CN111836458A - PCB high-flow power supply structure and PCB through-flow heightening process - Google Patents
PCB high-flow power supply structure and PCB through-flow heightening process Download PDFInfo
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- CN111836458A CN111836458A CN202010692517.7A CN202010692517A CN111836458A CN 111836458 A CN111836458 A CN 111836458A CN 202010692517 A CN202010692517 A CN 202010692517A CN 111836458 A CN111836458 A CN 111836458A
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- power supply
- pcb
- current
- conductor
- current conductor
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000008569 process Effects 0.000 title claims abstract description 25
- 239000004020 conductor Substances 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000008719 thickening Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a PCB high-current power supply structure which comprises a PCB substrate, a power supply through-current conductor arranged on the surface of the PCB substrate, and a thickened through-current coating which covers the surface of the power supply through-current conductor and is used for improving the through-current performance of the power supply through-current conductor. Therefore, the invention improves the through-current performance of the power supply through-current conductor by thickening the thickness of the power supply through-current conductor, so that the power supply through-current conductor can bear or transmit larger current, thereby improving the performance of the PCB power supply module and adapting to the PCB large-current application environment. Compared with the prior art, the PCB high-current power supply structure provided by the invention does not need to increase a PCB layer and occupy the wiring area on the surface of the PCB, so that the production cost can be reduced on the basis of improving the through-current capacity of the PCB power supply module, and the occupation of extra wiring space is avoided. The invention also discloses a PCB through-flow heightening process, which has the beneficial effects as described above.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a PCB high-current power supply structure. The invention also relates to a PCB through-flow heightening process.
Background
With the development of the electronic technology in China, more and more electronic devices have been widely used.
Servers are important components in electronic devices, and are devices that provide computing services. Since the server needs to respond to and process the service request, the server generally has the capability of assuming and securing the service. The server is divided into a file server, a database server, an application program server, a WEB server and the like according to different service types provided by the server.
In the big data era, a large number of IT devices are centrally located in a data center. These data centers include various types of servers, storage, switches, and a large number of cabinets and other infrastructure. Each IT device is composed of various hardware board cards, such as a computing module, a memory module, a storage module, a chassis and the like. The current data center generally refers to a server cabinet, and the servers are generally installed in the server cabinet in an integrated manner.
With the development of cloud computing applications, informatization gradually covers various fields of society. People's daily life more and more exchange through the network, and the network data volume is also increasing constantly, and is also higher to the performance requirement of server, and stability is also higher and higher, and the speed of upgrading is also faster and faster, and this has brought huge challenge to the research and development work, and in the change process of one generation and another generation, is also higher and higher to power consumption.
At present, in the design of a power module of a PCB, power taking and transmission are generally achieved through a copper conductor. If the power transmission through-current capacity of the power module is to be improved, the situation that the whole board needs to be added with a power supply part can be solved by directly adding the board layer of the PCB, but the whole thickness of the PCB is inevitably increased greatly. For the situation that large current is locally needed, if the PCB layer is also increased, the compensation is not carried out, and the cost is too high. Meanwhile, the current capacity can be improved by increasing the electricity taking area of the copper conductor, but the area of the copper sheet is increased, the design space on the PCB is narrow, the utilization rate is high, and the PCB wiring design is not facilitated.
Therefore, how to reduce the production cost and avoid occupying additional wiring space on the basis of improving the current capacity of the PCB power module is a technical problem faced by those skilled in the art.
Disclosure of Invention
The invention aims to provide a PCB high-current power supply structure which can reduce the production cost and avoid occupying extra wiring space on the basis of improving the current capacity of a PCB power supply module. Another object of the present invention is to provide a PCB through-flow heightening process.
In order to solve the technical problem, the invention provides a PCB high-current power supply structure which comprises a PCB substrate, a power supply through-current conductor arranged on the surface of the PCB substrate, and a thickened through-current coating which covers the surface of the power supply through-current conductor and is used for improving the through-current performance of the power supply through-current conductor.
