CN206595252U - A kind of SOT26 lead frames - Google Patents
A kind of SOT26 lead frames Download PDFInfo
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- CN206595252U CN206595252U CN201720277476.9U CN201720277476U CN206595252U CN 206595252 U CN206595252 U CN 206595252U CN 201720277476 U CN201720277476 U CN 201720277476U CN 206595252 U CN206595252 U CN 206595252U
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- chip
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- sot26
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Abstract
The utility model is related to a kind of semiconductor fabrication techniques, specifically related to a kind of SOT26 lead frames, include the framework of the rectangle for taking up chip, multiple chip installation portions being adapted with SOT26 packing forms are provided with said frame, being correspondingly arranged on 6 with each chip installation portion on framework is used for the pin mounting groove of welding chip pin, wherein 3 pin mounting grooves set the same side of chip installation portion, and 3 pin mounting grooves are symmetricly set in the opposite side of chip installation portion in addition；Provided with conductive Auxiliary support platform on chip installation portion, 3 chip installation portions are that a row constitutes a chip mount unit, and anticollision extension is additionally provided with each chip mount unit edge.The lead frame structure is rationally distributed, beneficial to stock utilization is improved, the setting of conductive Auxiliary support platform ensures the conductive qualities of chip, and in the anticollision extension of chip mount unit edge setting, make chip assemble and split phase to be independent of each other, and chip damage can be reduced.
Description
This case require that the Chinese utility model patent submitted on March 21st, 2016, Application No.：201620214676.5
Priority.
Technical field
The utility model is related to a kind of semiconductor fabrication, particularly a kind of SOT26 lead frames.
Background technology
The major function of lead frame is the carrier that mechanical support is provided for chip, as connecting chip inside and outside conducting medium
Circuit and form pathway for electrical signals, and the heat produced when together outwards distributing chip operation with package casing constitutes radiating logical
Road, it is a kind of electrical connection that chip internal circuits exit and outer lead are realized by means of bonding gold wire, is formed and electrically returned
It is required for using lead frame in the key structure part on road, most semiconductor integrated blocks, is weight in electronics and information industry
The basic material wanted.Chip package form is SOT26（SOT is the chip packaging unit model of miniature electric component, and 26 represent
The pin of one single chip is 6 after encapsulation, wherein the pin positioned at one single chip encapsulation part both sides is 3, and after encapsulation
One single chip encapsulation part is cube-shaped structure, and its size is long 2.9mm, width 1.6mm, high 0.96mm）, how in identical size
Framework on reasonable Arrangement packing forms be SOT26 chip, with more reasonably using framework matrix, obtain more rational material
Expect that utilization rate turns into urgent problem.
On the other hand, present lead frame structure is after encapsulation chip, the separation structure between adjacent chips installation portion
Do not consider interference and the segmentation problem of adjacent chips, chip damage is easily caused when segmentation or assembling chip；And existing chip peace
The structure in dress portion prevents the conductive qualities of chip from meeting chip use demand for a long time, it is necessary to further design framework structure.
Utility model content
Goal of the invention of the present utility model is：There is frame base profit for existing SOT26 chip lead frames product
It is not high with rate, frame structure it cannot be guaranteed that chip install after conductive qualities, and adjacent chips are easily damaged in separation and assembling
The problem of hindering is there is provided a kind of SOT26 lead frames, and the lead frame structure is rationally distributed, conductive beneficial to stock utilization is improved
The setting of Auxiliary support platform ensures the conductive qualities of chip, and in the anticollision extension of chip mount unit edge setting, makes core
Piece is assembled and segmentation phase is independent of each other, and can reduce chip damage.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of SOT26 lead frames, including for the framework for the rectangle for taking up chip, be provided with said frame multiple
The chip installation portion being adapted with SOT26 packing forms, 6 are correspondingly arranged on for welding on framework with each chip installation portion
The pin mounting groove of chip pin is connect, wherein 3 pin mounting grooves set the same side of chip installation portion, 3 pins are pacified in addition
Tankage is symmetricly set in the opposite side of chip installation portion；Provided with conductive Auxiliary support platform on chip installation portion, 3 chips are installed
Portion is that a row constitutes a chip mount unit, and anticollision extension is additionally provided with each chip mount unit edge.
