to end.
- 根据权利要求14所述的硅棒切磨一体机,其特征在于,所述硅棒切割装置还包括切割线驱动装置,用于驱动所述切割线运行以对待切割硅棒进行切割。The integrated silicon rod cutting and grinding machine according to claim 14, wherein the silicon rod cutting device further comprises a cutting wire driving device for driving the cutting wire to run to cut the silicon rod to be cut.
- 根据权利要求18所述的硅棒切磨一体机,其特征在于,所述切割线驱动装置为电机,具有动力输出轴且所述动力输出轴轴连接于所述第一切割轮或第二切割轮。The integrated silicon rod cutting and grinding machine according to claim 18, wherein the cutting wire driving device is a motor, and has a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel wheel.
- 根据权利要求14所述的硅棒切磨一体机,其特征在于,所述硅棒切割装置还包括:The integrated silicon rod cutting and grinding machine according to claim 14, wherein the silicon rod cutting device further comprises:至少一调距机构,设于所述至少一线切割单元,用于驱动所述线切割单元中至少两个切割轮相对所述切割架沿垂直于切割轮轮面的方向移动。At least one distance adjusting mechanism is provided in the at least one wire cutting unit, and is used for driving at least two cutting wheels in the wire cutting unit to move relative to the cutting frame in a direction perpendicular to the wheel surface of the cutting wheel.
- 根据权利要求20所述的硅棒切磨一体机,其特征在于,所述硅棒切割装置包括单线切割单元,所述调距机构包括:The integrated silicon rod cutting and grinding machine according to claim 20, wherein the silicon rod cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises:丝杆,沿切割轮轮面的正交方向设置且与所述单线切割单元螺纹连接;以及a screw rod, arranged along the orthogonal direction of the surface of the cutting wheel and threadedly connected with the single-wire cutting unit; and驱动源,用于驱动所述丝杆转动。The driving source is used for driving the lead screw to rotate.
- 根据权利要求20所述的硅棒切磨一体机,其特征在于,所述硅棒切割装置包括单线切割单元,所述调距机构包括:The integrated silicon rod cutting and grinding machine according to claim 20, wherein the silicon rod cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises:伸缩件,沿切割轮轮面的正交方向设置且与所述单线切割单元关联;以及a telescopic piece arranged in a direction orthogonal to the surface of the cutting wheel and associated with the single-wire cutting unit; and驱动源,用于驱动所述伸缩件沿切割轮轮面的正交方向伸缩运动。The driving source is used to drive the telescopic element to telescopically move along the orthogonal direction of the wheel surface of the cutting wheel.
- 根据权利要求20所述的硅棒切磨一体机,其特征在于,所述硅棒切割装置包括平行且相对设置的第一线切割单元和第二线切割单元,所述第一线切割单元和第二线切割单元中的至少一者通过所述调距机构驱动沿切割轮轮面的正交方向移动。The integrated silicon rod cutting and grinding machine according to claim 20, wherein the silicon rod cutting device comprises a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, the first wire cutting unit and the second wire cutting unit At least one of the two wire cutting units is driven by the distance adjustment mechanism to move in the orthogonal direction of the cutting wheel surface.
- 根据权利要求23所述的硅棒切磨一体机,其特征在于,所述调距机构包括:The integrated silicon rod cutting and grinding machine according to claim 23, wherein the distance adjusting mechanism comprises:丝杆,沿切割轮轮面的正交方向设置且与所述第一线切割单元或第二线切割单元螺纹连接;以及a screw rod, arranged along the orthogonal direction of the cutting wheel surface and threadedly connected with the first wire cutting unit or the second wire cutting unit; and驱动源,用于驱动所述丝杆转动。The driving source is used for driving the lead screw to rotate.
