CN111647366A - 一种电子产品包装用防静电保护膜及其制备方法 - Google Patents

一种电子产品包装用防静电保护膜及其制备方法 Download PDF

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CN111647366A
CN111647366A CN202010495271.4A CN202010495271A CN111647366A CN 111647366 A CN111647366 A CN 111647366A CN 202010495271 A CN202010495271 A CN 202010495271A CN 111647366 A CN111647366 A CN 111647366A
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窦进军
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Jiangsu Jiumao Precision Electronic Technology Co Ltd
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Abstract

本发明公开了一种电子产品包装用防静电保护膜及其制备方法，属于电子产品包装技术领域，一种电子产品包装用防静电保护膜及其制备方法，包括基材层，所述基材层的上表面设有保护层，所述基材层的下表面粘接有粘接胶层，粘接胶层的下表面设有离型层；基材层为树脂基材层，保护层为抗静电层，粘接胶层为有机硅压敏胶层，有机硅压敏胶采用涂布的方式涂布于基材层的表面形成有机硅压敏胶层，本发明的防静电保护膜，包括基材层、保护层、粘接胶层、离型层，基材层包括基材树脂、增塑剂、分散剂、固化剂、透明钙粉、钙锌稳定剂和色母，大大提高了保护膜的韧性和非迁移性，且耐温性能好，适合电子产品包装使用。

