CN111697153B - Light emitting device - Google Patents
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- CN111697153B CN111697153B CN201910199222.3A CN201910199222A CN111697153B CN 111697153 B CN111697153 B CN 111697153B CN 201910199222 A CN201910199222 A CN 201910199222A CN 111697153 B CN111697153 B CN 111697153B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Abstract
The invention provides a light emitting device. The light-emitting device comprises a first substrate, a pixel isolation structure, an electroluminescent structure and a second substrate, wherein the first substrate and the second substrate are arranged oppositely, the pixel isolation structure is arranged on the surface of the substrate, close to one side of the second substrate, of the first substrate, the surface of the substrate forms a plurality of sub-pixel regions which are isolated from each other through the pixel isolation structure, the electroluminescent structure is arranged in each sub-pixel region, a first region corresponding to the surface, away from one side of the first substrate, of the pixel isolation structure is arranged between the pixel isolation structure and the second substrate, the light-emitting device further comprises a water vapor blocking structure, and the water vapor blocking structure comprises a water vapor adsorption structure and/or a water vapor blocking structure which are arranged in the first region. The light-emitting device avoids the corrosion to the electroluminescent structure caused by the fact that the water vapor adsorption material enters the sub-pixel region formed by the isolation base body after being packaged in the prior art, thereby avoiding the influence on the performance of the device.
Description
Technical Field
The invention relates to the technical field of optics, in particular to a light-emitting device.
Background
Self-luminous display technology is receiving wide attention due to the characteristics of fast response, high contrast, ultra-thinness and the like, wherein organic electroluminescent display (OLED) has initiated a challenge to the dominance of Liquid Crystal Display (LCD), quantum dot light emitting display (QLED) with wider color gamut and lower manufacturing cost is followed, the self-luminous display panels are all sandwich structures with functional materials sandwiched between positive and negative electrodes, the functional materials generally comprise a plurality of functional film layers, including injection and transmission of holes, injection and transmission of electrons, and light emitting layers and the like, the thickness of the functional layers and the electrodes are all in nanometer level, and the functional layers and the electrodes are easily corroded by water and oxygen to be rapidly degraded, so that the generation of black spots of panel devices and the reduction of service life are caused. Therefore, a good encapsulation barrier against water oxygen is very critical.
There are two forms of packaging that are currently conventional: the plate glass is combined with a liquid desiccant, and the groove glass is combined with a solid drying sheet.
The former method is: the method comprises the steps of coating a packaging adhesive frame on packaged flat glass, coating a liquid desiccant in the frame, then pressing the frame with a substrate where a device is located, expanding the liquid desiccant to form a film in a low-vacuum environment, tightly attaching the flat glass to the substrate, and then packaging the device by using a UV (ultraviolet) curing packaging adhesive.
The manufacturing method of the latter is as follows: a sheet-shaped drying sheet is attached to a pit of groove glass (the depth of a common groove is 0.3 mm), the periphery of the pit is coated with UV glue, then the groove glass is attached to a substrate where a device is located, the device is packaged through UV curing packaging glue, the groove glass is expensive, the surface of plate glass needs to be etched to manufacture the groove, and the groove glass is difficult to use in a large area.
Disclosure of Invention
The invention mainly aims to provide a light-emitting device, which aims to solve the problems that the packaging mode of the light-emitting device in the prior art affects the performance of the device and the cost is high.
In order to achieve the above object, a light emitting device is provided, including a first substrate, a pixel isolation structure, an electroluminescent structure and a second substrate, the first substrate is disposed opposite to the second substrate, the pixel isolation structure is disposed on a surface of the first substrate on a side close to the second substrate, a plurality of sub-pixel regions isolated from each other are formed on the surface of the substrate through the pixel isolation structure, an electroluminescent structure is disposed in each sub-pixel region, a first region corresponding to a surface of a side far away from the first substrate with the pixel isolation structure is disposed between the pixel isolation structure and the second substrate, the light emitting device further includes a water vapor blocking structure, and the water vapor blocking structure includes a water vapor adsorption structure and/or a water vapor blocking structure disposed in the first region.
Furthermore, one side of the pixel isolation structure, which is far away from the first substrate, is provided with a first surface, the first surface is positioned in the first area, and the water vapor barrier structure covers all or part of the first surface; or the light-emitting device further comprises a first electrode layer, the first electrode layer is arranged on the surfaces of the pixel isolation structure and the electroluminescent structure, a second surface is arranged on one side, away from the first substrate, of the first electrode layer, the first area is the second surface, and the water vapor barrier structure covers all or part of the second surface.
