CN112005369B - 制造半导体器件的方法及半导体器件 - Google Patents
制造半导体器件的方法及半导体器件 Download PDFInfo
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- CN112005369B CN112005369B CN201880089378.XA CN201880089378A CN112005369B CN 112005369 B CN112005369 B CN 112005369B CN 201880089378 A CN201880089378 A CN 201880089378A CN 112005369 B CN112005369 B CN 112005369B
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Classifications
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Ceramic Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201862631134P | 2018-02-15 | 2018-02-15 | |
US62/631,134 | 2018-02-15 | ||
PCT/US2018/028444 WO2019160570A1 (en) | 2018-02-15 | 2018-04-19 | System and method of fabricating tim-less hermetic flat top his/emi shield package |
Publications (2)
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CN112005369A CN112005369A (zh) | 2020-11-27 |
CN112005369B true CN112005369B (zh) | 2024-05-28 |
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CN201880089378.XA Active CN112005369B (zh) | 2018-02-15 | 2018-04-19 | 制造半导体器件的方法及半导体器件 |
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US (1) | US10734326B2 (zh) |
CN (1) | CN112005369B (zh) |
WO (1) | WO2019160570A1 (zh) |
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US20190252324A1 (en) | 2019-08-15 |
WO2019160570A1 (en) | 2019-08-22 |
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US10734326B2 (en) | 2020-08-04 |
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