CN111957976A - Method for manufacturing composite board - Google Patents
Method for manufacturing composite board Download PDFInfo
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- CN111957976A CN111957976A CN202010641255.1A CN202010641255A CN111957976A CN 111957976 A CN111957976 A CN 111957976A CN 202010641255 A CN202010641255 A CN 202010641255A CN 111957976 A CN111957976 A CN 111957976A
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- metal powder
- polytetrafluoroethylene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
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Abstract
The invention discloses a manufacturing method of a composite board, which comprises the following steps: putting a polytetrafluoroethylene material into a hot pressing device, and paving a layer of metal powder on the polytetrafluoroethylene material; the hot-pressing device carries out hot pressing in at least one direction so as to enable the metal powder to be embedded into the polytetrafluoroethylene material and fused to form a composite board; and grinding the composite plate to expose the surface of the metal powder layer of the composite plate. And grinding the surface of the composite plate by adopting a grinding mode to ensure that the metal powder layer can be exposed on the surface of the polytetrafluoroethylene material and the conductive path can be exposed on the surface of the polytetrafluoroethylene material.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a method for manufacturing a composite board, in particular to a method for manufacturing the composite board by hot pressing polytetrafluoroethylene and metal powder.
[ background of the invention ]
Polytetrafluoroethylene (PTFE) is commonly called teflon, and is widely used in the printed circuit board industry due to the characteristics of small dielectric constant, small dielectric loss and high breakdown voltage. However, the surface energy of the ptfe material is very low, and the ptfe material is not easily bonded to a metal material, so that it is difficult to form a metal layer on the ptfe material for transmitting electrical signals.
The combination mode that usually adopts between polytetrafluoroethylene material and the metal material at present is: roughening the surfaces of the polytetrafluoroethylene plate and the metal plate respectively to form a plurality of concave-convex parts on the surfaces of the polytetrafluoroethylene plate and the metal plate so as to increase the roughness of the surfaces of the polytetrafluoroethylene plate and the metal plate, arranging the roughened surfaces of the polytetrafluoroethylene plate and the roughened surfaces of the metal plate opposite to each other, and finally pressing the roughened surfaces of the polytetrafluoroethylene plate and the roughened surfaces of the metal plate together under the conditions of vacuum, heating and pressurizing to form the polytetrafluoroethylene and metal composite plate. However, since the polytetrafluoroethylene plate and the metal plate need to be roughened respectively, the treatment method is complicated, and the recesses on the roughened surface of the polytetrafluoroethylene plate and the protrusions on the roughened surface of the metal plate are not necessarily arranged in a one-to-one opposite manner, so that the bonding force between the polytetrafluoroethylene plate and the metal plate is reduced, and the metal plate is easily peeled off from the surface of the polytetrafluoroethylene plate.
Therefore, in order to overcome the problems of non-stick property of the ptfe material, achieving a stable structure of the ptfe material surface metallization, and improving the electrical conductivity of the ptfe surface, a new manufacturing method is needed to make the ptfe and metal into a composite board.
[ summary of the invention ]
The invention aims to provide a method for manufacturing a composite board with more tightly combined metal and polytetrafluoroethylene.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a composite board comprises the following steps: putting a polytetrafluoroethylene material into a hot-pressing device, and paving a layer of metal powder on the polytetrafluoroethylene material; the hot-pressing device carries out hot pressing in at least one direction so as to enable the metal powder to be embedded into the polytetrafluoroethylene material and fused to form a composite board; and grinding the composite board to expose the surface of the metal powder layer of the composite board.
Further, the polytetrafluoroethylene material is a polytetrafluoroethylene plate or a polytetrafluoroethylene rod or polytetrafluoroethylene powder.
Further, the polytetrafluoroethylene material has a thickness in a range of 0.1mm to 500 mm.
Furthermore, the metal powder and the polytetrafluoroethylene powder are fully mixed and then laid on the polytetrafluoroethylene material, and the metal powder, the polytetrafluoroethylene powder and the polytetrafluoroethylene material are hot-pressed to form the composite board.
Furthermore, the polytetrafluoroethylene powder and the metal powder are mixed in a dry-type powder mixture or a wet-type powder mixture, the dry-type powder mixture comprises inert gas mixed as protection for metal oxidation resistance, and the wet-type powder mixture is added with an organic solvent as a mixing medium to reduce the chance of metal oxidation caused by frictional heat generation.
Further, the volume ratio of the polytetrafluoroethylene powder to the metal powder is 10:90 to 80: 20.
Further, the material of the metal powder is iron, nickel or copper or an alloy thereof.
Further, the particle size of the particles of the metal powder ranges from 20 μm to 100 μm.
Further, a layer of the metal powder is applied to the polytetrafluoroethylene material by spraying, brushing or powder-spreading.
Further, the thickness of the laid layer of the metal powder ranges from 0.1mm to 0.5 mm.
Further, the relative sphericity of the geometry of the particles of the metal powder is 0.45 to 0.99.
Further, the relative sphericity of the geometry of the particles of the metal powder is less than 0.65 to enhance the anchor bolt effect on the polytetrafluoroethylene material.
Further, the hot press apparatus has a function of rapid heating and rapid cooling within 60 minutes.
Further, the hot press apparatus performs pressing with a cylinder ram.
Further, the hot press apparatus performs pressing with a continuous roller.