Furthermore, the pixel isolation structure comprises at least one row of pixel isolation units arranged along the first direction, each pixel isolation unit surrounds the sub-pixel region, and adjacent pixel isolation units are connected.
Furthermore, the height of the water vapor barrier structure is 1-10 μm.
Further, the water vapor barrier structure is a water vapor barrier structure.
Further, a water vapor adsorption material is arranged in the water vapor blocking structure.
Further, the water vapor barrier structure is a water vapor adsorption structure, and the material forming the water vapor adsorption structure comprises a water vapor barrier material.
Furtherly, steam separation structure includes that steam adsorption structure and steam block the structure, and steam blocks that the structure forms the sealed wall in the outside in each first region, and steam adsorption structure sets up in the region that the sealed wall surrounds.
Further, the material forming the water vapor barrier structure comprises a curing glue, and the viscosity of the curing glue at 20 ℃ is preferably 5000-1000000 cps.
Further, the material forming the moisture adsorbing structure includes a liquid desiccant having a viscosity of 5000 to 1000000cps at 20 ℃.
Further, the pixel isolation structure comprises a plurality of pixel isolation units, and the surface of one side of at least one pixel isolation unit, which is far away from the first substrate, is provided with a concave part.
According to the technical scheme, a first area corresponding to the pixel isolation structure is arranged between the pixel isolation structure and the second substrate, and the light-emitting device further comprises a water vapor barrier structure arranged in the first area. The water vapor barrier structure is only correspondingly arranged above the isolation base body in the pixel isolation structure and is not contacted with the electroluminescent structure or the electrode layer in the sub-pixel region, so that the corrosion of the electroluminescent structure caused by the water vapor adsorption material entering the sub-pixel region formed by the isolation base body after being packaged in the prior art is avoided, and the influence on the performance of a device is avoided; in addition, the second substrate in the light-emitting device does not need to adopt a groove structure, so that the cost of the device is reduced; compared with a groove structure, the area for blocking water vapor is increased; due to the existence of the water vapor barrier structure, the pixel region can be effectively supported, and the buffer effect is better when the pixel region is stressed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic partial cross-sectional view illustrating a light emitting device according to an embodiment of the present invention;
fig. 2 is a schematic top view illustrating a pixel isolation structure including at least one row of pixel isolation units arranged along a first direction in a light emitting device according to an embodiment of the present invention;
fig. 3 is a schematic top view illustrating a water vapor adsorbing structure in a light emitting device according to an embodiment of the present invention;
fig. 4 is a schematic top view illustrating another water vapor adsorbing structure in the light emitting device according to the embodiment of the present invention;
fig. 5 is a schematic top view illustrating a water vapor adsorbing structure in a light emitting device according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional view illustrating a pixel isolation structure and a water vapor barrier structure in a light emitting device according to an embodiment of the present invention;
fig. 7 to 17 are schematic diagrams showing comparison of light emitting devices under a microscope in examples 1 to 7 of the present invention and comparative examples 1 to 3.
Wherein the figures include the following reference numerals:
10. a first substrate; 20. a pixel isolation structure; 210. a pixel isolation unit; 211. a first substrate segment; 212. a second substrate segment; 30. an electroluminescent structure; 40. a second substrate; 50. a water vapor barrier structure; 501. a water vapor adsorption structure; 502. a water vapor barrier structure; 60. a first electrode layer.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As described in the background, the packaging of light emitting devices in the prior art has an impact on device performance and is costly. The inventor of the present invention has studied the above problem, and proposes a light emitting device, as shown in fig. 1, which includes a first substrate 10, a pixel isolation structure 20, an electroluminescence structure 30, and a second substrate 40, where the first substrate 10 and the second substrate 40 are disposed opposite to each other, the pixel isolation structure 20 is disposed on a substrate surface of one side of the first substrate 10 close to the second substrate 40, the substrate surface forms a plurality of sub-pixel regions separated from each other by the pixel isolation structure 20, each sub-pixel region is provided with the electroluminescence structure 30, a first region corresponding to a surface of one side of the pixel isolation structure 20 away from the first substrate 10 is disposed between the pixel isolation structure 20 and the second substrate 40, the light emitting device further includes a water vapor blocking structure 50, and the water vapor blocking structure 50 includes a water vapor adsorption structure 501 and/or a water vapor blocking structure 502 disposed in the first region.
