CN112060376A - Silicon chip wire cut electrical discharge machining convenient to adjust - Google Patents
Silicon chip wire cut electrical discharge machining convenient to adjust Download PDFInfo
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- CN112060376A CN112060376A CN201910499018.3A CN201910499018A CN112060376A CN 112060376 A CN112060376 A CN 112060376A CN 201910499018 A CN201910499018 A CN 201910499018A CN 112060376 A CN112060376 A CN 112060376A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of silicon wafer cutting equipment, and discloses a silicon wafer wire cutting machine convenient to adjust. This silicon chip wire cut electrical discharge machining convenient to adjust makes T shape screw rod take the toper piece towards the direction motion of keeping away from the volleyball wheel axle center through loosening T shape screw rod, lead to the toper piece to break away from gradually with the contact of ejector pad, at this moment the spring resets and takes ejector pad and spacer pin to move towards the direction of keeping away from the processing roller, until spacer pin and processing roller separation, then just can adjust the distance between two adjacent volleyball wheels through the position of slip volleyball wheel on the processing roller, lead to the winding to follow the regulation in the distance between the cutting steel wire on the volleyball wheel, the advantage that cutting thickness is adjustable has been possessed.
Description
Technical Field
The invention relates to the technical field of silicon wafer cutting equipment, in particular to a silicon wafer wire cutting machine convenient to adjust.
Background
At present, the silicon wafer cutting method has two types of inner circle cutting and free abrasive grain multi-line cutting, and the fixed abrasive grain wire saw is essentially the inner circle cutting which uses a linear cutter to replace a ring-shaped cutter, in the two cutting methods, the former is the traditional silicon wafer processing method, the defect is that the material utilization rate is only 40% -50%, meanwhile, due to the structural limitation, the method can not process the silicon wafer with the diameter more than 200mm, the latter is a novel silicon wafer cutting technology developed in recent years, the silicon wafer is cut by driving a silicon carbide abrasive to carry out grinding processing through a series of steel wires, and compared with the former, the multi-line cutting has the advantages of high cutting efficiency, small cutter loss, low cost, good slicing surface quality, large processable silicon ingot diameter, large number of silicon wafers processed each time and the like.
The multi-wire cutting technology is a relatively advanced silicon chip processing technology in the world at present, the cutting principle of the multi-wire cutting machine is that a high-speed moving steel wire drives cutting abrasive attached to the steel wire to rub hard and brittle materials such as semiconductors and the like, so as to achieve the cutting effect, the multi-wire cutting machine mainly comprises a wire receiving and releasing roller, a processing roller, a guide wheel system, a tension control system, a workbench feeding system and a mortar supply system, a series of grooves with certain depth are engraved in parallel on the processing roller according to the cutting width requirement, the steel wire is wound on the grooves to form a metal wire net consisting of a plurality of parallel metal wires, the grooves can ensure that the steel wire is always parallel and not deviated in the processing process, a motor drives the processing roller during processing, the processing roller drives the steel wire wound on the processing roller, so that the steel wire at the processing section part does unidirectional or reciprocating motion, and the, because the groove on the processing roller is fixed, only the silicon wafer with the specified thickness can be cut, if the processing roller needs to be replaced and the groove needs to be opened again for processing the silicon wafers with different thicknesses, the production efficiency is reduced, materials are wasted, and the production cost is increased.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the silicon wafer wire cutting machine convenient to adjust, which has the advantage of adjustable cutting thickness and solves the problems that the conventional silicon wafer wire cutting machine can only cut silicon wafers with specified thickness because the groove on the processing roller is fixed, and if the processing roller needs to be replaced and the groove needs to be newly formed for processing the silicon wafers with different thicknesses, the production efficiency is reduced, materials are wasted, and the production cost is increased.
