CN111702862A - Adhesive tape cutting and attaching process with high utilization rate and die cutting machine - Google Patents
Adhesive tape cutting and attaching process with high utilization rate and die cutting machine Download PDFInfo
- Publication number
- CN111702862A CN111702862A CN202010602819.0A CN202010602819A CN111702862A CN 111702862 A CN111702862 A CN 111702862A CN 202010602819 A CN202010602819 A CN 202010602819A CN 111702862 A CN111702862 A CN 111702862A
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- Prior art keywords
- adhesive tape
- base film
- cutter
- cutting
- blade
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
- B26D2007/322—Means for performing other operations combined with cutting for conveying or stacking cut product the cut products being sheets, e.g. sheets of paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
- B26F2001/4427—Cutters therefor; Dies therefor combining cutting and forming operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
- B26F2001/4472—Cutting edge section features
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a high-utilization-rate adhesive tape cutting and attaching process and a die cutting machine, wherein the die cutting machine comprises a die holder, a feeding device, a cutter and a material moving device, wherein the cutter and the material moving device are positioned above the die holder; the feeding device feeds the adhesive tape above the base film material; the cutter comprises a first blade and a second blade, and the first blade is used for cutting the adhesive tape and enabling the adhesive tape to fall onto the release film; the second cutting edge is consistent with the outline of the base film of the product to be prepared and is used for punching the base film on the release film; the material moving device can move the base film material and move the adhesive tape cut by the first blade below the second blade. When a product is prepared, the adhesive tape is punched on the adhesive tape one by one through the cutter, so that adhesive tape waste is not required to be discharged, adhesive tape materials can be greatly saved, the utilization rate of the adhesive tape materials is greatly improved, and the cost is obviously reduced.
Description
Technical Field
The invention relates to the technical field of die cutting, in particular to a high-utilization-rate adhesive tape cutting and attaching process and a die cutting machine.
Background
In the die cutting industry, adhesive tapes are often required to be attached to release films according to requirements to form products required by customers. Fig. 1 shows a product with a glue strip comprising a glue strip 1 in the form of a strip (or rectangular block) and a base film 10 carrying the glue strip 1, the base film 10 being shown in the form of a rectangle having a larger dimension than the glue strip 1, which may be of other shapes. The positional accuracy of the adhesive tape 1 on the base film 10 is required to some extent, and for example, the distance L from the adhesive tape 1 to the left side edge 10a of the base film 10 is required to be relatively high.
In the prior art, when manufacturing the above product, as shown in fig. 2, a whole piece of adhesive tape 11 is usually covered on a release film 12, a protective film is arranged at the bottom of the release film 12, and the adhesive tape 1 is die-cut on the adhesive tape 11 by a first cutter, in which step the release film 12 is not cut; then, the adhesive tape waste 13 around the adhesive tape 1 is removed; after the adhesive tape waste 13 is removed, as shown in fig. 3, the release film 12 is punched again by the second cutter to form the base film 10 corresponding to the adhesive tape 1, that is, a product is formed, in this step, the protective film below the release film 12 is not cut, and then the release film waste 14 around the base film 10 can be discharged, so as to separate the product.
The prior art has the defects that a great amount of redundant adhesive tape waste 13 is generated in the manufacturing process, the larger the distance L1 between two adjacent adhesive tapes 1 is, the more the generated waste is, the lower the material utilization rate is, the material cannot be effectively saved, and the cost is reduced; in addition, it needs die-cut twice, and the shaping goes out adhesive tape 1 and base film 10 respectively, has increased the process on the one hand, is unfavorable for improving production efficiency, and on the other hand, the degree of difficulty of guaranteeing adhesive tape 1 position accuracy is great.
Disclosure of Invention
The invention aims to provide a high-utilization-rate adhesive tape cutting and attaching process and a die cutting machine aiming at the defects in the prior art, and the utilization rate of materials is higher when a product is prepared.
To achieve the above object, in one aspect, the present invention provides a die cutting machine, including:
the upper surface of the die holder is paved with a base film material, and the base film material comprises a protective film and a release film attached to the protective film;
a feeding device which feeds an adhesive tape above the base film material;
the cutter is positioned above the die holder and comprises a first blade and a second blade, and the first blade is used for cutting the adhesive tape and enabling the adhesive tape to fall onto the release film; the second cutting edge is consistent with the outline of the base film of the product to be prepared and is used for punching the base film on the release film;
and the material moving device can move the base film material and move the adhesive tape cut by the first blade below the second blade.