Description

一种电子产品包装用防静电保护膜及其制备方法
技术领域
本发明涉及电子产品包装技术领域，更具体地说，涉及一种电子产品包装用防静电保护膜及其制备方法。
背景技术
电子产品是以电能为工作基础的相关产品，主要包括：手表、智能手机、电话、电视机、影碟机、录像机、摄录机、收音机、收录机、组合音箱、激光唱机、电脑、游戏机、移动通信产品等。因早期产品主要以电子管为基础原件故名电子产品。
目前，一些电子产品的玻璃基材表面，在搬运和使用过程中，容易受到一些化学物质的接触性污染或指甲等的磨痕划伤，通常需要在其表面贴附保护膜来使之免受损伤和污染。现有技术中的保护膜一般采用PET材料作为基材，再涂上涂层材料制备。由于PET材料的电阻率高达1010-1020Ω·cm，容易积蓄静电。当这类保护膜在电子产品上使用时，容易吸附灰尘和杂质，同时也容易产生静电对电子部件材料造成损害，并且不利于人体健康。
发明内容
1.要解决的技术问题
针对现有技术中存在的问题，本发明的目的在于提供一种电子产品包装用防静电保护膜及其制备方法，本发明的防静电保护膜，包括基材层、保护层、粘接胶层、离型层，基材层包括基材树脂、增塑剂、分散剂、固化剂、透明钙粉、钙锌稳定剂和色母，大大提高了保护膜的韧性和非迁移性，且耐温性能好，适合电子产品包装使用。
2.技术方案
为解决上述问题，本发明采用如下的技术方案。
一种电子产品包装用防静电保护膜，包括基材层，所述基材层的上表面设有保护层，所述基材层的下表面粘接有粘接胶层，所述粘接胶层的下表面设有离型层；
所述基材层为树脂基材层，且树脂基材层包括以下按重量份计的组份：基材树脂60-80份、增塑剂20-30份、分散剂3-6份、固化剂4-8份、透明钙粉3-5份、钙锌稳定剂2-3份、色母1-2份；
所述保护层为抗静电层，且抗静电层包括以下按重量份计的组份：聚丙烯酸酯类树脂50-70份、抗静电剂15-25份、有机硅化合物10-15份、聚酰胺固化剂6-12份、硅烷偶联剂4-8份；
所述粘接胶层为有机硅压敏胶层，有机硅压敏胶采用涂布的方式涂布于基材层的表面形成有机硅压敏胶层。
进一步的，所述基材树脂选为有机硅树脂、酚醛树脂、聚氯乙烯树脂、聚乙烯树脂、聚丙烯树脂、ABS树脂、环氧树脂和丙烯酸树脂中的一种或两种以上的混合物。
进一步的，所述增塑剂为邻苯二甲酸酯、脂肪族二元酸酯、脂肪酸酯、苯多酸酯、多元醇酯、环氧烃类、烷基磺酸酯中的一种。
进一步的，所述抗静电剂为乙氧基化烷基胺和乙氧基化烷基酸胺中的一种，所述有机硅化合物为聚醚硅氧烷共聚物。
进一步的，所述有机硅压敏胶包含以下按重量份计的组份：有机硅胶粘剂100份、固化剂5-10份、催化剂1-2份、导电助剂1.5-3份。
进一步的，固化剂为乙烯基三胺，所述催化剂为有机铂催化剂，所述导电助剂为炭黑粉体、炭黑浆料、石墨粉体、石墨浆料、石墨烯粉体、石墨烯浆料、碳纳米管中的一种或两种以上的混合物。
一种电子产品包装用防静电保护膜的制备方法，包括以下步骤：
S1、利用树脂基材层的各组分原料制备树脂基材层；
S2、制备抗静电层，将抗静电层复合在树脂基材层的表面形成保护层，得半成品A；
S3、制备有机硅压敏胶，将有机硅压敏胶均匀涂布在树脂基材层的背面形成粘接胶层，干燥后得半成品膜B；
S4、在半成品膜B上粘接胶层的表面贴合离型层，固化后收卷，得成品防静电保护膜。
进一步的，所述S1具体包括以下步骤：
S11、按重量份数配比准备树脂基材层的各组分原材料；
S12、将基材树脂、增塑剂、分散剂、固化剂、透明钙粉、钙锌稳定剂和色母置入混合机内充分搅拌得混合料A；
S13、对混合料A加入塑化，塑化温度为180-220℃，之后利用共挤流延法制备树脂基材层。
进一步的，所述S2中，抗静电层的制备过程包括以下步骤：
S21、按重量份数配比准备抗静电层的各组分原材料；
S22、将聚丙烯酸酯类树脂、抗静电剂、有机硅化合物、聚酰胺固化剂、硅烷偶联剂置入混合机内充分搅拌得混合料B；
S23、将混合料B置入挤出机内挤出，再将挤出料引入压延机内压延，冷却成膜，得抗静电层。
进一步的，所述S3中，有机硅压敏胶的制备方法为：按重量份配比取有机硅胶粘剂、固化剂、催化剂和导电助剂，将有机硅胶粘剂、固化剂、催化剂和导电助剂置入混合机内充分搅拌混合，冷却后得有机硅压敏胶。
3.有益效果
相比于现有技术，本发明的优点在于：
(1)本发明的防静电保护膜，包括基材层、保护层、粘接胶层、离型层，基材层包括基材树脂、增塑剂、分散剂、固化剂、透明钙粉、钙锌稳定剂和色母，大大提高了保护膜的韧性和非迁移性，且耐温性能好，适合电子产品包装使用。
