CN112122804A - Low-temperature rapid non-pressure manufacturing method of high-temperature-resistant joint for packaging power chip - Google Patents
Low-temperature rapid non-pressure manufacturing method of high-temperature-resistant joint for packaging power chip Download PDFInfo
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- CN112122804A CN112122804A CN202011010707.2A CN202011010707A CN112122804A CN 112122804 A CN112122804 A CN 112122804A CN 202011010707 A CN202011010707 A CN 202011010707A CN 112122804 A CN112122804 A CN 112122804A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention provides a low-temperature rapid non-pressure manufacturing method of a high-temperature-resistant joint for packaging a power chip, which utilizes a temperature gradient, ultrasonic waves and a flat plate hot-pressing coupling process to manufacture a foamy copper/intermetallic compound composite high-temperature-resistant soldering tin prefabricated sheet, and utilizes the soldering tin prefabricated sheet structure to realize low-temperature rapid non-pressure connection of the power chip and obtain a manufacturing process of a large-size high-temperature-resistant welding joint. The composite high-temperature-resistant welding prefabricated sheet and the high-temperature-resistant welding joint manufactured by the invention have the advantages of simple preparation process, short welding time, low material cost and the like, and the formed high-temperature-resistant welding joint has extremely high shear strength and good electric conduction and heat conduction performance.
Description
Technical Field
The invention belongs to the field of material preparation, and particularly relates to a low-temperature rapid non-pressure manufacturing method of a high-temperature-resistant joint for packaging a power chip.
Background
Compared with the traditional silicon chip, the third-generation power semiconductor chip of silicon carbide, gallium nitride and the like has faster switching frequency, stronger working voltage, larger current bearing capacity and higher temperature resistance, and has wide application prospect in the fields of 5G communication, automobile electronics, large data networks, high-power illumination and the like. At present, because power chips are continuously developed towards the direction of integration and high performance, the service temperature of the chips is remarkably increased, the average working temperature of the chips is over 200 ℃, the peak working temperature of the chips even reaches 300 ℃ for special application occasions such as aerospace, oil exploration and communication base stations, and the extremely high service temperature puts higher requirements on the materials and the reliability of welding joints in the chips.
At present, tin-based solder (such as Sn-Ag, Sn-Cu, Sn-Bi, Sn-Pb and other alloy solder) is the main packaging interconnection material of the chip, and the service temperature of the formed welding joint is low<200 ℃) and poor mechanical property, and can not meet the long-term high-temperature use requirement of the power chip. Novel nano-slurry such as nano-silver, nano-copper and the like has low-temperature interconnection and high-temperature service capacity, but the slurry manufacturing cost is high, and the formed joint is lack of reliability verification. The instantaneous liquid phase diffusion welding technology can form a high-temperature resistant intermetallic compound (Cu) under the condition of low-temperature reflow6Sn5、Cu3Sn, etc.) and the theoretical service temperature of the joint is up to 415 ℃. However, the growth of the intermetallic compound is slow, the time for forming the intermetallic compound welding joint with the thickness of 20 microns at 300 ℃ is more than 30 ℃, and the industrial production requirement of the power chip cannot be met; if the height of the solder joint is reduced, the mechanical property of the joint structure is deteriorated, and the reliability of the chip is remarkably reduced. Therefore, how to quickly realize the low-temperature pressureless manufacturing of large-size intermetallic compound welding joints is the main technical bottle facing the current power chipAnd (4) a neck.
Disclosure of Invention
The application aims to provide a low-temperature rapid non-pressure manufacturing method of a high-temperature-resistant joint for packaging a power chip, and aims to solve the manufacturing problems of high welding temperature, long welding time, poor joint reliability and the like of the conventional high-temperature-resistant joint for packaging the power chip.
