US20160293886A1 - Organic light-emitting diode (oled) display panel and manufacturing method thereof - Google Patents
Organic light-emitting diode (oled) display panel and manufacturing method thereof Download PDFInfo
- Publication number
- US20160293886A1 US20160293886A1 US14/769,323 US201414769323A US2016293886A1 US 20160293886 A1 US20160293886 A1 US 20160293886A1 US 201414769323 A US201414769323 A US 201414769323A US 2016293886 A1 US2016293886 A1 US 2016293886A1
- Authority
- US
- United States
- Prior art keywords
- sealant
- substrate
- display panel
- oled
- panel according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H01L51/5256—
-
- H01L27/32—
-
- H01L51/56—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2101/00—Properties of the organic materials covered by group H10K85/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
Definitions
- Embodiments of the present invention relate to a method for manufacturing an organic light-emitting diode (OLED) display panel and the OLED display panel.
- OLED organic light-emitting diode
- OLED display panel has become new-generation display technology due to the advantages of self-luminous property, wide viewing angle, high contrast, rapid response speed, etc.
- the basic structure of an OLED generally comprises: a substrate, a first electrode layer, a second electrode layer, a light emitting layer (EML) and a cover.
- An organic functional layer on the substrate is sealed by the cover and a sealant so as to avoid the deterioration of the device performances and the service life due to the external environment (water, oxygen).
- a sealant in contact with the OLED is generally required to have low viscosity and high water resistance simultaneously, so that good package property can be guaranteed without damaging devices.
- low viscosity and high water resistance are actually conflictive in general and it is difficult for one sealing material to have the above two properties at the same time.
- At least one embodiment of the present invention provides an OLED display panel and a manufacturing method thereof, which can ensure that a package structure of an OLED has good package property without damaging devices.
- At least one embodiment of the present invention provides a method for manufacturing an OLED display panel.
- the method comprises: providing a first substrate and a second substrate, in which the first substrate is provided with an OLED layer; coating a first sealant on a surface of the OLED layer so as to cover the surface of the OLED layer; coating a second sealant on a surface of the second substrate and coating a third sealant outside the second sealant on the surface of the second substrate, in which the first sealant has a viscosity less than that of the second sealant; and pressing the first substrate and the second substrate together and performing curing to allow the second sealant to cover the first sealant and fill a gap among the first substrate, the second substrate and the third sealant.
- At least one embodiment of the present invention further provides an OLED display panel, which comprises: a first substrate and a second substrate arranged opposite to each other; an OLED layer formed on the first substrate; a first sealant coated on a surface of the OLED layer; a second sealant coated on a surface of the second substrate; and a third sealant coated outside the second sealant on the surface of the second substrate.
- the first sealant has a viscosity less than that of the second sealant; the second sealant covers the first sealant and fills a gap among the first substrate, the second substrate and the third sealant; and the third sealant seals the second sealant.
- FIG. 1 is a schematic diagram of a method for manufacturing an OLED display panel according to an embodiment of the present invention
- FIG. 2 is a schematic diagram illustrating a sealing process of an OLED display panel according to an embodiment of the present invention.
- FIG. 3 is a schematic structural view of an OLED display panel according to an embodiment of the present invention.
- FIG. 1 is a schematic diagram of a method for manufacturing an OLED display panel according to an embodiment of the present invention.
- a method for manufacturing the OLED display panel comprises: step S 1 : providing a first substrate and a second substrate, in which the first substrate is provided with an OLED layer; step S 2 : coating a first sealant on a surface of the OLED layer so as to cover the surface of the OLED layer; step S 3 : coating a second sealant on a surface of the second substrate and coating a third sealant outside the second sealant on the surface of the second substrate, in which the first sealant has a viscosity less than that of the second sealant; and step S 4 : pressing the first substrate and the second substrate together and performing curing to allow the second sealant to cover the first sealant and fill a gap among the first substrate, the second substrate and the third sealant.
- the steps S 2 and S 3 have no sequence limitation and may be executed simultaneously or sequentially no matter which is performed first; and meanwhile, the coating of the second sealant and the coating of the third sealant also have no sequence limitation and may be performed simultaneously or sequentially no matter which is performed first.
- the method for manufacturing the OLED display panel may further comprise other processes which may be achieved by the prior art and are not directly relevant to the technical solutions in the above embodiments. No further description will need to be given here.