Furthermore, a semi-closed positive pressure environment needs to be maintained in the hot pressing environment, and the whole environment is controlled to ensure a low oxygen state so as to protect the metal powder.
Furthermore, an inert gas is filled into the environment where the hot pressing is carried out to keep the semi-closed positive pressure environment.
Furthermore, a totally enclosed negative pressure environment or a vacuum environment is required to be maintained in the environment for hot pressing, and the whole environment is controlled to ensure a low oxygen state so as to protect the metal powder.
Further, on the hot press apparatus, hot pressing is performed in two directions or a plurality of directions.
Further, the thickness of the composite board ranges from 0.1mm to 500 mm.
Further, the composite board must be cooled before being ground.
Further, the composite board is cooled by the hot press.
And further, adding a polytetrafluoroethylene coating on the composite board to cover the metal powder layer, and then grinding.
Further, the composite board is placed in a grinding machine for vacuum adsorption and is ground.
Further, the metal powder layer on the surface of the composite board is thickened by chemical plating or electroplating or vacuum sputtering.
Further, the metal powder layer on the surface of the composite board is subjected to oxygen-insulating treatment before use.
Further, the particles of the metal powder are embedded in the polytetrafluoroethylene material in a volume at least exceeding one half.
The invention lays a layer of metal powder on the surface of the polytetrafluoroethylene material, and fuses the layer of metal powder into the polytetrafluoroethylene material for pressing under the conditions of heating and pressurizing by a hot-pressing device so as to combine the metal powder and the polytetrafluoroethylene material. Wherein the metal powder is an aggregate of a plurality of metal particles. Since the glass transition temperature (Tg) of the ptfe material and the melting point (Tm) of the ptfe material are lower than those of the metal materials commonly used, the metal particles in the metal powder having a high hardness can be embedded in the ptfe in a molten state, so that the metal particles in the metal powder are coated with the ptfe in the molten state to form an anchor phenomenon, thereby combining the metal materials with the ptfe material. And because the metal particles in the metal powder are solid particles, compared with the technical scheme that the roughened surface of the metal plate and the roughened surface of the polytetrafluoroethylene plate are pressed together in the prior art, the contact area between the metal particles in the metal powder and the polytetrafluoroethylene material is increased, and the metal material and the polytetrafluoroethylene material are more favorably combined. And after the metal particles of the layer of metal powder are pressed towards the polytetrafluoroethylene material under the conditions of heating and pressurizing, a metal powder layer formed by embedding the metal particles of the layer of metal powder can be formed in the polytetrafluoroethylene material, so that the composite board is formed, and a conductive path can be formed on the metal powder layer. And finally, in order to enable the metal powder layer to be exposed on the surface of the polytetrafluoroethylene material to be used as a conducting layer, the surface of the composite board is ground in a grinding mode, so that the metal powder layer can be exposed on the surface of the polytetrafluoroethylene material and the conducting path is exposed on the surface of the polytetrafluoroethylene material. And because the dielectric constant of the polytetrafluoroethylene material is small, when the metal powder layer transmits signals, the polytetrafluoroethylene material used as the metal powder layer carrier can reduce the loss during transmission so as to meet the use in the high-frequency field.
[ description of the drawings ]
Fig. 1 is a flowchart of a manufacturing method of a composite board according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of placing a teflon material into a hot-pressing device and laying a layer of metal powder on the teflon material according to a first embodiment of the present invention.
Fig. 3 is a schematic diagram of an initial stage of performing hot pressing in at least one direction by the hot pressing apparatus according to the first embodiment of the present invention;
FIG. 4 is a schematic view of the cylinder ram of FIG. 3 continuing to move downward to a position where a portion of the metal powder is embedded in the PTFE powder and fused;
FIG. 5 is a schematic view of the cylinder ram moved to a final position to embed metal powder into the PTFE material and fuse the metal powder to form a composite sheet in accordance with one embodiment of the present invention.
Fig. 6 is a schematic view illustrating a composite plate material being ground to expose a surface of a metal powder layer of the composite plate material in accordance with a first embodiment of the present invention.
Fig. 7 is a flowchart of a method for manufacturing a composite board according to a second embodiment of the present invention.
FIG. 8 is a schematic view showing a mixture of polytetrafluoroethylene powder and metal powder obtained by mixing polytetrafluoroethylene powder and metal powder in example two of the present invention.
FIG. 9 is a schematic view showing a polytetrafluoroethylene material being placed in a hot press apparatus and a layer of polytetrafluoroethylene powder and metal powder mixture being laid on the polytetrafluoroethylene material in accordance with a second embodiment of the present invention.
Fig. 10 is a schematic view of an initial stage of hot pressing in at least one direction by the hot pressing apparatus according to the second embodiment of the present invention;
FIG. 11 is a schematic view of the cylinder ram of FIG. 10 continuing to move down to a position where a portion of the metal powder is embedded in the PTFE powder and fused;
fig. 12 is a schematic diagram of the cylinder ram moving to the final position to embed the metal powder into the ptfe powder and ptfe material to form the composite sheet according to the second embodiment of the present invention.
FIG. 13 is a schematic view of an embodiment of the present invention illustrating hot pressing of metal powder into a PTFE material using continuous rollers. Detailed description of the embodiments reference is made to the accompanying drawings in which:
reference numerals of the first embodiment of the invention
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Vacuum adsorption grinder 91 | Grinding wheel 92 |
Reference numerals of embodiment two of the present invention
Reference numerals of embodiment three of the present invention
| Working table 1’ | Bottom wall 11' | Heating mechanism 2' | Cooling mechanism 3' |
| Pressing mechanism 4' | 5 'of polytetrafluoroethylene material' | 6 'of metal powder' | Bounded space 7' |
[ detailed description ] embodiments
For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.
