CN104080275A - Method for manufacturing stepped circuit board - Google Patents
Method for manufacturing stepped circuit board Download PDFInfo
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- CN104080275A CN104080275A CN201410089348.2A CN201410089348A CN104080275A CN 104080275 A CN104080275 A CN 104080275A CN 201410089348 A CN201410089348 A CN 201410089348A CN 104080275 A CN104080275 A CN 104080275A
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Abstract
The invention discloses a method for manufacturing a stepped circuit board, and belongs to the technical field of circuit board production processes. The method for manufacturing the stepped circuit board is characterized by comprising the following steps of (1) board cutting, (2) hole drilling, (2) primary pattern transfer, (4) graph electroplating, (5) film stripping, (6) secondary pattern transfer, (7) etching, (8) film stripping and (9) detection on whether the circuit width and the circuit distance of a circuit reach the standard or not. The method for manufacturing the stepped circuit board is simple in technological process, free of grinding boards, low in manufacturing cost and applicable to manufacturing stepped circuit boards.
Description
Technical field
The present invention relates to a kind of manufacture method of wiring board, more particularly, relate in particular to a kind of manufacture method of ladder wiring board.
Background technology
Along with printed wiring board is to the development of " light, thin, short, little " direction, the line design to electronic product and manufacture method require more and more higher, and traditional equal thickness fine-line printed wiring board has been difficult to meet the requirement of electron trade comprehensively.In order to adapt to electronic product diversification, modular development trend, so there is ladder circuit.The feature of ladder circuit is thick there are differences of copper that forms printed wiring board fine-line, between the circuit of zones of different because the thick difference of copper has certain gradient difference.
But, apply traditional fine-line technique and be difficult to prepare ladder wiring board, its technical difficult points comprises: (1) exists the thick gradient of copper because of plate face, in the time of rolling dry film, dry film against corrosion is difficult to form good laminating with plate face, causes etch phase to occur the quality defects such as open circuit, breach.(2) in etch phase, due to thick there are differences of zones of different circuit copper, cause under same etch condition, be difficult to ensure that the live width in the thick region of different Cu, line-spacing are all identical, affect the quality of product.(3) complex manufacturing technology, high cost, is not suitable for batch production.
Summary of the invention
The object of the invention is to for above-mentioned the deficiencies in the prior art, provide a kind of technological process simple, without the manufacture method of nog plate and the lower ladder wiring board of cost of manufacture.
Technical scheme of the present invention is achieved in that a kind of manufacture method of ladder wiring board, it is characterized in that, comprises the steps:
(1) substrate is carried out to sawing sheet and boring;
(2) to not needing to thicken region pressing protection dry film, the exposure imaging of copper on wiring board, realize the figure for the first time of wiring board is shifted; The object that figure shifts is for the first time that the region that need to thicken copper reveals;
(3) region that need to thicken copper through electro-coppering to wiring board thickeies;
(4) decorporate and be attached to the protection dry film on the region that does not need to thicken copper on surface of circuit board;
(5) wiring board moving back after film is applied to photosensitive-ink, realize figure for the second time through exposure, development and shift; Figure shifts and through the negative film film, line pattern is transferred on wiring board for the second time;
(6) carry out circuit etching with acid etching technique;
(7) decorporate and be attached to the photosensitive-ink on surface of circuit board;
(8) the live width line-spacing in the thick region of different Cu is measured.
In the manufacture method of above-mentioned a kind of ladder wiring board, the described pressing of step (2) protects the technological parameter of dry film to be: 105～125 DEG C of press mold temperature, and pressure 0.3～0.5Mpa, enters 90 ± 5 DEG C of plate temperatures, go out 55 ± 5 DEG C of plate temperatures, pad pasting speed 2.0～2.2m/min; Further, adopt LDI exposure machine to circuit board to explosure, realize figure and shift, the model of wherein protecting dry film is DG38, and thickness is 38 μ m, and the exposure energy of exposure machine is 10mJ～12mJ.
