CN111403912B - Electronic equipment's lid and electronic equipment - Google Patents

Electronic equipment's lid and electronic equipment Download PDF

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Publication number
CN111403912B
CN111403912B CN202010208293.8A CN202010208293A CN111403912B CN 111403912 B CN111403912 B CN 111403912B CN 202010208293 A CN202010208293 A CN 202010208293A CN 111403912 B CN111403912 B CN 111403912B
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Prior art keywords
dielectric layer
sub
cover
feeding
network
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CN111403912A (en
Inventor
郑超
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Priority to CN202010208293.8A priority Critical patent/CN111403912B/en
Publication of CN111403912A publication Critical patent/CN111403912A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

The embodiment of the invention discloses a cover body of electronic equipment and the electronic equipment, relates to the technical field of communication, and can solve the problem of performance reduction of a millimeter wave antenna in the electronic equipment. Wherein, this lid includes: the dielectric layer comprises a first dielectric layer, a second dielectric layer arranged on the first surface of the first dielectric layer and a third dielectric layer arranged on the second dielectric layer, wherein the second dielectric layer is arranged between the first dielectric layer and the third dielectric layer. The second surface of the first dielectric layer is provided with a feed network, and the second surface is arranged opposite to the first surface; the feed network is electrically connected with the coupling feed unit which passes through the second dielectric layer and the first dielectric layer; the third medium layer bears a target radiator, and the coupling feed unit is in coupling connection with the target radiator. The embodiment of the invention is applied to electronic equipment.

Description

Electronic equipment's lid and electronic equipment
Technical Field
The embodiment of the invention relates to the technical field of communication, in particular to a cover body of electronic equipment and the electronic equipment.
Background
With the development of 5G (fifth generation mobile communication) technology, millimeter wave antennas are gradually applied to various electronic devices to meet the data transmission rate requirements of users for the electronic devices.
Currently, in a millimeter wave antenna system, a Power Management Integrated Circuit (PMIC) and a Radio Frequency Integrated Circuit (RFIC) may be packaged into an independent module by an Antenna In Package (AIP) technology, and then the independent module and the millimeter wave antenna are respectively disposed in a housing of an electronic device, so as to implement high-speed data transmission through the independent module and the millimeter wave antenna.
However, in the above millimeter wave antenna system, the independent module and the millimeter wave antenna are disposed in the housing of the electronic device, and the rear cover of the housing may affect the gain of the millimeter wave antenna and the directional pattern of the millimeter wave antenna, so that the coverage area of the millimeter wave antenna is reduced, thereby causing the performance of the millimeter wave antenna in the electronic device to be degraded.
Disclosure of Invention
The embodiment of the invention provides a cover body of electronic equipment and the electronic equipment, which can solve the problem of performance reduction of a millimeter wave antenna in the electronic equipment.
In order to solve the technical problem, the embodiment of the invention adopts the following technical scheme:
in a first aspect of embodiments of the present invention, a cover for an electronic device is provided, where the cover includes: the dielectric layer comprises a first dielectric layer, a second dielectric layer arranged on the first surface of the first dielectric layer and a third dielectric layer arranged on the second dielectric layer, wherein the second dielectric layer is arranged between the first dielectric layer and the third dielectric layer. The second surface of the first dielectric layer is provided with a feed network, and the second surface is arranged opposite to the first surface; the feed network is electrically connected with the coupling feed unit which passes through the second dielectric layer and the first dielectric layer; the third medium layer carries a target radiator, and the coupling feed unit is coupled with the target radiator.
In a second aspect of the embodiments of the present invention, there is provided an electronic device, which includes the cover body as described in the first aspect.
In the embodiment of the present invention, a cover body of an electronic device includes a first dielectric layer, a second dielectric layer, and a third dielectric layer, and a feed network is disposed on the first dielectric layer, and the feed network is electrically connected to a coupling feed unit that passes through the second dielectric layer and the first dielectric layer, and the third dielectric layer carries a target radiator, and the coupling feed unit is coupled to the target radiator. Because the cover body of the electronic device includes a plurality of dielectric layers, and each module (i.e., the feed network, the coupling feed unit, and the target radiator) provided by the plurality of dielectric layers may constitute an antenna unit (i.e., an antenna), that is, the cover body may be regarded as an antenna unit, the influence of the cover body of the electronic device on the coverage of the antenna unit may be avoided, and thus the performance of the antenna unit in the electronic device may be improved.