- the first sealant is a sealing material with a viscosity of 10 cp to 20 cp
- the second sealant is a water-resistant or water-absorbing material with a viscosity of more than 50 cp.
- the first sealant comprises at least one selected from the group consisting of polyolefin material, olefinic alcohol material and polyester material.
- the second sealant comprises at least one selected from the group consisting of glass cement material, UV glue material, acrylic resin material and epoxy resin material.
- Ultra-low viscosity materials such as polyolefin material, olefinic alcohol material or polyester material are taken as a sealant directly contacting the OLED layer. Compared with the case that high-viscosity materials directly contact the OLED layer, the ultra-low viscosity materials can ensure that the tension produced on a contact surface between the sealant and the OLED layer in the curing process is low, and hence can greatly reduce the damage to the OLED layer.
- a high-viscosity sealant is adopted to cover periphery of the first sealant can ensure that a sealing structure has good water-resistant or water-absorbing property and prevents external moisture from passing through the second sealant, so that the first sealant keeps the OLED layer sealed and at the same time is not permeated by the external moisture.
- the third sealant is adopted to seal the second sealant, so that the sealing structure can obtain better protection and ensure that the second sealant maintains good surface uniformity.
- the coating thickness of the first sealant is 6 nm to 20 nm.
- the first sealant within the above thickness range can maintain good surface uniformity in the pressing and curing process, and hence good sealability can be guaranteed.
- the first sealant may be coated on the surface of the OLED by slit-coating.
- the second sealant and/or the third sealant may be coated on the second substrate by die-coating.
- the above method is more convenient in coating the second sealant and the third sealant on the second substrate.
- FIG. 2 is a schematic diagram illustrating a sealing process of an OLED display panel according to an embodiment of the present invention.
- an OLED layer 3 is disposed on a first substrate 1 ; a second substrate 2 is equivalent to a cover; in one aspect, a first sealant 4 is coated on the OLED layer 3 by, for instance, slit-coating; in another aspect, a second sealant 5 is coated on the second substrate 2 by, for instance, die-coating, and a third sealant 6 is coated on outside of the second sealant 5 ; subsequently, the second substrate 2 and the first substrate 1 are pressed together under vacuum environment to allow the second sealant 5 to fill a gap formed among the first substrate 1 , the second substrate 2 and the third sealant 6 and cover the first sealant 4 , and allow the third sealant 6 to seal the second sealant 5 ; and finally, a complete sealing structure is formed by light-curing or thermo-curing.
- the OLED layer 3 may include an organic functional layer structure, for instance, sequentially superimposed an anode, a light-emitting structure and a cathode, or sequentially superimposed a cathode, a light-emitting structure and an anode.
- the light-emitting structure may include a hole transport layer (HTL), an light emitting layer (EML), an electron transport layer (ETL), etc.
- FIG. 3 is a schematic structural view of an OLED display panel according to an embodiment of the present invention.
- the sealing structure of the OLED display panel includes a first substrate 1 and a second substrate 2 arranged opposite to each other.
- the first substrate 1 is provided with an OLED layer 3 ;
- a first sealant 4 is coated on a surface of the OLED layer 3 on the first substrate 1 and configured to cover a luminous region of the OLED layer 3 and is a sealing material with a viscosity of 10 cp to 20 cp;
- a second sealant 5 is coated on a surface of the second substrate and is a water-resistant or water-absorbing material with a viscosity of more than 50 cp; and a third sealant 6 is coated outside the second sealant 5 on the second substrate 2 .
- the first substrate 1 and the second substrate 2 are arranged opposite to each other and pressed together and cured under vacuum to allow the second sealant 5 to cover the first sealant 4 and fill a gap among the first substrate 1 , the second substrate 2 and the third sealant 6 , and allow the third sealant 6 to seal the second sealant 5 .
- the first sealant 4 comprises at least one selected from the group consisting of polyolefin material, olefinic alcohol material or polyester material.
- the second sealant 5 includes an epoxy resin material.
- Ultra-low viscosity materials such as polyolefin material, olefinic alcohol material or polyester material are taken as a sealant and directly contact the OLED layer 3 .
- the ultra-low viscosity materials can ensure that the tension produced on a contact surface between the sealant and the OLED layer 3 in the curing process is low, and hence can greatly reduce the damage to the OLED layer 3 .
- the case that high-viscosity sealant is adopted to cover outside of the first sealant 4 can ensure that the sealing structure has good water resistance. Furthermore, the third sealant 6 is adopted to seal the second sealant 5 , so that the sealing structure can obtain better protection and ensure that the second sealant 5 maintains good surface uniformity.
