CN112117392A - Display substrate, preparation method thereof and display device - Google Patents

Display substrate, preparation method thereof and display device Download PDF

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Publication number
CN112117392A
CN112117392A CN202011009843.XA CN202011009843A CN112117392A CN 112117392 A CN112117392 A CN 112117392A CN 202011009843 A CN202011009843 A CN 202011009843A CN 112117392 A CN112117392 A CN 112117392A
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light
polymer
structure layer
polymer film
emitting structure
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Chinese (zh)
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苗湘
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/854Arrangements for extracting light from the devices comprising scattering means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The embodiment of the invention provides a display substrate, a preparation method thereof and a display device.

Description

Display substrate, preparation method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.
Background
The quantum dot is a semiconductor nanocrystal which can be processed by solution, has the advantages of narrow light-emitting spectrum, adjustable light-emitting wavelength, high spectral purity and the like, and is expected to become a core part of a next-generation light-emitting device. Quantum Dot Light Emitting Diodes (QLEDs) are manufactured by using Quantum dots as a material for manufacturing a Light Emitting layer, and the Light Emitting layer is introduced between different conductive materials to obtain Light with a required wavelength. The QLED has the advantages of high color gamut, self-luminescence, low starting voltage, high response speed, long service life and the like.
In the QLED device, the low light extraction efficiency is a decisive factor for the low external quantum efficiency of the device. According to the geometrical optics principle, only about 20% of the generated light in the device can be emitted through the external mode due to the different refractive indexes of the film layers in the device, and the other 30% and 50% of the generated light are respectively left in the substrate mode and the ITO-organic layer waveguide mode and are emitted from the inner part of the device or the edge of the device.
Disclosure of Invention
Through the substrate modification technology, light in the QLED device can be extracted, so that the light emitting efficiency of the device is improved, and the performance of the device is improved. The extraction method of light in the QLED device comprises the following steps: scattering dielectric layers, microprism arrays, microcavity effects, photonic crystals, and the like. The improvement of the light extraction efficiency is mainly started from the aspects of reducing the non-luminous mode, reducing the total reflection, reducing the waveguide effect and the like. Techniques for extracting light in a QLED device can be divided into three types: substrate external modification, substrate internal modification and device structure optimization. Among them, changing the optical path by using scattering is an effective method for increasing the light extraction efficiency.
The scattering medium layer has low cost, easy preparation and obvious effect, is suitable for large-area production and is a method with potential application value. The scattering medium layer is ZrO2Or a white phosphor as the scattering medium. The scattering medium layer improves the luminous efficiency of the device by 40 percent. The increase in efficiency is somewhat different from the theoretical value, indicating that much of the excess light remains confined to the device.
The embodiment of the invention provides a display substrate which comprises a substrate base plate and a light-emitting structure layer arranged on the substrate base plate, wherein a rough surface is arranged on one side of a light-emitting surface of the light-emitting structure layer, and the rough surface is used for emitting light emitted by the light-emitting structure layer in a scattered light mode.
In an exemplary embodiment, the rough surface is disposed on a surface of the substrate on a side away from the light emitting structure layer; or the rough surface is arranged on the surface of the substrate close to the light-emitting structure layer.
In an exemplary embodiment, the light emitting device further comprises a cover plate arranged on the light emitting structure layer, and the rough surface is arranged on the surface of the cover plate on the side far away from the light emitting structure layer; or the rough surface is arranged on the surface of the cover plate close to one side of the light-emitting structure layer.
In an exemplary embodiment, the rough surface includes a plurality of micro-nano structures in a triangular pyramid shape or a plurality of micro-nano structures in a cylindrical shape.
The embodiment of the invention also provides a display device which comprises the display substrate.
The embodiment of the invention also provides a preparation method of the display substrate, which comprises the following steps:
forming a substrate and a light emitting structure layer;
and forming a rough surface on one side of the light emitting surface of the light emitting structure layer, wherein the rough surface is used for emitting light emitted by the light emitting structure layer in a scattered light mode.