Drawings
Fig. 1 is a schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 3 is a reflection coefficient diagram of a cover of an electronic device according to an embodiment of the invention;
fig. 4 is a third schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 5 is a fourth schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 6 is a fifth schematic structural view of a cover of an electronic device according to an embodiment of the present invention;
fig. 7 is a simulated directional diagram of a radiated signal of a cover of an electronic device according to an embodiment of the present invention;
fig. 8 is a sixth schematic view illustrating a structure of a cover of an electronic device according to an embodiment of the present invention;
fig. 9A is a seventh schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 9B is an eighth schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 9C is a ninth schematic view illustrating a structure of a cover of an electronic device according to an embodiment of the present invention;
fig. 10A is a tenth of a schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 10B is an eleventh schematic view illustrating a structure of a cover of an electronic device according to an embodiment of the present invention;
fig. 10C is a twelfth schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 10D is a thirteenth schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first" and "second," and the like, in the description and in the claims of embodiments of the present invention are used for distinguishing between different objects and not for describing a particular order of the objects. For example, a first dielectric layer and a second dielectric layer, etc. are used to distinguish between different dielectric layers, rather than to describe a particular order of dielectric layers.
In the description of the embodiments of the present invention, the meaning of "a plurality" means two or more unless otherwise specified. For example, a plurality of elements refers to two elements or more.
The term "and/or" herein is an association relationship describing an associated object, and means that there may be three relationships, for example, a display panel and/or a backlight, which may mean: there are three cases of a display panel alone, a display panel and a backlight together, and a backlight alone. The symbol "/" herein denotes a relationship that an associated object is or, e.g., input/output denotes input or output.
In the embodiments of the present invention, words such as "exemplary" or "for example" are used to mean serving as examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "e.g.," an embodiment of the present invention is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present relevant concepts in a concrete fashion.
Embodiments of the present invention provide a cover body of an electronic device and an electronic device, where the cover body of the electronic device includes a plurality of dielectric layers, and each module (i.e., a feed network, a coupling feed unit, and a target radiator) disposed in the plurality of dielectric layers forms an antenna unit (i.e., an antenna), that is, the cover body can be regarded as an antenna unit, so that an influence of the cover body of the electronic device on a coverage area of the antenna unit can be avoided, and thus performance of the antenna unit in the electronic device can be improved.
The cover body of the electronic equipment and the electronic equipment provided by the embodiment of the invention can be applied to an antenna system.
The cover of the electronic device and the electronic device provided by the embodiment of the invention are described in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
Fig. 1 shows a schematic structural diagram of a cover of an electronic device according to an embodiment of the present invention. As shown in fig. 1, a cover 10 of an electronic device includes: the dielectric layer comprises a first dielectric layer 11, a second dielectric layer 12 arranged on a first surface of the first dielectric layer 11, and a third dielectric layer 13 arranged on the second dielectric layer 12, wherein the second dielectric layer 12 is arranged between the first dielectric layer 11 and the third dielectric layer 13.
In the embodiment of the present invention, a feed network 14 is disposed on the second surface of the first dielectric layer 11, and the second surface is opposite to the first surface; the feed network 14 is electrically connected with a coupling feed unit 15 which passes through the second dielectric layer 12 and the first dielectric layer 11; the third dielectric layer 13 carries a target radiator 16, and the coupling feed unit 15 is coupled to the target radiator 16.
It is understood that the first surface and the second surface are two oppositely-oriented surfaces of the first medium layer 11, that is, the first surface is a surface of the first medium layer 11 contacting with the second medium layer 12 (i.e., a surface facing the second medium layer 12), and the second surface is a surface of the first medium layer 11 facing away from the second medium layer 12.
Optionally, in this embodiment of the present invention, the first dielectric layer 11, the second dielectric layer 12, and the third dielectric layer 13 may be dielectric substrates.
Optionally, in an embodiment of the present invention, the first dielectric layer 11, the second dielectric layer 12, or the third dielectric layer 13 may be made of a non-metal material; the first dielectric layer 11, the second dielectric layer 12, and the third dielectric layer 13 may be made of a ceramic material.
Optionally, in a possible implementation manner of the embodiment of the present invention, the coupling feeding unit 15 includes at least one feeding portion and at least one feeding arm, each feeding portion is electrically connected to one feeding arm, the at least one feeding portion is located in the second dielectric layer 12, the at least one feeding arm is located on a third surface of the second dielectric layer 12, and the third surface is a surface of the second dielectric layer 12, which is in contact with the third dielectric layer 13.
