CN111682018A - 一种led显示模组、显示屏单元板、显示屏及制备方法 - Google Patents
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Abstract
本发明属于LED显示技术领域,公开了一种LED显示模组,包括引线框架、R芯片、G芯片、B芯片和围坝结构,以散热片作为RGB芯片的载体,引线框架预加工为镂空结构,实心部分包括散热片和焊盘,在散热片正面承载一组RGB芯片,可将RGB芯片导通时发出的热量通过散热片背面直接散发到LED显示模组之外,有效提升产品热量散发效率,解决LED产品高温失效的难题;围坝结构实现相邻像素光隔离和光反射的作用,防止串光以及提升发光强度;无基板,只是在引线框架上直接固定RGB芯片,结构简单,实现轻薄化。本发明还公开了具有该LED显示模组的显示屏单元板和显示屏。
Description
技术领域
本发明属于LED显示技术领域,涉及一种LED显示模组、显示屏单元板、显示屏及制备方法。
背景技术
随着LED显示技术的突破与产品的成熟,对组成其像素的LED显示器件提出了散热好、可靠性高、轻薄的要求。
目前,多数的LED显示模组其芯片载体采用基板或模具冲压形成的包脚类支架,因封装材料自身的热导率、热膨胀失配以及散热结构设计局限性,限制了LED的散热以及产品可靠性的提升,同时封装体较厚,无法实现轻薄化。
发明内容
为了克服上述现有技术存在的缺陷,本发明的目的在于提供一种LED显示模组及具有其的显示屏单元板和显示屏,解决了现有LED显示模组散热性不好、无法实现轻薄化的问题。
本发明是通过以下技术方案来实现:
一种LED显示模组,包括引线框架、R芯片、G芯片、B芯片和围坝结构,引线框架包括实心部分和镂空部分,实心部分包括散热片和焊盘,焊盘位于散热片的周围,散热片和焊盘的背面为焊脚;焊盘位于散热片的周围;
在散热片和焊盘的正面设置围坝结构,位于围坝结构内的散热片部分的正面固定R芯片、G芯片和B芯片;
围坝结构内填充有用于封装R芯片、G芯片和B芯片的塑封料。
进一步,焊盘包括R芯片阴极焊盘、G芯片阴极焊盘、B芯片阴极焊盘和RGB芯片共阳极焊盘;R芯片阴极焊盘与散热片为一体结构。
进一步,R芯片、G芯片和B芯片的正极通过键合线与RGB芯片共阳极焊盘连接,R芯片的负极通过导电胶固定在R芯片阴极焊盘上,G芯片的负极通过键合线与G芯片阴极焊盘连接,B芯片的负极通过键合线与B芯片阴极焊盘连接。
进一步,引线框架采用铜带,采用蚀刻工艺制备而成。
进一步,焊脚与外部元件电连接。
进一步,散热片设有4个,焊脚共14个。
进一步,在实心部分的背面对应的外缘面上预开槽,形成台阶面。
进一步,所述LED显示模组包括四个像素单元。
本发明还公开了具有所述的LED显示模组的显示屏单元板,所述显示屏单元板由若干个LED显示模组贴在PCB板上构成。
本发明还公开了具有所述的显示屏单元板的LED显示屏,该显示屏由多个显示屏单元板拼接而成。
本发明还公开了所述的LED显示模组的制备方法,包括以下步骤:
S1、通过蚀刻工艺在引线框架正面形成散热片、RGB芯片共阳极焊盘、G芯片阴极焊盘及G芯片阴极焊盘;
S2、在背面通过蚀刻形成焊脚;
S3、通过塑封工艺在引线框架的正面像素单元处形成围坝结构,在围坝结构内的散热片正面固定R芯片、G芯片和B芯片;
S4、将R芯片、G芯片、B芯片的正极与RGB芯片共阳极焊盘连接,将R芯片的负极固定在R芯片阴极焊盘上,G芯片的负极与G芯片阴极焊盘连接,B芯片的负极与B芯片阴极焊盘连接;
S5、填充围坝结构,将R芯片、G芯片、B芯片封装在围坝结构内;
S6、通过切割工艺分离,形成若干个LED显示模组。
与现有技术相比,本发明具有以下有益的技术效果:
本发明公开了一种LED显示模组,包括引线框架、R芯片、G芯片、B芯片和围坝结构,以散热片作为RGB芯片的载体,引线框架预加工为镂空结构,实心部分包括散热片和焊盘,在散热片正面承载一组RGB芯片,由于引线框架的镂空结构,且引线框架本身比较轻薄,热量可得到及时的散发,可将RGB芯片导通时发出的热量通过散热片背面直接散发到LED显示模组之外,有效提升产品热量散发效率,解决LED产品高温失效的难题;围坝结构实现相邻像素光隔离和光反射的作用,防止串光以及提升发光强度。本发明无基板,只是在引线框架上直接固定RGB芯片,结构简单,实现轻薄化。
