CN111996405B - Method for preparing high-strength and high-conductivity copper alloy through metal injection molding - Google Patents
Method for preparing high-strength and high-conductivity copper alloy through metal injection molding Download PDFInfo
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- CN111996405B CN111996405B CN202010852636.4A CN202010852636A CN111996405B CN 111996405 B CN111996405 B CN 111996405B CN 202010852636 A CN202010852636 A CN 202010852636A CN 111996405 B CN111996405 B CN 111996405B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
- B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Abstract
The invention relates to a method for preparing a high-strength and high-conductivity copper alloy by metal injection molding, which comprises the following steps: s1, mixing powder: preparation of Al by internal oxidation2O3Dispersing copper powder to prepare pure copper powder, wherein Al2O3Al in dispersed copper powder2O3The content of (A) is 0.3% -1.2%; mixing pure copper powder with Al2O3Mechanically mixing the dispersed copper powder to obtain mixed powder, wherein the proportion of pure copper powder is 50-70%; s2, feeding: adding a plastic-based binder into the mixed powder for mixing, and granulating by using a granulator to prepare a feed; s3, injection: injecting the feedstock using a powder injection molding machine to form an injection billet; s4, catalytic degreasing: carrying out catalytic degreasing on the injection blank to obtain a degreased blank; s5, sintering: and sintering the degreased blank in a sintering furnace to obtain a sintered blank. The invention can prepare parts with complex shapes and improve Al2O3The problem that the dispersed copper powder is not compact during sintering is solved, and the heat conduction and electric conductivity are effectively improved.
Description
Technical Field
The invention relates to a method for preparing a high-strength and high-conductivity copper alloy by metal injection molding.
Background
Copper and copper alloys are widely used in the national industry due to their good mechanical and electrical properties and excellent thermal conductivity. The high-strength high-conductivity copper-based material is used as a structural functional material with excellent comprehensive performance, and is widely applied to large-scale integrated circuit lead frames, electric engineering switch contact bridges, high-pulse magnetic field conductors, resistance welding electrodes, high-power asynchronous traction motor rotors and the like. With the rapid development of the industry, the application of the high-strength and high-conductivity copper alloy is wider, and meanwhile, higher requirements on the high strength, high conductivity and heat conductivity of the copper alloy are provided. China starts to research high-strength and high-conductivity copper alloy later, and compared with developed countries, the level of production equipment and manufacturing technology has larger difference, and large-scale industrial production cannot be realized.
The preparation method of the high-strength high-conductivity copper-based material mainly comprises the following steps: alloying method and composite material method. The alloying method is to introduce one or more alloy elements, such as Fe, Cr, Ni, Ag, etc., into the copper matrix, and through fusion casting, plastic deformation and heat treatment, the comprehensive functions of solid solution strengthening, precipitation strengthening, fine grain strengthening and deformation strengthening are achieved. The composite material method usually adopts a powder metallurgy method, which comprises the working procedures of powder making, molding, deforming, sintering and the like, wherein fine, dispersed and high-strength ceramic particles are added into a copper matrix to serve as a reinforcing phase, the reinforcing phase mainly comprises hard phases such as oxides, carbides, borides, nitrides and the like, wherein Al is mainly researched2O3And (4) dispersion strengthening the copper. Due to the nanoscale Al2O3The alloy has the characteristics of high strength, high hardness, high conductivity, high softening temperature and the like.
At present, the alloying method and the composite material method for preparing the high-strength and high-conductivity copper material at home have the problems of complex process, long flow, high cost, poor performance stability and the like, and parts with complex shapes are not easy to prepare. And metal powder injection molding (MIM) is used as a near-net forming technology, has high material utilization rate, can greatly reduce the production cost, and is suitable for preparing products with complicated geometric shapes on a large scale. Because of the technological characteristics of MIM, the precipitates of the copper alloy grow up in the sintering and cooling processes, and plastic deformation does not occur in the production process of the product, so that the purposes of precipitation strengthening and deformation strengthening cannot be achieved, and therefore, the alloying method is not suitable for adopting the MIM process.