The lead frame sets multiple chip installation portions being adapted with SOT26 packing forms, and set on framework with
6 adaptable pin mounting grooves of chip installation portion, by the way that the side of 3 pin mounting grooves toward chip installation portions therein is prolonged
Stretch, 3 pin mounting grooves are symmetricly set in the opposite side of chip installation portion in addition so that the pin of chip can uniformly divide when installing
The both sides of chip installation portion are distributed in, the both sides space of pin mounting groove thus rationally can not be set using chip installation portion, suitably
Shorten the spacing of chip installation portion, arrange more chip installation portions, beneficial to the stock utilization for improving framework；
And the conductive Auxiliary support platform set on chip installation portion can guarantee that the conductive qualities after chip installation, core is improved
The electric conductivity of piece；3 chip installation portions are constituted after a chip mount unit, the setting at chip mount unit edge is prevented
Extension is hit, it is mutually unaffected when the chip on adjacent chips installation unit is assembled and is split, reduce chip damage.
As preferred scheme of the present utility model, the chip installation portion is the rectangular configuration being adapted with chip form,
Chip mount unit is also rectangle, and the long of chip installation portion be arranged in parallel in long with chip mount unit, the chip peace
The long of dress unit is arranged in parallel in long with framework.Chip installation portion and chip mount unit are designed to rectangle, can be with
The structure of chip is adapted, and is easy to chip to install, and the length by the long side of chip installation portion and chip mount unit with framework
Side is arranged in parallel, and is arranged beneficial to regular chip mount unit on framework, can arrange more chip installation portions, improves material
Expect utilization rate.
As preferred scheme of the present utility model, the long side direction of the pin mounting groove toward chip mount unit extends,
The anticollision extension is arranged on the short brink of chip mount unit, and is all provided with two short brinks of each chip mount unit
There is anticollision extension.Pin mounting groove is extended toward chip mount unit long side direction, and anticollision extension is arranged on chip
The short brink of installation unit, both are staggeredly arranged, are independent of each other, and the chip damage of adjacent chips installation unit are reduced, beneficial to conjunction
Reason improves frame material utilization rate using the clearance space between chip mount unit.
As preferred scheme of the present utility model, polarity is additionally provided with chip installation portion and separates supporting table, when chip peace
After on chip installation portion, both positive and negative polarity split pole conductive structure is formed.The polarity of particular design separates supporting table, the shape on framework
Into the conductive structure of both positive and negative polarity split pole, it is ensured that the conductive qualities of chip.
As preferred scheme of the present utility model, separate supporting table provided with two polarity on chip installation portion, respectively cloth
It is disposed adjacent to the position of two short sides of chip installation portion.Two polarity are set to separate supporting table on each chip installation portion,
And be provided in close to the both sides of its short side, that is, it is oppositely arranged, installs and support beneficial to the balance to chip.
As preferred scheme of the present utility model, conductive auxiliary branch is additionally provided with the framework close to chip installation portion short side
Platform is supportted, the conductive Auxiliary support platform separates supporting table with polarity and is correspondingly arranged, and separating supporting table both sides in each polarity is all provided with
It is equipped with conductive Auxiliary support platform.Separate supporting table two ends in polarity and conductive supporting platform is set respectively, be further ensured that conductive effect
With split pole conductive qualities.
As preferred scheme of the present utility model, middle part balanced support platform, the middle part are additionally provided with chip installation portion
Balanced support platform is positioned close to the position of chip installation portion long side edge.Set flat in the position that minister side is installed close to chip
Weigh supporting table, the support for chip medium position, it is ensured that chip installation quality.
As preferred scheme of the present utility model, the size of the chip mount unit is long 10.9 ± 0.01mm, wide by 4.2
± 0.01mm, the size of the framework is long 300 ± 0.01mm, wide 93 ± 0.01mm, and 24 row, 18 row's cores are disposed with framework
Piece installation unit.Chip mount unit arranges 24 row, 18 rows on framework, because the size of chip mount unit is length
10.9mm, width 4.2mm, 10.9*24=261.6mm, 4.2*18=75.6mm, less than the length and width size of framework, fully meet arrangement
Demand, the quantity of the one single chip installation portion so obtained is：24*18*3=1296, you can arrange 1296 cores on the frame
Piece, greatly improves the utilization rate of framework.