(2)本发明的防静电保护膜，加入了防静电保护层，能够对基材层进行有效的保护，且具有良好的防静电性能，对电子产品进行有效的保护。
(3)本发明的防静电保护膜，粘接胶层采用有机硅压敏胶，有机硅压敏胶包括聚丙烯酸酯类树脂、抗静电剂、有机硅化合物、聚酰胺固化剂、硅烷偶联剂，具备较佳的抗静电性能，配合防静电保护层，实现了对保护膜的双面防静电保护，从而有效的提高了保护膜的防静电效果。
附图说明
图1为本发明层状机构剖视图；
图2为本发明的制备方法步骤流程图；
图3为本发明中抗静电层的制备方法步骤流程图；
图4为本发明中有机硅压敏胶的制备方法步骤流程图。
图中标号说明：
1基材层、2保护层、3粘接胶层、4离型层。
具体实施方式
下面将结合本发明实施例中的附图；对本发明实施例中的技术方案进行清楚、完整地描述；显然；所描述的实施例仅仅是本发明一部分实施例；而不是全部的实施例，基于本发明中的实施例；本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例；都属于本发明保护的范围。
在本发明的描述中，需要说明的是，术语“上”、“下”、“内”、“外”、“顶/底端”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“设置有”、“套设/接”、“连接”等，应做广义理解，例如“连接”，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
实施例1：
请参阅图1，一种电子产品包装用防静电保护膜，包括基材层1，基材层1的上表面设有保护层2，基材层1的下表面粘接有粘接胶层3，粘接胶层3的下表面设有离型层4；
基材层1为树脂基材层，且树脂基材层包括以下按重量份计的组份：基材树脂60-80份、增塑剂20-30份、分散剂3-6份、固化剂4-8份、透明钙粉3-5份、钙锌稳定剂2-3份、色母1-2份；
保护层2为抗静电层，且抗静电层包括以下按重量份计的组份：聚丙烯酸酯类树脂50-70份、抗静电剂15-25份、有机硅化合物10-15份、聚酰胺固化剂6-12份、硅烷偶联剂4-8份；
粘接胶层3为有机硅压敏胶层，有机硅压敏胶采用涂布的方式涂布于基材层1的表面形成有机硅压敏胶层。
基材树脂选为有机硅树脂、酚醛树脂、聚氯乙烯树脂、聚乙烯树脂、聚丙烯树脂、ABS树脂、环氧树脂和丙烯酸树脂中的一种或两种以上的混合物。
增塑剂为邻苯二甲酸酯、脂肪族二元酸酯、脂肪酸酯、苯多酸酯、多元醇酯、环氧烃类、烷基磺酸酯中的一种。
抗静电剂为乙氧基化烷基胺和乙氧基化烷基酸胺中的一种，有机硅化合物为聚醚硅氧烷共聚物。
有机硅压敏胶包含以下按重量份计的组份：有机硅胶粘剂100份、固化剂5-10份、催化剂1-2份、导电助剂1.5-3份，其中固化剂为乙烯基三胺，催化剂为有机铂催化剂，导电助剂为炭黑粉体、炭黑浆料、石墨粉体、石墨浆料、石墨烯粉体、石墨烯浆料、碳纳米管中的一种或两种以上的混合物。
请参阅图2，一种电子产品包装用防静电保护膜的制备方法，包括以下步骤：
S1、利用树脂基材层的各组分原料制备树脂基材层；
S2、制备抗静电层，将抗静电层复合在树脂基材层的表面形成保护层2，得半成品A；
S3、制备有机硅压敏胶，将有机硅压敏胶均匀涂布在树脂基材层的背面形成粘接胶层3，干燥后得半成品膜B；
S4、在半成品膜B上粘接胶层3的表面贴合离型层4，固化后收卷，得成品防静电保护膜。
请参阅图3，S1具体包括以下步骤：
S11、按重量份数配比准备树脂基材层的各组分原材料；
S12、将基材树脂、增塑剂、分散剂、固化剂、透明钙粉、钙锌稳定剂和色母置入混合机内充分搅拌得混合料A；
S13、对混合料A加入塑化，塑化温度为180-220℃，之后利用共挤流延法制备树脂基材层。
请参阅图4，S2中，抗静电层的制备过程包括以下步骤：
S21、按重量份数配比准备抗静电层的各组分原材料；
S22、将聚丙烯酸酯类树脂、抗静电剂、有机硅化合物、聚酰胺固化剂、硅烷偶联剂置入混合机内充分搅拌得混合料B；
S23、将混合料B置入挤出机内挤出，再将挤出料引入压延机内压延，冷却成膜，得抗静电层。
S3中，有机硅压敏胶的制备方法为：按重量份配比取有机硅胶粘剂、固化剂、催化剂和导电助剂，将有机硅胶粘剂、固化剂、催化剂和导电助剂置入混合机内充分搅拌混合，冷却后得有机硅压敏胶。
以上所述；仅为本发明较佳的具体实施方式；但本发明的保护范围并不局限于此；任何熟悉本技术领域的技术人员在本发明揭露的技术范围内；根据本发明的技术方案及其改进构思加以等同替换或改变；都应涵盖在本发明的保护范围内。

