CN112004329A - Processing method for preventing false copper exposure of circuit board - Google Patents
Processing method for preventing false copper exposure of circuit board Download PDFInfo
- Publication number
- CN112004329A CN112004329A CN202010899388.9A CN202010899388A CN112004329A CN 112004329 A CN112004329 A CN 112004329A CN 202010899388 A CN202010899388 A CN 202010899388A CN 112004329 A CN112004329 A CN 112004329A
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- Prior art keywords
- circuit board
- processing method
- printing
- screen
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 15
- 239000010949 copper Substances 0.000 title claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 238000001035 drying Methods 0.000 claims abstract description 13
- 238000002360 preparation method Methods 0.000 claims abstract description 8
- 238000007689 inspection Methods 0.000 claims abstract description 7
- 238000007639 printing Methods 0.000 claims description 54
- 238000007650 screen-printing Methods 0.000 claims description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 235000017550 sodium carbonate Nutrition 0.000 claims description 3
- 238000005406 washing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010019 resist printing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a processing method for avoiding false copper exposure of a circuit board, which comprises a preparation step, a cleaning step, a first silk-screen step, a first pre-drying step, a second silk-screen step, a second pre-drying step, an alignment step, an exposure step, a development step, an inspection step and a baking step.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a processing method for preventing false copper exposure of a circuit board.
Background
The rigid-flex board is a circuit board-rigid-flex board with FPC (flexible printed circuit) and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through procedures such as pressing and the like.
The rigid-flex circuit board has the characteristics of both FPC and PCB, so that the rigid-flex circuit board can be used in products with special requirements, has a certain flexible area and a certain rigid area, and is greatly helpful for saving the internal space of the products, reducing the volume of finished products and improving the performance of the products.
In addition, in the design of the soft and hard combined circuit board, due to the limitation of the wiring space of the product design, via holes are arranged below part of the surface bonding pad, and in order to ensure the welding quality of components on the surface bonding pad, the via holes below the surface bonding pad need to be plugged by a plugging process so as to ensure the smoothness of the surface bonding pad. However, the thickness of the rigid-flexible board is getting thicker and thicker according to different structures and layers, so that poor coverage of solder resist ink is produced, and the phenomenon is called false copper leakage.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a processing method for avoiding false copper leakage of a circuit board, which can enable solder resist ink to completely cover the surface of a via hole and avoid false copper leakage.
The purpose of the invention is realized by adopting the following technical scheme:
a processing method for avoiding false copper exposure of a circuit board comprises the following steps:
the preparation method comprises the following steps: coating a water film on a screen printing plate with printing patterns, placing a film plate with the printing patterns on the screen printing plate coated with the water film, carrying out exposure treatment, and cleaning the exposed screen printing plate by using a developing solution so as to form the patterns on the water film, wherein the patterns are the same as the printing patterns on the screen printing plate, thus manufacturing the printing screen printing plate;
cleaning: removing foreign matters on the surface of the circuit board;
a first silk-screen step: carrying out first silk-screen printing on the upper surface of the circuit board by using a printing screen plate so as to print a printing pattern on the surface of the circuit board to form a first printing pattern;
a first pre-baking step: baking the circuit board by using a dryer, and drying the first printed pattern;
a second silk-screen step: carrying out second silk-screen printing on the lower surface of the circuit board by using the printing screen plate to form a second printing pattern;
a second pre-drying step: baking the circuit board by using a dryer, and drying the second printed pattern;
and (3) aligning: respectively arranging the film plates with the product patterns on the upper surface and the lower surface of the circuit board, aligning the product patterns of the film plate arranged on the upper surface of the circuit board with the first printing patterns to shield part of the first printing patterns, aligning the product patterns of the film plate arranged on the lower surface of the circuit board with the second printing patterns to shield part of the second printing patterns,
an exposure step: exposing the first printing pattern and the second printing pattern of the unshielded part by using an exposure machine;
a developing step: cleaning the circuit board by using a developing solution to remove the shielding part of the first printed pattern and the second printed pattern so as to form product patterns on the upper surface and the lower surface of the circuit board;
baking: and drying the circuit board by using a dryer to solidify the product pattern.
