CN111933785B - Light-emitting diode forming die - Google Patents
Light-emitting diode forming die Download PDFInfo
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- CN111933785B CN111933785B CN202010989187.8A CN202010989187A CN111933785B CN 111933785 B CN111933785 B CN 111933785B CN 202010989187 A CN202010989187 A CN 202010989187A CN 111933785 B CN111933785 B CN 111933785B
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- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000002347 injection Methods 0.000 claims abstract description 23
- 239000007924 injection Substances 0.000 claims abstract description 23
- 238000007493 shaping process Methods 0.000 claims description 14
- 101000623895 Bos taurus Mucin-15 Proteins 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 31
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000006872 improvement Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a light-emitting diode forming die, which comprises a base, a first supporting rod, a forming mechanism for forming a diode and a material injection mechanism for feeding materials into the forming mechanism, wherein the first supporting rod is vertically arranged on the base, the forming mechanism is arranged on the first supporting rod, the first support rod is provided with a first mounting plate and a second mounting plate which are horizontally arranged, the first mounting plate is positioned below the second mounting plate, the first mounting plate is provided with two mounting plates which are arranged in parallel, when the forming shell on the forming component I is matched with the forming shell on the forming component II, the clamp clamps the two electrodes and places the two electrodes in the groove of the forming shell, the gun head of the material injection gun extends into the groove of the forming shell to inject materials into the forming shell, after the diode is formed, and the first conveying belt and the second conveying belt move, and the forming shell on the first forming assembly is separated from the forming shell on the second forming assembly.
Description
Technical Field
The invention relates to the technical field of diode forming, in particular to a light-emitting diode forming die.
Background
Diodes, electronic components, a device with two electrodes, allow current to flow only in a single direction, and many applications use the rectifying function. When the existing diode is produced, a diode forming machine is generally adopted to process and produce the diode, the forming machine can only process one diode element, the size of a die cannot be changed, and the diode with different sizes is inconvenient to produce.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a light-emitting diode forming die.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows.
A light emitting diode forming die, comprising:
the diode forming device comprises a base, a first supporting rod, a forming mechanism for forming diodes and a material injection mechanism for feeding materials into the forming mechanism, wherein the first supporting rod is vertically arranged on the base, the forming mechanism is arranged on the first supporting rod, a first mounting plate and a second mounting plate are arranged on the first supporting rod, the first mounting plate and the second mounting plate are horizontally arranged, the first mounting plate is positioned below the second mounting plate, the first mounting plate is provided with two mounting plates which are arranged in parallel, the second mounting plate is provided with two mounting plates which are arranged in parallel, the forming mechanism comprises a first forming assembly and a second forming assembly, the first forming assembly is arranged on the second mounting plate, the second forming assembly is arranged on the first mounting plate, the first forming assembly comprises a first conveying belt arranged on the second mounting plate, the second forming assembly comprises a second conveying belt arranged on the first mounting plate, and the conveying belts of, the conveying belt I, the conveying belt II is parallel, the conveying belt I, be provided with the connecting rod on the area of conveying belt II, the shaping casing passes through the connecting rod to be connected in conveying belt I, on the conveying belt II, the shaping casing is provided with a plurality of and along conveying belt I, the area direction of conveying belt II, the even interval arrangement of shaping casing, the shaping casing includes the recess, annotate the material hole, standing groove I, standing groove II, the recess is seted up in the shaping casing, annotate the material hole set up in the surface of shaping casing and with the recess intercommunication, standing groove I, standing groove II sets up in the lateral wall department of shaping casing, standing groove I, standing groove II interval arrangement.
As a further improvement of the technical scheme, annotate material mechanism include motor one, lead screw, guide arm, slip frame, annotate the material rifle, be provided with limiting plate one, limiting plate two on the mounting panel one, motor one is installed on limiting plate two, the output shaft of motor one is the level and arranges, the one end of lead screw and the coaxial fixed connection of output axle head of motor one, the other end and a mounting panel swing joint, the guide arm parallel arrangement in one side of lead screw, the guide arm sets up between limiting plate one and mounting panel one, slip frame cover is located on lead screw, guide arm, slip frame and lead screw threaded connection, annotate the material rifle and install on the slip frame.