Because the polytetrafluoroethylene material has the characteristics of strong chemical stability, low surface energy, non-adhesiveness, high lubricity and the like, the polytetrafluoroethylene material is not easy to be bonded with a metal material, therefore, in order to increase the bonding force between the polytetrafluoroethylene material and the metal material, considering that the glass transition (Tg) of the polytetrafluoroethylene material and the melting point (Tm) of the polytetrafluoroethylene material are lower than those of the common metals, the metal particles with large hardness can be embedded into the polytetrafluoroethylene material in the molten state, so that the polytetrafluoroethylene material in the molten state coats the metal particles, so as to form an anchor phenomenon to combine the metal material with the polytetrafluoroethylene material, and because the metal particles are in solid particles, the contact area between the metal material and the polytetrafluoroethylene material is enlarged, and the metal material and the polytetrafluoroethylene material are combined more favorably. And because the dielectric constant of the polytetrafluoroethylene material is small, when the metal powder layer transmits signals, the polytetrafluoroethylene material used as the metal powder layer carrier can reduce the loss during transmission so as to meet the use in the high-frequency field.
In order to ensure that the metal particles can finally form a conductive path on the surface of the polytetrafluoroethylene material so as to be used as a conductive layer on the surface of a circuit board subsequently, the method adopts the following mode: laying a layer of metal powder on the surface of the polytetrafluoroethylene material, wherein the metal powder is an aggregate of a plurality of metal particles, and pressing the layer of metal powder towards the molten polytetrafluoroethylene material under the conditions of high temperature and high pressure in a vacuum or totally-enclosed negative pressure or semi-enclosed positive pressure working environment, so that the metal particles of the layer of metal powder are embedded into the polytetrafluoroethylene material to form a metal powder layer, and further a composite board is formed, and conductive paths formed by mutual abutting exist among the metal particles in the metal powder layer. And grinding the surface of the composite board by adopting a grinding mode so as to ensure that the metal powder layer can be exposed on the surface of the polytetrafluoroethylene material and the conductive path is exposed on the surface of the polytetrafluoroethylene material.
The metal powder layer is a region formed by embedding each metal particle in the metal powder layer into the polytetrafluoroethylene material in the embedding direction after each metal particle in the metal powder layer is embedded into the polytetrafluoroethylene material, that is, the region of the metal powder layer is a region between the deepest metal particle embedded into the polytetrafluoroethylene material and the shallowest metal particle embedded into the polytetrafluoroethylene material. And the metal powder layer contains polytetrafluoroethylene material which is infiltrated among different metal particles. The conductive path is an electrical path formed by the metal particles embedded in the teflon material abutting against each other.
The metal powder used in the invention is made of one or more of iron, nickel, copper, iron alloy, nickel alloy or copper alloy. The particles of the metal powder may be round or irregular. The particle size of the particles of the metal powder is selected in the range of 20 μm to 100 μm. The relative sphericity of the geometry of the particles of the metal powder is selected from the range of 0.45 to 0.99, and preferably, the relative sphericity of the geometry of the particles of the metal powder is selected from the range of 0.45 to 0.65, to enhance the anchor effect with the polytetrafluoroethylene material.
The method for laying the layer of metal powder on the surface of the polytetrafluoroethylene material can adopt a spraying, brushing or powder laying method, the thickness of the layer of metal powder is selected from the range of 0.1mm to 0.5mm, and specifically, the size of the layer of metal powder in the height direction after being stacked in the height direction is referred to.
The polytetrafluoroethylene material used in the invention is one of polytetrafluoroethylene plate, polytetrafluoroethylene rod or polytetrafluoroethylene powder. The polytetrafluoroethylene material has a thickness selected in the range of 0.1mm to 500 mm. When the polytetrafluoroethylene material is a polytetrafluoroethylene plate, the thickness of the polytetrafluoroethylene material refers to the dimension of the polytetrafluoroethylene plate in the thickness direction. When the polytetrafluoroethylene material is a polytetrafluoroethylene rod, the thickness of the polytetrafluoroethylene material refers to the dimension in the height direction after a plurality of polytetrafluoroethylene rods are stacked in the height direction. When the polytetrafluoroethylene material is polytetrafluoroethylene powder, the thickness of the polytetrafluoroethylene material refers to the dimension in the height direction after the polytetrafluoroethylene powder is stacked in the height direction.
And embedding metal particles of the layer of metal powder into a polytetrafluoroethylene material to form a metal powder layer, and controlling the thickness of the composite plate within the range of 0.1mm to 500mm after the composite plate is formed.