- the adopted sealant for package is divided into three types.
- a first sealant having a low viscosity is adopted to contact the OLED, so that the tension on a contact surface between the sealant and the OLED in the curing process can be reduced, and hence the damage to the OLED can be minimized
- a second sealant having high-viscosity is adopted to cover the first sealant, so that the sealing structure of the OLED can be guaranteed to have good water-resistant or water-absorbing properties at the same time.
- the third sealant is adopted to seal the second sealant, so that the sealing structure can obtain good protection and ensure that the second sealant maintain good surface uniformity.
- the OLED display panel provided by at least one embodiment of the present invention comprises: a first substrate and a second substrate arranged opposite to each other; an OLED layer formed on the first substrate; a first sealant coated on a surface of the OLED layer; a second sealant coated on a surface of the second substrate; and a third sealant coated outside the second sealant on the surface of the second substrate.
- the viscosity of the first sealant is less than that of the second sealant; the second sealant covers the first sealant and fills a gap among the first substrate, the second substrate and the third sealant; and the third sealant seals the second sealant.
- the terms “first”, “second” and “third” are only used for distinguishing and should not be understood as an indication or implication of a relative importance.
- the OLED display panel according to the embodiments of the present invention may further comprise other structures and components according to practical demands and the method for manufacturing the OLED display panel may further comprise other steps and details which may adopt the prior art, so no further description will need to be given here.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
An organic light-emitting diode (OLED) display panel and a manufacturing method thereof are disclosed. The manufacturing method includes: providing a first substrate (1) and a second substrate (2), in which the first substrate (1) is provided with an OLED layer (3); coating a first sealant (4) on a surface of the OLED layer (3) of the first substrate (1); coating a second sealant (5) on a surface of the second substrate (2) and coating a third sealant (6) outside the second sealant (2) on the second substrate (2), in which the first sealant (4) has a viscosity less than that of the second sealant (5); and pressing the first substrate (1) and the second substrate (2) together and performing curing to allow the second sealant (5) to cover the first sealant(4) and fill a gap among the first substrate (1), the second substrate (2) and the third sealant (6). The manufacturing method can reduce the tension of a contact surface between the sealant and an OLED in the curing process, reduce the damage to the OLED, and ensure that a sealing structure of the OLED has good water resistance.
Description
- Embodiments of the present invention relate to a method for manufacturing an organic light-emitting diode (OLED) display panel and the OLED display panel.
- OLED display panel has become new-generation display technology due to the advantages of self-luminous property, wide viewing angle, high contrast, rapid response speed, etc. The basic structure of an OLED generally comprises: a substrate, a first electrode layer, a second electrode layer, a light emitting layer (EML) and a cover. An organic functional layer on the substrate is sealed by the cover and a sealant so as to avoid the deterioration of the device performances and the service life due to the external environment (water, oxygen).
- A sealant in contact with the OLED is generally required to have low viscosity and high water resistance simultaneously, so that good package property can be guaranteed without damaging devices. However, low viscosity and high water resistance are actually conflictive in general and it is difficult for one sealing material to have the above two properties at the same time.
- At least one embodiment of the present invention provides an OLED display panel and a manufacturing method thereof, which can ensure that a package structure of an OLED has good package property without damaging devices.
- At least one embodiment of the present invention provides a method for manufacturing an OLED display panel. The method comprises: providing a first substrate and a second substrate, in which the first substrate is provided with an OLED layer; coating a first sealant on a surface of the OLED layer so as to cover the surface of the OLED layer; coating a second sealant on a surface of the second substrate and coating a third sealant outside the second sealant on the surface of the second substrate, in which the first sealant has a viscosity less than that of the second sealant; and pressing the first substrate and the second substrate together and performing curing to allow the second sealant to cover the first sealant and fill a gap among the first substrate, the second substrate and the third sealant.
- At least one embodiment of the present invention further provides an OLED display panel, which comprises: a first substrate and a second substrate arranged opposite to each other; an OLED layer formed on the first substrate; a first sealant coated on a surface of the OLED layer; a second sealant coated on a surface of the second substrate; and a third sealant coated outside the second sealant on the surface of the second substrate. The first sealant has a viscosity less than that of the second sealant; the second sealant covers the first sealant and fills a gap among the first substrate, the second substrate and the third sealant; and the third sealant seals the second sealant.
