CN110394911B - Secondary utilization method of diamond wire suitable for silicon wafer production and manufacturing - Google Patents
Secondary utilization method of diamond wire suitable for silicon wafer production and manufacturing Download PDFInfo
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- CN110394911B CN110394911B CN201910681189.8A CN201910681189A CN110394911B CN 110394911 B CN110394911 B CN 110394911B CN 201910681189 A CN201910681189 A CN 201910681189A CN 110394911 B CN110394911 B CN 110394911B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H49/00—Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
- B65H49/18—Methods or apparatus in which packages rotate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H54/00—Winding, coiling, or depositing filamentary material
- B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
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Abstract
The invention discloses a secondary utilization method of a gold steel wire suitable for silicon wafer production and manufacturing in the technical field of photovoltaic products, which comprises the following steps: the wire storage section of the wire take-up roller pays off to the pay-off wheel, so that the diamond wire of X kilometers is wound on the pay-off wheel; paying off the wire winding wheel by the wire paying-off wheel, so that the diamond wire of Y kilometers is wound on the wire winding wheel; the take-up pulley discharges the diamond wire of Z kilometers to the pay-off pulley, and meanwhile, the crystal support descends to cut; the crystal bar is separated from the wire net, the paying-off wheel pays off wires to the wire collecting wheel, so that (X-Y + Z) kilometers of diamond wires on the paying-off wheel are completely recovered and wound on the wire collecting wheel, and the wire amount on the paying-off wheel is 0; the take-up pulley then pays off to the wire storage section of the pay-off roller, so that the wire feeding amount of the take-up pulley becomes 0; the pay-off roller stores the line segment and returns for L kilometers. The invention adopts the cutting method of secondarily utilizing the cut old diamond wires, so that the wire consumption is reduced to the limit, the quality of the cut silicon wafer is not influenced, and the production material cost is reduced.
Description
Technical Field
The invention belongs to the technical field of photovoltaic products, and particularly relates to a secondary utilization method of a gold steel wire suitable for silicon wafer production and manufacturing.
Background
In the prior art, a gold steel wire is a main auxiliary material for producing and manufacturing silicon wafers, diamond particles are fixed on a straight pull steel wire in an electroplating mode, so that the gold steel wire moves back and forth at a high speed to generate a cutting force, a crystal bar moves slowly from top to bottom, the crystal bar and the gold steel wire start to cut after contacting until the crystal bar is cut into a plurality of silicon wafers, and finally the cutting is finished.
In the prior art, a diamond wire cutting device for polycrystalline silicon structurally comprises a pay-off roller, wherein a diamond wire is wound on the pay-off roller, the diamond wire paid off by the pay-off roller sequentially winds a first guide wheel, a second guide wheel, a third guide wheel, two threaded rollers, a fourth guide wheel, a fifth guide wheel and a sixth guide wheel, and is finally wound on a take-up roller in a retracting manner; the diamond wire is spirally wound on the two threaded rollers along the threaded grooves on the two sides to form a wire mesh; the pay-off roller comprises a pay-off wheel and a wire storage section, the pay-off wheel and the wire storage section of the pay-off roller are separated by an annular partition belt, the axial length of the wire storage section of the pay-off roller is greater than that of the pay-off wheel, the take-up roller comprises a take-up wheel and a wire storage section, the take-up wheel and the wire storage section of the take-up roller are separated by an annular partition belt, the axial length of the wire storage section of the take-up roller is greater than that of the take-up wheel, and the pay-off wheel and the take-up wheel are arranged oppositely; a liftable crystal support is arranged above the threaded roller, and a crystal rod is fixed on the crystal support.
In the prior art, the cutting method of the cutting device includes the steps of: paying off the wire storage section of the paying-off roller to the wire winding roller, paying off the wire from the wire winding wheel, continuously paying off the diamond wire from the wire winding wheel by the wire winding wheel, descending the crystal support, pressing the crystal bar downwards towards the wire net until the crystal bar is cut into a plurality of pieces by the wire net, paying off the wire from the wire winding wheel by the wire winding wheel, paying off the wire from the wire winding wheel to the wire storage section of the paying-off roller, paying off the wire from the wire storage section of the paying-off roller to the wire winding roller, and allowing the wire storage section of the paying-off roller to run empty; then, replacing the 2 nd new crystal bar to be cut on the crystal support, and circularly cutting the new crystal bar by the steps again; then, the 3 rd crystal bar, the 4 th crystal bar and the nth crystal bar are sequentially replaced for cutting until the diamond wires on the wire storage section of the pay-off roller are used up. The method adopts a new wire cutter to cut the crystal bar, when the cutting depth is 0-163 mm, all new wire cutting is adopted, and when the cutting depth is 163-164 mm, old wire cutting is adopted; most of cutting depth of the crystal bar adopts new linear cutting, so that the cutting quality is improved, and the generation of tool entering TTV, tool entering warping and linear marks is avoided. But has the disadvantages that: at present, the unit consumption of an electrogilding steel wire for cutting a crystal bar is about 3.5 km/knife (namely 1.4 m/pcs), 1 crystal bar is cut to be 1 knife, the consumed wire is reduced to the limit in the traditional cutting process, if the consumed wire is continuously reduced, the abnormalities such as no cut, wire breakage, overproof TTV/wire mark and the like can occur, the consumed wire is required to be reduced basically without a compression space, and the cut old wire cannot be utilized, so that the utilization rate of the diamond wire is not high enough.