In the light-emitting device, the water vapor barrier structure is only correspondingly arranged above the isolation base body in the pixel isolation structure and is not contacted with the electroluminescent structure or the electrode layer in the sub-pixel region, so that the phenomenon that the water vapor adsorption material enters the sub-pixel region formed by the isolation base body to corrode the electroluminescent structure after being packaged in the prior art is avoided, and the influence on the performance of the device is avoided; in addition, the second substrate in the light-emitting device does not need to adopt a groove structure, so that the cost of the device is reduced; compared with a groove structure, the area for blocking water vapor is increased; due to the existence of the water vapor barrier structure, the pixel region can be effectively supported, and the buffer effect is better when the pixel region is stressed.
In the light emitting device of the present invention, the water vapor adsorbing structure 501 and the water vapor blocking structure 502 are both disposed in the first region between the pixel isolation structure 20 and the second substrate 40, and both of them may be in direct contact with the second substrate 40, as shown in fig. 1, the water vapor adsorbing structure 501 and the water vapor blocking structure 502 may not be in contact with the second substrate 40, and at this time, the second substrate 40 is disposed on one side of the pixel isolation structure 20 away from the first substrate 10 through other supporting structures.
The light emitting device may further include a first electrode layer 60, the first electrode layer 60 may be disposed only on the surface of the electroluminescent structure 30, where a side of the pixel isolation structure 20 away from the first substrate 10 has a first surface, the first surface is located in the first region, and the moisture blocking structure 50 covers all or part of the first surface; alternatively, the first electrode layer 60 may be disposed on the surfaces of the pixel isolation structure 20 and the electroluminescent structure 30, and a side of the first electrode layer 60 away from the first substrate 10 has a second surface, the first region is the second surface, and the moisture barrier structure 50 covers all or part of the second surface.
In the light emitting device of the present invention, the pixel isolation structure 20 includes at least one row of pixel isolation units 210 (composed of isolation substrates) arranged along the first direction, each pixel isolation unit 210 surrounds the sub-pixel region, adjacent pixel isolation units 210 are connected, and the water vapor barrier structure 50 is located in the first region, as shown in fig. 2 to 5. Preferably, the height of the water vapor barrier structure 50 is 1 to 10 μm. The preferred height range enables a smaller gap between the first substrate 10 and the second substrate 40, which enables the device to have a thinner thickness, thereby facilitating the application of the end product; in addition, since the first substrate 10 and the second substrate 40 are generally bonded by the UV glue, on one hand, the larger the gap means that the glue is thicker, the area of attack by external water and oxygen is easily enlarged, and the probability of being broken is increased, so that the smaller gap can effectively reduce the corrosion of external water and oxygen, and on the other hand, the smaller gap means that less UV sealing glue is used, thereby reducing the cost.
And, preferably, the spread line width of the water vapor barrier structure 50 on the narrow-side cross section of the pixel isolation unit 210 is 5 to 50 μm. The preferable line width range enables the width of the water vapor barrier structure 50 to be less than or equal to the width of the narrow side of the pixel isolation unit 210 in the prior art, so that the water vapor barrier structure 50 can be stably disposed on the pixel isolation structure 20 without overflowing from the pixel isolation structure 20. Each of the pixel isolation units 210 described above may be divided into two first base segment 211 and two second base segment 212, and the first base segment 211 and the second base segment 212 are alternately connected around the sub-pixel region, as shown in fig. 2. The shape of the first body segment 211 and the two second body segments 212 described above can be chosen appropriately by the person skilled in the art according to the prior art.
The first substrate segment 211 and the second substrate segment 212 may be arc segments, which are connected to form a circular or elliptical pixel isolation unit 210; the first substrate segment 211 and the second substrate segment 212 may be straight segments and connected at an angle, for example, the first substrate segment 211 is arranged in parallel along the first direction, the second substrate segment 212 is arranged in parallel along the second direction, the second direction is perpendicular to the first direction, and the first substrate segment 211 and the second substrate segment 212 are connected to each other to form a rectangular pixel isolation unit 210.
At this time, the above-mentioned water vapor barrier structures 50 may be all located in the first region, and at this time, the water vapor barrier structures 50 have a shape similar to or consistent with the surface of the pixel isolation structure 20, as shown in fig. 3; the moisture barrier structure 50 may also be partially located in the first region, and the moisture absorbing structure 50 is located in a portion of the first surface corresponding to the first substrate, as shown in fig. 4; alternatively, the above-described moisture adsorbing structure 50 is located in a portion of the first surface corresponding to the second substrate, as shown in fig. 5. The water vapor adsorption structure 50 is not limited to the two setting manners, and the water vapor adsorption structure 50 may also be any discontinuous lines, that is, any combination of the lines may be used, and the lines may have random lengths and distribution manners.