- Simple description will be given below to the accompanying drawings of the embodiments to provide a more clear understanding of the technical solutions of the embodiments of the present invention. Obviously, the drawings described below only involve some embodiments of the present invention but are not intended to limit the present invention.
-
FIG. 1 is a schematic diagram of a method for manufacturing an OLED display panel according to an embodiment of the present invention; -
FIG. 2 is a schematic diagram illustrating a sealing process of an OLED display panel according to an embodiment of the present invention; and -
FIG. 3 is a schematic structural view of an OLED display panel according to an embodiment of the present invention. - Reference numerals of the accompanying drawings:
- For more clear understanding of the objectives, technical solutions and advantages of the embodiments of the present invention, clear and complete description will be given below to the technical solutions of the embodiments of the present invention with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the preferred embodiments are only part of the embodiments of the present invention but not all the embodiments. All the other embodiments obtained by those skilled in the art without creative efforts on the basis of the embodiments of the present invention illustrated shall fall within the scope of protection of the present invention.
-
FIG. 1 is a schematic diagram of a method for manufacturing an OLED display panel according to an embodiment of the present invention. - As illustrated in
FIG. 1 , a method for manufacturing the OLED display panel according to at least one embodiment of the present invention comprises: step S1: providing a first substrate and a second substrate, in which the first substrate is provided with an OLED layer; step S2: coating a first sealant on a surface of the OLED layer so as to cover the surface of the OLED layer; step S3: coating a second sealant on a surface of the second substrate and coating a third sealant outside the second sealant on the surface of the second substrate, in which the first sealant has a viscosity less than that of the second sealant; and step S4: pressing the first substrate and the second substrate together and performing curing to allow the second sealant to cover the first sealant and fill a gap among the first substrate, the second substrate and the third sealant. - It should be noted that: the steps S2 and S3 have no sequence limitation and may be executed simultaneously or sequentially no matter which is performed first; and meanwhile, the coating of the second sealant and the coating of the third sealant also have no sequence limitation and may be performed simultaneously or sequentially no matter which is performed first. In addition, the method for manufacturing the OLED display panel may further comprise other processes which may be achieved by the prior art and are not directly relevant to the technical solutions in the above embodiments. No further description will need to be given here.
- In at least one embodiment of the present invention, the first sealant is a sealing material with a viscosity of 10 cp to 20 cp, and the second sealant is a water-resistant or water-absorbing material with a viscosity of more than 50 cp.
- For instance, the first sealant comprises at least one selected from the group consisting of polyolefin material, olefinic alcohol material and polyester material.
- For instance, the second sealant comprises at least one selected from the group consisting of glass cement material, UV glue material, acrylic resin material and epoxy resin material.
- Ultra-low viscosity materials such as polyolefin material, olefinic alcohol material or polyester material are taken as a sealant directly contacting the OLED layer. Compared with the case that high-viscosity materials directly contact the OLED layer, the ultra-low viscosity materials can ensure that the tension produced on a contact surface between the sealant and the OLED layer in the curing process is low, and hence can greatly reduce the damage to the OLED layer.
- Moreover, the case that a high-viscosity sealant is adopted to cover periphery of the first sealant can ensure that a sealing structure has good water-resistant or water-absorbing property and prevents external moisture from passing through the second sealant, so that the first sealant keeps the OLED layer sealed and at the same time is not permeated by the external moisture. Moreover, the third sealant is adopted to seal the second sealant, so that the sealing structure can obtain better protection and ensure that the second sealant maintains good surface uniformity.
- In at least one embodiment, the coating thickness of the first sealant is 6 nm to 20 nm. The first sealant within the above thickness range can maintain good surface uniformity in the pressing and curing process, and hence good sealability can be guaranteed.
- For instance, the first sealant may be coated on the surface of the OLED by slit-coating.
- For instance, the second sealant and/or the third sealant may be coated on the second substrate by die-coating. The above method is more convenient in coating the second sealant and the third sealant on the second substrate.
