CN112198699A - Display panel and thinning method thereof - Google Patents

Display panel and thinning method thereof Download PDF

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Publication number
CN112198699A
CN112198699A CN202011174927.9A CN202011174927A CN112198699A CN 112198699 A CN112198699 A CN 112198699A CN 202011174927 A CN202011174927 A CN 202011174927A CN 112198699 A CN112198699 A CN 112198699A
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China
Prior art keywords
blind hole
substrate
display panel
thickness
hole area
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CN202011174927.9A
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Chinese (zh)
Inventor
聂晓辉
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to CN202011174927.9A priority Critical patent/CN112198699A/en
Publication of CN112198699A publication Critical patent/CN112198699A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application discloses a display panel and a thinning method thereof. The display panel comprises a color film substrate, an array substrate and a liquid crystal layer, wherein the color film substrate is arranged opposite to the array substrate, and the liquid crystal layer is arranged between the color film substrate and the array substrate; the display panel comprises at least one blind hole area and a non-blind hole area, and the thickness of the color film substrate in the blind hole area is smaller than that in the non-blind hole area; the thickness of the array substrate in the blind hole area is smaller than that in the non-blind hole area. The thickness of the color film substrate and the array substrate in the blind hole area is smaller than that of the non-blind hole area, the rigidity strength of the color film substrate and the array substrate is smaller, and the liquid crystal supporting force is enough to support the deformation of the color film substrate and the array substrate in the blind hole area after vacuum assembly, so that the problem of poor optical penetration rate and uniformity in the blind hole area is solved.

Description

Display panel and thinning method thereof
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel and a thinning method thereof.
Background
The extremely screen-occupation and ultra-narrow frame is the current and future development direction of the middle and small size display panel. The blind hole full-screen is a high-screen-ratio full-screen solution, and is a key point developed by current panel manufacturers. The blind hole has no display function, a normal display area is arranged outside the blind hole, the blind hole is a front camera firmware installation position, and in order to ensure the imaging quality of the front camera at the blind hole, the deformation of the TFT substrate and the CF substrate in the blind hole area is required to be smaller as well as better so as to ensure the optical penetration rate and the uniformity.
The assembling of the CF substrate and the TFT substrate generally comprises the steps of coating frame glue on the CF substrate, dripping liquid crystal on the TFT substrate, vacuumizing a vacuum chamber after the CF substrate and the TFT substrate are assembled, vacuumizing the space between the CF substrate and the TFT substrate, breaking the vacuum after the vacuum degree reaches a preset value, extruding the frame glue under the action of atmospheric pressure, and firmly bonding the CF substrate and the TFT substrate together. Because the blind hole position is only filled with liquid crystal, and the glass thickness of the whole TFT substrate and the CF substrate is the same, the liquid crystal supporting capacity of the blind hole area is limited, and the TFT substrate and the CF substrate at the blind hole position after assembly by vacuum deform inwards under the action of external atmospheric pressure, so that the optical penetration rate and the uniformity are poor, and the imaging image quality of a camera is influenced. The glass deformation of the blind hole position after the group combination is a problem which is difficult to avoid in the development process of the blind hole full-face screen, and is also a key problem for limiting the development and popularization of the blind hole full-face screen.
Therefore, the prior art has defects and needs to be improved urgently.
Disclosure of Invention
The present disclosure provides a display panel and a thinning method thereof to solve the problem of poor optical transmittance and uniformity at a blind via in the prior art.
In order to solve the above problems, the present application provides a display panel, where the display panel includes a color film substrate, an array substrate, and a liquid crystal layer, the color film substrate is disposed opposite to the array substrate, and the liquid crystal layer is disposed between the color film substrate and the array substrate; the display panel comprises at least one blind hole area and a non-blind hole area, and the thickness of the color film substrate in the blind hole area is smaller than that in the non-blind hole area; the thickness of the array substrate in the blind hole area is smaller than that in the non-blind hole area.
In some embodiments, the color filter substrate includes a first substrate and a first functional layer disposed on the first substrate, wherein a thickness of the first substrate in the blind hole region is smaller than a thickness of the first substrate in the non-blind hole region.
In some embodiments, the array substrate includes a second substrate and a second functional layer disposed on the second substrate, wherein a thickness of the second substrate in the blind hole region is smaller than a thickness of the second substrate in the non-blind hole region.
In some embodiments, the first and second substrate base panels have the same thickness within the blind hole region.
