CN112117537A - Antenna system and preparation method of dielectric antenna thereof - Google Patents
Antenna system and preparation method of dielectric antenna thereof Download PDFInfo
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- CN112117537A CN112117537A CN202010873848.0A CN202010873848A CN112117537A CN 112117537 A CN112117537 A CN 112117537A CN 202010873848 A CN202010873848 A CN 202010873848A CN 112117537 A CN112117537 A CN 112117537A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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Abstract
The application discloses an antenna system and a dielectric antenna preparation method thereof, wherein the dielectric antenna preparation method comprises the following steps: manufacturing an inner support with the same three-dimensional geometric shape as the dielectric antenna; forming a conductive layer on an inner surface and/or an outer surface of the inner support; dividing the outer surface of the conductive layer into a plurality of parts; manufacturing a plurality of shells corresponding to the outer surface of each part of the conductive layer, wherein the shells are made of dielectric materials; and bonding the conductive layer with a plurality of shells to form the dielectric antenna. According to the scheme, the shell made of the dielectric material is divided into a plurality of parts to be manufactured and bonded, so that the problem of shrinkage of the shell of the dielectric antenna can be effectively solved.
Description
Technical Field
The present application relates to the field of wireless communication technologies, and in particular, to an antenna system and a method for manufacturing a dielectric antenna thereof.
Background
An antenna is a transducer that converts a current propagating on a transmission line into an electromagnetic wave propagating in an unbounded medium (usually free space) or vice versa, and is therefore a component used in radio devices for transmitting or receiving electromagnetic waves. Engineering systems such as radio communication, broadcasting, television, radar, navigation, electronic countermeasure, remote sensing, radio astronomy and the like all use electromagnetic waves to transmit information and work by depending on antennas. In addition, non-signal capability radiation also requires antennas in terms of transferring energy with electromagnetic waves.
At present, the 5G communication frequency band is improved from the traditional 6GHz or below to the millimeter wave frequency band, and the frequency band is about 30 GHz-30 GHz. In this case, the antenna design also becomes diversified. Currently, in millimeter wave antenna design, there is one design that becomes a dielectric antenna. The design principle of the dielectric antenna is to increase the antenna gain by adding a dielectric material to focus the antenna field pattern, specifically referring to fig. 1, where fig. 1 is a schematic structural diagram of a dielectric antenna in the prior art.
The dielectric antenna design of fig. 1 has the advantages of convenient assembly and easy manufacture, and has the disadvantage that the dielectric material has serious shrinkage problems in the manufacturing process, and the mechanical size of the antenna and the antenna gain are greatly influenced.
Disclosure of Invention
The application at least provides an antenna system and a preparation method of a dielectric antenna thereof.
The first aspect of the present application provides a method for manufacturing a dielectric antenna, where the method for manufacturing a dielectric antenna includes:
manufacturing an inner support with the same three-dimensional geometric shape as the dielectric antenna;
forming a conductive layer on an inner surface and/or an outer surface of the inner stent;
dividing the outer surface of the conducting layer into a plurality of parts;
manufacturing a plurality of shells corresponding to the outer surface of each part of the conductive layer, wherein the shells are made of dielectric materials;
and bonding the conductive layer with the plurality of shells to form the dielectric antenna.
In some embodiments, the step of bonding the conductive layer to the plurality of housings comprises:
arranging a filling material on the outer surface of the conductive layer;
adhering a plurality of shells on the surface of the filling material, which faces away from the conductive layer;
wherein the filling material is a wave-absorbing material.
In some embodiments, the conductive layer is a metal layer;
the step of forming a conductive layer on the inner surface and/or the outer surface of the inner stent comprises:
polishing the outer surface of the inner support frame smoothly;
the conductive layer is formed on the outer surface of the inner lead through a plating process or a pasting process.
In some embodiments, the step of bonding the conductive layer to the plurality of housings comprises:
bonding the shell corresponding to the outer surface of each part of the conductive layer according to the shape of the conductive layer;
and inserting the conductive layer into the bonded shell and fixing.