In an exemplary embodiment, forming a rough surface on a light emitting surface side of the light emitting structure layer includes:
forming a polymer solution comprising at least two different polymers;
coating the polymer solution on one side of the light-emitting surface of the light-emitting structure layer to form a polymer film;
forming a specific pattern of at least one polymer in the polymer film;
and removing other polymers in the polymer film through an etching process to enable the specific pattern to form the rough surface.
In an exemplary embodiment, the polymer solution is a polymer blend solution, and at least one polymer in the polymer film is formed into a specific pattern, including:
and standing the polymer film to separate at least one polymer in the polymer film from other polymers in the polymer film, wherein at least one polymer in the polymer film forms the specific pattern.
In an exemplary embodiment, the polymer solution is a block copolymer solution, and at least one polymer in the polymer film is formed into a specific pattern, including:
applying at least two annealing temperatures to the polymer film to separate at least one polymer in the polymer film from other polymers in the polymer film, the at least one polymer in the polymer film forming the specific pattern.
In an exemplary embodiment, forming a rough surface over a light emitting surface side of the light emitting structure layer includes:
forming a polymer solution, said polymer solution comprising a polymer;
coating the polymer solution on one side of the light-emitting surface of the light-emitting structure layer to form a polymer film;
carrying out micro-nano processing on the polymer film through etching to enable the polymer film to form the rough surface
The invention provides a display substrate, a preparation method thereof and a display device, wherein a rough surface is arranged on one side of a light-emitting surface of a light-emitting structure layer, so that light emitted by the light-emitting structure layer is scattered at the rough surface, the randomness of angle distribution of scattered light enables a large part of light to be emitted, the probability that the light forms total reflection light on one side of the light-emitting surface of the light-emitting structure layer is reduced, the light within the range of the total reflection angle is transmitted to the air in the form of scattered light through the rough surface, and the light-emitting efficiency of the display substrate is improved.
Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the embodiments of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention. The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
Fig. 1 is a schematic structural diagram of a display substrate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of light exiting from a display substrate;
fig. 3 is a schematic diagram of light emergence in a display substrate according to an embodiment of the present invention;
FIG. 4 is a schematic view of a substrate after forming a substrate base according to an embodiment of the invention;
FIG. 5 is a schematic representation of a polymer film after formation of an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating a specific pattern formed according to an embodiment of the present invention;
FIG. 7 is a schematic view of the rough surface formed according to the embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The embodiment of the invention provides a display substrate which comprises a substrate base plate and a light-emitting structure layer arranged on the substrate base plate, wherein a rough surface is arranged on one side of a light-emitting surface of the light-emitting structure layer, and the rough surface is used for emitting light rays emitted by the light-emitting structure layer in a scattered light mode.
The display substrate provided by the embodiment of the invention has the advantages that the rough surface is arranged on one side of the light-emitting surface of the light-emitting structure layer, so that light emitted by the light-emitting structure layer is scattered at the rough surface, the randomness of the angle distribution of scattered light enables a large part of light to be emitted, the probability that the light forms total reflection light on one side of the light-emitting surface of the light-emitting structure layer is reduced, the light within the range of the total reflection angle is transmitted to the air in the form of scattered light through the rough surface, and the light-emitting efficiency of the display substrate is improved
The technical solution of the embodiment of the present invention is explained in detail by the specific embodiment below.
Fig. 1 is a schematic structural diagram of a display substrate according to an embodiment of the present invention. As shown in fig. 1, the display substrate according to the embodiment of the invention is a quantum dot light emitting diode display substrate, and includes a substrate 10 and a light emitting structure layer 20 formed on the substrate 10. The light emitting structure layer 20 is used for emitting display light. The light emitting structure layer 20 includes an anode 201, a cathode 202, and a light emitting function layer 203 disposed between the anode 201 and the cathode 202, which are oppositely disposed. The light-emitting functional layer 203 includes at least a light-emitting layer, and the light-emitting layer may be made of quantum dot material. The light-emitting functional layer 203 may further include functional film layers such as a hole transport layer, a hole injection layer, an electron transport layer, and an electron injection layer. This embodiment is not described herein.
