CN111590763A - Hard and brittle material lobe of a leaf device - Google Patents
Hard and brittle material lobe of a leaf device Download PDFInfo
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- CN111590763A CN111590763A CN202010562123.XA CN202010562123A CN111590763A CN 111590763 A CN111590763 A CN 111590763A CN 202010562123 A CN202010562123 A CN 202010562123A CN 111590763 A CN111590763 A CN 111590763A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/005—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
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- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a hard and brittle material breaking device which comprises a bottom plate, a carrying mechanism, a rotary breaking table, a scribing platform and a breaking mechanism, wherein the bottom plate is provided with a conveying mechanism; the conveying mechanism comprises a first X-axis movement driving device and a Z-axis movement driving device, the Z-axis movement driving device is movably arranged on the first X-axis movement driving device, and the rotary cracking table is movably arranged on the Z-axis movement driving device; the rotary cracking platform comprises a rotating device, a rotary supporting plate and an adsorption platform, the rotary supporting plate is rotatably connected with the output end of the rotating device, and the adsorption platform is arranged on the rotary supporting plate; the splitting mechanism comprises a second X-axis moving driving device, a Y-axis moving driving device, an X-axis rolling device and a Y-axis rolling device, the Y-axis moving driving device is movably arranged on the second X-axis moving driving device, and the X-axis rolling device and the Y-axis rolling device are movably arranged on the Y-axis moving driving device. The invention can realize automatic production, has universal material thickness, controllable splitting precision and high splitting efficiency.
Description
Technical Field
The invention relates to the technical field of splinter processing, in particular to a hard and brittle material splinter device.
Background
At present, cracking is needed after laser scribing processing of hard and brittle materials in the semiconductor industry, the panel display industry, the PCB industry and the 3C industry, and the cracking process comprises the following steps:
1. manual splinting has many uncertain factors, low consistency, no integration automation and long splinting time.
2. The CO2 laser is used for cracking hard and brittle materials, after the materials are scribed by short-wavelength laser, CO2 laser with certain power is used for repeatedly moving along scribing processing marks once, because the temperature of the CO2 laser acting on the surfaces of the materials is lower than the melting point of the materials, the materials are cracked by utilizing the rapid change of thermal stress generated by the focusing of the CO2 laser, and the purpose of cracking is achieved. The thermal stress generated by the CO2 laser acting on the surface of the material causes the material to crack, and the crack is delayed for several seconds; this method of fragmentation is very limited, for example: 1) when 50 x 1mm ceramic wafer is cracked into product 1 x 1mm small particles, because the 50 x 1mm ceramic wafer is transversely and longitudinally distributed with marking traces with the interval of 1mm, the time required for all the marking traces is longer, when CO2 laser does not complete all the marking traces, the ceramic wafer starts to be cracked, and the action force and the reaction force act to cause the ceramic wafer to move, so that the rest ceramic wafer cannot be cracked. 2) When the thickness of the hard and brittle material is less than 0.1mm, the energy of CO2 laser is difficult to control, and CO2 laser can easily melt the edge of the material to generate a defective product; the thermal stress generated by the CO2 laser causes the material to crack, so that the time for cracking the material is shorter; 3) in order to ensure the precision of the product, the laser scribing and the CO2 laser splitting generally adopt the same equipment and the same processing platform jig; that is, the CO2 laser stops working during laser scribing, and the CO2 laser stops working during laser scribing, which wastes platform resources and reduces the processing efficiency.
With the parts machined by the hard and brittle materials becoming smaller and the coming materials of the hard and brittle materials becoming thinner and thinner, the cracking process is not applicable.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a hard and brittle material splitting device, which has controllable splitting precision and can be integrated into equipment to realize automatic production; the problem of CO2 laser lobe edge melting can not appear, and the material thickness all is general, and lobe of a leaf efficiency is high.
