CN112001137A - Optimal key configuration determining method for microwave circuit interconnection signal transmission - Google Patents

Abstract

The invention discloses a method for determining optimal strip key configuration for microwave circuit interconnection signal transmission, which comprises the steps of determining four types of strip key interconnection geometry, physical properties and electromagnetic transmission parameters of single Gauss, double Gauss, single circular arc and double circular arc, respectively establishing four types of strip key interconnection configuration parametric characterization models, and respectively establishing four types of strip key interconnection structure electromagnetic models through space geometric characteristic comparison; establishing a four-type gold-strip bonding interconnection configuration and signal transmission performance prediction model; the transmission electrical performance of single and double gold belt interconnection signals is compared with that of a gold belt interconnection signal with a Gaussian configuration and an arc configuration; and determining the optimal configuration of the gold strip interconnection facing the signal transmission of the microwave circuit. The method can realize accurate prediction from morphological parameters of different types of gold belt interconnection structures to signal transmission performance, compares and determines the optimal gold belt interconnection configuration facing microwave circuit signal transmission, guides selection and optimization of microwave circuit interconnection configuration, and effectively improves the development quality of microwave products.

Description

Optimal key configuration determining method for microwave circuit interconnection signal transmission

Technical Field

The invention belongs to the technical field of microwave radio frequency circuits, and particularly relates to a method for determining an optimal key configuration for microwave circuit interconnection signal transmission, which can be used for guiding the optimal key belt interconnection design and selection of signal transmission performance in a microwave circuit in engineering design and manufacture.

Background

With the rapid development of modern electronic science and technology, microwave integrated circuits are widely applied in advanced fields such as interconnection communication, space navigation, target detection, electronic countermeasure and the like. As a core component of microwave electronic equipment, under the influence of moore's law and post-moore's law, the development of microwave integrated circuits is gradually moving towards "four high one light one small", that is, high integration, high power, high frequency, high reliability, and light weight and miniaturization. The impact of the selection and design of interconnections in microwave circuits on signal transmission performance is increasing. The circuit interconnection problem directly causes the increase of signal transmission loss, the reduction of mechanical and electrical reliability, and even the integral failure of the integrated circuit. Therefore, the development level of the microwave integrated circuit with high performance, especially the development level of the interconnection in the microwave circuit, is a key technology for breaking through the improvement of the performance of microwave electronic equipment.

In the process of designing, manufacturing and using the microwave integrated circuit, the interconnection of the microwave circuit has manufacturing precision errors and bears the deformation of an interconnection structure caused by external environmental loads, so that the interconnection between the circuit and the module is often designed into a telescopic flexible structure. The flexible interconnection structure has the advantages that effective signal transmission is guaranteed, meanwhile, the effect of containing manufacturing errors and buffering environmental load influence is achieved, and interconnection reliability is remarkably improved. However, the uncertainty of the influence of the flexible interconnection configuration and the interconnection number on signal transmission and the non-directivity of the selection of the interconnection configuration and the interconnection number under the condition of oriented to the optimal signal transmission performance become important factors for restricting the performance improvement of the microwave integrated circuit. In the existing research, the related literature of the optimal interconnection configuration determination method for microwave circuit interconnection signal transmission is less, and the optimal interconnection configuration determination conforming to the engineering performance index is usually realized through long-term artificial experience, a large amount of repeated software simulation and repeated tests in engineering. Therefore, the production cost is increased, the working efficiency is low, the influence of actual working conditions and requirements is caused, the universality is poor, and the selection of the optimal interconnection configuration for the signal transmission performance is difficult to realize quickly and effectively.

Therefore, aiming at a typical gold ribbon bonding interconnection structure in a microwave integrated circuit, four types of interconnection configurations are selected, namely single arc interconnection, double arc interconnection, single Gaussian interconnection and double Gaussian interconnection, an optimal strip key configuration determination method for microwave circuit interconnection signal transmission is deeply researched, parameterized characterization modeling and spatial characteristic comparison are carried out on the four types of gold ribbon interconnection configurations, a prediction model from configuration parameters and transmission frequency to signal transmission performance of the four types of gold ribbon interconnection is established, and single working conditions such as single indexes, comprehensive indexes, wide bands and deformation parameters and electrical performance under the comprehensive working conditions are comprehensively analyzed and compared, so that the optimal strip key interconnection configurations such as performance optimal interconnection, lowest consumable material interconnection, simplest process interconnection, minimum space occupation interconnection and the like are determined. Theoretical guidance is provided for engineering design and manufacture personnel in selection and design optimization of microwave integrated circuit interconnection, and the development level of high-frequency active microwave products is improved.

Disclosure of Invention

In order to solve the problems, the invention provides a method for determining the optimal key configuration for microwave circuit interconnection signal transmission, so as to realize quick and accurate selection of the optimal interconnection of the electrical performance in the opposite direction, and provide theoretical support for the optimization of microwave circuit interconnection design and the improvement of the electrical performance under consideration of manufacturing errors and environmental loads.

The technical solution for realizing the purpose of the invention is that a method for determining the optimal key configuration for microwave circuit interconnection signal transmission comprises the following steps:

(1) determining four types of metal band bonding interconnection geometric parameters and physical parameters of single Gauss, double Gauss, single circular arc and double circular arc according to the specific interconnection requirement in the high-frequency microwave circuit;

(2) determining four types of metal strip bonding interconnection electromagnetic transmission parameters according to interconnection working conditions and performance indexes in the microwave circuit;

(3) respectively establishing four types of metal strip bonding interconnection configuration parameterized representation models according to interconnection configuration in the microwave circuit and actual engineering investigation;

(4) comparing the space geometric characteristics of the four types of gold ribbon bonding interconnection configurations based on the four types of gold ribbon bonding interconnection configuration parameterized representation models;

(5) respectively establishing four types of metal strip bonding interconnection structure electromagnetic models in three-dimensional high-frequency structure simulation software based on four types of metal strip bonding interconnection configuration parameterized representation models;

(6) establishing a four-type metal strip bonding interconnection configuration and signal transmission performance prediction model according to the established four-type metal strip bonding interconnection configuration parameterized representation model and a response surface method;

(7) comparing the transmission electrical performance of single and double Gaussian-shaped gold belt interconnection signals according to the established four types of gold belt bonding interconnection configuration and signal transmission performance prediction models;

(8) comparing the transmission electrical performance of the single and double arc-shaped gold belt interconnection signals according to the established four types of gold belt bonding interconnection configuration and signal transmission performance prediction models;

(9) according to the established model for predicting the four types of gold strip bonding interconnection configurations and signal transmission performance, the electrical transmission performance of the gold strip interconnection signals with the Gaussian configuration and the arc configuration is compared;

(10) and determining the optimal gold belt interconnection configuration facing the microwave circuit signal transmission according to the established four types of gold belt bonding interconnection configurations, the signal transmission performance prediction model and the comparison result.

Further, the geometric parameters of single Gauss, double Gauss, single arc and double arcs which are the same are determined to comprise the width B of the four types of gold bands, the gap g of the medium modules and the arch height h of the gold bands_b(ii) a Gold strip thickness T and left end microstrip width W_lRight microstrip width W_rThickness h of the left end dielectric substrate₁Thickness h of right dielectric substrate₂Thickness h of microstrip₃Length l of left end gold belt bonding position₁Distance d from the left end of the microstrip to the left end of the substrate₁Distance p from the left part of the gold strip bonding to the left end of the microstrip₁Distance p between right end of gold strip bonding and right end of micro-strip₂Distance d from the right end of the microstrip to the right end of the substrate₂And the length l of the right gold ribbon bonding part₂；

Determining different geometric parameters of a single Gaussian, a double Gaussian, a single arc and a double arc comprises the following steps: width B of four kinds of gold belt, gap g of medium module and arch height h of gold belt_b(ii) a Width of gold band B of single Gauss and single arc_sWidth B of gold band of double Gauss and double circular arcs_dThe gaps of the medium modules of a single Gauss and a single arc are respectively g_sgAnd g_scThe gap between the dielectric modules of the double Gauss and the double circular arcs is g_dgAnd g_dcThe arch heights of the gold belt of a single Gauss and a single arc are h respectively_bsgAnd h_bscThe gap between the dielectric modules of the double Gauss and the double circular arcs is h_bdgAnd h_bdcDouble Gauss and double arc gold band gap W_g；

Determining the same physical parameters of a single Gauss, a double Gauss, a single arc and a double arc comprises determining the relative dielectric constant of the left end dielectric substrate_rlAnd the relative dielectric constant of the right dielectric substrate_rrDielectric loss angle of the left end dielectric substrate₁And right dielectric substrate dielectric loss angle₂；

Determining four types of metal strip bonding interconnection electromagnetic transmission parameters, specifically comprising: signal transmission frequency f, return loss S₁₁And insertion loss S₂₁。

Further, in the step (3), a parameterized representation model is performed on four types of metal strip bonding interconnection configurations, and the method is performed according to the following steps:

(3a) carrying out parametric representation on single and double Gaussian gold bands by adopting a Gaussian distribution function according to the characteristic analysis of the gold band bonding interconnection configuration;

(3b) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, carrying out parameterized representation on single and double Gaussian gold ribbons by adopting Gaussian distribution functions, and determining the Gaussian distribution representation functions of the single and double gold ribbon bonding interconnection configurations;

(3c) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, carrying out parametric characterization on single and double Gaussian gold ribbons by adopting a Gaussian distribution function, and calculating the differential length of the gold ribbon on the gold ribbon non-bonding area line;

(3d) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, carrying out parametric characterization on single and double Gaussian gold ribbons by adopting a Gaussian distribution function, and establishing single and double Gaussian gold ribbon bonding interconnection configuration parametric characterization models;

(3e) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, carrying out parametric representation on single and double arc gold ribbons by adopting an arc function, and determining the arc functions of the single and double gold ribbon bonding interconnection configurations;

(3f) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, single and double arc gold ribbons are parameterized and characterized by arc functions, and the differential length of the gold ribbon on the gold ribbon non-bonding area line is calculated;

(3g) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, single-arc and double-arc gold ribbons are parameterized and characterized by adopting an arc function, and single-arc and double-arc gold ribbon bonding interconnection configuration parameterized and characterized models are established.