The invention provides a low-temperature rapid non-pressure manufacturing method of a high-temperature-resistant joint for packaging a power chip, which comprises the following steps:
step S1: carrying out ultrasonic cleaning on the foamy copper, and then carrying out surface treatment on the foamy copper by using a plasma cleaning machine;
step S2: melting the tin-based brazing filler metal, adding copper powder, fully stirring to form molten brazing filler metal, soaking the foamy copper obtained in the step S1 in the molten brazing filler metal for 5-10 seconds, and taking out to form a prefabricated sheet;
step S3: processing and forming the prefabricated sheet by adopting a flat-plate thermoforming machine, when a high-temperature side heating plate of the flat-plate thermoforming machine is heated to be 20-100 ℃ higher than the melting temperature of the brazing filler metal and the temperature of a low-temperature side heating plate of the flat-plate thermoforming machine is 0-100 ℃ lower than that of the high-temperature side heating plate, putting the prefabricated sheet into the flat-plate thermoforming machine, applying a load by utilizing a flat-plate pressurizing device, measuring and accurately controlling the thickness of the prefabricated sheet by utilizing a thickness gauge, keeping the pressure value stable when the thickness value reaches a preset value, starting a pneumatic device, inserting an ultrasonic probe into a probe groove of the high-temperature side heating plate, starting ultrasonic waves, keeping the ultrasonic power range of 200 and 1500W, keeping the ultrasonic pressure of 0.6MPa and the ultrasonic time of 1-10 minutes, keeping the flat-plate thermoforming machine for 0-30 minutes, starting a circulating water cooling machine, and rapidly cooling, unloading the pressure and taking out the prefabricated pieces for later use;
step S4: after ultrasonic cleaning and plasma activation treatment are carried out on the prefabricated sheet obtained in the step S3, the prefabricated sheet is placed into chemical tin plating liquid for 0.5 to 10 minutes, and the foamed copper/intermetallic compound composite high-temperature-resistant welding prefabricated sheet is obtained;
step S5: carrying out graphical cutting on the foam copper/intermetallic compound composite high-temperature-resistant welding prefabricated sheet by adopting a laser cutting machine according to the shape of a bonding pad of the power chip;
step S6: and (4) placing the foamed copper/intermetallic compound composite high-temperature-resistant welding prefabricated sheet obtained in the step (S5) into two copper welding pads to be stacked into a sandwich structure, and treating by adopting a reflow soldering process to obtain the high-temperature-resistant welding joint.
In a preferred embodiment, the plasma cleaning machine in step S1 is an argon gas plasma cleaning machine, and the excitation frequency of the plasma cleaning machine is 13.56 MHz. The high-frequency argon plasma gas is used for activating the structure in the pores of the foam copper, so that the soldering flux is not added, and the volatilization of the soldering flux in the heating process is reduced, which causes the generation of gas.
In a preferred embodiment, the plasma cleaner is used for treating the foam copper for 10-30 minutes at a power range of 50-150W.
In a preferred embodiment, the ultrasonic cleaning of the copper foam in step S1 includes firstly performing ultrasonic cleaning on the copper foam with an alcohol solution for 5-10 minutes to remove residual organic matters on the surface of the copper foam, then performing ultrasonic cleaning with a 1-10% alcohol solution of hydrochloric acid or nitric acid for 0.5-3 minutes to remove an oxide film on the surface of the copper foam, and finally performing ultrasonic cleaning with deionized water for 1 minute and drying with nitrogen.
In a preferred embodiment, the temperature of the molten solder in step S2 is maintained at 10-20 ℃ above the melting point of the tin-based solder. When the copper foam is soaked in the molten brazing filler metal, the temperature of the copper foam is at room temperature, so that the temperature of the brazing filler metal is easily reduced locally, and the brazing filler metal is directly solidified to prevent the liquid brazing filler metal from soaking into deep gaps of the copper foam.
In a preferred embodiment, the preformed sheet obtained in step S3 is first ultrasonically cleaned with 1-10% hydrochloric acid alcohol or nitric acid alcohol solution for 1-3 minutes, and then ultrasonically cleaned with deionized water for 1 minute. The oxide film on the surface of the copper foam is CuO, and the CuO can be effectively dissolved by hydrochloric acid or nitryl alcohol solution. Secondly, the corrosion can increase the surface defects of the foam copper, the dipping resistance is increased, the corrosion pits on the surface of the foam copper can be effectively thinned by utilizing ultrasonic cleaning and acid liquor with higher concentration, and the roughness of the surface of the foam copper is reduced.