As a further improvement of the technical scheme, one side of the forming mechanism is provided with a clamping and placing mechanism for clamping and placing the electrodes, the base is provided with a mounting rack, the clamping and placing mechanism is installed on the mounting rack and comprises a third conveying belt, a clamping plate, a connecting plate, a second motor and a clamp, the third conveying belt is installed on the mounting rack, the conveying belt of the third conveying belt is vertically arranged, the clamping plate is clamped on the conveying belt surface of the third conveying belt, the clamping plate is provided with a plurality of conveying belts, the clamping plates are evenly arranged at intervals along the conveying belt surface of the third conveying belt, the second motor is installed on the clamping plate, an output shaft of the second motor is horizontally arranged, the clamping plate penetrates through an output shaft end of the second motor, and the clamp is installed on the connecting plate.
As a further improvement of the technical scheme, the fixture comprises a first clamping plate and a second clamping plate, wherein the first clamping plate and the second clamping plate are arranged up and down, the first clamping plate and the second clamping plate are parallel, the lower plate surface of the first clamping plate is provided with a first clamping groove and a second clamping groove, the upper plate surface of the second clamping plate is provided with a third clamping groove and a fourth clamping groove, the first clamping groove and the second clamping groove are arranged opposite to the third clamping groove and the fourth clamping groove, two electrodes of the diode can be respectively arranged between the first clamping groove and the third clamping groove and between the second clamping groove and the fourth clamping groove, the number of the fixture is the same as the number of the molding shells on the second molding assembly, and the first conveying belt, the second conveying belt and the third conveying belt are.
As a further improvement of the technical scheme, a third supporting rod is arranged on the base, a scraper is arranged at the top of the third supporting rod and close to the conveying tail end of the third conveying belt, and a knife face of the scraper is arc-shaped.
As a further improvement of the technical scheme, a second support rod and a discharge groove are arranged on the base, the discharge groove is arranged above the second support rod, and the discharge groove is close to the conveying tail end of the third conveying belt and is located below the third conveying belt.
Compared with the prior art, the diode forming device has the advantages that in the using process, when the forming shell on the forming assembly I is matched with the forming shell on the forming assembly II, the clamp clamps the two electrodes and places the two electrodes in the groove of the forming shell, the gun head of the injection gun extends into the groove of the forming shell to inject materials into the forming shell, after a diode is formed, the conveying belt I and the conveying belt II move, the forming shell on the forming assembly I is separated from the forming shell on the forming assembly II, the forming and demolding of the diode are convenient, and the production efficiency is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a schematic view of a molding mechanism and a clamping mechanism according to the present invention.
FIG. 3 is a schematic view of the first molding assembly and the second molding assembly of the present invention.
FIG. 4 is a schematic view of an installation of the molding assembly of the present invention.
FIG. 5 is a schematic view of a molding assembly of the present invention.
Fig. 6 is a schematic structural diagram of the molded housing of the present invention.
Fig. 7 is a schematic view of the installation of the injection mechanism of the present invention.
Fig. 8 is a schematic view of the injection mechanism of the present invention.
FIG. 9 is a schematic view of the clamp placement mechanism of the present invention.
FIG. 10 is a schematic view of the clip installation of the present invention.
FIG. 11 is a schematic view of the clamping of the diode according to the present invention.
FIG. 12 is a schematic view of the first and second clamping plates of the present invention.