In the manufacture method of above-mentioned a kind of ladder wiring board, what step (3) was described need to thicken in the operation that the region of copper thickeies wiring board, and copper cylinder copper ion concentration is 85 ± 15 g/L, to the region that need to thicken copper with 1.2 A/dm
2current density electroplate 65～70 min, make electroplate thickening copper region thick 28～32 μ m that are controlled at of copper.During for fear of plating, produce high potential, ensure copper facing uniformity, while electroplating thickening copper, fixture need be clipped in one end of coverlay protection.
In the manufacture method of above-mentioned a kind of ladder wiring board, the technological parameter that applies photosensitive-ink in step (5) is: pan feeding transfer rate is 2.5 ± 0.5m/min, coating speed is 3.0 ± 0.5 m/min, and baking time is 10 m/min, and baking temperature is 95 ± 5 DEG C.
In the manufacture method of above-mentioned a kind of ladder wiring board, adopt LDI exposure machine to circuit board to explosure in step (5), exposure machine exposure energy is 10mJ～12mJ; In the time of exposure, to thick copper circuit region etching compensation 27 ± 0.5 μ m, the etching of thin copper wire region is compensated to 39 ± 0.5 μ m.The object of the thick different circuit of copper being carried out respectively to fine compensation is to ensure still to equate with the live width of the thick region of different Cu circuit after identical speed etching.
In the manufacture method of above-mentioned a kind of ladder wiring board, acid etching process using HCl～H that step (6) is described
20
2system, wherein HCl concentration is 2.0 ± 0.5 N, H
20
2concentration is 2.0 ± 0.5 N, and proportion is 1.28
0.05, in etching section, spraying pressure is 2.5 ± 0.5 kg/cm
2, lower spray pressure is 2.0 ± 0.5 kg/cm
2, 49～53 DEG C of temperature, etching speed is 2.3～2.7m/min.
The present invention adopts after said method, compared with prior art, has advantages of following:
(1) select liquid photosensitive ink, and by turning down pan feeding speed and coating speed, make liquid photosensitive ink fully be filled into ladder circuit drop place, ensure the quality of coating, avoid etching solution in etching process to infiltrate, the phenomenons such as the open circuit breach that is prone to the thick different drop place of copper, avoided using dry film technique to cause the plate upper thread road cannot be closely connected with dry film and the quality problem such as the line defct that causes.
(2) do not solve the terraced problem of locating drop of ladder circuit scala media by nog plate, avoided the quality defect problems such as meticulous circuit occurs opening circuit in nog plate operation, affect the reliability of electronic product.
(3) by the accurate etching Compensation Analysis to different-thickness circuit, determine the etching compensation rate of different-thickness circuit, the optimal compensation amount is applied in line design, has solved after etching the thick live width line-spacing phenomenon such as or not do not exist together of copper, ensured the quality of ladder circuit.
(4) to have flow process simple for preparation method of the present invention, and production cost is low, and the advantage that efficiency is high is particularly suitable for making circuit below 3mil, the ladder circuit of the thick extreme difference of copper more than one times.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, but do not form any limitation of the invention.
The manufacture method of a kind of ladder wiring board of the present invention, comprises the steps:
(1) substrate is carried out to sawing sheet and boring; Substrate is preferably platform light EM825, H/Hoz substrate;
(2) to not needing to thicken region pressing protection dry film, the exposure imaging of copper on wiring board, realize the figure for the first time of wiring board is shifted; Particularly, the technological parameter of pressing protection dry film is: 105～125 DEG C of press mold temperature, pressure 0.3～0.5Mpa, enters 90 ± 5 DEG C of plate temperatures, goes out 55 ± 5 DEG C of plate temperatures, pad pasting speed 2.0～2.2m/min.Adopt LDI (Laser direct imaging laser direct imaging technology) exposure machine to circuit board to explosure simultaneously; realizing figure shifts; the model of wherein protecting dry film is DG38, and thickness is 38 μ m, and the exposure energy of exposure machine is 10mJ～12mJ.
