CN112573926A - Aluminum nitride conductor material and aluminum nitride full-ceramic heating structure device - Google Patents
Aluminum nitride conductor material and aluminum nitride full-ceramic heating structure device Download PDFInfo
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
Abstract
The invention discloses an aluminum nitride conductor material and an aluminum nitride all-ceramic heating structure device prepared from the same. The aluminum nitride conductor material has the advantages of low density, low thermal capacity, low energy consumption, high thermal radiation coefficient, high electrothermal efficiency, small thermal expansion coefficient, strong electric field strength resistance, no deformation at high temperature, long service life, high temperature rise speed, remarkable fluorine-oxygen corrosion resistance, excellent thermal shock resistance, durability and uniform heat distribution.
Description
Technical Field
The invention relates to the field of aluminum nitride products, in particular to an aluminum nitride all-ceramic heating structure device.
Background
Besides perfect heat conduction, aluminum nitride also has remarkable fluorine-oxygen corrosion resistance, excellent thermal shock resistance, durability, uniform heat distribution and the like, so that the aluminum nitride is widely applied to semiconductor process. Aluminum nitride ceramics are an important material produced in aluminum nitride applications.
The aluminum nitride ceramic is a novel ceramic material with excellent comprehensive performance, and is an ideal material for manufacturing a new generation of semiconductors and packaging electronic devices. The performance is excellent: has high thermal conductivity, high electrical insulation, low dielectric constant and loss, no toxicity and thermal expansion coefficient matching with silicon. As semiconductor manufacturing, electronic information and power electronics technologies continue to advance toward high integration, high speed, miniaturization and intelligence, and are widely applied to large-scale integrated circuit manufacturing processes, the application and development of aluminum nitride ceramic materials are becoming more extensive.
However, the common aluminum nitride ceramic material is difficult to conduct electricity effectively and directly, if the common aluminum nitride ceramic material is expected to be made into a conductive heating device, the conductive heating device is usually required to be made by matching with a metal resistor, but the traditional metal resistor heating body has many defects, specifically, the metal resistor has high density and high heat capacity and requires high power; the metal resistor and the ceramic are co-fired, so that the dielectric loss is large, the heating is uneven, and the service life is short; the metal resistor and the ceramic can not be uniformly sintered, and the ceramic is easy to crack in the using process; the electric heating efficiency is low, when the temperature is high, the resistance is increased, the power is reduced, and the power consumption is large; the ceramic is internally provided with a metal resistor, the temperature uniformity is difficult to guarantee, the same temperature difference is large, and the ceramic is difficult to use in scenes with high temperature difference precision requirements, such as semiconductor manufacturing, special industrial heating scenes and the like.
Disclosure of Invention
The present invention is directed to an aluminum nitride conductor material and an aluminum nitride all-ceramic heating structure device that can solve one or more of the above-mentioned problems.
According to one aspect of the invention, an aluminum nitride conductor material is provided, which is prepared from aluminum nitride powder, a sintering aid, a dispersing agent, a binder, an organic solvent and metal powder.
The aluminum nitride conductor material has the beneficial effects that: the aluminum nitride conductor material has the advantages of low density, low thermal capacity, low energy consumption, high thermal radiation coefficient, high electrothermal efficiency, small thermal expansion coefficient, strong electric field strength resistance, no deformation at high temperature, long service life, high temperature rise speed, remarkable fluorine-oxygen corrosion resistance, excellent thermal shock resistance, durability and uniform heat distribution.
In some embodiments, the aluminum nitride powder is an aluminum nitride powder produced by a carbon reduction process or a direct nitridation process.
In some embodiments, the sintering aid is Dy2O3、CaO、Li2O、YF3Or CaF2One or more of them.
In some embodiments, the dispersant is one or more of fish oil, castor oil, or triolein, and the binder is polyvinyl butyral.
In some embodiments, the organic solvent is one or a mixture of butanone and absolute ethanol.
In some embodiments, the metal powder is one or more of Ti, Mo, Ta, NiCo, or W.