Labeled as:
10. a base; 110. a first supporting rod; 111. a first mounting plate; 112. a second mounting plate; 113. a first limiting plate; 114. a second limiting plate; 120. a second supporting rod; 130. a discharge chute; 140. a mounting frame; 150. a third supporting rod; 151. a scraper;
20. a molding mechanism; 210. forming a first component; 211. a first conveying belt; 220. a second molding assembly; 221. a second conveying belt; 222. a connecting rod; 223. molding a shell; 224. a groove; 225. a material injection hole; 226. placing the first groove; 227. a second placing groove;
30. a material injection mechanism; 310. a first motor; 320. a screw rod; 330. a guide bar; 340. a sliding frame; 350. a material injection gun;
40. a clamping and placing mechanism; 410. conveying belt III; 420. clamping a plate; 430. a connecting plate; 440. a second motor; 450. a clamp; 451. a first clamping plate; 452. a second clamping plate; 453. a first clamping groove; 454. a second clamping groove; 455. a third clamping groove; 456. and a fourth clamping groove.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms may be understood by those skilled in the art according to specific situations.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being fixed or detachable or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 12, a light emitting diode molding die includes:
the diode forming device comprises a base 10, a first support rod 110, a forming mechanism 20 for forming diodes and a material injection mechanism 30 for feeding materials into the forming mechanism 20, wherein the first support rod 110 is vertically arranged on the base 10, the forming mechanism 20 is arranged on the first support rod 110, the first support rod 110 is provided with a first mounting plate 111 and a second mounting plate 112, the first mounting plate 111 and the second mounting plate 112 are horizontally arranged, the first mounting plate 111 is positioned below the second mounting plate 112, the first mounting plate 111 is provided with two parallel mounting plates, the second mounting plate 112 is provided with two parallel mounting plates, the forming mechanism 20 comprises a first forming assembly 210 and a second forming assembly 220, the first forming assembly 210 is arranged on the second mounting plates 112, the second forming assembly 220 is arranged on the first mounting plates 111, the first forming assembly 210 comprises a first conveying belt 211 arranged on the second mounting plates 112, the second forming assembly 220 comprises a second conveying belt 221 arranged on the first mounting plates 111, the conveyor belt surfaces of the first conveyor belt 211 and the second conveyor belt 221 are horizontally arranged, the first conveyor belt 211 and the second conveyor belt 221 are parallel, a connecting rod 222 and a forming shell 223 are arranged on the belt surfaces of the first conveyor belt 211 and the second conveyor belt 221, the forming shell 223 is connected to the first conveyor belt 211 and the second conveyor belt 221 through the connecting rod 222, a plurality of forming shells 223 are arranged along the belt surface directions of the first conveyor belt 211 and the second conveyor belt 221, the forming shells 223 are evenly arranged at intervals, each forming shell 223 comprises a groove 224, a material injection hole 225, a first placing groove 226 and a second placing groove 227, the groove 224 is arranged in the forming shell 223, the material injection hole 225 is arranged on the surface of the forming shell 223 and is communicated with the groove 224, the first placing groove 226 and the second placing groove 227 are arranged at the side wall of the forming shell 223, the first placing groove 226 and the second placing groove 227 are arranged at intervals, when the, the molded housing 223 on the first molding member 210 can be matched with the molded housing 223 on the second molding member 220, so that the diode can be molded.
As shown in fig. 7-8, the material injection mechanism 30 includes a first motor 310, a first screw 320, a guide rod 330, a sliding frame 340, and a material injection gun 350, the first mounting plate 111 is provided with a first limit plate 113 and a second limit plate 114, the first motor 310 is mounted on the second limit plate 114, an output shaft of the first motor 310 is horizontally arranged, one end of the first screw 320 is coaxially and fixedly connected with an output shaft end of the first motor 310, the other end of the first motor is movably connected with the first mounting plate 111, the guide rod 330 is disposed at one side of the first screw 320 in parallel, the guide rod 330 is disposed between the first limit plate 113 and the first mounting plate 111, the sliding frame 340 is sleeved on the first screw 320 and the guide rod 330, the sliding frame 340 is in threaded connection with the first screw 320, the material injection gun 350 is mounted on the sliding frame 340, after the molding shell 223 on the first molding component 210 can be matched with the molding shell 223 on the second molding component 220, so that the tip of the injection gun 350 is inserted into the groove 224 of the molding housing 223 to inject the molding housing 223.