- 根据权利要求23所述的硅棒切磨一体机,其特征在于,所述调距机构包括:The integrated silicon rod cutting and grinding machine according to claim 23, wherein the distance adjusting mechanism comprises:伸缩件,沿切割轮轮面的正交方向设置且与所述第一线切割单元或第二线切割单元关联;以及a telescopic piece arranged in the orthogonal direction of the surface of the cutting wheel and associated with the first wire cutting unit or the second wire cutting unit; and驱动源,用于驱动所述伸缩件沿切割轮轮面的正交方向作伸缩运动。The driving source is used for driving the telescopic element to perform telescopic movement along the orthogonal direction of the wheel surface of the cutting wheel.
- 根据权利要求23所述的硅棒切磨一体机,其特征在于,所述调距机构包括:The integrated silicon rod cutting and grinding machine according to claim 23, wherein the distance adjusting mechanism comprises:双向丝杆,沿切割轮轮面的正交方向设置且与所述第一线切割单元和第二线切割单元螺纹连接;以及A bidirectional screw rod, disposed along the orthogonal direction of the cutting wheel surface and threadedly connected with the first wire cutting unit and the second wire cutting unit; and驱动源,用于驱动所述丝杆转动以使得所述第一线切割单元和所述第二线切割单元沿切割轮轮面的正交方向相向移动或相背移动。The driving source is used for driving the screw rod to rotate, so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the wheel surface of the cutting wheel.
- 根据权利要求13所述的硅棒切磨一体机,其特征在于,所述切割转换机构包括:The integrated silicon rod cutting and grinding machine according to claim 13, wherein the cutting conversion mechanism comprises:切割转换导轨,沿第二方向布设,用于设置所述切割架;所述第二方向垂直于所述第一方向;以及a cutting conversion guide rail arranged along a second direction for setting the cutting frame; the second direction is perpendicular to the first direction; and切割转换驱动单元,用于驱动所述切割架及其至少一线切割单元沿所述切割转换导轨移动。A cutting conversion driving unit is used for driving the cutting frame and its at least one line cutting unit to move along the cutting conversion guide rail.
- 根据权利要求27所述的硅棒切磨一体机,其特征在于,所述切割转换驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 27, wherein the cutting conversion drive unit comprises:移动齿轨,沿第二方向设置;Move the rack, set along the second direction;驱动齿轮,设于所述切割架且与所述移动齿轨啮合;以及a driving gear, provided on the cutting frame and engaged with the moving rack; and驱动源,用于驱动所述驱动齿轮以使所关联的切割架及其至少一线切割单元沿所述切割转换导轨移动。A driving source for driving the driving gear to move the associated cutting frame and its at least one line cutting unit along the cutting conversion guide rail.
- 根据权利要求27所述的硅棒切磨一体机,其特征在于,所述切割转换驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 27, wherein the cutting conversion drive unit comprises:移动丝杆,沿第二方向设置且与所述切割架关联;以及a moving screw disposed along the second direction and associated with the cutting frame; and驱动源,用于驱动所述移动丝杆转动以使所关联的切割架及其至少一线切割单元沿所述切割转换导轨移动。The driving source is used for driving the moving screw to rotate so as to make the associated cutting frame and its at least one line cutting unit move along the cutting conversion guide rail.
- 根据权利要求13所述的硅棒切磨一体机,其特征在于,还包括边皮卸料装置,所述边皮卸料装置包括边皮承托机构,用于抵靠硅棒外侧并承托切割形成的边皮。The integrated silicon rod cutting and grinding machine according to claim 13, further comprising an edge skin discharge device, wherein the edge skin discharge device comprises a edge skin support mechanism for abutting against the outside of the silicon rod and supporting the edge skin Cut the formed hem.
- 根据权利要求30所述的硅棒切磨一体机,其特征在于,所述边皮承托机构包括:The integrated silicon rod cutting and grinding machine according to claim 30, wherein the edge skin supporting mechanism comprises:承托部;以及The Receipt Department; and驱动单元,连接所述承托部以控制所述承托部远离或抵靠所述边皮。The driving unit is connected to the supporting portion to control the supporting portion to move away from or abut against the side skin.