-
FIG. 2 is a schematic diagram illustrating a sealing process of an OLED display panel according to an embodiment of the present invention. - As illustrated in
FIG. 2 , anOLED layer 3 is disposed on a first substrate 1; asecond substrate 2 is equivalent to a cover; in one aspect, afirst sealant 4 is coated on theOLED layer 3 by, for instance, slit-coating; in another aspect, asecond sealant 5 is coated on thesecond substrate 2 by, for instance, die-coating, and athird sealant 6 is coated on outside of thesecond sealant 5; subsequently, thesecond substrate 2 and the first substrate 1 are pressed together under vacuum environment to allow thesecond sealant 5 to fill a gap formed among the first substrate 1, thesecond substrate 2 and thethird sealant 6 and cover thefirst sealant 4, and allow thethird sealant 6 to seal thesecond sealant 5; and finally, a complete sealing structure is formed by light-curing or thermo-curing. - For instance, the
OLED layer 3 may include an organic functional layer structure, for instance, sequentially superimposed an anode, a light-emitting structure and a cathode, or sequentially superimposed a cathode, a light-emitting structure and an anode. The light-emitting structure may include a hole transport layer (HTL), an light emitting layer (EML), an electron transport layer (ETL), etc. -
FIG. 3 is a schematic structural view of an OLED display panel according to an embodiment of the present invention. - As illustrated in
FIG. 3 , the sealing structure of the OLED display panel provided by the embodiment of the present invention includes a first substrate 1 and asecond substrate 2 arranged opposite to each other. The first substrate 1 is provided with anOLED layer 3; afirst sealant 4 is coated on a surface of theOLED layer 3 on the first substrate 1 and configured to cover a luminous region of theOLED layer 3 and is a sealing material with a viscosity of 10 cp to 20 cp; asecond sealant 5 is coated on a surface of the second substrate and is a water-resistant or water-absorbing material with a viscosity of more than 50 cp; and athird sealant 6 is coated outside thesecond sealant 5 on thesecond substrate 2. The first substrate 1 and thesecond substrate 2 are arranged opposite to each other and pressed together and cured under vacuum to allow thesecond sealant 5 to cover thefirst sealant 4 and fill a gap among the first substrate 1, thesecond substrate 2 and thethird sealant 6, and allow thethird sealant 6 to seal thesecond sealant 5. - For instance, the
first sealant 4 comprises at least one selected from the group consisting of polyolefin material, olefinic alcohol material or polyester material. - For instance, the
second sealant 5 includes an epoxy resin material. - Ultra-low viscosity materials such as polyolefin material, olefinic alcohol material or polyester material are taken as a sealant and directly contact the
OLED layer 3. Compared with the case that high-viscosity materials directly contact the OLED layer, the ultra-low viscosity materials can ensure that the tension produced on a contact surface between the sealant and theOLED layer 3 in the curing process is low, and hence can greatly reduce the damage to theOLED layer 3. - Moreover, the case that high-viscosity sealant is adopted to cover outside of the
first sealant 4 can ensure that the sealing structure has good water resistance. Furthermore, thethird sealant 6 is adopted to seal thesecond sealant 5, so that the sealing structure can obtain better protection and ensure that thesecond sealant 5 maintains good surface uniformity. - By adoption of the above technical solutions, the adopted sealant for package is divided into three types. A first sealant having a low viscosity is adopted to contact the OLED, so that the tension on a contact surface between the sealant and the OLED in the curing process can be reduced, and hence the damage to the OLED can be minimized Moreover, a second sealant having high-viscosity is adopted to cover the first sealant, so that the sealing structure of the OLED can be guaranteed to have good water-resistant or water-absorbing properties at the same time. Furthermore, the third sealant is adopted to seal the second sealant, so that the sealing structure can obtain good protection and ensure that the second sealant maintain good surface uniformity.
- The OLED display panel provided by at least one embodiment of the present invention comprises: a first substrate and a second substrate arranged opposite to each other; an OLED layer formed on the first substrate; a first sealant coated on a surface of the OLED layer; a second sealant coated on a surface of the second substrate; and a third sealant coated outside the second sealant on the surface of the second substrate. The viscosity of the first sealant is less than that of the second sealant; the second sealant covers the first sealant and fills a gap among the first substrate, the second substrate and the third sealant; and the third sealant seals the second sealant.
- It should be noted that: in the present application document, the terms “first”, “second” and “third” are only used for distinguishing and should not be understood as an indication or implication of a relative importance. In addition, it should be known by those skilled in the art that the OLED display panel according to the embodiments of the present invention may further comprise other structures and components according to practical demands and the method for manufacturing the OLED display panel may further comprise other steps and details which may adopt the prior art, so no further description will need to be given here.