It should be noted that the above-mentioned "at least one feeding arm is located on the third surface of the second dielectric layer 12" may be understood as follows: all parts of each of the at least one feeding arm are positioned on the third surface of the second dielectric layer 12; or a part of each feeding arm in the at least one feeding arm is positioned on the third surface of the second dielectric layer 12; alternatively, all of a portion of the at least one feeding arm may be located on the third surface of the second dielectric layer 12.
Optionally, in an embodiment of the present invention, the at least one feeding arm is an arc-shaped feeding arm, and each feeding arm of the at least one feeding arm is disposed toward the target radiator 16.
It should be noted that the above "each feeding arm is respectively disposed toward the target radiator 16" may be understood as follows: the arc center of each feed arm is located on the side of each feed arm near the target radiator 16.
Illustratively, as shown in fig. 2, the coupling feed unit 15 includes at least one feed portion (e.g., the feed portion 151, the feed portion 152, the feed portion 153, and the feed portion 154) and at least one feed arm (e.g., the circular arc feed arm 155, the circular arc feed arm 156, the circular arc feed arm 157, and the circular arc feed arm 158), the feed portion 151 is electrically connected to the circular arc feed arm 155, the feed portion 152 is electrically connected to the circular arc feed arm 156, the feed portion 153 is electrically connected to the circular arc feed arm 157, and the feed portion 154 is electrically connected to the circular arc feed arm 158; the power feeding unit 151, the power feeding unit 152, the power feeding unit 153, and the power feeding unit 154 are located in the second dielectric layer 12, and the circular arc shaped power feeding arm 155, the circular arc shaped power feeding arm 156, the circular arc shaped power feeding arm 157, and the circular arc shaped power feeding arm 158 are located on the third surface of the second dielectric layer 12.
Optionally, in another possible implementation manner of the embodiment of the present invention, the coupling feeding unit 15 includes at least one feeding portion and at least one feeding arm, each feeding portion is electrically connected to one feeding arm, and the at least one feeding portion and the at least one feeding arm are located in the second dielectric layer 12.
It should be noted that the above-mentioned "at least one feeding arm is located in the second dielectric layer 12" may be understood as follows: the entire portion of each of the at least one feed arm is located in the second dielectric layer 12.
Optionally, in the embodiment of the present invention, arc coupling feeding may be performed by using an arc-shaped feeding arm, so that the arc-shaped feeding arm may perform coupling feeding on the target radiator 16 in an arc coupling feeding manner, so as to improve a bandwidth of the target radiator 16, and thus meet requirements of the target radiator 16 on compatibility of different network system frequency bands.
Exemplarily, fig. 3 shows a reflection coefficient diagram of the target radiator 16 in the embodiment of the present invention, and as shown in fig. 3, the target radiator 16 is fed in an arc coupling manner, so that the bandwidth of the target radiator 16 can reach-10 dB, the-10 dB bandwidth can cover a frequency band of 23GHz-46GHz, and thus the global mainstream 5G millimeter wave frequency band of n257-n261 can be satisfied.
In the embodiment of the invention, at least one arc-shaped feed arm can be arranged to perform coupling feed on the target radiator in an arc coupling feed mode, so that the bandwidth of the target radiator can be improved.
Optionally, in this embodiment of the present invention, the feeding network 14 includes at least one equal power division shift network, two ends of each equal power division shift network are electrically connected to different feeding arms respectively, and each equal power division shift network has a different feeding arm connected to the network.
Optionally, in this embodiment of the present invention, the number of the feed arms included in the coupling feed unit 15 is the same as the total number of the ends of the feed network 14, where the power divider moves to the network.
Illustratively, in conjunction with FIG. 2, as shown in FIG. 4, the feed network 14 includes at least one power divider moving toward the network (e.g., power divider moving toward network 14-1 and power divider moving toward network 14-2), the power divider moving toward one end (e.g., V-) of network 14-1 electrically connected to feed arm 155, the power divider moving toward the other end (e.g., V +) of network 14-2 electrically connected to feed arm 157, the power divider moving toward one end (H-) of network 14-1 electrically connected to feed arm 156, and the power divider moving toward the other end (H +) of network 14-2 electrically connected to feed arm 158.
Optionally, in the embodiment of the present invention, the target radiator 16 may radiate a differential signal with equal amplitude and a phase difference of 180 ° through at least one equal power division to the network.
Optionally, in this embodiment of the present invention, when at least one equal power division direction is towards the network and includes two equal power division directions towards the network, a horizontal signal radiated by the target radiator 16 excited by one equal power division direction towards the network may be used, and a vertical signal radiated by the target radiator 16 excited by another equal power division direction towards the network may be used, so as to implement dual polarization (i.e., orthogonal polarization) of the signal.