Claims (10)

1.一种电子产品包装用防静电保护膜，包括基材层(1)，其特征在于：所述基材层(1)的上表面设有保护层(2)，所述基材层(1)的下表面粘接有粘接胶层(3)，所述粘接胶层(3)的下表面设有离型层(4)；
所述基材层(1)为树脂基材层，且树脂基材层包括以下按重量份计的组份：基材树脂60-80份、增塑剂20-30份、分散剂3-6份、固化剂4-8份、透明钙粉3-5份、钙锌稳定剂2-3份、色母1-2份；
所述保护层(2)为抗静电层，且抗静电层包括以下按重量份计的组份：聚丙烯酸酯类树脂50-70份、抗静电剂15-25份、有机硅化合物10-15份、聚酰胺固化剂6-12份、硅烷偶联剂4-8份；
所述粘接胶层(3)为有机硅压敏胶层，有机硅压敏胶采用涂布的方式涂布于基材层(1)的表面形成有机硅压敏胶层。
2.根据权利要求1所述的一种电子产品包装用防静电保护膜，其特征在于：所述基材树脂选为有机硅树脂、酚醛树脂、聚氯乙烯树脂、聚乙烯树脂、聚丙烯树脂、ABS树脂、环氧树脂和丙烯酸树脂中的一种或两种以上的混合物。
3.根据权利要求1所述的一种电子产品包装用防静电保护膜，其特征在于：所述增塑剂为邻苯二甲酸酯、脂肪族二元酸酯、脂肪酸酯、苯多酸酯、多元醇酯、环氧烃类、烷基磺酸酯中的一种。
4.根据权利要求1所述的一种电子产品包装用防静电保护膜，其特征在于：所述抗静电剂为乙氧基化烷基胺和乙氧基化烷基酸胺中的一种，所述有机硅化合物为聚醚硅氧烷共聚物。
5.根据权利要求1所述的一种电子产品包装用防静电保护膜，其特征在于：所述有机硅压敏胶包含以下按重量份计的组份：有机硅胶粘剂100份、固化剂5-10份、催化剂1-2份、导电助剂1.5-3份。
6.根据权利要求5所述的一种电子产品包装用防静电保护膜，其特征在于：固化剂为乙烯基三胺，所述催化剂为有机铂催化剂，所述导电助剂为炭黑粉体、炭黑浆料、石墨粉体、石墨浆料、石墨烯粉体、石墨烯浆料、碳纳米管中的一种或两种以上的混合物。
7.一种根据权利要求1-6任意一项所述电子产品包装用防静电保护膜的制备方法，包括以下步骤：
S1、利用树脂基材层的各组分原料制备树脂基材层；
S2、制备抗静电层，将抗静电层复合在树脂基材层的表面形成保护层(2)，得半成品A；
S3、制备有机硅压敏胶，将有机硅压敏胶均匀涂布在树脂基材层的背面形成粘接胶层(3)，干燥后得半成品膜B；
S4、在半成品膜B上粘接胶层(3)的表面贴合离型层(4)，固化后收卷，得成品防静电保护膜。
8.根据权利要求7所述的一种电子产品包装用防静电保护膜，其特征在于：所述S1具体包括以下步骤：
S11、按重量份数配比准备树脂基材层的各组分原材料；
S12、将基材树脂、增塑剂、分散剂、固化剂、透明钙粉、钙锌稳定剂和色母置入混合机内充分搅拌得混合料A；
S13、对混合料A加入塑化，塑化温度为180-220℃，之后利用共挤流延法制备树脂基材层。
9.根据权利要求7所述的一种电子产品包装用防静电保护膜，其特征在于：所述S2中，抗静电层的制备过程包括以下步骤：
S21、按重量份数配比准备抗静电层的各组分原材料；
S22、将聚丙烯酸酯类树脂、抗静电剂、有机硅化合物、聚酰胺固化剂、硅烷偶联剂置入混合机内充分搅拌得混合料B；
S23、将混合料B置入挤出机内挤出，再将挤出料引入压延机内压延，冷却成膜，得抗静电层。
10.根据权利要求7所述的一种电子产品包装用防静电保护膜，其特征在于：所述S3中，有机硅压敏胶的制备方法为：按重量份配比取有机硅胶粘剂、固化剂、催化剂和导电助剂，将有机硅胶粘剂、固化剂、催化剂和导电助剂置入混合机内充分搅拌混合，冷却后得有机硅压敏胶。
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Application publication date: 20200911