In some embodiments, the step of bonding the conductive layer to the housing comprises:
attaching the shell corresponding to each part of the outer surface of the conductive layer to the outer surface of the conductive layer according to the corresponding position;
and adhering and fixing a plurality of shells attached to the outer surface of the conducting layer.
In some embodiments, the inner support comprises a transmitting section and a feeding section;
the step of dividing the outer surface of the conductive layer into a plurality of parts includes:
dividing an outer surface of the conductive layer into portions in a direction from the feeding section to the emitting section.
In some embodiments, the inner support comprises a transmitting section and a feeding section;
the step of dividing the outer surface of the conductive layer into a plurality of parts includes:
the outer surface of the conductive layer corresponding to the transmitting section and the feeding section of the inner support is averagely divided into a plurality of parts with equal areas.
In some embodiments, the thickness of the outer shell is set to one quarter of the wavelength of the electromagnetic signal emitted by the inner support.
In some embodiments, the dielectric antenna manufacturing method further includes:
the dielectric constant of the housing material is determined based on the dielectric constant of the inner support and the dielectric constant of the peripheral space constituted by air.
A second aspect of the application provides an antenna system comprising a signal processor and a dielectric antenna as described above.
In the scheme, an inner support with the same three-dimensional geometric shape as the dielectric antenna is manufactured; forming a conductive layer on an inner surface and/or an outer surface of the inner support; dividing the outer surface of the conductive layer into a plurality of parts; manufacturing a plurality of shells corresponding to the outer surface of each part of the conductive layer, wherein the shells are made of dielectric materials; and bonding the conductive layer with a plurality of shells to form the dielectric antenna. According to the scheme, the shell made of the dielectric material is divided into a plurality of parts to be manufactured and bonded, so that the problem of shrinkage of the shell of the dielectric antenna can be effectively solved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.
Fig. 1 is a schematic diagram of a prior art dielectric antenna;
fig. 2 is a schematic flowchart of an embodiment of a method for manufacturing a dielectric antenna provided in the present application;
fig. 3 is a schematic block diagram of a dielectric antenna manufacturing process provided in the present application;
fig. 4 is a schematic diagram of a frame of an embodiment of an antenna system provided in the present application.
Detailed Description
The following describes in detail the embodiments of the present application with reference to the drawings attached hereto.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two. In addition, the term "at least one" herein means any one of a plurality or any combination of at least two of a plurality, for example, including at least one of A, B, C, and may mean including any one or more elements selected from the group consisting of A, B and C.
Referring to fig. 2 and fig. 3, fig. 2 is a schematic flow chart of an embodiment of a dielectric antenna manufacturing method provided in the present application, and fig. 3 is a schematic frame diagram of a dielectric antenna manufacturing process provided in the present application. The application provides a dielectric antenna, which is different from the existing dielectric antenna preparation method and is prepared by the following steps:
step S11: and manufacturing an inner support with the same three-dimensional geometrical shape as the dielectric antenna.
Wherein, an inner support B with the same three-dimensional geometrical shape as the dielectric antenna A is manufactured. The three-dimensional geometry of the inner support B can be a polyhedron or a rotator; the inner support B is a composite material, and the composite material may be a non-conductive material, and may be, for example, a mixture of one or more of foam, a polymer material, a prepreg, a reinforced fiber, and a honeycomb material.
The inner support B is preferably of an integrally formed integral structure, and the structural stability can be improved. When the inner support B adopts prepreg, the inner support B can be prepared by the following steps: and laying a prepreg on the upper layer of the mould, vacuumizing a vacuum bag, and finally performing thermosetting molding in an oven. Therefore, the traditional screw fixing mode is not needed, and the mechanical performance of the product is better. When the inner support B is made of high polymer materials, the inner support B can be formed by an injection molding process.
The inner support B is preferably a hollow structure filled with foam or honeycomb material. The blank body can be of an integral structure and is manufactured by adopting an integral forming process. By adopting the hollow structure, the weight of the three-dimensional antenna can be greatly reduced.