Further, after the developing step, the baking step also comprises an inspection step before, and in the inspection step, the surface of the circuit board is detected by using a magnifying glass.
Further, the cleaning step comprises an acid washing step and a polishing step, wherein the circuit board is treated by sulfuric acid with the concentration of 3% in the acid washing step, and the circuit board treated by the acid washing step is polished by diamond in the polishing step to remove burrs on the surface of the circuit board.
Further, in the preparing step, the thickness of the hydrophenanthrin is 30 um.
Further, the baking temperature in the first pre-baking step is 60-80 ℃, and the heating time duration is as follows: 10min-20min, wherein the baking temperature in the second pre-baking step is 60-80 ℃, and the heating time is as follows: 20min-40 min.
Further, the baking temperature in the baking step is 150-160 ℃, and the baking time is 90-150 min.
Further, in the preparation step and the development step, Na2CO3 is used as a developer.
Further, the exposure time in the exposure step was 8 s.
Further, in the first silk-screen step and the second silk-screen step, the silk-screen pressure is 6Kg/cm2, the silk-screen speed is 2m/min, and the adopted ink is solder resist ink with the viscosity of 150 dpa.s.
Compared with the prior art, the invention has the beneficial effects that:
this application is through at half tone surface coating water film to increase the thickness of half tone, thereby when increasing the silk screen printing, store up in printing half tone fretwork part, the printing ink volume of printed pattern department promptly, thereby increase the coating at the printing ink thickness on circuit board surface, thicker printing ink can be attached to the great via hole surface of thickness, in order to avoid it to expose, appears false hourglass copper.
Drawings
FIG. 1 is a flow chart of a processing method for preventing false copper exposure of a circuit board according to the present invention;
the figure is as follows: 1. a preparation step; 2. cleaning; 3. a first silk-screen step; 4. a first pre-baking step; 5. a second silk-screen step; 6. a second pre-drying step; 7. aligning; 8. an exposure step; 9. a developing step; 10. a checking step; 11. and (5) baking.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
Fig. 1 shows a processing method for avoiding false copper exposure of a circuit board, which comprises the following steps:
preparation step 1: coating a water film on a screen printing plate with printing patterns, placing a film plate with the printing patterns on the screen printing plate coated with the water film, carrying out exposure treatment, and cleaning the exposed screen printing plate by using a developing solution so as to form the patterns on the water film, wherein the patterns are the same as the printing patterns on the screen printing plate, thus manufacturing the printing screen printing plate; the position that the printed pattern need cover on this application and the circuit board and hinder the solder resist printing ink is the same or close, and it can be according to the different and transform of solder resist printing ink cover position on the circuit board to do not restrict its specific pattern in the application.
In this application the thickness of water film is 30um, and the printing pattern is for forming the fretwork part on half tone and water film, and when carrying out exposure, the film board will carry out part to the water film and shelter from, and the ultraviolet ray will shine on the water film that the film board does not shelter from the part, makes this part of water film solidification, and the part that does not expose will dissolve in developing solution to form the pattern the same with the printing pattern on the half tone on the water film.
This application is through at half tone surface coating water film to increase the thickness of half tone, thereby when increasing the silk screen printing, store up in printing half tone fretwork part, the printing ink volume of printed pattern department promptly, thereby increase the coating at the printing ink thickness on circuit board surface, thicker printing ink can be attached to the great via hole surface of thickness, in order to avoid it to expose, appears false hourglass copper.
And 2, cleaning: foreign matters on the surface of the circuit board are removed, and the influence of the foreign matters on the silk screen printing is avoided;
the method comprises a pickling step and a polishing step, wherein sulfuric acid with the concentration of 3% is used for processing the circuit board in the pickling step to remove oxides and corrosion on the surface of the circuit board and avoid the influence on the silk-screen printing effect, diamond is used for polishing the circuit board processed in the pickling step in the polishing step to remove burrs on the surface of the circuit board and remove burrs in a worn-off plug hole, and if burrs exist in the plug hole, false copper leakage may occur after silk-screen printing.
