CN114126201B - PCB based on pulse VCP electroplating and preparation method thereof - Google Patents
PCB based on pulse VCP electroplating and preparation method thereof Download PDFInfo
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- CN114126201B CN114126201B CN202111452350.8A CN202111452350A CN114126201B CN 114126201 B CN114126201 B CN 114126201B CN 202111452350 A CN202111452350 A CN 202111452350A CN 114126201 B CN114126201 B CN 114126201B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70025—Production of exposure light, i.e. light sources by lasers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a PCB based on pulse VCP electroplating and a preparation method thereof, comprising a PCB carrier substrate, wherein the method comprises the following steps: s1, vacuum lamination; s2, horizontally depositing copper; s3, VCP electroplating; s4, self-attaching a dry film; s5, performing laser direct writing exposure; s6, developing a dry film; s7, secondary electroplating; s8, alkaline etching; s9, welding elements; s10, solder resist printing. According to the invention, the heat dissipation components are arranged in the PCB, on the side and on the top, so that the heat dissipation efficiency is improved, the VCP electroplating and the laser direct writing exposure are combined to produce the PCB, the pulse current VCP electroplating is adopted, the copper plating depth capability reaches 100%, the thicknesses of plated hole copper and surface copper are 1:1, the product quality is remarkably improved, the laser direct writing exposure is adopted, a circuit film does not need to be manufactured, the problem of circuit exposure caused by the expansion and contraction of a circuit negative film does not exist, and the problem of underexposure or overexposure caused by energy deficiency does not occur.
Description
Technical Field
The invention relates to the technical field of PCB production and preparation, in particular to a PCB based on pulse VCP electroplating and a preparation method thereof.
Background
Currently, widely used PCB (Printed circuit board ) boards are copper/epoxy glass cloth or phenolic resin glass cloth substrates, and there are also a small number of paper-based copper-clad boards used.
These substrates, although having excellent electrical properties and workability, have relatively poor heat dissipation properties, and therefore, in general, it is difficult to conduct heat from the resin of the PCB itself to the heat dissipation path of the highly heat-generating components on the PCB, and the heat is mainly dissipated from the surface of the components to the surrounding air.
However, as electronic products have entered the times of miniaturization, high-density mounting and high-heat-generation assembly of components, if the electronic products are cooled only by the surfaces of components with very small surface areas, the cooling effect is very insufficient, and especially the electronic products are used in a large amount of surface-mounted components such as QFP, BGA and the like, the heat generated by the components is also transferred to the PCB in a large amount, and the electronic products work in a long-time high-temperature environment, so that the service life of the PCB is easily reduced, and the equipment is lost.
The existing PCB is mainly characterized in that a radiating block is arranged on the PCB through welding, or a special radiator customized according to the position and the height of a heating device on the PCB is added, or different element height positions are cut out on a large flat radiator. The heat dissipation cover is integrally fastened on the element surface and is contacted with each element to dissipate heat. The technical means has high cost and poor heat dissipation effect.
Disclosure of Invention
In order to solve the technical problems, the invention provides a PCB board based on pulse VCP electroplating and a preparation method thereof, and the heat dissipation components are arranged in the PCB board, on the side and on the top, so that the heat dissipation efficiency of the PCB board is greatly improved, the PCB board is produced in a mode of combining VCP electroplating with laser direct writing exposure, the copper plating depth capability reaches 100% through pulse current VCP electroplating, the thickness of plated hole copper and surface copper is 1:1, the product quality is obviously improved, the laser direct writing exposure does not need to manufacture a circuit film, the problem of circuit exposure caused by expansion and contraction of a circuit film does not exist, the problem of underexposure or overexposure caused by insufficient energy does not occur, and meanwhile, the exposure speed is high, and the efficiency is high.
In order to achieve the technical purpose, the technical scheme of the invention is realized as follows:
the PCB based on pulse VCP electroplating comprises a PCB carrier substrate, wherein the PCB carrier substrate comprises an inner heat dissipation fiber layer and a glass fiber substrate layer, the glass fiber substrate layer is coated on two sides of the outer layer of the inner heat dissipation fiber layer, copper foil layers are coated on two sides of the outer layer of the glass fiber substrate layer, solder resist ink layers are coated on two sides of the outer layer of the copper foil layers, and flame retardant ink layers are coated on two sides of the outer layer of the solder resist ink layers; the surface of PCB board is provided with a plurality of PCB component, and PCB component's pin is connected with the copper foil layer, and PCB component's outside is provided with the heat dissipation protective layer, and PCB board's both sides are provided with lateral part fire-retardant layer, and the outside cladding on lateral part fire-retardant layer has the thermal insulation to hinder electric layer, and the outside cladding on thermal insulation to hinder electric layer has the heat conduction fin.