Step S12: a conductive layer is formed on the inner surface and/or the outer surface of the inner support.
Wherein a conductive layer (not shown) is formed on the inner surface and/or the outer surface of the inner support B. Before this, the outer surface of the inner stent B may be polished smooth. This step is not required if the outer surface of the composite material used is inherently smooth.
The conductive layer is a metal layer, such as copper foil, silver foil, etc. And attaching the metal layer to the outer surface of the composite material by adopting the modes of electroplating, sputtering, film pasting, spraying, bonding and the like, so that the metal layer is formed on the outer surface of the composite material. Among them, the plating process and the pasting process are the preferred processes. Furthermore, the conductive layer can be coated or adhered or covered with a layer of the composite material in other ways to protect the conductive layer.
Step S13: the outer surface of the conductive layer is divided into several parts.
Step S14: and manufacturing a plurality of shells corresponding to each part of the outer surface of the conductive layer, wherein the plurality of shells are made of dielectric materials.
The shell C to be manufactured is divided into a plurality of parts according to the outer surface of the conducting layer or the inner support B, and the shell C of each part is independently manufactured, wherein the shell C is made of a medium material.
For example, as shown in fig. 3, the case C to be produced is divided into eight parts. Wherein, the inner support B can be divided into a transmission section and a feeding section according to the transmission direction division of the signal. The specific way of shell division is as follows: (1) dividing the outer surface of the conductive layer into several parts along the direction of the inner support B along the feed section to the launch section, as shown in fig. 3; (2) the outer surfaces of the conductive layer corresponding to the emitting section and the feeding section of the inner support B are equally divided into several parts having equal areas, respectively.
Further, when the shell C is divided into a plurality of parts with equal size and shape, the same mold can be used for preparing the plurality of parts of the shell C, so that the preparation cost can be effectively reduced.
Wherein the shell C has the function of avoiding reflection, and the thickness of the shell C can be set to be a quarter of the wavelength of the electromagnetic signal emitted by the inner support B. The node constant of the dielectric material of which the housing C is made depends on the dielectric constant of the inner support B (or the dielectric constant of the core and radiating sections of the inner support B) and on the node constant of the peripheral space around the dielectric antenna a, which in the usual application is constituted by air. Ideally, the dielectric constant of the dielectric material of the housing C is equal to the square root of the product of the two dielectric constants. The housing C thus designed makes it possible to significantly reduce the interference distribution in the transition region between the dielectric antenna a and the surrounding space and to reduce the multiple reflections associated therewith within the inner carrier B.
Step S15: and bonding the conductive layer with a plurality of shells to form the dielectric antenna.
As shown in fig. 3, the conductive layer, the inner support B, and the plurality of shells are combined to form the dielectric antenna a.
The specific combination mode is as follows: (1) firstly, adhering a shell C corresponding to the outer surface of each part of the conducting layer according to the shape of the conducting layer to form a whole assembly, then inserting the conducting layer and the inner support B into the whole assembly, and fixing to form a dielectric antenna A; (2) firstly, attaching the shells C corresponding to each part of the outer surface of the conductive layer to the outer surface of the conductive layer according to corresponding positions, and then adhering and fixing the shells attached to the outer surface of the conductive layer to form the dielectric antenna A.
In the embodiment of the disclosure, an inner support with the same three-dimensional geometrical shape as the dielectric antenna is manufactured; forming a conductive layer on an inner surface and/or an outer surface of the inner support; dividing the outer surface of the conductive layer into a plurality of parts; manufacturing a plurality of shells corresponding to the outer surface of each part of the conductive layer, wherein the shells are made of dielectric materials; and bonding the conductive layer with a plurality of shells to form the dielectric antenna. According to the scheme, the shell made of the dielectric material is divided into a plurality of parts to be manufactured and bonded, so that the problem of shrinkage of the shell of the dielectric antenna can be effectively solved.
Referring to fig. 4, fig. 4 is a schematic diagram of an embodiment of an antenna system according to the present application. Specifically, the antenna system 20 of the present disclosure includes a signal processor 21 and a dielectric antenna 22, where the dielectric antenna 22 may be prepared by the above-mentioned dielectric antenna preparation method.