Further, feedway includes first blowing roller, first receipts material roller and distributor, be provided with the sticky tape material of lapping on the first blowing roller, the sticky tape material includes the basement membrane and attached sticky tape on the basement membrane, process behind the distributor, the basement membrane rolling extremely on the first receipts material roller, the sticky tape removes extremely base film material top.
Further, the material moving device comprises a second discharging roller and a second material receiving roller, a rolled base film material is arranged on the second discharging roller, and the base film material is rolled on the second material receiving roller after passing through the die holder.
Furthermore, an obtuse angle is formed between the bottom film and the adhesive tape which are separated by the distributing block.
Further, the lower end of the second blade exceeds the first blade, and the exceeding distance L4 is the same as the thickness D of the release film.
On the other hand, the invention also provides a high-utilization-rate adhesive tape cutting and attaching process, which comprises the following steps of:
step 1: laying a base film material on a flat surface;
step 2: moving a tape over the base film stock;
and step 3: driving a cutter to cut off part of the adhesive tape onto a release film of the base film material to form an adhesive tape; simultaneously, punching a base film on a release film on the periphery of the adhesive tape adjacent to the cut adhesive tape by the cutter;
and 4, step 4: driving the cutter to reset upwards, moving the base film material for a certain distance, wherein the distance is equal to the distance between two adjacent adhesive tapes, and simultaneously moving the adhesive tapes to the die holder for a distance of adhesive tape width;
and 5: repeating steps 3 and 4.
Further, the cutter comprises a first blade and a second blade, and the first blade is used for cutting the adhesive tape and enabling the adhesive tape to fall onto the release film; the second cutting edge is consistent with the outline of the base film of a product to be prepared and is used for punching the base film on the release film.
Further, the high-utilization-rate adhesive tape cutting and attaching process is implemented by the die cutting machine.
Compared with the prior art, the invention has the advantages that:
according to the high-utilization-rate adhesive tape cutting and attaching process and the die-cutting machine, when the product is prepared, the adhesive tapes are punched on the adhesive tapes one by one through the cutter, so that adhesive tape waste materials do not need to be discharged, adhesive tape materials can be greatly saved, the utilization rate of the adhesive tape materials is greatly improved, and the cost is obviously reduced. Meanwhile, when the cutter punches downwards at every time, the base film can be punched at the periphery of the adjacent adhesive tape when the adhesive tape is cut off, so that a product is manufactured, punching is not required to be performed twice, the production efficiency is higher, the productivity is improved, and the product competitiveness is improved.
Drawings
FIG. 1 is a schematic structural diagram of the product of the present invention.
Fig. 2 is a schematic view of a prior art die-cut adhesive tape strip in a single piece of tape attached to a release film.
Fig. 3 is a schematic view showing a state of the art in which a base film is die-cut outside a rubber strip.
Fig. 4 is a schematic view of the die cutting machine of the present invention.
Fig. 5 is a schematic structural view of the tape material of the present invention.
FIG. 6 is a schematic view of the structure of the base film material of the present invention.
Fig. 7 is an enlarged view of a portion I in fig. 4.
Fig. 8 is a schematic view of the structure of the cutter in the present invention.
FIG. 9 is a schematic view showing the positions of the first and second blades of the knife and the adhesive tape on the base film material in the present invention.
Fig. 10 is a schematic view of the present invention when the cutter punches the release film on the die holder downward.
Fig. 11 is a schematic view of the die cutting machine of the present invention with a third take-up roll.
Detailed Description
The present invention will be described in further non-limiting detail with reference to the following preferred embodiments and accompanying drawings.
The high-utilization-rate adhesive tape cutting and attaching process of the die cutting machine according to a preferred embodiment of the present invention uses the rolls of the adhesive tape 2 and the rolls of the base film 3 as raw materials and is manufactured using the die cutting machine shown in fig. 4.
Specifically, as shown in fig. 5, the adhesive tape material 2 includes a base film 20 and an adhesive tape 21 attached to the base film 20, where the base film 20 is typically a release film; as shown in fig. 6, the base film stock 3 includes a protective film 30 at the lowermost layer and a release film 31 attached to the protective film 30.