The technical scheme of the invention is as follows:
a hard and brittle material splitting device comprises a bottom plate, a carrying mechanism, a rotary splitting table, a scribing platform and a splitting mechanism, wherein the scribing platform, the carrying mechanism, the rotary splitting table and the splitting mechanism are fixedly arranged on the bottom plate;
the carrying mechanism comprises a first X-axis moving driving device and a Z-axis moving driving device, the Z-axis moving driving device is movably arranged on the first X-axis moving driving device and is driven by the first X-axis moving driving device to move along the X-axis direction, and the rotary splinter table is movably arranged on the Z-axis moving driving device and is driven by the Z-axis moving driving device to move along the Z-axis direction;
the rotary cracking table comprises a rotating device, a rotary supporting plate and an adsorption table, the rotary supporting plate is rotatably connected with the output end of the rotating device, the rotary supporting plate is provided with the adsorption table, and the adsorption table is provided with a ceramic wafer adsorption position;
the scribing platform and the splitting mechanism are positioned on one side of the first X-axis movement driving device, the scribed ceramic wafer is placed on the scribing platform, and the ceramic wafer on the scribing platform is adsorbed on the ceramic wafer adsorption position through the adsorption platform of the rotary splitting platform;
the splitting mechanism comprises a second X-axis moving driving device, a Y-axis moving driving device, an X-axis rolling device and a Y-axis rolling device, the Y-axis moving driving device is movably arranged on the second X-axis moving driving device and is driven by the second X-axis moving driving device to move along the X-axis direction, and the X-axis rolling device and the Y-axis rolling device are movably arranged on the Y-axis moving driving device and are driven by the Y-axis moving driving device to move along the Y-axis direction;
and the ceramic wafer on the ceramic wafer adsorption position is rolled by the X-axis rolling device and the Y-axis rolling device to realize the splitting of the ceramic wafer in the X direction and the Y direction.
Further, the hard and brittle material splitting device further comprises a paper placing mechanism, the paper placing mechanism is fixedly arranged on the bottom plate and located on one side of the first X-axis moving driving device, the paper placing mechanism comprises a first connecting seat, a guide pillar, a movable supporting plate, a linear bearing, a stop block and a magnet, the guide pillar is vertically fixed on the first connecting seat, a movable through hole and a paper groove are formed in the movable supporting plate, the movable through hole is movably connected with the guide pillar through the linear bearing, the stop block is arranged at the top end of the guide pillar, the paper groove faces the first X-axis moving driving device, an upper opening and a lower opening are formed in the paper groove, and the magnet is arranged on two sides of the paper groove.
Furthermore, the hard and brittle material splitting device also comprises a material receiving box, the material receiving box is fixedly arranged on the bottom plate and is positioned on one side of the first X-axis moving driving device, and a layer of elastic rubber mat is arranged on the inner layer of the material receiving box.
Furthermore, the first X-axis movement driving device, the Z-axis movement driving device, the second X-axis movement driving device and the Y-axis movement driving device are all composed of servo motors and lead screw guide rail mechanisms.
Further, rotary device includes rotating electrical machines, shaft coupling and second connecting seat, a side of second connecting seat sets up rotating electrical machines, another side swivelling joint swivel support board of second connecting seat, rotating electrical machines's output pass through the shaft coupling with swivel support board connects.
Furthermore, one side of the rotating support plate is provided with a light blocking sheet and a photoelectric switch, so as to provide signals for the rotation control of the rotating support plate.
Furthermore, one side of the rotary supporting plate is provided with an elastic anti-collision block.
Furthermore, the adsorption table is made of elastic materials with certain toughness.
Furthermore, the bottom of the ceramic wafer adsorption position is uniformly provided with a plurality of ceramic adsorption holes, the periphery of the ceramic wafer adsorption position is uniformly surrounded with a plurality of paper adsorption holes, and the ceramic adsorption holes and the paper adsorption holes are respectively controlled by two air passages.