In a preferred embodiment, the water vapor barrier structure 50 is a water vapor barrier structure 502. At this time, the water vapor blocking structure 502 is respectively connected with the pixel isolation structure 20 and the second substrate 40 to form a sealing structure surrounding the sub-pixel region, so that the sub-pixel region forms a closed region to realize physical blocking of water vapor. More preferably, a water vapor adsorbing material is disposed in the water vapor blocking structure 502 to provide a chemical adsorption effect to the water vapor blocking structure 502, so as to improve a water vapor blocking effect.
In another preferred embodiment, the water vapor barrier structure 50 is a water vapor adsorbing structure 501, and the material forming the water vapor adsorbing structure 501 includes a water vapor barrier material. The water vapor adsorption structure 501 can be disposed on a side surface of the pixel isolation structure 20 away from the first substrate 10, and the chemical adsorption performance of the water vapor adsorption structure 501 can separate water vapor.
In a preferred embodiment, the moisture barrier structure 50 includes a moisture absorbing structure 501 and a moisture blocking structure 502, the moisture blocking structure 502 forms a sealing wall outside each first region, and the moisture absorbing structure 501 is disposed inside the sealing wall, as shown in fig. 6. At this time, the above-mentioned water vapor barrier structure 50 can simultaneously realize the physical barrier and chemical adsorption effects on water vapor.
In the above preferred embodiment, the material forming the moisture blocking structure 502 may include a curing adhesive, the curing adhesive may be selected from any one of a UV curing adhesive, a thermosetting adhesive and a dual curing adhesive, and the material forming the moisture adsorbing structure 501 may include a liquid desiccant. When the moisture barrier 50 includes both a cured adhesive and a liquid desiccant, the application may include: the method comprises the steps of firstly applying curing glue, forming a limited area for the liquid desiccant after the glue is cured, and then applying the liquid desiccant.
In order to stably arrange the water vapor blocking structure 502 and/or the water vapor adsorbing structure 501 in the first region, it is more preferable that the viscosity of the curing glue at 20 ℃ is 5000 to 1000000cps; and the viscosity of the liquid desiccant at 20 ℃ is 5000-1000000 cps. In some embodiments, the above application method is ink-jet printing, and the above material with high viscosity cannot discharge ink at normal temperature, but can discharge ink at high temperature by heating through a pipeline and a nozzle, and the drop falling temperature is reduced, the viscosity is increased, and the material can be well fixed on the water vapor barrier structure 50. Since the pixel defining structure material is generally a resin and has a small surface energy, in some cases, the spreading of the ink droplets can be further restricted by appropriately adding a surface tension-increasing component to the curable adhesive and the desiccant component, so that the ink droplets can be stably deposited in the first region.
In a preferred embodiment, the pixel isolation structure 20 includes a plurality of pixel isolation units 210, and a surface of a side of at least one pixel isolation unit 210 away from the first substrate 10 has a concave portion. The recess facilitates the attachment arrangement of the water vapour barrier 50.
The above light-emitting device of the present invention will be further described with reference to examples.
Example 1
As shown in fig. 1, the light emitting device provided in this embodiment includes a first substrate 10, a pixel isolation structure 20, an electroluminescent structure 30, and a second substrate 40, where the first substrate 10 and the second substrate 40 are disposed opposite to each other, the pixel isolation structure 20 is disposed on a substrate surface of one side of the first substrate 10 close to the second substrate 40, the substrate surface forms a plurality of sub-pixel regions isolated from each other through the pixel isolation structure 20, and an electroluminescent structure 30 is disposed in each sub-pixel region, where a first region corresponding to a surface of one side of the pixel isolation structure 20 away from the first substrate 10 is disposed between the pixel isolation structure 20 and the second substrate 40. The first substrate 10 is a TFT substrate, and the second substrate 40 is a flat glass.
The light emitting device further includes a water vapor blocking structure 50, the water vapor blocking structure 50 includes a water vapor adsorbing structure 501 disposed in the first region, and a material forming the water vapor adsorbing structure 501 includes a liquid desiccant (fulaba, oleDry-F type), and the viscosity of the liquid desiccant is about 100000cps at 20 ℃.