A preparation method of a PCB based on pulse VCP electroplating specifically comprises the following steps:
s1, vacuum lamination: each layer of the PCB is: stacking the inner heat dissipation fiber layer, the glass fiber substrate layer and the copper foil layer in sequence, placing the stacked layers under a vacuum sub-pressing machine for vacuum pressing, controlling the vacuum pressing temperature to be less than or equal to 20 ℃, controlling the vacuum degree to be-0.1 MPa, and repeatedly pressing the stacked layers until the thickness of the stacked layers is not changed;
s2, horizontally depositing copper: the method comprises the steps of removing burrs from openings of pressed copper-clad plates, immersing the copper-clad plates in deoiling liquid to remove greasy dirt, ensuring uniform reflux circulating concentration of deoiling liquid during deoiling, opening micro pits on a base material at a drilling position after cleaning, horizontally placing the copper-clad plates in a copper precipitation tank, chemically drilling holes through colloid palladium to pretzel and secondarily electrochemically horizontally coppering, depositing copper on the surface of an insulating base material at the drilling holes, and realizing interlayer electrical connection;
s3, VCP electroplating: placing the copper-clad plate subjected to vacuum lamination in a VCP electroplating bath, adding a special copper plating brightening agent, a copper plating carrier and a copper solution mixed electroplating copper solution, carrying out VCP electroplating by using pulse waveform current, and carrying out electroplating copper on the surface of the copper-clad plate and a layer hole by controlling the positive and negative current proportion and the positive and negative current time and controlling the VCP electroplating temperature and the electroplating solution reflux ratio;
s4, self-adhesive dry film: flattening the VCP electroplated copper-clad plate, automatically covering the cut dry film with proper size on two sides of the copper-clad plate, extruding the dry film by a film pressing device, removing residual bubbles in the dry film by vacuumizing to enable the dry film to be in seamless lamination with the copper-clad plate, and performing secondary extrusion on the dry film and the copper-clad plate to enable the dry film to be firmly laminated;
s5, laser direct writing exposure: placing the copper-clad plate with the dry film under a laser direct-writing exposure machine, adopting a special camera for positioning and a camera to perform accurate automatic alignment control with a positioning hole on the real object copper-clad plate, and starting a laser light source to perform multi-light source scanning type accumulated direct-writing exposure;
s6, developing a dry film: placing the copper-clad plate subjected to laser direct writing exposure in a developing machine added with a developing solution for dry film development, and controlling the developing temperature to be not more than 30 ℃ by the reflux circulation of the developing solution during development, and developing under low pressure and low oxygen to avoid bubbles generated by the developing solution;
s7, secondary electroplating: performing secondary VCP copper electroplating on the developed copper-clad plate, performing VCP tin electroplating after the thickness of the electroplated layer fish dry film is the same, controlling the forward and reverse current proportion, the forward and reverse current time, the temperature and the reflux ratio of electroplating to be the same as those of primary electroplating, removing the residual dry film of the developed copper-clad plate by adopting a film removing liquid after the electroplating is completed, and reserving a tin layer and a copper layer at the lower part;
s8, alkaline etching: placing the copper-clad plate subjected to secondary electroplating in an etching machine added with etching liquid for etching, controlling the etching temperature to be not more than 30 ℃ during etching, etching under the conditions of vacuum low pressure and low oxygen to avoid bubbles generated by the etching liquid, discharging the etching liquid after etching, cleaning, adding tin stripping liquid for stripping tin, and carrying out the reflux circulation of the tin stripping liquid during stripping tin to keep the VCP copper electroplated layer;
s9, welding elements: welding the etched PCB to the required PCB element according to a schematic diagram, cleaning redundant solder, coating a lateral flame-retardant layer and a heat-insulating and electricity-blocking layer on the lateral part of the PCB, connecting a heat-conducting radiating fin with the lateral part of an inner heat-radiating fiber layer, so that the inner heat-radiating fiber layer and the heat-conducting fin can mutually conduct heat, performing AIO intermediate inspection on the copper-clad plate, and maintaining an inert gas environment or vacuumizing the whole AIO intermediate inspection process;
s10, solder resist printing: coating a layer of solder resist on the surface of the qualified copper-clad plate in AIO by adopting a screen printing mode, performing laser direct writing exposure and development on the solder resist, performing secondary screen printing, secondary exposure and development to form a solder resist ink layer, coating a flame-retardant ink layer on the surface of the solder resist ink layer, curing the flame-retardant ink layer through exposure, performing character printing baking, surface treatment, binding and forming, electrically testing, and connecting a prepared heat radiation protection layer on a PCB (printed circuit board) to enable heat conduction between the PCB and the heat radiation protection layer to be performed, and performing finished product testing and appearance machine testing again.