- 根据权利要求31所述的硅棒切磨一体机,其特征在于,所述承托部包括:The integrated silicon rod cutting and grinding machine according to claim 31, wherein the supporting portion comprises:至少两个承托块,沿所述第一方向间隔设置,具有用于接触并承载边皮的承载面。At least two bearing blocks, spaced along the first direction, have bearing surfaces for contacting and bearing the edge skins.
- 根据权利要求31所述的硅棒切磨一体机,其特征在于,所述承托部包括:The integrated silicon rod cutting and grinding machine according to claim 31, wherein the supporting portion comprises:至少两个承托杆,沿第一方向设置,用于接触并承托边皮;以及at least two support bars disposed along the first direction for contacting and supporting the edge skin; and两个连接部,分设于所述切割架第一方向的相对两侧以对应所述至少两个承托杆的相对两端,用于连接所述至少两个承托杆并与所述驱动单元连接。Two connecting parts, respectively located on opposite sides of the cutting frame in the first direction to correspond to opposite ends of the at least two support rods, for connecting the at least two support rods and the drive unit connect.
- 根据权利要求31所述的硅棒切磨一体机,其特征在于,所述承托部包括沿所述第一方向间隔设置的至少两个承托轮组,其中,所述承托轮组包括:The integrated silicon rod cutting and grinding machine according to claim 31, wherein the supporting portion comprises at least two supporting wheel sets spaced along the first direction, wherein the supporting wheel sets comprise :至少两个承托轮,所述至少两个承托轮间隔设置,用于接触并承托边皮;以及at least two support wheels, the at least two support wheels are spaced apart for contacting and supporting the edge skin; and承托底座,用于设置所述至少两个承托轮并与所述驱动单元连接。The supporting base is used for disposing the at least two supporting wheels and connecting with the driving unit.
- 根据权利要求31所述的硅棒切磨一体机,其特征在于,所述驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 31, wherein the driving unit comprises:气缸或液压泵;以及Cylinders or hydraulic pumps; and伸缩部,连接所述承托部,在所述气缸或液压泵驱动下伸缩运动以控制所述承托部远离或抵靠所述边皮。The telescopic part is connected to the supporting part, and is driven by the cylinder or the hydraulic pump to telescopically move so as to control the supporting part to move away from or abut against the side skin.
- 根据权利要求31所述的硅棒切磨一体机,其特征在于,所述驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 31, wherein the driving unit comprises:驱动电机;以及drive motor; and丝杆组件,连接所述承托部,由所述驱动电机驱动运动以控制所述承托部远离或抵靠所述边皮。The screw assembly is connected to the bearing portion, and is driven and moved by the driving motor to control the bearing portion to move away from or abut against the edge skin.
- 根据权利要求30所述的硅棒切磨一体机,其特征在于,所述边皮卸料装置还包括边皮错位机构,设于所述机座或硅棒切割装置,用于沿第一方向推动所述边皮以令所述边皮脱离所述边皮承托机构。The integrated machine for cutting and grinding silicon rods according to claim 30, characterized in that, the edge skin unloading device further comprises a edge skin dislocation mechanism, which is arranged on the machine base or the silicon rod cutting device and is used for moving along the first direction. Push the edge skin to disengage the edge skin from the edge skin support mechanism.
- 根据权利要求34所述的硅棒切磨一体机,其特征在于,所述边皮错位机构包括:The integrated silicon rod cutting and grinding machine according to claim 34, wherein the edge and skin dislocation mechanism comprises:推顶部;以及push the top; and气缸或液压泵,用于驱动所述推顶部沿第一方向推顶所述边皮的伸缩杆沿第一方向设置。A cylinder or a hydraulic pump is used for driving the push top to push the side skin along the first direction. The telescopic rod is arranged along the first direction.
- 根据权利要求1或30所述的硅棒切磨一体机,其特征在于,所述边皮卸料装置还包括边皮输送机构,用于承接切割形成的边皮并将所述边皮转运至卸料区。The integrated silicon rod cutting and grinding machine according to claim 1 or 30, wherein the edge skin unloading device further comprises a edge skin conveying mechanism for receiving the cut edge skin and transferring the edge skin to a unloading area.