The die cutting machine comprises a feeding device, a material moving device, a die holder 43 and a cutter 44, wherein the feeding device is used for providing an adhesive tape 21 above the die holder 43, and specifically comprises a first discharging roller 4, a first receiving roller 41 and a distributing block 45; the material moving device comprises a second discharging roller 40 and a second receiving roller 42. The first discharging roller 4, the second discharging roller 40, the first receiving roller 41 and the second receiving roller 42 are controlled by servo motors to rotate, and the feeding length and the moving length can be accurately controlled by controlling the rotation of the motors.
As shown in fig. 4 and 7, the adhesive tape 2 is placed on a first discharging roller 4 of the die cutter, and discharged by the first discharging roller 4. The adhesive tape material 2 is discharged from the first discharging roller 4, passes through the distributing block 45, the bottom film 20 is separated from the adhesive tape 21 on the distributing block 45, and the separated bottom film 20 is wound by the first receiving roller 41. Preferably, the carrier film 20 and the adhesive tape 21 are separated from each other at an obtuse angle, so that they can be separated from each other at a large angle. In this embodiment, the distributor block 45 is provided with a supporting surface 450 and a separating surface 451, and the base film 20 passes through the supporting surface 450 and enters the first material receiving roller 41 along the separating surface 451 to be wound.
The distributing block 45 is disposed close to the die holder 43, the supporting surface 450 thereof is slightly higher than the upper surface of the base film 3 on the die holder 43, when the adhesive tape 21 is separated from the base film 20, the suspended adhesive tape 21 extends to the upper side of the die holder 43 and is close to the base film 3 on the die holder 43, and the suspended adhesive tape 21 is close to but not in contact with the base film 3, so that the adhesive tape 21 can be reliably conveyed.
The base film material 3 is placed on a second discharging roller 40 of the die cutter, and discharged by the second discharging roller 40. After the second discharging roller 40 discharges the base film material 3, the discharged base film material is drawn to the die holder 43 and is attached to and laid on the upper surface of the die holder 43.
The cutter 44 is fixed to the upper die of the die cutting machine and can be driven by the upper die to move up and down, so that the adhesive tape 21 and the base film material 3 at the die holder 43 are cut.
The cutter 44 includes a body 440 and first and second blades 441, 442 secured to the body 440.
The first blade 441 is used to cut the adhesive tape 21, and the cut adhesive tape 21 falls on the surface of the release film 31 of the base film material 3, i.e. to form the adhesive tape 1 of the product. Every time the cutter 44 cuts the adhesive tape 21, after the cutter 44 is reset, the first discharging roller 4 feeds the adhesive tape 2 with the length of the adhesive tape 1 and the width B, and meanwhile, the first receiving roller 40 winds the base film 20 with the length of the adhesive tape 1 and the width B, namely, the adhesive tape 21 with the length of the adhesive tape 1 and the width B is newly fed above the die holder 43 to prepare for next punching.
The second blade 442 is used to punch out the base film 10 on the release film 31, so that the shape and size of the blade thereof are consistent with the outer contour shape and size of the base film 10. Fig. 9 is a schematic view showing the positions of the first blade 441 and the second blade 442 on the base film material 3, in which the blade points of the first blade 441 and the second blade 442 are indicated by broken lines.
The distance L1 between two adjacent products on the protective film 30 can be set in advance, and the distance L3 between the second blade 442 and the first blade 441 is L1-L. In this way, after the first blade 441 cuts the adhesive tape 1, the base film material 3 moves by a distance L1, so that the adhesive tape 1 is located right below the second blade 442, and at this time, the distance from the left edge of the second blade 442 to the adhesive tape 1 is just L, and when the cutter 44 punches downward again, the second blade 442 punches out the desired base film 10 outside the adhesive tape 1. The moving distance of the base film material 3 can be controlled by the second discharging roller 40 and the second receiving roller 42.
The length H1 of the first cutting edge 441 is less than the length H2 of the second cutting edge 442, and the distance L4 of the lower end of the second cutting edge 442 beyond the first cutting edge 441 is H2-H1. As shown in fig. 10, when the cutter 44 undercuts to the bottommost portion, the second blade 442 just cuts the release film 31 without damaging the protective film 30, while the first blade 441 has cut the adhesive tape 21 and does not damage the release film 31. Preferably, the distance L4 is consistent with the thickness D of the release film 31.