(3) region that need to thicken copper through electro-coppering to wiring board thickeies; In thickening process, control each parameter and be: copper cylinder copper ion concentration is 85 ± 15 g/L, to the region that need to thicken copper with 1.2 A/dm
2current density electroplate 65～70 min, make electroplate thickening copper region thick 28～32 μ m that are controlled at of copper.During for fear of plating, produce high potential, ensure copper facing uniformity, while electroplating thickening copper, fixture need be clipped in one end of coverlay protection.
(4) decorporate and be attached to the protection dry film on the region that does not need to thicken copper on surface of circuit board;
(5) wiring board moving back after film is applied to photosensitive-ink, realize figure for the second time through exposure, development and shift; Figure shifts and through the negative film film, line pattern is transferred on wiring board for the second time; Particularly, the technological parameter of coating photosensitive-ink is: pan feeding transfer rate is 2.5 ± 0.5m/min, and coating speed is 3.0 ± 0.5 m/min, and baking time is 10 m/min, and baking temperature is 95 ± 5 DEG C.Meanwhile, adopt LDI exposure machine to circuit board to explosure, exposure machine exposure energy is 10mJ～12mJ; In the time of exposure, to thick copper circuit region etching compensation 27 ± 0.5 μ m, the etching of thin copper wire region is compensated to 39 ± 0.5 μ m.The object of the thick different circuit of copper being carried out respectively to fine compensation is to ensure still to equate with the live width of the thick region of different Cu circuit after identical speed etching.
Can fully fit with plate face in order to ensure resist, prevent that in etch process, etching solution infiltration causes open circuit, the bad quality defect that waits of circuit, the present invention has adopted liquid photosensitive ink, and turned down pan feeding transfer rate and coating speed, so that liquid photosensitive ink is fully filled into the drop place of ladder circuit.
(6) carry out circuit etching with acid etching technique; Be specially: adopt HCl～H
20
2system, wherein HCl concentration is 2.0 ± 0.5 N, H
20
2concentration is 2.0 ± 0.5 N, and proportion is 1.28
0.05, in etching section, spraying pressure is 2.5 ± 0.5 kg/cm
2, lower spray pressure is 2.0 ± 0.5 kg/cm
2, 49～53 DEG C of temperature, etching speed is 2.3～2.7m/min.
(7) decorporate and be attached to the photosensitive-ink on surface of circuit board;
(8) the live width line-spacing in the thick region of different Cu is measured.
In above-mentioned each step, wherein step (1), (4), (7), (8) are the ordinary skill in the art.
Embodiment 1
Without a ladder circuit manufacturing technology for nog plate operation, with the example that is made as of common double panel, the region that in specific implementation process, wiring board need to be thickeied copper through figure transfer for the first time reveals, and electroplates thickening and meets the requirement that circuit copper is thick; When figure shifts for the second time, adopt liquid photosensitive ink to carry out respectively fine compensation as resist and to the circuit in the thick region of different Cu, to meet under acid etching condition, the thick region of different Cu live width line-spacing is the requirement of 3/3mil.
Manufacture method:
(1) sawing sheet: H/Hoz substrate is carried out to sawing sheet, sawing sheet size 468*412mm.
(2) boring: adopt machine drilling mode, to drilling holes on circuit board.
(3) figure shifts for the first time: employing model is DG38, and thickness is the dry film of 38 μ m, 105 DEG C of press mold temperature, and pressure 0.3 Mpa, speed 2.0 m/min, enter 90 DEG C of plate temperatures, go out 55 DEG C of plate temperatures, adopt LDI exposure machine to expose, exposure energy 10mJ; Above-mentioned wiring board is developed, appear and need to thicken copper region.
(4) graphic plating: copper cylinder copper ion concentration is controlled at 85 ± 15 g/L, with 1.2 A/dm
2current density electro-coppering 65 min, soleplate face copper is thick is 28 μ m.
(5) move back film: decorporate and do not need to thicken the protection dry film in copper region.