- 根据权利要求39所述的硅棒切磨一体机,其特征在于,所述边皮输送机构包括:The integrated silicon rod cutting and grinding machine according to claim 39, wherein the edge skin conveying mechanism comprises:输送部,用于承载所述边皮;以及a conveying part for carrying the edge skin; and输送驱动源,用于驱动所述输送部沿第一方向运动以输送所述边皮。The conveying driving source is used for driving the conveying part to move in a first direction to convey the edge skin.
- 根据权利要求1所述的硅棒切磨一体机,其特征在于,所述硅棒研磨装置包括:The integrated silicon rod cutting and grinding machine according to claim 1, wherein the silicon rod grinding device comprises:磨具安装座;Abrasive mount;至少一对磨具,对向设置于所述磨具安装座上;at least one pair of grinding tools, oppositely arranged on the grinding tool mounting seat;磨具进退机构,用于驱动所述至少一对磨具中的至少一个磨具沿第二方向移动,其中,所述第二方向垂直于所述第一方向;以及an abrasive tool advancing and retracting mechanism for driving at least one abrasive tool in the at least one pair of abrasive tools to move in a second direction, wherein the second direction is perpendicular to the first direction; and磨具转换机构,用于驱动所述至少一对磨具沿着所述磨具安装座在第一转移通道和第二转移通道之间转换。A grinding tool switching mechanism is used for driving the at least one pair of grinding tools to switch between the first transfer channel and the second transfer channel along the grinding tool mounting seat.
- 根据权利要求41所述的硅棒切磨一体机,其特征在于,所述至少一对磨具中的任一个磨具包括相互嵌套的粗磨砂轮和精磨砂轮。The integrated silicon rod cutting and grinding machine according to claim 41, wherein any one of the at least one pair of grinding tools comprises a rough grinding wheel and a fine grinding wheel which are nested in each other.
- 根据权利要求42所述的硅棒切磨一体机,其特征在于,所述粗磨砂轮嵌套于所述精磨砂轮之内,且所述粗磨砂轮和所述精磨砂轮中的至少一个设有伸缩驱动机构;或者,所述精磨砂轮嵌套于所述粗磨砂轮之内,且所述粗磨砂轮和所述精磨砂轮中的至少一个设有伸缩驱动机构。The integrated silicon rod cutting and grinding machine according to claim 42, wherein the rough grinding wheel is nested inside the fine grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel A telescopic drive mechanism is provided; or, the fine grinding wheel is nested inside the rough grinding wheel, and at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism.
- 根据权利要求41所述的硅棒切磨一体机,其特征在于,所述磨具转换机构包括:The integrated silicon rod cutting and grinding machine according to claim 41, wherein the grinding tool conversion mechanism comprises:磨具转换导轨,沿第二方向布设,用于设置所述磨具安装座;以及an abrasive tool conversion guide rail disposed along the second direction for positioning the abrasive tool mount; and磨具转换驱动单元,用于驱动至少一对磨具沿所述磨具转换导轨移动。The abrasive tool conversion driving unit is used for driving at least one pair of abrasive tools to move along the abrasive tool conversion guide rail.
- 根据权利要求44所述的硅棒切磨一体机,其特征在于,所述磨具转换驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 44, wherein the grinding tool conversion drive unit comprises:移动齿轨,沿第二方向设置;move the rack, set along the second direction;驱动齿轮,设于所述磨具安装座且与所述移动齿轨啮合;以及a drive gear, disposed on the grinding tool mounting seat and engaged with the moving rack; and驱动源,用于驱动所述驱动齿轮以使所关联的磨具安装座及其至少一对磨具沿所述磨具转换导轨移动。A driving source for driving the driving gear to move the associated abrasive tool mounting seat and at least one pair of abrasive tools along the abrasive tool conversion guide rail.