As shown in fig. 9-12, in the process of matching the molding housing 223 on the first molding assembly 210 with the molding housing 223 on the second molding assembly 220, two electrodes of the diode need to be placed in the first and second placing grooves 226 and 227 of the two molding housings 223, one side of the molding mechanism 20 is provided with a clamping and placing mechanism 40 for clamping and placing the electrodes, the base 10 is provided with the mounting frame 140, the clamping and placing mechanism 40 is mounted on the mounting frame 140, the clamping and placing mechanism 40 includes a third conveyor belt 410, a plurality of clamping plates 420, a connecting plate 430, a second motor 440, and a clamp 450, the third conveyor belt 410 is mounted on the mounting frame 140, the conveyor belt surface of the third conveyor belt 410 is vertically arranged, the clamping plates 420 are clamped on the conveyor belt surface of the third conveyor belt 410, the clamping plates 420 are provided with a plurality of clamping plates and are arranged along the conveyor belt surface of the third conveyor belt 410 at regular intervals, the second, the output shaft of the second motor 440 is horizontally arranged, the output shaft of the second motor 440 penetrates through the clamping plate 420, the output shaft end of the second motor 440 is sleeved with the connecting plate 430, the clamp 450 is installed on the connecting plate 430, and the clamp 450 can clamp the electrode, so that the electrode is conveniently placed in the groove 224 of the forming shell 223.
More specifically, the clamp 450 includes a first clamp plate 451, a second clamp plate 452, the first clamp plate 451, the second clamp plate 452 are arranged up and down, the first clamp plate 451, the second clamp plate 452 are parallel, the lower plate surface of the first clamp plate 451 is provided with a first clamping groove 453, a second clamping groove 454, the upper plate surface of the second clamp plate 452 is provided with a third clamping groove 455, a fourth clamping groove 456, the first clamping groove 453, the second clamping groove 454, the third clamping groove 455, and the fourth clamping groove 456 are arranged oppositely, two electrodes of the diode can be respectively arranged between the first clamping groove 453 and the third clamping groove 455, and between the second clamping groove 454 and the fourth clamping groove 456, the number of the clamp 450 is the same as the number of the molding housings 223 on the second molding assembly 220, the first conveyor belt 211, the second conveyor belt 221, and the third conveyor belt 410 are synchronously conveyed, in the process that the molding housing 223 on the first molding assembly 210 is matched with the molding housing 223 on the second molding assembly 220, the clamp 450 clamps the, then the first motor 310 drives the sliding frame 340 to move towards the direction close to the forming shell 223, the gun head of the material injection gun 350 extends into the groove 224 of the forming shell 223 to inject materials into the forming shell 223, after the diode is formed, the first conveying belt 211 and the second conveying belt 221 move, the forming shell 223 on the first forming assembly 210 is separated from the forming shell 223 on the second forming assembly 220, then the third conveying belt 410 conveys the diode, the output shaft of the second motor 440 rotates to drive the connecting plate 430 to rotate, so that the clamp 450 rotates 90 degrees, then the clamp 450 cancels clamping of the electrode, and the diode is separated from the clamp 450.
More specifically, after the diode is molded, in order to remove burrs on the surface of the diode, the base 10 is provided with three supporting rods 150, the top of the three supporting rods 150 is provided with a scraper 151, the scraper 151 is close to the conveying end of the three conveying belts 410, and the knife face of the scraper 151 is arc-shaped, so that the scraper can be matched with the diode, and in the process of conveying the diode by the three conveying belts 410, the knife face of the scraper 151 can scrape off the burrs on the surface of the diode.