Wherein the vacuum environment is as follows: no matter is present in the working environment. The totally-enclosed negative pressure working environment is as follows: air outside the working environment is not introduced, air in the working environment is gradually exhausted, so that the air pressure in the working environment is lower than the external atmospheric pressure, and the environment is controlled to be in a low-oxygen state, so that the possibility of oxidizing the metal powder is reduced. The semi-closed positive pressure working environment is as follows: constantly to operational environment input inert gas, because of the input inert gas among the operational environment, atmospheric pressure among the operational environment is greater than external atmospheric pressure, and gas among the operational environment can discharge naturally, utilizes the continuous input of inert gas and the continuous output of gas among the operational environment to replace inert gas as far as possible with the gas in the operational environment, guarantee that operational environment is in the low oxygen state as far as possible, reduce the possibility that metal powder is oxidized. The high temperature condition means that: the temperature within the working environment is preferably selected from the range of 250 ℃ to 400 ℃ so that when the polytetrafluoroethylene material is in a molten state, the metal particles in the layer of metal powder are facilitated to embed into the molten polytetrafluoroethylene material to form an anchor phenomenon. The high pressure conditions refer to: in the working environment, the pressure to which the metal powder and the molten polytetrafluoroethylene material are subjected is preferably in the range of 5Mpa to 50Mpa, so that the metal particles in the metal powder are embedded into the molten polytetrafluoroethylene material to form the anchor bolt phenomenon.
The high temperature and high pressure condition of the invention is provided by a hot pressing device, and the hot pressing device at least comprises a heating mechanism and a pressing mechanism.
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 to 6 are schematic views illustrating a first embodiment of the present invention.
As shown in fig. 1 and 3, the hot press apparatus according to the first embodiment of the present invention includes a table 1, a heating mechanism 2, a cooling mechanism 3, and a pressing mechanism 4. Specifically, in this embodiment, the working table 1 includes a bottom wall 11, a side wall 12 and an accommodating cavity 13 defined by the bottom wall 11 and the side wall 12, and an opening is provided at an upper end of the accommodating cavity 13. Heating mechanism 2, cooling mechanism 3 are located in diapire 11 and lateral wall 12 and enclose to locate and hold the chamber 13 outside for holding the material rapid heating and rapid cooling in the chamber 13, and heating mechanism 2 can rapid heating to required temperature in 60min, and cooling mechanism 3 can rapid cooling to required temperature in 60 min. Specifically, in the present embodiment, the heating mechanism 2 is specifically a heating plate (hereinafter, this name is used for description), the cooling mechanism 3 is specifically a cold water drain (hereinafter, this name is used for description), and the heating plate 2 and the cold water drain 3 are alternately arranged on the periphery of the accommodating chamber 13. The pressing mechanism 4 is a cylinder head (hereinafter, this name is used) provided at the upper end of the accommodating chamber 13, that is, the bottom surface of the cylinder head 4 is opposite to the bottom wall 11, the side portion of the cylinder head 4 and the side wall 12 are in contact with each other, and the cylinder head 4 is used for pressing downward into the accommodating chamber 13. The cylinder head 4 is also provided with an exhaust port 41, and the exhaust port 41 is used only for outputting gas to the outside. In this embodiment, the working environment refers to a space range defined between the table 1 and the cylinder head 4.
As shown in fig. 1 and fig. 2, a step S1 of the method for manufacturing a composite board according to the first embodiment of the present invention is shown. Step S1: the polytetrafluoroethylene material 5 is placed into an accommodating cavity 13 in a workbench 1 of a hot-pressing device, so that the polytetrafluoroethylene material 5 is in contact with a bottom wall 11, and then a layer of metal powder 6 is laid on the upper surface of the polytetrafluoroethylene material 5 in a powder laying mode. The thickness of the layer of metal powder 6 is selected from a certain thickness within a range of 0.1mm to 0.5mm, the metal particles of the layer of metal powder 6 have different or uniform particle sizes, the particle sizes are selected from a range of 20 μm to 100 μm, the relative sphericity of the geometric shapes of the metal particles of the layer of metal powder 6 is different or uniform, and the relative sphericity is selected from a range of 0.45 to 0.99.
Specifically, in the present embodiment, the teflon material 5 is a teflon plate, and the thickness of the teflon plate is selected from a certain thickness in a range of 0.1mm to 500 mm. In other embodiments, the ptfe material 5 may be a ptfe rod or powder, and a plurality of ptfe rods or powders are laid over the bottom wall 11.
Specifically, in the present embodiment, the metal powder 6 is copper powder, and in other embodiments, the metal powder 6 may be iron powder, nickel powder, copper alloy powder, iron alloy powder, or nickel alloy powder.
In other embodiments, the metal powder 6 may be applied to the surface of the ptfe material 5 by spraying or brushing.
As shown in fig. 1 and 3, a step S21 in step S2 of the method for manufacturing a composite board according to the first embodiment of the present invention is described. Step S21: the working environment keeps totally closed negative pressure, namely only discharges gas through the exhaust port 41 to the outside to reduce the oxygen content in the working environment, avoid metal powder 6 to oxidize, and evacuate the cold water in the cold water row 3, the heating plate 2 begins to heat gradually, the jar pressure head 4 is pressed down towards the layer of metal powder 6 and polytetrafluoroethylene material 5 continuously with a certain pressure in the range of 5Mpa to 50 Mpa.
In another embodiment, the upper and lower sides of the ptfe material 5 may be respectively provided with cylinder heads 4 to press the metal powder 6 onto the upper and lower surfaces of the ptfe material 5 in the upper and lower directions, specifically, a layer of metal powder 6 is laid or sprayed or painted on the upper surface of the ptfe material 5, a layer of metal powder 6 is laid or sprayed or painted on the surface of the cylinder head 4 below the ptfe material 5, and then the upper and lower cylinder heads 4 are pressed toward the middle ptfe material 5.