(6) figure shifts for the second time: applying liquid photosensitive-ink as its technological parameter of resist layer is: pan feeding transfer rate is 2.5m/min, and coating speed is 3.0m/min, and baking time is 10m/min, and baking temperature is 95 DEG C.Adopt the exposure of LDI exposure machine, exposure energy is controlled at 10mJ; Aforesaid substrate is developed.
(7) etching: acid etching process using HCl～H
20
2system, wherein HCl concentration is 2.0N, H
20
2concentration is 2.0 N, and proportion 1.28 sprays pressure 2.5 kg/cm in etching section
2, lower spray pressure 2.0 kg/cm
2, 49 DEG C of temperature, etching speed 2.7 m/min.
(8) move back film: the wet film adhering on the surface of circuit board of decorporating, reveals the ladder circuit of needs.
(9) AOI: whether the live width line-spacing of detection line is up to standard.
Embodiment 2
Without a ladder circuit manufacturing technology for nog plate operation, with the example that is made as of common double panel, the region that in specific implementation process, wiring board need to be thickeied copper through figure transfer for the first time reveals, and electroplates thickening and meets the requirement that circuit copper is thick; When figure shifts for the second time, adopt liquid photosensitive ink to carry out respectively fine compensation as resist and to the circuit in the thick region of different Cu, to meet under acid etching condition, the thick region of different Cu live width line-spacing is the requirement of 3/3mil.
Manufacture method:
(1) sawing sheet: platform light EM825 substrate is carried out to sawing sheet, sawing sheet size 468*412mm.
(2) boring: adopt machine drilling mode, to drilling holes on circuit board.
(3) figure shifts for the first time: employing model is DG38, and thickness is the dry film of 38 μ m, 115 DEG C of press mold temperature, pressure 0.4Mpa, speed 2.1m/min, enters 85 DEG C of plate temperatures, ejecting plate temperature 50 C, adopts LDI exposure machine to expose, and exposure energy is controlled at 11mJ; Above-mentioned wiring board is developed, appear and need to thicken copper region.
(4) graphic plating: copper cylinder copper ion concentration is controlled at 85 ± 15 g/L, with 1.2 A/dm
2current density electro-coppering 68min, soleplate face copper is thick is 30 μ m.
(5) move back film: decorporate and do not need to thicken the protection dry film in copper region.
(6) figure shifts for the second time: applying liquid photosensitive-ink as its technological parameter of resist layer is: pan feeding transfer rate is 2 m/min, and coating speed is 2.5m/min, and baking time is 10 m/min, and baking temperature is 90 DEG C.Adopt the exposure of LDI exposure machine, exposure energy is controlled at 11mJ; Aforesaid substrate is developed.
(7) etching: acid etching process using HCl～H
20
2system, wherein HCl concentration is 1.5N, H
20
2concentration is 1.5N, and proportion 1.23 sprays pressure 2.0kg/cm in etching section
2, lower spray pressure 1.5kg/cm
2 ?, temperature 50 C, etching speed 2.5m/min.
(8) move back film: the wet film adhering on the surface of circuit board of decorporating, reveals the ladder circuit of needs.
(9) AOI: whether the live width line-spacing of detection line is up to standard.
Embodiment 3
Without a ladder circuit manufacturing technology for nog plate operation, with the example that is made as of common double panel, the region that in specific implementation process, wiring board need to be thickeied copper through figure transfer for the first time reveals, and electroplates thickening and meets the requirement that circuit copper is thick; When figure shifts for the second time, adopt liquid photosensitive ink to carry out respectively fine compensation as resist and to the circuit in the thick region of different Cu, to meet under acid etching condition, the thick region of different Cu live width line-spacing is the requirement of 3/3mil.
Manufacture method:
(1) sawing sheet: platform light EM825 substrate is carried out to sawing sheet, sawing sheet size 468*412mm.
(2) boring: adopt machine drilling mode, to drilling holes on circuit board.
(3) figure shifts for the first time: employing model is DG38, and thickness is the dry film of 38 μ m, 125 DEG C of press mold temperature, pressure 0.5 Mpa, speed 2.2 m/min, enter 95 DEG C of plate temperatures, ejecting plate temperature 60 C, adopts LDI exposure machine to expose, and exposure energy is controlled at 12 mJ; Above-mentioned wiring board is developed, appear and need to thicken copper region.