Disclosure of Invention
The invention aims to provide a secondary utilization method of a gold steel wire suitable for silicon wafer production and manufacturing, which reduces the wire consumption to the limit, does not influence the quality of a cut silicon wafer and realizes the reduction of production material cost by changing the traditional method that a diamond wire is discarded after being cut for one time and adopting the cutting method of the old diamond wire after secondary utilization and cutting.
The purpose of the invention is realized as follows: a secondary utilization method of a gold steel wire suitable for silicon wafer production and manufacturing comprises a wire collecting roller and a wire releasing roller, wherein a plurality of circles of used old diamond wires are wound on the wire collecting roller, the diamond wires on the wire collecting roller extend outwards and then sequentially wind a left guide wheel set, two thread rollers and a right guide wheel set, and then are collected and wound on the wire releasing roller; the diamond wire is spirally wound on the two threaded rollers along the threaded grooves on the two sides to form a wire mesh; the winding roller comprises a winding wheel and a wire storage section, the winding wheel and the wire storage section of the winding roller are separated by an annular partition belt, the axial length of the wire storage section of the winding roller is greater than that of the winding wheel, the paying-off roller comprises a paying-off wheel and a wire storage section, the paying-off wheel and the wire storage section of the paying-off roller are separated by an annular partition belt, the axial length of the wire storage section of the paying-off roller is greater than that of the paying-off wheel, and the paying-off wheel and the winding wheel are arranged oppositely; a liftable crystal support is arranged above the threaded roller, and a crystal rod is fixed on the crystal support; the method comprises the following steps:
(1) taking up the wire roller and sending the wire: the wire collecting roller and the wire releasing roller rotate reversely, and the wire storing section of the wire collecting roller releases the wire to the wire releasing wheel, so that the diamond wire of X kilometers is wound on the wire releasing wheel;
(2) feeding by a pay-off wheel: the paying-off roller and the winding-up roller rotate, and the paying-off wheel pays off the wire to the winding-up wheel, so that the Y kilometer diamond wires are wound on the winding-up wheel;
(3) cutting the incoming wire of the take-up pulley: the wire take-up roller and the wire pay-off roller rotate reversely again, the wire take-up wheel releases the diamond wires of Z kilometers to the wire pay-off wheel, and meanwhile, the crystal support descends to enable the crystal bar to be pressed downwards towards the wire net until the crystal bar is cut into a plurality of pieces by the wire net, the wire feeding amount of the wire pay-off wheel is (X-Y + Z) kilometers, and the wire feeding amount of the wire take-up wheel is (Y-Z) kilometers;
(4) wire returning of a take-up pulley and a pay-off pulley: the crystal support rises to drive the crystal bar to be separated from the wire net, the pay-off roller and the take-up roller rotate, the pay-off wheel pays off wires to the take-up wheel, so that (X-Y + Z) kilometers of diamond wires on the pay-off wheel are all recovered and wound on the take-up wheel, and the wire feeding amount on the pay-off wheel is changed into 0; the wire take-up pulley then takes out the wire to the wire storage section of the wire release roller, so that the diamond wires of X kilometers on the wire take-up pulley are completely recovered and wound on the wire storage section of the wire release roller, and the wire amount on the wire take-up pulley becomes 0;
(5) the paying-off roller stores the line segment and returns the line: the paying-off roller and the winding-up roller rotate, and the diamond wire of L kilometers is discharged from the paying-off roller wire storage section to the winding-up roller wire storage section.
X in the step (1) is larger than Y in the step (2), Y in the step (2) is larger than Z in the step (3), a certain amount of used old diamond wires are wound on a wire storage section of a take-up roller before the step (1) is started, 0 kilometer wires are arranged on the wire storage section of a pay-off roller, and 0 kilometer wires are arranged on a take-up wheel and a pay-off wheel. Compared with the prior art, the invention has the beneficial effects that: according to the invention, the cut old wire is observed through an electron microscope, the diamond particle density on the surface of the old diamond wire used for 1 time is about 40% of that of the new wire, and the old diamond wire can be judged to still have cutting force, so that a secondary utilization cutting mode is adopted for the old diamond wire wound on the wire storage section of the take-up roller after 1 time of cutting. The method comprises the steps that a take-up roller wound with an old diamond wire is used as a new 'pay-off roller', the wire is wound again, the take-up roller pays off the wire to the pay-off roller, and secondary cutting in the opposite direction is carried out; the method changes the traditional mode that the diamond wire after primary cutting is abandoned, adopts the cutting method of secondarily utilizing the old diamond wire, can reduce the wire consumption to the limit, basically does not influence the quality of the cut silicon wafer, and realizes the reduction of the production material cost.