进一步,引线框架采用铜带,有效降低了产品厚度,实现轻薄化。
进一步,在实心部分的背面对应的外缘面上预开槽,形成台阶面,台阶面使塑封料与引线框架产生挂接,半蚀刻区域在封装后会包封在塑封料中,防止引线框架与塑封料脱离。
本发明还公开了具有所述LED显示模组的显示屏单元板和显示屏,散热性能更优,整体结构重量更轻。
本发明还公开了所述所述LED显示模组的制备方法,首先通过蚀刻工艺加工出能够固定RGB芯片的引线框架,实现轻薄化和高效散热;然后再进行上芯、压焊后的围坝结构内填充,填充料为具有良好透光性的环氧树脂、硅树脂等材料,有效将RGB芯片的光传递到产品外面,形成像素点。增加了塑封成型的围坝结构,通过围坝结构,实现了相邻像素光隔离和光反射的作用,防止串光以及提升发光强度。
附图说明
图1为本发明的LED显示模组的结构示意图;
图2为引线框架的正面结构示意图;
图3为引线框架的反面结构示意图;
图4为图3的A-A剖视图;
图5为引线框架的反面焊脚布置示意图;
图6为分割之前的引线框架的整体结构示意图。
其中,1为引线框架;2为R芯片;3为G芯片;4为B芯片;5为围坝结构;6为键合线;7为散热片;8为焊脚;9为B芯片阴极焊盘;10为G芯片阴极焊盘;11为RGB芯片共阳极焊盘;12为R芯片阴极焊盘;13为台阶面。
具体实施方式
下面结合附图对本发明做进一步详细描述:
如图1所示,本发明公开了一种LED显示模组,包括引线框架1、R芯片2、G芯片3、B芯片4和围坝结构5,引线框架1包括实心部分和镂空部分,实心部分包括散热片7和焊盘,散热片7和焊盘的背面为焊脚8;焊盘位于散热片7的周围;在散热片7和焊盘的正面设置围坝结构5,位于围坝结构5内的散热片7部分的正面固定R芯片2、G芯片3和B芯片4。
如图2所示,焊盘包括R芯片阴极焊盘12、G芯片阴极焊盘10、B芯片阴极焊盘9和RGB芯片共阳极焊盘11,RGB芯片共阳极焊盘11、G芯片阴极焊盘10及B芯片阴极焊盘9位于散热片7的周围。
R芯片阴极焊盘12与散热片7为一体结构,散热片7延伸出一部分区域作为R芯片阴极焊盘12。R芯片2的负极通过导电胶与R芯片阴极焊盘12固定连接。
如图1所示,R芯片2、G芯片3和B芯片4的正极通过键合线6与RGB芯片共阳极焊盘11连接,G芯片3的负极和B芯片4的负极通过键合线6与对应的芯片阴极焊盘连接。
如图1所示,实心部分分为四个像素单元,形成4个全彩像素点,成XY方向阵列排布。具体地,每个像素单元包括一个散热片7和一组RGB芯片4,X方向的2个像素单元共用1个共阳极焊盘。
在每个像素单元处设置围坝结构5,R芯片2、G芯片3和B芯片4固定在位于围坝结构5内的散热片7部分的正面;R芯片2、G芯片3和B芯片4与RGB芯片共阳极焊盘11连接,G芯片3于G芯片阴极焊盘10连接,B芯片4与B芯片阴极焊盘9连接。
围坝结构5内填充有用于封装R芯片2、G芯片3和B芯片4的塑封料。围坝结构5通过塑封工艺,将塑封料在引线框架1上注塑成型,实现相邻像素光隔离和光反射的作用,防止串光以及提升发光强度。
塑封料为具有良好透光性的环氧树脂、硅树脂等材料,有效将RGB芯片的光传递到产品外面,形成像素点。
引线框架1为单层金属材质,通过蚀刻等工艺形成镂空结构,实现显示模组内部电路连接功能,一般采用铜带。
引线框架1为单层金属材质,通过蚀刻等工艺形成镂空结构,实现显示模组内部电路连接功能,一般采用铜带。
实心部分的背面作为SMT焊脚8,SMT焊脚8与外部元件电连接。
LED显示模组包括4个全彩像素点,呈XY方向阵列排布。
如图5所示,散热片7为4个,焊脚8共14个,焊脚8为图中灰色区域对应的圆形部分。
如图4所示,在实心部分的背面对应的外缘面上预开槽,形成台阶面13,作为半蚀刻区域,如3图中所示的灰色区域,即背面的横截面积小于正面的横截面积。台阶面13使塑封料与引线框架1产生挂接,半蚀刻区域在封装后会包封在塑封料中,防止引线框架1与塑封料脱离。
本发明公开的LED显示模组的制备方法,具体包括以下步骤:
S1、通过蚀刻工艺形成如图6所示的引线框架1,正面形成散热片7、RGB芯片共阳极焊盘11、G芯片阴极焊盘10及G芯片阴极焊盘10;