Example 2
The present embodiment provides a light emitting device different from embodiment 1 in that:
the liquid desiccant (OleDry-F type, futaba) has a viscosity of about 500000cps at 20 deg.C.
Example 3
The present embodiment provides a light emitting device different from embodiment 1 in that:
the viscosity of the liquid desiccant (OleDry-F type, futaba) at 20 deg.C is about 1000000cps.
Example 4
The present embodiment provides a light emitting device different from embodiment 1 in that:
the water vapor barrier structure 50 includes a water vapor barrier structure 502 disposed in the first region, and the material forming the water vapor barrier structure 502 may include a UV curable glue (Saes) having a viscosity of 200000cps at 20 ℃.
Example 5
The present embodiment provides a light emitting device different from embodiment 4 in that:
the viscosity of the UV-curable glue (AqvaDry model, saes) was about 5000cps at 20 ℃.
Example 6
The present embodiment provides a light emitting device different from embodiment 4 in that:
the viscosity of the UV-curable glue (ZeoGlue type, saes) was about 1000000cps at 20 ℃.
Example 7
The present embodiment provides a light emitting device different from embodiment 1 in that:
the water vapor blocking structure 50 includes a water vapor adsorption structure 501 and a water vapor blocking structure 502 disposed in the first region, the water vapor blocking structure 50 includes the water vapor adsorption structure 501 and the water vapor blocking structure 502, the water vapor blocking structure 502 forms a sealing wall outside each first region, the water vapor adsorption structure 501 is disposed inside the sealing wall, as shown in fig. 6, the material forming the water vapor adsorption structure 501 includes a liquid desiccant (OleDry-F type, futaba), the viscosity of the liquid desiccant at 20 ℃ is about 5000cps, the material forming the water vapor blocking structure 502 may include a UV curable adhesive (zeogue type, saes), and the viscosity of the curable adhesive at 20 ℃ is 200000cps.
Comparative example 1
The present comparative example provides a light emitting device different from example 1 in that the above-described water vapor barrier structure is not provided.
Comparative example 2
The light-emitting device provided by the comparative example is different from the light-emitting device provided by embodiment 1 in that the light-emitting device does not have the above-mentioned water vapor barrier structure, the second substrate 40 is groove glass, a patch desiccant (DryFlex, saes) is attached in a pit of the groove glass, UV glue is coated around the pit, the groove glass is attached to the first substrate 10, and the UV curing packaging glue is used for completing the packaging of the device.
Comparative example 3
The light-emitting device provided in this comparative example is different from that of example 1 in that the above-described water vapor barrier structure is not provided, the second substrate 40 is a flat glass, a frame of an encapsulation adhesive is coated on the flat glass, a liquid desiccant (OleDry-F type, futaba) is coated in the frame, and then the frame is pressed on the substrate on which the device is located, the liquid desiccant is spread to form a film in a low vacuum environment, the flat glass is tightly attached to the substrate, and the encapsulation adhesive is UV-cured to complete encapsulation of the device.
After the 100ppi pixel light-emitting device was constructed by the packaging process in examples 1 to 7 and comparative examples 1 to 3 described above, it was placed under an L200ND microscope to observe black spots (black spot observation was divided into two times: initial one time, and after one time of standing at 60 ℃ and 80 rh for 1000 hours), whether or not the device had black spots and changes thereof with time was observed, and microscopic views were obtained as shown in fig. 7 to 17, in which fig. 7 is a microscopic view of the light-emitting device in examples 1 to 7 and comparative examples 1 to 3 at the initial light emission, and fig. 8 to 17 are microscopic views of the light-emitting device in examples 1 to 7 and comparative examples 1 to 3 after 1000 hours at 60 ℃ and 80 rh, respectively.