- 根据权利要求44所述的硅棒切磨一体机,其特征在于,所述磨具转换驱动单元包括:The integrated silicon rod cutting and grinding machine according to claim 44, wherein the grinding tool conversion drive unit comprises:移动丝杆,沿第二方向设置且与所述磨具安装座关联;以及a moving lead screw disposed in a second direction and associated with the abrasive tool mount; and驱动源,用于驱动所述移动丝杆转动以使所关联的磨具安装座及其至少一对磨具沿所述磨具转换导轨移动。The driving source is used for driving the moving screw to rotate so as to move the associated grinding tool mounting seat and at least a pair of grinding tools along the grinding tool conversion guide rail.
- 根据权利要求41所述的硅棒切磨一体机,其特征在于,所述硅棒研磨装置还包括:至少一对倒角磨具,对向设置于所述磨具安装座上。The integrated silicon rod cutting and grinding machine according to claim 41, wherein the silicon rod grinding device further comprises: at least one pair of chamfering grinding tools, which are arranged on the grinding tool mounting seat opposite to each other.
- 根据权利要求41所述的硅棒切磨一体机,其特征在于,所述第一硅棒夹具和第二硅棒夹具中任一者还包括:研磨修复装置,用于修磨对应的所述硅棒研磨装置中的至少一对磨具。The integrated silicon rod cutting and grinding machine according to claim 41, wherein any one of the first silicon rod holder and the second silicon rod holder further comprises: a grinding and repairing device for grinding the corresponding At least one pair of grinding tools in the silicon rod grinding device.
- 根据权利要求1所述的硅棒切磨一体机,其特征在于,还包括:硅棒移送装置,设于所述硅棒加工平台的装载区位,用于将待加工的硅棒转移至所述硅棒加工平台的第一加工区位。The integrated machine for cutting and grinding silicon rods according to claim 1, further comprising: a silicon rod transferring device, which is arranged at the loading area of the silicon rod processing platform, and is used for transferring the silicon rods to be processed to the said silicon rod processing platform. The first processing location of the silicon rod processing platform.
- 根据权利要求49所述的硅棒切磨一体机,其特征在于,所述硅棒移送装置包括:The integrated silicon rod cutting and grinding machine according to claim 49, wherein the silicon rod transfer device comprises:硅棒承载结构,用于承载待加工的硅棒;The silicon rod bearing structure is used to carry the silicon rod to be processed;对中调节机构,用于调节所述待加工的硅棒的位置以使其轴心线与预定中心线对应;以及a centering adjustment mechanism for adjusting the position of the silicon rod to be processed so that its axis line corresponds to a predetermined center line; and进给驱动机构,用于驱动所述硅棒承载结构及其承载的所述待加工的硅棒沿第二方向由装载区位移动至第一加工区位。A feeding driving mechanism is used for driving the silicon rod supporting structure and the silicon rod to be processed carried by the silicon rod supporting structure to move from the loading area to the first processing area along the second direction.
- 根据权利要求50所述的硅棒切磨一体机,其特征在于,所述对中调节机构包括垂向升降机构,用于驱动所述硅棒承载结构及承载的所述待加工的硅棒作垂向升降运动以使得所述待加工的硅棒的轴心线与预定中心线在垂向上对齐。The integrated machine for cutting and grinding silicon rods according to claim 50, wherein the centering adjustment mechanism comprises a vertical lifting mechanism, which is used to drive the silicon rod carrying structure and the silicon rods to be processed. The vertical lifting and lowering movement is performed so that the axis line of the silicon rod to be processed is vertically aligned with the predetermined center line.
- 根据权利要求51所述的硅棒切磨一体机,其特征在于,所述垂向升降机构包括:The integrated silicon rod cutting and grinding machine according to claim 51, wherein the vertical lifting mechanism comprises:垂向升降导轨,设于所述承载底座;a vertical lifting guide rail, arranged on the bearing base;滑块,设于所述承载部件;以及a slider, provided on the bearing member; and垂向升降驱动单元。Vertical lift drive unit.