In some embodiments, functions of or modules included in the apparatus provided in the embodiments of the present disclosure may be used to execute the method described in the above method embodiments, and specific implementation thereof may refer to the description of the above method embodiments, and for brevity, will not be described again here.
The foregoing description of the various embodiments is intended to highlight various differences between the embodiments, and the same or similar parts may be referred to each other, and for brevity, will not be described again herein.
In the several embodiments provided in the present application, it should be understood that the disclosed method and apparatus may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a module or a unit is merely one type of logical division, and an actual implementation may have another division, for example, a unit or a component may be combined or integrated with another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some interfaces, and may be in an electrical, mechanical or other form.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, a network device, or the like) or a processor (processor) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Claims (10)
1. A dielectric antenna preparation method is characterized by comprising the following steps:
manufacturing an inner support with the same three-dimensional geometric shape as the dielectric antenna;
forming a conductive layer on an inner surface and/or an outer surface of the inner stent;
dividing the outer surface of the conducting layer into a plurality of parts;
manufacturing a plurality of shells corresponding to the outer surface of each part of the conductive layer, wherein the shells are made of dielectric materials;
and bonding the conductive layer with the plurality of shells to form the dielectric antenna.
2. A method for manufacturing a dielectric antenna according to claim 1,
the step of bonding the conductive layer to the plurality of housings comprises:
arranging a filling material on the outer surface of the conductive layer;
adhering a plurality of shells on the surface of the filling material, which faces away from the conductive layer;
wherein the filling material is a wave-absorbing material.
3. The method for manufacturing a dielectric antenna according to claim 1, wherein the conductive layer is a metal layer;
the step of forming a conductive layer on the inner surface and/or the outer surface of the inner stent comprises:
polishing the outer surface of the inner support frame smoothly;
the conductive layer is formed on the outer surface of the inner lead through a plating process or a pasting process.
4. A method for manufacturing a dielectric antenna according to claim 1,
the step of bonding the conductive layer to the plurality of housings comprises:
bonding the shell corresponding to the outer surface of each part of the conductive layer according to the shape of the conductive layer;
and inserting the conductive layer into the bonded shell and fixing.
5. A method for manufacturing a dielectric antenna according to claim 1,
the step of bonding the conductive layer to the housing comprises:
attaching the shell corresponding to each part of the outer surface of the conductive layer to the outer surface of the conductive layer according to the corresponding position;
and adhering and fixing a plurality of shells attached to the outer surface of the conducting layer.
6. A method for manufacturing a dielectric antenna according to claim 1,
the inner support comprises a transmitting section and a feeding section;
the step of dividing the outer surface of the conductive layer into a plurality of parts includes:
dividing an outer surface of the conductive layer into portions in a direction from the feeding section to the emitting section.
7. A method for manufacturing a dielectric antenna according to claim 1,
the inner support comprises a transmitting section and a feeding section;
the step of dividing the outer surface of the conductive layer into a plurality of parts includes:
the outer surface of the conductive layer corresponding to the transmitting section and the feeding section of the inner support is averagely divided into a plurality of parts with equal areas.
8. A method for manufacturing a dielectric antenna according to claim 1,
the thickness of the outer shell is set to one quarter of the wavelength of the electromagnetic signal emitted by the inner support.
9. A method for manufacturing a dielectric antenna according to claim 1,
the preparation method of the dielectric antenna further comprises the following steps:
the dielectric constant of the housing material is determined based on the dielectric constant of the inner support and the dielectric constant of the peripheral space constituted by air.
10. An antenna system comprising a signal processor and a dielectric antenna as claimed in any one of claims 1 to 9.
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| CN202010873848.0A CN112117537B (en) | 2020-08-26 | 2020-08-26 | Antenna system and preparation method of dielectric antenna thereof |
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| CN202010873848.0A CN112117537B (en) | 2020-08-26 | 2020-08-26 | Antenna system and preparation method of dielectric antenna thereof |
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