As shown in fig. 1, a rough surface 30 is disposed on one side of the light emitting surface of the light emitting structure layer 20, and the rough surface 30 is used for emitting the light emitted from the light emitting structure layer 20 in a form of scattered light, so as to improve the light emitting efficiency of the display substrate. The rough surface 30 may be disposed on the inner surface and/or the outer surface of any one of the layers on the light emitting surface side of the light emitting structure layer 20. The rough surface 30 can roughen the surface of the film layer on the light emitting surface side of the light emitting structure layer 20.
As shown in fig. 1, the display substrate of the present embodiment is top-emitting. The display substrate of the embodiment further includes a cover plate 40 disposed on the light emitting structure layer 20, and the rough surface 30 is disposed on a surface of the cover plate 40 away from the light emitting structure layer 20. After the surface of the cover plate 40 is roughened by the rough surface 30, the rough surface 30 forms a plurality of protrusions on the surface of the cover plate 40, and the protrusions enable the incident angle of light entering the cover plate 40 to be smaller than the critical angle, so that the light can be refracted by the protrusions. When the roughness of the rough surface 30 is larger, especially when the protrusions form a pattern of micro-nano structures, for example, the rough surface 30 includes a plurality of micro-nano structures in a triangular pyramid shape or a plurality of micro-nano structures in a cylindrical shape. The rough surface 30 can provide more micro light-emitting planes, so that the probability that light is refracted instead of totally reflected at the rough surface 30 is increased, and the light-emitting efficiency is improved.
In the embodiment, the rough surface 30 can effectively extract the light limited in the display substrate, and eliminate the influence of the microcavity effect when the light is emitted from the display substrate, so that the half-height width and the chromaticity coordinate value of the light-emitting spectrum of the display substrate are very small along with the change of the angle, and the light-emitting uniformity of the display substrate is improved.
In an embodiment, in the case where the light emitting manner of the display substrate is top emission, the anode may be a transparent electrode or a semitransparent electrode. The type and material of the anode are not limited. For example, the anode may be formed of a transparent conductive material having a high work function, and an electrode material thereof may include Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Indium Gallium Oxide (IGO), Gallium Zinc Oxide (GZO), zinc oxide (ZnO), indium oxide (In2O3), Aluminum Zinc Oxide (AZO), carbon nanotubes, and the like. The cathode may be formed of a material having high conductivity and low work function, for example, the material of the cathode 152 may include magnesium aluminum alloy (MgAl), lithium aluminum alloy (LiAl), or the like, or a single metal such as magnesium, aluminum, lithium, silver, or the like.
In an exemplary embodiment, the light emitting manner of the display substrate of the present embodiment is top emission. The rough surface may be disposed on a surface of the cover plate near a side of the light emitting structure layer, which is not described herein again.
In an exemplary embodiment, the light emitting manner of the display substrate of the present embodiment is bottom emission. The rough surface can be arranged on the surface of one side of the substrate base plate far away from the light-emitting structure layer; alternatively, the rough surface may be disposed on a surface of the substrate near the light emitting structure layer, which is not described herein again.
Fig. 2 is a schematic diagram of light emergence in a display substrate. As shown in fig. 2, a rough surface is not disposed on the light-emitting surface side of the light-emitting structure layer in the display substrate 1, light emitted by the light-emitting structure layer is totally reflected on the light-emitting surface side, and light greater than the critical angle is totally emitted inside the device and cannot be emitted into the air.