More specifically, in order to collect the diodes, the second support rod 120 and the discharge groove 130 are disposed on the base 10, the discharge groove 130 is disposed above the second support rod 120, the discharge groove 130 is close to the conveying end of the third conveyor belt 410 and is located below the third conveyor belt 410, and the diodes can fall into the discharge groove 130.
The working principle is as follows:
in the using process of the invention, when the first conveyor belt 211 and the second conveyor belt 221 are in the conveying process, the forming shell 223 on the first forming assembly 210 can be matched with the forming shell 223 on the second forming assembly 220, after the forming shell 223 on the first forming assembly 210 can be matched with the forming shell 223 on the second forming assembly 220, the first motor 310 drives the sliding frame 340 to move towards the direction close to the forming shell 223, so that the gun head of the material injection gun 350 extends into the groove 224 of the forming shell 223, so as to inject the material into the forming shell 223, when the forming shell 223 on the first forming assembly 210 is matched with the forming shell 223 on the second forming assembly 220, the clamp 450 clamps the two electrodes and places the two electrodes into the groove 224 of the forming shell 223, then the first motor 310 drives the sliding frame 340 to move towards the direction close to the forming shell 223, the gun head of the material injection gun 350 extends into the groove 224 of the forming shell 223 to inject the material into the forming shell 223, after the diode is formed, the first conveyor belt 211 and the second conveyor belt 221 move, the forming shell 223 on the first forming assembly 210 is separated from the forming shell 223 on the second forming assembly 220, then the third conveyor belt 410 conveys the diode, the output shaft of the second motor 440 rotates to drive the connecting plate 430 to rotate, so that the clamp 450 rotates 90 degrees, then the clamp 450 cancels the clamping of the electrode, and the diode is separated from the clamp 450.
It should be understood that the above-described embodiments are merely preferred embodiments of the invention and the technical principles applied thereto. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, such variations are within the scope of the invention as long as they do not depart from the spirit of the invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.
Claims (6)
1. A light emitting diode forming die is characterized by comprising:
the diode forming device comprises a base, a first supporting rod, a forming mechanism for forming diodes and a material injection mechanism for feeding materials into the forming mechanism, wherein the first supporting rod is vertically arranged on the base, the forming mechanism is arranged on the first supporting rod, a first mounting plate and a second mounting plate are arranged on the first supporting rod, the first mounting plate and the second mounting plate are horizontally arranged, the first mounting plate is positioned below the second mounting plate, the first mounting plate is provided with two mounting plates which are arranged in parallel, the second mounting plate is provided with two mounting plates which are arranged in parallel, the forming mechanism comprises a first forming assembly and a second forming assembly, the first forming assembly is arranged on the second mounting plate, the second forming assembly is arranged on the first mounting plate, the first forming assembly comprises a first conveying belt arranged on the second mounting plate, the second forming assembly comprises a second conveying belt arranged on the first mounting plate, and the conveying belts of, the conveying belt I, the conveying belt II is parallel, the conveying belt I, be provided with the connecting rod on the area of conveying belt II, the shaping casing passes through the connecting rod to be connected in conveying belt I, on the conveying belt II, the shaping casing is provided with a plurality of and along conveying belt I, the area direction of conveying belt II, the even interval arrangement of shaping casing, the shaping casing includes the recess, annotate the material hole, standing groove I, standing groove II, the recess is seted up in the shaping casing, annotate the material hole set up in the surface of shaping casing and with the recess intercommunication, standing groove I, standing groove II sets up in the lateral wall department of shaping casing, standing groove I, standing groove II interval arrangement.
2. The light-emitting diode forming die as claimed in claim 1, wherein the material injection mechanism comprises a first motor, a first lead screw, a guide rod, a sliding frame and a material injection gun, the first mounting plate is provided with a first limiting plate and a second limiting plate, the first motor is mounted on the second limiting plate, an output shaft of the first motor is horizontally arranged, one end of the lead screw is coaxially and fixedly connected with an output shaft end of the first motor, the other end of the lead screw is movably connected with the first mounting plate, the guide rod is arranged on one side of the lead screw in parallel, the guide rod is arranged between the first limiting plate and the first mounting plate, the sliding frame is sleeved on the lead screw and the guide rod, the sliding frame is in threaded connection with the lead screw, and the material injection.