(II) technical scheme
In order to achieve the purpose of adjusting the cutting thickness, the invention provides the following technical scheme: the utility model provides a silicon chip wire cutting machine convenient to adjust, the on-line screen storage device comprises a base, the top fixed mounting of base has the fuselage, the top fixed mounting of base has electric putter, electric putter's top fixed mounting has the workstation, the inside fixed mounting of workstation has the support frame, the inside intercommunication of workstation has one end to run through and extend to the blow off pipe of workstation bottom, the front side movable mounting of fuselage has the paying out roll and receives the line roller, the front side fixed mounting of fuselage has the liquid reserve tank, the front side fixed mounting of liquid reserve tank has the injection pipe, the front side movable mounting of fuselage has the guide pulley of two, the front side movable mounting of liquid reserve tank has the processing roller of three in quantity, the front side fixed mounting of fuselage has the motor, the output and the upside of motor processing roller fixed connection, the outside sliding connection of processing roller has the wire arranging wheel, the outside fixed mounting of paying out roll has one end to twine, Wire arrangement wheel, left side on the three processing roller the cutting steel wire of guide pulley and receipts line roller, cutting steel wire and receipts line roller fixed connection, the lock chamber has been seted up to the inside of wire arrangement wheel, the inside sliding connection in lock chamber has the ejector pad, the inside fixed mounting in lock chamber has one end and ejector pad fixed connection's spring, the inside movable mounting in lock chamber has one end to run through and extend to the outside T shape screw rod of wire arrangement wheel, the one end fixed mounting that the T shape screw rod is located the lock intracavity portion has the toper piece, toper piece and ejector pad closely laminate, the inside fixed mounting of ejector pad has one end to run through and extend to the inside spacer pin of processing roller.
Preferably, the number of the electric push rods is two, the electric push rods are symmetrically distributed, and the electric push rods are positioned on the front side of the machine body.
Preferably, the liquid accumulation groove is formed in the workbench, the drain pipe is communicated with the bottom wall of the liquid accumulation groove, and the two support frames are symmetrically distributed in the front and back direction.
Preferably, the unwrapping wire roller is unanimous with receipts line roller size and specification, and unwrapping wire roller and receipts line roller use the liquid reserve tank to be the symmetric distribution as the center, and the liquid reserve tank intussuseption is filled with the mixture of carborundum miropowder and coolant liquid, and the injection pipe is corrugated tube, and the quantity of injection pipe is two and is the symmetric distribution.
Preferably, two the guide pulley is located the below of liquid reserve tank and is the symmetric distribution, and three processing roller is isosceles triangle and distributes, and three processing roller is located between the left and right sides guide pulley, and three processing roller is located the liquid reserve tank below, and the motor is located the liquid reserve tank below.
Preferably, it is single the quantity of arranging the line wheel on the processing roller is no less than eight and be the equidistance and distribute, and the quantity of the lock chamber in single arranging the line wheel is four, divides into two sets of a set of two and lies in the left and right sides of processing roller respectively, and the lock chamber is the symmetric distribution, and the screw hole with the screw thread looks adaptation of T shape screw rod is seted up to the inside of arranging the line wheel.
Preferably, one side that the ejector pad is relative with the toper piece is the inclined plane, and inclination is unanimous with the conical surface inclination of toper piece, and the spacing groove with the diameter looks adaptation of spacer pin is seted up to the inside of processing roller, and the quantity of spacing groove is no less than fifty on single processing roller, and the spacing groove is the equidistance and distributes, and the spacing groove is the symmetric distribution.
Advantageous effects
Compared with the prior art, the invention provides the silicon wafer wire cutting machine convenient to adjust, which has the following beneficial effects:
this silicon chip wire cut electrical discharge machining convenient to adjust makes T shape screw rod take the toper piece towards the direction motion of keeping away from the volleyball wheel axle center through loosening T shape screw rod, lead to the toper piece to break away from gradually with the contact of ejector pad, at this moment the spring resets and takes ejector pad and spacer pin to move towards the direction of keeping away from the processing roller, until spacer pin and processing roller separation, then just can adjust the distance between two adjacent volleyball wheels through the position of slip volleyball wheel on the processing roller, lead to the winding to follow the regulation in the distance between the cutting steel wire on the volleyball wheel, the advantage that cutting thickness is adjustable has been possessed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a drawing showing the connection of two adjacent processing rolls and a cutting wire according to the present invention;
FIG. 3 is an enlarged view of the invention at A in FIG. 2.