Fig. 3 is a schematic diagram of light exiting from a display substrate according to an embodiment of the invention. As shown in fig. 3, a rough surface 30 is disposed on one side of the light-emitting surface of the light-emitting structure layer in the display substrate 1, and the rough surface 30 can break through the limitation of the total reflection angle, so that more light can be emitted from the display substrate 1, thereby improving the light-emitting efficiency of the display substrate 1. The rough surface 30 can make the total reflection light exit in the form of scattered light, so that the probability of total emission of the light is reduced, and the light limited in the display substrate 1 can be effectively extracted. The rough surface 30 can make the light dynamics become disordered and the optical phase space distribution become ergodic, so that more light rays inside the display substrate 1 can escape from the escape angle, and the light extraction function is achieved. For the display substrate 1, when the light emitting region is located in a resonant cavity formed by a total reflection film and a semi-reflection film, and the cavity length and the wavelength of light are in the same order of magnitude, light with a specific wavelength can be selected and enhanced, and the spectrum is narrowed, that is, the microcavity effect occurs. Due to the scattering effect of the rough surface 30, the influence of the microcavity effect when the light is emitted from the display substrate 1 is weakened, so that the half-peak width and the chromaticity coordinate value of the light-emitting spectrum of the display substrate 1 are slightly changed with the angle, and the light-emitting uniformity of the display substrate 1 is improved.
The embodiment also provides a process for manufacturing a display substrate, including:
forming a substrate and a light emitting structure layer;
and forming a rough surface on one side of the light emitting surface of the light emitting structure layer, wherein the rough surface is used for emitting light emitted by the light emitting structure layer in a scattered light mode.
In an exemplary embodiment, forming a rough surface on a light emitting surface side of the light emitting structure layer includes:
forming a polymer solution comprising at least two different polymers;
coating the polymer solution on one side of the light-emitting surface of the light-emitting structure layer to form a polymer film;
forming a specific pattern of at least one polymer in the polymer film;
and removing other polymers in the polymer film through an etching process to enable the specific pattern to form the rough surface.
In an exemplary embodiment, the polymer solution is a polymer blend solution, and at least one polymer in the polymer film is formed into a specific pattern, including:
and standing the polymer film to separate at least one polymer in the polymer film from other polymers in the polymer film, wherein at least one polymer in the polymer film forms the specific pattern.
In an exemplary embodiment, the polymer solution is a block copolymer solution, and at least one polymer in the polymer film is formed into a specific pattern, including:
applying at least two annealing temperatures to the polymer film to separate at least one polymer in the polymer film from other polymers in the polymer film, the at least one polymer in the polymer film forming the specific pattern.
Fig. 4 to fig. 7 are schematic diagrams of a display substrate preparation process provided in this embodiment. The method for forming the rough surface on the light-emitting surface side of the light-emitting structure layer comprises the following steps:
1) forming a base substrate 10, as shown in fig. 4;
2) a polymer solution is formed. Forming the polymer solution comprises: at least two different polymers are mixed to form a polymer solution. In particular, the polymer solution is a polymer blend. The polymer solution comprises two polymers, polyphenylsilsesquioxane (PPSQ) and Polystyrene (PS). Two Polymers of Polyphenyl Silsesquioxane (PPSQ) and Polystyrene (PS) are mixed in a mass ratio of 1: 1 to 1: 5, and the total concentration of the two polymers in the polymer solution is 3-10% (mass fraction). For example, the total concentration of polyphenylsilsesquioxane (PPSQ) and Polystyrene (PS) in the polymer solution is 4% (mass fraction), and the mass ratio of the two Polymers Polyphenylsilsesquioxane (PPSQ) and Polystyrene (PS) is 1: 1 in a ratio of 1.
In an exemplary embodiment, the polymer solution may also include both Polystyrene (PS) and Polymethylmethacrylate (PMMA) polymers.
3) And spin-coating or spray-coating the polymer solution on the surface of the substrate to form a polymer film. Wherein the thickness of the polymer film is 20nm-300 nm. Specifically, the polymer solution was spin-coated on the surface of the substrate base plate 10, and the polymer thin film 50 was formed by spin-coating at 3000rpm for 40 seconds, as shown in fig. 5.