As a further improvement of the invention, the tension of the diamond wire arranged between the wire take-up roller and the wire release roller is 9.45-9.55N, and the diamond wire on the wire release roller or the wire take-up roller is released at 3.94-4.06 m/s2The acceleration of the diamond wire is uniformly accelerated, and when the moving speed of the diamond wire reaches 22.6-23.4 m/s, the diamond wire keeps moving at a constant speed. Theoretically, the old diamond wire exceeds 7km, namely the cutting force for completely cutting 1 crystal bar is met; however, after the old diamond wire is cut once, the old diamond wire is easy to break due to the fact that the old diamond wire reciprocates for a long time, so that the tension of the diamond wire is reduced, and the moving speed and the acceleration of the diamond wire are reduced, so that the old diamond wire can bear the burden of secondary cutting.
As a further improvement of the method, in the step (3), the descending moving speed of the crystal bar is 1.57-1.63 mm/min, and the wire is fed in a mode of going in one loop after 150 cycles in the process that the wire take-up wheel discharges the diamond wires of Z kilometers to the wire release wheel. The cycle number of the diamond wire in one turn is reduced by reducing the descending moving speed of the crystal bar, so that the old diamond wire can bear the burden of secondary cutting; when the take-up pulley cuts the incoming wire of the pay-off pulley, the cutting is divided into 150 circulation steps, each circulation step adopts the mode of firstly cutting the incoming wire and then cutting the return wire, and the wire amount of the incoming wire is larger than that of the return wire.
As a further improvement of the invention, before the step (1) is started, the storage wire section of the take-up roller is wound with 50, 70 or 100 kilometers of old diamond wires, and the wire mesh between the two threaded rollers comprises 3.5 kilometers of diamond wires.
As a further improvement of the invention, after the step (5) is completed, a new ingot to be cut is fixedly installed on the crystal support again, and the steps (1), (2), (3), (4) and (5) are performed in a circulating manner again until the diamond wires on the wire storage section of the take-up roller are used up. After 5 steps are circulated once, the cutting of 1 crystal bar can be completed.
As a further improvement of the invention, said X =8, Y =7.5, Z =6.5, L = 1; the size of the crystal bar in the cutting direction is 157.5-158 mm, and after the crystal bar is contacted with the wire mesh, the stroke of descending movement of the crystal bar is 164 mm. The stroke of the descending movement is larger than the size of the crystal bar, so that the crystal bar can be completely cut.
As a further improvement of the invention, the left side guide wheel group sequentially comprises a first guide wheel, a second guide wheel and a third guide wheel, wheel shafts of the second guide wheel and the third guide wheel are positioned in the same horizontal plane, the right side guide wheel group sequentially comprises a fourth guide wheel, a fifth guide wheel and a sixth guide wheel, wheel shafts of the fourth guide wheel and the fifth guide wheel are positioned in the same horizontal plane, wheel shafts of the first guide wheel and the sixth guide wheel are rotatably connected with a wire arranging swing arm, the end part of the wire arranging swing arm is provided with a wire arranging wheel, and the two wire arranging swing arms are respectively arranged corresponding to a wire releasing roller and a wire receiving roller. Because the diamond wire is spirally wound on the wire roller, the position of the diamond wire can be changed when the diamond wire is paid off or taken up, and the wire arranging swing arm can adapt to the diamond wire for guiding the diamond wire; the wire arranging swing arm swings to guide the diamond wire released by the wire take-up roller, so that the diamond wire is ensured to be wound on a wire releasing wheel or a wire storing section of the wire releasing roller; the wire arranging swing arm swings to guide the diamond wire released by the wire releasing roller, and the diamond wire is ensured to be wound on the wire storing section of the wire winding wheel or the wire winding roller.
As a further improvement of the invention, the axes of the pay-off roller and the take-up roller are parallel to each other, the axes of the two threaded rollers are parallel, and the axes of the threaded rollers are perpendicular to the axis of the pay-off roller.
Drawings
FIG. 1 is a schematic view of a cutting apparatus used in the method of the present invention.
Fig. 2 is a three-dimensional structure view of the paying-off wheel, 2 thread rollers and the take-up wheel.
The automatic winding machine comprises a winding roller 1, a winding wheel 1a, a wire storage section 1b, a wire winding roller 2, a wire winding wheel 2a, a wire storage section 2b, a threaded roller 3, a guide wheel six 4, a guide wheel five 5, a guide wheel four 6, a guide wheel three 7, a guide wheel two 8, a guide wheel one 9, a crystal support 10, a crystal bar 11, a separation band 12, a wire arranging swing arm 13, a wire arranging wheel 13a and a wire mesh 14.