At present, Al2O3The industrial production method of the dispersion strengthening copper alloy is an internal oxidation method, which adopts an oxidant to oxidize Cu-Al alloy powder to obtain Al generated in situ2O3Granulating, and reducing the oxidized powder to obtain Al2O3If pressure is not applied during sintering, the density of the product is not high, and the electric conduction and heat conduction performance can hardly meet the requirements.
Disclosure of Invention
The invention aims to provide a method for preparing a high-strength and high-conductivity copper alloy by metal injection molding, which can prepare parts with complex shapes and improve Al2O3The dispersed copper powder is not compact, and the heat conduction and electric conductivity are effectively improved.
The technical scheme for realizing the purpose of the invention is as follows: the invention comprises the following steps:
s1, mixing powder: preparation of Al by internal oxidation2O3 Dispersing copper powder to prepare pure copper powder, wherein Al2O3Al in dispersed copper powder2O3The content of (A) is 0.3% -1.2%; mixing pure copper powder with Al2O3Mechanically mixing the dispersed copper powder to obtain mixed powder, wherein the proportion of pure copper powder is 50-70%;
s2, feeding: adding a plastic-based binder into the mixed powder for mixing, and granulating by using a granulator to prepare a feed;
s3, injection: injecting the feedstock using a powder injection molding machine to form an injection billet;
s4, catalytic degreasing: carrying out catalytic degreasing on the injection blank to obtain a degreased blank;
s5, sintering: and sintering the degreased blank in a sintering furnace to obtain a sintered blank.
Pure copper powder was prepared by the water atomization method in the above step S1.
The plastic-based binder comprises a main binder, a framework binder and an activator; the main binder is polyformaldehyde 70-90%, the skeleton binder 5-20% and the activator 1-5%.
The above step S3: and (3) performing injection molding on the feed under the conditions of 100-180 MPa of injection pressure and 180-200 ℃ of injection temperature by using a powder injection molding machine to obtain an injection blank.
The above step S4: carrying out catalytic degreasing by using oxalic acid to obtain a degreased blank; the catalytic temperature is 100-150 ℃, and the degreasing time t is more than or equal to (240+ 60H) min; where H is the maximum wall thickness of the complex part in mm.
The above step S5: introducing the degreased blank into a sintering furnace by H2Sintering to obtain a sintered blank, wherein the sintering temperature is between 900 and 1060 DEG CTime of heat preservation t>2h。
Particle size D of pure copper powder99≤30μm，Al2O3The particle size range of the dispersed copper powder is D99≤30μm。
The skeleton binder is one or more of HDPE, PP and PE, and the activating agent is one or more of polyethylene wax PW, stearic acid SA and antioxidant 1010.
The invention has the positive effects that: (1) through research, Al2O3The sintering activity of the dispersed copper powder is low, copper atoms can not effectively migrate, so that a blank can not be sintered compactly, which is also Al2O3The reason that the density of the product is not high is due to the fact that pressure is not applied during sintering of the copper-based composite material powder which is distributed in a dispersed manner; the invention utilizes the characteristic of high sintering activity of the pure copper powder to uniformly mix the dispersed copper and the pure copper powder, and the whole blank can realize densification by the physicochemical processes of diffusion, migration and the like of pure copper atoms in the sintering process, and meanwhile, Al can also realize the densification2O3Uniformly distributed in the whole blank body, thereby playing a role in strengthening.
(2) The copper powder prepared by the water atomization method has the advantages of fine granularity, high sintering activity and environment-friendly preparation process, and is the preferred preparation method.