In a preferred embodiment, the preform obtained in step S3 is surface-activated with argon plasma for 5 to 10 minutes at a power in the range of 50 to 150W.
In a preferred embodiment, the power range of the laser cutting machine is 100-500W, and the positioning precision is +/-0.05 mm.
In a preferred embodiment, the heating temperature of the reflow soldering process in the step S6 is 240-300 ℃, and the heating time is 10-60 seconds.
In a preferred embodiment, the mass ratio of the tin-based solder to the copper powder in the step S2 is 100: 1-20: 1. If less mass of copper powder is added this will result in the copper foam dissolving.
The invention relates to a low-temperature rapid non-pressure manufacturing method of a high-temperature-resistant joint for packaging a power chip, which is characterized in that a foamy copper/intermetallic compound composite high-temperature-resistant soldering tin prefabricated piece is manufactured by utilizing a temperature gradient, ultrasonic waves and a flat plate hot-pressing coupling process, and a manufacturing process for realizing low-temperature rapid non-pressure connection of the power chip and obtaining a large-size high-temperature-resistant welding joint is realized by utilizing the soldering tin prefabricated piece structure. Wherein the foam copper/intermetallic compound composite high-temperature-resistant welding prefabricated sheet takes the foam copper as a framework and a large-volume intermetallic compound (Cu)6Sn5、Cu3Sn, etc.) as a filler, and a tin plating layer as a surface layer to prepare a large-size high-temperature-resistant composite welding prefabricated sheet with controllable thickness. Because the tin coating has low-temperature welding capacity and the copper and the intermetallic compound have higher melting points, the composite high-temperature-resistant welding prefabricated piece can quickly realize the vertical interconnection of the power chip under the traditional low-temperature reflow process parameters, and form a high-temperature-resistant welding joint with the service temperature of more than 300 ℃, thereby meeting the long-term high-temperature service requirement of the power chip.
The invention can rapidly manufacture the high-temperature-resistant welding joint under the condition of the traditional low-temperature pressureless reflow process, is compatible with the traditional reflow soldering manufacturing process, eliminates the adverse effect of the high-temperature, high-pressure and long-time reflow process on the internal structure of the chip, and the formed high-temperature-resistant welding joint has controllable size, good high-temperature mechanical property and excellent electric conduction and heat dissipation capacity, and has great practical value for the long-term stable service of a third-generation power semiconductor chip. The high-temperature-resistant welding prefabricated sheet prepared by the invention has the advantages of simple manufacturing process, less internal defects, good reliability, strong low-temperature interconnection capacity, low cost and convenience for batch manufacturing.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain the principles of the invention. Other embodiments and many of the intended advantages of embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
Fig. 1 is a flow chart of a low-temperature, fast, and pressureless manufacturing method of a high-temperature-resistant joint for power chip packaging according to an embodiment of the present invention;
FIG. 2 is a schematic illustration of a copper foam surface topography (a) and a copper foam cross-sectional structure (b) according to one embodiment of the present invention;
FIG. 3 is a schematic view of the forming of a composite refractory welded preform sheet according to one embodiment of the present invention;
FIG. 4 is a schematic view of an interface of a copper foam/intermetallic compound composite refractory welded preform sheet (a) and a sectional view of a refractory welded joint (b) according to an embodiment of the present invention;
FIG. 5 is a graphical representation of the shear strength of a high temperature resistant weld joint according to one embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention will be described in detail with reference to fig. 1, and the low-temperature, fast and pressureless manufacturing method of the high-temperature-resistant joint for packaging the power chip of the invention comprises the following steps:
step S1: selecting commercial foam copper with different apertures according to actual requirements, and cutting the commercial foam copper into a required shape; ultrasonically cleaning the cut foamy copper for 5-10 minutes by using an alcohol solution to remove residual organic matters on the surface of the foamy copper; then ultrasonically cleaning for 0.5-3 minutes by using 1-10% hydrochloric acid alcohol or nitric acid alcohol solution to remove the surface oxidation film of the foam copper; ultrasonically cleaning the foamy copper for 1 minute by using deionized water and drying by using nitrogen; and finally, performing surface treatment on the foamy copper for 10-30 minutes by using an argon plasma cleaning machine, wherein the power range is 50-150W, and the power and time parameters can be adjusted according to the thickness of the foamy copper. The excitation frequency of the argon plasma cleaning machine is 13.56MHz, and the structure in the pores of the foam copper is activated by using high-frequency plasma gas, so that the addition of soldering flux is not needed, and the gas caused by the volatilization of the soldering flux in the heating process is reduced.