According to one aspect of the present invention, a method for preparing an aluminum nitride conductor material is provided, which comprises the following steps:
step a: uniformly mixing aluminum nitride powder, a sintering aid, a dispersing agent, a binder, an organic solvent and metal powder for 10-30 hours by using a ball mill to obtain slurry, carrying out vacuum defoaming treatment on the slurry, and drying at the temperature of less than or equal to 150 ℃ to obtain a powdery mixture;
step b: placing the powdery mixture in a mold, and molding in the mold through a dry press or a pressure molding machine to obtain a biscuit;
step c: placing the biscuit in a glue discharging furnace, and performing glue discharging treatment in a nitrogen atmosphere at the temperature of less than or equal to 800 ℃ to discharge various organic matters in the biscuit, thereby obtaining a ceramic biscuit;
step d: and (3) placing the ceramic biscuit in a graphite sintering furnace or a metal vacuum sintering furnace, and sintering for 4-6 hours at the temperature of 1600-1860 ℃ to obtain the aluminum nitride conductor material.
The preparation method of the aluminum nitride conductor material has the beneficial effects that: the preparation method of the aluminum nitride conductor material can enable the metal powder to be tightly combined in the aluminum nitride powder body, so that the aluminum nitride conductor material has excellent conductivity, and simultaneously, the strength, the conductivity and the heat distribution uniformity of the aluminum nitride conductor material can be ensured.
According to an aspect of the present invention, there is provided an aluminum nitride all-ceramic heating structure device comprising the aluminum nitride conductor material of claim 1 and an insulating aluminum nitride material prepared from an aluminum nitride powder, a sintering aid, a binder and an organic solvent.
The aluminum nitride all-ceramic heating structure device has the beneficial effects that: the aluminum nitride conductor material and the insulating aluminum nitride material in the aluminum nitride all-ceramic heating structure device are all prepared by adopting the aluminum nitride powder, the insulation of the doped aluminum nitride conductor can effectively form insulation protection, and the doped aluminum nitride conductor is easy to carry out graphical design and can be co-fired with the insulating aluminum nitride material to be closely mutually fused and hot-pressed and sintered into a whole. It has low density, low heat capacity, low dielectric loss, long heating life, obvious resistance to fluorine-oxygen corrosion, excellent heat shock resistance, high durability and homogeneous heat distribution.
In some embodiments, the preparation method of the insulating aluminum nitride material comprises the steps of uniformly mixing aluminum nitride powder, a sintering aid, a solvent, a dispersant, a binder and an organic auxiliary agent for 5-20 hours by using a ball mill to obtain a mixture, and then carrying out spray drying granulation on the mixture or directly drying the mixture at a temperature of less than or equal to 90 ℃ and then crushing and granulating the dried mixture to obtain the insulating aluminum nitride material.
According to one aspect of the present invention, there is provided a method for preparing an aluminum nitride all-ceramic heating structure device, comprising the steps of:
step e: taking an aluminum nitride conductor material, covering a layer of insulating aluminum nitride material on the aluminum nitride conductor material, covering a layer of insulating aluminum nitride material again on the basis of the aluminum nitride conductor material to obtain a three-layer laminated body, carrying out dry pressing treatment on the three-layer laminated body, and pressing and forming the three-layer laminated body into a whole to obtain a blank.
Step f: and sintering the blank body in a hot-pressing sintering furnace at 1600-1860 ℃ for 4-6 hours to obtain the aluminum nitride all-ceramic heating structure device.
The preparation method of the aluminum nitride all-ceramic heating structure device has the beneficial effects that: therefore, by the preparation method of the aluminum nitride all-ceramic heating structure device, the aluminum nitride conductor material and the insulating aluminum nitride material can be fully combined together, the aluminum nitride conductor material can play a role in conducting and heating, and the insulating aluminum nitride material can be formed into an insulating shell to play an insulating and protecting role, so that the use safety of the aluminum nitride all-ceramic heating structure device is improved.
Drawings
Fig. 1 is a front view of an aluminum nitride all-ceramic heating structure device according to an embodiment of the present invention.
Fig. 2 is a rear view of the aluminum nitride all-ceramic heating structure device of fig. 1.
Fig. 3 is a cross-sectional view of a left side view of the aluminum nitride all-ceramic heating structure device of fig. 1.
In the figure: 1. an aluminum nitride conductor material and 2. an insulating aluminum nitride material.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1
The aluminum nitride conductor material of the embodiment is prepared from aluminum nitride powder, a sintering aid, a dispersant, a binder, an organic solvent and metal powder.
The aluminum nitride powder can be aluminum nitride powder generated by a carbon reduction method or a direct nitriding method, and D50 is 1.2-1.9 um.