Detailed Description
(example 1)
The invention comprises the following steps:
s1, mixing powder: preparation of Al by internal oxidation2O3 Dispersing copper powder, and preparing pure copper powder, wherein Al is contained in the pure copper powder by a water mist method2O3Al in dispersed copper powder2O3The content of (A) is 0.6%; mixing pure copper powder with Al2O3Mechanically mixing the dispersed copper powder according to the proportion of 1:1 to obtain mixed powder, wherein the pure copper powder and the Al2O3The particle size of the dispersed copper powder is D99=30μm；
S2, feeding: adding a plastic-based binder into the mixed powder for mixing, and granulating by using a granulator to prepare a feed; wherein the plastic-based binder comprises a main binder, a skeleton binder and an activator; the main binder is polyformaldehyde accounting for 90%, the framework binder is PE accounting for 6%, and the activating agent is polyethylene wax PW, stearic acid SA and antioxidant 1010 accounting for 4%.
S3, injection: using a powder injection molding machine to perform injection molding on the feed under the conditions of 140MPa injection pressure and 200 ℃ injection temperature to obtain an injection blank;
s4, catalytic degreasing: carrying out catalytic degreasing on the injection blank by using oxalic acid to obtain a degreased blank; the catalytic temperature is 130 ℃, and the degreasing time is 450 min;
s5, sintering: introducing the degreased blank into a sintering furnace by H2Sintering to obtain a sintered blank, wherein the sintering temperature is 960 ℃, and the heat preservation time is 2 hours.
The sintered compact prepared in this example had a density of 8.7g/cm 3; the yield strength is 364 MPa; the elongation is 15%; the thermal conductivity is 343W/mk; the conductivity was 80% IACS.
(example 2)
The invention comprises the following steps:
s1, mixing powder: preparation of Al by internal oxidation2O3 Dispersed copper powder, preparing pure copper powder by electrolysis method, wherein Al2O3Al in dispersed copper powder2O3The content of (A) is 0.8%; al (B) is2O3Mechanically mixing the dispersed copper powder and the pure copper powder according to the proportion of 1:1.5 to obtain mixed powder, wherein the pure copper powder and the Al powder2O3The particle size of the dispersed copper powder is D99=30μm；
S2, feeding: adding a plastic-based binder into the mixed powder for mixing, and granulating by using a granulator to prepare a feed; wherein the plastic-based binder comprises a main binder, a skeleton binder and an activator; the main binder is polyformaldehyde accounting for 80%, the skeleton binder accounts for 15% of PP, and the activator comprises polyethylene wax PW and stearic acid SA accounting for 5%.
S3, injection: using a powder injection molding machine to perform injection molding on the feed under the conditions of 150MPa injection pressure and 190 ℃ injection temperature to obtain an injection blank;
s4, catalytic degreasing: carrying out catalytic degreasing on the injection blank by using oxalic acid to obtain a degreased blank; the catalytic temperature is 110 ℃, and the degreasing time is 450 min;
s5, sintering: will get rid ofIntroducing the grease blank into a sintering furnace through H2Sintering to obtain a sintered blank, wherein the sintering temperature is 950 ℃, and the heat preservation time is 3 hours.
The density of the dispersion-strengthened copper sintered compact prepared in this example was 8.8g/cm 3; the yield strength is 335 MPa; the elongation is 18 percent; the thermal conductivity is 360W/mk; the conductivity was 85% IACS.
(example 3)
The invention comprises the following steps:
s1, mixing powder: preparation of Al by internal oxidation2O3 Dispersed copper powder, pure copper powder prepared by oxidation-reduction method, wherein Al2O3Al in dispersed copper powder2O3The content of (A) is 1.0%; al (B) is2O3Mechanically mixing the dispersed copper powder and the pure copper powder according to the proportion of 1:1.5 to obtain mixed powder, wherein the pure copper powder and the Al powder2O3The particle size of the dispersed copper powder is D99=24μm；
S2, feeding: adding a plastic-based binder into the mixed powder for mixing, and granulating by using a granulator to prepare a feed; wherein the plastic-based binder comprises a main binder, a skeleton binder and an activator; the main binder is polyformaldehyde accounting for 85%, the skeleton binder is PP accounting for 10%, and the activating agent comprises polyethylene wax PW, stearic acid SA and antioxidant 1010 accounting for 5%.