(4) graphic plating: copper cylinder copper ion concentration is controlled at 85 ± 15 g/L, with 1.2 A/dm
2current density electro-coppering 70 min, soleplate face copper is thick is 32 μ m.
(6) move back film: decorporate and do not need to thicken the protection dry film in copper region.
(6) figure shifts for the second time: applying liquid photosensitive-ink as its technological parameter of resist layer is: pan feeding transfer rate is 3.0 m/min, and coating speed is 3.5 m/min, and baking time is 10 m/min, and baking temperature is 100 DEG C.Adopt the exposure of LDI exposure machine, exposure energy is controlled at 12 mJ; Aforesaid substrate is developed.
(7) etching: acid etching process using HCl～H
20
2system, wherein HCl concentration is 2.5N, H
20
2concentration is 2.5N, and proportion 1.33 sprays pressure 3.0kg/cm in etching section
2, lower spray pressure 2.5kg/cm
2 ?, 53 DEG C of temperature, etching speed 2.3 m/min.
(8) move back film: the wet film adhering on the surface of circuit board of decorporating, reveals the ladder circuit of needs.
(9) AOI: whether the live width line-spacing of detection line is up to standard.
Claims (7)
1. a manufacture method for ladder wiring board, is characterized in that, comprises the steps:
(1) substrate is carried out to sawing sheet and boring;
(2) to not needing to thicken region pressing protection dry film, the exposure imaging of copper on wiring board, realize the figure for the first time of wiring board is shifted;
(3) region that need to thicken copper through electro-coppering to wiring board thickeies;
(4) decorporate and be attached to the protection dry film on the region that does not need to thicken copper on surface of circuit board;
(5) wiring board moving back after film is applied to photosensitive-ink, realize figure for the second time through exposure, development and shift;
(6) carry out circuit etching with acid etching technique;
(7) decorporate and be attached to the photosensitive-ink on surface of circuit board;
(8) the live width line-spacing in the thick region of different Cu is measured.
2. the manufacture method of a kind of ladder wiring board according to claim 1; it is characterized in that; the described pressing of step (2) protects the technological parameter of dry film to be: 105～125 DEG C of press mold temperature; pressure 0.3～0.5Mpa; enter 90 ± 5 DEG C of plate temperatures; go out 55 ± 5 DEG C of plate temperatures, pad pasting speed 2.0～2.2m/min.
3. the manufacture method of a kind of ladder wiring board according to claim 1 and 2; it is characterized in that; in step (2), adopt LDI exposure machine to circuit board to explosure; realizing figure shifts; the model of wherein protecting dry film is DG38; thickness is 38 μ m, and the exposure energy of exposure machine is 10mJ～12mJ.
4. the manufacture method of a kind of ladder wiring board according to claim 1, it is characterized in that, what step (3) was described need to thicken in the operation that the region of copper thickeies wiring board, and copper cylinder copper ion concentration is 85 ± 15 g/L, to the region that need to thicken copper with 1.2 A/dm
2current density electroplate 65～70 min, make electroplate thickening copper region thick 28～32 μ m that are controlled at of copper.
5. the manufacture method of a kind of ladder wiring board according to claim 1, it is characterized in that, the technological parameter that applies photosensitive-ink in step (5) is: pan feeding transfer rate is 2.5 ± 0.5m/min, coating speed is 3.0 ± 0.5 m/min, baking time is 10 m/min, and baking temperature is 95 ± 5 DEG C.
6. a kind of manufacture method of ladder wiring board according to claim 1 or 5, is characterized in that, adopts LDI exposure machine to circuit board to explosure in step (5), and exposure machine exposure energy is 10mJ～12mJ; In the time of exposure, to thick copper circuit region etching compensation 27 ± 0.5 μ m, the etching of thin copper wire region is compensated to 39 ± 0.5 μ m.