Step S2: melting tin-based brazing filler metal in a melting pool, adding a proper amount of copper powder (10-50 g of copper powder is added into 1kg of brazing filler metal) and fully stirring to form molten brazing filler metal, keeping the temperature of the molten brazing filler metal at 10-20 ℃ higher than the melting point of the brazing filler metal, and scraping an oxide film on the surface of the molten brazing filler metal; rapidly soaking the foamed copper which is cleaned by the plasma and is not added with the fluxing agent into the molten brazing filler metal, keeping the time for 5-10 seconds, and then taking out; cooling to room temperature by water, and drying by cold air.
Step S3: processing and forming the precast slab obtained in the step S2 by using a flat-plate thermoforming machine with two sides capable of independently controlling temperature and applying ultrasonic load, putting the precast slab into the flat-plate thermoforming machine when a high-temperature side heating plate of the flat-plate thermoforming machine is heated to a temperature 20-100 ℃ higher than the melting point temperature of the brazing filler metal and the temperature of a low-temperature side heating plate of the flat-plate thermoforming machine is 0-100 ℃ lower than that of the high-temperature side heating plate, applying load by using a flat-plate pressurizing device, wherein the pressure range is 50-1000MPa, and measuring and accurately controlling the thickness of the precast slab by; when the thickness value reaches a preset value, keeping the pressure value stable, starting a pneumatic device, inserting an ultrasonic probe into a probe groove of a high-temperature side heating plate, and starting ultrasonic waves, wherein the ultrasonic power is 200 and 1500W, the ultrasonic pressure is 0.6MPa, and the ultrasonic time is 1-10 minutes; and (3) continuously keeping the temperature of the flat-plate thermoforming machine for 0-30 minutes, starting a circulating water cooling machine, rapidly cooling the flat-plate thermoforming machine to room temperature, unloading the pressure and taking out the prefabricated sheets for later use.
Step S4: ultrasonically cleaning the prefabricated sheet obtained in the step S3 for 1-3 minutes by using 1-10% hydrochloric acid alcohol or nitric acid alcohol solution; then ultrasonically cleaning for 1 minute by using deionized water; activating the surface for 5-10 minutes by using argon plasma, wherein the power range is 50-150W; soaking the prefabricated sheet in commercial chemical tin plating solution for 0.5-10 min, taking out and drying to obtain the foamed copper/intermetallic compound composite high temperature resistant welding prefabricated sheet.
Step S5: carrying out graphical cutting on the foamy copper/intermetallic compound composite high-temperature-resistant welding prefabricated piece according to the shape of a power chip bonding pad by using a commercial high-power laser cutting machine, wherein the laser power is 100-500W, and the positioning precision is +/-0.05 mm; and collecting the patterned precast sheet for later use.
Step S6: the copper bonding pad, the graphical composite high-temperature-resistant welding prefabricated sheet and the copper bonding pad are stacked into a sandwich structure, the traditional reflow soldering process is adopted to heat for 10-60 seconds at the temperature of 240-300 ℃, and then the temperature is cooled to the room temperature, so that the high-temperature-resistant welding joint is obtained.