Further, in the step (4), comparing the spatial geometrical characteristics of the four types of metal strip bonding interconnection configurations, according to the following steps:

(4a) according to the established four-type gold band bonding interconnection configuration parameterized representation model, carrying out space occupied volume comparison on a single gold band and a Gauss gold band, and removing a gold band gap W_gIn contrast, the sum of the widths of the two gold bands is equal to the width 2B of a single gold band_d＝B_sCalculating the volume occupied by the space of a single gold strip and the space occupied by two gold strips when other structural parameters are controlled to be the same;

(4b) according to the established four-type gold belt bonding interconnection configuration parameterized representation model, when the space volume occupied by the Gaussian gold belt and the circular arc gold belt is the same, the gold belt consumptions of different configurations are compared;

(4c) according to the established four-type gold-strip bonding interconnection configuration parameterized representation model, when the consumptive material quantity is equal, configuration inversion is carried out on the four-type gold-strip bonding interconnection configuration parameterized representation model, and the spatial direction positions of inversion are compared;

(4d) according to the established four-type gold belt bonding interconnection configuration parameterization representation model, when the consumptive material quantity is equal, the occupied volume of the four-type gold belt bonding interconnection configuration parameterization representation model is compared;

(4e) and establishing an interrelation among the volume occupied by the gold belt, the space direction position and the consumable quantity according to the established four-type gold belt bonding interconnection configuration parameterized representation model.

Further, in the step (5), according to the determined geometrical parameters, physical parameters, electromagnetic transmission parameters of gold ribbon bonding interconnection in the microwave circuit and the parameterized characterization modeling of the four types of gold ribbon bonding interconnection structures, four types of electromagnetic models of the gold ribbon bonding interconnection structures are respectively established in three-dimensional high-frequency structure simulation software HFSS.

Further, in the step (6), establishing a model for predicting four types of metal strip bonding interconnection configurations and signal transmission performance is performed according to the following steps:

(6a) establishing a multiple regression model between the structural parameters and the electrical properties according to four types of metal strip bonding interconnection structure electromagnetic models constructed in three-dimensional high-frequency structure simulation software HFSS, and giving a continuous function relation between the signal transmission performance and a plurality of structural parameters;

(6b) selecting the frequency f and the width B of the gold strip for a single Gauss gold strip and a single arc gold strip_sGap g of dielectric substrate, height h of gold band arch_bAs test factor, the return loss S is selected₁₁And insertion loss S₂₁As a response indicator;

(6c) for double Gauss gold bands and double arc gold bands, selecting frequency f and gold band width B_sGap g of dielectric substrate, height h of gold band arch_bGold band gap W_gAs test factor, the return loss S is selected₁₁And insertion loss S₂₁As a response indicator.

Further, in the step (7), comparing the transmission electrical performance of the single and double gaussian-shaped gold-strip interconnection signals according to the following steps:

(7a) according to the established four-type gold band bonding interconnection configuration and signal transmission performance prediction model, single-index signal transmission electrical performance comparison is carried out on a single Gauss gold band and a double Gauss gold band, the same frequency f is set, and a gold band gap W is removed_gIn contrast, the sum of the widths of the two gold bands is equal to the width 2B of a single gold band_d＝B_sAnd the other structural parameters are controlled to be the same, and S of a single Gauss golden band and a double Gauss golden band is calculated₁₁The ratio of (A) to (B);

(7b) according to the established four-type gold band bonding interconnection configuration and signal transmission performance prediction model, performing wide-band signal transmission electrical performance comparison on a single Gaussian gold band and double Gaussian gold bands, setting the frequency f to be 1-40GHz, and removing a gold band gap W_gIn contrast, the sum of the widths of the two gold bands is equal to the width 2B of a single gold band_d＝B_sAnd the other structural parameters are controlled to be the same, and S of a single Gauss gold band and a double Gauss gold band in a wide frequency band is calculated₁₁The difference sum;

(7c) according to the established four-type gold band bonding interconnection configuration and signal transmission performance prediction model, carrying out comprehensive index signal transmission electrical performance comparison on a single Gauss gold band and a double Gauss gold band, setting the frequency f to be 1-40GHz, and removing a gold band gap W_gIn contrast, the sum of the widths of the two gold bands is equal to the width 2B of a single gold band_d＝B_sThe other structural parameters are controlled identically, and S is contained in a single Gauss golden band and a double Gauss golden band₁₁And S₂₁Synthesis at a wide frequency band ofComparing the index electrical properties;

(7d) and according to the established four types of gold band bonding interconnection configuration and signal transmission performance prediction model, performing signal transmission electrical performance comparison on a single Gaussian gold band and double Gaussian gold bands under the variable configuration parameters.

Further, in the step (8), the transmission electrical performance of the single and double arc configuration gold belt interconnection signals is compared.

And (8) comparing the transmission electrical properties of the single and double arc-shaped gold belt interconnection signals by adopting the same method as the step (7).

And (9) comparing the transmission electrical properties of the single Gaussian and single arc-shaped gold belt interconnection signals by adopting the same method as the step (7).

Further, in the step (10), according to the established four types of gold ribbon bonding interconnection configurations, the signal transmission performance prediction model and the comparison result thereof, determining the optimal gold ribbon interconnection configuration facing the microwave circuit signal transmission, and performing the following steps:

(10a) setting the frequency f to be 1-40GHz according to the established four-type gold band bonding interconnection configuration and signal transmission performance prediction model, wherein the sum of the widths of two gold bands is equal to the width 2B of a single gold band_d＝B_sThe other structural parameters are controlled to be the same, and the performance optimal interconnection in the four types of metal strip bonding interconnection configurations is determined;

(10b) according to the established four-type gold belt bonding interconnection configuration parameterized characterization model, when the sum of the widths of two gold belts is equal to the width 2B of a single gold belt_d＝B_sThe other structural parameters are controlled to be the same, and the consumption of the gold strips with different configurations is compared;

(10c) according to the established four-type gold belt bonding interconnection configuration parameterized characterization model, when the sum of the widths of two gold belts is equal to the width 2B of a single gold belt_d＝B_sThe other structural parameters are controlled to be the same, and the space position occupation of the gold strips with different configurations is compared;

(10d) setting frequency f according to the established four-type gold belt bonding interconnection configuration and signal transmission performance prediction model, wherein the sum of the widths of two gold belts is equal to the width 2 of a single gold beltB_d＝B_sDetermining the optimal interconnection in the four types of metal strip bonding interconnection configurations when other structural parameters are controlled to be the same;

(10e) setting the sum of the widths of two gold strips equal to the width 2B of a single gold strip according to the established four-type gold strip bonding interconnection configuration and signal transmission performance prediction model_d＝B_sWhen the electrical performance is the same, determining the lowest interconnection of consumables in the four types of gold strip bonding interconnection configurations;

(10f) setting the sum of the widths of two gold strips equal to the width 2B of a single gold strip according to the established four-type gold strip bonding interconnection configuration and signal transmission performance prediction model_d＝B_sAnd determining the minimum space occupation interconnection in the four types of gold ribbon bonding interconnection configurations when the electrical properties are the same.

Compared with the prior art, the invention has the following characteristics:

1. aiming at the gold ribbon bonding interconnection in the microwave circuit, the invention establishes a parameterized representation model of four types of gold ribbon bonding interconnection configurations of single arc, double arcs, single Gauss and double Gauss, analyzes the spatial characteristics of the models, further establishes a prediction model of the four types of gold ribbon interconnection from configuration parameters and transmission frequency to signal transmission performance based on the representation model, and compares the interconnection electrical performance under multiple indexes and multiple working conditions, thereby realizing the determination of the optimal bonding configuration for the interconnection signal transmission of the microwave circuit, and solving the problems that different interconnection types and the signal transmission performance are not related clearly and the optimal design direction for performance regulation and interconnection is not selected clearly in the microwave circuit at present.