In some embodiments, the liquid crystal layer includes a liquid crystal and a liquid crystal support pillar, and the liquid crystal support pillar is disposed in the non-blind hole region and is configured to support the liquid crystal, wherein two ends of the liquid crystal support pillar are respectively in contact with the color film substrate and the array substrate.
The present application further provides a method for thinning a display panel, including the steps of:
providing a display panel, covering a non-blind hole area of the display panel by using a first protective layer, and thinning the blind hole area of the display panel;
removing the first protective layer, covering the blind hole area of the display panel by using a second protective layer, and thinning the non-blind hole area of the display panel;
and removing the second protective layer.
In some embodiments, the display panel includes a color film substrate and an array substrate, the color film substrate includes a first substrate, and the array substrate includes a second substrate; the thinning processing of the display panel comprises thinning processing of the first substrate base plate and the second substrate base plate at the same time.
In some embodiments, the thickness of the thinned first substrate base plate and the second substrate base plate in the blind hole region is smaller than the thickness in the non-blind hole region.
In some embodiments, when the blind hole area of the display panel is thinned, the non-blind hole area covered by the first protection layer is not processed; when thinning processing is carried out on the non-blind hole area of the display panel, the blind hole area covered by the second protective layer is not processed.
In some embodiments, the removing of the first protection layer, the removing of the second protection layer, the thinning of the display panel in the blind hole region, and the thinning of the display panel in the non-blind hole region are performed by at least one of mechanical processing, chemical reaction, laser lift-off, or other means.
In summary, the present application discloses a display panel and a thinning method thereof. The display panel comprises a color film substrate, an array substrate and a liquid crystal layer, wherein the color film substrate is arranged opposite to the array substrate, and the liquid crystal layer is arranged between the color film substrate and the array substrate; the display panel comprises at least one blind hole area and a non-blind hole area, and the thickness of the color film substrate in the blind hole area is smaller than that in the non-blind hole area; the thickness of the array substrate in the blind hole area is smaller than that in the non-blind hole area. The thickness of the color film substrate and the array substrate in the blind hole area is smaller than that of the non-blind hole area, the rigidity strength of the color film substrate and the array substrate is smaller, and the liquid crystal supporting force is enough to support the deformation of the color film substrate and the array substrate in the blind hole area after vacuum assembly, so that the problem of poor optical penetration rate and uniformity in the blind hole area is solved.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic view of a partial area structure of a display panel according to an embodiment of the present disclosure.
Fig. 2 is a schematic plan view of a display panel according to an embodiment of the present disclosure.
Fig. 3 is a schematic flowchart of a thinning method of a display panel according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a defined feature may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Specifically, please refer to fig. 1 and fig. 2, in which fig. 1 is a schematic diagram of a partial area structure of a display panel 1 according to an embodiment of the present disclosure; fig. 2 is a schematic plan view of a display panel 1 according to an embodiment of the present disclosure. The application provides a display panel 1, which comprises a color film substrate 100, an array substrate 200 and a liquid crystal layer 300, wherein the color film substrate 100 is arranged opposite to the array substrate 200, and the liquid crystal layer 300 is arranged between the color film substrate 100 and the array substrate 200; the display panel 1 includes at least one blind hole region 10 and a non-blind hole region 20, and the thickness of the color film substrate 100 in the blind hole region 10 is smaller than that in the non-blind hole region 20; the thickness of the array substrate 200 in the blind hole region 10 is smaller than that in the non-blind hole region 20 (it is defined herein that the thickness of the color filter substrate 100 is the vertical distance between the side of the color filter substrate 100 close to the liquid crystal layer 300 and the side of the color filter substrate 100 away from the liquid crystal layer 300, and the thickness of the array substrate 200 is the vertical distance between the side of the array substrate 200 close to the liquid crystal layer 300 and the side of the array substrate 200 away from the liquid crystal layer 300).
As can be understood by those skilled in the art, the thickness of the color filter substrate 100 in the blind hole region 10 is smaller than that in the non-blind hole region 20, and the thickness of the array substrate 200 in the blind hole region 10 is smaller than that in the non-blind hole region 20. Since the display panel 1 includes the color film substrate 100 and the array substrate 200, it can be said that the thickness of the display panel 1 in the blind hole region 10 is smaller than that in the non-blind hole region 20.
In this embodiment, the color filter substrate 100 includes a first substrate 110 and a first functional layer 120 disposed on the first substrate 110, wherein a thickness of the first substrate 110 in the blind via region 10 is smaller than a thickness of the first substrate in the non-blind via region 20. The array substrate 200 includes a second substrate 210 and a second functional layer 220 disposed on the second substrate 210, wherein a thickness of the second substrate 210 in the blind via region 10 is smaller than a thickness of the second substrate in the non-blind via region 20.
