CN110516357A - Gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method - Google Patents
Gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method Download PDFInfo
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Abstract
The invention discloses a kind of, and the gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method, including determines gold ribbon flexible interconnection geometric parameter, physical parameter, electromagnetic transmission parameter, carries out parametrization characterization to gold ribbon flexible interconnection form；It determines gold ribbon flexible interconnection operating condition and environment temperature load, establishes gold ribbon flexible interconnection structure-thermal deformation analysis model；It determines gold ribbon flexible interconnection morphological parameters heat distortion amount, establishes gold ribbon flexible interconnection structure-emi analysis model；The orthogonal test of gold ribbon flexible interconnection form Deformation Parameters and electrical performance indexes is designed, gold ribbon flexible interconnection morphological parameters heat affecting degree is calculated；Determine gold ribbon flexible interconnection form thermal sensitive parameter and morphological parameters thermal sensitivity.This method can instruct microwave components to consider the design and optimization of application environment, promote microwave product and develop quality.
Description
Technical field
The invention belongs to microwave radio field of circuit technology, specifically a kind of gold ribbon towards microwave components electrical property is flexible
Interconnection thermal sensitive parameter determines method, can be used for instructing module Networking Design and electromagnetic transmission performance in microwave components to regulate and control.
Background technique
Present information electronic technology development is swift and violent, as the core of hardware technology support, microwave components and microwave circuit quilt
It is widely used in the high-precision pointed collar domain such as deep space exploration, target tracking, interconnected communication and various space applications.Microwave electron equipment
The development trend that highly reliable, integrated miniaturization and high-speed is gradually presented is developed, this makes high-quality microwave module development skill
The breakthrough of art becomes the urgent need of electronics technology development.
Circuit and module are connected in high frequency active microwave components frequently with flexible interconnection structure, this structure is realizing letter
While number accurate transfer, the effect of buffering itself and environmental load is also had both, so that circuit reliability is obviously improved.
However, the study found that interconnecting metamorphosis with the raising of signal transmission frequencies, in microwave components to the shadow of signal transmission performance
Sound increased dramatically, or even cause microwave components disabler.When microwave electron equipment is on active service in big temperature change and extreme temperature environment
When middle, interconnection form flexible is easily influenced by temperature loading and deformation occurs, and then is impacted to signal transmission.It is above-mentioned to make
Obtaining circuit flexible interconnection thermal deformation problem in high-frequency microwave component becomes influence microwave components performance, and restricts microwave electron equipment
The key factor that Development Level is promoted under towards extreme temperature operating condition.
Signal transmission performance is impacted for flexible interconnection form thermal deformation in microwave circuit and microwave components at present
Aspect, rarely seen Research on Theory.It studies and rests in artificial experience and a large amount of interconnection thermodynamic software emulation more in engineering,
Job costs height, low efficiency and effect are poor.Therefore, herein for typical coaxial in microwave components and micro-strip interconnection architecture, deeply
Gold ribbon flexible interconnection thermal sensitive parameter of the research towards microwave components electrical property determines method, joins to gold ribbon flexible interconnection form
Numberization quantifies accurate Characterization, establishes heat-interconnection architecture-emi analysis model based on interconnection morphological feature, breaks through interconnection form
Thermal sensitive parameter identification is calculated with morphological parameters thermal sensitivity.Optimization design and hot ring are interconnected in microwave components for project planner
Transmission performance regulation aspect in border provides theoretical direction.High frequency active microwave product Development Level is promoted, extreme temperature environment is met
Lower microwave electron equips high-performance military service demand.
Summary of the invention
In view of the above-mentioned problems, the present invention provides a kind of gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property
It determines method, is microwave group quickly and accurately to determine gold ribbon flexible interconnection form thermal sensitive parameter and morphological parameters thermal sensitivity
The guarantee of electrical property provides theoretical direction under part performance boost and complex environment.
Realizing the technical solution of the object of the invention is, a kind of gold ribbon flexible interconnection heat towards microwave components electrical property
Quick parameter determination method, this method include the following steps:
(1) specific requirement interconnected according to high-frequency microwave component, determines gold ribbon flexible interconnection geometric parameter and physical parameter；
(2) operating condition and performance indicator are interconnected according to microwave components, determines gold ribbon flexible interconnection electromagnetic transmission in microwave components
Parameter；
(3) form and the practical investigation of engineering are interconnected according to microwave components, parametrization table is carried out to gold ribbon flexible interconnection form
Sign；
(4) according to microwave components work requirements and operating condition, microwave components gold ribbon flexible interconnection operating condition and environment are determined
Temperature loading；
(5) it is characterized according to gold ribbon flexible interconnection geometric parameter, thermal physical property parameter, morphological parametersization in determining microwave components
And working environment, establish gold ribbon flexible interconnection structure-thermal deformation analysis model；
(6) soft using Ansys analysis and solution gold ribbon according to gold ribbon flexible interconnection structure-thermal deformation analysis model of foundation
Property interconnection morphological parameters heat distortion amount；
(7) it according to interconnection geometry and physical parameter, morphological parameters characterization and electromagnetic transmission parameter, establishes and parameter is become with heat
Number is gold ribbon flexible interconnection structure-emi analysis model that variable regulates and controls parameter；
(8) according to gold ribbon flexible interconnection morphological parameters in microwave components and electric property assessment index, determine factor, level and
Index designs the orthogonal test of gold ribbon flexible interconnection form Deformation Parameters and electrical performance indexes；
(9) according to orthogonal experiments variance analysis, gold ribbon flexible interconnection morphological parameters heat affecting degree is calculated；
(10) it according to gold ribbon flexible interconnection morphological parameters heat affecting degree, determines gold ribbon flexible interconnection form thermal sensitive parameter and counts
Calculate morphological parameters thermal sensitivity.