In another embodiment, the working environment in this embodiment may also be a vacuum environment or a totally enclosed positive pressure environment, the vacuum environment is that no medium exists in a space range formed by the surrounding of the table 1 and the cylinder head 4, the totally enclosed positive pressure environment is that an air inlet and an air outlet are arranged on the cylinder head 4, the air inlet continuously inputs an inert gas into the space range formed by the surrounding of the table 1 and the cylinder head 4, and because the inert gas is input into the working environment, the air pressure in the working environment is greater than the external atmospheric pressure, the gas in the working environment is naturally discharged from the air outlet, so that the gas in the working environment is replaced by the inert gas as much as possible, and the pressure of the cylinder head 4 is greater than the air pressure of the inert gas.
As shown in fig. 1 and 4, a step S22 in step S2 of the method for manufacturing a composite board according to the first embodiment of the present invention is described. Step S22: the working environment is still kept in a totally-enclosed negative pressure state, the heating plate 2 is heated to a certain temperature within the range of 250 ℃ to 400 ℃, the polytetrafluoroethylene material 5 is changed into the molten polytetrafluoroethylene material 5, at the moment, the cylinder pressure head 4 contacts the layer of metal powder 6, since the metal powder 6 in this embodiment is copper powder and the melting point of copper is higher than 400 deg.c, the metal particles in the metal powder 6 are still in the form of solid particles, the layer of metal powder 6 and the polytetrafluoroethylene material 5 in the molten state are simultaneously pressed by the cylinder head 4, the individual metal particles of the layer of metal powder 6 are gradually embedded down into the molten polytetrafluoroethylene material 5, so that the polytetrafluoroethylene material 5 in a molten state flows toward the gaps between the metal particles of the metal powder 6, so that the metal particles in the metal powder 6 are coated by the molten polytetrafluoroethylene material 5 to form an anchor bolt phenomenon.
As shown in fig. 1 and 5, step S23 is a step S2 of the method for manufacturing a composite board according to the first embodiment of the present invention. Step S23: the working environment is still kept in a fully-closed negative pressure state, the temperature of the heating plate 2 is kept at a certain temperature within the range of 250 ℃ to 400 ℃, the cylinder pressure head continues to press downwards towards the layer of metal powder 6 and the polytetrafluoroethylene material 5 until all metal particles of the layer of metal powder 6 are completely embedded downwards into the molten polytetrafluoroethylene material 5 to form a metal powder layer 7, and then the composite plate 8 is formed. The cylinder ram 4 is then held stationary and the pressure is stopped and the heating plate 2 continues to maintain the certain temperature in the range of 250 c to 400 c for 60 seconds to 1200 seconds. Then the heating plate 2 stops heating, the cold water row 3 is opened, and cold water is introduced until the composite board 8 is cooled to be solidified, so that the composite board 8 is solidified and formed.
Specifically, in the composite sheet 8, at least more than half of the volume of each metal particle of the layer of metal powder 6 is embedded in the molten polytetrafluoroethylene material 5.
Specifically, in another embodiment, after the step S23, a layer of teflon paint may be further applied to the surface of the composite board 8, and the teflon paint is used to fill gaps between different particles in the metal powder layer 7, so as to flatten the whole composite board 8, which facilitates the subsequent grinding step.
As shown in fig. 6, the first embodiment of the present invention further includes a grinding mechanism 9 for grinding the composite board 8, the grinding mechanism 9 includes a vacuum adsorption grinder 91 and a grinding wheel 92, wherein the vacuum adsorption grinder 91 can firmly adsorb the composite board 8 to be ground onto the surface of the vacuum adsorption grinder 91, and the grinding wheel 92 is used for grinding the surface of the composite board 8.
As shown in fig. 1 and 6, step S3 of the method for manufacturing a composite board 8 according to the first embodiment of the present invention is shown. Step S3: and taking the cooled and solidified composite plate 8 out of the accommodating cavity 13, wherein an anchor bolt phenomenon is formed between metal particles in the metal powder layer 7 and the polytetrafluoroethylene material 5 in a molten state, so that the metal particles in the metal powder layer 7 are not necessarily exposed on the surface of the composite plate 8, grinding is carried out until the surface of the metal powder layer 7 in the composite plate 8 is exposed, and the thickness of the ground composite plate 8 is controlled to be a certain thickness within the range of 0.1mm to 500 mm.
Specifically, in this embodiment, the composite board 8 is placed on the vacuum adsorption grinder 91 for vacuum adsorption, that is, the bottom surface of the composite board 8 is adsorbed by the vacuum device on the vacuum adsorption grinder 91, so that the bottom surface of the composite board 8, which is away from the metal powder layer 7, is fixed on the vacuum adsorption grinder 91, and the metal powder layer 7 is disposed upward, and then the upper surface of the composite board 8 is ground by the grinding wheel 92 until the metal powder layer 7 is exposed.
Specifically, in the present embodiment, since the metal powder layer 7 is exposed on the surface of the composite board 8 after grinding, in order to prevent the metal powder layer 7 from being oxidized, the metal powder layer 7 is finally subjected to an oxygen-barrier treatment before use. Specifically, the surface of the metal powder layer 7 is covered with a gummed paper to perform oxygen barrier treatment.