2. The optimal gold strip bonding interconnection configuration type can be determined by utilizing the optimal strip bonding configuration determining method facing microwave circuit interconnection signal transmission, parameterization quantitative accurate representation of four types of gold strip bonding interconnection shapes can be realized in the microwave circuit design, manufacture and application processes, signal transmission performance prediction can be quickly realized based on the four types of gold strip bonding interconnection geometric configurations, interconnection electrical performance comparison under multiple indexes and multiple working conditions is adopted, theoretical guidance is provided for engineering designers to select optimal design and transmission performance regulation and control in the microwave circuit design and manufacture, and therefore working efficiency is improved, product development cost is reduced, and product service performance is guaranteed.

Drawings

FIG. 1 is a flow chart of a method for determining an optimal keyed configuration for microwave circuit interconnect signal transmission in accordance with the present invention;

FIG. 2 is a schematic diagram of a gold ribbon bonded interconnect structure;

FIG. 3 is a schematic diagram of gold ribbon bonding interconnection parameters (shown as double Gaussian gold ribbon);

FIG. 4 is a schematic diagram of a Gaussian distribution function characterizing gold band morphology;

FIG. 5 is a schematic diagram of a circle function characterizing a gold ribbon morphology;

FIG. 6 is a schematic diagram of a circle function representation of calculated gold ribbon dimensions;

FIG. 7 is a schematic view of the volume of the gold ribbon occupied space;

FIG. 8 is a three-dimensional structure-electromagnetic simulation model and a partial enlarged view of single Gauss gold ribbon bonding interconnection;

FIG. 9 is a schematic diagram of a three-dimensional electromagnetic simulation model and a partial enlarged view of a double-Gaussian gold ribbon bonded interconnection;

FIG. 10 is an enlarged view of a single arc gold ribbon bonded interconnection three-dimensional structure-electromagnetic simulation model;

FIG. 11 is an enlarged view of a three-dimensional electromagnetic simulation model and a portion of a double-arc gold ribbon bonded interconnection;

FIG. 12 is a graph comparing the S11 parameters of four types of golden band configuration HFSS simulations with regression model calculations;

FIG. 13 is a graph comparing the S21 parameters calculated by the regression model and the four types of golden band configuration HFSS simulations.

Detailed Description

The invention is further explained below with reference to the drawings and the embodiments.

Referring to fig. 1, the invention is a method for determining an optimal keyed configuration for microwave circuit interconnection signal transmission, comprising the following steps:

step 1, determining four types of metal strip bonding interconnection geometric parameters and physical parameters of single Gauss, double Gauss, single arc and double arcs

Referring to fig. 2 and 3, the four types of gold ribbon bonded interconnects comprise a ground plate 6, dielectric substrates 1 and 5 are connected on the upper layer of the ground plate 6, and a conductor ribbon 2 connected on the dielectric substrate 1 is connected with the conductor ribbon 6 connected on the dielectric substrate 5 through a gold ribbon 3; according to the specific requirements of interconnection in a high-frequency microwave circuit, determining four types of metal band bonding interconnection geometric parameters and physical parameters of single Gauss, double Gauss, single arc and double arcs respectively;

(1a) determining the same geometric parameters of single Gauss, double Gauss, single arc and double arcs, including width B of four kinds of gold bands, gap g of medium modules and height h of gold band arch_b(ii) a Gold strip thickness T and left end microstrip width W₁Right microstrip width W₂Thickness h of the left end dielectric substrate₁Thickness h of right dielectric substrate₂Thickness h of microstrip₃Length l of left end gold belt bonding position₁Distance d from the left end of the microstrip to the left end of the substrate₁Distance p from the left part of the gold strip bonding to the left end of the microstrip₁Distance p between right end of gold strip bonding and right end of micro-strip₂Distance d from the right end of the microstrip to the right end of the substrate₂Length l of right-end gold belt bonding position₂；

(1b) Determining different geometric parameters of a single Gaussian, a double Gaussian, a single arc and a double arc comprises the following steps: width B of four kinds of gold belt, gap g of medium module and arch height h of gold belt_b(ii) a Width of gold band B of single Gauss and single arc_sWidth B of gold band of double Gauss and double circular arcs_dThe gaps of the medium modules of a single Gauss and a single arc are respectively g_sgAnd g_scThe gap between the dielectric modules of the double Gauss and the double circular arcs is g_dgAnd g_dcThe arch heights of the gold belt of a single Gauss and a single arc are h respectively_bsgAnd h_bscThe gap between the dielectric modules of the double Gauss and the double circular arcs is h_bdgAnd h_bdcDouble Gauss and double arc gold band gap W_g；

(1c) Determining the same physical parameters of a single Gauss, a double Gauss, a single arc and a double arc comprises determining the relative dielectric constant of the left end dielectric substrate_r1And the relative dielectric constant of the right dielectric substrate_r2Dielectric loss of the left end dielectric substrateCorner₁And right dielectric substrate dielectric loss angle₂。

Step 2, determining four types of gold ribbon bonding interconnection electromagnetic transmission parameters

Determining four types of metal strip bonding interconnection electromagnetic transmission parameters, specifically comprising: signal transmission frequency f, return loss S₁₁And insertion loss S₂₁And the like.

Step 3, establishing four types of metal strip bonding interconnection configuration parameterized characterization models

According to the interconnection configuration and the engineering actual investigation in the microwave circuit, four types of metal strip bonding interconnection configuration parameterized characterization models are respectively established, and the method is carried out according to the following steps with reference to fig. 4,5 and 6:

(3a) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, single and double Gaussian gold ribbons are parameterized and characterized by adopting Gaussian distribution functions, and the single and double gold ribbon bonding interconnection configuration Gaussian distribution characterization functions are determined as follows:

wherein a is a gold band shape z-direction change control correlation function, b is a gold band shape x-direction change control correlation function, mu and c are the peak abscissa of the Gaussian function, and d_bFor gold ribbon bond span, μ and d_bThe calculation formula is as follows:

d_b＝p₁+d₁+g+p₂+d₂

in the formula, a₁、b₁、c₁、Δ₁、z₁For the intermediate variables calculated, the calculation is as follows:

a₁＝1-z₁

b₁＝2(p₁+d₁)+2z₁(p₂+d₂+g)

c₁＝(p₁+d₁)²-z₁(p₂+d₂+g)²

(3c) according to the characteristic analysis of the gold band bonding interconnection configuration, single and double Gaussian gold bands are parameterized and characterized by adopting a Gaussian distribution function, and the differential length of the gold band on a gold band non-bonding area line is calculated as follows:

in the formula, x₁And x₂Representing the starting point and the end point of the length part to be calculated of the Gaussian interconnection gold ribbon, wherein x is the abscissa of the gold ribbon configuration function curve;

(3d) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, single and double Gaussian gold ribbons are parameterized and characterized by adopting a Gaussian distribution function, and a single and double Gaussian gold ribbon bonding interconnection configuration parameterized and characterized model is established as follows:

(3e) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, carrying out parametric characterization on single and double arc gold ribbons by adopting an arc function, and determining the arc functions of the single and double gold ribbon bonding interconnection configuration as follows:

in the formula, X_c、Z_cIs the abscissa and ordinate of the center of curvature of the arc, R_cIs the radius of curvature of the arc;

R_c＝h_b-Z_c

wherein the content of the first and second substances,

b₂＝-2d_b

in the formula, a₂、b₂、c₂、Δ₂Respectively, the calculated intermediate variables;

(3f) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, single and double arc gold ribbons are parameterized and characterized by arc functions, and the differential length of the gold ribbon on the gold ribbon non-bonding area line

The calculation is as follows:

in the formula, theta_cIs the central angle of the arc;

O_cthe curvature center of the obtained gold strip is constructed for the circular function, and the coordinate is (X)_C,Z_C) B is the starting point of the left end of the bending part of the gold belt and has the coordinate (-p)₁-d₁,h₁+h₃) H is the right end termination point of the bent part of the gold belt and has the coordinate of (p)₂+d₂+g,h₂+h₃)，θ₁Is the angle between the line connecting the center of curvature and the point H and the horizontal line, theta₂The included angle between the connecting line of the curvature center and the point B and the horizontal line;

θ_c＝π-θ₁-θ₂

(3g) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, single and double arc gold ribbons are parameterized and characterized by adopting an arc function, and a single and double arc gold ribbon bonding interconnection configuration parameterized and characterized model is established as follows:

step 4, comparing the space geometric characteristics of the four types of metal strip bonding interconnection configurations

Based on the four types of metal strip bonding interconnection configuration parameterized representation models, comparing the space geometric characteristics of the four types of metal strip bonding interconnection configuration, and referring to fig. 7, the method comprises the following steps:

(4a) according to the established four-type gold band bonding interconnection configuration parameterized representation model, carrying out space occupied volume comparison on a single gold band and a Gauss gold band, and removing a gold band gap W_gIn contrast, the sum of the widths of the two gold bands is equal to the width 2B of a single gold band_d＝B_sAnd other structural parameters are controlled to be the same, the occupied volumes of the spaces of the single gold strip and the double gold strips are respectively as follows:

