WO2012139498A1 - Three roller multi-wire saw - Google Patents

Three roller multi-wire saw Download PDF

Info

Publication number
WO2012139498A1
WO2012139498A1 PCT/CN2012/073806 CN2012073806W WO2012139498A1 WO 2012139498 A1 WO2012139498 A1 WO 2012139498A1 CN 2012073806 W CN2012073806 W CN 2012073806W WO 2012139498 A1 WO2012139498 A1 WO 2012139498A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting
roller
auxiliary
rolls
wire
Prior art date
Application number
PCT/CN2012/073806
Other languages
French (fr)
Chinese (zh)
Inventor
黄禹宁
刘宇宁
潘勇涛
Original Assignee
Huang Yuning
Liu Yuning
Pan Yongtao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huang Yuning, Liu Yuning, Pan Yongtao filed Critical Huang Yuning
Publication of WO2012139498A1 publication Critical patent/WO2012139498A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Definitions

  • the present invention relates to a multi-wire cutting machine for cutting a wafer, in particular to a three-roll multi-wire cutting machine. Further, the three-roll multi-wire cutting machine of the present invention can employ both the widely used slurry cutting method. A new diamond wire cutting method can also be used, and the multi-wire cutting machine of the present invention is suitable for cutting all brittle and high hardness materials. Background technique
  • FIG. 1 and FIG. 1A shows a cutting working principle diagram of the current Japanese NTC MWM442DM model, and a plurality of cutting lines 3 are wound on two parallelly disposed cutting rolls 11, 12, and the cutting rolls 11 and 12 are simultaneously processed.
  • the steel wire is in a high-speed linear motion.
  • the following two cutting methods can be used: a.
  • Slurry cutting The cutting slurry is evenly lowered to both ends of the steel wire to make the steel The surface layer of the wire is uniformly wrapped with a slurry film for dicing, wherein the dicing slurry contains silicon carbide fine powder.
  • New diamond wire cutting method The coolant is hooked down to both ends of the steel wire. The steel wire is plated with a thin layer of diamond powder, and the workpieces 21 and 22 are driven downward by the table, and the cutting roller The cutting line 3 of high-speed linear motion between 11 and 12 is in contact. Because the surface of the steel wire is covered with cutting slurry or diamond powder, the high-speed linear motion of the steel wire drives the cutting slurry or diamond. The coating cuts the workpiece quickly and the workpiece is cut into pieces.
  • this structure can simultaneously mount two single crystal silicon rods 21 and 22 on the same workbench for cutting, and the cutting effect is good.
  • the distance L between the two cutting rolls during cutting is too large, causing the cutting steel wire to be cut.
  • the bending deformation and the shaking phenomenon are serious, and defects such as line marks, chipping, and chipping occur in the cutting process, the cutting yield is lowered, and the production cost is increased.
  • this method focuses on cutting single crystal silicon, is not suitable for cutting polycrystalline silicon rods, and has poor versatility, so it has certain limitations in use.
  • the above structural forms have the following drawbacks: 1.
  • the distance L between the two cutting rolls 11, 12 is too large, and is not suitable for cutting polycrystalline silicon rods, and is only suitable for cutting single crystal silicon rods, has poor versatility, is limited in use, and is produced. Inconvenient management.
  • the above structure is limited in the total length of the cut silicon rod.
  • the effective length of the cutting rolls 11, 12 is only 300 mm, the total length of the two silicon rods is 600mm, if the effective length of the cutting roller is increased in design, the cutting quality will drop rapidly, which results in the limitation of the total length of the silicon cut by the structural model, low output and unstable quality, which increases the production cost.
  • the effective length L1 of the cutting rolls 11, 12 is designed to be lengthened to 800 mm, which can increase the cutting efficiency by 1.33 times compared with the cutting roll having a length of 600 mm, but due to the length of the cutting rolls 11, 12 After the increase, the number of turns of the winding wire increases, and the tensile force between the cutting rolls 11, 12 is increased.
  • the design is to increase the strength of the cutting rolls 11, 12, so that the diameter of the cutting roll is increased to be large enough.
  • the structure improves the cutting quality, productivity and versatility, and both the single crystal silicon and the polycrystalline silicon are suitable, thus achieving the design goal.
  • this design structure also has other deficiencies: a.
  • the technical problem to be solved by the present invention is to provide a three-axis multi-wire cutting machine with small equipment and low processing cost in view of the deficiencies in the prior art, which not only has high cutting efficiency, but also can be passed through two independent The table feed system and the three rolls are separated into two separate cutting sections, which can cut two single and polycrystalline silicon rods at the same time, and the cutting quality is good.
  • the present invention adopts the following technical solution: two parallel cutting rolls are arranged in the cutting chamber, and one auxiliary set above the symmetry center or the symmetry center of the two cutting rolls Cutting roller; The angle a between the cutting line on both sides of the auxiliary cutting roller and the plane of the axes of the two cutting rollers is zero. ⁇ 30.
  • two separate cutting zones are formed, namely zone A and zone B;
  • two independent tables and feed systems are arranged in the middle of the two cutting rolls, two of which are symmetric with the feed system Set, and the linear guides of the two sets of feed systems are perpendicular to the cutting lines on both sides of the auxiliary cutting rolls.
  • the auxiliary cutting roller is disposed between the two cutting rollers, the cutting area between the two cutting rollers is divided into two sections, and each cutting section can independently cut a single, polycrystalline silicon rod, so that each cutting section is cut.
  • the span can be minimized, which can effectively solve the instability, bending and jitter of the cutting line tension during the cutting process due to the large span of the cutting line during the cutting process.
  • the single and polycrystalline silicon rods are subjected to force and uniformity during the cutting process, and the cutting quality can be improved.
  • the three-cutting roller is designed to separate the cutting chamber into two separate cutting sections.