In addition, in the present embodiment, after the metal particles of the layer of metal powder 6 are embedded into the molten teflon material 5 to form the metal powder layer 7, the area of the conductive path formed by the mutual contact between different metal particles is larger, or the metal powder layer 7 needs to reach a certain thickness according to the actual working requirement, so after step S3, the metal powder layer 7 on the surface of the composite board 8 is thickened by chemical plating, electroplating or vacuum sputtering, specifically, the same metal material as the metal powder 6 may be plated, or another metal material with better conductive performance may be plated.
Fig. 7 to 12 are schematic views illustrating a second embodiment of the present invention. The hot press apparatus and the polishing mechanism 9 in the second embodiment are the same as those of the first embodiment 9. The second embodiment is further provided with a mixing device 10 for mixing the polytetrafluoroethylene powder 20 and the metal powder 6.
As shown in fig. 7 and 8, a step S1 of the method for manufacturing a composite board according to the second embodiment of the present invention is shown. Step S1: the polytetrafluoroethylene powder 20 and the metal powder 6 are respectively put into the mixing device 10 from two inlets of the mixing device 10 to be mixed, to obtain a polytetrafluoroethylene powder and metal powder mixture 30. Wherein the volume ratio between the polytetrafluoroethylene powder 20 and the metal powder 6 is a certain volume ratio in the range of 10:90 to 80: 20.
Specifically, in the present embodiment, the metal powder 6 is copper powder. The metal powder 6 has different or uniform particle sizes selected from the range of 20 μm to 100 μm, and the metal powder 6 has different or uniform relative sphericity of the geometric shape selected from the range of 0.45 to 0.65.
Specifically, in the present embodiment, the polytetrafluoroethylene powder 20 and the metal powder 6 are mixed in a dry manner, that is, an inert gas is introduced into the mixing device 10 to mix the polytetrafluoroethylene powder 20 and the metal powder 6, so as to prevent the metal powder 6 and the polytetrafluoroethylene powder 20 from being oxidized due to heat generated by friction during the mixing process. Wherein the inert gas is nitrogen.
In another embodiment, the polytetrafluoroethylene powder 20 and the metal powder 6 may be mixed by wet mixing, that is, adding an organic solvent, which may be ethanol or isopropanol, into the mixing device 10 to mix the polytetrafluoroethylene powder 20 and the metal powder 6, and likewise, to prevent the metal powder 6 and the polytetrafluoroethylene powder 20 from being oxidized due to heat generated by friction during the mixing process.
As shown in fig. 7 and 9, step S2 of the method for manufacturing a composite board according to the second embodiment of the present invention is shown. The difference between the step S2 of the second embodiment of the present invention and the step S1 of the first embodiment of the present invention is: the top surface of the ptfe material 5 is dusted with a layer of ptfe powder and metal powder mixture 30 rather than just a layer of metal powder 6.
Specifically, in the present embodiment, the teflon material 5 is a teflon plate, and the thickness of the teflon plate is selected from a certain thickness in a range of 0.1mm to 500 mm.
In another embodiment, after the polytetrafluoroethylene powder 20 and the metal powder 6 are mixed by adding an organic solvent of ethanol or isopropyl alcohol to form the polytetrafluoroethylene powder and metal powder mixture 30, the polytetrafluoroethylene powder and metal powder mixture 30 is applied to the surface of the polytetrafluoroethylene material 5 by spraying or brushing.
As shown in fig. 7 and 10, step S31 in step S3 of the method for manufacturing a composite board according to the second embodiment of the present invention is described. Step S31 of the second embodiment of the present invention is identical to step S21 of the first embodiment of the present invention.
In other embodiments, the polytetrafluoroethylene powder formed by mixing the added organic solvent of ethanol or isopropyl alcohol and the ethanol or isopropyl alcohol in the metal powder mixture 30 may be gradually volatilized by heating due to the start of heating in step S31.
As shown in fig. 7 and 11, step S32 in step S3 of the method for manufacturing a composite board according to the second embodiment of the present invention is described. The difference between the step S32 of the second embodiment of the present invention and the step S22 of the first embodiment of the present invention is: the polytetrafluoroethylene material 5 and the polytetrafluoroethylene powder 20 are both in a molten state and are fused into a whole, hereinafter, the fused molten polytetrafluoroethylene material 5 and the fused polytetrafluoroethylene powder 20 are collectively referred to as the molten polytetrafluoroethylene material 5, the layer of metal powder 6 and the molten polytetrafluoroethylene material 5 are simultaneously pressed by the pressure of the cylinder head 4, the layer of metal particles of the metal powder 6 is gradually embedded into the molten polytetrafluoroethylene material 5, and the molten polytetrafluoroethylene material 5 flows towards the gaps among the metal particles of the metal powder 6, so that the metal particles in the metal powder 6 are coated by the molten polytetrafluoroethylene material 5, and an anchor bolt phenomenon is formed.
As shown in fig. 7 and 12, a step S33 of step S3 of the method for manufacturing a composite board according to the second embodiment of the present invention is described. Step S33 of the second embodiment of the present invention is identical to step S23 of the first embodiment of the present invention.
As shown in fig. 1 and 7, step S4 of the second embodiment of the present invention is identical to step S3 of the first embodiment of the present invention.
(see in particular fig. 5).