In the embodiment of the present invention, when at least two equal power dividers simultaneously operate in the network, a multiple-input multiple-output (MIMO) multi-path signal transmission manner may be formed, so as to improve a transmission rate of a signal.
In the embodiment of the present invention, the feeding network 14 is electrically connected to the coupling feeding unit 15 to feed the coupling feeding unit 15 by a coupling feeding manner, so that the coupling feeding unit 15 can perform coupling feeding to the target radiator 16 by the coupling feeding manner, so that the target radiator 16 generates resonance, and thus the target radiator 16 can radiate signals.
In the embodiment of the invention, the target radiator can be fed differentially to the network through at least one equal power division direction, so that the common mode rejection capability and the anti-interference capability of the target radiator can be improved, and the differential end-to-end isolation and the purity of signal polarization radiated by the target radiator can be improved.
It should be noted that the above-mentioned "the feeding network 14 is electrically connected to the coupling feeding unit 15 passing through the second dielectric layer 12 and the first dielectric layer 11" may be understood as follows: one end of the coupling feeding unit 15 (i.e., one end of each feeding portion) is electrically connected to the feeding network 14 disposed on the second surface of the first dielectric layer 11, and the other end of the coupling feeding unit 15 (i.e., the other end of each feeding portion) is located on the third surface of the second dielectric layer 12.
Optionally, in the embodiment of the present invention, the target radiator 16 (or the target radiating unit) may be disposed in the third dielectric layer 13 or on the surface of the third dielectric layer 13.
Optionally, in an embodiment of the present invention, the target radiator 16 may be a millimeter wave radiator.
Optionally, in this embodiment of the present invention, the target radiator 16 may include at least one of a high-frequency radiator and a low-frequency radiator.
It is understood that the cover 10 has a multi-layer structure, and the first medium layer 11, the second medium layer 12 and the third medium layer 13 have the multi-layer structure of the cover 10. The cover 10 can be regarded as an antenna unit (e.g., millimeter wave antenna).
Optionally, in the embodiment of the present invention, a metal layer is disposed on a fourth surface of the second dielectric layer 12, where the fourth surface is a surface of the second dielectric layer 12, which is in contact with the first dielectric layer 11.
It is understood that the third surface and the fourth surface are two oppositely-oriented surfaces of the second medium layer 12, that is, the third surface is a surface of the second medium layer 12 contacting with the third medium layer 13 (i.e., a surface facing the third medium layer 13), and the fourth surface is a surface of the second medium layer 12 facing the first medium layer 11.
In the embodiment of the present invention, the metal layer may be arranged to reduce the influence of other devices (for example, a device connected to the feeding network 14) in the electronic device on the antenna unit, so as to implement that the boundary condition of the antenna unit is relatively fixed.
The embodiment of the invention provides a cover body of electronic equipment, which comprises a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein a feed network is arranged on the first dielectric layer and is electrically connected with a coupling feed unit penetrating through the second dielectric layer and the first dielectric layer, the third dielectric layer bears a target radiator, and the coupling feed unit is in coupling connection with the target radiator. Because the cover body of the electronic device includes a plurality of dielectric layers, and each module (i.e., the feed network, the coupling feed unit, and the target radiator) provided by the plurality of dielectric layers may constitute an antenna unit (i.e., an antenna), that is, the cover body may be regarded as an antenna unit, the influence of the cover body of the electronic device on the coverage of the antenna unit may be avoided, and thus the performance of the antenna unit in the electronic device may be improved.
Optionally, in the embodiment of the present invention, the cover 10 of the electronic device may include at least one antenna module, and each antenna module includes a first dielectric layer 11, a second dielectric layer 12, and a third dielectric layer 13.
It should be noted that the number of the antenna modules included in the cover 10 and the positions of the antenna modules may be set according to actual use requirements, which is not limited in the embodiment of the present invention.
It can be understood that, in the embodiment of the present invention, the millimeter wave antenna (i.e., the millimeter wave array antenna) is integrated on the cover 10, so that the influence of the surrounding environment and the hand-holding of the user can be reduced to a greater extent, and the performance of the millimeter wave antenna is greatly improved.
Optionally, in an embodiment of the present invention, the third dielectric layer 13 includes at least one first sub-dielectric layer disposed in parallel, and the target radiator 16 includes a sub-radiator carried by each first sub-dielectric layer.