  • Each cutting section has a separate table and feed system. It can cut one silicon rod independently, and two sections can cut two silicon rods. Therefore, it is relatively easy to design a machine for cutting long silicon rods.
  • the three-roll multi-wire cutting machine of the present invention can cut a silicon rod by 1000 mm in a small volume, small weight, about 13 tons, and low energy consumption.
  • the above angle ⁇ is selected from 0° to 30°. Within the range, the angle ⁇ is selected from 0° to 15°. The range is better.
  • the present invention has the following technical effects:
  • An auxiliary cutting roller is disposed above the center of symmetry of the two cutting rolls, and the angle ⁇ between the cutting line on the two sides of the auxiliary cutting roller and the plane of the axes of the two cutting rolls is 0° to 30°. Within the range, the angle ⁇ is selected from 0° to 15°. The range is better.
  • each cutting section independently cuts a single and polycrystalline silicon rod, and the cutting span of each cutting section can be minimized, which can effectively solve the cutting line during the cutting process.
  • the tension of the cutting line caused by the large span is unstable, curved and shaken during the securing process, improving the cutting quality and the versatility of the singulation and polysilicon.
  • the silicon rod is subjected to a reasonable force during the cutting process, the balance is stable, and the cutting quality is stable.
  • the device is small in size, light in weight, low in manufacturing cost, large in output, low in energy consumption, and can greatly reduce cutting. Cutting production costs.
  • the present invention employs an angle ⁇ at 0. ⁇ 30.
  • the design of the three-roll multi-wire cutting structure in the range can find a cutting silicon rod with a length of more than 800mm, even more than 1200mm, and the manufacturing difficulty is low, the manufacturing cost is low, the volume is small, the energy consumption is low, the weight is light, and the output is low.
  • Figure 1 and Figure 1A show the working principle of the existing multi-wire cutting machine
  • Figure 2A is a schematic diagram of the force analysis of the multi-wire cutting machine shown in Figure 1;
  • Figure 3 and Figure 3A are diagrams showing the working principle of another multi-wire cutting machine
  • Figure 3B is a schematic diagram of the force analysis of the multi-wire cutting machine shown in Figure 3;
  • FIG. 4 and FIG. 4A are schematic structural views of a three-roll multi-wire cutting machine of the present invention.
  • FIG. 4B is a schematic diagram of the force analysis of the multi-wire cutting machine shown in FIG. 4;
  • Figure 5 is a cross-sectional view taken along line A - A of Figure 4.
  • the two cutting rolls 11, 12 and the auxiliary cutting rolls 13 are respectively erected in the cutting chamber 71, and the surfaces of the two cutting rolls 11, 12 and the auxiliary cutting rolls 13 are opened.
  • a wire groove through which the cutting line passes (not shown in FIGS. 4 and 5), and the auxiliary cutting roller 13 is disposed above the center of symmetry or the center of symmetry of the two cutting rolls 11, 12, between the two cutting rolls 11, 12
  • the cutting line 3 is supported such that two separate cutting zones are formed between the two sides of the auxiliary cutting roller 13 and the two cutting rolls 11, 12, the cutting lines 31, 32 on both sides of the auxiliary cutting roller 13 and the two cutting roller axes
  • the angle ⁇ between the planes 14 is at zero. ⁇ 30.
  • the angle ⁇ is preferably at zero. ⁇ 15.
  • the feed system of the worktable 4 is composed of a motor 41, a lead screw 42, a linear guide 43, and a slider 44 and the slider bracket 46
  • the motor 41 is fixed on the box body 7
  • the screw rod 42 is coaxially fixed with the shaft of the motor 41
  • the linear guide rail 43 is fixed on the box body 7 through the rail bracket 47
  • the slider 44 is fixed on the slider bracket 46
  • the table is fixed under the slider bracket 46
  • the slider bracket 46 is provided with a nut 45 matched with the screw rod 42
  • the motor 41 drives the screw 42 to rotate
  • the nut 45 moves up and down along the screw rod 42, so that the slider 44 moves along the linear guide 43, thereby driving the table 5 for the feeding motion.
  • the two linear guides of the above-described table 4, 5 feed system are perpendicular to the cutting lines 31, 32 on both sides of the auxiliary cutting roller 13, respectively.
  • a drive motor 9 is provided in the casing below the cutter roller 11, and is coupled to the pulley fixed to the shaft of the cutter roller 11 via a belt 91.
  • the part number 6 in Figs. 4 and 5 is a head which sprays a mortar to the surface of the cutting line 3 in the cutting chamber 71.
  • the part numbers 111 and 131 in Fig. 5 are the bearing housings to which the cutting roller 11 and the auxiliary cutting roller 13 are connected to the chassis 7, respectively.
  • the right part of Figure 4 is the cutting line retraction line system.
  • the cutting line 3 is discharged by the payoff wheel 82, enters the cutting chamber 71 through the guide wheel system 81, is wound around a plurality of turns in the wire grooves of the cutting rolls 11, 12 and the auxiliary cutting roll 13, and then leads to the cutting chamber 71, passing through the guide wheel system 81. Return to the take-up reel 83.
  • each cutting zone can cut one polycrystalline bar, so that the span of each cutting zone can be minimized, and the cutting line can be effectively prevented from being spanned during the cutting process.
  • the large cutting line tension is unstable, curved and shaken, and the volume of the device does not increase.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A three roller multi-wire saw for cutting wafers includes two cutting rollers (11, 12) provided parallel to each other in a cutting chamber (71), and an auxiliary cutting roller (13) which is provided at or above the symmetry center of the two cutting rollers, such that the included angle α between cutting lines (31, 32) on the two sides of the auxiliary cutting roller and the plane (14) where the axes of the two cutting rollers are located is in the range of 0-30°; there are two sets of working stations (4, 5) and feeding systems thereof, which are configured symmetrically, with linear guide rails (43) thereof being perpendicular to the cutting lines on the two sides of the auxiliary cutting roller respectively. The cutting saw can cut two monocrystalline or twin-crystalline silicon rods simultaneously with stable cutting quality; and the device has small size, light weight, low power consumption, high production efficiency, great versatility and lower cutting production cost.