Fig. 2 shows the surface morphology (a) and the cross-sectional structure (b) of the copper foam, and as shown in fig. 2, the copper foam is a porous material, has a three-dimensional network skeleton structure, has a larger specific surface area compared with a copper block, has more surface grain boundaries and higher energy, and is suitable for the growth of intermetallic compounds.
Fig. 3 is a schematic view of the processing and forming of the composite high temperature resistant welded precast slab, and as shown in fig. 3, the precast slab obtained in step S2 is processed and formed by a flat-plate thermoforming machine with two sides capable of independently controlling temperature and applying ultrasonic load, and the thickness of the precast slab can be set according to actual needs.
Fig. 4 is an interface topography (a) and a cross-sectional topography (b) of a high temperature-resistant solder joint of the copper foam/intermetallic compound composite high temperature-resistant solder preform, as shown in fig. 4(a), the obtained copper foam/intermetallic compound composite high temperature-resistant solder preform has been transformed into a structure filled with copper as a skeleton and an intermetallic compound under the action of a temperature gradient, and after tin is coated on the surface of the copper foam/intermetallic compound composite high temperature-resistant solder preform, the energy barrier between the preform and the copper pad can be effectively reduced, and the low temperature reflow of the preform and the copper pad can be realized. As can be seen from fig. 4(b), the joint has formed an effective interconnection.
FIG. 5 is a graph illustrating the shear strength of a high temperature resistant weld joint, as shown in FIG. 5, which is optimal when the temperature gradient is 60 deg.C; when the temperature gradient is 80 ℃, the copper skeleton is dissolved rapidly, and the shear strength is reduced rapidly.
Example 1
Selecting commercial foam copper with pore diameter of 150 μm, porosity of 63.1% and thickness of 100 μm, and cutting into 10 × 10mm2The square small blocks are firstly cleaned by alcohol solution for 5 minutes in an ultrasonic mode, then cleaned by 5% hydrochloric acid alcohol solution for 1 minute in an ultrasonic mode, then cleaned by deionized water for 1 minute in an ultrasonic mode, dried by nitrogen in a blow-drying mode, finally cleaned by an argon plasma cleaning machine for 10 minutes, and the power range is 100W. Melting tin-copper eutectic solder in a melting pool, adding a proper amount of copper powder (10-50 g of copper powder is added into 1kg of solder) and fully stirring, keeping the temperature at 240 ℃, scraping off an oxide film on the surface, quickly soaking the foamed copper which is cleaned by plasma and is not added with the fluxing agent in the molten solder, keeping for 5 seconds, taking out, cooling to room temperature by water, and drying by cold air.
A flat plate thermoforming machine with two sides capable of independently controlling temperature and applying ultrasonic load is utilized, a low-temperature side heating plate is set to be 220 ℃, and a high-temperature side heating plate is set to be 240 ℃; when the temperature is raised to a preset temperature, the prefabricated sheet is placed between heating plates, and the pressure is 200MPa, so that the thickness of the prefabricated sheet reaches 70 mu m; and when the thickness value reaches a preset value, keeping the pressure value stable, starting a pneumatic device, inserting an ultrasonic probe into a probe groove of the high-temperature side heating plate, starting ultrasonic waves, keeping the temperature for 5 minutes, cooling the heating plate to room temperature, and taking out the prefabricated sheet, wherein the ultrasonic power is 1000W, the ultrasonic pressure is 0.6MPa, and the ultrasonic time is 10 minutes. Ultrasonically cleaning the prefabricated sheet for 1 minute by using 5% hydrochloric acid alcohol solution, ultrasonically cleaning the prefabricated sheet for 1 minute by using deionized water, finally activating the surface for 5 minutes by using argon plasma (with the power of 100W), soaking the prefabricated sheet in commercial chemical tinning liquid, keeping the surface for 3 minutes, taking out and drying to obtain the composite high-temperature-resistant welding prefabricated sheet.