Detailed Description
Example 1
As shown in fig. 1 and 2, the method for recycling the gold steel wire suitable for silicon wafer production comprises a wire take-up roller 2 and a wire pay-off roller 1, wherein a plurality of circles of used old diamond wires are wound on the wire take-up roller 2, the diamond wires on the wire take-up roller 2 extend outwards and then sequentially wind a left guide wheel set, two thread rollers 3 and a right guide wheel set, and then are wound on the wire pay-off roller 1 in a retracting manner; the diamond wire is spirally wound on the two threaded rollers 3 along the threaded grooves on the two sides to form a wire mesh 14; the wire take-up roller 2 comprises a take-up pulley 2a and a wire storage section 2b, the take-up pulley 2a and the wire storage section 2b of the take-up roller 2 are separated by an annular separation band 12, the axial length of the wire storage section 2b of the take-up roller 2 is greater than that of the take-up pulley 2a, the pay-off roller 1 comprises a pay-off pulley 1a and a wire storage section 1b, the pay-off pulley 1a and the wire storage section 1b of the pay-off roller 1 are separated by the annular separation band 12, the axial length of the wire storage section 1b of the pay-off roller 1 is greater than that of the pay-off pulley 1a, and the pay-off pulley 1a and the take-up pulley 2a are oppositely arranged; a liftable crystal support 10 is arranged above the threaded roller 3, and a crystal bar 11 is fixed on the crystal support 10;
the wire storage section 2b of the wire take-up roller 2 is initially wound with 50 kilometers of old diamond wires, and the length of the diamond wires contained in the wire mesh 14 between the two threaded rollers 3 is 3.5 kilometers; the wire storage section 1b of the pay-off roller 1 is provided with 0 kilometer of wire, and the take-up pulley 2a and the pay-off pulley 1a are also provided with 0 kilometer of wire;
the method comprises the following steps:
(1) taking up the wire roller and sending the wire: the wire collecting roller 2 and the wire releasing roller 1 rotate reversely, and the wire storing section 2b of the wire collecting roller 2 releases wires to the wire releasing wheel 1a, so that a diamond wire of 8 kilometers is wound on the wire releasing wheel 1 a;
(2) feeding by a pay-off wheel: the paying-off roller 1 and the wire-taking-up roller 2 rotate, and the paying-off wheel 1a pays off the wire-taking-up wheel 2a, so that a 7.5-kilometer diamond wire is wound on the wire-taking-up wheel 2 a;
(3) cutting the incoming wire of the take-up pulley: the wire take-up roller 2 and the wire pay-off roller 1 rotate reversely again, the wire take-up wheel 2a pays out 6.5 kilometers of diamond wires to the wire pay-off wheel 1a, and meanwhile, the crystal support 10 descends to enable the crystal bar 11 to be pressed downwards towards the wire mesh 14 until the crystal bar 11 is cut into a plurality of pieces by the wire mesh 14, at the moment, the wire feeding amount of the wire pay-off wheel 1a is 7 kilometers, and the wire feeding amount of the wire take-up wheel 2a is 1 kilometer; the descending moving speed of the crystal bar 11 is 1.6mm/min, and in the process that the wire winding wheel 2a discharges the diamond wires to the wire discharging wheel 1a, wire feeding is carried out in a mode of going in one cycle for 150 cycles; the size of the crystal bar 11 in the cutting direction is 157.75mm, and after the crystal bar 11 is contacted with the wire mesh 14, the stroke of descending movement of the crystal bar 11 is 164 mm;
(4) wire returning of a take-up pulley and a pay-off pulley: the crystal support 10 rises to drive the crystal bar 11 to be separated from the wire mesh 14, the pay-off roller 1 and the take-up roller 2 rotate, the pay-off wheel 1a pays off wires to the take-up wheel 2a, so that 7 kilometers of diamond wires on the pay-off wheel 1a are all recovered and wound on the take-up wheel 2a, and the wire amount on the pay-off wheel 1a is 0; the take-up pulley 2a then pays off to the wire storage section 1b of the pay-off roller 1, so that 8 kilometers of diamond wires on the take-up pulley 2a are completely recovered and wound on the wire storage section 1b of the pay-off roller 1, and the wire amount on the take-up pulley 2a is changed into 0;
(5) the paying-off roller stores the line segment and returns the line: pay off roller 1 and receipts line roller 2 rotate, and pay off roller 1 stores up line section 1b and stores up line section 2b to receive line roller 2 and emit 1 kilometer diamond wire.
And (3) after the step (5) is finished, fixedly mounting a new crystal bar 11 to be cut on the crystal support 10 again, and circularly performing the steps (1), (2), (3), (4) and (5) again until the diamond wires on the wire storage section 2b of the wire receiving roller 2 are used up.
The tension of the diamond wire arranged between the take-up roller 2 and the pay-off roller 1 is 9.5N, and the diamond wire on the pay-off roller 1 or the take-up roller 2 is paid out and then is at 4m/s2The acceleration of the diamond wire is uniformly accelerated, and when the moving speed of the diamond wire reaches 23 m/s, the diamond wire keeps moving at a constant speed.
The left side direction wheelset includes leading wheel one 9, leading wheel two 8 and leading wheel three 7 in proper order, and the shaft of leading wheel two 8 and leading wheel three 7 is located same horizontal plane, the right side direction wheelset includes leading wheel four 6, leading wheel five 5 and leading wheel six 4 in proper order, and the shaft of leading wheel four 6 and leading wheel five 5 is located same horizontal plane, and the epaxial winding displacement swing arm 13 that all rotates of leading wheel one 9 and leading wheel six 4 is connected with, and the tip of winding displacement swing arm 13 is equipped with winding displacement wheel 13a, and two winding displacement swing arms 13 respectively with unwrapping wire roller 1, receive the corresponding setting of line roller 2.
The axes of the pay-off roller 1 and the take-up roller 2 are parallel to each other, the axes of the two threaded rollers 3 are parallel to each other, and the axes of the threaded rollers 3 are perpendicular to the axis of the pay-off roller 1.