As preferred scheme of the present utility model, unit separation trough or envelope are provided between the column and the column in chip mount unit
Fill positioning hole.It is to need setting unit separation trough and encapsulation positioning hole between the column and the column in chip mount unit for existing scheme
Two kinds of structures, are now changed to be arranged at intervals, save frame size, can be used for many arrangement chip installation portions, increase operation rate.
As preferred scheme of the present utility model, the size between two adjacent chip mount units is：It is long along framework
The distance in degree direction is 1.6 ± 0.01mm, is 0.5 ± 0.01mm along the distance in frame width direction.
As preferred scheme of the present utility model, the size on the chip mount unit of close frame edge and the side of framework
For：Distance with framework short side is 0.6 ± 0.01mm, and the distance with the long side of framework is 2.4-3.2mm.
In summary, by adopting the above-described technical solution, the beneficial effects of the utility model are：
1st, the lead frame structure is rationally distributed, and beneficial to stock utilization is improved, the setting of conductive Auxiliary support platform ensures
The conductive qualities of chip, and the anticollision extension set at chip mount unit edge, when chip is assembled and is split mutually not
Influence, and chip damage can be reduced；
2nd, pin mounting groove is extended toward chip mount unit long side direction, and anticollision extension is arranged on chip and installed
The short brink of unit, both are staggeredly arranged, are independent of each other, and the chip damage of adjacent chips installation unit are reduced, beneficial to reasonable profit
With the clearance space between chip mount unit, frame material utilization rate is improved；
3rd, the polarity of particular design separates supporting table, the conductive structure of both positive and negative polarity split pole is formed on framework, it is ensured that chip
Conductive qualities；Separate supporting table two ends in polarity and conductive supporting platform is set respectively, be further ensured that conductive effect and split pole are led
Electricity quality；
4th, balanced support platform is set in the position that minister side is installed close to chip, for the support of chip medium position, protected
Demonstrate,prove chip installation quality.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model SOT26 chi frames.
Fig. 2 is A portions partial enlarged drawing in Fig. 1.
Fig. 3 is B portions partial enlarged drawing in Fig. 2.
Fig. 4 is D portions partial enlarged drawing in Fig. 3.
Marked in figure：1- frameworks, 101- unit slot segmentations, 102- encapsulation positioning holes, 2- chip mount units, 201- chips
Installation portion, 202- pin mounting grooves, 203- polarity separates balanced support platform in the middle part of supporting table, 204- anticollisions extension, 205-,
206- conduction Auxiliary support platforms.
Embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only to explain this
Utility model, is not used to limit the utility model.
Embodiment 1
As shown in Figures 1 to 4, the SOT26 lead frames of the present embodiment, including for the framework 1 for the rectangle for taking up chip,
Multiple chip installation portions 201 being adapted with SOT26 packing forms are provided with the framework 1, with each core on framework 1
Piece installation portion 201, which is correspondingly arranged on 6, is used for the pin mounting groove 202 of welding chip pin, wherein 3 pin mounting grooves 202
The same side of chip installation portion 201 is set, and 3 pin mounting grooves 202 are symmetricly set in the another of chip installation portion 201 in addition
Side；On chip installation portion 201 chip is constituted provided with 206,3 chip installation portions 201 of conductive Auxiliary support platform for a row
Installation unit 2, anticollision extension 204 is additionally provided with each edge of chip mount unit 2.
Further, the chip installation portion 201 is the rectangular configuration being adapted with chip form, chip mount unit 2
Also it is rectangle, the long of chip installation portion 201 be arranged in parallel in long with chip mount unit 2, the chip mount unit 2
It is long to be arranged in parallel in long with framework 1.Chip installation portion and chip mount unit are designed to rectangle, knot that can be with chip
Structure is adapted, and is easy to chip to install, and by the long parallel cloth in long with framework of chip installation portion and chip mount unit
Put, arranged beneficial to regular chip mount unit on framework, more chip installation portions can be arranged, improve material use
Rate.