In the blind hole region 10, the thicknesses of the first substrate 110 and the second substrate 210 are the same. In this case, in the non-blind hole region 20, the thicknesses of the first substrate base 110 and the second substrate base 210 are not limited, and the thicknesses of the first substrate base 110 and the second substrate base 210 may be the same or different. However, the thickness of the first substrate board 110 and the second substrate board 210 in the blind hole region 10 must be smaller than the thickness in the non-blind hole region 20.
In the non-blind via region 20, the thicknesses of the first substrate base plate 110 and the second substrate base plate 210 are the same. In this case, in the blind hole region 10, the thicknesses of the first substrate 110 and the second substrate 210 are not limited, and the thicknesses of the first substrate 110 and the second substrate 210 may be the same or different. However, the thickness of the first substrate board 110 and the second substrate board 210 in the non-blind hole region 20 must be greater than the thickness in the blind hole region 10.
In this application, the liquid crystal layer 300 includes a liquid crystal 310 and a liquid crystal supporting pillar 320, and the liquid crystal supporting pillar 320 is used for supporting the liquid crystal 310, wherein two ends of the liquid crystal supporting pillar 320 are respectively in contact with the color film substrate 100 and the array substrate 200. It will be understood by those skilled in the art that the liquid crystal supporting columns 320 can have two different heights, and the supporting forces of the liquid crystal supporting columns 320 of the two different heights are different. In order to ensure the light transmittance of the blind hole region 10, the liquid crystal supporting column 320 is disposed in the non-blind hole region 20, and it is understood that the liquid crystal layer 300 only has the liquid crystal 310 in the blind hole region 10.
In the present application, the color film substrate 100, the array substrate 200, the liquid crystal 310 in the liquid crystal layer 300, and the liquid crystal supporting pillar 320 are all common materials in the art, for example: the color film substrate 100 and the array substrate 200 are both glass substrates or polyimide and the like. This application is not repeated.
Specifically, please refer to fig. 3, and fig. 3 is a schematic flowchart illustrating a thinning method of a display panel 1 according to an embodiment of the present application. The present application further provides a thinning method of a display panel 1, including the following steps:
providing a display panel 1, covering a non-blind hole area 20 of the display panel 1 with a first protective layer, and thinning a blind hole area 10 of the display panel 1;
removing the first protective layer, covering the blind hole area 10 of the display panel 1 by using a second protective layer, and thinning the non-blind hole area 20 of the display panel;
and removing the second protective layer.
In this application, the display panel 1 includes a color film substrate 100 and an array substrate 200, where the color film substrate 100 includes a first substrate 110, and the array substrate 200 includes a second substrate 210; wherein the first substrate 110 and the second substrate 210 are thinned at the same time. As will be understood by those skilled in the art, the display panel 1 is thinned by performing both thinning process on the first substrate 110 and thinning process on the second substrate 210. When the first substrate 110 and the second substrate 210 are thinned, the thinned thickness (the thinned thickness is a difference between the thickness before the thinning process of the first substrate 110 and the second substrate 210 and the thickness after the thinning process of the first substrate 110 and the second substrate 210) may be controlled, and the thinned display panel may satisfy the conditions of the present application, and is not limited otherwise.
In the present application, when the blind hole region 10 and the non-blind hole region 20 are thinned, the thickness of the display panel 1 in the blind hole region 10 after the thinning process is smaller than the thickness in the non-blind hole region 20. Preferably, the display panel 1 in the blind hole region 10 is thinned, and then the display panel 1 in the non-blind hole region 20 is thinned, so as to prevent the display panel from being broken or cracked when the blind hole region 10 is thinned, thereby achieving the required thickness requirement and improving the process yield.
The thickness of the display panel 1 after thinning processing in the blind hole area 10 is smaller than that in the non-blind hole area 20. That is, the thickness of the first substrate 110 in the blind hole region 10 is smaller than the thickness in the non-blind hole region 20; the thickness of the second substrate 210 in the blind hole region 10 is smaller than the thickness in the non-blind hole region 20.
It should be noted that, when the blind hole region 10 of the display panel 1 is thinned, the non-blind hole region 20 covered by the first protection layer is not processed; when the non-blind hole region 20 of the display panel is thinned, the blind hole region 10 covered by the second protective layer is not processed.