V_s＝B_s(l₁+l₂+d_bs)max(h_b-h₁,h_b-h₂)

d_bs＝p₁+d₁+g_s+p₂+d₂

in the formula, V_sOccupying space for a single gold belt, d_bsBonding span of a single gold ribbon, g_sA dielectric module gap for a single gold strip;

V_d＝(2B_d+W_g)(l₁+l₂+d_bd)max(h_b-h₁,h_b-h₂)

d_bd＝p₁+d₁+g_d+p₂+d₂

in the formula, V_dThe volume occupied by two gold bands, d_bdBonding span of double gold ribbons, g_dA dielectric module gap for a single gold strip;

(4b) according to the established four types of gold belt bonding interconnection configuration parameterized representation models, when the occupied space volumes of the Gaussian gold belt and the arc gold belt are the same, the consumption amounts of the gold belts with different configurations are compared:

for a single Gauss gold strip and a single arc gold strip, when the occupied space volume is the same,

V_sg＝B_sg(l₁+l₂+d_bsg)max(h_bsg-h₁,h_bsg-h₂)

＝V_sc＝B_sc(l₁+l₂+d_bsc)max(h_bsc-h₁,h_bsc-h₂)

in the formula, V_sgVolume occupied by a single Gauss gold belt, d_bsgBonding span of a single Gauss gold band, B_sgThe width of the gold band is a single Gaussian gold band; v_scThe volume of the occupied space of a single arc gold belt, d_bscA bonding span of a single arc gold ribbon, B_scThe width of the gold belt is a single arc gold belt;

i.e. B_sgd_bsgh_bsg＝B_scd_bsch_bscWhen the temperature of the water is higher than the set temperature,

comparing the space consumptive material quantity, and for a single Gauss gold belt, the consumed material quantity V_msgComprises the following steps:

in the formula, S_sg＝B_sT is the area of the cross section of a single gold band, and u and v are the starting point and the ending point of the gold band;

for a single arc gold strip, the amount V of material consumed_mscComprises the following steps:

in the formula, S_scIs the area of the cross section of a single arc gold belt;

for double Gaussian gold bands and double arc gold bands, when the occupied space volume is the same,

V_dg＝B_dg(l₁+l₂+d_bdg)max(h_bdg-h₁,h_bdg-h₂)

＝V_dc＝B_dc(l₁+l₂+d_bdc)max(h_bdc-h₁,h_bdc-h₂)

i.e. B_dgd_bdgh_bdg＝B_dcd_bdch_bdcWhen the temperature of the water is higher than the set temperature,

comparing the space consumptive material quantity, and for the double Gauss gold belt, the consumed material quantity V_mdgComprises the following steps:

V_mdg＝2V_msg

for double arc gold ribbon, the amount V of material consumed_mdcComprises the following steps:

V_mdc＝2V_msc

(4c) according to the established four types of gold belt bonding interconnection configuration parameterization characterization models, when the consumptive material quantity is equal, configuration inversion is carried out on the four types of gold belt bonding interconnection configuration parameterization characterization models, and the inverted spatial direction positions are compared:

for the bonding configuration of four types of metal bands, i.e. single Gauss, double Gauss, single arc and double arc, the consumption V can be determined according to the corresponding material consumption_msg、V_mdg、V_msc、V_mdcThe gap g of the medium modules and the height h of the golden ribbon arch are reversed to be respectively configured_bAnd a gold band width B;

when the width B of the gold strip is inverted, the other orientation parameters are known, and the following can be obtained:

B＝f(V_m,g,h_b)

in the formula, V_mThe consumption amount is the consumption amount;

inversion of golden zone arch height h_bWhen the other orientation parameters are known, the following can be obtained:

h_b＝f(V_m,g,B)

when the gap g of the medium module is inverted, the other orientation parameters are known, and the following can be obtained:

g＝f(V_m,B,h_b)

(4d) according to the established four types of metal strip bonding interconnection configuration parameterization representation models, when the consumptive material quantity is equal, the occupied volume is compared:

for a single Gauss gold strip and a single arc gold strip, when the consumption amounts of the gold strips are equal, solving the smaller occupied volume of the gold strips:

for the double-root Gaussian gold strip and the double-root arc gold strip, when the consumption amounts are equal, the smaller occupied volume is solved:

in the formula, V_dgThe volume of the occupied space of the double Gauss golden belt is V_dcThe volume of the occupied space of the double Gaussian golden belts is increased;

(4e) establishing an interrelation among the volume occupied by the gold belt, the space direction position and the consumable quantity according to the established four types of gold belt bonding interconnection configuration parameterized representation model:

f(V,L)＝V_m

wherein V is V (B, l)₁,l₂,d_b,h₁,h₂,h_b)

L＝L(B,g,h_b)

V_m＝V_m(B,l₁,l₂,d_b,h₁,h₂,h_b,g,T)

In the formula, V (B, l)₁,l₂,d_b,h₁,h₂,h_b) Is the volume expression of gold band, L (B, g, h)_b) For the expression of the position of the gold strip direction, V_m(B,l₁,l₂,d_b,h₁,h₂,h_bAnd g, T) is the gold band consumable quantity expression.

Step 5, establishing four types of electromagnetic models with gold ribbon bonding interconnection structures

And respectively establishing four types of metal strip bonding interconnection structure electromagnetic models in three-dimensional high-frequency structure simulation software HFSS according to the determined metal strip bonding interconnection geometric parameters, physical property parameters, electromagnetic transmission parameters and parametric representation modeling of the four types of metal strip bonding interconnection structures in the microwave circuit.

Step 6, establishing a model for predicting four types of gold ribbon bonding interconnection configurations and signal transmission performance

Establishing a four-type metal strip bonding interconnection configuration and signal transmission performance prediction model according to the established four-type metal strip bonding interconnection configuration parameterized characterization model and a response surface method, and performing the following steps:

(6a) establishing a multiple regression model between the structural parameters and the electrical properties according to four types of metal strip bonding interconnection structure electromagnetic models constructed in three-dimensional high-frequency structure simulation software HFSS, and giving a continuous function relation between the signal transmission performance and a plurality of structural parameters;

the experiment adopts a multiple quadratic regression equation to approximate the experiment data, and the calculation formula is as follows:

wherein Y is a test index, and X is_i,X_jIs a factor of, beta₀Is a constant term, β_iIs a coefficient of a first order term, beta_iiIs a coefficient of a quadratic term, beta_ijIs the interaction term coefficient;

(6b) selecting the frequency f and the width B of the gold strip for a single Gauss gold strip and a single arc gold strip_sGap g of dielectric substrate, height h of gold band arch_bAs test factor, the return loss S is selected₁₁And insertion loss S₂₁As a response indicator;

according to the test result, a multivariate regression empirical formula between the signal transmission performance S parameter and the interconnection form parameter is established in Design Expert:

in the formula, beta₀Is a constant term, β_iIs a first order coefficient, i is 1,2,3,4, beta_ijIs a quadratic coefficient, i is more than or equal to 1 and less than or equal to j and less than or equal to 4;

therefore, a single Gaussian and single arc gold strip interconnection structure circuit coupling model is obtained, namely, the single Gaussian and single arc gold strip interconnection form parameter and signal transmission performance circuit coupling model is established, and the function F is used_iThe expression, i is 1,2,3,4, abbreviated as:

wherein S is_sg11S of a single Gauss₁₁Parameter, S_sg21S of a single Gauss₂₁A parameter;

wherein S is_sc11S being a single circular arc₁₁Parameter, S_sc21S being a single circular arc₂₁A parameter;

(6c) for double Gauss gold bands and double arc gold bands, selecting frequency f and gold band width B_sGap g of dielectric substrate, height h of gold band arch_bGold band gap W_gAs test factor, the return loss S is selected₁₁And insertion loss S₂₁As a response indicator;

according to the test result, a multivariate regression empirical formula between the signal transmission performance S parameter and the interconnection form parameter is established in Design Expert:

in the formula, beta₀Is a constant term, β_iIs a first order coefficient, i is 1,2,3,4,5, beta_ijIs a quadratic term coefficient, i is more than or equal to 1 and less than or equal to j is less than or equal to 5;

therefore, a double-Gaussian and double-arc gold strip interconnection structure path coupling model is obtained, namely, a double-Gaussian and double-arc gold strip interconnection morphological parameter and signal transmission performance path coupling model is established, and a function F is used_iWhen i is 5,6,7,8, it is abbreviated as:

wherein S is_dg11S of double root Gauss₁₁Parameter, S_sg21S of double root Gauss₂₁A parameter;

wherein S is_sc11S is a double arc₁₁Parameter, S_sc21S is a double arc₂₁And (4) parameters.