Preferably, the surface area of the thickened current coating corresponds to the surface area of the power supply current conductor.
Preferably, the thickness of the thickened current coating is between 40% and 60% of the thickness of the power supply current conductor.
Preferably, the thickened throughflow coating is in particular a silver plating.
Preferably, the power supply current conductor is embodied as a copper plating.
The invention also provides a PCB through-flow heightening process, which comprises the following steps:
laying a power supply through-current conductor on the PCB substrate at a power supply area;
covering the area on the surface of the PCB substrate outside the power supply through-current conductor;
and laying a thickened current coating on the surface of the power supply current conductor.
Preferably, laying a power supply through-current conductor on the PCB substrate at the power supply area, specifically comprising:
copper is plated on the PCB substrate at the power supply area.
Preferably, the covering the area of the surface of the PCB substrate outside the power supply through-current conductor specifically includes:
the surface of the PCB substrate is completely covered by a dry film;
and opening a process window at the area of the dry film corresponding to the power supply through-current conductor so as to expose the power supply through-current conductor.
Preferably, a thickened current coating is applied to the surface of the power supply current conductor, in particular comprising:
silver is plated on the surface of the power supply through-current conductor.
The PCB high-current power supply structure mainly comprises a PCB substrate, a power supply through-current conductor and a thickened through-current coating. The PCB substrate is a bottom layer structure of the PCB and is mainly used for realizing wiring design and mounting other electronic components. The power supply through-current conductor is arranged on the surface of the PCB substrate, is a main component of the PCB power supply module, is mainly used for getting and transmitting electricity, and plays a role in through-current. The thickened through-flow coating covers the surface of the power supply through-flow conductor and is mainly used for improving the through-flow performance of the power supply through-flow conductor in a mode of thickening the thickness of the power supply through-flow conductor, so that the power supply through-flow conductor can bear or transmit larger current, the performance of a PCB power supply module is improved, and the power supply module is suitable for a PCB large-current application environment. Compared with the prior art, the PCB high-current power supply structure provided by the invention has the advantages that the through-current performance is improved by thickening the thickness of the through-current conductor of the power supply, a PCB layer does not need to be increased, and the wiring area on the surface of the PCB does not need to be occupied, so that the production cost can be reduced on the basis of improving the through-current capacity of the PCB power supply module, and the occupation of extra wiring space is avoided.
The PCB through-current heightening process mainly comprises three steps, wherein in the first step, a power through-current conductor is paved at the position of a power area on a PCB substrate, then in the second step, the area on the surface of the PCB substrate, which is positioned outside the power through-current conductor, is covered, and only the surface of the power through-current conduction is exposed, and finally in the third step, a thickened through-current coating is paved on the surface of the power through-current conductor, so that the through-current performance of the power through-current conductor is improved by thickening the thickness of the power through-current conductor, and the PCB through-current heightening process has the beneficial effects as.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
Fig. 2 is a schematic sectional view of a portion of the structure of fig. 1.
FIG. 3 is a flow chart of an embodiment of the present invention.
Wherein, in fig. 1-2:
PCB base plate-1, power through-current conductor-2, thickening through-current coating-3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
In one embodiment of the present invention, a PCB high-current power supply structure mainly comprises a PCB substrate 1, a power supply through-current conductor 2 and a thickened through-current coating 3.
The PCB substrate 1 is a bottom structure of the PCB and is mainly used for implementing wiring design and mounting other electronic components. In general, the PCB substrate 1 may have a rectangular structure, or may be cut as needed to reduce the surface area. Meanwhile, the PCB substrate 1 can also be an FPC so as to be convenient to mount in a narrow and complex mounting space and carry out an SMT surface mounting process.
The power supply through-current conductor 2 is arranged on the surface of the PCB substrate 1, is a main component of a PCB power supply module, is mainly used for getting and transmitting electricity and plays a role in through-current. In general, the power supply current conductor 2 may be a copper plating layer to be laid when the PCB is subjected to a surface copper plating process, and is generally rectangular or in a complex polygonal shape as required. Of course, the power supply current conductor 2 may also be a silver plated layer or the like.