Referring to fig. 7 to 17, it can be seen from the change of the black spot of the light emitting device before and after the aging at high temperature and high humidity that comparative example 1 without the drying agent has a large amount of black spots, and especially the sensitive blue sub-pixel has very dim light emission; comparative example 3 adopts the combination of plate glass and liquid desiccant, and after aging, more black spots are generated; also, the desiccant used in comparative example 3 is the same as examples 1-3 and example 7, and it can be seen that additional corrosive black spots can be generated by directly contacting the desiccant with the device; comparative example 2 employs a combination of a well lid and a patch desiccant, which is inferior or comparable to the above example in black dot, but well glass is expensive and fragile when used over a large area, and is difficult to popularize. It can be seen that the light-emitting devices in embodiments 1 to 7 can effectively prevent moisture corrosion, and avoid the influence of the moisture corrosion on the device performance caused by the electroluminescent structure.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:
the water vapor barrier structure is only correspondingly arranged above the isolation base body and is not contacted with the electroluminescent structure or the electrode layer in the sub-pixel region, so that the corrosion of the electroluminescent structure caused by the water vapor adsorption material entering the sub-pixel region formed by the isolation base body after being packaged in the prior art is avoided, and the influence on the performance of a device is avoided; in addition, the second substrate in the light-emitting device does not need to adopt a groove structure, so that the cost of the device is reduced; compared with a groove structure, the area for blocking water vapor is increased; due to the existence of the water vapor barrier structure, the pixel region can be effectively supported, and the buffer effect is better when the pixel region is stressed.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A light emitting device comprising a first substrate (10), a pixel isolation structure (20), an electroluminescent structure (30) and a second substrate (40), wherein the first substrate (10) and the second substrate (40) are oppositely arranged, the pixel isolation structure (20) is arranged on the substrate surface of one side of the first substrate (10) close to the second substrate (40), the substrate surface forms a plurality of sub-pixel regions separated from each other through the pixel isolation structure (20), the electroluminescent structure (30) is arranged in each sub-pixel region, the light emitting device is characterized in that a first region corresponding to the surface of one side of the pixel isolation structure (20) far away from the first substrate (10) is arranged between the pixel isolation structure (20) and the second substrate (40), the light emitting device further comprises a water vapor barrier structure (50), and the water vapor barrier structure (50) comprises a water vapor adsorption structure (501) and/or a water vapor barrier structure (502) arranged in the first region,
the side, away from the first substrate (10), of the pixel isolation structure (20) is provided with a first surface, the first surface is located in the first area, and the water vapor barrier structure (50) covers all or part of the first surface; or
The light-emitting device further comprises a first electrode layer (60), the first electrode layer (60) is arranged on the surfaces of the pixel isolation structure (20) and the electroluminescent structure (30), one side, far away from the first substrate (10), of the first electrode layer (60) is provided with a second surface, the first area is the second surface, the water vapor barrier structure (50) covers all or part of the second surface,
the water vapor blocking structure (50) comprises a water vapor adsorption structure (501) and a water vapor blocking structure (502), the water vapor blocking structure (502) forms a sealing wall on the outer side of each first area, and the water vapor adsorption structure (501) is arranged in an area surrounded by the sealing walls.
2. A light-emitting device according to claim 1, wherein the pixel isolation structure (20) comprises at least one row of pixel isolation units (210) arranged along a first direction, each pixel isolation unit (210) surrounding the sub-pixel region, adjacent pixel isolation units (210) being connected.
3. The light-emitting device according to any one of claims 1 to 2, wherein the height of the water vapor barrier structure (50) is 1 to 10 μm.
4. A light emitting device according to any of claims 1-2, characterized in that the water vapor barrier structure (50) is a water vapor barrier structure (502).
5. The light emitting device of claim 4, wherein a water vapor adsorbing material is disposed in the water vapor blocking structure (502).
6. A light emitting device according to any of claims 1 to 2, wherein the water vapor barrier structure (50) is a water vapor adsorbing structure (501), and the material forming the water vapor adsorbing structure (501) comprises a water vapor barrier material.
7. A light emitting device according to any of claims 1-2, characterized in that the material forming the moisture barrier structure (502) comprises a cured glue, preferably having a viscosity of 5000-1000000 cps at 20 ℃.
8. A light emitting device according to any of claims 1-2, characterized in that the material forming the moisture adsorbing structure (501) comprises a liquid desiccant having a viscosity of 5000-1000000 cps at 20 ℃.
9. A light emitting device according to claim 1, wherein said pixel isolation structure (20) comprises a plurality of pixel isolation units (210), and a surface of a side of at least one of said pixel isolation units (210) remote from said first substrate (10) has a recess.
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| CN106340597A (en) * | 2016-08-31 | 2017-01-18 | 纳晶科技股份有限公司 | Light emitting device |
| CN107819081A (en) * | 2016-12-05 | 2018-03-20 | 纳晶科技股份有限公司 | Encapsulating structure, method for packing and optoelectronic device |
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| DE102004031109B4 (en) * | 2003-12-30 | 2016-03-31 | Lg Display Co., Ltd. | Organic double-plate type luminescent display and method of making same |
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