7. the manufacture method of a kind of ladder wiring board according to claim 1, is characterized in that, acid etching process using HCl～H that step (6) is described
20
2system, wherein HCl concentration is 2.0 ± 0.5 N, H
20
2concentration is 2.0 ± 0.5 N, and proportion is 1.28
0.05, in etching section, spraying pressure is 2.5 ± 0.5 kg/cm
2, lower spray pressure is 2.0 ± 0.5 kg/cm
2, 49～53 DEG C of temperature, etching speed is 2.3～2.7m/min.
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|---|---|---|---|
| CN201410089348.2A CN104080275B (en) | 2014-03-12 | 2014-03-12 | A kind of preparation method of ladder wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410089348.2A CN104080275B (en) | 2014-03-12 | 2014-03-12 | A kind of preparation method of ladder wiring board |
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| CN104080275A true CN104080275A (en) | 2014-10-01 |
| CN104080275B CN104080275B (en) | 2018-02-09 |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470234A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Method for producing step copper-plated PCB |
| CN104507264A (en) * | 2014-12-31 | 2015-04-08 | 苏州福莱盈电子有限公司 | Technology for manufacturing 30-micron fine line |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
| CN105549550A (en) * | 2015-11-30 | 2016-05-04 | 北大方正集团有限公司 | Laser direct imaging data transferring method and device |
| CN107155264A (en) * | 2017-06-02 | 2017-09-12 | 江门崇达电路技术有限公司 | A kind of method for lifting alkali etching uniformity |
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN107660079A (en) * | 2017-09-06 | 2018-02-02 | 江门市泽天达科技有限公司 | A kind of etch process |
| CN107666781A (en) * | 2017-08-02 | 2018-02-06 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of circuit board |
| CN107683025A (en) * | 2017-11-01 | 2018-02-09 | 汕头凯星印制板有限公司 | A kind of manufacture method of the non-homogeneous copper thickness pcb board of same aspect |
| CN110167276A (en) * | 2019-05-31 | 2019-08-23 | 孙来庆 | A kind of production method of same layer mandarin duck copper circuit board |
| CN111836458A (en) * | 2020-07-17 | 2020-10-27 | 苏州浪潮智能科技有限公司 | PCB high-flow power supply structure and PCB through-flow heightening process |
| CN112654169A (en) * | 2020-11-09 | 2021-04-13 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with bending requirement |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470234A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Method for producing step copper-plated PCB |
| CN104507264A (en) * | 2014-12-31 | 2015-04-08 | 苏州福莱盈电子有限公司 | Technology for manufacturing 30-micron fine line |
| CN104507264B (en) * | 2014-12-31 | 2017-10-20 | 苏州福莱盈电子有限公司 | It is a kind of to be used for the manufacture craft of 30 microns of fine-lines |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
| CN105549550B (en) * | 2015-11-30 | 2018-02-02 | 北大方正集团有限公司 | Laser direct imaging data transfering method and device |
| CN105549550A (en) * | 2015-11-30 | 2016-05-04 | 北大方正集团有限公司 | Laser direct imaging data transferring method and device |
| CN107155264A (en) * | 2017-06-02 | 2017-09-12 | 江门崇达电路技术有限公司 | A kind of method for lifting alkali etching uniformity |
| CN107666781A (en) * | 2017-08-02 | 2018-02-06 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of circuit board |
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN107660079A (en) * | 2017-09-06 | 2018-02-02 | 江门市泽天达科技有限公司 | A kind of etch process |
| CN107683025A (en) * | 2017-11-01 | 2018-02-09 | 汕头凯星印制板有限公司 | A kind of manufacture method of the non-homogeneous copper thickness pcb board of same aspect |
| CN110167276A (en) * | 2019-05-31 | 2019-08-23 | 孙来庆 | A kind of production method of same layer mandarin duck copper circuit board |
| CN111836458A (en) * | 2020-07-17 | 2020-10-27 | 苏州浪潮智能科技有限公司 | PCB high-flow power supply structure and PCB through-flow heightening process |
| CN112654169A (en) * | 2020-11-09 | 2021-04-13 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with bending requirement |
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