CN111653541A - 一种镀铁镀铂的双镀层键合铜丝 - Google Patents
一种镀铁镀铂的双镀层键合铜丝 Download PDFInfo
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Abstract
本发明公开了一种镀铁镀铂的双镀层键合铜丝,涉及键合丝技术领域。一种镀铁镀铂的双镀层键合铜丝,所述镀铁镀铂的双镀层键合铜丝包括铜芯材;镀覆在铜芯材表面的铁镀层;镀覆在铁镀层表面的铂镀层。所述铜芯材经过熔炼进行粗拉伸后在表面镀覆铁镀层;再中拉伸后在铁镀层表面镀覆铂镀层;再超细拉伸为镀铁镀铂的双镀层键合铜丝。采用逐层拉伸,逐层镀层,具有较好的最终塑性变形能力,铁铂双镀层在压力加工过程中变形一致,表面均匀,致密完整,尤其是有利于焊接键合时充分变形,提高拉断力及可靠性。而且,双镀层结合处具有铁磁性的铁铂合金层能够起到屏蔽作用,减小键合线中的噪音。同时镀铁铂合金层对单晶铜键合线形成了保护,避免被氧化。
Description
技术领域
本发明涉及键合丝技术领域,具体是一种镀铁镀铂的双镀层键合铜丝。
背景技术
随着集成电路和半导体器件封装技术向多引线化、高集成度和小型化发展,封装技术要求采用更细、电学性能更优良的键合丝进行键合。传统的金键合丝和铝键合丝在导电性能和导热性能上的已经趋于极限,并且金的价格愈发上涨限制了其的应用。金丝和铝丝已经在导电和导热性能上逐步趋近于极限。铜丝作为内引线,具有比金丝高的导电和导热性能,可以用于制造对电流负载要求更高的功率器件,而且可以使高密度封装时的散热更为容易。铜丝较强的抗拉强度可以使丝线直径变得更细,焊盘尺寸和焊盘间距也能相应减小。然而铜线表面的污染和氧化造成焊接性能降低,氧化膜降低了铜线的键合性能。
发明内容
本发明的目的在于提供一种镀铁镀铂的双镀层键合铜丝,以解决上述背景技术中提出的至少一个问题。
为实现上述目的,本发明提供如下技术方案:
一种镀铁镀铂的双镀层键合铜丝,所述镀铁镀铂的双镀层键合铜丝包括:
铜芯材;
镀覆在铜芯材表面的铁镀层;
以及镀覆在铁镀层表面的铂镀层。
其中,所述铜芯材经过熔炼进行粗拉伸后在表面镀覆铁镀层;
再中拉伸后在铁镀层表面镀覆铂镀层;
再超细拉伸为镀铁镀铂的双镀层键合铜丝。
优选的,所述铜芯材是纯度至少99.999%的高纯铜合金材料。
优选的,在真空镀膜设备中进行动态连续磁控溅射真空镀膜形成的铁镀层和/或铂镀层。
优选的,所述真空镀膜设备的真空度为10-3~10Pa。
优选的,所述超细拉伸后铁镀层厚度为0.5μm。
优选的,所述超细拉伸后铂镀层厚度为0.5μm
优选的,所述铜芯材直径为2mm。
一种镀铁镀铂的双镀层键合铜丝的制备方法,包括:
铜合金经过真空熔炼和定向连续引铸工艺,经粗拔以制得直径大约为4-5mm的铜芯:
在氮气气氛下对铜芯进行退火;
退火后的铜芯表面上电镀金属铁,并精拔呈直径为2-3mm的镀铁铜丝;并对镀铁铜丝进行热退火,其中热退火温度为450-500℃,时间为45-55min;
镀铁铜丝表面上电镀金属铂,并精拔成直径为1-2mm的双镀层键合铜丝;双镀层键合铜丝进行热退火,退火温度为700±1℃,退火气氛为5%H2+95Ar。
优选的,在氮气气氛下对铜芯进行退火,其中退火炉有效长度为900-1100mm,退火温度为400-450℃,退火速率为1.3m/s。
与现有技术相比,本发明的有益效果是:
本发明铁铂双镀层键合铜丝采用逐层拉伸,逐层镀层,具有较好的最终塑性变形能力,铁铂双镀层在压力加工过程中变形一致,表面均匀,致密完整,尤其是有利于焊接键合时充分变形,提高拉断力及可靠性。而且,双镀层结合处具有铁磁性的铁铂合金层能够起到屏蔽作用,减小键合线中的噪音。同时镀铁铂合金层对单晶铜键合线形成了保护,避免被氧化。
具体实施方式
为了加深对本发明的理解,下面将结合实施例对本发明作进一步详述,以下实施例仅用于解释本发明,并不构成对本发明保护范围的限定。
本发明实施例提供,一种镀铁镀铂的双镀层键合铜丝,所述镀铁镀铂的双镀层键合铜丝包括铜芯材,镀覆在铜芯材表面的铁镀层,以及镀覆在铁镀层表面的铂镀层。
其中,所述铜芯材经过熔炼进行粗拉伸后在表面镀覆铁镀层;
再中拉伸后在铁镀层表面镀覆铂镀层;
再超细拉伸为镀铁镀铂的双镀层键合铜丝。