Step 7, comparing the transmission electrical properties of the single-root and double-root Gaussian-configuration gold belt interconnection signals

According to the established four types of gold band bonding interconnection configuration and signal transmission performance prediction models, single-root and double-root Gaussian configuration gold band interconnection signal transmission electrical performance is compared, and the method comprises the following steps:

(7a) and (3) carrying out single-index signal transmission electrical property comparison on the single Gauss gold band and the double Gauss gold bands, wherein S of the single Gauss gold band and the double Gauss gold bands is the same when the same frequency f, different gold band gaps and the sum of the double-root gold band widths are equal to the width of the single Gauss gold band, and other structural parameters are the same₁₁In a ratio of

If it is

Then the S of the double Gaussian gold band in the wide frequency band is indicated₁₁The performance is better;

s of single Gauss gold belt and double Gauss gold belts₂₁In a ratio of

If it is

Then the S of a single Gauss gold band in the wide frequency band is shown₂₁The performance is better;

(7b) comparing the electrical performance of signal transmission in a wide frequency band between a single Gauss gold band and two Gauss gold bands, and calculating the S of the single Gauss gold band and the two Gauss gold bands in the wide frequency band when the frequency f is 1-40GHz, the gaps of the gold bands are different, the sum of the widths of the two Gauss gold bands is equal to the width of the single Gauss gold band, and other structural parameters are the same₁₁The sum of the differences is:

S_g11＝∑(S_sg11-S_dg11)

if S_g11If < 0, a single Gauss is indicatedS of gold band in wide frequency band₁₁The performance is better, and the performance is better,

if S_g11If > 0, the S of the double Gaussian gold band in the wide frequency band is indicated₁₁The performance is better;

s of single Gauss gold band and double Gauss gold bands in wide frequency band₂₁The sum of the differences is:

S_g21＝∑(S_sg21-S_dg21)

if S_g21If < 0, S of double Gaussian gold bands in wide frequency band is indicated₂₁The performance is better, and the performance is better,

if S_g21If > 0, the S of a single Gaussian gold band in the wide frequency band is indicated₂₁The performance is better;

(7c) and (2) carrying out comprehensive index signal transmission electrical property comparison on the single Gaussian gold band and the double Gaussian gold bands, wherein when the frequency f is 1-40GHz, the gold band gaps are different, the sum of the widths of the double gold bands is equal to the width of the single gold band, and other structural parameters are the same:

calculating single Gauss gold band S_sg11And S_sg21Maximum difference Δ S in f-1-40 GHz_sg11And Δ S_sg21，S₁₁Minimum value S_sg11minAnd S₂₁Maximum value S_sg21maxCalculating the normalized S parameter to obtain the electrical property S of the gold strip comprehensive index_sg：

λ₁、λ₂Respectively normalized S_sg11And S_sg21The weight coefficient of (a);

calculating double Gauss gold band S_dg11And S_dg21Average value Δ S in the range of f 1-40GHz_dg11And Δ S_dg21，S₁₁Minimum value S_dg11minAnd S₂₁Maximum value S_dg21maxCalculating the normalized S parameter to obtain the electrical property S of the gold strip comprehensive index_dg：

If it is

The comprehensive index performance of the double gausses in the wide frequency band is better;

(7d) and (3) comparing the electrical performance of signal transmission under the deformation parameters of a single Gauss gold band and a double Gauss gold band:

when other parameters are the same, only the arch height h of the golden belt is considered_bInfluence on the charging performance of single Gauss gold band and double Gauss gold bands:

by

Obtaining the transmission electrical property of a single Gauss gold belt and the arch height h of the gold belt_bThe relation of (1):

wherein the content of the first and second substances,

α₁h_b＝β₄h_b+β₁₄fh_b+β₂₄B_sh_b+β₃₄gh_b

in the formula, alpha₀Is a constant term, α₁Is a coefficient of a first order term, alpha₂Is a quadratic coefficient;

by

Obtaining the transmission electrical property of double Gaussian gold bands and the arch height h of the gold bands_bThe relation of (1):

γ₁h_b＝β₄h_b+β₁₄fh_b+β₂₄B_dh_b+β₃₄gh_b+β₄₅W_gh_b

in the formula, gamma₀Is a constant term, γ₁Is a coefficient of a first order term, gamma₂Is a quadratic coefficient;

within the allowable range of the arch height of the golden band, sigma S_sg＜∑S_dgWhen the arch height changes, the electrical property of a single Gauss gold band is superior to that of a double Gauss gold band; on the contrary, the performance of the double-root Gauss gold belt is better;

in the same way, the influence of the width B of the gold band and the gap g of the dielectric module on the electrical properties of a single Gauss gold band and a double Gauss gold band can be obtained.

Step 8, comparing the transmission electrical performance of the single-arc-shaped and double-arc-shaped gold belt interconnection signals

And (4) comparing the transmission electrical performance of the single-arc configuration gold belt and the transmission electrical performance of the double-arc configuration gold belt according to the established four types of gold belt bonding interconnection configuration and signal transmission performance prediction models, and comparing the transmission electrical performance of the single-arc configuration gold belt and the transmission electrical performance of the double-arc configuration gold belt in the step (8) by adopting the same method as the step (7).

Step 9, comparing the transmission electrical properties of the Gaussian configuration and the arc configuration gold belt interconnection signals

And (3) comparing the transmission electrical performance of the Gaussian configuration and arc configuration gold belt interconnection signals according to the established four types of gold belt bonding interconnection configuration and signal transmission performance prediction models, wherein the method adopted in the step (9) is the same as that in the step (7), and the transmission electrical performance of the Gaussian configuration and arc configuration gold belt interconnection signals is compared.

Step 10, determining the optimal configuration of gold ribbon interconnection facing microwave circuit signal transmission

According to the established four types of gold belt bonding interconnection configurations, a signal transmission performance prediction model and a comparison result thereof, setting the sum of the widths of two gold belts to be equal to the width of a single gold belt, and determining the optimal gold belt interconnection configuration facing microwave circuit signal transmission under the condition that other structural parameters are the same, wherein the method comprises the following steps of:

(10a) and setting the frequency f to be 1-40GHz, and determining the optimal performance interconnection in four types of gold strip bonding interconnection configurations:

uniformly selecting partial frequency points n, and calculating the electrical performance of the four types of gold strip bonding interconnection configurations at corresponding nodes:

to S₁₁Parameters are as follows:

s of all nodes in frequency band of single Gauss gold band₁₁The sum of

S of all nodes of single arc gold belt in frequency band₁₁The sum of

S of all nodes in frequency band of double-root Gauss gold belt₁₁The sum of

S of all nodes of double arc gold bands in frequency band₁₁The sum of

Obtaining four kinds of gold S with bonding interconnection configuration by the same method₂₁Parameter(s)

In the formula (I), the compound is shown in the specification,

s of all nodes in frequency band for single Gauss gold band₂₁The sum of the total weight of the components,

s for all nodes in frequency band of single arc gold band₂₁The sum of the total weight of the components,

s of all nodes in frequency band for double Gauss gold bands₂₁The sum of the total weight of the components,

s of all nodes in frequency band for double arc gold bands₂₁Sum of g₀Constant value for arch height of gold band of single Gauss and single arc, B₀Width of gold band of single Gauss and single arc, h_b0The arch height of the gold belt is constant for a single Gaussian and a single arc;

S_11minthe corresponding gold ribbon bonding configuration is S₁₁Gold ribbon bonding configuration with optimized electrical performance

S_21maxThe corresponding gold ribbon bonding configuration is S₂₁Gold ribbon bonding configuration with optimized electrical performance

g₀,B₀,h_b0Respectively corresponding to configuration parameters

(10b) Comparing the consumption of gold strips with different configurations:

V_msg,V_mdg,V_msc,V_mdcconsumption of materials in four-type gold strip bonding interconnection configuration

(10c) Comparing the space position occupation of gold bands with different configurations:

V_sg,V_dg,V_sc,V_dcspace position occupation of four types of metal strip bonding interconnection configuration

(10d) Determining the optimal interconnection in four types of gold ribbon bonding interconnection configurations:

the electrical property represents the functionality of gold ribbon bonding and is represented by S;

the consumption amount represents the economy of gold belt bonding and is V_mTo represent;

the space ratio represents the integration of gold ribbon bonding, and B × g × h_bTo represent;

the following formula is obtained to measure the comprehensive performance of the gold ribbon interconnection:

P＝ω₁S+ω₂V_m+ω₃(B×g×h_b)

p represents the overall performance of the gold band, omega₁,ω₂,ω₃Is a weight coefficient of the corresponding index, and ω₁＞ω₂,ω₃(ii) a S represents the electrical property of gold ribbon bonding; v_mRepresenting the consumable amount of gold ribbon bonding; bxgxh_bRepresenting the space ratio of gold ribbon bonding;

when the parameters are the same, calculating P values of the four types of golden bands, and determining the optimal interconnection in the four types of golden band bonding interconnection configurations;

(10e) determining the lowest interconnection of consumables in four types of gold ribbon bonding interconnection configurations when the electrical properties are the same:

s parameter is composed of width B of gold belt and height h of gold belt arch_bThe gap g of the medium substrate is determined together, so that under the same electrical property, the four types of gold strip bonding interconnection configurations respectively have various different structural parameter combinations and various different consumable material amounts, the minimum consumable material amount corresponding to the gold strip configurations is obtained, and the minimum consumable material amount of a single Gauss gold strip is V_msgminThe minimum material consumption of the double Gauss gold bands is V_mdgminThe smallest single arc gold beltThe consumption amount is V_mscminThe minimum material consumption of the double arc gold strips is V_mdcminSelecting the gold belt configuration corresponding to the minimum consumable amount from the four gold belt configurations;

in the formula, V_msgminMinimum material consumption of single Gauss gold belt, V_mdgminMinimum material consumption of double Gauss gold band, V_mscminMinimum material consumption of single arc gold belt, V_mdcminThe minimum material consumption of the double arc gold strips;