Description

三辊多线切割机  Three-roll multi-wire cutting machine
技术领域 Technical field
本发明涉及一种切割晶片的多线切割机, 具体地说是一种三辊多线切割 机, 进一步地, 本发明的三辊多线切割机既可采用现广泛采用的浆料式切割 法, 也可采用新型的金刚石线的切割法, 本发明的多线切割机适用于所有脆 性、 高硬度材料的切割。 背景技术  The present invention relates to a multi-wire cutting machine for cutting a wafer, in particular to a three-roll multi-wire cutting machine. Further, the three-roll multi-wire cutting machine of the present invention can employ both the widely used slurry cutting method. A new diamond wire cutting method can also be used, and the multi-wire cutting machine of the present invention is suitable for cutting all brittle and high hardness materials. Background technique
目前, 太阳能级硅片和 LED 用蓝宝石、 碳化硅单晶村底片大规模采用 多线切割机生产。 如图 1、 图 1A, 其示出了目前日本 NTC MWM442DM机 型的切割工作原理图,在两根平行设置的切割辊 11、 12上缠绕多道切割线 3, 切割辊 11、 12 同时做顺时或逆时针高速运动, 使钢线处于高速直线运动状 态, 这时可采用以下两种切割方法: a、 浆料法切割: 将切割用浆料均匀地 降至钢线的两端, 使钢线的表层均匀地裹有切割用浆料薄膜, 其中切割用浆 料含有碳化硅微粉。 b、 新型金钢石线切割法: 将冷却液均勾地降至钢线的 两端, 钢线上镀有金刚石微粉薄层, 工件 21、 22 由工作台带动向下进给, 与切割辊 11、 12之间的高速直线运动的切割线 3接触, 由于钢线的表面上 裹有切割用浆料或镀有金刚石微粉, 通过钢线的高速直线运动, 带动切割用 浆料或金钢石镀层对工件进行快速切削, 于是工件被切割成片。 参阅图 1、 图 1A所示, 这种结构可在同一工作台上同时安装两根单晶硅棒 21、 22进行 切割, 切割效果较好。 但当切割两根多晶硅棒时, 如图 2、 图 2A所示, 由 于多晶硅的硬度比单晶硅略硬且不够均匀, 切割时两根切割辊的间距 L过 大, 造成切割钢线在切割过程中弯曲变形和抖动现象严重, 使切割过程中出 现线痕、 崩边、 崩角等疵品, 切割良率降低, 生产成本升高。 所以该方式侧 重于切割单晶硅, 不适宜切多晶硅棒, 通用性差, 故在使用上具有一定的局 限性。 总体而言, 上述结构形式存在如下缺陷: 1、 两根切割辊 11、 12的间 距 L过大, 不适应切割多晶硅棒, 仅适于切割单晶硅棒, 通用性差, 使用上 受到限制, 生产管理不便。 2、 以上结构造成在切割硅棒总长度上受到限制, 由于切割辊 11、 12有效长度仅为 300mm, 所以两根硅棒加起来的总长度为 600mm, 如果设计上再加长切割辊的有效长度, 则切割质量会快速下降, 这 就造成该结构机型切割硅的总长度受到限制, 产量低、 质量又不稳定, 使生 产成本升高。 At present, solar-grade silicon wafers and LED sapphire and silicon carbide single crystal substrates are produced on a large scale by multi-wire cutting machines. As shown in FIG. 1 and FIG. 1A, it shows a cutting working principle diagram of the current Japanese NTC MWM442DM model, and a plurality of cutting lines 3 are wound on two parallelly disposed cutting rolls 11, 12, and the cutting rolls 11 and 12 are simultaneously processed. When moving at high speed or counterclockwise, the steel wire is in a high-speed linear motion. At this time, the following two cutting methods can be used: a. Slurry cutting: The cutting slurry is evenly lowered to both ends of the steel wire to make the steel The surface layer of the wire is uniformly wrapped with a slurry film for dicing, wherein the dicing slurry contains silicon carbide fine powder. b. New diamond wire cutting method: The coolant is hooked down to both ends of the steel wire. The steel wire is plated with a thin layer of diamond powder, and the workpieces 21 and 22 are driven downward by the table, and the cutting roller The cutting line 3 of high-speed linear motion between 11 and 12 is in contact. Because the surface of the steel wire is covered with cutting slurry or diamond powder, the high-speed linear motion of the steel wire drives the cutting slurry or diamond. The coating cuts the workpiece quickly and the workpiece is cut into pieces. Referring to Fig. 1 and Fig. 1A, this structure can simultaneously mount two single crystal silicon rods 21 and 22 on the same workbench for cutting, and the cutting effect is good. However, when cutting two polycrystalline silicon rods, as shown in Fig. 2 and Fig. 2A, since the hardness of polycrystalline silicon is slightly harder and less uniform than single crystal silicon, the distance L between the two cutting rolls during cutting is too large, causing the cutting steel wire to be cut. During the process, the bending deformation and the shaking phenomenon are serious, and defects such as line marks, chipping, and chipping occur in the cutting process, the cutting yield is lowered, and the production cost is increased. Therefore, this method focuses on cutting single crystal silicon, is not suitable for cutting polycrystalline silicon rods, and has poor versatility, so it has certain limitations in use. In general, the above structural forms have the following drawbacks: 1. The distance L between the two cutting rolls 11, 12 is too large, and is not suitable for cutting polycrystalline silicon rods, and is only suitable for cutting single crystal silicon rods, has poor versatility, is limited in use, and is produced. Inconvenient management. 2. The above structure is limited in the total length of the cut silicon rod. Since the effective length of the cutting rolls 11, 12 is only 300 mm, the total length of the two silicon rods is 600mm, if the effective length of the cutting roller is increased in design, the cutting quality will drop rapidly, which results in the limitation of the total length of the silicon cut by the structural model, low output and unstable quality, which increases the production cost.