- The foregoing is only the preferred embodiments of the present invention and not intended to limit the scope of protection of the present invention. The scope of protection of the present invention should be defined by the appended claims.
- The application claims priority to the Chinese patent application No. 201410347239.6, filed on Jul. 21, 2014, the disclosure of which is incorporated herein by reference as part of the application.
Claims (19)
1. A method for manufacturing an organic light-emitting diode (OLED) display panel, comprising:
providing a first substrate and a second substrate, in which the first substrate is provided with an OLED layer;
coating a first sealant on a surface of the OLED layer so as to cover a surface of the OLED layer;
coating a second sealant on a surface of the second substrate, and coating a third sealant outside the second sealant on the surface of the second substrate, in which the first sealant has a viscosity less than that of the second sealant; and
pressing the first substrate and the second substrate together and performing curing to allow the second sealant to cover the first sealant and fill a gap among the first substrate, the second substrate and the third sealant.
2. The method for manufacturing the OLED display panel according to claim 1 , wherein the first sealant is a sealing material with a viscosity of 10 cp to 20 cp; and the second sealant is a water-resistant or water-absorbing material with a viscosity of more than 50 cp.
3. The method for manufacturing the OLED display panel according to claim 2 , wherein the first sealant comprises at least one selected from the group consisting of polyolefin material, olefinic alcohol material and polyester material.
4. The method for manufacturing the OLED display panel according to claim 2 , wherein the second sealant comprises at least one selected from the group consisting of glass cement material, UV glue material, acrylic resin material and epoxy resin material.
5. The method for manufacturing the OLED display panel according to claim 1 , wherein the first sealant has a coating thickness of 6 μm to 20 μm.
6. The method for manufacturing the OLED display panel according to claim 1 , wherein the first sealant is coated on the OLED layer by slit-coating.
7. The method for manufacturing the OLED display panel according to claim 1 , wherein the second sealant and/or the third sealant is coated on the second substrate by die-coating.
8. An organic light-emitting diode (OLED) display panel, comprising:
a first substrate and a second substrate arranged opposite to each other;
an OLED layer formed on the first substrate;
a first sealant coated on a surface of the OLED layer;
a second sealant coated on a surface of the second substrate; and
a third sealant coated outside the second sealant on the surface of the second substrate, wherein
the first sealant has a viscosity less than that of the second sealant; the second sealant covers the first sealant and fills a gap among the first substrate, the second substrate and the third sealant; and the third sealant seals the second sealant.
9. The OLED display panel according to claim 8 , wherein the first sealant is a sealing material with a viscosity of 10 cp to 20 cp; and the second sealant is a water-resistant or water-absorbing material with a viscosity of more than 50 cp.
10. The OLED display panel according to claim 9 , wherein the first sealant comprises at least one selected from the group consisting of polyolefin material, olefinic alcohol material and polyester material.
11. The OLED display panel according to claim 9 , wherein the second sealant comprises at least one selected from the group consisting of glass cement material, UV glue material, acrylic resin material and epoxy resin material.
12. The OLED display panel according to claim 8 , wherein the first sealant has a coating thickness of 6 μm to 20 μm.
13. The OLED display panel according to claim 9 , wherein the first sealant has a coating thickness of 6 μm to 20 μm.
14. The OLED display panel according to claim 10 , wherein the first sealant has a coating thickness of 6 μm to 20 μm.
15. The OLED display panel according to claim 11 , wherein the first sealant has a coating thickness of 6 μm to 20 μm.
16. The method for manufacturing the OLED display panel according to claim 2 , wherein the first sealant is coated on the OLED layer by slit-coating.
17. The method for manufacturing the OLED display panel according to claim 3 , wherein the first sealant is coated on the OLED layer by slit-coating.
18. The method for manufacturing the OLED display panel according to claim 2 , wherein the second sealant and/or the third sealant is coated on the second substrate by die-coating.