Furthermore, the X-axis rolling device and the Y-axis rolling device are respectively composed of an installation seat, a roller wheel and deep groove ball bearings, the deep groove ball bearings are arranged at two ends of the roller wheel, the roller wheel is rotatably arranged on the installation seat through the deep groove ball bearings at the two ends, and the X-axis rolling device and the Y-axis rolling device are movably arranged on the Y-axis moving driving device through a third connecting seat.
Compared with the prior art, the invention has the beneficial effects that:
1. the method is suitable for full-automatic production and flexible production of hard and brittle materials;
2. the method is suitable for the fracture of the scribed lines of various hard and brittle materials, in particular for the fracture of the hard and brittle materials (the thickness of the hard and brittle materials is less than 0.5 mm) which are thinner and the parts are smaller;
3. the production efficiency is improved, the labor is saved, and the yield of products is improved;
4. the labor cost is reduced, the product quality is improved, the stability of the product quality is ensured, and the method is green and environment-friendly.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a hard and brittle material breaking device according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a carrying mechanism according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a rotary splitting table according to an embodiment of the present invention;
FIG. 4 is a second schematic structural diagram of a rotary cracking table according to the embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a splinter mechanism according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a paper feeding mechanism according to an embodiment of the present invention;
FIG. 7 is a schematic view of a ceramic sheet with paper placed thereon according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of the material receiving box according to the embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
Examples
The embodiment of the invention provides a hard and brittle material cracking device which is applied to cracking processing of hard and brittle materials after laser processing in the semiconductor industry, the panel display industry, the PCB industry and the 3C industry.
Silicon wafers, quartz glass, sapphire, ceramics and the like are common for hard and brittle materials in the semiconductor industry, the panel display industry, the PCB industry and the 3C industry. The product parts processed by the materials are characterized by small size and high precision; the crystal oscillator is usually a small-sized cuboid and is applied to products such as crystal oscillators, chips, LED lamps and the like. The processing technology is that laser is adopted to perform scribing on hard and brittle materials such as silicon wafers, quartz glass and the like according to the size of a processed part, namely, half-cutting processing (according to the process, a thin line with a certain depth of the material thickness is scribed from the surface of the material, attention is paid to that the hard and brittle materials cannot be cut off at one time, because the size of a generally processed product is very small, such as particles with the length of 1mm, the width of 0.9mm, the thickness of 0.01mm and the size precision of +/-0.002 mm, processing in two directions of XY is needed, the processing process is often accompanied with movement in two directions of XY, the brittle material is adsorbed on a positioning clamp (vacuum adsorption, the product cannot be displaced in the whole processing process, so the vacuum can not be broken in the processing process), and auxiliary actions such as blowing ion wind (in order to remove charged dust adsorbed on the brittle material) are carried out on the brittle material, these secondary actions can cause the product to be blown away by the ion wind at 1mm x 0.9mm x 0.01mm, and the particles are difficult to collect; when the machining is carried out to a certain process, the vacuum to be cut is broken by the vacuum absorption, the product to be cut is displaced, the machining precision cannot be reached, and the like, so that a scribing machining mode is adopted). And after scribing, cracking the brittle material to obtain a product meeting the size requirement.
Specifically, referring to fig. 1, the hard and brittle material cracking device comprises a bottom plate 1, a carrying mechanism 2, a rotary cracking table 3, a scribing platform 4, a paper placing mechanism 5, a cracking mechanism 6 and a material receiving box 7, wherein the scribing platform 4, the carrying mechanism 2, the rotary cracking table 3, the paper placing mechanism 5, the cracking mechanism 6 and the material receiving box 7 are all fixedly arranged on the bottom plate 1, the scribing platform 4 is used for placing scribed ceramic sheets, the carrying mechanism 2 is used for driving the rotary cracking table 3 to move, the ceramic sheets on the scribing platform 4 are taken away through the rotary cracking table 3, the paper placing mechanism 5 is used for paving a layer of paper on the ceramic sheets of the rotary cracking table 3, the cracking mechanism 6 is used for cracking the ceramic sheets of the rotary cracking table 3, and the material receiving box 7 is used for collecting cracked finished products. Under the control of the PLC, the automatic feeding device can automatically take materials, turn over, place paper, split sheets and feed materials.