为了克服这些问题, 采取了如下措施: a、 为了提高切割质量和切单、 多晶硅的通用性, 在同一工作台上只安装一根硅棒。 如图 3、 图 3A所示, 在两根切割辊 11、 12之间的间距 L2可大大缩短, 克服由于两根切割辊 11、 12之间的间距 L2过大,造成切割钢线在切割过程中的弯曲变形和抖动现象, 提高切割质量和切单、 多晶硅的通用性。 b、 为了提高一次切割产量, 将切 割辊 11、 12的有效长度 L1设计加长至 800mm, 与长度为 600mm的切割辊 相比, 这样可提高一次切割效率 1.33倍, 但由于切割辊 11、 12长度增加后, 绕钢线的匝数增加, 使切割辊 11、 12 间的拉力增加, 设计上就要增加切割 辊 11、 12 的强度, 这样就要增大切割辊的直径使其足够大。 采取上述改进 后, 该结构提高了切割质量、 产能和通用性, 既适切单晶硅又适切多晶硅, 于是达到了设计目的。 但是此设计结构同时也具有其它不足之处: a、 由于 切割辊 11、 12的直径加大, 长度 L加长, 使该设备的制造难度加大, 制造 成本大幅增加, 设备体积庞大, 每台重量达 17吨以上, 每台功率在 160KW 以上, 耗能大。 b、 该设备能够一次切割的单、 多晶硅棒仅长 800mm, 如果 设计再加长则设备制造的难度更大, 成本更高, 设备体积更大, 重量更重, 耗能更加惊人, 因此该设计结构 4艮难再有更好的性价比。 c、 由以上的原因 此设备造价昂贵、 体积庞大、 重量达 17吨、 生产效率较低、 耗能高、 人力、 资源浪费大, 造成生产成本高。 发明内容  In order to overcome these problems, the following measures have been taken: a. In order to improve the cutting quality and the versatility of the dicing and polysilicon, only one silicon rod is mounted on the same workbench. As shown in FIG. 3 and FIG. 3A, the distance L2 between the two cutting rolls 11, 12 can be greatly shortened, overcoming the cutting process of the cutting steel wire due to the excessive spacing L2 between the two cutting rolls 11, 12. Bending deformation and jitter phenomenon, improve cutting quality and versatility of singulation and polysilicon. b. In order to increase the cutting yield, the effective length L1 of the cutting rolls 11, 12 is designed to be lengthened to 800 mm, which can increase the cutting efficiency by 1.33 times compared with the cutting roll having a length of 600 mm, but due to the length of the cutting rolls 11, 12 After the increase, the number of turns of the winding wire increases, and the tensile force between the cutting rolls 11, 12 is increased. The design is to increase the strength of the cutting rolls 11, 12, so that the diameter of the cutting roll is increased to be large enough. With the above improvements, the structure improves the cutting quality, productivity and versatility, and both the single crystal silicon and the polycrystalline silicon are suitable, thus achieving the design goal. However, this design structure also has other deficiencies: a. Due to the increased diameter of the cutting rolls 11, 12, the length L is lengthened, making the manufacturing of the device more difficult, the manufacturing cost is greatly increased, the equipment is bulky, and each weight is Up to 17 tons or more, each power is above 160KW, which consumes a lot of energy. b. The single and polycrystalline silicon rods that can be cut at one time are only 800mm long. If the design is lengthened, the equipment is more difficult to manufacture, the cost is higher, the equipment is larger, the weight is heavier, and the energy consumption is more amazing. Therefore, the design structure 4 Difficult to have a better price/performance ratio. c. Reasons for the above The equipment is expensive, bulky, weighs 17 tons, has low production efficiency, high energy consumption, and wastes manpower and resources, resulting in high production costs. Summary of the invention
本发明要解决的技术问题在于, 针对现有技术中存在的不足之处, 提供 一种具有设备体积小、 加工成本低的三轴多线切割机, 不仅切割效率高, 同 时可通过两个独立的工作台进给***和三辊分隔成两个独立的切割区间, 可 同时切割两根单、 多晶硅棒, 而且切割质量好。  The technical problem to be solved by the present invention is to provide a three-axis multi-wire cutting machine with small equipment and low processing cost in view of the deficiencies in the prior art, which not only has high cutting efficiency, but also can be passed through two independent The table feed system and the three rolls are separated into two separate cutting sections, which can cut two single and polycrystalline silicon rods at the same time, and the cutting quality is good.
为实现上述目的, 本发明采用了以下技术方案: 在切割室内设置两根平 行的切割辊, 和一根设置在两根切割辊的对称中心或对称中心的上方的辅助 切割辊; 辅助切割辊两侧的切割线与两根切割辊的轴心所在平面之间的夹角 a在 0。 ~ 30。 范围内; 形成有两个独立的切割区, 即 A区间和 B区间; 在 两根切割辊上方中间设置有两个独立的工作台和进给***, 其中两套工作台 及其进给***对称设置, 并且两套进给***的直线导轨分别垂直于辅助切割 辊两侧的切割线。 In order to achieve the above object, the present invention adopts the following technical solution: two parallel cutting rolls are arranged in the cutting chamber, and one auxiliary set above the symmetry center or the symmetry center of the two cutting rolls Cutting roller; The angle a between the cutting line on both sides of the auxiliary cutting roller and the plane of the axes of the two cutting rollers is zero. ~ 30. Within the range; two separate cutting zones are formed, namely zone A and zone B; two independent tables and feed systems are arranged in the middle of the two cutting rolls, two of which are symmetric with the feed system Set, and the linear guides of the two sets of feed systems are perpendicular to the cutting lines on both sides of the auxiliary cutting rolls.