Optionally, in the embodiment of the present invention, each of the first sub-dielectric layers is provided with one sub-radiator, or a fifth surface of each of the first sub-dielectric layers is provided with one sub-radiator, and one fifth surface is a surface of one of the first sub-dielectric layers, which is opposite to the second dielectric layer 12.
Optionally, in this embodiment of the present invention, the sub radiator carried by each first sub dielectric layer may be a millimeter wave radiator, and the sub radiator may be a high frequency radiator or a low frequency radiator.
Optionally, in an embodiment of the present invention, the shape of the sub radiator may be any one of the following shapes: circular, oval, triangular, square, rectangular, diamond, and polygonal. Specifically, the setting may be according to actual use requirements, and the embodiment of the present invention is not limited.
Optionally, in the embodiment of the present invention, in the at least one first sub-dielectric layer, a sub-radiator carried by the first sub-dielectric layer in contact with the second dielectric layer 12 is coupled to the coupling feed unit 15; and any two adjacent sub radiators in the sub radiators carried by each first sub dielectric layer are in coupling connection.
It can be understood that the sub-radiator directly coupled to the coupling feed unit 15 (i.e. the sub-radiator carried by the first sub-dielectric layer in contact with the second dielectric layer 12 in at least one first sub-dielectric layer) may be fed by the coupling feed unit 15, and then the sub-radiator coupled to the sub-radiator is fed by the sub-radiator, and so on until the sub-radiators carried by all the first sub-dielectric layers are fed.
It should be noted that, the fact that the sub radiator feeds power to the sub radiator coupled to the sub radiator may be understood as follows: the sub radiator radiates a signal by radiating the signal so that the sub radiator coupled to the sub radiator resonates, thereby also radiating the signal.
Optionally, in the embodiment of the present invention, any two adjacent sub radiators are oppositely disposed.
It should be noted that the above "any two adjacent sub radiators are disposed oppositely" may be understood as follows: the connecting line of the central point of one sub-radiator and the central point of the other sub-radiator is perpendicular to the plane of the first sub-medium layer.
Exemplarily, referring to fig. 1, as shown in fig. 5, the third dielectric layer 13 includes at least one first sub-dielectric layer (e.g., a dielectric layer 17 and a dielectric layer 18) disposed parallel to each other, one surface of the dielectric layer 17 is in contact with the second dielectric layer 12, the other surface of the dielectric layer 17 is provided with a sub-radiator 19, the other surface of the dielectric layer 17 is in contact with one surface of the dielectric layer 18, and the other surface of the dielectric layer 18 is provided with a sub-radiator 20; the sub-radiator 19 is coupled to the coupling feed unit 15, the sub-radiator 19 is disposed opposite to the sub-radiator 20, and the sub-radiator 19 is coupled to the sub-radiator 20.
Optionally, in this embodiment of the present invention, the cover 10 may further include at least one parasitic unit, and each parasitic unit is disposed through at least one first sub-dielectric layer.
Optionally, in an embodiment of the present invention, each parasitic unit in the at least one parasitic unit is a metal via structure.
It can be understood that the metal via structure is a hollow cylindrical structure.
Optionally, in an embodiment of the present invention, in any one of the first sub-dielectric layers, the at least one parasitic unit is distributed around the sub-radiator carried by the any one of the first sub-dielectric layers.
Optionally, in an embodiment of the present invention, the at least one parasitic unit is uniformly distributed around the sub radiator carried by the first sub dielectric layer.
Exemplarily, referring to fig. 5, as shown in fig. 6, the cover 10 further includes at least one parasitic unit (e.g., a parasitic unit a, a parasitic unit b, a parasitic unit c, a parasitic unit d, a parasitic unit e, a parasitic unit f, a parasitic unit g, and a parasitic unit h), each of the at least one parasitic unit is disposed through at least one first sub-dielectric layer (e.g., the dielectric layer 17 and the dielectric layer 18), and the at least one parasitic unit is uniformly distributed around the sub-radiator 19 and the sub-radiator 20.
In the embodiment of the invention, under the condition that each sub radiator radiates signals, each parasitic unit can generate resonance, so that the beam width of a radiation directional diagram of each sub radiator can be widened, and the coverage angle of array scanning can be increased.
Illustratively, fig. 7 shows a simulated directional diagram of a signal radiated by the target radiator 16 according to an embodiment of the present invention. As shown in fig. 7, the width of the beam corresponding to the signal radiated by the target radiator 16 is 3dB, before the at least one parasitic element is disposed, the coverage angle D of the signal corresponding to the beam with the width of 3dB is 78.2 degrees, and after the at least one parasitic element is disposed, the coverage angle of the signal corresponding to the beam with the width of 3dB is increased to D 1 100.6 degrees.