The thickened through-flow coating 3 covers the surface of the power supply through-flow conductor 2 and is mainly used for improving the through-flow performance of the power supply through-flow conductor 2 in a mode of thickening the thickness of the power supply through-flow conductor 2, so that the power supply through-flow conductor 2 can bear or transmit larger current, the performance of a PCB power supply module is improved, and the power supply module is suitable for a PCB large-current application environment. In general, the thickened flow-through coating 3 can be embodied as a silver coating. Of course, the thickened flow-through coating 3 can also be a copper coating or the like.
Compared with the prior art, the PCB high-current power supply structure provided by the embodiment has the advantages that the through-current performance is improved through the thickness mode of the thickened power supply through-current conductor 2, the PCB layer does not need to be increased, the wiring area on the surface of the PCB does not need to be occupied, the production cost can be reduced on the basis of improving the through-current capacity of the PCB power supply module, and the extra wiring space is avoided to be occupied.
As shown in fig. 2, fig. 2 is a schematic sectional view of a portion of the structure of fig. 1.
In a preferred embodiment with regard to the thickened current coating 3, the surface area of the thickened current coating 3 can be comparable to the surface area of the power supply current conductor 2. In this way, the thickened current coating 3 covers the entire surface of the power supply current conductor 2 and is identical in shape. Of course, the surface area of the thickened current coating 3 can be suitably smaller than the surface area of the power supply current conductor 2, in which case the specific shape of the thickened current coating 3 can be flexibly adjusted as required.
In general, the thickness of the thickened current coating 3 may amount to 40% to 60%, for example 50%, of the thickness of the power supply current conductor 2. In particular, the thickness of the power supply current conductor 2 may be 1.6mil, while the thickness of the thickened current coating 3 may be 0.8 mil. With such an arrangement, the current capacity of the current conductor can be increased by about 50% theoretically after the thickened current coating 3 is applied.
As shown in fig. 3, fig. 3 is a flowchart of an embodiment of the present invention.
The embodiment also provides a through-flow heightening process of the PCB, which mainly comprises three steps, namely:
s1, laying a power supply through-current conductor 2 on the PCB substrate 1 at a power supply area;
s2, covering the area of the surface of the PCB substrate 1 outside the power supply through-current conductor 2;
s3, a thickened current coating 3 is applied to the surface of the power supply current conductor 2.
In the first step, the position of a power supply area on a PCB substrate 1 is determined in an electroplating process of a PCB manufacturing process, and then copper plating is carried out on the position in the electroplating process so as to lay a power supply through-current conductor 2 with a preset thickness;
in the second step, the area of the surface of the PCB substrate 1 outside the power supply current conductor 2 is covered, exposing only the surface of the power supply current conductor. Specifically, the surface of the PCB substrate 1 may be covered by a dry film or the like, and then a process window is opened at a region of the dry film corresponding to the power supply through-current conductor 2, so that the surface of the power supply through-current conductor 2 is exposed through the process window.
In a third step, the PCB substrate 1 may be placed in a copper plating bath for a secondary plating process to plate silver on the surface of the power supply current conductor 2, thereby laying the thickened current coating 3 on the surface of the power supply current conductor 2.
Of course, in the first step, silver plating may be performed on the surface of the PCB substrate 1, and in the third step, copper plating may be performed on the surface of the power supply through-current conductor 2.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The utility model provides a PCB high-pass current power supply structure, its characterized in that, including PCB base plate (1), set up in power through-flow conductor (2) on PCB base plate (1) surface, and cover in on power through-flow conductor (2) surface, be used for improving its through-flow performance's bodiness through-flow coating (3).
2. PCB high-flux power supply structure according to claim 1, characterized in that the surface area of the thickened through-flow coating (3) is comparable to the surface area of the power through-flow conductor (2).