As shown in fig. 2, the carrying mechanism 2 includes a first X-axis movement driving device 21 and a Z-axis movement driving device 22, the Z-axis movement driving device 22 is movably disposed on the first X-axis movement driving device 21, and is driven by the first X-axis movement driving device 21 to move along the X-axis direction, and the rotary cracking table 3 is movably disposed on the Z-axis movement driving device 22 and is driven by the Z-axis movement driving device 22 to move along the Z-axis direction. The first X-axis movement driving device 21 and the Z-axis movement driving device 22 are composed of a servo motor and a lead screw guide rail mechanism. The scribing platform 4, the paper placing mechanism 5, the scribing mechanism 6 and the material receiving box 7 are all positioned on one side of the first X-axis moving driving device 21.
As shown in fig. 3 and 4, the rotary cracking table 3 includes a rotating device 31, a rotary supporting plate 32 and an adsorbing table 33, the rotary supporting plate 32 is rotatably connected to an output end of the rotating device 31, the rotary supporting plate 32 is provided with the adsorbing table 33, the rotating device 31 includes a rotating motor 311, a coupler 312 and a second connecting seat 313, one side surface of the second connecting seat 313 is provided with the rotating motor 311, the other side surface of the second connecting seat 313 is rotatably connected to the rotary supporting plate 32, an output end of the rotating motor 311 is connected to the rotary supporting plate 32 through the coupler 312, the adsorbing table 33 is provided with a ceramic wafer adsorbing position, the bottom of the ceramic wafer adsorbing position is uniformly provided with a plurality of ceramic adsorbing holes 331, the periphery of the ceramic wafer adsorbing position is uniformly provided with a plurality of paper adsorbing holes 332, the ceramic adsorbing holes 331 are used for adsorbing the ceramic wafer on the scribing platform on the ceramic wafer adsorbing position, the paper adsorbing holes 332 are used, the ceramic adsorption holes 331 and the paper adsorption holes 332 are respectively controlled by designing two air passages in the rotary support plate 32, the air flow and the air pressure are independently controlled, the ceramic wafer is kept still after being split into small pieces, the splitting success rate is ensured, and the air pressure and the air flow can be changed according to requirements in the splitting process due to the fact that the two air passages are respectively controlled, and the splitting requirements are met. The rotating support plate 32 is made of duralumin or high strength steel. The ceramic adsorption holes 331 are small holes, the aperture is 1mm, and the hole spacing is small; the paper adsorption holes 332 are holes with a larger diameter ratio, and the hole diameter is 2 mm.
Further, one side of the rotating support plate 32 is provided with a light blocking sheet 34, a photoelectric switch 35 and an elastic anti-collision block 36, the light blocking sheet 34 and the photoelectric switch 35 can provide signals for the rotation control of the rotating support plate 32, two elastic anti-collision blocks 36 are arranged up and down, so that the rotating support plate 32 can rotate clockwise and anticlockwise to prevent collision, and the rotating stroke of the rotating support plate 32 is 190 °.
Preferably, the adsorption table 33 is made of an elastic material (such as silica gel) with certain toughness, and when ceramic wafer cracks are slightly deformed, the adsorption table is slightly deformed, so that the ceramic wafer cracks are prevented from being extruded with each other, and edge breakage and crushing caused by hard touch and hard contact are avoided to generate an NG product.