- 根据权利要求51所述的硅棒切磨一体机,其特征在于,所述垂向升降机构包括:The integrated silicon rod cutting and grinding machine according to claim 51, wherein the vertical lifting mechanism comprises:垂向升降导杆,用于设置所述硅棒承载结构;以及a vertical lift guide for setting the silicon rod bearing structure; and垂向升降驱动单元,用于驱动所述硅棒承载结构沿着所述垂向升降导杆作升降移动。The vertical lift driving unit is used for driving the silicon rod supporting structure to move up and down along the vertical lift guide rod.
- 根据权利要求52或53所述的硅棒切磨一体机,其特征在于,所述垂向升降驱动单元包 括:驱动电机以及垂向设置且由所述驱动电机驱动的丝杆组件,或者,驱动电机以及垂向设置且由所述驱动电机驱动的齿轮齿条传动组件。The integrated silicon rod cutting and grinding machine according to claim 52 or 53, wherein the vertical lifting and lowering driving unit comprises: a driving motor and a screw assembly vertically arranged and driven by the driving motor, or driving A motor and a rack and pinion drive assembly vertically disposed and driven by the drive motor.
- 根据权利要求50所述的硅棒切磨一体机,其特征在于,所述硅棒移送装置还包括居中调节机构,用于调节所述待加工的硅棒在第一方向上的位置以使其位于所述硅棒承载结构的居中区域。The integrated silicon rod cutting and grinding machine according to claim 50, wherein the silicon rod transferring device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that the located in the central area of the silicon rod carrying structure.
- 根据权利要求55所述的硅棒切磨一体机,其特征在于,所述居中调节机构包括:The integrated silicon rod cutting and grinding machine according to claim 55, wherein the centering adjustment mechanism comprises:支架,设于所述机座或所述硅棒承载结构上;a bracket, arranged on the machine base or the silicon rod bearing structure;调节导轨,沿第一方向设于所述支架上;an adjusting guide rail, arranged on the bracket along the first direction;至少两个推顶件,分别设于所述支架的相对两侧;At least two ejectors are respectively arranged on opposite sides of the bracket;调节驱动单元,用于驱动所述至少两个推顶件沿着所述调节导轨相向移动以推顶硅棒置于所述硅棒承载结构的居中区域。An adjustment driving unit for driving the at least two ejectors to move toward each other along the adjustment guide rail to eject the silicon rod to be placed in the central area of the silicon rod support structure.
- 根据权利要求56所述的硅棒切磨一体机,其特征在于,所述调节驱动单元包括:驱动电机以及沿第一方向设置且由所述驱动电机驱动的丝杆组件,或者,驱动电机以及沿第一方向设置且由所述驱动电机驱动的齿轮齿条传动组件。The integrated silicon rod cutting and grinding machine according to claim 56, wherein the adjustment driving unit comprises: a driving motor and a screw assembly arranged along the first direction and driven by the driving motor, or, a driving motor and A rack and pinion drive assembly disposed along the first direction and driven by the drive motor.
- 根据权利要求50所述的硅棒切磨一体机,其特征在于,所述硅棒移送装置还包括设于所述硅棒承载结构上的硅棒夹紧机构。The integrated silicon rod cutting and grinding machine according to claim 50, wherein the silicon rod transferring device further comprises a silicon rod clamping mechanism provided on the silicon rod carrying structure.
- 根据权利要求58所述的硅棒切磨一体机,其特征在于,所述硅棒夹紧机构包括:The integrated silicon rod cutting and grinding machine according to claim 58, wherein the silicon rod clamping mechanism comprises:夹具安装件,沿着第一方向设于所述硅棒承载结构上;以及a fixture mounting member disposed on the silicon rod bearing structure along the first direction; and至少两个硅棒夹紧件,沿着所述夹具安装件间距设置。At least two silicon rod clamps are arranged along the distance between the clamp mounts.
- 根据权利要求59所述的硅棒切磨一体机,其特征在于,所述硅棒夹紧件包括:The integrated silicon rod cutting and grinding machine according to claim 59, wherein the silicon rod clamping member comprises:夹臂安装座,设于所述夹具安装件上;a clamping arm mounting seat, arranged on the fixture mounting piece;两个夹臂,活动设于所述夹臂安装座上;以及two clamp arms, movably arranged on the clamp arm mounting seat; and夹臂驱动机构,用于驱动所述两个夹臂作开合动作。The clamping arm driving mechanism is used to drive the two clamping arms to open and close.