In this embodiment, when the first knife is used to cut the first ingot 11, the length of the diamond wire wound around each region on the pay-off roll 1 and the take-up roll 2 in different cutting steps is listed.
The cut silicon wafer of this example had a TTV of 28 microns and a line mark of 19 microns.
Example 2
As shown in fig. 1 and 2, the method for recycling the gold steel wire suitable for silicon wafer production comprises a wire take-up roller 2 and a wire pay-off roller 1, wherein a plurality of circles of used old diamond wires are wound on the wire take-up roller 2, the diamond wires on the wire take-up roller 2 extend outwards and then sequentially wind a left guide wheel set, two thread rollers 3 and a right guide wheel set, and then are wound on the wire pay-off roller 1 in a retracting manner; the diamond wire is spirally wound on the two threaded rollers 3 along the threaded grooves on the two sides to form a wire mesh 14; the wire take-up roller 2 comprises a take-up pulley 2a and a wire storage section 2b, the take-up pulley 2a and the wire storage section 2b of the take-up roller 2 are separated by an annular separation band 12, the axial length of the wire storage section 2b of the take-up roller 2 is greater than that of the take-up pulley 2a, the pay-off roller 1 comprises a pay-off pulley 1a and a wire storage section 1b, the pay-off pulley 1a and the wire storage section 1b of the pay-off roller 1 are separated by the annular separation band 12, the axial length of the wire storage section 1b of the pay-off roller 1 is greater than that of the pay-off pulley 1a, and the pay-off pulley 1a and the; a liftable crystal support 10 is arranged above the threaded roller 3, and a crystal bar 11 is fixed on the crystal support 10;
the wire storage section 2b of the wire take-up roller 2 is initially wound with 70 kilometers of old diamond wires, and the length of the diamond wires contained in the wire mesh 14 between the two threaded rollers 3 is 3.5 kilometers; the wire storage section 1b of the pay-off roller 1 is provided with 0 kilometer of wire, and the take-up pulley 2a and the pay-off pulley 1a are also provided with 0 kilometer of wire;
the method comprises the following steps:
(1) taking up the wire roller and sending the wire: the wire collecting roller 2 and the wire releasing roller 1 rotate reversely, and the wire storing section 2b of the wire collecting roller 2 releases wires to the wire releasing wheel 1a, so that a diamond wire of 8 kilometers is wound on the wire releasing wheel 1 a;
(2) feeding by a pay-off wheel: the paying-off roller 1 and the wire-taking-up roller 2 rotate, and the paying-off wheel 1a pays off the wire-taking-up wheel 2a, so that a 7.5-kilometer diamond wire is wound on the wire-taking-up wheel 2 a;
(3) cutting the incoming wire of the take-up pulley: the wire take-up roller 2 and the wire pay-off roller 1 rotate reversely again, the wire take-up wheel 2a pays out 6.5 kilometers of diamond wires to the wire pay-off wheel 1a, and meanwhile, the crystal support 10 descends to enable the crystal bar 11 to be pressed downwards towards the wire mesh 14 until the crystal bar 11 is cut into a plurality of pieces by the wire mesh 14, at the moment, the wire feeding amount of the wire pay-off wheel 1a is 7 kilometers, and the wire feeding amount of the wire take-up wheel 2a is 1 kilometer; the descending moving speed of the crystal bar 11 is 1.57mm/min, and in the process that the wire winding wheel 2a discharges the diamond wires to the wire discharging wheel 1a, wire feeding is carried out in a mode of going in one cycle for 150 cycles; the size of the crystal bar 11 in the cutting direction is 158mm, and after the crystal bar 11 is contacted with the wire mesh 14, the stroke of descending movement of the crystal bar 11 is 164 mm;
(4) wire returning of a take-up pulley and a pay-off pulley: the crystal support 10 rises to drive the crystal bar 11 to be separated from the wire mesh 14, the pay-off roller 1 and the take-up roller 2 rotate, the pay-off wheel 1a pays off wires to the take-up wheel 2a, so that 7 kilometers of diamond wires on the pay-off wheel 1a are all recovered and wound on the take-up wheel 2a, and the wire amount on the pay-off wheel 1a is 0; the take-up pulley 2a then pays off to the wire storage section 1b of the pay-off roller 1, so that 8 kilometers of diamond wires on the take-up pulley 2a are completely recovered and wound on the wire storage section 1b of the pay-off roller 1, and the wire amount on the take-up pulley 2a is changed into 0;
(5) the paying-off roller stores the line segment and returns the line: pay off roller 1 and receipts line roller 2 rotate, and pay off roller 1 stores up line section 1b and stores up line section 2b to receive line roller 2 and emit 1 kilometer diamond wire.
And (5) after the step (5) is finished, fixedly mounting a new crystal bar 11 to be cut on the crystal support 10 again, and circularly performing the steps (1), (2), (3), (4) and (5) again until the diamond wires on the wire storage section 2b of the wire receiving roller 2 are used up.
The tension of the diamond wire arranged between the take-up roller 2 and the pay-off roller 1 is 9.45N, and the diamond wire on the pay-off roller 1 or the take-up roller 2 is paid out at 4.06m/s2The acceleration of the diamond wire is uniformly accelerated, and when the moving speed of the diamond wire reaches 22.6m/s, the diamond wire keeps moving at a constant speed.