The sintering aid can be Dy2O3、CaO、Li2O、YF3Or CaF2In this embodiment, the sintering aid is preferably Dy2O3。
The dispersant may be one or more of fish oil, castor oil or triolein, and in this embodiment, the dispersant is preferably castor oil.
The binder is preferably polyvinyl butyral.
The organic solvent may be one or a mixture of butanone and absolute ethanol, and in this embodiment, the organic solvent is preferably a mixture of butanone and absolute ethanol.
The metal powder may be one or a mixture of Ti, Mo, Ta, NiCo, or W, and in this embodiment, the metal powder is preferably a mixture of Ti, Mo, and Ta.
Aluminum nitride and Dy2O3The weight percentages of Ti, Mo and Ta are 75.0%, 5.0%, 6.0% and 9.0%, respectively.
The preparation method of the aluminum nitride conductor material comprises the following steps:
step a: uniformly mixing aluminum nitride powder, a sintering aid, a dispersing agent, a binder, an organic solvent and metal powder for 20 hours by a ball mill to obtain slurry, carrying out vacuum defoaming treatment on the slurry, and drying at the temperature of less than or equal to 150 ℃ to obtain a powdery mixture;
step b: placing the powdery mixture in a mold, and molding in the mold through a dry press or a pressure molding machine to obtain a biscuit;
step c: placing the biscuit in a glue discharging furnace, and performing glue discharging treatment in a nitrogen atmosphere at 580 ℃ to discharge various organic matters in the biscuit so as to obtain a ceramic biscuit;
step d: and (3) placing the ceramic biscuit in a graphite sintering furnace, and sintering at 1850 ℃ for 6 hours to obtain the aluminum nitride conductor material.
Example 2
The insulating aluminum nitride material of the embodiment is prepared from aluminum nitride powder, a sintering aid, a binder and an organic solvent.
The aluminum nitride powder can be aluminum nitride powder generated by a carbon reduction method or a direct nitriding method, and D50 is 1.2-1.9 um.
The sintering aid can be Dy2O3、CaO、Li2O、YF3Or CaF2In this embodiment, the sintering aid is preferably Dy2O3。
The dispersant may be one or more of fish oil, castor oil or triolein, and in this embodiment, the dispersant is preferably castor oil.
The binder is preferably polyvinyl butyral.
The organic solvent may be one or a mixture of butanone and absolute ethanol, and in this embodiment, the organic solvent is preferably a mixture of butanone and absolute ethanol.
Aluminum nitride and Dy2O3The weight percentage of the components is 95.0 percent and 5.0 percent.
The preparation method of the insulating aluminum nitride material comprises the steps of uniformly mixing aluminum nitride powder, a sintering aid, a solvent, a dispersing agent, a binder and an organic auxiliary agent for 10 hours by using a ball mill to obtain a mixture, and then carrying out spray drying granulation on the mixture or directly drying the mixture at the temperature of less than or equal to 90 ℃, and then crushing and granulating the dried mixture to obtain the insulating aluminum nitride material.
Example 3
Referring to fig. 1, 2 and 3, the aluminum nitride all-ceramic heating structure device of the present embodiment includes an aluminum nitride conductor material 1 and an insulating aluminum nitride material 2.
The preparation method of the aluminum nitride all-ceramic heating structure device comprises the following steps:
step e: taking the aluminum nitride conductor material 1 prepared in the example 1 and the insulating aluminum nitride material 2 prepared in the example 2, covering a layer of the insulating aluminum nitride material 2 on the aluminum nitride conductor material 1, then covering a layer of the insulating aluminum nitride material 2 again on the basis of the insulating aluminum nitride conductor material 1 to obtain a three-layer laminated body, and carrying out dry pressing treatment on the three-layer laminated body to be pressed into a whole to obtain a blank.
Step f: and sintering the blank body in a hot-pressing sintering furnace at 1860 ℃ for 6 hours to obtain the aluminum nitride all-ceramic heating structure device.
The aluminum nitride all-ceramic heating structure device prepared by the method can be subjected to appearance modification, namely, aluminum nitride ceramic heating guide devices with different design sizes and functions can be obtained through processes such as grinding, machining, laser processing and the like.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (10)
1. The aluminum nitride conductor material is characterized by being prepared from aluminum nitride powder, a sintering aid, a dispersing agent, a binder, an organic solvent and metal powder.