19. The method for manufacturing the OLED display panel according to claim 3 , wherein the second sealant and/or the third sealant is coated on the second substrate by die-coating.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410347239.6A CN104124268A (en) | 2014-07-21 | 2014-07-21 | Organic light emitting diode (OLED) display panel and manufacture method thereof |
CN201410347239.6 | 2014-07-21 | ||
PCT/CN2014/088692 WO2016011709A1 (en) | 2014-07-21 | 2014-10-15 | Organic light emitting diode display panel and manufacturing method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
US20160293886A1 true US20160293886A1 (en) | 2016-10-06 |
Family
ID=51769619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/769,323 Abandoned US20160293886A1 (en) | 2014-07-21 | 2014-10-15 | Organic light-emitting diode (oled) display panel and manufacturing method thereof |
Country Status (3)
Country | Link |
---|---|
US (1) | US20160293886A1 (en) |
CN (1) | CN104124268A (en) |
WO (1) | WO2016011709A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170194380A1 (en) * | 2015-07-10 | 2017-07-06 | Boe Technology Group Co., Ltd. | Encapsulation method, display panel and display device |
US10615365B2 (en) | 2016-01-29 | 2020-04-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Package assemblies and the packaging method thereof |
US10622584B2 (en) | 2018-03-27 | 2020-04-14 | Boe Technology Group Co., Ltd. | Display panel, packaging method thereof and OLED display apparatus |
US10755991B2 (en) * | 2018-08-13 | 2020-08-25 | Lg Display Co., Ltd. | Foldable display device |
WO2021103979A1 (en) * | 2019-11-29 | 2021-06-03 | 华为技术有限公司 | Display panel, flexible display screen, electronic apparatus, and preparation method for display panel |
US11322723B2 (en) | 2018-04-09 | 2022-05-03 | Boe Technology Group Co., Ltd. | Packaging structure including water-absorbing layer, display component and display device |
US11374195B2 (en) * | 2019-11-29 | 2022-06-28 | Boe Technology Group Co., Ltd. | Display panel and method of manufacturing the same, and display apparatus |
US11609618B2 (en) | 2018-06-11 | 2023-03-21 | Ordos Yuansheng Optoelectronics Co., Ltd. | Display motherboard and manufacturing method thereof |
US11825691B2 (en) | 2017-04-17 | 2023-11-21 | Boe Technology Group Co., Ltd. | Display panel and water-absorbing magnetic nanoparticles |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104766876A (en) * | 2015-04-10 | 2015-07-08 | 京东方科技集团股份有限公司 | Organic light emitting diode substrate |
CN110444682B (en) * | 2019-07-25 | 2022-02-11 | 苏州清越光电科技股份有限公司 | Display panel, preparation process thereof and display device comprising same |
CN112635511A (en) * | 2019-10-09 | 2021-04-09 | 群创光电股份有限公司 | Electronic device and method for manufacturing electronic device |
CN111477770A (en) * | 2020-04-16 | 2020-07-31 | 合肥京东方卓印科技有限公司 | Packaging method of special-shaped display panel, special-shaped display panel and display device |
CN112164761A (en) * | 2020-09-29 | 2021-01-01 | 京东方科技集团股份有限公司 | Display panel and display device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040242115A1 (en) * | 2003-03-12 | 2004-12-02 | Katsuhiko Yanagawa | Method and an apparatus for manufacturing an organic EL display device |
CN102569669A (en) * | 2011-12-22 | 2012-07-11 | 友达光电股份有限公司 | Organic electroluminescent device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006185650A (en) * | 2004-12-27 | 2006-07-13 | Seiko Epson Corp | Manufacturing method of circuit board, electro-optical device, and electronic apparatus |
CN1885369A (en) * | 2005-06-24 | 2006-12-27 | 悠景科技股份有限公司 | Glue sealing method and glue sealing structure for preventing moisture infiltration |
JP5119865B2 (en) * | 2007-11-02 | 2013-01-16 | セイコーエプソン株式会社 | Organic electroluminescence equipment, electronic equipment |
KR101028277B1 (en) * | 2010-05-25 | 2011-04-11 | 엘지이노텍 주식회사 | Light emitting device, method for fabricating the light emitting device, light emitting device package and lighting unit |
TWI578842B (en) * | 2012-03-19 | 2017-04-11 | 群康科技(深圳)有限公司 | Display and manufacturing method thereof |
CN103594488B (en) * | 2013-11-21 | 2016-01-20 | 四川虹视显示技术有限公司 | A kind of method for packing of OLED display device and encapsulating structure |
CN103682178B (en) * | 2013-12-27 | 2016-03-30 | 京东方科技集团股份有限公司 | The method for packing of Organic Light Emitting Diode and organic light emitting diode device |
-
2014
- 2014-07-21 CN CN201410347239.6A patent/CN104124268A/en active Pending
- 2014-10-15 US US14/769,323 patent/US20160293886A1/en not_active Abandoned