The left side direction wheelset includes leading wheel one 9, leading wheel two 8 and leading wheel three 7 in proper order, and the shaft of leading wheel two 8 and leading wheel three 7 is located same horizontal plane, the right side direction wheelset includes leading wheel four 6, leading wheel five 5 and leading wheel six 4 in proper order, and the shaft of leading wheel four 6 and leading wheel five 5 is located same horizontal plane, and the epaxial winding displacement swing arm 13 that all rotates of leading wheel one 9 and leading wheel six 4 is connected with, and the tip of winding displacement swing arm 13 is equipped with winding displacement wheel 13a, and two winding displacement swing arms 13 respectively with unwrapping wire roller 1, receive the corresponding setting of line roller 2.
The axes of the pay-off roller 1 and the take-up roller 2 are parallel to each other, the axes of the two threaded rollers 3 are parallel to each other, and the axes of the threaded rollers 3 are perpendicular to the axis of the pay-off roller 1.
The cut silicon wafer of this example had a TTV of 29.5 microns and a line mark of 18.9 microns.
Example 3
As shown in fig. 1 and 2, the method for recycling the gold steel wire suitable for silicon wafer production comprises a wire take-up roller 2 and a wire pay-off roller 1, wherein a plurality of circles of used old diamond wires are wound on the wire take-up roller 2, the diamond wires on the wire take-up roller 2 extend outwards and then sequentially wind a left guide wheel set, two thread rollers 3 and a right guide wheel set, and then are wound on the wire pay-off roller 1 in a retracting manner; the diamond wire is spirally wound on the two threaded rollers 3 along the threaded grooves on the two sides to form a wire mesh 14; the wire take-up roller 2 comprises a take-up pulley 2a and a wire storage section 2b, the take-up pulley 2a and the wire storage section 2b of the take-up roller 2 are separated by an annular separation band 12, the axial length of the wire storage section 2b of the take-up roller 2 is greater than that of the take-up pulley 2a, the pay-off roller 1 comprises a pay-off pulley 1a and a wire storage section 1b, the pay-off pulley 1a and the wire storage section 1b of the pay-off roller 1 are separated by the annular separation band 12, the axial length of the wire storage section 1b of the pay-off roller 1 is greater than that of the pay-off pulley 1a, and the pay-off pulley 1a and the take-up pulley 2a are oppositely arranged; a liftable crystal support 10 is arranged above the threaded roller 3, and a crystal bar 11 is fixed on the crystal support 10;
the wire storage section 2b of the wire take-up roller 2 is initially wound with 100 kilometers of old diamond wires, and the length of a diamond wire contained in the wire mesh 14 between the two threaded rollers 3 is 3.5 kilometers; the wire storage section 1b of the pay-off roller 1 is provided with 0 kilometer of wire, and the take-up pulley 2a and the pay-off pulley 1a are also provided with 0 kilometer of wire;
the method comprises the following steps:
(1) taking up the wire roller and sending the wire: the wire collecting roller 2 and the wire releasing roller 1 rotate reversely, and the wire storing section 2b of the wire collecting roller 2 releases wires to the wire releasing wheel 1a, so that a diamond wire of 8 kilometers is wound on the wire releasing wheel 1 a;
(2) feeding by a pay-off wheel: the paying-off roller 1 and the wire-taking-up roller 2 rotate, and the paying-off wheel 1a pays off the wire-taking-up wheel 2a, so that a 7.5-kilometer diamond wire is wound on the wire-taking-up wheel 2 a;
(3) cutting the incoming wire of the take-up pulley: the wire take-up roller 2 and the wire pay-off roller 1 rotate reversely again, the wire take-up wheel 2a pays out 6.5 kilometers of diamond wires to the wire pay-off wheel 1a, and meanwhile, the crystal support 10 descends to enable the crystal bar 11 to be pressed downwards towards the wire mesh 14 until the crystal bar 11 is cut into a plurality of pieces by the wire mesh 14, at the moment, the wire feeding amount of the wire pay-off wheel 1a is 7 kilometers, and the wire feeding amount of the wire take-up wheel 2a is 1 kilometer; the descending moving speed of the crystal bar 11 is 1.63mm/min, and in the process that the wire winding wheel 2a discharges the diamond wires to the wire discharging wheel 1a, wire feeding is carried out in a mode of going in one cycle for 150 cycles; the size of the crystal bar 11 in the cutting direction is 157.5mm, and after the crystal bar 11 is contacted with the wire mesh 14, the stroke of descending movement of the crystal bar 11 is 164 mm;
(4) wire returning of a take-up pulley and a pay-off pulley: the crystal support 10 rises to drive the crystal bar 11 to be separated from the wire mesh 14, the pay-off roller 1 and the take-up roller 2 rotate, the pay-off wheel 1a pays off wires to the take-up wheel 2a, so that 7 kilometers of diamond wires on the pay-off wheel 1a are all recovered and wound on the take-up wheel 2a, and the wire amount on the pay-off wheel 1a is 0; the take-up pulley 2a then pays off to the wire storage section 1b of the pay-off roller 1, so that 8 kilometers of diamond wires on the take-up pulley 2a are completely recovered and wound on the wire storage section 1b of the pay-off roller 1, and the wire amount on the take-up pulley 2a is changed into 0;
(5) the paying-off roller stores the line segment and returns the line: pay off roller 1 and receipts line roller 2 rotate, and pay off roller 1 stores up line section 1b and stores up line section 2b to receive line roller 2 and emit 1 kilometer diamond wire.