As shown in fig. 5, the splinter mechanism 6 includes a second X-axis moving driving device 61, a Y-axis moving driving device 62, an X-axis rolling device 63, and a Y-axis rolling device 64, the Y-axis moving driving device 62 is movably disposed on the second X-axis moving driving device 61, and is driven by the second X-axis moving driving device 61 to move along the X-axis direction, and the X-axis rolling device 63 and the Y-axis rolling device 64 are movably disposed on the Y-axis moving driving device 62, and are driven by the Y-axis moving driving device 62 to move along the Y-axis direction. And the ceramic wafer is rolled by the X-axis rolling device 63 and the Y-axis rolling device 64 to realize the splitting of the ceramic wafer in the X direction and the Y direction. The second X-axis movement driving device 61 and the Y-axis movement driving device 62 are composed of a servo motor and a lead screw guide mechanism. The X-axis rolling device 63 and the Y-axis rolling device 64 are respectively composed of an installation seat 631, a roller 632 and deep groove ball bearings 633, the deep groove ball bearings 633 are arranged at two ends of the roller 632, the roller 632 is rotatably arranged on the installation seat 631 through the deep groove ball bearings 633 at the two ends, and the X-axis rolling device 63 and the Y-axis rolling device 64 are movably arranged on the Y-axis moving driving device 62 through a third connection seat 65. The roller 632 is made of stainless steel or tool steel, and the surface is plated with hard chrome; the surface is required to be smooth, the surface roughness is Ra0.4, and the surface hardness is high.
As shown in fig. 6, the paper feeding mechanism 5 includes a first connecting seat 51, a guide pillar 52, a movable supporting plate 53, a linear bearing 54, a stopper 55 and a magnet 56, the guide pillar 52 is vertically fixed on the first connecting seat 51, the movable supporting plate 53 is provided with a movable through hole and a paper slot, the movable through hole is movably connected with the guide pillar 52 through the linear bearing 54, the linear bearing 54 has a guiding and sliding effect, the stopper 55 is provided at the top end of the guide pillar 52 to prevent the movable supporting plate 53 from being separated from the guide pillar 52, the paper slot faces the first X-axis moving driving device 21, the paper slot is provided with an upper opening and a lower opening, the paper slot is used for placing adsorption paper, the magnets 56 are provided at two sides of the paper slot. The paper placing mechanism 5 can realize that paper is squared to the surface of the ceramic plate, as shown in fig. 7, and for the action of the paper, 1, the roller 632 and the ceramic plate are isolated, so that the roller 632 is prevented from being in hard-to-hard contact with the ceramic plate, and the edge of the ceramic plate is prevented from being broken; 2. the ceramic wafer is adsorbed and compressed, so that NG products are prevented from being generated due to movement when the ceramic wafer is cracked; 3. prevent the static electricity from being generated, so that the ceramic particles and the roller 632 are adsorbed together, and NG products are generated during the splitting.
The outer layer of the material receiving box 7 is made of stainless steel, and as shown in fig. 8, an elastic rubber pad 71 is attached to the inner layer, so that the problem that the ceramic plate collides with the stainless steel of the material receiving box to generate NG products is avoided.
The motion process is as follows:
A. the carrying mechanism 2 drives the rotary cracking table 3 to move towards the scribing platform 4, and when the rotary cracking table is about to reach the scribing platform 4, the rotary supporting plate 32 rotates to enable the adsorption table 33 to face downwards until the adsorption position of the ceramic chip is positioned right above the ceramic chip of the scribing platform 4 (note that the laser scribing processing surface of the ceramic chip is upwards placed on the scribing platform 4);
B. the rotary cracking table 3 moves downwards, the ceramic wafer is adsorbed from the scribing platform 4, the carrying mechanism 2 drives the rotary cracking table 3 to move towards the paper placing mechanism 5, when the rotary cracking table reaches the paper placing mechanism 5, the rotary supporting plate 32 rotates to turn over the ceramic wafer, the surface of the ceramic wafer without scribing is upward (the surface is not turned over, and the edge of a scribing inlet is easy to be broken to cause NG products in the process of cracking), when the rotary cracking table 3 moves to the position right below the paper placing mechanism 5, the rotary cracking table moves upwards, and the paper on the paper placing mechanism 5 is just attached to the surface of the ceramic;
C. the rotary cracking platform 3 continues to move upwards to carry the ceramic sheet, and the paper on the paper placing mechanism 5 reaches the specified cracking position;