4) Forming a specific pattern on one polymer in the polymer film. Forming a specific pattern of one of the polymers in the polymer film includes: the polymer film 50 is left standing for 24 hours, so that the polymer film 50 forms a phase separation morphology that a continuous Polystyrene (PS)60 phase wraps an isolated polyphenylsilsesquioxane (PPSQ)70 phase, and the isolated polyphenylsilsesquioxane (PPSQ)70 is in a cylindrical micro-nano structure and has a height of less than 100nm, as shown in FIG. 6.
5) The Polystyrene (PS) in the polymer film is etched away by an etching process, leaving polyphenylsilsesquioxane (PPSQ) such that the cylindrical micro-nano structure formed by the polyphenylsilsesquioxane (PPSQ) serves as the rough surface 30. In particular, taking dry etching as an example, O2The plasma has high selectivity to Polystyrene (PS), and can selectively etch the PS. By the use of O2Plasma etching of polymer films, O2The plasma flow rate was 10-40sccm, the etching time was 40s, the RIE power was 40W, PS in the polymer film was etched away, and PPSQ in the polymer film was retained, so that PPSQ formed a rough surface 30 pattern, as shown in fig. 7.
In the embodiment, the polymer solutions with different concentrations and different proportions are used, and different process conditions are adopted, so that the specific pattern can be adjusted and finally formed.
In an exemplary embodiment, the polymer solution is a block copolymer solution, and the polymer solution is coated on the light emitting surface side of the light emitting structure layer to form the polymer film. At least two annealing temperatures are applied to the polymer film to cause at least one polymer in the polymer film to phase separate from other polymers in the polymer film, the at least one polymer in the polymer film forming a specific pattern. For example, at least one polymer in the polymer film is formed into different shapes such as a layer shape and a linear shape. And then removing other polymers in the polymer film by etching, and reserving the polymers forming the specific pattern in the polymer film to enable the specific pattern to form a rough surface. Taking polymer solution comprising two polymers of Polystyrene (PS) and polymethyl methacrylate (PMMA) as an example, after a polymer film is formed by spin coating, slowly volatilizing a solvent in the polymer film at room temperature to enable the PS to form a column shape and enable the PMMA to form a micro pattern of a continuous phase; and raising the temperature to enable the PMMA to gradually form a layer, and finally forming a layer-shaped and column-shaped mixed micro pattern, namely forming the PMMA into a layer shape and forming the PS into a column shape.
In the embodiment, the rough surface of the micro-nano structure is prepared on the substrate or the film layer by using processing methods such as dry etching, wet etching and the like, so that the pattern and the size of the rough surface of the micro-nano structure can be effectively adjusted, and different rough surfaces can be prepared for different devices.
In exemplary embodiments, the polymer solution may also be a single component polymer solution in embodiments, i.e., the polymer solution includes one polymer; coating the polymer solution on one side of the light-emitting surface of the light-emitting structure layer to form a polymer film; and carrying out micro-nano processing on the polymer film through etching to enable the polymer film to form a micro-nano structure, wherein the micro-nano structure is used as a rough surface.
The embodiment of the invention also provides a display device which comprises the display substrate. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A display substrate is characterized by comprising a substrate base plate and a light emitting structure layer arranged on the substrate base plate, wherein a rough surface is arranged on one side of a light emitting surface of the light emitting structure layer, and the rough surface is used for emitting light emitted by the light emitting structure layer in a scattered light mode.
2. The display substrate according to claim 1, wherein the rough surface is disposed on a surface of the substrate on a side away from the light emitting structure layer; or the rough surface is arranged on the surface of the substrate close to the light-emitting structure layer.
3. The display substrate according to claim 1, further comprising a cover plate disposed over the light emitting structure layer, wherein the rough surface is disposed on a surface of the cover plate on a side away from the light emitting structure layer; or the rough surface is arranged on the surface of the cover plate close to one side of the light-emitting structure layer.
4. The display substrate of claim 1, wherein the rough surface comprises a plurality of triangular pyramidal micro-nano structures or a plurality of cylindrical micro-nano structures.