A first silk-screen step 3: carrying out first silk-screen printing on the upper surface of the circuit board by using a printing screen plate so as to print a printing pattern on the surface of the circuit board to form a first printing pattern; the first printed pattern in this application is a solder resist ink layer attached to the upper surface of the circuit board, which is used to cover the solder vias and the plug holes existing in the upper surface of the circuit board.
A first pre-baking step 4: baking the circuit board by using a dryer, and drying the first printed pattern;
in the step, the baking temperature of the dryer is 60-80 ℃, and the heating time is as follows: 10min-20min, optimally 72 ℃, and the heating time is as follows: and 15min, the first printed pattern can be dried preliminarily, and the phenomenon that the solder resist ink of the first printed pattern is displaced to influence the coverage effect or cause the covered plug holes to be exposed and cause false copper exposure during the second silk-screen step 5 is avoided.
And 5, a second silk-screen printing step: carrying out second silk-screen printing on the lower surface of the circuit board by using the printing screen plate to form a second printing pattern; the second printed pattern in this application is a solder resist ink layer attached to the lower surface of the circuit board, which is used to cover the solder apertures and the plug holes existing in the lower surface of the circuit board.
A second pre-baking step 6: baking the circuit board by using a dryer, and drying the second printed pattern;
in the second pre-baking step 6, the baking temperature is 60-80 ℃, and the heating time is as follows: 20min-40min, preferably 72 ℃, and a drying time of 30min to enable the second printed pattern to be dried preliminarily.
And 7, contraposition step: respectively arranging the film plates with the product patterns on the upper surface and the lower surface of the circuit board, aligning the product patterns of the film plate arranged on the upper surface of the circuit board with the first printing patterns to shield part of the first printing patterns, aligning the product patterns of the film plate arranged on the lower surface of the circuit board with the second printing patterns to shield part of the second printing patterns,
and an exposure step 8: exposing the first printing pattern and the second printing pattern of the unshielded part by using an exposure machine for 8 s; after printing and baking the solder resist ink, carrying out photoimaging exposure on the solder resist ink, and irradiating by ultraviolet rays to enable an epoxy resin system with free radicals to generate photopolymerization crosslinking reaction, namely the solder resist ink in the first printing pattern and the second printing pattern of the unshielded part is cured, and the unshielded part (the film board shielding part) is melted or falls off in a developing solution; the photosensitive part is photo-cured, developed and sprayed in sodium carbonate solution without falling off, and the branch is connected into permanent curing under the heat curing operation.
And a developing step 9: cleaning the circuit board by using a developing solution to remove the shielding part of the first printed pattern and the second printed pattern so as to form product patterns on the upper surface and the lower surface of the circuit board; the developing solution adopts Na2CO 3.
And a baking step 11: and drying the circuit board by using a dryer to solidify the product pattern.
In the baking step 11, the baking temperature is 150-160 ℃, the baking time is 90-150 min, preferably 155 ℃, and the baking time is 120 min, so that the solder resist ink can be linked to be permanently cured at high temperature.
In addition, after the developing step 9, the baking step 11 further includes an inspection step 10, in the inspection step 10, the surface of the circuit board is detected by using a magnifying glass, and the magnifying glass is of a magnification of 40 times, so that a user can inspect whether the circuit board has the conditions of incomplete development, ink deficiency, ink residue, poor exposure and the like after silk-screen printing by using the magnifying glass in a visual mode.