In some embodiments, the thinning process employs a mechanical process. The first substrate 110 or the second substrate 210 may be fixed on a processing platform, and a diamond tool is used for drilling and milling, specifically, a drill of the diamond tool is used to directly cut the first substrate 110 or the second substrate 210 under high-speed rotation, so that the blind hole region 10 is first processed on the first substrate 110 or the second substrate 210. The region other than the blind via region 10 is cut to form a non-blind via region 20. It will be understood by those skilled in the art that when such a scheme is adopted, the first protective layer and the second protective layer function to prevent the cutting from scratching the surface of the first base substrate 110 or the second base substrate 210.
In this embodiment, the surface of the blind hole region 10 is polished by a mechanical polishing method, and the mechanical polishing method is performed by a diamond grinding head. During polishing, the diamond grinding head slowly moves on the surface of the blind hole region 10 to polish under the condition of high-speed rotation, and the diamond grinding head can grind the rough surface at the bottom to make the surface region at the bottom smooth and flat, so that the surface of the blind hole region 10 reaches the roughness required correspondingly.
In some embodiments, the thinning process is performed using a chemical etching method. The chemical etching method uses a chemical solution to react with the surface of the first substrate 110 or the second substrate 210, and erodes the surface of the first substrate 110 or the second substrate 210 to thin the first substrate 110 or the second substrate 210. It is mentioned above that the first substrate 110 or the second substrate 210 is a glass substrate. Specifically, the time is controlled by calculation by applying the principle that hydrofluoric acid (HF) solution reacts with glass (chemical component is SiO2) to dissolve the glass, so as to realize the thickness dimension of the glass substrate to be thinned, and the corresponding chemical reaction equation is as follows: 6HF + SiO2＝H2SiF6+2H2O。
Because the embodiment adopts chemical solution, chemical solution all has the etching effect to the glass surface that contacts, consequently, when etching blind hole region 10, non-blind hole region 20 need adopt first protective layer to cover, when etching non-blind hole region 20, blind hole region 10 need adopt the second protective layer to cover, first protective layer and the second protective layer adopts the material preparation that does not react with corresponding chemical solution. Therefore, the method enables the total thickness of the glass substrate to be rapidly reduced to achieve the thickness required by the present application.
In some embodiments, the thinning process is performed using a laser processing method. The principle of laser processing is different from the traditional mechanical cutting processing principle, and the laser processing blind hole is processed by utilizing the heat energy action of laser. Specifically, the laser beam is focused to a very small spot, the material to be processed (glass in this embodiment) absorbs the laser with the corresponding wavelength, so that the material to be processed is melted and gasified at a high temperature in a short time, the part to be processed is erased, the very small spot (laser) moves at a high speed on the surface of the glass, and the glass in the required area is etched, so as to form the blind hole area 10 in this application, or the non-blind hole area 20 is thinned.
In this embodiment, the laser processing method for manufacturing the blind hole region 10 is performed by using a femtosecond laser. When the conventional nanosecond laser pulse is used to process the blind hole region 10 on the transparent optical glass, a molten phase is formed outside the irradiation region due to thermal diffusion, and a thermal stress caused by the melting may cause defects such as cracks around the processed hole. The femtosecond laser is used in the embodiment, and the femtosecond laser can avoid the generation of defects such as cracks. The femtosecond laser can inject energy into the laser irradiated portion faster than the thermal diffusion speed of the material, compared to other lasers, thereby reducing the occurrence of defects such as cracks around the blind via region 10 to be processed due to thermal diffusion.
After the thinning treatment, polishing the surface of the blind hole region 10 may be further included. And polishing by adopting a laser polishing method, wherein the laser polishing method adopts femtosecond laser to polish. When the femtosecond laser is used for polishing, and the corresponding laser beam is focused on the surface of the blind hole region 10, a large amount of heat is accumulated on the surface region of the blind hole region 10 in a short time, when the temperature reaches the melting point of the material, a thin layer of glass close to the surface in the blind hole region 10 starts to melt (the thickness of the glass melted by the laser is usually in the micrometer level), when the temperature further reaches the boiling point of the glass, some molten glass starts to evaporate, and the temperature of other parts of the whole glass is basically unchanged. After the blind hole region 10 is manufactured, the bottom surface has tiny bulges and depressions, the laser polishing process melts a layer of thinner glass on the bottom surface (the thickness of the glass melted by the laser is usually in the micron level), the glass can flow after being melted, and the glass liquid melted at the bulge position naturally levels to the depressions under the action of gravity, so that the curvatures of all positions of the blind hole region 10 tend to be consistent, namely, the blind hole region 10 becomes smooth and flat. And simultaneously, the molten glass material is solidified at the speed of several meters per second, and finally, the smooth and flat glass surface after solidification is obtained. That is, after the blind hole region 10 is laser polished, the surface of the blind hole region 10 can reach the corresponding roughness requirement.