5. A display device comprising the display substrate according to any one of claims 1 to 4.
6. A method for preparing a display substrate is characterized by comprising the following steps:
forming a substrate and a light emitting structure layer;
and forming a rough surface on one side of the light emitting surface of the light emitting structure layer, wherein the rough surface is used for emitting light emitted by the light emitting structure layer in a scattered light mode.
7. The method of claim 6, wherein forming a rough surface on a light emitting surface of the light emitting structure layer comprises:
forming a polymer solution comprising at least two different polymers;
coating the polymer solution on one side of the light-emitting surface of the light-emitting structure layer to form a polymer film;
forming a specific pattern of at least one polymer in the polymer film;
and removing other polymers in the polymer film through an etching process to enable the specific pattern to form the rough surface.
8. The method for preparing a display substrate according to claim 7, wherein the polymer solution is a polymer blend solution, and the step of forming at least one polymer in the polymer film into a specific pattern comprises:
and standing the polymer film to separate at least one polymer in the polymer film from other polymers in the polymer film, wherein at least one polymer in the polymer film forms the specific pattern.
9. The method for manufacturing a display substrate according to claim 7, wherein the polymer solution is a block copolymer solution, and the step of forming at least one polymer in the polymer film into a specific pattern comprises:
applying at least two annealing temperatures to the polymer film to separate at least one polymer in the polymer film from other polymers in the polymer film, the at least one polymer in the polymer film forming the specific pattern.
10. The method of claim 6, wherein forming a rough surface on the light emitting surface side of the light emitting structure layer comprises:
forming a polymer solution, said polymer solution comprising a polymer;
coating the polymer solution on one side of the light-emitting surface of the light-emitting structure layer to form a polymer film;
and carrying out micro-nano processing on the polymer film through etching to enable the polymer film to form the rough surface.
CN202011009843.XA 2020-09-23 2020-09-23 Display substrate, preparation method thereof and display device Pending CN112117392A (en)

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Citations (7)

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US20040227446A1 (en) * 2003-02-26 2004-11-18 Akira Fujimoto Display device and method of manufacturing transparent substrate for display device
CN1819290A (en) * 2005-02-10 2006-08-16 株式会社东芝 White led and manufacturing method therefor
US20130056711A1 (en) * 2011-09-06 2013-03-07 Electronics And Telecommunications Research Institute Organic light emitting diodes and methods of manufacturing the same
CN103928489A (en) * 2013-08-02 2014-07-16 厦门天马微电子有限公司 Organic light-emitting diode display panel and forming method thereof
US20150123093A1 (en) * 2012-04-30 2015-05-07 Osram Oled Gmbh Organic Light-Emitting Component and Method for Producing an Organic Light-Emitting Component
CN105800550A (en) * 2016-04-06 2016-07-27 南京大学 Method for preparing nano-structure by utilizing blended polymer phase separation
CN106684217A (en) * 2017-01-17 2017-05-17 Tcl集团股份有限公司 Light-emitting device substrate and preparation method thereof and light-emitting device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040227446A1 (en) * 2003-02-26 2004-11-18 Akira Fujimoto Display device and method of manufacturing transparent substrate for display device
CN1819290A (en) * 2005-02-10 2006-08-16 株式会社东芝 White led and manufacturing method therefor
US20130056711A1 (en) * 2011-09-06 2013-03-07 Electronics And Telecommunications Research Institute Organic light emitting diodes and methods of manufacturing the same
US20150123093A1 (en) * 2012-04-30 2015-05-07 Osram Oled Gmbh Organic Light-Emitting Component and Method for Producing an Organic Light-Emitting Component
CN103928489A (en) * 2013-08-02 2014-07-16 厦门天马微电子有限公司 Organic light-emitting diode display panel and forming method thereof
CN105800550A (en) * 2016-04-06 2016-07-27 南京大学 Method for preparing nano-structure by utilizing blended polymer phase separation
CN106684217A (en) * 2017-01-17 2017-05-17 Tcl集团股份有限公司 Light-emitting device substrate and preparation method thereof and light-emitting device

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