Cutting the prefabricated sheet into 5 × 5mm pieces by laser cutting machine2Laser power 500W. And stacking the copper bonding pad/the prefabricated sheet/the copper bonding pad into a sandwich structure, heating the copper bonding pad/the prefabricated sheet/the copper bonding pad for 60 seconds at the temperature of 240 ℃ without pressure by adopting a reflow soldering process, and cooling the copper bonding pad/the prefabricated sheet/the copper bonding pad to room temperature to obtain the high-temperature-resistant welding joint. And (5) carrying out a shearing performance test, and measuring that the shearing strength of the joint under the parameter is 54.3 MPa.
Example 2
The similar process for preparing the copper foam/intermetallic compound composite high temperature resistant welding preform as in example 1 was used. A flat plate thermoforming machine with two sides capable of independently controlling temperature and applying ultrasonic load is utilized, a low-temperature side heating plate is set to be 200 ℃, and a high-temperature side heating plate is set to be 240 ℃; when the temperature is raised to a preset temperature, the prefabricated sheet is placed between heating plates, and the pressure is 400MPa, so that the thickness of the prefabricated sheet reaches 50 mu m; and when the thickness value reaches a preset value, keeping the pressure value stable, starting a pneumatic device, inserting an ultrasonic probe into a probe groove of the high-temperature side heating plate, starting ultrasonic waves, keeping the ultrasonic power at 1200W, the ultrasonic pressure at 0.6MPa and the ultrasonic time at 10 minutes, keeping the temperature for 10 minutes, then cooling the heating plate to room temperature, and taking out the prefabricated sheet. Ultrasonically cleaning the prefabricated sheet for 1 minute by using hydrochloric acid alcohol solution with the mass fraction of 3 percent, ultrasonically cleaning the prefabricated sheet for 1 minute by using deionized water, activating the surface for 3 minutes by using argon plasma (with the power of 120W), soaking the prefabricated sheet in commercial chemical tinning liquid, keeping the surface for 5 minutes, taking out and drying the prefabricated sheet to obtain the composite high-temperature-resistant welding prefabricated sheet.
Cutting the prefabricated sheet into 5 × 5mm pieces by laser cutting machine2Laser power 500W. And stacking the copper bonding pad/the prefabricated sheet/the copper bonding pad into a sandwich structure, heating the copper bonding pad/the prefabricated sheet/the copper bonding pad for 60 seconds at 240 ℃ without pressure by adopting a reflow soldering process, and cooling the copper bonding pad/the prefabricated sheet/the copper bonding pad to room temperature to obtain the high-temperature-resistant welding joint. And (5) carrying out a shearing performance test, and measuring that the shearing strength of the joint under the parameter is 67.8 MPa.
While the principles of the invention have been described in detail in connection with the preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing embodiments are merely illustrative of exemplary implementations of the invention and are not limiting of the scope of the invention. The details of the embodiments are not to be interpreted as limiting the scope of the invention, and any obvious changes, such as equivalent alterations, simple substitutions and the like, based on the technical solution of the invention, can be interpreted without departing from the spirit and scope of the invention.