D. the X-axis rolling device 63 and the Y-axis rolling device 64 move right above the paper feeding mechanism 5, and the rotary splitting table 3 moves upward at a slight position, such as: 1mm, so that the roller 632 is in contact with the paper on the ceramic sheet, and the roller 632 can apply pressure to the ceramic sheet (when the ceramic sheet is cracked, the roller 632 applies certain pressure to the paper, and the pressure is adjusted by adjusting the distance between the ceramic sheet and the center of the roller 632);
E. the roller 632 of the X-axis rolling device 63 performs a splitting movement once from right to left to complete the splitting in the left-right direction, and the roller 632 of the Y-axis rolling device 64 performs a splitting movement twice from back to front (after the roller 632 of the Y-axis rolling device 64 performs a splitting movement once from back to front, the rotary splitting table 3 moves downward, the Y-axis rolling device 64 resets, the rotary splitting table 3 moves upward to the splitting position, and the roller 632 of the Y-axis rolling device 64 performs a splitting movement twice from back to front to complete the splitting movement twice in the front-back direction). In this process, attention is paid to: 1. each splinter movement can only move in one direction and cannot move back and forth (such as from left to right and then from right to left), otherwise NG products are easy to generate; 2. each time the roller 632 returns to the splitting position, the rotating splitting table 3 moves downward to allow the paper on the adsorption table 33 to move away from the roller 632; 3. the cracking pressure is adjusted by adjusting the upward movement distance of the rotary cracking table 3;
F. after the splinter is finished, the carrying mechanism 2 drives the rotary splinter table 3 to move right above the material receiving box 7, the rotary supporting plate 32 rotates, the ceramic adsorption holes 331 blow back gas, and it is guaranteed that all splinter parts are poured completely and the adsorption table 33 is clean.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The hard and brittle material cracking device is characterized in that: the scribing platform, the carrying mechanism, the rotary splitting table and the splitting mechanism are fixedly arranged on the bottom plate;
the carrying mechanism comprises a first X-axis moving driving device and a Z-axis moving driving device, the Z-axis moving driving device is movably arranged on the first X-axis moving driving device and is driven by the first X-axis moving driving device to move along the X-axis direction, and the rotary splinter table is movably arranged on the Z-axis moving driving device and is driven by the Z-axis moving driving device to move along the Z-axis direction;
the rotary cracking table comprises a rotating device, a rotary supporting plate and an adsorption table, the rotary supporting plate is rotatably connected with the output end of the rotating device, the rotary supporting plate is provided with the adsorption table, and the adsorption table is provided with a ceramic wafer adsorption position;
the scribing platform and the splitting mechanism are positioned on one side of the first X-axis movement driving device, the scribed ceramic wafer is placed on the scribing platform, and the ceramic wafer on the scribing platform is adsorbed on the ceramic wafer adsorption position through the adsorption platform of the rotary splitting platform;
the splitting mechanism comprises a second X-axis moving driving device, a Y-axis moving driving device, an X-axis rolling device and a Y-axis rolling device, the Y-axis moving driving device is movably arranged on the second X-axis moving driving device and is driven by the second X-axis moving driving device to move along the X-axis direction, and the X-axis rolling device and the Y-axis rolling device are movably arranged on the Y-axis moving driving device and are driven by the Y-axis moving driving device to move along the Y-axis direction;
and the ceramic wafer on the ceramic wafer adsorption position is rolled by the X-axis rolling device and the Y-axis rolling device to realize the splitting of the ceramic wafer in the X direction and the Y direction.
2. The hard brittle material breaking device according to claim 1, characterized in that: the hard and brittle material splitting device further comprises a paper placing mechanism, the paper placing mechanism is fixedly arranged on the bottom plate and located on one side of the first X-axis moving driving device, the paper placing mechanism comprises a first connecting seat, a guide pillar, a movable supporting plate, a linear bearing, a stop block and a magnet, the guide pillar is vertically fixed on the first connecting seat, a movable through hole and a paper groove are formed in the movable supporting plate, the movable through hole is movably connected with the guide pillar through the linear bearing, the stop block is arranged at the top end of the guide pillar, the paper groove faces the first X-axis moving driving device, an upper opening and a lower opening are formed in the paper groove, and the magnet is arranged on two sides of the paper groove.