In the figure: the device comprises a base 1, a machine body 2, an electric push rod 3, a workbench 4, a support frame 5, a sewage discharge pipe 6, a pay-off roller 7, a take-up roller 8, a liquid storage tank 9, an injection pipe 10, a guide wheel 11, a processing roller 12, a motor 13, a wire arrangement wheel 14, a cutting steel wire 15, a lock cavity 16, a push block 17, a spring 18, a T-shaped screw rod 19, a conical block 20 and a limiting pin 21.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a silicon wafer wire cutting machine convenient to adjust comprises a base 1, a machine body 2 is fixedly installed at the top of the base 1, electric push rods 3 are fixedly installed at the top of the base 1, the number of the electric push rods 3 is two, the electric push rods 3 are symmetrically distributed, the electric push rods 3 are located at the front side of the machine body 2, a workbench 4 is fixedly installed at the top of the electric push rods 3, a liquid accumulation groove is formed in the workbench 4, a blow-off pipe 6 is communicated with the inner bottom wall of the liquid accumulation groove, the number of the support frames 5 is two and symmetrically distributed front and back, a support frame 5 is fixedly installed in the workbench 4, a blow-off pipe 6 with one end penetrating and extending to the bottom of the workbench 4 is communicated with the interior of the workbench 4, a pay-off roller 7 and a take-up roller 8 are movably installed at the front side of the machine body 2, the pay-off roller 7 and the take-up roller 8 are of the, the liquid storage tank 9 is filled with a mixture of silicon carbide micropowder and cooling liquid, the injection pipes 10 are corrugated hoses, the number of the injection pipes 10 is two and are symmetrically distributed, the front side of the machine body 2 is fixedly provided with the liquid storage tank 9, the front side of the liquid storage tank 9 is fixedly provided with the injection pipes 10, the front side of the machine body 2 is movably provided with two guide wheels 11, the two guide wheels 11 are positioned below the liquid storage tank 9 and are symmetrically distributed, the three processing rollers 12 are distributed in an isosceles triangle shape, the three processing rollers 12 are positioned between the left guide wheel 11 and the right guide wheel 11, the three processing rollers 12 are positioned below the liquid storage tank 9, the motor 13 is positioned below the liquid storage tank 9, the front side of the liquid storage tank 9 is movably provided with three processing rollers 12, the front side of the machine body 2 is fixedly provided with the motor 13, the model of the motor 13 can be BY42G 250C-0151, the output end of the motor 13 is fixedly connected, the outer side of the processing roller 12 is connected with a wire arranging wheel 14 in a sliding manner, the number of the wire arranging wheels 14 on a single processing roller 12 is not less than eight and is distributed equidistantly, the number of lock cavities 16 in the single wire arranging wheel 14 is four, the lock cavities are divided into two groups, two groups are respectively positioned at the left side and the right side of the processing roller 12, the lock cavities 16 are distributed symmetrically, threaded holes matched with threads of a T-shaped screw rod 19 are formed in the wire arranging wheel 14, one end of each of the cutting steel wires 15 is fixedly installed on the outer side of the wire releasing roller 7 and sequentially wound on a right guide wheel 11, the wire arranging wheels 14 on the three processing rollers 12, a left guide wheel 11 and a cutting steel wire 15 of a wire receiving roller 8 in a clockwise direction, the cutting steel wire 15 is fixedly connected with the wire receiving roller 8, the lock cavities 16 are formed in the wire arranging wheel 14, a push block 17 is connected in the lock, the silicon wafer wire cutting machine convenient to adjust is characterized in that limiting grooves matched with the diameters of limiting pins 21 are formed in the processing rollers 12, the number of the limiting grooves in a single processing roller 12 is not less than fifty, the limiting grooves are distributed equidistantly, the limiting grooves are distributed symmetrically, a spring 18 with one end fixedly connected with a push block 17 is fixedly arranged in a lock cavity 16, a T-shaped screw 19 with one end penetrating through and extending to the outside of the wire arranging wheel 14 is movably arranged in the lock cavity 16, a conical block 20 is fixedly arranged at one end of the T-shaped screw 19 in the lock cavity 16, the conical block 20 is tightly attached to the push block 17, a limiting pin 21 with one end penetrating through and extending to the inside of the processing roller 12 is fixedly arranged in the push block 17, the T-shaped screw 19 drives the conical block 20 to move towards the direction far away from the axis of the wire arranging wheel 14 by unscrewing the T-shaped screw 19, so that the conical block 20 is gradually separated from the push block, at this time, the spring 18 is reset and drives the push block 17 and the limiting pin 21 to move towards the direction away from the processing roller 12 until the limiting pin 21 is separated from the processing roller 12, and then the distance between two adjacent wire arranging wheels 14 can be adjusted by sliding the positions of the wire arranging wheels 14 on the processing roller 12, so that the distance between the cutting steel wires 15 wound on the wire arranging wheels 14 can be adjusted accordingly, and the advantage of adjustable cutting thickness is achieved.