3. The light-emitting diode forming die as claimed in claim 2, wherein a clamping and placing mechanism for clamping and placing the electrodes is arranged on one side of the forming mechanism, a mounting frame is arranged on the base, the clamping and placing mechanism is mounted on the mounting frame and comprises a third conveying belt, a clamping plate, a connecting plate, a second motor and a clamp, the third conveying belt is mounted on the mounting frame, the conveying belt surface of the third conveying belt is vertically arranged, the clamping plate is clamped on the conveying belt surface of the third conveying belt, the clamping plate is provided with a plurality of clamping plates and is uniformly arranged along the conveying belt surface of the third conveying belt at intervals, the second motor is mounted on the clamping plate, an output shaft of the second motor is horizontally arranged, the output shaft of the second motor penetrates through the clamping plate, the connecting plate is sleeved on the output shaft end of the second motor.
4. The light-emitting diode forming die as claimed in claim 3, wherein the fixture comprises a first clamping plate and a second clamping plate, the first clamping plate and the second clamping plate are arranged vertically, the first clamping plate and the second clamping plate are parallel, a first clamping groove and a second clamping groove are formed in the lower plate surface of the first clamping plate, a third clamping groove and a fourth clamping groove are formed in the upper plate surface of the second clamping plate, the first clamping groove and the second clamping groove are arranged opposite to the third clamping groove and the fourth clamping groove, two electrodes of the diode can be respectively arranged between the first clamping groove and the third clamping groove and between the second clamping groove and the fourth clamping groove, the number of the fixtures is the same as that of the forming shells on the second forming assembly, and the first conveying belt, the second conveying belt and the third conveying belt are conveyed synchronously.
5. The light-emitting diode forming die as claimed in claim 3, wherein a third support rod is disposed on the base, a scraper is disposed on the top of the third support rod, the scraper is close to the conveying end of the third conveyor belt, and a blade surface of the scraper is arc-shaped.
6. The light-emitting diode forming die as claimed in claim 3, wherein the base is provided with a second support rod and a discharge groove, the discharge groove is arranged above the second support rod, and the discharge groove is close to the conveying end of the third conveying belt and is arranged below the third conveying belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010989187.8A CN111933785B (en) | 2020-09-18 | 2020-09-18 | Light-emitting diode forming die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010989187.8A CN111933785B (en) | 2020-09-18 | 2020-09-18 | Light-emitting diode forming die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111933785A CN111933785A (en) | 2020-11-13 |
| CN111933785B true CN111933785B (en) | 2021-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010989187.8A Active CN111933785B (en) | 2020-09-18 | 2020-09-18 | Light-emitting diode forming die |
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| Country | Link |
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| CN (1) | CN111933785B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115954298B (en) * | 2022-12-31 | 2023-11-03 | 先之科半导体科技(东莞)有限公司 | Diode packaging equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6078948B2 (en) * | 2012-01-20 | 2017-02-15 | 日亜化学工業株式会社 | Package molded body for light emitting device and light emitting device using the same |
| CN107910287B (en) * | 2017-11-14 | 2019-01-01 | 中山市木林森电子有限公司 | Full-automatic LED packaging machine |
| CN208474997U (en) * | 2018-08-19 | 2019-02-05 | 深圳市零奔洋光电股份有限公司 | A kind of high protection LED injection mould group |
| CN109742211B (en) * | 2018-11-21 | 2020-05-08 | 木林森股份有限公司 | Automatic production equipment for LED packaging tube |
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2020
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| Publication number | Publication date |
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| CN111933785A (en) | 2020-11-13 |
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