S3, injection: using a powder injection molding machine to perform injection molding on the feed under the conditions of 160MPa injection pressure and 195 ℃ injection temperature to obtain an injection blank;
s4, catalytic degreasing: carrying out catalytic degreasing on the injection blank by using oxalic acid to obtain a degreased blank; the catalytic temperature is 120 ℃, and the degreasing time is 470 min;
s5, sintering: introducing the degreased blank into a sintering furnace by H2Sintering to obtain a sintered blank, wherein the sintering temperature is 950 ℃, and the heat preservation time is 3 hours.
The density of the dispersion-strengthened copper sintered compact prepared in this example was 8.76g/cm3(ii) a The yield strength is 339 MPa; the elongation is 17%; the thermal conductivity is 355W/mk; the conductivity was 83% IACS.
(example 4)
The invention comprises the following steps:
s1, mixing powder: preparation of Al by internal oxidation2O3 Dispersing copper powder, and preparing pure copper powder, wherein Al is contained in the pure copper powder by a water mist method2O3Al in dispersed copper powder2O3The content of (A) is 1.2%; al (B) is2O3Mechanically mixing the dispersed copper powder and the pure copper powder according to the proportion of 1:1 to obtain mixed powder, wherein the pure copper powder and the Al powder2O3The particle size of the dispersed copper powder is D99=20μm；
S2, feeding: adding a plastic-based binder into the mixed powder for mixing, and granulating by using a granulator to prepare a feed; wherein the plastic-based binder comprises a main binder, a skeleton binder and an activator; the main binder is polyformaldehyde accounting for 86%, the framework binder is HDPE accounting for 9%, and the activating agent comprises polyethylene wax PW, stearic acid SA, an antioxidant 1010 and the like accounting for 5%.
S3, injection: using a powder injection molding machine to perform injection molding on the feed under the conditions of injection pressure of 155MPa and injection temperature of 195 ℃ to obtain an injection blank;
s4, catalytic degreasing: carrying out catalytic degreasing on the injection blank by using oxalic acid to obtain a degreased blank; the catalytic temperature is 110 ℃, and the degreasing time is 460 min;
s5, sintering: introducing the degreased blank into a sintering furnace by H2Sintering to obtain a sintered blank, wherein the sintering temperature is 960 ℃, and the heat preservation time is 2.5 h.
The density of the dispersion-strengthened copper sintered compact prepared in this example was 8.7g/cm3(ii) a The yield strength is 345 MPa; the elongation is 14 percent; the thermal conductivity is 331W/mk; the conductivity was 77% IACS.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A method for preparing high-strength high-conductivity copper alloy by metal injection molding; the method is characterized by comprising the following steps:
s1, mixing powder: preparation of Al by internal oxidation2O3 Dispersing copper powder to prepare pure copper powder, wherein Al2O3Al in dispersed copper powder2O3The content of (A) is 0.3% -1.2%; mixing pure copper powder with Al2O3The mixed powder is obtained by mechanically mixing the dispersed copper powder, wherein the proportion of the pure copper powder is 50-70 percent, and the granularity D of the pure copper powder99≤30μm，Al2O3The particle size range of the dispersed copper powder is D99≤30μm；
S2, feeding: adding a plastic-based binder into the mixed powder for mixing, and granulating by using a granulator to prepare a feed;
s3, injection: injecting the feed material into a powder injection molding machine under the conditions of injection pressure of 100-180 MPa and injection temperature of 180-200 ℃ to obtain an injection blank;
s4, catalytic degreasing: carrying out catalytic degreasing by using oxalic acid to obtain a degreased blank; the catalytic temperature is 100-150 ℃, and the degreasing time t is more than or equal to (240+ 60H) min; wherein H is the maximum wall thickness of the complex part, and the unit is mm;
s5, sintering: introducing the degreased blank into a sintering furnace by H2Sintering to obtain a sintered blank, wherein the sintering temperature is between 900 and 1060 ℃, and the heat preservation time t is>2h。
2. The method for preparing the high-strength and high-conductivity copper alloy by metal injection molding according to claim 1, wherein the method comprises the following steps: in the step S1, pure copper powder is prepared by a water atomization method, an electrolysis method or a redox method.