S2、在背面通过蚀刻形成焊脚8;
S3、通过模具将塑封料注塑在引线框架1正面像素单元处,形成围坝结构5,在围坝结构5内的散热片7正面通过固晶胶将R芯片2、G芯片3、B芯片4固定;
S4、通过键合线6将R芯片2、G芯片3、B芯片4与RGB芯片共阳极焊盘11和对应的芯片阴极焊盘连接;
S5、通过点胶工艺将液态胶水填入围坝结构5,保证R芯片2、G芯片3、B芯片4与键合线6封装在围坝结构5内;
S6、通过切割工艺分离,形成如图1所示的多个LED显示模组。
Claims (10)
1.一种LED显示模组,其特征在于,包括引线框架(1)、R芯片(2)、G芯片(3)、B芯片(4)和围坝结构(5),引线框架(1)包括实心部分和镂空部分,实心部分包括散热片(7)和焊盘,焊盘位于散热片(7)的周围,散热片(7)和焊盘的背面为焊脚(8);焊盘位于散热片(7)的周围;
焊盘包括R芯片阴极焊盘(12)、G芯片阴极焊盘(10)、B芯片阴极焊盘(9)和RGB芯片共阳极焊盘(11);R芯片阴极焊盘(12)与散热片(7)为一体结构;
在散热片(7)和焊盘的正面设置围坝结构(5),位于围坝结构(5)内的散热片(7)部分的正面固定R芯片(2)、G芯片(3)和B芯片(4);
围坝结构(5)内填充有用于封装R芯片(2)、G芯片(3)和B芯片(4)的塑封料。
2.根据权利要求1所述的LED显示模组,其特征在于,R芯片(2)、G芯片(3)和B芯片(4)的正极通过键合线(6)与RGB芯片共阳极焊盘(11)连接,R芯片(2)的负极通过导电胶固定在R芯片阴极焊盘(12)上,G芯片(3)的负极通过键合线(6)与G芯片阴极焊盘(10)连接,B芯片(4)的负极通过键合线(6)与B芯片阴极焊盘(9)连接。
3.根据权利要求1所述的LED显示模组,其特征在于,引线框架(1)采用铜带,采用蚀刻工艺制备而成。
4.根据权利要求1所述的LED显示模组,其特征在于,焊脚(8)与外部元件电连接。
5.根据权利要求1所述的LED显示模组,其特征在于,散热片(7)设有4个,焊脚(8)共14个。
6.根据权利要求1所述的LED显示模组,其特征在于,在实心部分的背面对应的外缘面上预开槽,形成台阶面(13)。
7.根据权利要求1所述的LED显示模组,其特征在于,所述LED显示模组包括四个像素单元。
8.具有权利要求1~7任意一项所述的LED显示模组的显示屏单元板,其特征在于,所述显示屏单元板由若干个LED显示模组贴在PCB板上构成。
9.具有权利要求8所述的显示屏单元板的LED显示屏,其特征在于,该显示屏由多个显示屏单元板拼接而成。
10.权利要求1~7任意一项所述的LED显示模组的制备方法,其特征在于,包括以下步骤:
S1、通过蚀刻工艺在引线框架(1)正面形成散热片(7)、RGB芯片共阳极焊盘(11)、G芯片阴极焊盘(10)及G芯片阴极焊盘(10);
S2、在背面通过蚀刻形成焊脚(8);
S3、通过塑封工艺在引线框架(1)的正面像素单元处形成围坝结构(5),在围坝结构(5)内的散热片(7)正面固定R芯片(2)、G芯片(3)和B芯片(4);
S4、将R芯片(2)、G芯片(3)、B芯片(4)的正极与RGB芯片共阳极焊盘(11)连接,将R芯片(2)的负极固定在R芯片阴极焊盘(12)上,G芯片(3)的负极与G芯片阴极焊盘(10)连接,B芯片(4)的负极与B芯片阴极焊盘(9)连接;
S5、填充围坝结构(5),将R芯片(2)、G芯片(3)、B芯片(4)封装在围坝结构(5)内;
S6、通过切割工艺分离,形成若干个LED显示模组。
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CN115911022A (zh) * | 2023-02-15 | 2023-04-04 | 江西兆驰半导体有限公司 | 一种扇出型封装led器件的制造方法 |
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CN115911022A (zh) * | 2023-02-15 | 2023-04-04 | 江西兆驰半导体有限公司 | 一种扇出型封装led器件的制造方法 |
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