2. The aluminum nitride conductor material according to claim 1, wherein the aluminum nitride powder is an aluminum nitride powder produced by a carbon reduction method or a direct nitriding method.
3. The aluminum nitride conductor material as claimed in claim 1, wherein the sintering aid is Dy2O3、CaO、Li2O、YF3Or CaF2One or more of them.
4. The aluminum nitride conductor material as claimed in claim 1, wherein the dispersant is one or more of fish oil, castor oil or triolein, and the binder is polyvinyl butyral.
5. The aluminum nitride conductor material as claimed in claim 1, wherein the organic solvent is one or a mixture of butanone and absolute ethyl alcohol.
6. The aluminum nitride conductor material of claim 1, wherein the metal powder is one or more of Ti, Mo, Ta, NiCo, or W.
7. The method for preparing an aluminum nitride conductor material according to claim 1, comprising the steps of:
step a: uniformly mixing aluminum nitride powder, a sintering aid, a dispersing agent, a binder, an organic solvent and metal powder for 10-30 hours by using a ball mill to obtain slurry, carrying out vacuum defoaming treatment on the slurry, and drying at the temperature of less than or equal to 150 ℃ to obtain a powdery mixture;
step b: placing the powdery mixture in a mold, and molding in the mold through a dry press or a pressure molding machine to obtain a biscuit;
step c: placing the biscuit in a glue discharging furnace, and performing glue discharging treatment in a nitrogen atmosphere at the temperature of less than or equal to 800 ℃ to discharge various organic matters in the biscuit, thereby obtaining a ceramic biscuit;
step d: and (3) placing the ceramic biscuit in a graphite sintering furnace or a metal vacuum sintering furnace, and sintering for 4-6 hours at the temperature of 1600-1860 ℃ to obtain the aluminum nitride conductor material.
8. An aluminum nitride all-ceramic heating structure device, characterized by comprising the aluminum nitride conductor material of claim 1 and an insulating aluminum nitride material prepared from aluminum nitride powder, a sintering aid, a binder and an organic solvent.
9. The aluminum nitride all-ceramic heating structural device according to claim 8, wherein the preparation method of the insulating aluminum nitride material comprises the steps of uniformly mixing aluminum nitride powder, a sintering aid, a solvent, a dispersant, a binder and an organic auxiliary agent for 5-20 hours by using a ball mill to obtain a mixture, and then carrying out spray drying granulation on the mixture or directly drying the mixture at a temperature of less than or equal to 90 ℃ and then crushing and granulating the dried mixture to obtain the insulating aluminum nitride material.
10. The method of fabricating an aluminum nitride all-ceramic heating structure device according to claim 8, comprising the steps of:
step e: taking an aluminum nitride conductor material, covering a layer of insulating aluminum nitride material on the aluminum nitride conductor material, covering a layer of insulating aluminum nitride material again on the basis of the aluminum nitride conductor material to obtain a three-layer laminated body, carrying out dry pressing treatment on the three-layer laminated body, and pressing and forming the three-layer laminated body into a whole to obtain a blank.
Step f: and sintering the blank body in a hot-pressing sintering furnace at 1600-1860 ℃ for 4-6 hours to obtain the aluminum nitride all-ceramic heating structure device.
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Cited By (3)
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| CN115536399A (en) * | 2022-11-02 | 2022-12-30 | 无锡海古德新技术有限公司 | Full aluminum nitride ceramic heating structure device and preparation method thereof |
| CN116253571A (en) * | 2023-03-16 | 2023-06-13 | 无锡海古德新技术有限公司 | Aluminum nitride ceramic granulating powder and preparation method thereof |
| CN116410003A (en) * | 2021-12-31 | 2023-07-11 | 江苏博睿光电股份有限公司 | Substrate, preparation method and application |
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| CN116410003A (en) * | 2021-12-31 | 2023-07-11 | 江苏博睿光电股份有限公司 | Substrate, preparation method and application |
| CN115536399A (en) * | 2022-11-02 | 2022-12-30 | 无锡海古德新技术有限公司 | Full aluminum nitride ceramic heating structure device and preparation method thereof |
| CN116253571A (en) * | 2023-03-16 | 2023-06-13 | 无锡海古德新技术有限公司 | Aluminum nitride ceramic granulating powder and preparation method thereof |
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Application publication date: 20210330 |