Claims (10)
1. A low-temperature rapid non-pressure manufacturing method of a high-temperature-resistant joint for packaging a power chip is characterized by comprising the following steps:
step S1: carrying out ultrasonic cleaning on the foamy copper, and then carrying out surface treatment on the foamy copper by using a plasma cleaning machine;
step S2: melting the tin-based brazing filler metal, adding copper powder, fully stirring to form molten brazing filler metal, soaking the foamy copper obtained in the step S1 in the molten brazing filler metal for 5-10 seconds, and taking out to form a prefabricated sheet;
step S3: processing and forming the prefabricated sheet by adopting a flat-plate thermoforming machine, when a high-temperature side heating plate of the flat-plate thermoforming machine is heated to a temperature 20-100 ℃ higher than the melting point temperature of the brazing filler metal and the temperature of a low-temperature side heating plate of the flat-plate thermoforming machine is 0-100 ℃ lower than that of the high-temperature side heating plate, putting the prefabricated sheet into the flat-plate thermoforming machine, applying a load by utilizing a flat-plate pressurizing device, measuring and accurately controlling the thickness of the prefabricated sheet by utilizing a thickness gauge, keeping the pressure value stable after the thickness value reaches a preset value, starting a pneumatic device, inserting an ultrasonic probe into a probe groove of the high-temperature side heating plate, starting ultrasonic waves, keeping the ultrasonic power range of 200 and 1500W, the ultrasonic pressure of 0.6MPa and the ultrasonic time of 1-10 minutes, and starting a circulating water cooler after the flat-plate thermoforming machine keeps the temperature for 0, rapidly cooling the flat-plate thermoforming machine to room temperature, unloading the pressure and taking out the prefabricated sheet for later use;
step S4: carrying out ultrasonic cleaning and plasma activation treatment on the prefabricated sheet obtained in the step S3, and then putting the prefabricated sheet into chemical tin plating solution, wherein the chemical plating time is 0.5-10 minutes, and thus obtaining the foamed copper/intermetallic compound composite high-temperature-resistant welding prefabricated sheet;
step S5: carrying out graphical cutting on the foam copper/intermetallic compound composite high-temperature-resistant welding prefabricated sheet by adopting a laser cutting machine according to the shape of a bonding pad of the power chip;
step S6: and (4) placing the foamy copper/intermetallic compound composite high-temperature-resistant welding prefabricated sheet obtained in the step (S5) into two copper welding pads to be stacked into a sandwich structure, and treating by adopting a reflow soldering process to obtain the high-temperature-resistant welding joint.
2. The low-temperature, fast and pressureless manufacturing method of high-temperature-resistant joints for power chip packaging according to claim 1, wherein the plasma cleaning machine in step S1 is an argon plasma cleaning machine, and the excitation frequency of the plasma cleaning machine is 13.56 MHz.
3. The low-temperature rapid pressureless manufacturing method of the high-temperature-resistant joint for power chip packaging according to claim 2, wherein the processing time of the plasma cleaning machine on the foamy copper is 10-30 minutes, and the power range is 50-150W.
4. The low-temperature rapid non-pressure manufacturing method of the high-temperature-resistant joint for power chip packaging according to claim 1, wherein the ultrasonic cleaning of the copper foam in step S1 comprises firstly ultrasonic cleaning the copper foam with an alcohol solution for 5-10 minutes, then ultrasonic cleaning with a 1-10% alcohol solution of hydrochloric acid or nitric acid for 0.5-3 minutes, finally ultrasonic cleaning with deionized water for 1 minute and drying with nitrogen.
5. The low-temperature, fast, and pressureless manufacturing method of a high-temperature-resistant joint for power chip packaging according to claim 1, wherein the temperature of the molten solder in step S2 is maintained at 10-20 ℃ higher than the melting point of the tin-based solder.
6. The method for manufacturing the high temperature resistant joint for power chip packaging according to claim 1, wherein the prefabricated sheet obtained in step S3 is ultrasonically cleaned for 1-3 minutes by using 1-10% hydrochloric alcohol or nitric acid alcohol solution, and then is ultrasonically cleaned for 1 minute by using deionized water.
7. The method for manufacturing the high temperature-resistant joint for power chip packaging according to claim 2, wherein the prefabricated sheet obtained in step S3 is subjected to surface activation for 5-10 minutes by using the argon plasma, and the power range is 50-150W.
8. The method as claimed in claim 1, wherein the laser cutting machine has a power range of 100-500W and a positioning accuracy of ± 0.05 mm.
9. The method as claimed in claim 1, wherein the reflow process of step S6 is performed at a temperature of 240-300 ℃ for a time of 10-60 seconds.
10. The low-temperature rapid non-pressure manufacturing method of the high-temperature-resistant joint for power chip packaging as claimed in claim 1, wherein the mass ratio of the tin-based solder to the copper powder in step S2 is 100: 1-20: 1.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112122804B (en) | 2021-06-11 |
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