- 2014-10-15 WO PCT/CN2014/088692 patent/WO2016011709A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040242115A1 (en) * | 2003-03-12 | 2004-12-02 | Katsuhiko Yanagawa | Method and an apparatus for manufacturing an organic EL display device |
CN102569669A (en) * | 2011-12-22 | 2012-07-11 | 友达光电股份有限公司 | Organic electroluminescent device |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170194380A1 (en) * | 2015-07-10 | 2017-07-06 | Boe Technology Group Co., Ltd. | Encapsulation method, display panel and display device |
US10566392B2 (en) * | 2015-07-10 | 2020-02-18 | Boe Technology Group Co., Ltd. | Encapsulation method, display panel and display device |
US10615365B2 (en) | 2016-01-29 | 2020-04-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Package assemblies and the packaging method thereof |
US11825691B2 (en) | 2017-04-17 | 2023-11-21 | Boe Technology Group Co., Ltd. | Display panel and water-absorbing magnetic nanoparticles |
US10622584B2 (en) | 2018-03-27 | 2020-04-14 | Boe Technology Group Co., Ltd. | Display panel, packaging method thereof and OLED display apparatus |
US11322723B2 (en) | 2018-04-09 | 2022-05-03 | Boe Technology Group Co., Ltd. | Packaging structure including water-absorbing layer, display component and display device |
US11609618B2 (en) | 2018-06-11 | 2023-03-21 | Ordos Yuansheng Optoelectronics Co., Ltd. | Display motherboard and manufacturing method thereof |
US10755991B2 (en) * | 2018-08-13 | 2020-08-25 | Lg Display Co., Ltd. | Foldable display device |
WO2021103979A1 (en) * | 2019-11-29 | 2021-06-03 | 华为技术有限公司 | Display panel, flexible display screen, electronic apparatus, and preparation method for display panel |
US11374195B2 (en) * | 2019-11-29 | 2022-06-28 | Boe Technology Group Co., Ltd. | Display panel and method of manufacturing the same, and display apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN104124268A (en) | 2014-10-29 |
WO2016011709A1 (en) | 2016-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20160293886A1 (en) | Organic light-emitting diode (oled) display panel and manufacturing method thereof | |
WO2016086538A1 (en) | Oled encapsulation structure and oled encapsulation method | |
US9013099B2 (en) | Organic electroluminescent apparatus | |
WO2016086535A1 (en) | Oled packaging structure and packaging method therefor | |
US10290828B2 (en) | Encapsulation structure and encapsulation method, and OLED apparatus | |
US10297786B2 (en) | Organic light-emitting diode display panel, method for manufacturing the same and display device | |
US20020068143A1 (en) | Adhesive sealed organic optoelectronic structures | |
US10658611B2 (en) | Encapsulation method of OLED panel and a encapsulation structure thereof | |
US9082726B2 (en) | Organic light-emitting display apparatus and method of manufacturing thereof | |
US10707440B2 (en) | Display panel with an elastic component surrounding by a frame sealant | |
US8624230B2 (en) | Organic light emitting diode display | |
US9793506B2 (en) | Display panel with annular protrusion and annular groove, packaging method thereof and display device | |
KR101937068B1 (en) | Oled packaging method and oled packaging structure | |
WO2016086533A1 (en) | Oled encapsulation method and oled encapsulation structure | |
US20160365538A1 (en) | Packaging structure of oled device and packaging method thereof | |
US10516120B2 (en) | Flexible OLED display and manufacturing method thereof | |
CN102709479A (en) | Package structure and package method for organic light emitting diode (OLED) device | |
US9196867B2 (en) | Organic light emitting display apparatus and manufacturing method thereof | |
WO2014073534A1 (en) | Organic electroluminescent display device and production method for same | |
US20160365537A1 (en) | Packaging structure of oled device and packaging method thereof | |
US9843016B2 (en) | OLED package structure and OLED packaging method | |
CN104362167A (en) | Organic electroluminescent display panel, substrate and manufacturing method thereof and display device | |
US20210408456A1 (en) | Display panel, method for fabricating same, and display device | |
KR20150049260A (en) | Organic light emitting display apparatus and manufacturing method thereof | |
US20190334124A1 (en) | Oled packaging structure and oled display panel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: BOE TECHNOLOGY GROUP CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YU, DONGHUI;WANG, CHUN JAN;SONG, WENFENG;SIGNING DATES FROM 20150713 TO 20150813;REEL/FRAME:036403/0649 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |