CN112014711A - 一种晶圆探针台 - Google Patents
一种晶圆探针台 Download PDFInfo
- Publication number
- CN112014711A CN112014711A CN202011005550.4A CN202011005550A CN112014711A CN 112014711 A CN112014711 A CN 112014711A CN 202011005550 A CN202011005550 A CN 202011005550A CN 112014711 A CN112014711 A CN 112014711A
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- CN
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- Prior art keywords
- wafer
- probe card
- bearing table
- slide rail
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000523 sample Substances 0.000 title claims abstract description 126
- 238000001514 detection method Methods 0.000 claims abstract description 36
- 238000012360 testing method Methods 0.000 claims abstract description 34
- 238000003384 imaging method Methods 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims description 13
- 230000002250 progressing effect Effects 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 239000004579 marble Substances 0.000 claims description 3
- 230000000750 progressive effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 78
- 239000013078 crystal Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2648—Characterising semiconductor materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8411—Application to online plant, process monitoring
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011005550.4A CN112014711B (zh) | 2020-09-22 | 一种晶圆探针台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011005550.4A CN112014711B (zh) | 2020-09-22 | 一种晶圆探针台 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112014711A true CN112014711A (zh) | 2020-12-01 |
CN112014711B CN112014711B (zh) | 2024-07-26 |
Family
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112863587A (zh) * | 2021-01-26 | 2021-05-28 | 深圳市卓然电子有限公司 | 一种闪存芯片的测试方法 |
CN113049881A (zh) * | 2021-04-09 | 2021-06-29 | 中国电子技术标准化研究院 | 集成电路外延层扩展电阻测试仪 |
TWI779978B (zh) * | 2021-12-29 | 2022-10-01 | 卓金星 | 載物平台裝置及包括該載物平台裝置之量測裝置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203811645U (zh) * | 2014-05-08 | 2014-09-03 | 中芯国际集成电路制造(北京)有限公司 | 测试探针台 |
CN104181449A (zh) * | 2009-09-03 | 2014-12-03 | 应用材料公司 | 测试设备与相关方法 |
JP2018037538A (ja) * | 2016-08-31 | 2018-03-08 | 株式会社東京精密 | プローバ |
CN207992391U (zh) * | 2018-03-26 | 2018-10-19 | 安徽钜芯半导体科技有限公司 | 一种晶圆测试装置 |
CN212569024U (zh) * | 2020-09-22 | 2021-02-19 | 东莞市凯迪微清洗技术有限公司 | 一种晶圆探针台 |
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104181449A (zh) * | 2009-09-03 | 2014-12-03 | 应用材料公司 | 测试设备与相关方法 |
CN203811645U (zh) * | 2014-05-08 | 2014-09-03 | 中芯国际集成电路制造(北京)有限公司 | 测试探针台 |
JP2018037538A (ja) * | 2016-08-31 | 2018-03-08 | 株式会社東京精密 | プローバ |
CN207992391U (zh) * | 2018-03-26 | 2018-10-19 | 安徽钜芯半导体科技有限公司 | 一种晶圆测试装置 |
CN212569024U (zh) * | 2020-09-22 | 2021-02-19 | 东莞市凯迪微清洗技术有限公司 | 一种晶圆探针台 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112863587A (zh) * | 2021-01-26 | 2021-05-28 | 深圳市卓然电子有限公司 | 一种闪存芯片的测试方法 |
CN113049881A (zh) * | 2021-04-09 | 2021-06-29 | 中国电子技术标准化研究院 | 集成电路外延层扩展电阻测试仪 |
TWI779978B (zh) * | 2021-12-29 | 2022-10-01 | 卓金星 | 載物平台裝置及包括該載物平台裝置之量測裝置 |
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CB02 | Change of applicant information |
Address after: 523000 Room 302, 3rd floor, building A1, 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Applicant after: Dongguan Kaidi Micro Intelligent Equipment Co.,Ltd. Address before: 523000 Room 302, 3rd floor, building A1, 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Applicant before: Dongguan Kaidi micro Cleaning Technology Co.,Ltd. |
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CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 523000 Room 302, 3rd floor, building A1, 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Applicant after: Guangdong Kaidi Micro Intelligent Equipment Co.,Ltd. Address before: 523000 Room 302, 3rd floor, building A1, 38 Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Applicant before: Dongguan Kaidi Micro Intelligent Equipment Co.,Ltd. |
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