Preferably, in the first screen printing step 3 and the second screen printing step 5, the screen printing pressure is 6Kg/cm2, the screen printing speed is 2m/min, and the adopted ink is solder resist ink with the viscosity of 150 dpa.s.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (9)
1. A processing method for avoiding false copper exposure of a circuit board is characterized by comprising the following steps:
the preparation method comprises the following steps: coating a water film on a screen printing plate with printing patterns, placing a film plate with the printing patterns on the screen printing plate coated with the water film, carrying out exposure treatment, and cleaning the exposed screen printing plate by using a developing solution so as to form the patterns on the water film, wherein the patterns are the same as the printing patterns on the screen printing plate, thus manufacturing the printing screen printing plate;
cleaning: removing foreign matters on the surface of the circuit board;
a first silk-screen step: carrying out first silk-screen printing on the upper surface of the circuit board by using a printing screen plate so as to print a printing pattern on the surface of the circuit board to form a first printing pattern;
a first pre-baking step: baking the circuit board by using a dryer to dry the first printed pattern;
a second silk-screen step: carrying out second silk-screen printing on the lower surface of the circuit board by using the printing screen plate to form a second printing pattern;
a second pre-drying step: baking the circuit board by using a dryer to dry the second printed pattern;
and (3) aligning: respectively placing the film plates with the product patterns on the upper surface and the lower surface of the circuit board, aligning the product patterns of the film plates placed on the upper surface of the circuit board with the first printed patterns and shielding part of the first printed patterns, aligning the product patterns of the film plates placed on the lower surface of the circuit board with the second printed patterns and shielding part of the second printed patterns;
an exposure step: exposing the first printing pattern and the second printing pattern of the unshielded part by using an exposure machine;
a developing step: cleaning the circuit board by using a developer to remove the first printed pattern and the second printed pattern of the shielding part so as to form product patterns on the upper surface and the lower surface of the circuit board;
baking: and drying the circuit board by using a dryer to solidify the product pattern.
2. The processing method of claim 1, wherein the processing method comprises: after the developing step, before the baking step, the method also comprises an inspection step, wherein the surface of the circuit board is detected by using a magnifying glass in the inspection step.
3. The processing method of claim 1, wherein the processing method comprises: the cleaning step comprises an acid pickling step and a polishing step, wherein the circuit board is treated by sulfuric acid with the concentration of 3% in the acid pickling step, and the circuit board treated by the acid pickling step is polished by diamond in the polishing step to remove burrs on the surface of the circuit board.
4. The processing method of claim 1, wherein the processing method comprises: in the preparation step, the thickness of the hydrophenanthrin is 30 um.
5. The processing method of claim 1, wherein the processing method comprises: the baking temperature in the first pre-baking step is 60-80 ℃, and the heating time is as follows: 10min-20min, wherein the baking temperature in the second pre-baking step is 60-80 ℃, and the heating time is as follows: 20min-40 min.
6. The processing method of claim 1, wherein the processing method comprises: in the baking step, the baking temperature is 150-160 ℃, and the baking time is 90-150 min.
7. The processing method of claim 1, wherein the processing method comprises: in the preparation step and the development step, Na2CO3 is used as a developer.
8. The processing method of claim 1, wherein the processing method comprises: the exposure time in the exposure step was 8 s.
9. The processing method of claim 1, wherein the processing method comprises: in the first silk-screen step and the second silk-screen step, the silk-screen pressure is 6Kg/cm2, the silk-screen speed is 2m/min, and the adopted ink is solder resist ink with the viscosity of 150 dpa.s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010899388.9A CN112004329B (en) | 2020-08-31 | 2020-08-31 | Processing method for avoiding false copper exposure of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010899388.9A CN112004329B (en) | 2020-08-31 | 2020-08-31 | Processing method for avoiding false copper exposure of circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN112004329A true CN112004329A (en) | 2020-11-27 |
| CN112004329B CN112004329B (en) | 2024-03-08 |
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| CN202010899388.9A Active CN112004329B (en) | 2020-08-31 | 2020-08-31 | Processing method for avoiding false copper exposure of circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411969A (en) * | 2021-06-01 | 2021-09-17 | 高德（无锡）电子有限公司 | Process for improving LDD flow laser perforation plug hole false exposure |
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| Publication number | Publication date |
|---|---|
| CN112004329B (en) | 2024-03-08 |
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