As shown in fig. 13, which is a schematic diagram of a third embodiment of the present invention, the third embodiment of the present invention is different from the first embodiment of the present invention in that: the hot press apparatus in this embodiment includes a table 1 ', a heating mechanism 2', a cooling mechanism 3 ', and a pressing mechanism 4'. Wherein the table 1 'comprises a bottom wall 11'. The heating mechanism 2 'and the cooling mechanism 3' are arranged in the bottom wall 11 'and used for rapidly heating and rapidly cooling substances on the surface of the bottom wall 11', the heating mechanism 2 'can be rapidly heated to a required temperature within 60min, and the cooling mechanism 3' can be rapidly cooled to the required temperature within 60 min. Specifically, in the present embodiment, the heating means 2 ' is specifically a heating plate 2 ' (hereinafter, this name is used for description), the cooling means 3 ' is specifically a cold water bank 3 ' (hereinafter, this name is used for description), and the heating plate 2 ' and the cold water bank 3 ' are alternately arranged in the bottom wall 11 '. The pressing mechanism 4 ' is a continuous roller 4 ' (hereinafter, the name is used for description), and the continuous roller 4 ' can roll back and forth. The manufacturing method of the composite board of the third embodiment of the invention comprises the following steps: in a vacuum working environment or a semi-closed negative pressure environment or a fully-closed positive pressure environment, a polytetrafluoroethylene material 5 ' is placed on the surface of a bottom wall 11 ', a layer of metal powder 6 ' or a layer of mixture 6 ' of the polytetrafluoroethylene powder and the metal powder is laid on the polytetrafluoroethylene material 5 ', the polytetrafluoroethylene material 5 ' is heated by a heating plate 2 ' to be molten, the molten polytetrafluoroethylene material 5 ' and the layer of metal powder 6 ' on the upper surface of the molten polytetrafluoroethylene material are pressed back and forth by a continuous roller 4 ', so that metal particles in the layer of metal powder 6 ' can be embedded into the molten polytetrafluoroethylene material 5 ' to form a metal powder layer, a composite board is further formed, conductive paths formed by mutual abutting exist among different metal particles in the metal powder layer, and then the continuous roller 4 ' stops rolling, and stopping heating the heating plate 2 ', opening the cold water outlet 3', and introducing cold water until the composite board is cooled to room temperature so as to solidify and form the composite board. Finally, the operation of step S3 according to the first embodiment of the present invention is performed (see fig. 5 in detail). Wherein the working environment in the present embodiment refers to the bounded space 7 ' accommodating the table 1 ', the heating mechanism 2 ', the cooling mechanism 3 ' and the pressing mechanism 4 '.
Specifically, in this embodiment, the teflon material 5' is a teflon plate, and the thickness of the teflon plate is selected from a certain thickness in the range of 0.1mm to 500 mm. The metal powder 6 ' is copper powder, the thickness of the layer of metal powder 6 ' is selected from a certain thickness in the range of 0.1mm to 0.5mm, the particle size of the particles of the layer of metal powder 6 ' is not uniform or uniform, and the particle size is selected from the range of 20 μm to 100 μm. The relative sphericity of the particles of the layer of metal powder 6' is varied or uniform, and is selected from the range of 0.45 to 0.65. The heating plate 2' is heated to a temperature in the range of 250 ℃ to 400 ℃. The thickness of the composite board after grinding is controlled to be a certain thickness within the range of 0.1mm to 500 mm. The continuous roller 4 ' is continuously pressed down towards the layer of metal powder 6 ' and the polytetrafluoroethylene material 5 ' in the molten state with a certain pressure in the range 5Mpa to 50 Mpa.
Wherein, since the metal powder 6 ' is copper powder in the embodiment and the melting point of copper is higher than 400 ℃, the metal powder 6 ' is still in the form of solid particles, after the layer of metal powder 6 ' and the molten polytetrafluoroethylene material 5 ' are simultaneously pressed by the pressure of the continuous roller 4 ', the metal particles of the layer of metal powder 6 ' are embedded downwards into the molten polytetrafluoroethylene material 5 ', and the molten polytetrafluoroethylene material 5 ' flows towards the gap between the metal powders 6 ', so that the molten polytetrafluoroethylene material 5 ' covers the metal powder 6 ', thereby forming the anchor bolt phenomenon.
The invention has the following beneficial effects:
laying a layer of metal powder on the surface of the polytetrafluoroethylene material, and fusing the layer of metal powder into the polytetrafluoroethylene material under the conditions of heating and pressurizing by a hot-pressing device for pressing so as to combine the metal powder and the polytetrafluoroethylene material. Wherein the metal powder is an aggregate of a plurality of metal particles. Since the glass transition temperature (Tg) of the ptfe material and the melting point (Tm) of the ptfe material are lower than those of the metal materials commonly used, the metal particles in the metal powder having a high hardness can be embedded in the ptfe in a molten state, so that the metal particles in the metal powder are coated with the ptfe in the molten state to form an anchor phenomenon, thereby combining the metal materials with the ptfe material. And because the metal particles in the metal powder are solid particles, compared with the technical scheme that the roughened surface of the metal plate and the roughened surface of the polytetrafluoroethylene plate are pressed together in the prior art, the contact area between the metal particles in the metal powder and the polytetrafluoroethylene material is increased, and the metal material and the polytetrafluoroethylene material are more favorably combined. And after the metal particles of the layer of metal powder are pressed towards the polytetrafluoroethylene material under the conditions of heating and pressurizing, a metal powder layer formed by embedding the metal particles of the layer of metal powder can be formed in the polytetrafluoroethylene material, so that the composite board is formed, and a conductive path can be formed on the metal powder layer. And finally, in order to enable the metal powder layer to be exposed on the surface of the polytetrafluoroethylene material to be used as a conducting layer, the surface of the composite board is ground in a grinding mode, so that the metal powder layer can be exposed on the surface of the polytetrafluoroethylene material and the conducting path is exposed on the surface of the polytetrafluoroethylene material. And because the dielectric constant of the polytetrafluoroethylene material is small, when the metal powder layer transmits signals, the polytetrafluoroethylene material used as the metal powder layer carrier can reduce the loss during transmission so as to meet the use in the high-frequency field.