- 根据权利要求60所述的硅棒切磨一体机,其特征在于,所述夹臂驱动机构包括:The integrated silicon rod cutting and grinding machine according to claim 60, wherein the clamping arm driving mechanism comprises:开合齿轮,设于所述夹臂安装座上;The opening and closing gear is arranged on the mounting seat of the clamping arm;两个齿条,每一个齿条与一个夹臂关联且与所述开合齿轮啮合;以及two racks, each associated with a clamp arm and in mesh with the opening and closing gear; and驱动源,关联于所述开合齿轮,用于驱动所述开合齿轮转动。A driving source, associated with the opening and closing gear, is used to drive the opening and closing gear to rotate.
- 根据权利要求59所述的硅棒切磨一体机,其特征在于,在所述硅棒夹紧机构中,至少两个硅棒夹紧件中的至少一个硅棒夹紧件设有间距调整驱动机构,用于驱动其沿着所述夹具安装件运动,以调整所述至少两个硅棒夹紧件的间距。The integrated silicon rod cutting and grinding machine according to claim 59, characterized in that, in the silicon rod clamping mechanism, at least one silicon rod clamping member of the at least two silicon rod clamping members is provided with a distance adjustment drive and a mechanism for driving it to move along the clamp mounting member to adjust the distance between the at least two silicon rod clamping members.
- 根据权利要求62所述的硅棒切磨一体机,其特征在于,所述间距调整驱动机构为丝杆调整机构、链条输送机构、倍速链机构、或传动带机构。The integrated silicon rod cutting and grinding machine according to claim 62, wherein the distance adjustment driving mechanism is a screw adjustment mechanism, a chain conveying mechanism, a double-speed chain mechanism, or a transmission belt mechanism.
- 根据权利要求50所述的硅棒切磨一体机,其特征在于,所述进给驱动机构包括:The integrated silicon rod cutting and grinding machine according to claim 50, wherein the feeding driving mechanism comprises:进给导杆或进给导轨,沿第二方向布设,用于设置所述硅棒承载结构;以及a feed guide rod or feed rail, arranged along the second direction, for arranging the silicon rod carrying structure; and进给驱动单元,用于驱动所述硅棒承载结构沿着所述进给导杆或进给导轨移动。A feeding driving unit is used for driving the silicon rod supporting structure to move along the feeding guide rod or the feeding guide rail.
- 根据权利要求50所述的硅棒切磨一体机,其特征在于,所述硅棒移送装置还包括晶线检测单元。The integrated silicon rod cutting and grinding machine according to claim 50, wherein the silicon rod transfer device further comprises a crystal line detection unit.
- 根据权利要求1所述的硅棒切磨一体机,其特征在于,还包括:硅棒卸载装置,设于所述硅棒加工平台的工件卸料区,用于将研磨后硅棒自所述硅棒加工平台卸载。The integrated machine for cutting and grinding silicon rods according to claim 1, further comprising: a silicon rod unloading device, which is arranged in the workpiece unloading area of the silicon rod processing platform, and is used for removing the ground silicon rods from the Unloading of the ingot processing platform.
