CN111916381B - 一种晶圆放料盒取料辅助机构 - Google Patents
一种晶圆放料盒取料辅助机构 Download PDFInfo
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- CN111916381B CN111916381B CN202010853899.7A CN202010853899A CN111916381B CN 111916381 B CN111916381 B CN 111916381B CN 202010853899 A CN202010853899 A CN 202010853899A CN 111916381 B CN111916381 B CN 111916381B
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- 239000000463 material Substances 0.000 title claims abstract description 9
- 238000007664 blowing Methods 0.000 title claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 abstract description 33
- 238000007599 discharging Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010853899.7A CN111916381B (zh) | 2020-08-24 | 2020-08-24 | 一种晶圆放料盒取料辅助机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010853899.7A CN111916381B (zh) | 2020-08-24 | 2020-08-24 | 一种晶圆放料盒取料辅助机构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111916381A CN111916381A (zh) | 2020-11-10 |
CN111916381B true CN111916381B (zh) | 2024-06-28 |
Family
ID=73278981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202010853899.7A Active CN111916381B (zh) | 2020-08-24 | 2020-08-24 | 一种晶圆放料盒取料辅助机构 |
Country Status (1)
Country | Link |
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CN (1) | CN111916381B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114446848A (zh) * | 2021-12-28 | 2022-05-06 | 苏州精濑光电有限公司 | 一种料盒的辅助定位机构 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4960485A (en) * | 1987-06-19 | 1990-10-02 | Enya Mfg. Co., Ltd. | Automatic wafer mounting device |
CN102738056A (zh) * | 2011-06-28 | 2012-10-17 | 清华大学 | 一种利用气缸伸缩的推杆式晶圆夹持装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57154854A (en) * | 1981-03-20 | 1982-09-24 | Hitachi Ltd | Processing device for plate type material |
JPH11121585A (ja) * | 1997-10-17 | 1999-04-30 | Olympus Optical Co Ltd | ウェハ搬送装置 |
JPH11288998A (ja) * | 1998-04-03 | 1999-10-19 | Sony Corp | ウエハ移し替え装置 |
KR100666546B1 (ko) * | 2005-06-02 | 2007-01-09 | 비전세미콘 주식회사 | 반도체용 플라즈마 세정장치 |
CN201058765Y (zh) * | 2007-06-01 | 2008-05-14 | 深圳市大族激光科技股份有限公司 | 送料装置 |
JP6375186B2 (ja) * | 2014-09-05 | 2018-08-15 | 株式会社Screenホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
CN107658258B (zh) * | 2016-07-25 | 2019-08-30 | 上海新昇半导体科技有限公司 | 一种晶圆片架的取放片装置 |
CN106997863B (zh) * | 2017-05-18 | 2023-11-10 | 深圳新益昌科技股份有限公司 | 一种用于led固晶机的支架自动供料***及其运行方法 |
CN108438884A (zh) * | 2018-04-28 | 2018-08-24 | 叶小桥 | 一种铝合金条加工用调节抓取推料机构 |
CN208385434U (zh) * | 2018-07-16 | 2019-01-15 | 苏州映真智能科技有限公司 | 一种用于自花篮上取出硅片的顶片机构 |
CN208478308U (zh) * | 2018-08-16 | 2019-02-05 | 德淮半导体有限公司 | 晶圆抓取装置及半导体加工设备 |
CN110137123B (zh) * | 2019-05-31 | 2021-06-15 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 晶圆上下料装置及晶圆下料方法 |
CN110911340A (zh) * | 2019-12-06 | 2020-03-24 | 覃冬梅 | 一种侧边紧凑贴合的晶圆取放机械手 |
-
2020
- 2020-08-24 CN CN202010853899.7A patent/CN111916381B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4960485A (en) * | 1987-06-19 | 1990-10-02 | Enya Mfg. Co., Ltd. | Automatic wafer mounting device |
CN102738056A (zh) * | 2011-06-28 | 2012-10-17 | 清华大学 | 一种利用气缸伸缩的推杆式晶圆夹持装置 |
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CN111916381A (zh) | 2020-11-10 |
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PB01 | Publication | ||
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Effective date of registration: 20240522 Address after: No. 201 and 202, Building E4, Headquarters Economic Park, Yunlong Demonstration Zone, Zhuzhou City, Hunan Province, 412000 Applicant after: ZHUZHOU HONGYILONG INDUSTRIAL CO.,LTD. Country or region after: China Address before: 318050 side of Changpu village vegetable market, Lunan street, Luqiao District, Taizhou City, Zhejiang Province Applicant before: Taizhou Laolin Decoration Co.,Ltd. Country or region before: China |
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