由于辅助切割辊设置在两根切割辊中间, 将两根切割辊之间的切割区域 分隔成两个区间, 每个切割区间可以独立地切割一根单、 多晶硅棒, 因而每 个切割区间的切割跨度可以降至最小, 可以有效解决切割线在切割过程中由 于跨度大造成的切割线张力在割线过程中不稳定、 弯曲和抖动现象。 并且由 于中间辅助切割辊的支撑和固定作用, 使单、 多晶硅棒在切割过程中受力合 理、 匀衡稳定, 可以提高切割质量。  Since the auxiliary cutting roller is disposed between the two cutting rollers, the cutting area between the two cutting rollers is divided into two sections, and each cutting section can independently cut a single, polycrystalline silicon rod, so that each cutting section is cut. The span can be minimized, which can effectively solve the instability, bending and jitter of the cutting line tension during the cutting process due to the large span of the cutting line during the cutting process. Moreover, due to the support and fixing action of the intermediate auxiliary cutting roller, the single and polycrystalline silicon rods are subjected to force and uniformity during the cutting process, and the cutting quality can be improved.
三切割辊的设计使切割室内隔成两个独立的切割区间, 每个切割区间有 独立的工作台和进给***, 可以独立地切割一根硅棒, 两个区间就可切两根 硅棒,这样比较容易的设计切割较长硅棒的机器,本发明的三辊多线切割机, 在小体积、 小重量, 约 13吨、 低耗能的情况下可切割硅棒 1000mm长。  The three-cutting roller is designed to separate the cutting chamber into two separate cutting sections. Each cutting section has a separate table and feed system. It can cut one silicon rod independently, and two sections can cut two silicon rods. Therefore, it is relatively easy to design a machine for cutting long silicon rods. The three-roll multi-wire cutting machine of the present invention can cut a silicon rod by 1000 mm in a small volume, small weight, about 13 tons, and low energy consumption.
夹角 α过大, 会导致切割线带砂量不足, 影响切割品质, 因此, 上述夹 角 α选在 0° ~ 30。 范围内, 夹角 α选在 0° ~ 15。 的范围内较好。  If the angle α is too large, the amount of sand in the cutting line will be insufficient, which will affect the cutting quality. Therefore, the above angle α is selected from 0° to 30°. Within the range, the angle α is selected from 0° to 15°. The range is better.
由上述技术方案可知, 本发明有如下技术效果:  According to the above technical solution, the present invention has the following technical effects:
在两根切割辊的对称中心的上方设置了一根辅助切割辊, 辅助切割辊两 侧的切割线与两根切割辊轴心所在平面之间的夹角 α在 0° ~ 30。 范围内, 夹角 α选在 0° ~ 15。 的范围内较好。  An auxiliary cutting roller is disposed above the center of symmetry of the two cutting rolls, and the angle α between the cutting line on the two sides of the auxiliary cutting roller and the plane of the axes of the two cutting rolls is 0° to 30°. Within the range, the angle α is selected from 0° to 15°. The range is better.
通过设置辅助切割辊将切割区域分隔成两个区间, 每个切割区间独立地 切割一根单、 多晶硅棒, 每个切割区间的切割跨度可以降至最小, 可以有效 解决切割线在切割过程中由于跨度大造成的切割线张力在割线过程中不稳 定、 弯曲和抖动现象, 提高切割质量和切单、 多晶硅的通用性。  By setting the auxiliary cutting roller to divide the cutting area into two sections, each cutting section independently cuts a single and polycrystalline silicon rod, and the cutting span of each cutting section can be minimized, which can effectively solve the cutting line during the cutting process. The tension of the cutting line caused by the large span is unstable, curved and shaken during the securing process, improving the cutting quality and the versatility of the singulation and polysilicon.
并且由于中间辅助切割辊的支撑和固定作用, 使硅棒在切割过程中受力 合理、 勾衡稳定, 切割质量稳定。  And due to the support and fixation of the intermediate auxiliary cutting roller, the silicon rod is subjected to a reasonable force during the cutting process, the balance is stable, and the cutting quality is stable.
且设备体积小、 重量轻、 制造成本低、 产量大、 耗能小, 可大大降低切 割生产成本。 The device is small in size, light in weight, low in manufacturing cost, large in output, low in energy consumption, and can greatly reduce cutting. Cutting production costs.
本发明通过采用夹角 α在 0。 ~ 30。 范围内的三辊多线切割结构的设 计, 能够寻找到一条实现切割硅棒长度大于 800mm, 甚至可达到 1200mm以 上, 并且制造难度低, 制造成本低, 体积小、 低耗能、 重量轻、 产量大、 切 割质量好、 通用性强的低成本机型的设计制造之路。 附图说明  The present invention employs an angle α at 0. ~ 30. The design of the three-roll multi-wire cutting structure in the range can find a cutting silicon rod with a length of more than 800mm, even more than 1200mm, and the manufacturing difficulty is low, the manufacturing cost is low, the volume is small, the energy consumption is low, the weight is light, and the output is low. The design and manufacture of large, low-cut models with good cutting quality and versatility. DRAWINGS
图 1、 图 1A为现有的多线切割机工作原理图;  Figure 1 and Figure 1A show the working principle of the existing multi-wire cutting machine;
图 2、 图 2A为图 1所示多线切割机受力分析原理图;  Figure 2, Figure 2A is a schematic diagram of the force analysis of the multi-wire cutting machine shown in Figure 1;
图 3、 图 3A为另一方式多线切割机工作原理图;  Figure 3 and Figure 3A are diagrams showing the working principle of another multi-wire cutting machine;
图 3B为图 3所示多线切割机受力分析原理图;  Figure 3B is a schematic diagram of the force analysis of the multi-wire cutting machine shown in Figure 3;
图 4、 图 4A为本发明三辊多线切割机结构示意图;  4 and FIG. 4A are schematic structural views of a three-roll multi-wire cutting machine of the present invention; FIG.
图 4B为图 4所示多线切割机受力分析原理图;  4B is a schematic diagram of the force analysis of the multi-wire cutting machine shown in FIG. 4;
图 5为图 4的沿 A - A线的剖视图。  Figure 5 is a cross-sectional view taken along line A - A of Figure 4;
具体实施方式 detailed description
如图 4、 4A、 4B和图 5所示, 两根切割辊 11、 12及辅助切割辊 13分别 平行架设在切割室 71中, 两根切割辊 11、 12及辅助切割辊 13表面开有供 切割线通过的线槽(图 4和 5中未示出 ) , 辅助切割辊 13设置在两根切割 辊 11、 12的对称中心或对称中心的上方, 对两根切割辊 11、 12之间的切割 线 3进行支撑, 使得辅助切割辊 13两侧与两根切割辊 11、 12之间形成两个 独立的切割区, 辅助切割辊 13两侧的切割线 31、 32与两根切割辊轴心所在 平面 14之间的夹角 α在 0。 ~ 30。 范围内,夹角 α最好在 0。 ~ 15。 范围内; 两根切割辊 11、 12上方设有两套对称设置的工作台 4、 5及其进给***, 工 作台 4的进给***由电机 41、 丝杆 42、 直线导轨 43、 滑块 44及滑块支架 46组成, 电机 41固定在箱体 7上, 丝杆 42与电机 41轴同轴固定, 直线导 轨 43通过导轨支架 47固定在箱体 7上, 滑块 44固定在滑块支架 46上, 工 作台固定在滑块支架 46下方,滑块支架 46上设有与丝杆 42配合的螺母 45 , 当电机 41带动丝杆 42转动时, 螺母 45沿丝杆 42作上、 下运动, 使得滑块 44沿直线导轨 43运动, 从而带动工作台 5作进给运动。 上述工作台 4、 5进 给***的两个直线导轨分别垂直于辅助切割辊 13两侧的切割线 31、 32。 切 割辊 11下方的机箱中设有驱动电机 9,通过皮带 91与固定在切割辊 11轴上 的带轮传动连接。 图 4及图 5中的件号 6为向切割室 71内的切割线 3表面 喷切割砂浆的喷头。 图 5中件号 111和 131分别为切割辊 11和辅助切割辊 13与机箱 7连接的轴承座。 As shown in FIGS. 4, 4A, 4B and 5, the two cutting rolls 11, 12 and the auxiliary cutting rolls 13 are respectively erected in the cutting chamber 71, and the surfaces of the two cutting rolls 11, 12 and the auxiliary cutting rolls 13 are opened. A wire groove through which the cutting line passes (not shown in FIGS. 4 and 5), and the auxiliary cutting roller 13 is disposed above the center of symmetry or the center of symmetry of the two cutting rolls 11, 12, between the two cutting rolls 11, 12 The cutting line 3 is supported such that two separate cutting zones are formed between the two sides of the auxiliary cutting roller 13 and the two cutting rolls 11, 12, the cutting lines 31, 32 on both sides of the auxiliary cutting roller 13 and the two cutting roller axes The angle α between the planes 14 is at zero. ~ 30. Within the range, the angle α is preferably at zero. ~ 15. Within the range; two sets of symmetrically arranged worktables 4, 5 and their feed system are arranged above the two cutting rolls 11, 12, and the feed system of the worktable 4 is composed of a motor 41, a lead screw 42, a linear guide 43, and a slider 44 and the slider bracket 46, the motor 41 is fixed on the box body 7, the screw rod 42 is coaxially fixed with the shaft of the motor 41, the linear guide rail 43 is fixed on the box body 7 through the rail bracket 47, and the slider 44 is fixed on the slider bracket 46, the table is fixed under the slider bracket 46, and the slider bracket 46 is provided with a nut 45 matched with the screw rod 42 When the motor 41 drives the screw 42 to rotate, the nut 45 moves up and down along the screw rod 42, so that the slider 44 moves along the linear guide 43, thereby driving the table 5 for the feeding motion. The two linear guides of the above-described table 4, 5 feed system are perpendicular to the cutting lines 31, 32 on both sides of the auxiliary cutting roller 13, respectively. A drive motor 9 is provided in the casing below the cutter roller 11, and is coupled to the pulley fixed to the shaft of the cutter roller 11 via a belt 91. The part number 6 in Figs. 4 and 5 is a head which sprays a mortar to the surface of the cutting line 3 in the cutting chamber 71. The part numbers 111 and 131 in Fig. 5 are the bearing housings to which the cutting roller 11 and the auxiliary cutting roller 13 are connected to the chassis 7, respectively.
图 4右侧部分为切割线收放线***。 切割线 3由放线轮 82放出, 通过 导轮*** 81进入切割室 71 , 缠绕在切割辊 11、 12和辅助切割辊 13的线槽 里若干圏, 之后导出切割室 71 , 通过导轮*** 81回到收线轮 83。  The right part of Figure 4 is the cutting line retraction line system. The cutting line 3 is discharged by the payoff wheel 82, enters the cutting chamber 71 through the guide wheel system 81, is wound around a plurality of turns in the wire grooves of the cutting rolls 11, 12 and the auxiliary cutting roll 13, and then leads to the cutting chamber 71, passing through the guide wheel system 81. Return to the take-up reel 83.
由于辅助切割辊 13 两侧形成两个独立的切割区, 每个切割区可以切割 一根多晶棒, 因而每个切割区的跨度可以缩减至最小, 能够有效避免切割线 在切割过程中由于跨度大造成的切割线张力不稳定、 弯曲和抖动现象, 而设 备的体积并不增大。  Since two auxiliary cutting zones are formed on both sides of the auxiliary cutting roller 13, each cutting zone can cut one polycrystalline bar, so that the span of each cutting zone can be minimized, and the cutting line can be effectively prevented from being spanned during the cutting process. The large cutting line tension is unstable, curved and shaken, and the volume of the device does not increase.
以上借助较佳实施例描述了本发明的具体实施方式, 但是应该理解的 是, 这里具体的描述, 不应理解为对本发明的实质和范围的限定, 本领域内 的普通技术人员在阅读本说明书后对上述实施例做出的各种修改, 都属于本 发明所保护的范围。  The present invention has been described with reference to the preferred embodiments of the present invention, but it should be understood that the detailed description of the invention should not be construed Various modifications made to the above embodiments are within the scope of the present invention.

Claims

权 利 要 求 书 Claim
1、 三辊多线切割机, 包括两根平行设置在切割室 (71)内的切割辊 (11、 12), 以及设置在两根切割辊 (11、 12)上方中间的工作台及其进给***; 其特 征是: 切割室 (71)内还设置有一根辅助切割辊 (13), 所述辅助切割辊 (13)设置 在两根切割辊 (11、 12)的对称中心或对称中心的上方, 使得辅助切割辊 (13) 两侧的切割线 (31、 32)与两根切割辊 (11、 12)轴心所在平面(14)之间的夹角 在 0。 ~ 30。 范围内; 所述工作台及其进给***有两套, 两套工作台(4、 5) 及其进给***对称设置, 并且两套进给***的直线导轨分别垂直于辅助切割 辊 (13)两侧的切割线 (31、 32)。  1. A three-roll multi-wire cutting machine comprising two cutting rolls (11, 12) arranged in parallel in a cutting chamber (71), and a table disposed above the two cutting rolls (11, 12) and a feeding system; characterized in that: an auxiliary cutting roller (13) is further disposed in the cutting chamber (71), and the auxiliary cutting roller (13) is disposed at a symmetrical center or a symmetrical center of the two cutting rollers (11, 12) Above, the angle between the cutting line (31, 32) on both sides of the auxiliary cutting roller (13) and the plane (14) of the axis of the two cutting rolls (11, 12) is zero. ~ 30. Within the scope; the workbench and its feed system have two sets, two sets of worktables (4, 5) and their feed systems are symmetrically arranged, and the linear guides of the two sets of feed systems are perpendicular to the auxiliary cutting rolls (13 ) Cutting lines on both sides (31, 32).
2、根据权利要求 1所述的三辊多线切割机,其特征在于:辅助切割辊 (13) 两侧的切割线 (31、 32)与两根切割辊轴心所在平面(14)之间的夹角 α在 0。 ~ 30° 范围内。  2. A three-roll multi-wire cutting machine according to claim 1, characterized in that between the cutting lines (31, 32) on both sides of the auxiliary cutting roll (13) and the plane (14) of the axes of the two cutting rolls The angle α is at 0. ~ 30° range.
3、根据权利要求 2所述的三辊多线切割机,其特征在于:辅助切割辊 (13) 两侧的切割线 (31、 32)与两根切割辊轴心所在平面(14)之间的夹角 α在 0。 ~ 15° 范围内。  3. A three-roll multi-wire cutting machine according to claim 2, characterized in that between the cutting lines (31, 32) on both sides of the auxiliary cutting roller (13) and the plane (14) of the axes of the two cutting rolls The angle α is at 0. ~ 15° range.
PCT/CN2012/073806 2011-04-11 2012-04-11 Three roller multi-wire saw WO2012139498A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201120103575.8 2011-04-11
CN2011201035758U CN202016131U (en) 2011-04-11 2011-04-11 Three-roller multi-wire cutting machine

Publications (1)

Publication Number Publication Date
WO2012139498A1 true WO2012139498A1 (en) 2012-10-18

Family

ID=44809808

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/073806 WO2012139498A1 (en) 2011-04-11 2012-04-11 Three roller multi-wire saw

Country Status (2)

Country Link
CN (1) CN202016131U (en)
WO (1) WO2012139498A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510343B (en) * 2013-05-30 2015-12-01 G Tech Optoelectronics Corp Diamond line cutting machine and cutting method using same
CN114012914A (en) * 2021-11-01 2022-02-08 青岛高测科技股份有限公司 Flaw-piece clamping mechanism, flaw-piece unloading device and silicon rod cutting system

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202016131U (en) * 2011-04-11 2011-10-26 黄禹宁 Three-roller multi-wire cutting machine
CN102211362A (en) * 2011-04-11 2011-10-12 黄禹宁 Three-roller multi-wire cutting machine
CN102729348B (en) * 2012-07-13 2016-01-06 乐山新天源太阳能科技有限公司 Multi-line cutting machine
CN102962904B (en) * 2012-11-28 2015-08-05 天津市环欧半导体材料技术有限公司 A kind of three station multi-wire saw workbench
CN107626980B (en) * 2017-10-31 2019-07-12 乐山新天源太阳能科技有限公司 Three axis can detect the high-speed cutting machine of Buddha's warrior attendant thread breakage
CN114750311A (en) * 2022-04-21 2022-07-15 青岛高测科技股份有限公司 Method for cutting silicon rod by single wire and double wires, cutting equipment and cutting system
CN114750312A (en) * 2022-04-21 2022-07-15 青岛高测科技股份有限公司 Method, cutting equipment and cutting system for cutting silicon rod by single wire and three wires
CN114571618A (en) * 2022-04-21 2022-06-03 青岛高测科技股份有限公司 Method, cutting equipment and cutting system for vertically cutting silicon rod by three wires
CN114589823A (en) * 2022-04-21 2022-06-07 青岛高测科技股份有限公司 Method for single-wire cutting of silicon rod, cutting device and cutting system
CN114714226B (en) * 2022-06-01 2022-09-09 唐山晶玉科技股份有限公司 Double-station multi-wire saw inclined plane workbench
CN114953230A (en) * 2022-06-30 2022-08-30 青岛高测科技股份有限公司 Multi-wire cutting machine

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5570545A (en) * 1978-11-20 1980-05-28 Matsushita Electric Ind Co Ltd Multi-wire cutting device
WO1991012915A1 (en) * 1990-03-01 1991-09-05 Charles Hauser Industrial device for sawing parts into thin slices
JP2002052457A (en) * 2000-08-08 2002-02-19 Takizawa Tekkosho:Kk Wire saw
JP2004001218A (en) * 2003-06-03 2004-01-08 Takizawa Tekkosho:Kk Wire saw
CN102211362A (en) * 2011-04-11 2011-10-12 黄禹宁 Three-roller multi-wire cutting machine
CN202016131U (en) * 2011-04-11 2011-10-26 黄禹宁 Three-roller multi-wire cutting machine
CN202162898U (en) * 2010-09-17 2012-03-14 上海日进机床有限公司 Diamond wire slicer for cutting crystalline silicon rod
CN102398317A (en) * 2010-09-17 2012-04-04 上海日进机床有限公司 Diamond cutting line slicing machine for cutting crystal silicon rod

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5570545A (en) * 1978-11-20 1980-05-28 Matsushita Electric Ind Co Ltd Multi-wire cutting device
WO1991012915A1 (en) * 1990-03-01 1991-09-05 Charles Hauser Industrial device for sawing parts into thin slices
JP2002052457A (en) * 2000-08-08 2002-02-19 Takizawa Tekkosho:Kk Wire saw
JP2004001218A (en) * 2003-06-03 2004-01-08 Takizawa Tekkosho:Kk Wire saw
CN202162898U (en) * 2010-09-17 2012-03-14 上海日进机床有限公司 Diamond wire slicer for cutting crystalline silicon rod
CN102398317A (en) * 2010-09-17 2012-04-04 上海日进机床有限公司 Diamond cutting line slicing machine for cutting crystal silicon rod
CN102211362A (en) * 2011-04-11 2011-10-12 黄禹宁 Three-roller multi-wire cutting machine
CN202016131U (en) * 2011-04-11 2011-10-26 黄禹宁 Three-roller multi-wire cutting machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510343B (en) * 2013-05-30 2015-12-01 G Tech Optoelectronics Corp Diamond line cutting machine and cutting method using same
CN114012914A (en) * 2021-11-01 2022-02-08 青岛高测科技股份有限公司 Flaw-piece clamping mechanism, flaw-piece unloading device and silicon rod cutting system

Also Published As

Publication number Publication date
CN202016131U (en) 2011-10-26

Similar Documents

Publication Publication Date Title
WO2012139498A1 (en) Three roller multi-wire saw
CN103407009B (en) Diamond wire multi-line cutting machine
TWI507282B (en) Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece
KR101314729B1 (en) Abrasive wire sawing
KR101283393B1 (en) Method of Improving Nanotopography on Surface of Wafer and Wire Saw Device
CN103203808B (en) Efficient multi-line cutting device and method
CN102211362A (en) Three-roller multi-wire cutting machine
KR100831747B1 (en) Wire saw machine and work machining method using thereof
CN202053389U (en) Wire cutting device
CN114833955B (en) Wire cutting machine
CN108714978B (en) Crystal silicon edge cutting and grinding integrated machine
CN106738392B (en) Turn to multi-line cutting method and equipment
CN102837372B (en) Worktable of multi-wire sawing machine
CN104552634A (en) Novel numerically-controlled diamond wire sapphire slicer
CN202764052U (en) Multi-line cutting machine for processing crisp and hard material curved surfaces
CN211415633U (en) Honeycomb ceramic fixed-length cutting machine
CN204566417U (en) Novel numerical control diamond wire sapphire slices machine
KR101066205B1 (en) Wire saw machine
CN210256793U (en) Large-size silicon carbide wafer diamond wire cutting machine tool
CN211566525U (en) Solar cell crystalline silicon cutting equipment
CN108327106A (en) Solar silicon wafers diamond multi-line cutting machine
CN108437248A (en) A kind of multi-wire saw vibration auxiliary device
CN111546519A (en) Cutting process for improving geometric parameters of large-diameter silicon wafer
CN207682684U (en) Multi-line cutting machine for processing solar panel
CN221187151U (en) Large-size sapphire crystal bar cutting device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12771179

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12771179

Country of ref document: EP

Kind code of ref document: A1