In the embodiment of the present invention, at least one parasitic unit may penetrate through at least one first sub-dielectric layer, so as to widen a beam width of a radiation pattern of sub-radiators carried by the at least one first sub-dielectric layer, thereby increasing a coverage angle of array scanning and increasing a radiation coverage range of the sub-radiators.
It can be understood that the bandwidth of the antenna unit is increased by the coupling mode, and at the same time, the beam width of the antenna is widened by at least one parasitic unit around the antenna unit, so that better beam scanning characteristics are realized.
Optionally, in this embodiment of the present invention, the third dielectric layer 13 further includes at least one second sub-dielectric layer disposed in parallel, where any second sub-dielectric layer and the first sub-dielectric layer are disposed in parallel; at least one parasitic unit is arranged on the at least one second sub-dielectric layer and penetrates through the at least one second sub-dielectric layer.
It can be understood that each of the at least one first sub-dielectric layer carries one sub-radiator, and each of the at least one second sub-dielectric layer has at least one parasitic unit.
Optionally, in an embodiment of the present invention, one of the at least one first sub-dielectric layer is in contact with the third surface of the second dielectric layer 12, and one of the at least one second sub-dielectric layer is in contact with another one of the at least one first sub-dielectric layer (i.e., the first sub-dielectric layer that is farthest from the one first sub-dielectric layer in the at least one first sub-dielectric layer).
Exemplarily, referring to fig. 1, as shown in fig. 8, the third dielectric layer 13 includes at least one first sub-dielectric layer (e.g., dielectric layer 21) and at least one second sub-dielectric layer (e.g., dielectric layer 22) disposed in parallel, where the dielectric layers 21 and 22 are disposed in parallel; one surface of the dielectric layer 21 is in contact with the second dielectric layer 12, the other surface of the dielectric layer 21 is provided with the sub-radiator 23, the other surface of the dielectric layer 21 is in contact with one surface of the dielectric layer 22, and at least one parasitic unit (for example, a parasitic unit a, a parasitic unit b, a parasitic unit c and a parasitic unit d) is arranged on the dielectric layer 22.
Optionally, in this embodiment of the present invention, one of the at least one second sub-dielectric layer contacts the third surface of the second dielectric layer 12, and one of the at least one first sub-dielectric layer contacts another one of the at least one second sub-dielectric layer (i.e., the second sub-dielectric layer that is farthest from the one second sub-dielectric layer) in the at least one second sub-dielectric layer.
In the embodiment of the present invention, at least one parasitic unit may penetrate through at least one second sub-dielectric layer, so as to widen a beam width of a radiation pattern of sub-radiators carried by at least one first sub-dielectric layer, thereby increasing a coverage angle of array scanning and increasing a radiation coverage range of the sub-radiators.
Optionally, in the embodiment of the present invention, the feed network 14 is attached to and electrically connected to a signal processing module in the electronic device, or the feed network 14 is electrically connected to the signal processing module in the electronic device through a signal transmission line.
Optionally, in this embodiment of the present invention, the signal processing module may be an IC chip, and the IC chip may include a PMIC and an RFIC.
Optionally, in an embodiment of the present invention, the feeding network 14 is electrically connected to an RFIC, and the PMIC is electrically connected to a processor in the electronic device through a connector.
Optionally, in an embodiment of the present invention, the feeding network 14 and the RFIC are electrically connected to the RFIC through a signal transmission line, and the PMIC is electrically connected to a processor in the electronic device through a connector.
Optionally, in the embodiment of the present invention, the signal transmission line may be any one of the following lines: the substrate integrates a waveguide (SIW) and a microstrip line.
Optionally, in the embodiment of the present invention, the cover 10 and the signal processing module may be regarded as an antenna system.
For example, fig. 9A illustrates a layout diagram of an antenna module of the cover 10 according to an embodiment of the present invention. As shown in fig. 9A, the cover 10 includes at least one antenna module (e.g., an antenna module X, an antenna module Y, and an antenna module Z), and the antenna module X, the antenna module Y, and the antenna module Z are located at different positions of the cover 10.