(10f) when the electrical properties are the same, determining the minimum occupied space interconnect in the four types of gold ribbon bond interconnect configurations:

s parameter is composed of width B of gold belt and height h of gold belt arch_bThe gap g of the medium substrate is determined together, so that under the same electrical property, the four types of gold band bonding interconnection configurations respectively have various different structural parameter combinations and also have various different space occupation, the minimum space occupation corresponding to the respective gold band configurations is obtained, and the minimum space occupation of a single Gaussian gold band is V_sgminThe minimum space occupation of the double Gauss gold bands is V_dgminThe minimum space occupation of a single arc gold belt is V_scminThe minimum space occupation of the double arc gold bands is V_dcminSelecting a gold strip configuration corresponding to the minimum space occupation from the four parts;

in the formula, V_sgminIs the minimum space occupation of a single Gauss gold band, V_dgminIs the minimum space occupation of double Gauss gold bands, V_scminIs the minimum space occupation of a single arc gold belt, V_dcminThe minimum space occupation of the double arc gold bands is realized.

The advantages of the present invention can be further illustrated by the following simulation experiments:

firstly, determining the geometric parameters and physical parameters of gold ribbon bonding interconnection

The experiment determines the optimal bond configuration facing microwave circuit interconnection signal transmission by establishing a multiple regression model between the structural parameters and the electrical properties, comparing the electrical properties of the four types of interconnection gold tapes under the same structural parameters, comparing the consumption of the four types of interconnection gold tapes under the same electrical properties and comparing the space position occupation ratio of the four types of interconnection gold tapes under the same electrical properties.

Firstly, four types of gold ribbon bonding interconnection geometric parameters and physical parameters are required to be given, the schematic diagrams of the gold ribbon bonding interconnection parameterized models are shown in the tables 2 and 3, and the geometric parameters and the physical parameters of the four types of gold ribbon bonding interconnection are shown in the table 1.

TABLE 1 geometrical and physical parameters of four types of metal ribbon bond interconnection

Secondly, establishing an electromagnetic simulation model of the four-type golden belt bonding interconnection structure of the examination

Determining gold ribbon bonding interconnection electromagnetic transmission parameters in a microwave circuit, which specifically comprises the following steps: signal transmission scanning frequency f is 1-40GHz, return loss index S₁₁Insertion loss index S₂₁And the like.

According to four types of metal strip bonding interconnection geometric parameters, physical parameters, electromagnetic transmission parameters and parametric representation modeling of four types of metal strip bonding interconnection configurations of single Gauss, double Gauss, single arc and double arc, four types of metal strip bonding interconnection structure electromagnetic models are built in three-dimensional electromagnetic full-wave simulation analysis software HFSS, and are shown in figures 8, 9, 10 and 11. The established model consists of a gold strip, a microstrip conductor, a dielectric substrate and the like.

Establishing a multiple regression model between the structural parameters and the electrical properties

Determining gold ribbon bonding interconnection electromagnetic transmission parameters in microwave circuitThe method specifically comprises the following steps: signal transmission scanning frequency f, return loss index S₁₁Insertion loss index S₂₁And the like.

Selecting the frequency f and the width B of the gold strip for a single Gauss gold strip and a single arc gold strip_sGap g of dielectric substrate, height h of gold band arch_bAs test factor, the return loss S is selected₁₁And insertion loss S₂₁As a response index, a test was conducted. The response surface factor level tables are shown in tables 2 and 3.

TABLE 2 level table for single Gauss golden band and single arc golden band response surface factor

TABLE 3 level table for curve factor response of double Gauss golden bands and double arc golden bands

And establishing a multiple regression empirical formula between the transmission performance S parameter and the key structure parameter of the four types of gold-band bonded signals by combining the result of the corresponding HFSS simulation analysis data, wherein the expression is as follows:

the multiple regression equation between the single Gaussian gold band signal transmission performance S parameter and the key parameter is as follows:

the multiple regression equation between the single arc gold strip signal transmission performance S parameter and the key parameter is as follows:

the multiple regression equation between the double-root Gaussian gold band signal transmission performance S parameter and the key parameter is as follows:

the multivariate regression equation between the double arc gold band signal transmission performance S parameter and the key parameter is as follows:

fourthly, determining the optimal configuration of the gold belt interconnection

In the aspects of gold strip electrical performance, material consumption, process, space occupation and the like, the quality of the electrical performance is particularly important for the selection of the gold strip. Therefore, the electrical performance is taken as an index in the case, and the interconnection configuration with the best electrical performance in the four types of gold strip interconnection configurations is determined.

Selecting the frequency f as 12-18 GHz, taking 0.2GHz as a step length, and obtaining the return loss S of the four types of golden band signal transmission performance under the frequency band through the established four types of golden band bonding interconnection configuration and signal transmission performance prediction model₁₁And insertion loss S₂₁。

It can be observed from fig. 12 and 13 that in the f-12 to 18GHz band, when the structural parameters are the same, the S is considered to be the same₁₁The performance index is that double gold bands are superior to a single gold band, and a Gaussian gold band is superior to a circular arc gold band; for S₂₁The performance index is that a single gold strip is superior to a double gold strip, and a Gaussian gold strip is superior to a circular arc gold strip.

Claims (9)

1. A method for determining an optimal keyed configuration for microwave circuit interconnect signal transmission, comprising the steps of:

(1) determining four types of metal band bonding interconnection geometric parameters and physical parameters of single Gauss, double Gauss, single circular arc and double circular arc according to the specific interconnection requirement in the high-frequency microwave circuit;

(2) determining four types of metal strip bonding interconnection electromagnetic transmission parameters according to interconnection working conditions and performance indexes in the microwave circuit;

(3) respectively establishing four types of metal strip bonding interconnection configuration parameterized representation models according to interconnection configuration in the microwave circuit and actual engineering investigation;

(4) comparing the space geometric characteristics of the four types of gold ribbon bonding interconnection configurations based on the four types of gold ribbon bonding interconnection configuration parameterized representation models;

(5) respectively establishing four types of metal strip bonding interconnection structure electromagnetic models in three-dimensional high-frequency structure simulation software based on four types of metal strip bonding interconnection configuration parameterized representation models;

(6) establishing a four-type metal strip bonding interconnection configuration and signal transmission performance prediction model according to the established four-type metal strip bonding interconnection configuration parameterized representation model and a response surface method;

(7) comparing the transmission electrical performance of single and double Gaussian-shaped gold belt interconnection signals according to the established four types of gold belt bonding interconnection configuration and signal transmission performance prediction models;

(8) comparing the transmission electrical performance of the single and double arc-shaped gold belt interconnection signals according to the established four types of gold belt bonding interconnection configuration and signal transmission performance prediction models;

(9) according to the established model for predicting the four types of gold strip bonding interconnection configurations and signal transmission performance, the electrical transmission performance of the gold strip interconnection signals with the Gaussian configuration and the arc configuration is compared;

(10) and determining the optimal gold belt interconnection configuration facing the microwave circuit signal transmission according to the established four types of gold belt bonding interconnection configurations, the signal transmission performance prediction model and the comparison result.

2. The method of claim 1, wherein determining the same geometric parameters of a single gaussian, a double gaussian, a single arc, and a double arc comprises: gold strip thickness T and left end microstrip width W₁Right microstrip width W₂Thickness h of the left end dielectric substrate₁Thickness h of right dielectric substrate₂Thickness h of microstrip₃Length l of left end gold belt bonding position₁Distance d from the left end of the microstrip to the left end of the substrate₁Distance p from the left part of the gold strip bonding to the left end of the microstrip₁Distance p between right end of gold strip bonding and right end of micro-strip₂Distance d from the right end of the microstrip to the right end of the substrate₂And the length l of the right gold ribbon bonding part₂；

Determining different geometric parameters of a single Gaussian, a double Gaussian, a single arc and a double arc comprises the following steps: width B of four kinds of gold belt, gap g of medium module and arch height h of gold belt_b(ii) a Width of gold band B of single Gauss and single arc_sWidth B of gold band of double Gauss and double circular arcs_dThe gaps of the medium modules of a single Gauss and a single arc are respectively g_sgAnd g_scThe gap between the dielectric modules of the double Gauss and the double circular arcs is g_dgAnd g_dcThe arch heights of the gold belt of a single Gauss and a single arc are h respectively_bsgAnd h_bscThe arch heights of the gold belt of the double Gauss and the double circular arcs are h respectively_bdgAnd h_bdcAnd a gold band gap W of double Gauss and double arcs_g；

Determining the same physical property parameters of a single Gaussian, a double Gaussian, a single arc and a double arc comprises the following steps: relative dielectric constant of left end dielectric substrate_r1And right dielectric substrateConstant number_r2Dielectric loss angle of the left end dielectric substrate₁And right dielectric substrate dielectric loss angle₂；

Determining four types of gold-ribbon bonded interconnection electromagnetic transmission parameters comprises: signal transmission frequency f, return loss S₁₁And insertion loss S₂₁。

3. The method for determining an optimal keyed configuration for microwave circuit interconnect signaling according to claim 2, wherein step (3) is performed as follows:

(3a) according to the characteristic analysis of the gold ribbon bonding interconnection configuration, single and double Gaussian gold ribbons are parameterized and characterized by adopting Gaussian distribution functions, and the single and double gold ribbon bonding interconnection configuration Gaussian distribution characterization functions are determined as follows:

wherein a is a gold band shape z-direction change control correlation function, b is a gold band shape x-direction change control correlation function, mu and c are the peak abscissa of the Gaussian function, and d_bIs a gold ribbon bonding span;

(3c) differential length of gold ribbon on gold ribbon non-bonding area line

The calculation is as follows:

in the formula, x₁And x₂Representing the starting point and the end point of the length part to be calculated of the Gaussian interconnection gold ribbon, wherein x is the abscissa of the gold ribbon configuration function curve;

(3d) establishing single and double Gaussian gold band bonding interconnection configuration parameterized characterization models as follows:

(3e) determining the arc function of the single and double gold ribbon bonding interconnection configuration as follows:

in the formula, X_c、Z_cIs the abscissa and ordinate of the center of curvature of the arc, R_cIs the radius of curvature of the arc;

(3f) differential length of gold ribbon on gold ribbon non-bonding area line

The calculation is as follows:

in the formula, theta_cIs the central angle of the arc;

(3g) establishing a single-arc and double-arc gold-strip bonding interconnection configuration parameterized characterization model as follows:

4. the method for determining an optimal keyed configuration for microwave circuit interconnect signaling according to claim 2, wherein step (4) is performed as follows:

(4a) according to the established four-type gold belt bonding interconnection configuration parameterized representation model, comparing the volume occupied by the single gold belt and the double gold belts, and removing the gold belt gap W_gIn contrast, the sum of the widths of the two gold bands is equal to the width 2B of a single gold band_d＝B_sAnd other structural parameters are controlled to be the same, the occupied volumes of the spaces of the single gold strip and the double gold strips are respectively as follows:

V_s＝B_s(l₁+l₂+d_bs)max(h_b-h₁,h_b-h₂)

d_bs＝p₁+d₁+g_s+p₂+d₂

in the formula, V_sOccupying space for a single gold belt, d_bsBonding span of a single gold ribbon, g_sA dielectric module gap for a single gold strip;

V_d＝(2B_d+W_g)(l₁+l₂+d_bd)max(h_b-h₁,h_b-h₂)

d_bd＝p₁+d₁+g_d+p₂+d₂

in the formula, V_dThe volume occupied by two gold bands, d_bdBonding span of double gold ribbons, g_dA dielectric module gap for a single gold strip;

(4b) when the space volume occupied by the Gaussian gold strip and the circular arc gold strip is the same, the consumable quantity of the gold strips with different configurations is compared:

for a single Gauss gold strip and a single arc gold strip, when the occupied space volume is the same,

V_sg＝B_sg(l₁+l₂+d_bsg)max(h_bsg-h₁,h_bsg-h₂)

＝V_sc＝B_sc(l₁+l₂+d_bsc)max(h_bsc-h₁,h_bsc-h₂)

in the formula, V_sgVolume occupied by a single Gauss gold belt, d_bsgBonding span of a single Gauss gold band, B_sgThe width of the gold band is a single Gaussian gold band; v_scThe volume of the occupied space of a single arc gold belt, d_bscA bonding span of a single arc gold ribbon, B_scThe width of the gold belt is a single arc gold belt;

i.e. B_sgd_bsgh_bsg＝B_scd_bsch_bscWhen the temperature of the water is higher than the set temperature,

comparing the space consumptive material quantity, and for a single Gauss gold belt, the consumed material quantity V_msgComprises the following steps:

in the formula, S_sg＝B_sT is the area of the cross section of a single Gaussian gold band, and u and v are the starting point and the ending point of the gold band;

for a single arc gold strip, the amount V of material consumed_mscComprises the following steps:

in the formula, S_scIs the area of the cross section of a single arc gold belt;

for double Gaussian gold bands and double arc gold bands, when the occupied space volume is the same,

V_dg＝B_dg(l₁+l₂+d_bdg)max(h_bdg-h₁,h_bdg-h₂)

＝V_dc＝B_dc(l₁+l₂+d_bdc)max(h_bdc-h₁,h_bdc-h₂)

i.e. B_dgd_bdgh_bdg＝B_dcd_bdch_bdcWhen the temperature of the water is higher than the set temperature,

comparing the space consumptive material quantity, and for the double Gauss gold belt, the consumed material quantity V_mdgComprises the following steps:

V_mdg＝2V_msg

for double arc gold ribbon, the amount V of material consumed_mdcComprises the following steps:

V_mdc＝2V_msc

(4c) when the consumptive material amount is equal, carry out configuration inversion to it, compare the spatial direction position of inversion:

for the bonding configuration of four types of metal bands, i.e. single Gauss, double Gauss, single arc and double arc, the consumption V can be determined according to the corresponding material consumption_msg、V_mdg、V_msc、V_mdcThe gap g of the medium modules and the height h of the golden ribbon arch are reversed to be respectively configured_bAnd a gold band width B;

when the width B of the gold strip is inverted, the other orientation parameters are known, and the following can be obtained:

B＝f(V_m,g,h_b)

in the formula, V_mThe consumption amount is the consumption amount;

inversion of golden zone arch height h_bWhen the other orientation parameters are known, the following can be obtained:

h_b＝f(V_m,g,B)

when the gap g of the medium module is inverted, the other orientation parameters are known, and the following can be obtained:

g＝f(V_m,B,h_b)

(4d) when the consumptive material quantity is equal, compare its volume that occupies:

for a single Gauss gold strip and a single arc gold strip, when the consumption amounts of the gold strips are equal, solving the smaller occupied volume of the gold strips:

for the double-root Gaussian gold strip and the double-root arc gold strip, when the consumption amounts are equal, the smaller occupied volume is solved:

in the formula, V_dgThe volume of the occupied space of the double Gauss golden belt is V_dcThe volume of the occupied space of the double Gaussian golden belts is increased;

(4e) establishing a correlation among the volume occupied by the gold belt, the space direction position and the consumable amount:

f(V,L)＝V_m

wherein V is the volume occupied by the gold band, L is the position of the gold band, and V_mThe consumption of gold belt is high.

5. The method for determining an optimal keyed configuration for microwave circuit interconnect signaling according to claim 2, wherein step (6) is performed as follows:

(6a) establishing a multiple regression model between the structural parameters and the electrical properties, and giving a continuous functional relation between the signal transmission performance and a plurality of structural parameters:

in the formula, Y is a test index, X_i、X_jIs a factor of, beta₀Is a constant term, β_iIs a coefficient of a first order term, beta_iiIs a coefficient of a quadratic term, beta_ijIs the interaction term coefficient;

(6b) selecting the frequency f and the width B of the gold strip for a single Gauss gold strip and a single arc gold strip_sGap g of dielectric substrate, height h of gold band arch_bAs test factor, the return loss S is selected₁₁And insertion loss S₂₁As a response indicator;

according to the test result, a multivariate regression empirical formula between the signal transmission performance S parameter and the interconnection form parameter is established in Design Expert:

in the formula, beta₀Is a constant term, β_iIs a first order coefficient, i is 1,2,3,4, beta_ijIs a quadratic coefficient, i is more than or equal to 1 and less than or equal to j and less than or equal to 4;

therefore, a single Gaussian and single arc gold belt interconnection form parameter and signal transmission performance path coupling model is established by using a function F_iThe expression, i is 1,2,3,4, abbreviated as:

wherein S is_sg11S of a single Gauss₁₁Parameter, S_sg21S of a single Gauss₂₁A parameter;

wherein S is_sc11S being a single circular arc₁₁Parameter, S_sc21S being a single circular arc₂₁A parameter;

(6c) for double Gauss gold bands and double arc gold bands, selecting frequency f and gold band width B_sGap g of dielectric substrate, height h of gold band arch_bGold band gap W_gAs test factor, the return loss S is selected₁₁And insertion loss S₂₁As a response indicator;

according to the test result, a multivariate regression empirical formula between the signal transmission performance S parameter and the interconnection form parameter is established in Design Expert:

in the formula, beta₀Is a constant term, β_iIs a first order coefficient, i is 1,2,3,4,5, beta_ijIs a quadratic term coefficient, i is more than or equal to 1 and less than or equal to j is less than or equal to 5;

therefore, a double-Gaussian and double-arc gold strip interconnection structure path coupling model is obtained, namely, a double-Gaussian and double-arc gold strip interconnection morphological parameter and signal transmission performance path coupling model is established, and a function F is used_iWhen i is 5,6,7,8, it is abbreviated as:

wherein the content of the first and second substances,S_dg11s of double root Gauss₁₁Parameter, S_sg21S of double root Gauss₂₁A parameter;

wherein S is_sc11S is a double arc₁₁Parameter, S_sc21S is a double arc₂₁And (4) parameters.

6. The method for determining the optimal bond configuration for microwave circuit interconnection signal transmission according to claim 2, wherein the step (7) is performed for single-gaussian and double-gaussian configuration gold band interconnection signals, the step (8) is performed for single-arc and double-arc configuration gold band interconnection signals, and the step (9) is performed for single-index signal and wide-band signal transmission electrical performance comparison for single-gaussian and single-arc configuration gold band interconnection signals, according to the following procedures:

(a) comparing the electrical performance of single-index signal transmission to the gold strip, and when the sum of the widths of the two gold strips is equal to the width of a single gold strip at the same frequency and different gold strip gaps and other structural parameters are the same, comparing the S of the gold strips₁₁The ratio of the components is as follows:

in the formula, S_u11、S_u11S of gold bands u and v respectively₁₁(ii) a B represents the width of the gold strip; when u is 1 and v is 3, it represents S of single root and double root Gauss gold band₁₁The ratio of (A) to (B); when u is 5 and v is 7, it represents S of single and double arc gold band₁₁The ratio of (A) to (B); when u is 1 and v is 5, it represents S of single Gauss and single arc gold band₁₁The ratio of (A) to (B);

if it is

It indicates that the gold band u is at S of that frequency₁₁The performance is better;

s of gold ribbon₂₁The ratio of the components is as follows:

in the formula, S_u21、S_u21S of gold bands u and v respectively₂₁(ii) a When u is 2 and v is 4, it represents S of single root and double root Gauss gold band₂₁The ratio of (A) to (B); when u is 6 and v is 8, it represents S of single and double arc gold band₂₁The ratio of (A) to (B); when u is 2 and v is 6, it represents S of single Gauss and single arc gold band₂₁The ratio of (A) to (B);

if it is

It indicates that the gold band v is at S of that frequency₂₁The performance is better;

(b) and (3) carrying out wide-frequency-band signal transmission electrical property comparison on the gold band, wherein when the frequency f is 1-40GHz, the gold band gaps are different, the sum of the widths of the two gold bands is equal to the width of a single gold band, and other structural parameters are the same, the return loss S of the gold band in the wide frequency band₁₁Difference sum S_sum11Comprises the following steps:

S_sum11＝∑(S_u11-S_v11)

if S_g11If < 0, S in the wide frequency band of the gold band u is indicated₁₁The performance is better;

if S_g11If > 0, the result shows that the gold band v is S in a wide frequency band₁₁The performance is better;

insertion loss S of single Gauss gold band and double Gauss gold bands in wide frequency band₂₁Difference sum S_sum21Comprises the following steps:

S_sum21＝∑(S_u21-S_v21)

if S_g21If < 0, S in the wide frequency band of the gold band v is indicated₂₁The performance is better;

if S_g21If > 0, the result shows that the gold band u is S in a wide frequency band₂₁The performance is better.

7. The method for determining the optimal bond configuration for microwave circuit interconnection signal transmission according to claim 2, wherein the step (7) is performed for single and double gaussian configuration gold ribbon interconnection signals, the step (8) is performed for single and double arc configuration gold ribbon interconnection signals, and the step (9) is performed for comparison of the transmission electrical performance of the comprehensive index signal for the gaussian configuration and arc configuration gold ribbon interconnection signals by the following processes:

when the frequency f is 1-40GHz, the gaps of the gold strips are different, the sum of the widths of the two gold strips is equal to the width of a single gold strip, and other structural parameters are the same:

calculating the relation of the golden band u to S_u11And S_u21Maximum difference Δ S of_u11And Δ S_u21Calculating S₁₁Minimum value S_u11minAnd S₂₁Maximum value S_u21maxCalculating the normalized S parameter to obtain the electrical property S of the comprehensive index of the gold band u_u：

λ₁、λ₂Respectively normalized S_u11And S_u21The weight coefficient of (a);

calculating golden band v about S_v11And S_v21Maximum difference Δ S of_v11And Δ S_v21Calculating S₁₁Minimum value S_v11minAnd S₂₁Maximum value S_v21maxCalculating the normalized S parameter to obtain the electrical property S of the comprehensive index of the gold band v_v：

If it is

The comprehensive index performance of the gold strip v in the wide frequency band is better.

8. The method for determining the optimal bond configuration for microwave circuit interconnection signal transmission according to claim 2, wherein the step (7) is performed for single-to-double gaussian configuration gold ribbon interconnection signals, the step (8) is performed for single-to-double circular arc configuration gold ribbon interconnection signals, and the step (9) is performed for transmission electrical property comparison under the transformation parameters for gaussian configuration and circular arc configuration gold ribbon interconnection signals, according to the following procedures:

when other parameters are the same, only the arch height h of the golden belt is considered_bInfluence on gold charging performance:

by

Obtaining the transmission electrical property of the gold strip u and the gold strip arch height h_bThe relation of (1):

by

Obtaining the transmission electrical property of the gold strip v and the gold strip arch height h_bThe relation of (1):

in the formula, gamma₀Is a constant term, γ₁Is a coefficient of a first order term, gamma₂Is a quadratic coefficient;

within the allowable range of the arch height of the golden band, sigma S_u＜∑S_vWhen the arch height is changed, the electrical property of the gold strip u is superior to that of the gold strip v;

the effect of the gold band width B and the dielectric module gap g on the electrical properties of the gold bands u and v can be obtained in the same way.

9. The method for determining the optimal configuration with keys for microwave circuit interconnection signal transmission according to claim 2, wherein in the step (10), the sum of the widths of the two gold strips is set to be equal to the width of a single gold strip, and the optimal configuration with keys for microwave circuit signal transmission is determined under the condition that other structural parameters are the same, and the following process is performed:

(10a) and setting the frequency f to be 1-40GHz, and determining the optimal performance interconnection in four types of gold strip bonding interconnection configurations:

uniformly selecting partial frequency points n, and calculating the electrical performance of the four types of gold strip bonding interconnection configurations at corresponding nodes:

to S₁₁Parameters are as follows:

s of all nodes in frequency band of single Gauss gold band₁₁The sum of

S of all nodes of single arc gold belt in frequency band₁₁The sum of

S of all nodes in frequency band of double-root Gauss gold belt₁₁The sum of

S of all nodes of double arc gold bands in frequency band₁₁The sum of

Obtaining four kinds of gold S with bonding interconnection configuration by the same method₂₁Parameter(s)

In the formula (I), the compound is shown in the specification,

s of all nodes in frequency band for single Gauss gold band₂₁Sum of，

S for all nodes in frequency band of single arc gold band₂₁The sum of the total weight of the components,

s of all nodes in frequency band for double Gauss gold bands₂₁The sum of the total weight of the components,

s of all nodes in frequency band for double arc gold bands₂₁Sum of g₀Constant value for arch height of gold band of single Gauss and single arc, B₀Width of gold band of single Gauss and single arc, h_b0The arch height of the gold belt is constant for a single Gaussian and a single arc;

S_11minthe corresponding gold ribbon bonding configuration is S₁₁Gold ribbon bonding configuration with optimal electrical performance;

S_21maxthe corresponding gold ribbon bonding configuration is S₂₁Gold ribbon bonding configuration with optimal electrical performance;

(10b) comparing the consumption of gold strips with different configurations:

(10c) comparing the space position occupation of gold bands with different configurations:

(10d) determining the optimal interconnection in four types of gold ribbon bonding interconnection configurations:

the following formula is obtained to measure the comprehensive performance of the gold ribbon interconnection:

P＝ω₁S+ω₂V_m+ω₃(B×g×h_b)

wherein P represents the overall performance of the gold band, ω₁,ω₂,ω₃Is a weight coefficient of the corresponding index, and ω₁＞ω₂,ω₃(ii) a S represents the electrical property of gold ribbon bonding; v_mRepresenting the consumable amount of gold ribbon bonding; bxgxh_bRepresenting the space ratio of gold ribbon bonding;

when the parameters are the same, calculating P values of the four types of golden bands, and determining the optimal interconnection in the four types of golden band bonding interconnection configurations;

(10e) determining the lowest interconnection of consumables in four types of gold ribbon bonding interconnection configurations when the electrical properties are the same:

in the formula, V_msgminMinimum material consumption of single Gauss gold belt, V_mdgminMinimum material consumption of double Gauss gold band, V_mscminMinimum material consumption of single arc gold belt, V_mdcminThe minimum material consumption of the double arc gold strips;

(10f) when the electrical properties are the same, determining the minimum occupied space interconnect in the four types of gold ribbon bond interconnect configurations:

in the formula, V_sgminIs the minimum space occupation of a single Gauss gold band, V_dgminIs the minimum space occupation of double Gauss gold bands, V_scminIs the minimum space occupation of a single arc gold belt, V_dcminThe minimum space occupation of the double arc gold bands is realized.

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