And (3) after the step (5) is finished, fixedly mounting a new crystal bar 11 to be cut on the crystal support 10 again, and circularly performing the steps (1), (2), (3), (4) and (5) again until the diamond wires on the wire storage section 2b of the wire receiving roller 2 are used up.
The tension of the diamond wire arranged between the take-up roller 2 and the pay-off roller 1 is 9.55N, and the diamond wire on the pay-off roller 1 or the take-up roller 2 is paid out at 3.94m/s2The acceleration of the diamond wire is uniformly accelerated, and when the moving speed of the diamond wire reaches 23.4m/s, the diamond wire keeps moving at a constant speed.
The left side direction wheelset includes leading wheel one 9, leading wheel two 8 and leading wheel three 7 in proper order, and the shaft of leading wheel two 8 and leading wheel three 7 is located same horizontal plane, the right side direction wheelset includes leading wheel four 6, leading wheel five 5 and leading wheel six 4 in proper order, and the shaft of leading wheel four 6 and leading wheel five 5 is located same horizontal plane, and the epaxial winding displacement swing arm 13 that all rotates of leading wheel one 9 and leading wheel six 4 is connected with, and the tip of winding displacement swing arm 13 is equipped with winding displacement wheel 13a, and two winding displacement swing arms 13 respectively with unwrapping wire roller 1, receive the corresponding setting of line roller 2.
The axes of the pay-off roller 1 and the take-up roller 2 are parallel to each other, the axes of the two threaded rollers 3 are parallel to each other, and the axes of the threaded rollers 3 are perpendicular to the axis of the pay-off roller 1.
The cut silicon wafer of this example had a TTV of 28.6 microns and a line mark of 19.3 microns.
In summary, it can be seen that the TTV value of each embodiment of the present invention is less than 30 microns, and the line mark value is less than 20 microns, which all meet the requirements of high quality silicon wafers; therefore, the cutting method of the invention can not generate the abnormalities of cut-through, broken line, TTV/line mark exceeding standard and the like. The method adopts a cutting method of secondarily utilizing old diamond wires, can reduce the wire consumption to the limit, basically does not influence the quality of cut silicon wafers, and realizes the reduction of production material cost.
The present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.
Claims (6)
1. A secondary utilization method of diamond wires suitable for silicon wafer production and manufacturing comprises a wire collecting roller and a wire releasing roller, wherein a plurality of circles of used old diamond wires are wound on the wire collecting roller, the diamond wires on the wire collecting roller extend outwards and then sequentially wind a left guide wheel set, two thread rollers and a right guide wheel set, and then are collected and wound on the wire releasing roller; the diamond wire is spirally wound on the two threaded rollers along the threaded grooves on the two sides to form a wire mesh; the winding roller comprises a winding wheel and a wire storage section, the winding wheel and the wire storage section of the winding roller are separated by an annular partition belt, the axial length of the wire storage section of the winding roller is greater than that of the winding wheel, the paying-off roller comprises a paying-off wheel and a wire storage section, the paying-off wheel and the wire storage section of the paying-off roller are separated by an annular partition belt, the axial length of the wire storage section of the paying-off roller is greater than that of the paying-off wheel, and the paying-off wheel and the winding wheel are arranged oppositely; a liftable crystal support is arranged above the threaded roller, and a crystal rod is fixed on the crystal support; characterized in that the method comprises the following steps:
(1) taking up the wire roller and sending the wire: the wire collecting roller and the wire releasing roller rotate reversely, and the wire storing section of the wire collecting roller releases the wire to the wire releasing wheel, so that the diamond wire of X kilometers is wound on the wire releasing wheel;
(2) feeding by a pay-off wheel: the paying-off roller and the winding-up roller rotate, and the paying-off wheel pays off the wire to the winding-up wheel, so that the Y kilometer diamond wires are wound on the winding-up wheel;
(3) cutting the incoming wire of the take-up pulley: the wire take-up roller and the wire pay-off roller rotate reversely again, the wire take-up wheel releases the diamond wires of Z kilometers to the wire pay-off wheel, and meanwhile, the crystal support descends to enable the crystal bar to be pressed downwards towards the wire net until the crystal bar is cut into a plurality of pieces by the wire net, the wire feeding amount of the wire pay-off wheel is (X-Y + Z) kilometers, and the wire feeding amount of the wire take-up wheel is (Y-Z) kilometers; the descending moving speed of the crystal bar is 1.57-1.63 mm/min, and in the process that a wire take-up wheel releases the diamond wire of Z kilometers to a wire release wheel, wire is fed in a mode of going in and going back one by one in 150 cycles;
(4) wire returning of a take-up pulley and a pay-off pulley: the crystal support rises to drive the crystal bar to be separated from the wire net, the pay-off roller and the take-up roller rotate, the pay-off wheel pays off wires to the take-up wheel, so that (X-Y + Z) kilometers of diamond wires on the pay-off wheel are all recovered and wound on the take-up wheel, and the wire feeding amount on the pay-off wheel is changed into 0; the wire take-up pulley then takes out the wire to the wire storage section of the wire release roller, so that the diamond wires of X kilometers on the wire take-up pulley are completely recovered and wound on the wire storage section of the wire release roller, and the wire amount on the wire take-up pulley becomes 0;
(5) the paying-off roller stores the line segment and returns the line: the paying-off roller and the take-up roller rotate, and the paying-off roller wire storage section releases the diamond wire of L kilometers to the take-up roller wire storage section;
the tension of the diamond wire arranged between the wire take-up roller and the wire pay-off roller is 9.45-9.55N, and the diamond wire on the wire pay-off roller or the wire take-up roller is paid out and then is at 3.94-4.06 m/s2The acceleration of the diamond wire is uniformly accelerated, and when the moving speed of the diamond wire reaches 22.6-23.4 m/s, the diamond wire keeps moving at a constant speed.