In the present embodiment, the long side direction of the pin mounting groove 202 toward chip mount unit 2 extends, and the anticollision is prolonged
Stretch the short brink that section 204 is arranged on chip mount unit 2, and each chip mount unit 2 two short brinks be equipped with it is anti-
Hit extension 204.Pin mounting groove is extended toward chip mount unit long side direction, and anticollision extension is arranged on chip peace
The short brink of unit is filled, both are staggeredly arranged, are independent of each other, the chip damage of adjacent chips installation unit is reduced, beneficial to reasonable
Using the clearance space between chip mount unit, frame material utilization rate is improved.
In summary, the lead frame of the present embodiment sets multiple chip installation portions being adapted with SOT26 packing forms,
And 6 pin mounting grooves being adapted with chip installation portion are set on framework, by by 3 pin mounting grooves therein toward core
The side extension of piece installation portion, in addition 3 pin mounting grooves are symmetricly set in the opposite side of chip installation portion so that chip draws
Pin can be uniformly distributed in the both sides of chip installation portion when installing, and thus rationally can not set pin mounting groove using chip installation portion
Both sides space, the appropriate spacing for shortening chip installation portion arranges more chip installation portions, beneficial to the material profit for improving framework
With rate；
And the conductive Auxiliary support platform set on chip installation portion can guarantee that the conductive qualities after chip installation, core is improved
The electric conductivity of piece；3 chip installation portions are constituted after a chip mount unit, the setting at chip mount unit edge is prevented
Extension is hit, it is mutually unaffected when the chip on adjacent chips installation unit is assembled and is split, reduce chip damage.
Embodiment 2
As shown in Figures 1 to 4, the SOT26 lead frames according to embodiment 1, the present embodiment is in chip installation portion 201
On be additionally provided with polarity and separate supporting table 203, after chip is arranged on chip installation portion 201, form both positive and negative polarity split pole conduction knot
Structure.The polarity of particular design separates supporting table, the conductive structure of both positive and negative polarity split pole is formed on framework, it is ensured that the conductive matter of chip
Amount.
In the present embodiment, separate supporting tables 203 provided with two polarity on each chip installation portion 201, be respectively arranged in
Close to the position of two short sides of chip installation portion 201.Two polarity are set to separate supporting table on each chip installation portion, and
It is provided in close to the both sides of its short side, that is, is oppositely arranged, installs and support beneficial to the balance to chip.
Further, as shown in figure 3, being additionally provided with conductive Auxiliary support on the framework 1 close to the short side of chip installation portion 201
Platform 206, the conductive Auxiliary support platform 206 separates supporting table 203 with polarity and is correspondingly arranged, and separates supporting table in each polarity
203 both sides are provided with conductive Auxiliary support platform 206.Separate supporting table two ends in polarity and conductive supporting platform is set respectively, enter one
Step ensures conductive effect and split pole conductive qualities.
Further, middle part balanced support platform 205, the middle part balanced support are additionally provided with chip installation portion 201
Platform 205 is positioned close to the position of the long side edge of chip installation portion 201.In the position that minister side is installed close to chip, balance is set
Supporting table, the support for chip medium position, it is ensured that chip installation quality.
In the present embodiment, the size of the chip mount unit 2 is long 10.9mm, width 4.2mm, the size of the framework 1
For long 300mm, width 93mm, 24 row, 18 row's chip mount units 2 are disposed with framework 1.Chip mount unit cloth on framework
Put 24 row, 18 rows, due to chip mount unit size for long 10.9mm, width 4.2mm, 10.9*24=261.6mm, 4.2*18=
75.6mm, less than the length and width size of framework, fully meets arrangement demand, and the quantity of the one single chip installation portion so obtained is：
24*18*3=1296, you can arrange 1296 chips on the frame, greatly improve the utilization rate of framework.
Further, in chip mount unit 2 between the column and the column provided with unit separation trough 101 or encapsulation positioning hole 102,
The unit separation trough 101 and encapsulation positioning hole 102 of the present embodiment are disposed between chip mount unit 2.For existing side
Case is to need setting unit separation trough and encapsulation two kinds of structures of positioning hole between the column and the column in chip mount unit, is now changed to interval
Set, save frame size, many arrangement chip installation portions can be used for, increased operation rate.