In conclusion, in the silicon wafer wire cutting machine convenient to adjust, the T-shaped screw rod 19 is loosened to enable the T-shaped screw rod 19 to drive the conical block 20 to move towards the direction far away from the axle center of the wire arranging wheel 14, so that the conical block 20 is gradually separated from the contact with the push block 17, the spring 18 is reset and drives the push block 17 and the limit pin 21 to move towards the direction far away from the processing roller 12 until the limit pin 21 is separated from the processing roller 12, then the distance between two adjacent wire arranging wheels 14 can be adjusted by sliding the positions of the wire arranging wheels 14 on the processing roller 12, so that the distance between the cutting steel wires 15 wound on the wire arranging wheels 14 can be adjusted, the advantage of adjustable cutting thickness is achieved, the problem that in the existing silicon wafer wire cutting machine is solved, because the groove on the processing roller 12 is fixed, only silicon wafers with a specified thickness can be cut, if silicon wafers with different thicknesses need to be processed by replacing the processing, thus not only reducing the production efficiency but also wasting the material and improving the production cost.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a silicon chip wire cut electrical discharge machining convenient to adjust, includes base (1), its characterized in that: the machine body is characterized in that a machine body (2) is fixedly mounted at the top of the base (1), an electric push rod (3) is fixedly mounted at the top of the base (1), a workbench (4) is fixedly mounted at the top of the electric push rod (3), a support frame (5) is fixedly mounted inside the workbench (4), a blow-off pipe (6) with one end penetrating and extending to the bottom of the workbench (4) is communicated with the inside of the workbench (4), a pay-off roller (7) and a take-up roller (8) are movably mounted at the front side of the machine body (2), a liquid storage tank (9) is fixedly mounted at the front side of the machine body (2), an injection pipe (10) is fixedly mounted at the front side of the liquid storage tank (9), two guide wheels (11) are movably mounted at the front side of the machine body (2), three processing rollers (12) are movably mounted at the front side of the liquid storage tank (9), and a motor, the output and the upside of motor (13) processing roller (12) fixed connection, the outside sliding connection of processing roller (12) has calandria wheel (14), the outside fixed mounting of unwrapping wire roller (7) has one end to twine the right side according to clockwise in proper order calandria wheel (14), the left side on guide pulley (11), three processing roller (12) cutting steel wire (15) of guide pulley (11) and receipts line roller (8), cutting steel wire (15) and receipts line roller (8) fixed connection, the inside of calandria wheel (14) has seted up lock chamber (16), the inside sliding connection of lock chamber (16) has ejector pad (17), the inside fixed mounting of lock chamber (16) has spring (18) of one end and ejector pad (17) fixed connection, the inside movable mounting of lock chamber (16) has one end to run through and extend to the outside T shape screw rod (19) of calandria wheel (14), the one end fixed mounting that T shape screw rod (19) is located lock chamber (16) inside has cone-shaped block (20), the conical block (20) is tightly attached to the push block (17), and a limiting pin (21) with one end penetrating through and extending into the processing roller (12) is fixedly installed inside the push block (17).
2. The silicon wafer wire cutting machine convenient to adjust as set forth in claim 1, wherein: the number of the electric push rods (3) is two, the electric push rods (3) are symmetrically distributed, and the electric push rods (3) are located on the front side of the machine body (2).
3. The silicon wafer wire cutting machine convenient to adjust as set forth in claim 1, wherein: the liquid accumulation groove is formed in the workbench (4), the blow-off pipe (6) is communicated with the inner bottom wall of the liquid accumulation groove, and the two support frames (5) are symmetrically distributed in the front and the back.