Further, in step (1), determine that gold ribbon flexible interconnection geometric parameter includes: gold ribbon width B, gold in microwave components
Tape thickness T, gold ribbon horizontal section length L1, half span P of gold ribbon, gold ribbon micro-strip bond length b4, gold ribbon is coaxially bonded angle θ, gold ribbon arrives
Dielectric substrate threshold value b2, inner conductor length Lc, inner conductor diameter d1, inner conductor end to gold ribbon distance b3, drop g, insulation
Medium length b1, dielectric diameter d2, conductor strip length Lm, conductor bandwidth Wm, conductor tape thickness H1, dielectric substrate length
Ls, dielectric substrate width Ws, dielectric substrate thickness h2With module gap S；
Determine that electromagnetic property parameters include: dielectric substrate permittivity εs, dielectric substrate loss angle tangent θs, glass medium
Permittivity εgWith glass medium loss angle tangent θg。
Determine that thermal physical property parameter includes: dielectric substrate, conductor band, gold ribbon, inner conductor and dielectric thermal physical property parameter, institute
State dielectric substrate, conductor band, gold ribbon, inner conductor and dielectric thermal physical property parameter include elastic modulus E, thermalexpansioncoefficientα and
Poisson's ratio μ.
Further, in step (2), determine that gold ribbon flexible interconnection electromagnetic transmission parameter includes: signal transmission in microwave components
Frequency f, return loss S11With insertion loss S21。
Further, in the step (3), to gold ribbon flexible interconnection form carry out parametrization characterization according to the following steps into
Row:
Interconnection Form division is four areas, it is same to be respectively as follows: gold ribbon by (3a) according to gold ribbon flexible interconnection Morphometric analysis
Axis bonding region, gold ribbon micro-strip bonding region, left side nonbonding area and right side nonbonding area.Since gold ribbon flexible interconnection has symmetrical junction
Structure, therefore choose left one side of something and carry out parametrization characterization；
(3b) establishes cartesian cartesian coordinate system according to the left half of Morphometric analysis of gold ribbon flexible interconnection, soft to gold ribbon
Property interconnection Form division be 5 sections: AB arc section, BC straightway, the upper parabolic section of CD, parabolic section and EF straightway under DE, respectively into
Row piecewise function characterization；
(3c) is 5 sections to gold ribbon flexible interconnection Form division and is segmented according to gold ribbon flexible interconnection Morphometric analysis
Function characterization is coaxially bonded AB arc section characterization function, gold ribbon left side nonbonding area top BC straight line segment table including gold ribbon
Parabolic segment table levies function under parabolic segment table sign function, gold ribbon left side nonbonding area DE on nonbonding area CD on the left of sign function, gold ribbon
Function is characterized with gold ribbon micro-strip bonding region EF straightway.
Further, in step (4), gold ribbon flexible interconnection operating condition and environment temperature load are determined, according to microwave components
Work requirements and operating condition determine that microwave components gold ribbon flexible interconnection operating condition is extreme temperature, big temperature changing environment.Carrying out heat
When analyzing load application, setting caloric impact temperature variation range is Tmin~Tmax, temperature rate Tc, high/low temperature peak holding
Time is tk, temperature cycle period.
When carrying out gold ribbon flexible interconnection structure-thermal deformation analysis, in order to traverse each temperature course, 2 are applied to interconnection architecture
The temperature loading in a period.
Further, in the step (5), gold ribbon flexible interconnection structure-thermal deformation analysis model is established according to the following steps
It carries out:
(5a) is according to microwave components gold ribbon flexible interconnection geometric parameter, physical parameter and the step determined in step (1)
(3) parametrization that gold ribbon flexible interconnection form carries out is characterized in, gold ribbon flexible interconnection structure-heat is established in Ansys software
Deformation analysis models；
The model that (5b) is established includes dielectric, inner conductor, gold ribbon, micro belt conductor and dielectric substrate；According to step 4
The temperature loading of middle determination carries out environmental load application to gold ribbon flexible interconnection structure.
Further, it in the step (6), is pressed using Ansys analysis and solution gold ribbon flexible interconnection morphological parameters heat distortion amount
It is carried out according to following steps:
(6a) determines 6 major parameters for influencing gold ribbon flexible interconnection form according to the practical investigation of engineering are as follows: drop g, gold
Take dielectric substrate threshold value b to2, inner conductor end to gold ribbon distance b3, gold ribbon micro-strip bond length b4, module gap S and gold
Half span P of band；
(6b), to gold ribbon flexible interconnection structure-thermal deformation analysis solving result, and provides parameter size thermal change according to Ansys
When shape increases, heat distortion amount is positive value, and when parameter size thermal deformation reduces, heat distortion amount is negative value.It thereby determines that golden in (6a)
Band flexible interconnection morphological parameters thermal deformation；
(6c) is based on thermal deformation formula, determines gold ribbon interconnection morphological parameters size after thermal deformation.
Further, in step (7), established gold ribbon flexible interconnection structure-emi analysis model includes dielectric, interior leads
Body, gold ribbon, micro belt conductor and dielectric substrate.
Further, in the step (8), factor, level and index are determined, designs gold ribbon flexible interconnection form thermal change parameter
Several orthogonal tests with electrical performance indexes follow the steps below:
(8a) selects the gold ribbon flexible interconnection form for considering thermal deformation according to interconnection form Deformation Parameters and heat distortion amount
Take equidistant 6 factor, 7 horizontal values；
(8b) determines gold ribbon flexibility according to the microwave components gold ribbon flexible interconnection electromagnetic transmission parameter determined in step (2)
Interconnecting electromagnetic transmission performance indicator is return loss and insertion loss；
(8c) designs 6 factor, 7 horizontal quadrature table L49(78), and combine 3 D electromagnetic full-wave simulation software analysis design gold ribbon
The orthogonal test of flexible interconnection form Deformation Parameters and electrical performance indexes.
Further, in the step (9), calculate gold ribbon flexible interconnection morphological parameters heat affecting degree according to the following steps into
Row:
(9a) calculates gold ribbon flexible interconnection morphological parameters and normalizes heat affecting degree according to orthogonal test the results of analysis of variance；
(9b) towards return loss S11 and insertion loss S21 comprehensive electrochemical properties index, calculates gold ribbon flexible interconnection shape simultaneously
State parameter heat affecting degree.