For example, the cover 10 includes an antenna module. Fig. 9B shows a cross-sectional view of the cover 10 according to an embodiment of the present invention, as shown in fig. 9B, the cover 10 includes a first dielectric layer 11, a second dielectric layer 12, and at least one first sub-dielectric layer (e.g., a dielectric layer 17 and a dielectric layer 18) disposed in parallel with each other, the first dielectric layer 11 is disposed with a feeding network 14, the feeding network 14 is electrically connected to a coupling feeding unit 15 passing through the second dielectric layer 12 and the first dielectric layer 11, the dielectric layer 17 is disposed with a sub-radiator 19, the dielectric layer 18 is disposed with a sub-radiator 20, at least one parasitic unit 24 is disposed through the dielectric layer 17 and the dielectric layer 18, and the feeding network 14 is electrically connected to a signal processing module 25 (e.g., a PMIC and an RFIC) in a fitting manner.
As another example, fig. 9C shows a cross-sectional view of the cover 10 provided in the embodiment of the present invention, as shown in fig. 9C, the cover 10 includes a first dielectric layer 11, a second dielectric layer 12, and at least one first sub-dielectric layer (for example, a dielectric layer 17 and a dielectric layer 18), a feeding network 14 is disposed on the first dielectric layer 11, the feeding network 14 is electrically connected to a coupling feeding unit 15 that passes through the second dielectric layer 12 and the first dielectric layer 11, a sub-radiator 19 is disposed on the dielectric layer 17, a sub-radiator 20 is disposed on the dielectric layer 18, at least one parasitic unit 24 is disposed through the dielectric layer 17 and the dielectric layer 18, and the feeding network 14 is electrically connected to a signal processing module 25 in the electronic device through a signal transmission line 26.
It can be understood that the feeding network 14 and the signal processing module may be connected by a signal transmission line, so that the cover 10 (i.e., the antenna unit) and the signal processing module may be staggered in spatial position to reduce the difficulty of stacking the whole device, and the degree of freedom of the layout of the antenna unit may be widened, and the optimal layout position of the antenna unit may be selected without affecting other devices.
Optionally, in the embodiment of the present invention, the cover 10 may be manufactured by a low temperature co-fired ceramic (LTCC) process, and the cover 10 is attached to the signal processing module.
For example, as shown in fig. 10A, the first dielectric layer 11, the second dielectric layer 12, the third dielectric layer 13, the feeding network 14, the coupling feeding unit 15, and the target radiator 16 of the cover 10 may be formed by LTCC; as shown in fig. 10B, the lid body 10 formed by the LTCC process may be welded to the signal processing module 25 by a flip-chip welding process; as shown in fig. 10C, the cover 10 welded to the signal processing module 25 may be milled to a desired shape by a Computer Numerical Control (CNC) process; as shown in fig. 10D, a Color Material Finish (CMF) surface treatment may be performed on the cap body 10 by the CNC process to form a color coating layer 27, so as to complete the fabrication of the cap body 10.
It can be understood that in the embodiment of the present invention, the millimeter wave antenna unit and the cover 10 may be integrated by using an LTCC process to form a structural relationship of the antenna unit, that is, the cover 10, so that the influence of the cover 10 on the performance of the antenna unit is solved, and meanwhile, the space required by the antenna unit is saved, so as to improve the competitiveness of the product.
Optionally, in the embodiment of the present invention, the cover 10 (i.e., the antenna unit) may be applied to a Wireless Wide Area Network (WWAN), a Wireless Local Area Network (WLAN), Radio Frequency Identification (RFID), Near Field Communication (NFC), or wireless charging. Fig. 11 shows a schematic diagram of a possible structure of an electronic device involved in the embodiment of the present invention. As shown in fig. 11, the electronic device 50 may include: the cover 10 in the above embodiment.
Optionally, in this embodiment of the present invention, the electronic device may be a mobile electronic device, and may also be a non-mobile electronic device. For example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, a personal game machine, a smart watch, an electronic camera device, a Personal Digital Assistant (PDA), or the like, and the non-mobile electronic device may be a Personal Computer (PC), a television (television), a teller machine, a self-service machine, or the like, and embodiments of the present invention are not limited in particular.
Optionally, in this embodiment of the present invention, the electronic device may further include a signal processing module, and the feeding network 14 in the cover 10 is connected to the signal processing module (for example, electrically connected in a bonding manner or connected through a signal transmission line).