4. The silicon wafer wire cutting machine convenient to adjust as set forth in claim 1, wherein: pay off roller (7) and receipts line roller (8) size and specification are unanimous, and pay off roller (7) and receipts line roller (8) use liquid reserve tank (9) to be the symmetric distribution as the center, and liquid reserve tank (9) intussuseption is filled with the mixture of carborundum miropowder and coolant liquid, and injection pipe (10) are corrugated tube, and the quantity of injection pipe (10) is two and is the symmetric distribution.
5. The silicon wafer wire cutting machine convenient to adjust as set forth in claim 1, wherein: two guide pulley (11) are located the below of liquid reserve tank (9) and are the symmetric distribution, and three processing roller (12) are isosceles triangle and distribute, and three processing roller (12) are located between left and right sides guide pulley (11), and three processing roller (12) are located liquid reserve tank (9) below, and motor (13) are located liquid reserve tank (9) below.
6. The silicon wafer wire cutting machine convenient to adjust as set forth in claim 1, wherein: the number of the wire arranging wheels (14) on the processing roller (12) is not less than eight and is distributed equidistantly, the number of lock cavities (16) in the single wire arranging wheel (14) is four, the lock cavities are divided into two groups of two which are respectively positioned at the left side and the right side of the processing roller (12), the lock cavities (16) are distributed symmetrically, and threaded holes matched with the threads of the T-shaped screw rods (19) are formed in the wire arranging wheels (14).
7. The silicon wafer wire cutting machine convenient to adjust as set forth in claim 1, wherein: one side that ejector pad (17) and toper piece (20) are relative is the inclined plane, and inclination is unanimous with the conical surface inclination of toper piece (20), and the spacing groove with the diameter looks adaptation of spacer pin (21) is seted up to the inside of processing roller (12), and the quantity of spacing groove is no less than fifty on single processing roller (12), and the spacing groove is the equidistance and distributes, and the spacing groove is the symmetric distribution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910499018.3A CN112060376A (en) | 2019-06-11 | 2019-06-11 | Silicon chip wire cut electrical discharge machining convenient to adjust |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910499018.3A CN112060376A (en) | 2019-06-11 | 2019-06-11 | Silicon chip wire cut electrical discharge machining convenient to adjust |
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| CN112060376A true CN112060376A (en) | 2020-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910499018.3A Pending CN112060376A (en) | 2019-06-11 | 2019-06-11 | Silicon chip wire cut electrical discharge machining convenient to adjust |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113733378A (en) * | 2021-11-05 | 2021-12-03 | 江苏晟大光电科技有限公司 | Solar cell panel assembly crystal silicon cell piece cutting and processing equipment |
| CN114131772A (en) * | 2021-11-16 | 2022-03-04 | 青岛高测科技股份有限公司 | Cutting method and cutting device for hard and brittle material rod |
| CN115625809A (en) * | 2022-10-31 | 2023-01-20 | 浙江富芯微电子科技有限公司 | Crystal bar cutting system |
| CN116198039A (en) * | 2023-04-28 | 2023-06-02 | 苏州晨晖智能设备有限公司 | Semiconductor monocrystalline silicon piece cutting equipment |
-
2019
- 2019-06-11 CN CN201910499018.3A patent/CN112060376A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113733378A (en) * | 2021-11-05 | 2021-12-03 | 江苏晟大光电科技有限公司 | Solar cell panel assembly crystal silicon cell piece cutting and processing equipment |
| CN114131772A (en) * | 2021-11-16 | 2022-03-04 | 青岛高测科技股份有限公司 | Cutting method and cutting device for hard and brittle material rod |
| CN115625809A (en) * | 2022-10-31 | 2023-01-20 | 浙江富芯微电子科技有限公司 | Crystal bar cutting system |
| CN116198039A (en) * | 2023-04-28 | 2023-06-02 | 苏州晨晖智能设备有限公司 | Semiconductor monocrystalline silicon piece cutting equipment |
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Application publication date: 20201211 |
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| WD01 | Invention patent application deemed withdrawn after publication |