According to the thinning method of the display panel 1, the blind hole area 10 is processed by adopting the thicker glass substrate, so that the situation of breakage or cracking during processing of the blind hole area 10 is prevented, then the glass substrate is thinned, and the non-blind hole area 20 is formed, so that the required thickness requirement is met, and the process yield is improved.
The display panel can be applied to intelligent terminals, mobile phones, tablets, computers, wearable equipment and the like, and is not limited specifically.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel and the thinning method thereof provided by the embodiments of the present application are described in detail above, and the principle and the embodiments of the present application are explained herein by applying specific examples, and the description of the embodiments above is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims (10)

1. A display panel comprises a color film substrate, an array substrate and a liquid crystal layer, and is characterized in that the color film substrate is arranged opposite to the array substrate, and the liquid crystal layer is arranged between the color film substrate and the array substrate; wherein the content of the first and second substances,
the display panel comprises at least one blind hole area and a non-blind hole area, and the thickness of the color film substrate in the blind hole area is smaller than that in the non-blind hole area; the thickness of the array substrate in the blind hole area is smaller than that in the non-blind hole area.
2. The display panel of claim 1, wherein the color filter substrate comprises a first substrate and a first functional layer disposed on the first substrate, wherein a thickness of the first substrate in the blind hole region is smaller than a thickness of the first substrate in the non-blind hole region.
3. The display panel of claim 1, wherein the array substrate comprises a second substrate and a second functional layer disposed on the second substrate, wherein a thickness of the second substrate in the blind hole region is smaller than a thickness of the second substrate in the non-blind hole region.
4. The display panel according to claims 2 and 3, wherein the first substrate and the second substrate have the same thickness in the blind hole region.
5. The display panel of claim 1, wherein the liquid crystal layer comprises a liquid crystal and a liquid crystal support pillar, the liquid crystal support pillar is disposed in the non-blind hole region and is configured to support the liquid crystal, and two ends of the liquid crystal support pillar are respectively in contact with the color film substrate and the array substrate.
6. A method for thinning a display panel includes:
providing a display panel, covering a non-blind hole area of the display panel by using a first protective layer, and thinning the blind hole area of the display panel;
removing the first protective layer, covering the blind hole area of the display panel by using a second protective layer, and thinning the non-blind hole area of the display panel;
and removing the second protective layer.
7. The method for thinning a display panel according to claim 6, wherein the display panel includes a color filter substrate and an array substrate, the color filter substrate includes a first substrate, and the array substrate includes a second substrate; wherein the content of the first and second substances,
the thinning process of the display panel includes simultaneously thinning the first substrate board and the second substrate board.
8. The method for thinning a display panel according to claim 7, wherein a thickness of the thinned first substrate board and the thinned second substrate board in the blind hole region is smaller than a thickness in the non-blind hole region.
9. The method for thinning a display panel according to claim 6, wherein when the blind hole region of the display panel is thinned, the non-blind hole region covered by the first protective layer is not processed; when thinning processing is carried out on the non-blind hole area of the display panel, the blind hole area covered by the second protective layer is not processed.
10. The method for thinning a display panel according to claim 6, wherein the removing of the first protective layer, the removing of the second protective layer, the thinning of the display panel in the blind hole region, and the thinning of the display panel in the non-blind hole region are performed by at least one of mechanical processing, chemical reaction, laser lift-off, and other methods.
CN202011174927.9A 2020-10-28 2020-10-28 Display panel and thinning method thereof Pending CN112198699A (en)

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CN111025784A (en) * 2020-01-08 2020-04-17 武汉华星光电技术有限公司 Liquid crystal display panel and display device
CN111025717A (en) * 2019-12-12 2020-04-17 武汉华星光电技术有限公司 Liquid crystal display panel and electronic device
CN111965906A (en) * 2020-09-16 2020-11-20 厦门天马微电子有限公司 Display panel and electronic device

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Publication number Priority date Publication date Assignee Title
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CN110211972A (en) * 2019-05-23 2019-09-06 武汉华星光电半导体显示技术有限公司 A kind of array substrate and display device
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Application publication date: 20210108