The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all technical changes that can be made by applying the present specification and the drawings are included in the scope of the present invention.
Claims (27)
1. The manufacturing method of the composite board is characterized by comprising the following steps:
putting a polytetrafluoroethylene material into a hot-pressing device, and paving a layer of metal powder on the polytetrafluoroethylene material;
the hot-pressing device carries out hot pressing in at least one direction so as to enable the metal powder to be embedded into the polytetrafluoroethylene material and fused to form a composite board;
and grinding the composite board to expose the surface of the metal powder layer of the composite board.
2. The method of making a composite sheet material of claim 1, wherein: the polytetrafluoroethylene material is a polytetrafluoroethylene plate or a polytetrafluoroethylene rod or polytetrafluoroethylene powder.
3. The method of making a composite sheet material of claim 1, wherein: the polytetrafluoroethylene material has a thickness in the range of 0.1mm to 500 mm.
4. The method of making a composite sheet material of claim 1, wherein: the metal powder layer is laid on the polytetrafluoroethylene material after being fully mixed with the polytetrafluoroethylene powder, and the metal powder layer, the polytetrafluoroethylene powder layer and the polytetrafluoroethylene material layer are hot-pressed to form the composite board together.
5. The method of making a composite sheet material of claim 4, wherein: the polytetrafluoroethylene powder and the metal powder are mixed in a dry-type powder mixing mode or a wet-type powder mixing mode, the dry-type powder mixing mode comprises inert gas mixed to serve as metal anti-oxidation protection, and the wet-type powder mixing mode is characterized in that an organic solvent is added to serve as a mixing medium to reduce the chance of metal oxidation caused by friction heat generation.
6. The method of making a composite sheet material of claim 4, wherein: the volume ratio of the polytetrafluoroethylene powder to the metal powder is 10:90 to 80: 20.
7. The method of making a composite sheet material of claim 1, wherein: the metal powder is made of iron, nickel or copper or an alloy thereof.
8. The method of making a composite sheet material of claim 1, wherein: the particles of the metal powder have a particle size ranging from 20 μm to 100 μm.
9. The method of making a composite sheet material of claim 1, wherein: and a layer of the metal powder is laid on the polytetrafluoroethylene material in a spraying, brushing or powder laying mode.
10. The method of making a composite sheet material of claim 1, wherein: the thickness of the laid layer of the metal powder ranges from 0.1mm to 0.5 mm.
11. The method of making a composite sheet material of claim 1, wherein: the relative sphericity of the geometry of the particles of the metal powder is from 0.45 to 0.99.
12. The method of making a composite sheet material of claim 1, wherein: the relative sphericity of the geometry of the particles of the metal powder is less than 0.65 to enhance the anchor effect on the polytetrafluoroethylene material.
13. The method of making a composite sheet material of claim 1, wherein: the hot press device has the functions of rapid heating and rapid cooling within 60 minutes.
14. The method of making a composite sheet material of claim 1, wherein: the hot-pressing device presses by a cylinder pressure head.
15. The method of making a composite sheet material of claim 1, wherein: the hot pressing device presses by a continuous roller.
16. The method of making a composite sheet material of claim 1, wherein: and a semi-closed positive pressure environment is required to be kept in the environment for hot pressing, and the whole environment is controlled to ensure a low oxygen state so as to protect the metal powder.
17. A method of making a composite sheet material as claimed in claim 16, wherein: and (3) filling inert gas into the environment in which the hot pressing is carried out to maintain the semi-closed positive pressure environment.
18. The method of making a composite sheet material of claim 1, wherein: the environment for hot pressing needs to be kept in a totally enclosed negative pressure environment or vacuum environment, and the whole environment is controlled to ensure a low oxygen state so as to protect the metal powder.
19. The method of making a composite sheet material of claim 1, wherein: and performing hot pressing in two or more directions on the hot pressing device.
20. The method of making a composite sheet material of claim 1, wherein: the thickness range of the composite board is 0.1mm to 500 mm.
21. The method of making a composite sheet material of claim 1, wherein: the composite sheet must be cooled prior to grinding.
22. A method of making a composite sheet material as claimed in claim 21, wherein: the composite board is cooled by the hot-pressing device.
23. The method of making a composite sheet material of claim 1, wherein: adding polytetrafluoroethylene coating on the composite board to cover the metal powder layer, and then grinding.
24. The method of making a composite sheet material of claim 1, wherein: and (3) placing the composite board into a grinding machine with vacuum adsorption for grinding.
25. The method of making a composite sheet material of claim 1, wherein: and further thickening the metal powder layer on the surface of the composite board by chemical plating or electroplating or vacuum sputtering.
26. The method of making a composite sheet material of claim 1, wherein: and the metal powder layer on the surface of the composite board is subjected to oxygen insulation treatment before use.
27. The method of making a composite sheet material of claim 1, wherein: the particles of the metal powder are embedded in the polytetrafluoroethylene material in a volume at least exceeding one half.
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