3. PCB high-flux power supply structure according to claim 2, characterized in that the thickness of the thickened through-current coating (3) amounts to 40-60% of the thickness of the power through-current conductor (2).
4. PCB high-flux power supply structure according to claim 3, characterized in that the thickened through-flow coating (3) is in particular a silver plating.
5. PCB high-flux power supply structure according to claim 4, characterized in that the power supply through-current conductor (2) is in particular a copper plating.
6. A PCB through-flow heightening process is characterized by comprising the following steps:
laying a power supply through-current conductor (2) on a PCB substrate (1) at a power supply area;
covering the area of the surface of the PCB substrate (1) outside the power supply through-current conductor (2);
and laying a thickened current coating (3) on the surface of the power supply current conductor (2).
7. The PCB through-current heightening process according to claim 6, wherein a power through-current conductor (2) is laid on a PCB substrate (1) at a power area, and the process specifically comprises the following steps:
copper is plated on the PCB substrate (1) at the power supply area.
8. The PCB through-current heightening process according to claim 7, characterized in that covering an area on the surface of the PCB substrate (1) except the power through-current conductor (2) specifically comprises:
the surface of the PCB substrate (1) is fully covered by a dry film;
and arranging a process window at the region of the dry film corresponding to the power supply through-current conductor (2) so as to expose the power supply through-current conductor (2).
9. The PCB through-current heightening process according to claim 8, characterized in that a thickened through-current coating (3) is laid on the surface of the power supply through-current conductor (2), and specifically comprises the following steps:
silver is plated on the surface of the power supply through-current conductor (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010692517.7A CN111836458A (en) | 2020-07-17 | 2020-07-17 | PCB high-flow power supply structure and PCB through-flow heightening process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010692517.7A CN111836458A (en) | 2020-07-17 | 2020-07-17 | PCB high-flow power supply structure and PCB through-flow heightening process |
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| Publication Number | Publication Date |
|---|---|
| CN111836458A true CN111836458A (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010692517.7A Pending CN111836458A (en) | 2020-07-17 | 2020-07-17 | PCB high-flow power supply structure and PCB through-flow heightening process |
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| Country | Link |
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| CN (1) | CN111836458A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117391036A (en) * | 2023-12-12 | 2024-01-12 | 苏州元脑智能科技有限公司 | Printed circuit board simulation method, device, equipment and storage medium |
| CN117979542A (en) * | 2024-03-29 | 2024-05-03 | 苏州元脑智能科技有限公司 | Circuit board power supply structure and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813637A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN104080275A (en) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | Method for manufacturing stepped circuit board |
| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN105744735A (en) * | 2016-04-26 | 2016-07-06 | 广东欧珀移动通信有限公司 | Electronic equipment, printed circuit board and preparation method of printed circuit board |
-
2020
- 2020-07-17 CN CN202010692517.7A patent/CN111836458A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813637A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN104080275A (en) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | Method for manufacturing stepped circuit board |
| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN105744735A (en) * | 2016-04-26 | 2016-07-06 | 广东欧珀移动通信有限公司 | Electronic equipment, printed circuit board and preparation method of printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117391036A (en) * | 2023-12-12 | 2024-01-12 | 苏州元脑智能科技有限公司 | Printed circuit board simulation method, device, equipment and storage medium |
| CN117391036B (en) * | 2023-12-12 | 2024-03-12 | 苏州元脑智能科技有限公司 | Printed circuit board simulation method, device, equipment and storage medium |
| CN117979542A (en) * | 2024-03-29 | 2024-05-03 | 苏州元脑智能科技有限公司 | Circuit board power supply structure and manufacturing method |
| CN117979542B (en) * | 2024-03-29 | 2024-05-31 | 苏州元脑智能科技有限公司 | Circuit board power supply structure and manufacturing method |
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Application publication date: 20201027 |
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| RJ01 | Rejection of invention patent application after publication |