Further, it in the step (10), determines gold ribbon flexible interconnection form thermal sensitive parameter and calculates morphological parameters temperature-sensitive
Degree follows the steps below:
(10a) is according to parameter freedom degree fjWith error freedom degree fe, and F distribution and α quantile are combined, determine critical value Fα
(fj,fe), then calculate gold ribbon flexible interconnection morphological parameters normalization critical heat disturbance degree；
(10b) towards return loss S11 and insertion loss S21 comprehensive electrochemical properties index, calculates gold ribbon flexible interconnection simultaneously
Morphological parameters critical heat disturbance degree；
(10c) normalizes heat affecting degree according to gold ribbon flexible interconnection morphological parametersAnd normalization critical heat disturbance degreeDetermine the decision criteria of gold ribbon flexible interconnection form thermal sensitive parameter are as follows:
(10d) combines thermal sensitive parameter decision criteria according to gold ribbon flexible interconnection morphological parameters heat affecting degree, determines interconnection
Morphological parameters normalize thermal sensitivity.
Compared with prior art, the present invention having the following characteristics that
1. the present invention is directed to microwave components gold ribbon flexible interconnection structure, the gold ribbon flexible interconnection shape towards electrical property is established
State parameterizes characterization model.The influence between temperature loading and flexible interconnection signal transmission performance is had studied based on this characterization model
Relationship, it is determined that gold ribbon flexible interconnection form thermal sensitive parameter, and calculate interconnection morphological parameters thermal sensitivity.It solves under thermal force
Flexible interconnection Deformation Parameters are associated with unclear, the unknown difficulty in hot optimization design direction with influence between transmission performance in microwave components
Topic.
2. determining method, it can be achieved that in microwave group using the gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property
With the course of work, flexible interconnection morphological parametersization quantify accurate Characterization for part design, manufacture, quickly provide flexible interconnection form heat
Quick parameter and morphological parameters thermal sensitivity are project planner in the case where considering thermal environment loading effect, and module is mutual in microwave components
Connection design provides theoretical direction with transmission performance regulation aspect, promotes working efficiency, reduces product development cost, ensures product clothes
Use as a servant performance.
Detailed description of the invention
Fig. 1 is the process that a kind of gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property of the present invention determines method
Figure；
Fig. 2 is the gold ribbon flexible interconnection parameterized model schematic diagram for considering thermal deformation；
Fig. 3 is gold ribbon flexible interconnection sectional characterization schematic diagram；
Fig. 4 is warm varying load curve；
Fig. 5 is gold ribbon flexible interconnection structure-thermal deformation analysis model；
Fig. 6 is model after gold ribbon flexible interconnection structure-thermal deformation grid dividing；
Fig. 7 is total deformation of the gold ribbon flexible interconnection form at the highest temperature moment；
Fig. 8 is total deformation of the gold ribbon flexible interconnection form at the lowest temperature moment；
Fig. 9 is the gold ribbon flexible interconnection structure-emi analysis model for regulating and controlling parameter using Deformation Parameters as variable；
Specific embodiment
The present invention will be further described with reference to the accompanying drawings and embodiments.
Referring to Fig.1, the present invention is that a kind of gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method,
Specific step is as follows:
Step 1, the geometric parameter and physical parameter of gold ribbon flexible interconnection in microwave components are determined
Referring to shown in Fig. 2, gold ribbon flexible interconnection includes earth plate 1 in high-frequency microwave component, is connected on 1 upper layer of earth plate
Dielectric substrate 2, the conductor band 3 connected on dielectric substrate 2 are connected to inner conductor 5, inner conductor 5 and dielectric 4 by gold ribbon 6
Connection.According to the specific requirement interconnected in high-frequency microwave component, respectively determine microwave components in gold ribbon interconnection geometric parameter with
Physical parameter.
Determine that geometric parameter includes: gold ribbon width B, gold ribbon thickness T, gold ribbon horizontal section length L1, half span P of gold ribbon, gold
Band micro-strip bond length b4, gold ribbon be coaxially bonded angle θ, gold ribbon to dielectric substrate threshold value b2, inner conductor length Lc, inner conductor
Diameter d1, inner conductor end to gold ribbon distance b3, drop g, dielectric length b1, dielectric diameter d2, conductor strip length Lm、
Conductor bandwidth Wm, conductor tape thickness H1, dielectric substrate length Ls, dielectric substrate width Ws, dielectric substrate thickness h2And intermodule
Gap S；
Determine that electromagnetic property parameters include: dielectric substrate permittivity εs, dielectric substrate loss angle tangent θs, glass medium
Permittivity εgWith glass medium loss angle tangent θg；
Determine that thermal physical property parameter includes: dielectric substrate thermal physical property parameter, conductor band thermal physical property parameter, the hot physical property ginseng of gold ribbon
Number, inner conductor thermal physical property parameter and dielectric thermal physical property parameter.Specific dielectric substrate, conductor band, gold ribbon, inner conductor and insulation
Medium thermal physical property parameter includes elastic modulus E, thermalexpansioncoefficientα and Poisson's ratio μ.
Step 2, gold ribbon flexible interconnection electromagnetic transmission parameter in microwave components is determined
It determines gold ribbon flexible interconnection electromagnetic transmission parameter in microwave components, specifically includes: signal transmission frequencies f, echo damage
Consume S11With insertion loss S21。
Step 3, parametrization characterization is carried out to gold ribbon flexible interconnection structural form
Form and the practical investigation of engineering are interconnected according to microwave components, gold ribbon flexible interconnection form sectional is parameterized
Characterization is followed the steps below referring to Fig. 3:
Interconnection Form division is four areas, it is same to be respectively as follows: gold ribbon by (3a) according to gold ribbon flexible interconnection Morphometric analysis
Axis bonding region, gold ribbon micro-strip bonding region, left side nonbonding area and right side nonbonding area.Since gold ribbon flexible interconnection has symmetrical junction
Structure, therefore choose left one side of something and carry out parametrization characterization.
(3b) establishes cartesian cartesian coordinate system according to the left half of Morphometric analysis of gold ribbon flexible interconnection, soft to gold ribbon
Property interconnection Form division be 5 sections: AB arc section, BC straightway, the upper parabolic section of CD, parabolic section and EF straightway under DE, respectively into
Row piecewise function characterization；Enable intermediate variable:
(3c) is 5 sections to gold ribbon flexible interconnection Form division and is segmented according to gold ribbon flexible interconnection Morphometric analysis
Function characterization, wherein gold ribbon is coaxially bonded AB arc section characterization function are as follows:
Nonbonding area top BC straightway characterizes function on the left of gold ribbon are as follows:
Parabolic segment table levies function on nonbonding area CD on the left of gold ribbon are as follows:
Parabolic segment table levies function under nonbonding area DE on the left of gold ribbon are as follows:
Gold ribbon micro-strip bonding region EF straightway characterizes function are as follows:
Step 4, microwave components gold ribbon flexible interconnection operating condition and environment temperature load are determined
Determine that microwave components gold ribbon flexible interconnection operating condition is referring to Fig. 4 according to microwave components work requirements and operating condition
Extreme temperature, big temperature changing environment；When carrying out the application of heat analysis load, setting caloric impact temperature variation range is Tmin~Tmax,
Temperature rate is Tc, the high/low temperature peak holding time is tk, then temperature cycles period Cy are as follows:
When carrying out gold ribbon flexible interconnection structure-thermal deformation analysis, in order to traverse each temperature course, 2 are applied to interconnection architecture
The temperature loading in a period.
Step 5, gold ribbon flexible interconnection structure-thermal deformation analysis model is established
According to gold ribbon flexible interconnection geometric parameter in determining microwave components, thermal physical property parameter, morphological parametersization characterization and
Working environment, establishes gold ribbon flexible interconnection structure-thermal deformation analysis model, referring to Fig. 5, Fig. 6, according to the following steps into
Row:
(5a) is according to microwave components gold ribbon flexible interconnection geometric parameter, physical parameter and the step determined in step (1)
(3) parametrization that gold ribbon flexible interconnection form carries out is characterized in, gold ribbon flexible interconnection structure-heat is established in Ansys software
Deformation analysis models；
The model that (5b) is established includes dielectric, inner conductor, gold ribbon, micro belt conductor and dielectric substrate；According to step 4
The temperature loading of middle determination carries out environmental load application to gold ribbon flexible interconnection structure.
Step 6, Ansys analysis and solution gold ribbon flexible interconnection morphological parameters heat distortion amount is utilized
It is flexible mutually using Ansys analysis and solution gold ribbon according to gold ribbon flexible interconnection structure-thermal deformation analysis model of foundation
Join morphological parameters heat distortion amount, referring to Fig. 7, Fig. 8, follow the steps below:
(6a) determines 6 major parameters for influencing gold ribbon flexible interconnection form according to the practical investigation of engineering are as follows: drop g, gold
Take dielectric substrate threshold value b to2, inner conductor end to gold ribbon distance b3, gold ribbon micro-strip bond length b4, module gap S and gold
Half span P of band；
(6b), to gold ribbon flexible interconnection structure-thermal deformation analysis solving result, and provides parameter size thermal change according to Ansys
When shape increases, heat distortion amount is positive value, and when parameter size thermal deformation reduces, heat distortion amount is negative value；It thereby determines that golden in (6a)
Band flexible interconnection morphological parameters thermal deformation are as follows:
Part=(gt,b2t,b3t,b4t,St,Pt), Part∈[parmin-par0,parmax-par0]
Wherein, PartExpression parameter heat distortion amount vector；gtFor drop heat distortion amount, b2tFor gold ribbon to dielectric substrate end
Apart from heat distortion amount, b3tIt is inner conductor end to gold ribbon apart from heat distortion amount, b4tFor gold ribbon micro-strip bond length heat distortion amount, St
For module gap heat distortion amount, PtFor half span heat distortion amount of gold ribbon；
Parmin=(gmin,(b2)min,(b3)min,(b4)min,Smin,Pmin) after expression parameter thermal deformation size minimum value to
Amount；
Wherein, gminFor minimum value after drop thermal deformation, (b2)minFor after gold ribbon to dielectric substrate threshold value thermal deformation most
Small value, (b3)minFor inner conductor end to gold ribbon after thermal deformation minimum value, (b4)minFor gold ribbon micro-strip bond length thermal deformation
Minimum value afterwards, SminFor minimum value after the thermal deformation of module gap, PminFor minimum value after half span thermal deformation of gold ribbon；
Par0=(g0,b20,b30,b40,S0,P0) expression parameter initial vector,
Wherein, g0For drop initial value, b20For gold ribbon to dielectric substrate threshold value initial value, b30For inner conductor end to gold ribbon
Apart from initial value, b40For gold ribbon micro-strip bond length initial value, S0For module gap initial value, P0For half span initial value of gold ribbon；
Parmax=(gmax,(b2)max,(b3)max,(b4)max,Smax,Pmax) after expression parameter thermal deformation dimensional maximums to
Amount；
Wherein, gmaxFor maximum value after drop thermal deformation, (b2)maxFor after gold ribbon to dielectric substrate threshold value thermal deformation most
Big value, (b3)maxFor inner conductor end to gold ribbon after thermal deformation maximum value, (b4)maxFor gold ribbon micro-strip bond length thermal deformation
Maximum value afterwards, SmaxFor maximum value after the thermal deformation of module gap, PmaxFor maximum value after half span thermal deformation of gold ribbon；
(6c) is based on thermal deformation formula, determines gold ribbon interconnection morphological parameters size vector after thermal deformation are as follows:
Par=Par0+Part=(g0+gt,b20+b2t,b30+b3t,b40+b4t,S0+St,P0+Pt)。
Step 7, the flexible interconnection structure-emi analysis model for regulating and controlling parameter using Deformation Parameters as variable is established
According to interconnection geometry and physical parameter, morphological parameters characterization and electromagnetic transmission parameter, establish with Deformation Parameters
The gold ribbon flexible interconnection structure-emi analysis model for regulating and controlling parameter for variable, referring to Fig. 9, including according to determination in step (1)
The microwave components gold ribbon flexible interconnection electricity determined in microwave components gold ribbon flexible interconnection geometric parameter, physical parameter and step (2)
It is determined in the parametrization characterization and step (6) carried out in magnetic configured transmission and step (3) to gold ribbon flexible interconnection form
Gold ribbon interconnects morphological parameters numerical value after thermal deformation, establishes gold ribbon flexible interconnection knot in 3 D electromagnetic full-wave simulation analysis software
Structure-emi analysis model, the model established is by the components group such as edge medium, inner conductor, gold ribbon, micro belt conductor and dielectric substrate
At.
Step 8, factor, level and index are determined, gold ribbon flexible interconnection form Deformation Parameters and electrical performance indexes are designed
Orthogonal test
According to gold ribbon flexible interconnection morphological parameters in microwave components and electric property assessment index, determines factor, level and refer to
Mark designs the orthogonal test of gold ribbon flexible interconnection form Deformation Parameters and electrical performance indexes, follows the steps below:
(8a) selects the gold ribbon flexible interconnection form for considering thermal deformation according to interconnection form Deformation Parameters and heat distortion amount
Take equidistant 6 factor, 7 horizontal values are as follows:
Wherein, (g0+gt)v1~(g0+gt)v77 horizontal values, (b are taken for drop20+b2t)v1~(b20+b2t)v7It is arrived for gold ribbon
Dielectric substrate threshold value takes 7 horizontal values, (b30+b3t)v1~(b30+b3t)v77 levels are taken for inner conductor end to gold ribbon distance
Numerical value, (b40+b4t)v1~(b40+b4t)v77 horizontal values, (S are taken for gold ribbon micro-strip bond length0+St)v1~(S0+St)v7For mould
Block gap takes 7 horizontal values, (P0+Pt)v1~(P0+Pt)v77 horizontal values are taken for half span of gold ribbon.
Factor level calculation formula in table are as follows:
In formula, m is number of levels；
(8b) determines gold ribbon flexibility according to the microwave components gold ribbon flexible interconnection electromagnetic transmission parameter determined in step (2)
Interconnecting electromagnetic transmission performance indicator is return loss and insertion loss:
Ind=[S11 S21]；
(8c) designs 6 factor, 7 horizontal quadrature table L49(78), and combine 3 D electromagnetic full-wave simulation software analysis design gold ribbon
The orthogonal test of flexible interconnection form Deformation Parameters and electrical performance indexes.
Step 9, gold ribbon flexible interconnection morphological parameters disturbance degree is calculated
Variance analysis is carried out according to orthogonal experiments, gold ribbon flexible interconnection morphological parameters disturbance degree is calculated, according to following
Step carries out:
(9a) calculates gold ribbon flexible interconnection morphological parameters and normalizes heat affecting degree according to orthogonal test the results of analysis of variance
EffjAre as follows:
In above formula, FjCorrespond to that index is averaged the sum of squares of deviations and error is averaged the ratio of the sum of squares of deviations for j-th of parameter；
(9b) towards return loss S11 and insertion loss S21 comprehensive electrochemical properties index, calculates gold ribbon flexible interconnection shape simultaneously
State parameter heat affecting degreeAre as follows:
In formula,For the gold ribbon flexible interconnection morphological parameters heat affecting degree towards return loss index S 11, EffS21
For the gold ribbon flexible interconnection morphological parameters heat affecting degree towards insertion loss index S 21, w1And w2Respectively correspond to heat affecting degree
Weight coefficient.
Step 10, it determines gold ribbon flexible interconnection form thermal sensitive parameter and calculates morphological parameters thermal sensitivity
According to gold ribbon flexible interconnection morphological parameters heat affecting degree, determines gold ribbon flexible interconnection form thermal sensitive parameter and calculate shape
State parameter thermal sensitivity, follows the steps below:
(10a) is according to parameter freedom degree fjWith error freedom degree fe, and F distribution and α quantile are combined, determine critical value Fα
(fj,fe), then calculate gold ribbon flexible interconnection morphological parameters normalization critical heat disturbance degree EffjαAre as follows:
(10b) towards return loss S11 and insertion loss S21 comprehensive electrochemical properties index, calculates gold ribbon flexible interconnection simultaneously
Morphological parameters critical heat disturbance degreeAre as follows:
In formula,For the gold ribbon flexible interconnection morphological parameters critical heat disturbance degree towards return loss index S 11,For the gold ribbon flexible interconnection morphological parameters critical heat disturbance degree towards insertion loss index S 21；
(10c) normalizes heat affecting degree according to gold ribbon flexible interconnection morphological parametersAnd normalization critical heat disturbance degreeDetermine the decision criteria of gold ribbon flexible interconnection form thermal sensitive parameter are as follows:
(10d) combines thermal sensitive parameter decision criteria according to gold ribbon flexible interconnection morphological parameters heat affecting degree, determines interconnection
Morphological parameters normalize thermal sensitivity are as follows:
Advantages of the present invention can be calculated by following instance and be further illustrated:
One, the geometric parameter and physical parameter of gold ribbon flexible interconnection are determined
It is heated to study flexible interconnection structure in T/R component by taking Ku wave band active phase array antenna T/R component as an example for this experiment
When environmental load influences, influence of the form thermal deformation to circuit microwave transmission performance is interconnected, and probe into and pass towards microwave electrical property
The determination method of defeated interconnection form thermal sensitive parameter and morphological parameters thermal sensitivity.For simplifying the analysis, it chooses typical in T/R component
Coaxial circuit and microstrip circuit transformational structure, probe into gold ribbon flexible interconnection be heated loading effect shape association mechanism.Gold ribbon
Flexible interconnection considers that the parameterized model schematic diagram of thermal deformation is shown in that Fig. 2, geometric parameter and the physical parameter of gold ribbon flexible interconnection are shown in
Table 1, table 2, and taking the electromagnetism operating center frequency of T/R component is 15GHz.
The geometric parameter and physical parameter of 1 gold ribbon flexible interconnection of table
The thermal physical property parameter of 2 gold ribbon flexible interconnection of table
Two, it calculates and solves gold ribbon flexible interconnection morphological parameters heat distortion amount
1. determining gold ribbon flexible interconnection operating condition and environment temperature load
T/R component gold ribbon flexible interconnection operating condition is extreme temperature, big temperature changing environment.Referring to Fig. 4, heat analysis is being carried out
When load applies, setting caloric impact temperature variation range is -180 DEG C~+150 DEG C, and temperature rate is 66 DEG C/s, high/low temperature peak
The value retention time is 900s, and the temperature cycles period is 1810s, and temperature loading applies 2 periods.
2. establishing gold ribbon flexible interconnection structure-thermal deformation analysis model
According to T/R component gold ribbon flexible interconnection geometric parameter, physical parameter, and interconnection morphological parametersization characterization, In
Gold ribbon flexible interconnection structure-thermal deformation analysis model such as Fig. 5 is established in Ansys software, shown in Fig. 6.The model established is by exhausted
Edge medium, inner conductor, gold ribbon, micro belt conductor and dielectric substrate component composition.To gold ribbon flexible interconnection structure according to as shown in Figure 4
Carry out the application of environment temperature load.
3. analytical calculation gold ribbon flexible interconnection morphological parameters heat distortion amount；
Gold ribbon flexible interconnection morphological parameters thermal deformation is analyzed using Ansys software, incorporating parametric thermal deformation meter
Formula is calculated, the heat distortion amount of each parameter of gold ribbon flexible interconnection form is calculated separately.Determine interconnection characterization parameter thermal deformation range such as
Shown in the following table 3.
Gold ribbon interconnects the characterization parameter thermal deformation of form key when table -180~150 DEG C of applications of 3 temperature loading
Three, it determines gold ribbon flexible interconnection form thermal sensitive parameter and calculates morphological parameters thermal sensitivity
1. establishing the gold ribbon flexible interconnection structure-emi analysis model for regulating and controlling parameter using Deformation Parameters as variable
According to gold ribbon flexible interconnection geometric parameter, physical parameter, morphological parameters characterization and electromagnetism in determining T/R component
Configured transmission establishes the gold ribbon flexibility for regulating and controlling parameter using Deformation Parameters as variable in 3 D electromagnetic full-wave simulation analysis software
Interconnection architecture-emi analysis model as shown in figure 9, the model established by dielectric, inner conductor, gold ribbon, micro belt conductor and
The components such as dielectric substrate composition.
2. designing the orthogonal test of gold ribbon flexible interconnection form Deformation Parameters and electrical performance indexes
(1) gold ribbon flexible interconnection design variable, design initial value and design space are determined
Form and the practical investigation of engineering are interconnected according to microwave components, and combines the morphological parameters thermal deformation of gold ribbon flexible interconnection
Amount determines the corresponding design variable of 6 Control factors of gold ribbon flexible interconnection form, design initial value and design space such as the following table 4 institute
Show.
The design variable of 4 gold ribbon flexible interconnection of table and design space
(2) orthogonal test factor, level and index Design orthogonal test are chosen
Equidistant 6 factor, 7 horizontal values are chosen according to design space to gold ribbon flexible interconnection form, 6 factor of design 7 is horizontal
Orthogonal arrage L49(78), using return loss and insertion loss as electromagnetic transmission performance indicator, in conjunction with 3 D electromagnetic full-wave simulation software
The orthogonal test of analysis design gold ribbon flexible interconnection morphological parameters and electromagnetic transmission performance indicator.
3. calculating gold ribbon flexible interconnection morphological parameters heat affecting degree
According to orthogonal test the results of analysis of variance, the gold ribbon flexible interconnection form ginseng towards return loss index S 11 is calculated
Number heat affecting degree analyzes result are as follows:
It calculates the gold ribbon flexible interconnection morphological parameters heat affecting degree towards Insertion Loss index S 21 and analyzes result are as follows:
Taking heat affecting degree weight coefficient is respectively w1=w2=0.5, thus it is comprehensive towards return loss S11 and insertion loss S21 simultaneously
Close electrical performance indexes, gold ribbon flexible interconnection morphological parameters heat affecting degree are as follows:
4. determining gold ribbon flexible interconnection form thermal sensitive parameter and calculating morphological parameters thermal sensitivity
According to parameter freedom degree fjWith error freedom degree fe, and F distribution and α quantile are combined, determine critical value Fα(fj,
fe), then calculate the gold ribbon flexible interconnection morphological parameters critical heat disturbance degree towards return loss index S 11 are as follows:
Calculate the gold ribbon flexible interconnection morphological parameters critical heat disturbance degree towards Insertion Loss index S 21 are as follows:
Therefore simultaneously towards return loss S11 and insertion loss S21 comprehensive electrochemical properties index, gold ribbon flexible interconnection morphological parameters
Critical heat disturbance degree are as follows:
It is calculated according to the decision criteria of gold ribbon flexible interconnection form thermal sensitive parameter:
Then, the gold ribbon flexible interconnection form thermal sensitive parameter towards comprehensive electrochemical properties determines are as follows:
Parc=[b2 b4 S P]
Thermal sensitivity calculation formula is normalized according to gold ribbon flexible interconnection morphological parameters, calculates thermal sensitivity are as follows:
RSenj=[0 0.2148 0 0.2455 0.2378 0.3019].
The present invention is not limited to the above embodiments, on the basis of technical solution disclosed by the invention, the skill of this field
For art personnel according to disclosed technology contents, one can be made to some of which technical characteristic by not needing creative labor
A little replacements and deformation, these replacements and deformation are within the scope of the invention.
Claims (10)
1. a kind of gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method, which is characterized in that including under
State step:
(1) specific requirement interconnected according to high-frequency microwave component, determines gold ribbon flexible interconnection geometric parameter and physical parameter；
(2) operating condition and performance indicator are interconnected according to microwave components, determines gold ribbon flexible interconnection electromagnetic transmission parameter in microwave components；
(3) form and the practical investigation of engineering are interconnected according to microwave components, parametrization characterization is carried out to gold ribbon flexible interconnection form；
(4) according to microwave components work requirements and operating condition, microwave components gold ribbon flexible interconnection operating condition and environment temperature are determined
Load；
(5) according to gold ribbon flexible interconnection geometric parameter, thermal physical property parameter, morphological parameters characterization and work in determining microwave components
Make environmental condition, establishes gold ribbon flexible interconnection structure-thermal deformation analysis model；
(6) flexible mutually using Ansys analysis and solution gold ribbon according to gold ribbon flexible interconnection structure-thermal deformation analysis model of foundation
Join morphological parameters heat distortion amount；
(7) according to interconnection geometry and physical parameter, morphological parameters characterization and electromagnetic transmission parameter, foundation is with Deformation Parameters
Gold ribbon flexible interconnection structure-emi analysis model of variable regulation parameter；
(8) according to gold ribbon flexible interconnection morphological parameters in microwave components and electric property assessment index, factor, level is determined and is referred to
Mark designs the orthogonal test of gold ribbon flexible interconnection form Deformation Parameters and electrical performance indexes；
(9) according to orthogonal experiments variance analysis, gold ribbon flexible interconnection morphological parameters heat affecting degree is calculated；
(10) it according to gold ribbon flexible interconnection morphological parameters heat affecting degree, determines gold ribbon flexible interconnection form thermal sensitive parameter and calculates shape
State parameter thermal sensitivity.
2. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 1 towards microwave components electrical property determines method,
It is characterized in that, in the step (1), determines that gold ribbon flexible interconnection geometric parameter includes: gold ribbon width B, gold ribbon thickness T, gold ribbon
Horizontal section length L1, half span P of gold ribbon, gold ribbon micro-strip bond length b4, gold ribbon be coaxially bonded angle θ, gold ribbon to dielectric substrate end
Distance b2, inner conductor length Lc, inner conductor diameter d1, inner conductor end to gold ribbon distance b3, drop g, dielectric length b1, absolutely
Edge media diameters d2, conductor strip length Lm, conductor bandwidth Wm, conductor tape thickness H1, dielectric substrate length Ls, dielectric substrate width
Ws, dielectric substrate thickness h2With module gap S；
Determine that electromagnetic property parameters include: dielectric substrate permittivity εs, dielectric substrate loss angle tangent θs, glass medium dielectric
Constant εgWith glass medium loss angle tangent θg；
The thermal physical property parameter includes: dielectric substrate, conductor band, gold ribbon, inner conductor and dielectric thermal physical property parameter；It is given an account of
Matter substrate, conductor band, gold ribbon, inner conductor and dielectric thermal physical property parameter include elastic modulus E, thermalexpansioncoefficientα and Poisson
Compare μ；
In the step (2), gold ribbon flexible interconnection electromagnetic transmission parameter includes: signal transmission frequencies f, echo damage in microwave components
Consume S11With insertion loss S21。
3. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 2 towards microwave components electrical property determines method,
It is characterized in that, step (3) carries out according to the following procedure:
Interconnection Form division is four areas, is respectively as follows: the same axle key of gold ribbon by (3a) according to gold ribbon flexible interconnection Morphometric analysis
Close area, gold ribbon micro-strip bonding region, left side nonbonding area and right side nonbonding area；Since gold ribbon flexible interconnection has symmetrical structure,
Therefore choosing left one side of something carries out parametrization characterization；
(3b) establishes cartesian cartesian coordinate system according to the left half of Morphometric analysis of gold ribbon flexible interconnection, flexible to gold ribbon mutual
Connection Form division is parabolic section and EF straightway under 5 sections: AB arc section, BC straightway, the upper parabolic section of CD, DE, is divided respectively
Section function characterization；Enable intermediate variable:
(3c) is 5 sections of progress piecewise functions to gold ribbon flexible interconnection Form division according to gold ribbon flexible interconnection Morphometric analysis
Characterization, wherein gold ribbon is coaxially bonded AB arc section characterization function are as follows:
Nonbonding area top BC straightway characterizes function on the left of gold ribbon are as follows:
Parabolic segment table levies function on nonbonding area CD on the left of gold ribbon are as follows:
Parabolic segment table levies function under nonbonding area DE on the left of gold ribbon are as follows:
Gold ribbon micro-strip bonding region EF straightway characterizes function are as follows:
4. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 1 towards microwave components electrical property determines method,
It is characterized in that, the step (4) determines microwave components gold ribbon flexible interconnection work item according to microwave components work requirements and operating condition
Part is extreme temperature, big temperature changing environment；When carrying out the application of heat analysis load, setting caloric impact temperature variation range is Tmin~
Tmax, temperature rate Tc, the high/low temperature peak holding time is tk, then temperature cycles period Cy are as follows:
When carrying out gold ribbon flexible interconnection structure-thermal deformation analysis, in order to traverse each temperature course, is applied to interconnection architecture 2 week
The temperature loading of phase.
5. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 1 towards microwave components electrical property determines method,
It is characterized in that, step (5) carries out according to the following procedure:
(5a) is according to microwave components gold ribbon flexible interconnection geometric parameter, physical parameter and the step (3) determined in step (1)
In to gold ribbon flexible interconnection form carry out parametrization characterize, gold ribbon flexible interconnection structure-thermal deformation is established in Ansys software
Analysis model；
The model that (5b) is established includes dielectric, inner conductor, gold ribbon, micro belt conductor and dielectric substrate；According to true in step 4
Fixed temperature loading carries out environmental load application to gold ribbon flexible interconnection structure.
6. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 1 towards microwave components electrical property determines method,
It is characterized in that, step (6) carries out according to the following procedure:
(6a) determines 6 major parameters for influencing gold ribbon flexible interconnection form are as follows: drop g, gold ribbon arrive according to the practical investigation of engineering
Dielectric substrate threshold value b2, inner conductor end to gold ribbon distance b3, gold ribbon micro-strip bond length b4, module gap S and gold ribbon are partly
Span P；
(6b) according to Ansys to gold ribbon flexible interconnection structure-thermal deformation analysis solving result, and provide parameter size thermal deformation increase
Added-time, heat distortion amount are positive value, and when parameter size thermal deformation reduces, heat distortion amount is negative value；Thereby determine that gold ribbon is soft in (6a)
Property interconnection morphological parameters thermal deformation are as follows:
Part=(gt,b2t,b3t,b4t,St,Pt), Part∈[parmin-par0,parmax-par0]
Wherein, PartExpression parameter heat distortion amount vector；gtFor drop heat distortion amount, b2tFor gold ribbon to dielectric substrate threshold value
Heat distortion amount, b3tIt is inner conductor end to gold ribbon apart from heat distortion amount, b4tFor gold ribbon micro-strip bond length heat distortion amount, StFor mould
Block gap heat distortion amount, PtFor half span heat distortion amount of gold ribbon；
Parmin=(gmin,(b2)min,(b3)min,(b4)min,Smin,Pmin) size minimum value vector after expression parameter thermal deformation；
Wherein, gminFor minimum value after drop thermal deformation, (b2)minFor minimum value after gold ribbon to dielectric substrate threshold value thermal deformation,
(b3)minFor inner conductor end to gold ribbon after thermal deformation minimum value, (b4)minFor after gold ribbon micro-strip bond length thermal deformation most
Small value, SminFor minimum value after the thermal deformation of module gap, PminFor minimum value after half span thermal deformation of gold ribbon；
Par0=(g0,b20,b30,b40,S0,P0) expression parameter initial vector；
Wherein, g0For drop initial value, b20For gold ribbon to dielectric substrate threshold value initial value, b30For inner conductor end to gold ribbon distance
Initial value, b40For gold ribbon micro-strip bond length initial value, S0For module gap initial value, P0For half span initial value of gold ribbon；
Parmax=(gmax,(b2)max,(b3)max,(b4)max,Smax,Pmax) dimensional maximums vector after expression parameter thermal deformation；
Wherein, gmaxFor maximum value after drop thermal deformation, (b2)maxFor maximum value after gold ribbon to dielectric substrate threshold value thermal deformation,
(b3)maxFor inner conductor end to gold ribbon after thermal deformation maximum value, (b4)maxFor after gold ribbon micro-strip bond length thermal deformation most
Big value, SmaxFor maximum value after the thermal deformation of module gap, PmaxFor maximum value after half span thermal deformation of gold ribbon；
(6c) is based on thermal deformation formula, determines gold ribbon interconnection morphological parameters size vector after thermal deformation are as follows:
Par=Par0+Part=(g0+gt,b20+b2t,b30+b3t,b40+b4t,S0+St,P0+Pt)。
7. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 1 towards microwave components electrical property determines method,
Be characterized in that, gold ribbon flexible interconnection structure-emi analysis model that the step (7) is established include dielectric, inner conductor,
Gold ribbon, micro belt conductor and dielectric substrate.
8. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 1 towards microwave components electrical property determines method,
It is characterized in that, step (8) carries out according to the following procedure:
The gold ribbon flexible interconnection form selection etc. of (8a) according to interconnection form Deformation Parameters and heat distortion amount, to thermal deformation is considered
6 factor of spacing, 7 horizontal values are as follows:
Wherein, (g0+gt)v1~(g0+gt)v77 horizontal values, (b are taken for drop20+b2t)v1~(b20+b2t)v7For gold ribbon to medium
Substrate end distance takes 7 horizontal values, (b30+b3t)v1~(b30+b3t)v77 number of levels are taken to gold ribbon distance for inner conductor end
Value, (b40+b4t)v1~(b40+b4t)v77 horizontal values, (S are taken for gold ribbon micro-strip bond length0+St)v1~(S0+St)v7For module
Gap takes 7 horizontal values, (P0+Pt)v1~(P0+Pt)v77 horizontal values are taken for half span of gold ribbon；
Factor level calculation formula in table are as follows:
In formula, m is number of levels；
(8b) determines gold ribbon flexible interconnection according to the microwave components gold ribbon flexible interconnection electromagnetic transmission parameter determined in step (2)
Electromagnetic transmission performance indicator is return loss and insertion loss: Ind=[S11 S21]；
(8c) designs 6 factor, 7 horizontal quadrature table L49(78), and combine 3 D electromagnetic full-wave simulation software analysis design gold ribbon flexible
Interconnect the orthogonal test of form Deformation Parameters and electrical performance indexes.
9. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 1 towards microwave components electrical property determines method,
It is characterized in that, step (9) carries out according to the following procedure:
(9a) calculates gold ribbon flexible interconnection morphological parameters and normalizes heat affecting degree according to orthogonal test the results of analysis of variance are as follows:
In above formula, FjCorrespond to that index is averaged the sum of squares of deviations and error is averaged the ratio of the sum of squares of deviations for j-th of parameter；
(9b) towards return loss S11 and insertion loss S21 comprehensive electrochemical properties index, calculates gold ribbon flexible interconnection form ginseng simultaneously
Number heat affecting degree are as follows:
In formula,For the gold ribbon flexible interconnection morphological parameters heat affecting degree towards return loss index S 11, EffS21For face
To the gold ribbon flexible interconnection morphological parameters heat affecting degree of insertion loss index S 21, w1And w2Respectively correspond to the power system of heat affecting degree
Number.
10. the gold ribbon flexible interconnection thermal sensitive parameter according to claim 1 towards microwave components electrical property determines method,
It is characterized in that, step (10) carries out according to the following procedure:
(10a) is according to parameter freedom degree fjWith error freedom degree fe, and F distribution and α quantile are combined, determine critical value Fα(fj,
fe), then calculate gold ribbon flexible interconnection morphological parameters normalization critical heat disturbance degree EffjαAre as follows:
(10b) towards return loss S11 and insertion loss S21 comprehensive electrochemical properties index, calculates gold ribbon flexible interconnection form simultaneously
Parameter critical heat disturbance degreeAre as follows:
In formula,For the gold ribbon flexible interconnection morphological parameters critical heat disturbance degree towards return loss index S 11,
For the gold ribbon flexible interconnection morphological parameters critical heat disturbance degree towards insertion loss index S 21；
(10c) normalizes heat affecting degree according to gold ribbon flexible interconnection morphological parametersAnd normalization critical heat disturbance degreeDetermine the decision criteria of gold ribbon flexible interconnection form thermal sensitive parameter are as follows:
(10d) combines thermal sensitive parameter decision criteria according to gold ribbon flexible interconnection morphological parameters heat affecting degree, determines interconnection form
Parameter normalization thermal sensitivity RSenjAre as follows:
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