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CN202011093270.3A CN114261028A (en) | 2020-09-16 | 2020-10-12 | Silicon rod cutting and grinding integrated machine |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114799908A (en) * | 2022-04-22 | 2022-07-29 | 江苏金智达工具有限公司 | Improved aluminum sawing machine and using method |
CN115535623A (en) * | 2022-10-12 | 2022-12-30 | 广东昭信智能装备有限公司 | A coiler for making inductance |
CN117686518A (en) * | 2024-02-02 | 2024-03-12 | 天津普信模具有限公司 | Processing table for automobile mold detection and control method thereof |
EP4349241A1 (en) | 2022-10-05 | 2024-04-10 | Caranx Medical SAS | Insertion instrument, system comprising the insertion instrument and process for manufacturing the insertion instrument |
EP4349264A1 (en) | 2022-10-05 | 2024-04-10 | Caranx Medical SAS | Medical device and system comprising a medical device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5564409A (en) * | 1995-06-06 | 1996-10-15 | Corning Incorporated | Apparatus and method for wire cutting glass-ceramic wafers |
CN108942572A (en) * | 2017-05-19 | 2018-12-07 | 浙江集英精密机器有限公司 | Silicon single crystal rod multiplexing position processing method and silicon single crystal rod Multi-position processing machine |
CN208215714U (en) * | 2018-05-17 | 2018-12-11 | 上海日进机床有限公司 | Silicon ingot cutting equipment |
CN208375019U (en) * | 2018-05-02 | 2019-01-15 | 上海日进机床有限公司 | Silicon rod clamping device, silicon rod conversion equipment and silicon rod processing machine |
CN110026826A (en) * | 2018-09-30 | 2019-07-19 | 浙江晶盛机电股份有限公司 | A kind of full-automatic silicon single crystal rod cuts Compound Machining integrated equipment and its application method |
CN210060835U (en) * | 2019-03-22 | 2020-02-14 | 天通日进精密技术有限公司 | Combined grinding wheel |
CN111376393A (en) * | 2020-04-14 | 2020-07-07 | 福州天瑞线锯科技有限公司 | Single silicon crystal bar cutting and grinding all-in-one machine |
-
2021
- 2021-05-20 WO PCT/CN2021/094827 patent/WO2022057296A1/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5564409A (en) * | 1995-06-06 | 1996-10-15 | Corning Incorporated | Apparatus and method for wire cutting glass-ceramic wafers |
CN108942572A (en) * | 2017-05-19 | 2018-12-07 | 浙江集英精密机器有限公司 | Silicon single crystal rod multiplexing position processing method and silicon single crystal rod Multi-position processing machine |
CN208375019U (en) * | 2018-05-02 | 2019-01-15 | 上海日进机床有限公司 | Silicon rod clamping device, silicon rod conversion equipment and silicon rod processing machine |
CN208215714U (en) * | 2018-05-17 | 2018-12-11 | 上海日进机床有限公司 | Silicon ingot cutting equipment |
CN110026826A (en) * | 2018-09-30 | 2019-07-19 | 浙江晶盛机电股份有限公司 | A kind of full-automatic silicon single crystal rod cuts Compound Machining integrated equipment and its application method |
CN210060835U (en) * | 2019-03-22 | 2020-02-14 | 天通日进精密技术有限公司 | Combined grinding wheel |
CN111376393A (en) * | 2020-04-14 | 2020-07-07 | 福州天瑞线锯科技有限公司 | Single silicon crystal bar cutting and grinding all-in-one machine |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114799908A (en) * | 2022-04-22 | 2022-07-29 | 江苏金智达工具有限公司 | Improved aluminum sawing machine and using method |
EP4349241A1 (en) | 2022-10-05 | 2024-04-10 | Caranx Medical SAS | Insertion instrument, system comprising the insertion instrument and process for manufacturing the insertion instrument |
EP4349264A1 (en) | 2022-10-05 | 2024-04-10 | Caranx Medical SAS | Medical device and system comprising a medical device |
WO2024074298A1 (en) | 2022-10-05 | 2024-04-11 | Caranx Medical Sas | Insertion instrument, system comprising the insertion instrument and process for manufacturing the insertion instrument |
CN115535623A (en) * | 2022-10-12 | 2022-12-30 | 广东昭信智能装备有限公司 | A coiler for making inductance |
CN117686518A (en) * | 2024-02-02 | 2024-03-12 | 天津普信模具有限公司 | Processing table for automobile mold detection and control method thereof |
CN117686518B (en) * | 2024-02-02 | 2024-04-19 | 天津普信模具有限公司 | Processing table for automobile mold detection and control method thereof |
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