In the present embodiment, the size between two adjacent chip mount units 2 is：Along the distance of the length direction of framework 1
It is 0.5mm for 1.6mm, along the distance of the width of framework 1.
Further, the chip mount unit 2 and the size on the side of framework 1 close to the edge of framework 1 are：With framework short side
Distance is 0.6mm, and the distance with the long side of framework is 2.8mm.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Any modifications, equivalent substitutions and improvements made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. a kind of SOT26 lead frames, including for the framework for the rectangle for taking up chip, it is characterised in that on said frame
Multiple chip installation portions being adapted with SOT26 packing forms are provided with, are correspondingly arranged on framework with each chip installation portion
There are 6 to be used for the pin mounting groove of welding chip pin, wherein 3 pin mounting grooves set the same side of chip installation portion, separately
Outer 3 pin mounting grooves are symmetricly set in the opposite side of chip installation portion；Provided with conductive Auxiliary support platform on chip installation portion,
3 chip installation portions are that a row constitutes a chip mount unit, and anticollision extension is additionally provided with each chip mount unit edge
Section.
2. SOT26 lead frames according to claim 1, it is characterised in that the chip installation portion is and chip form
Adaptable rectangular configuration, chip mount unit is also rectangle, and the long of chip installation portion is put down in long with chip mount unit
Row is set, and the long of the chip mount unit is arranged in parallel in long with framework.
3. SOT26 lead frames according to claim 2, it is characterised in that the pin mounting groove installs single toward chip
The long side direction extension of member, the anticollision extension is arranged on the short brink of chip mount unit, and installs single in each chip
Two short brinks of member are equipped with anticollision extension.
4. SOT26 lead frames according to claim 2, it is characterised in that polarity point is additionally provided with chip installation portion
Every supporting table, after chip is arranged on chip installation portion, both positive and negative polarity split pole conductive structure is formed.
5. SOT26 lead frames according to claim 4, it is characterised in that two are provided with each chip installation portion
Polarity separates supporting table, is respectively arranged in the position of two short sides close to chip installation portion.
6. SOT26 lead frames according to claim 5, it is characterised in that in the framework close to chip installation portion short side
On be additionally provided with conductive Auxiliary support platform, the conductive Auxiliary support platform separates supporting table with polarity and is correspondingly arranged, in each polarity
Separate supporting table both sides and be provided with conductive Auxiliary support platform.
7. SOT26 lead frames according to claim 2, it is characterised in that middle part is additionally provided with chip installation portion flat
Weigh supporting table, and the middle part balanced support platform is positioned close to the position of chip installation portion long side edge.
8. the SOT26 lead frames according to one of claim 1-7, it is characterised in that the chi of the chip mount unit
It is very little that to grow 10.9 ± 0.01mm, wide 4.2 ± 0.01mm, the size of the framework is to grow 300 ± 0.01mm, wide 93 ± 0.01mm,
24 row, 18 row's chip mount units are disposed with framework.
9. SOT26 lead frames according to claim 8, it is characterised in that in chip mount unit between the column and the column
Provided with unit separation trough or encapsulation positioning hole, the unit separation trough and encapsulation positioning hole be disposed on chip mount unit it
Between.
10. SOT26 lead frames according to claim 8, it is characterised in that between two adjacent chip mount units
Size be：It is 1.6 ± 0.01mm, is 0.5 ± 0.01mm along the distance in frame width direction along the distance in lengths of frame direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2016202146765 | 2016-03-21 | ||
| CN201620214676 | 2016-03-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206595252U true CN206595252U (en) | 2017-10-27 |
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ID=60124782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720277476.9U Active CN206595252U (en) | 2016-03-21 | 2017-03-21 | A kind of SOT26 lead frames |
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| Country | Link |
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| CN (1) | CN206595252U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199943A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | Lead frame and lead frame piles up with supporting positioner thereof |
-
2017
- 2017-03-21 CN CN201720277476.9U patent/CN206595252U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199943A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | Lead frame and lead frame piles up with supporting positioner thereof |
| CN111199943B (en) * | 2018-11-16 | 2021-11-12 | 泰州友润电子科技股份有限公司 | Lead frame and lead frame piles up with supporting positioner thereof |
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