本发明铁铂双镀层键合铜丝采用逐层拉伸,逐层镀层,具有较好的最终塑性变形能力,铁铂双镀层在压力加工过程中变形一致,表面均匀,致密完整,尤其是有利于焊接键合时充分变形,提高拉断力及可靠性。而且,双镀层结合处具有铁磁性的铁铂合金层能够起到屏蔽作用,减小键合线中的噪音。同时镀铁铂合金层对单晶铜键合线形成了保护,避免被氧化。
一实施例,所述铜芯材是纯度至少99.999%的高纯铜合金材料。
一实施例,在真空镀膜设备中进行动态连续磁控溅射真空镀膜形成的铁镀层和/或铂镀层。真空镀膜设备中进行动态连续磁控溅射真空镀膜形成的铁镀层和/或铂镀层。镀覆铁镀层和铂镀层附着力远大于化学镀的镀层,在后续拉伸变形时变形一致,表面均匀,致密完整。
一实施例,所述真空镀膜设备的真空度为10-3~10Pa。
一实施例,所述超细拉伸后铁镀层厚度为0.5μm。
一实施例,所述超细拉伸后铂镀层厚度为0.5μm
一实施例,所述铜芯材直径为2mm。
一种镀铁镀铂的双镀层键合铜丝的制备方法,包括:
铜合金经过真空熔炼和定向连续引铸工艺,经粗拔以制得直径大约为4-5mm的铜芯:
在氮气气氛下对铜芯进行退火;
退火后的铜芯表面上电镀金属铁,并精拔呈直径为2-3mm的镀铁铜丝;并对镀铁铜丝进行热退火,其中热退火温度为450-500℃,时间为45-55min;
镀铁铜丝表面上电镀金属铂,并精拔成直径为1-2mm的双镀层键合铜丝;双镀层键合铜丝进行热退火,将表面镀铁铂合金的键合铜丝进行退火,退火温度为700±1℃,退火气氛5%H2+95Ar,使得铁铂合金发生有序化转变。
一实施例,在氮气气氛下对铜芯进行退火,其中退火炉有效长度为900-1100mm,退火温度为400-450℃,退火速率为1.3m/s。
本具体实施方式的双镀层键合铜丝能够满足现代封装的高端键合要求。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是本发明的原理,在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明的范围内。本发明要求的保护范围由所附的权利要求书及其等同物界定。
Claims (9)
1.一种镀铁镀铂的双镀层键合铜丝,其特征在于,所述镀铁镀铂的双镀层键合铜丝包括:
铜芯材;
镀覆在铜芯材表面的铁镀层;
以及镀覆在铁镀层表面的铂镀层;
其中,所述铜芯材经过熔炼进行粗拉伸后在表面镀覆铁镀层;
再中拉伸后在铁镀层表面镀覆铂镀层;
再超细拉伸为镀铁镀铂的双镀层键合铜丝。
2.根据权利要求1所述镀铁镀铂的双镀层键合铜丝,其特征在于所述,所述铜芯材是纯度至少99.999%的高纯铜合金材料。
3.根据权利要求1所述镀铁镀铂的双镀层键合铜丝,其特征在于,在真空镀膜设备中进行动态连续磁控溅射真空镀膜形成的铁镀层和/或铂镀层。
4.根据权利要求3所述镀铁镀铂的双镀层键合铜丝,其特征在于,所述真空镀膜设备的真空度为10-3~10Pa。
5.根据权利要求2所述镀铁镀铂的双镀层键合铜丝,其特征在于,所述超细拉伸后铁镀层厚度为0.5μm。
6.根据权利要求2所述镀铁镀铂的双镀层键合铜丝,其特征在于,所述超细拉伸后铂镀层厚度为0.5μm。
7.根据权利要求1所述镀铁镀铂的双镀层键合铜丝,其特征在于,所述铜芯材直径为2mm。
8.根据权利要求1-7任一所述的镀铁镀铂的双镀层键合铜丝的制备方法,其特征在于,所述制备方法包括:
铜合金经过真空熔炼和定向连续引铸工艺,经粗拔以制得直径大约为4-5mm的铜芯:
在氮气气氛下对铜芯进行退火;
退火后的铜芯表面上电镀金属铁,并精拔呈直径为2-3mm的镀铁铜丝;并对镀铁铜丝进行热退火,其中热退火温度为450-500℃,时间为45-55min;
镀铁铜丝表面上电镀金属铂,并精拔成直径为1-2mm的双镀层键合铜丝;双镀层键合铜丝进行热退火,退火温度为700±1℃,退火气氛为5%H2+95Ar。
9.根据权利要求8所述的镀铁镀铂的双镀层键合铜丝的制备方法,其特征在于,
在氮气气氛下对铜芯进行退火,其中退火炉有效长度为900-1100mm,退火温度为400-450℃,退火速率为1.3m/s。
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