3. The method for preparing the high-strength and high-conductivity copper alloy by metal injection molding according to claim 1, wherein the method comprises the following steps: the plastic-based binder comprises a main binder, a framework binder and an activator; the main binder is polyformaldehyde 70-90%, the skeleton binder 5-20% and the activator 1-5%.
4. The method for preparing the high-strength and high-conductivity copper alloy by metal injection molding according to claim 3, wherein the method comprises the following steps: the skeleton binder is one or more of HDPE, PP and PE, and the activating agent is one or more of polyethylene wax PW, stearic acid SA and antioxidant 1010.
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| CN112719297B (en) * | 2021-03-31 | 2021-06-29 | 陕西斯瑞新材料股份有限公司 | Method for 3D printing of high-density dispersion-strengthened copper part |
| CN115044793B (en) * | 2022-06-16 | 2023-09-08 | 江苏精研科技股份有限公司 | Manufacturing method for preparing two-phase high-entropy alloy by powder injection molding |
| CN116504742B (en) * | 2023-06-21 | 2023-12-08 | 青岛泰睿思微电子有限公司 | Frame for semiconductor package, method for manufacturing the same, and method for packaging the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08109422A (en) * | 1994-10-11 | 1996-04-30 | Yazaki Corp | Production of alumina dispersion strengthened copper |
| CN101250639A (en) * | 2008-03-27 | 2008-08-27 | 哈尔滨工业大学深圳研究生院 | Novel nanometer phase dispersion strengthening cuprum as well as preparation method and product producing technique thereof |
| CN106141192A (en) * | 2015-07-24 | 2016-11-23 | 洛阳新巨能高热技术有限公司 | A kind of copper alloy element manufacture method |
| CN106552942A (en) * | 2017-02-06 | 2017-04-05 | 深圳市卡德姆科技有限公司 | A kind of method of the modeling based binder and injection moulding copper and copper alloy parts for copper and copper alloy injection moulding |
| DE102018101391A1 (en) * | 2017-01-26 | 2018-07-26 | Cep-Compound Extrusion Products Gmbh | Process for the preparation of a dispersion strengthened copper material and dispersion strengthened copper material |
| CN111172422A (en) * | 2020-01-21 | 2020-05-19 | 中国兵器科学研究院宁波分院 | Preparation method of aluminum oxide dispersion strengthening copper-based composite material |
-
2020
- 2020-08-22 CN CN202010852636.4A patent/CN111996405B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08109422A (en) * | 1994-10-11 | 1996-04-30 | Yazaki Corp | Production of alumina dispersion strengthened copper |
| CN101250639A (en) * | 2008-03-27 | 2008-08-27 | 哈尔滨工业大学深圳研究生院 | Novel nanometer phase dispersion strengthening cuprum as well as preparation method and product producing technique thereof |
| CN106141192A (en) * | 2015-07-24 | 2016-11-23 | 洛阳新巨能高热技术有限公司 | A kind of copper alloy element manufacture method |
| DE102018101391A1 (en) * | 2017-01-26 | 2018-07-26 | Cep-Compound Extrusion Products Gmbh | Process for the preparation of a dispersion strengthened copper material and dispersion strengthened copper material |
| CN106552942A (en) * | 2017-02-06 | 2017-04-05 | 深圳市卡德姆科技有限公司 | A kind of method of the modeling based binder and injection moulding copper and copper alloy parts for copper and copper alloy injection moulding |
| CN111172422A (en) * | 2020-01-21 | 2020-05-19 | 中国兵器科学研究院宁波分院 | Preparation method of aluminum oxide dispersion strengthening copper-based composite material |
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