3. The hard brittle material breaking device according to claim 1, characterized in that: the hard and brittle material cracking device further comprises a material receiving box, the material receiving box is fixedly arranged on the bottom plate and located on one side of the first X-axis moving driving device, and a layer of elastic rubber mat is arranged on the inner layer of the material receiving box.
4. The hard brittle material breaking device according to claim 1, characterized in that: the first X-axis movement driving device, the Z-axis movement driving device, the second X-axis movement driving device and the Y-axis movement driving device are all composed of servo motors and lead screw guide rail mechanisms.
5. The hard brittle material breaking device according to claim 1, characterized in that: the rotating device comprises a rotating motor, a coupler and a second connecting seat, wherein the rotating motor is arranged on one side face of the second connecting seat, the other side face of the second connecting seat is rotatably connected with a rotating support plate, and the output end of the rotating motor is connected with the rotating support plate through the coupler.
6. The hard brittle material breaking device according to claim 1, characterized in that: and a light blocking sheet and a photoelectric switch are arranged on one side of the rotating support plate to provide signals for the rotation control of the rotating support plate.
7. The hard brittle material breaking device according to claim 1, characterized in that: and one side of the rotating support plate is provided with an elastic anti-collision block.
8. The hard brittle material breaking device according to claim 1, characterized in that: the adsorption table is made of elastic materials with certain toughness.
9. The hard brittle material breaking device according to claim 1, characterized in that: the bottom of potsherd adsorbs the position evenly is equipped with a plurality of pottery and adsorbs the hole, potsherd adsorbs the week portion of position evenly to enclose and is equipped with a plurality of paper and adsorbs the hole, pottery adsorbs the hole and paper and adsorbs the hole and adopts two way air flues to control respectively.
10. The hard brittle material breaking device according to claim 1, characterized in that: the X-axis rolling device and the Y-axis rolling device are respectively composed of an installation seat, a roller wheel and deep groove ball bearings, the deep groove ball bearings are arranged at two ends of the roller wheel, the roller wheel is rotatably arranged on the installation seat through the deep groove ball bearings at the two ends, and the X-axis rolling device and the Y-axis rolling device are movably arranged on the Y-axis moving driving device through a third connecting seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010562123.XA CN111590763A (en) | 2020-06-18 | 2020-06-18 | Hard and brittle material lobe of a leaf device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010562123.XA CN111590763A (en) | 2020-06-18 | 2020-06-18 | Hard and brittle material lobe of a leaf device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111590763A true CN111590763A (en) | 2020-08-28 |
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| CN202010562123.XA Pending CN111590763A (en) | 2020-06-18 | 2020-06-18 | Hard and brittle material lobe of a leaf device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114851411A (en) * | 2022-06-02 | 2022-08-05 | 深圳市光道激光技术有限公司 | Brittle plate splitting machine and splitting process |
| CN115124229A (en) * | 2022-08-31 | 2022-09-30 | 中电科风华信息装备股份有限公司 | Full-automatic mechanical sheet splitting and waste edge removing mechanism for UTG ultrathin glass |
-
2020
- 2020-06-18 CN CN202010562123.XA patent/CN111590763A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114851411A (en) * | 2022-06-02 | 2022-08-05 | 深圳市光道激光技术有限公司 | Brittle plate splitting machine and splitting process |
| CN115124229A (en) * | 2022-08-31 | 2022-09-30 | 中电科风华信息装备股份有限公司 | Full-automatic mechanical sheet splitting and waste edge removing mechanism for UTG ultrathin glass |
| CN115124229B (en) * | 2022-08-31 | 2022-11-11 | 中电科风华信息装备股份有限公司 | Full-automatic mechanical sheet cracking and waste edge removing mechanism for UTG (ultra-thin glass) |
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