After the cutter 44 cuts the base film 10 around the adhesive tape 1, the product 5 is formed, and the protective film 30 with the product 5 is wound on the second material receiving roller 42; or the unnecessary release film waste 20a around the base film 10 can be discharged before rolling as required, and at this time, as shown in fig. 11, only one third material receiving roller 46 needs to be arranged to roll the release film waste 20 a.
The high-utilization-rate adhesive tape cutting and attaching process comprises the following steps:
step 1: laying the base film material 3 on a flat surface;
in step 1, the flat surface is the upper surface of the die holder 43; the base film material 3 is discharged by a second discharging roller 40 of the die cutting machine, and is wound by a second receiving roller 42 after passing through the upper surface of a die holder 43.
Step 2: moving the tape 21 over the base film stock 3;
in step 2, the adhesive tape 21 is formed by peeling off the base film 20 from the adhesive tape 2, the adhesive tape 2 is discharged by the first discharging roller 4 of the die cutting machine, after passing through the distributing block 45 of the die cutting machine, the base film 20 is separated from the adhesive tape 21, the separated base film 20 is wound by the first receiving roller 41, and the adhesive tape 21 is moved to above the base film 3 at the die holder 43.
And step 3: driving a cutter 44 to cut off part of the adhesive tape 21 onto the release film 31 of the base film material 3 to form an adhesive tape 1, and simultaneously punching the base film 10 on the release film 31 at the periphery of the adhesive tape 1 adjacent to the adhesive tape 1 by the cutter 44;
the cutter 44 includes a first blade 441 and a second blade 442 for cutting the adhesive tape 21 and punching the base film 10, respectively.
And 4, step 4: the cutter 44 moves upwards to reset, the base film material 3 moves for a certain distance, the distance is equal to the distance between two adjacent adhesive tapes 1, and the adhesive tape 21 moves towards the die holder 43 for a distance of the width of one adhesive tape 1;
in step 4, the base film material 3 is driven to move by the second discharging roller 40 and the second receiving roller 42, and the adhesive tape 1 is driven to move by the first discharging roller 4 and the first receiving roller 41.
And 5: and repeating the steps 3 to 4.
According to the high-utilization-rate adhesive tape cutting and attaching process and the die-cutting machine, when the product is prepared, the adhesive tapes are punched on the adhesive tapes one by one through the cutter, so that adhesive tape waste materials do not need to be discharged, adhesive tape materials can be greatly saved, the utilization rate of the adhesive tape materials is greatly improved, and the cost is obviously reduced. Meanwhile, when the cutter punches downwards at every time, the base film can be punched at the periphery of the adjacent adhesive tape when the adhesive tape is cut off, so that a product is manufactured, punching is not required to be performed twice, the production efficiency is higher, the productivity is improved, and the product competitiveness is improved.
It should be noted that the above-mentioned preferred embodiments are merely illustrative of the technical concepts and features of the present invention, and are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (8)
1. A die cutting machine, characterized in that it includes:
the mould comprises a mould base (43), wherein a base film material (3) is laid on the upper surface of the mould base (43), and the base film material (3) comprises a protective film (30) and a release film (31) attached to the protective film (30);
a feeding device which feeds a tape (21) above the base film material (3);
a cutter (44) positioned above the die holder (43), wherein the cutter (44) comprises a first cutting edge (441) and a second cutting edge (442), and the first cutting edge (441) is used for cutting the adhesive tape (21) and enabling the adhesive tape to fall onto the release film (31); the second blade (442) is in accordance with the outline of the base film (10) of the product to be prepared and is used for punching the base film (10) on the release film (31);
a material moving device capable of moving the base film material (3) and moving the adhesive tape (21) cut by the first blade (441) to a position below the second blade (442).
2. The die cutting machine according to claim 1, characterized in that: the feeding device comprises a first discharging roller (4), a first receiving roller (41) and a distributing block (45), wherein a coiled adhesive tape material (2) is arranged on the first discharging roller (4), the adhesive tape material (2) comprises a bottom film (20) and an adhesive tape (21) attached to the bottom film (20), the adhesive tape material passes through the distributing block (45) and then is wound on the first receiving roller (41), and the adhesive tape (21) is moved to the position above the base film material (3).
3. The die cutting machine according to claim 1, characterized in that: the material moving device comprises a second discharging roller (40) and a second material receiving roller (42), wherein a coiled base film material (3) is arranged on the second discharging roller (40), and the base film material (3) is coiled on the second material receiving roller (42) after passing through the die holder (3).
4. The die cutting machine according to any one of claims 1 to 3, characterized in that: an obtuse angle is formed between the bottom film (20) and the adhesive tape (21) which are separated by the distributing block (45).
5. The die cutting machine according to any one of claims 1 to 3, characterized in that: the lower end of the second cutting edge (442) exceeds the first cutting edge (441), and the exceeding distance L4 is the same as the thickness D of the release film (31).
6. A high-utilization-rate adhesive tape cutting and attaching process is characterized by comprising the following steps:
step 1: laying a base film material (3) on a flat surface;
step 2: moving an adhesive tape (21) above the base film material (3);
and step 3: driving a cutter (44) to cut off part of the adhesive tape (21) onto a release film (31) of the base film material (3) to form an adhesive tape (1); simultaneously, the cutter (44) punches a base film (10) on a release film (31) on the periphery of the adhesive tape (1) adjacent to the cut adhesive tape (1);
and 4, step 4: the cutter (44) is driven to reset upwards, the base film material (3) is moved for a certain distance, the distance is equal to the distance between two adjacent adhesive tapes (1), and the adhesive tape (21) is moved for the distance of the width of one adhesive tape (1) to the die holder (43);
and 5: repeating steps 3 and 4.
7. The high-utilization-rate adhesive tape cutting and attaching process as claimed in claim 6, wherein: the cutter (44) comprises a first cutting edge (441) and a second cutting edge (442), wherein the first cutting edge (441) is used for cutting the adhesive tape (21) and enabling the adhesive tape to fall onto the release film (31); the second blade (442) is in line with the contour of the base film (10) of the product to be prepared and is used for punching out the base film (10) on the release film (31).
8. The high-utilization-rate adhesive tape cutting and attaching process as claimed in claim 6, wherein: the high-utilization adhesive tape cutting and attaching process is implemented by the die cutting machine according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010602819.0A CN111702862A (en) | 2020-06-29 | 2020-06-29 | Adhesive tape cutting and attaching process with high utilization rate and die cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010602819.0A CN111702862A (en) | 2020-06-29 | 2020-06-29 | Adhesive tape cutting and attaching process with high utilization rate and die cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111702862A true CN111702862A (en) | 2020-09-25 |
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ID=72544258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010602819.0A Withdrawn CN111702862A (en) | 2020-06-29 | 2020-06-29 | Adhesive tape cutting and attaching process with high utilization rate and die cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111702862A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112339018A (en) * | 2020-10-21 | 2021-02-09 | 深圳市伟铂瑞信科技有限公司 | VHB (very high frequency) square-shaped rubber asynchronous feeding seamless splicing processing technology |
| CN113023455A (en) * | 2021-03-12 | 2021-06-25 | 东莞市绿辉智能科技有限公司 | Foam-cotton-glue asynchronous die-cutting process |
| CN113619138A (en) * | 2021-08-10 | 2021-11-09 | 苏州安洁科技股份有限公司 | High-utilization-rate jump cutting waste suction process |
| CN114311145A (en) * | 2020-09-29 | 2022-04-12 | 昊佰电子科技（上海）有限公司 | Method for manufacturing foam die-cutting piece for preventing handle film from being stuck on material belt |
-
2020
- 2020-06-29 CN CN202010602819.0A patent/CN111702862A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311145A (en) * | 2020-09-29 | 2022-04-12 | 昊佰电子科技（上海）有限公司 | Method for manufacturing foam die-cutting piece for preventing handle film from being stuck on material belt |
| CN112339018A (en) * | 2020-10-21 | 2021-02-09 | 深圳市伟铂瑞信科技有限公司 | VHB (very high frequency) square-shaped rubber asynchronous feeding seamless splicing processing technology |
| CN113023455A (en) * | 2021-03-12 | 2021-06-25 | 东莞市绿辉智能科技有限公司 | Foam-cotton-glue asynchronous die-cutting process |
| CN113619138A (en) * | 2021-08-10 | 2021-11-09 | 苏州安洁科技股份有限公司 | High-utilization-rate jump cutting waste suction process |
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Application publication date: 20200925 |