An embodiment of the present invention provides an electronic device, which includes a cover, and since the cover includes a plurality of dielectric layers, and each module (i.e., a feed network, a coupling feed unit, and a target radiator) disposed in the plurality of dielectric layers forms an antenna unit (i.e., an antenna), that is, the cover can be regarded as an antenna unit, an influence of the cover of the electronic device on a coverage area of the antenna unit can be avoided, so that a performance of the antenna unit in the electronic device can be improved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling an electronic device (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A cover for an electronic device, the cover serving as an antenna unit of the electronic device, the cover comprising: the dielectric layer comprises a first dielectric layer, a second dielectric layer arranged on the first surface of the first dielectric layer and a third dielectric layer arranged on the second dielectric layer, wherein the second dielectric layer is arranged between the first dielectric layer and the third dielectric layer;
a feed network is arranged on a second surface of the first dielectric layer, and the second surface is opposite to the first surface; the feed network is electrically connected with a coupling feed unit passing through the second dielectric layer and the first dielectric layer; the third medium layer bears a target radiator, and the coupling feed unit is in coupling connection with the target radiator; the coupling feed unit comprises at least one feed arm, the at least one feed arm is an arc-shaped feed arm, and each arc-shaped feed arm in the at least one feed arm is arranged towards the target radiator; the first dielectric layer, the second dielectric layer or the third dielectric layer may be made of a non-metallic material;
a metal layer is arranged on a fourth surface of the second medium layer, and the fourth surface is a surface, in contact with the first medium layer, of the second medium layer.
2. The cover according to claim 1, wherein the third dielectric layer includes at least one first sub-dielectric layer disposed parallel to each other, and the target radiator includes sub-radiators carried by each first sub-dielectric layer; in the at least one first sub-dielectric layer, a sub-radiator carried by the first sub-dielectric layer in contact with the second dielectric layer is coupled with the coupling feed unit; and any two adjacent sub-radiators in the sub-radiators carried by each first sub-dielectric layer are in coupling connection.
3. The cover of claim 2, further comprising at least one parasitic element, each parasitic element disposed through the at least one first sub-dielectric layer.
4. The cover body of claim 2, wherein the third dielectric layer further comprises at least one second sub-dielectric layer arranged in parallel with each other, and any second sub-dielectric layer is arranged in parallel with any first sub-dielectric layer; at least one parasitic unit is arranged on the at least one second sub-dielectric layer and penetrates through the at least one second sub-dielectric layer.
5. A cover as claimed in claim 3 or 4, wherein each parasitic element is a metal via structure.
6. The cover according to claim 3 or 4, wherein in any one of the first sub-dielectric layers, the at least one parasitic element is distributed around a sub-radiator carried by the any one of the first sub-dielectric layers.
7. The cover according to claim 1, wherein the coupling feeding unit further includes at least one feeding portion, each feeding portion is electrically connected to one feeding arm, the at least one feeding portion is located in the second dielectric layer, the at least one feeding arm is located on a third surface of the second dielectric layer, and the third surface is a surface of the second dielectric layer, which is in contact with the third dielectric layer.
8. The cover body according to claim 7, wherein the power feeding network comprises at least one equal power division direction network, two ends of each equal power division direction network are respectively electrically connected with different power feeding arms, and each equal power division direction network is different from the power feeding arm connected with the power feeding network.
9. The cover body according to claim 1, wherein the feeding network is attached to and electrically connected with a signal processing module in the electronic device, or the feeding network is electrically connected with the signal processing module in the electronic device through a signal transmission line.
10. An electronic device characterized in that it comprises a cover as claimed in any one of claims 1 to 9.
CN202010208293.8A 2020-03-23 2020-03-23 Electronic equipment's lid and electronic equipment Active CN111403912B (en)

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TWI830381B (en) * 2022-09-14 2024-01-21 泓博無線通訊技術有限公司 Millimeter wave antenna for dual-polarized operation

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CN102686060A (en) * 2012-05-23 2012-09-19 上海华勤通讯技术有限公司 Housing of mobile terminal and manufacturing method as well as mobile terminal thereof
CN105514584A (en) * 2016-01-18 2016-04-20 西安爱生技术集团公司 Vertical polarization C-waveband broadband short backfire antenna
CN106785408A (en) * 2017-01-24 2017-05-31 桂林电子科技大学 Broadband low section omnidirectional circular-polarized antenna
CN210040532U (en) * 2019-06-25 2020-02-07 广东盛路通信科技股份有限公司 Broadband navigation antenna

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CN102686060A (en) * 2012-05-23 2012-09-19 上海华勤通讯技术有限公司 Housing of mobile terminal and manufacturing method as well as mobile terminal thereof
CN105514584A (en) * 2016-01-18 2016-04-20 西安爱生技术集团公司 Vertical polarization C-waveband broadband short backfire antenna
CN106785408A (en) * 2017-01-24 2017-05-31 桂林电子科技大学 Broadband low section omnidirectional circular-polarized antenna
CN210040532U (en) * 2019-06-25 2020-02-07 广东盛路通信科技股份有限公司 Broadband navigation antenna

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