2. The method for recycling diamond wires suitable for silicon wafer production and manufacturing according to claim 1, wherein before step (1) is started, the wire storage section of the take-up roller is wound with 50, 70 or 100 kilometers of old diamond wires, and the length of the diamond wires contained in the wire mesh between two thread rollers is 3.5 kilometers.
3. The method for recycling the diamond wire suitable for the production and the manufacture of the silicon wafer as claimed in claim 1 or 2, wherein after the step (5) is completed, a new ingot to be cut is fixedly installed on the crystal support again, and the steps (1), (2), (3), (4) and (5) are performed in a circulating mode again until the diamond wire on the wire storage section of the take-up roller is used up.
4. A method for reusing diamond wire suitable for silicon wafer production and manufacturing according to claim 1 or 2, wherein X =8, Y =7.5, Z =6.5, and L = 1; the size of the crystal bar in the cutting direction is 157.5-158 mm, and after the crystal bar is contacted with the wire mesh, the stroke of descending movement of the crystal bar is 164 mm.
5. The method for recycling the diamond wire suitable for silicon wafer production and manufacturing according to claim 1 or 2, wherein the left guide wheel set sequentially comprises a first guide wheel, a second guide wheel and a third guide wheel, wheel shafts of the second guide wheel and the third guide wheel are located in the same horizontal plane, the right guide wheel set sequentially comprises a fourth guide wheel, a fifth guide wheel and a sixth guide wheel, wheel shafts of the fourth guide wheel and the fifth guide wheel are located in the same horizontal plane, wheel shafts of the first guide wheel and the sixth guide wheel are rotatably connected with a wire arranging swing arm, a wire arranging wheel is arranged at the end of the wire arranging swing arm, and the wire arranging swing arm is respectively arranged corresponding to a wire releasing roller and a wire receiving roller.
6. The method for recycling the diamond wire suitable for the production and the manufacture of the silicon wafers as claimed in claim 1 or 2, wherein the axes of the pay-off roller and the take-up roller are parallel to each other, the axes of the two threaded rollers are parallel, and the axis of the threaded roller is perpendicular to the axis of the pay-off roller.
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| CN112936623A (en) * | 2019-12-10 | 2021-06-11 | 阿特斯光伏电力(洛阳)有限公司 | Cutting method of diamond wire cutting device |
| CN111483067A (en) * | 2020-05-25 | 2020-08-04 | 青岛高测科技股份有限公司 | Diamond wire reverse cutting process |
| CN112078039B (en) * | 2020-07-30 | 2022-07-26 | 乐山高测新能源科技有限公司 | Cutting method for reducing diamond wire loss in crystal silicon multi-wire cutting |
| CN112157831B (en) * | 2020-07-30 | 2022-07-26 | 乐山高测新能源科技有限公司 | Semiconductor silicon slicing diamond wire cutting process for power device |
| CN112257273B (en) * | 2020-10-26 | 2021-09-03 | 青岛高测科技股份有限公司 | Roll diameter period compensation method |
| CN113733377A (en) * | 2021-07-30 | 2021-12-03 | 隆基绿能科技股份有限公司 | Silicon wafer cutting method |
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| CN102039638B (en) * | 2009-10-26 | 2013-04-24 | 英利能源（中国）有限公司 | Cutting method for cutting substrate by utilizing cutting line |
| KR20140090906A (en) * | 2013-01-10 | 2014-07-18 | 주식회사 엘지실트론 | Wire saw and method for slicing ingot using the same |
| KR20140092117A (en) * | 2013-01-15 | 2014-07-23 | 주식회사 엘지실트론 | Wire sawing device |
| JP2015150660A (en) * | 2014-02-17 | 2015-08-24 | 株式会社ノリタケカンパニーリミテド | wire tool |
| CN108556162B (en) * | 2018-05-14 | 2020-09-22 | 邢台晶龙电子材料有限公司 | Method for cutting silicon wafer by using diamond wire |
| CN108501232B (en) * | 2018-05-31 | 2024-07-05 | 扬州续笙新能源科技有限公司 | Diamond wire cutting device and cutting method for polycrystalline silicon |
| CN108858842A (en) * | 2018-07-20 | 2018-11-23 | 阜宁协鑫光伏科技有限公司 | Silicon wafer wire cutting method |
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