Preferably, the VCP electroplated copper solution in step 3 of the preparation method is: 30-45g/L of copper sulfate, 10-20g/L of monopotassium phosphate, 10-15g/L of dipotassium phosphate, 15-25g/L of artificial plasma, 5-10g/L of ammonium bromide and deionized water.
Preferably, the special copper plating brightening agent for VCP electroplating in the step 3 of the preparation method is as follows: 2.5-4.5g/L of copper sulfate, 50-90g/L of zinc sulfate, 50-100g/L of sulfuric acid, 1.5-2.5g/L of saccharin, 2-5g/L of citric acid, 0.005-0.015g/L of diammine blue, 2-4g/L of sodium dodecyl sulfate, 2-5g/L of sodium dodecyl sulfate and deionized water.
Preferably, in the step 3 of the preparation method, the forward and reverse current ratio of VCP electroplating is 1:1, the forward and reverse current time is 1:1, the VCP electroplating temperature is controlled to be less than or equal to 20 ℃, and the reflux ratio of the electroplating solution is 1:3.
Preferably, the exposure speed of the laser direct-writing exposure in the step 5 of the preparation method is 10-20s, and the number of times of multi-light source scanning type accumulated direct-writing exposure is more than or equal to 3.
Preferably, the developing solution for dry film development in the preparation method step 6 is: 10-15g/L of sodium hydroxide, 5-12g/L of diglycolamine, 5-9g/L of dipotassium hydrogen phosphate, 5-7g/L of monopotassium phosphate, 2-5g/L of citric acid, 3-6g/L of sodium dodecyl benzene sulfonate, 2-4g/L of sodium lauryl sulfate and deionized water.
Preferably, the etching solution for alkaline etching in the preparation method step 8 is: 20-30g/L of sodium hydroxide, 10-20g/L of sodium sulfide, 10-15g/L of dipotassium hydrogen phosphate, 15-25g/L of monopotassium phosphate, 5-10g/L of sodium dodecyl benzene sulfonate, 5-8g/L of sodium lauryl sulfate, 4-9g/L of polyalcohol, 15-20g/L of sodium pyrophosphate, 5-15g/L of 1, 5-pentamethylene tetrazole, 10-15g/L of artificial blood plasma and deionized water.
Preferably, the solder resist ink for solder resist printing in the preparation method step 10 is: 40-70g/L of beta-hydroxyethyl acrylate modified melamine formaldehyde resin, 30-60g/L of linear polyester with carboxyl end group, 20-40g/L of hyperbranched resin, 10-15g/L of reactive diluent, 15-20g/L of photoinitiator and 8-15g/L, feTiO of pigment 3 MgTiO 3 10-20g/L, 20-50g/L solvent, 5-8g of toughening agentL, 4-7g/L of curing agent and 3-6g/L of dispersing agent.
The invention has the beneficial effects that: according to the PCB based on pulse VCP electroplating, through arranging the heat dissipation parts in the interior, the side parts and the top of the PCB, the heat dissipation efficiency of the whole PCB is greatly improved, the possibility of thermal deformation of the PCB is reduced, the VCP electroplating and the laser direct writing exposure are combined, the production cost is reduced by adopting a mode of combining the VCP electroplating with the laser direct writing exposure, the copper plating depth capability reaches 100%, the thickness of plating hole copper and surface copper is 1:1, the product quality is remarkably improved, the problem of circuit exposure caused by circuit film manufacturing and the expansion and contraction of a circuit negative film is not required by laser direct writing exposure, the problem of underexposure or overexposure caused by insufficient energy is not caused, the exposure speed is high, the efficiency is high, the final product quality of the PCB is remarkably improved by secondary electroplating, the PCB is scientific and reasonable in design, the production is realized by adopting the most advanced mode, the production is facilitated, the production cost is reduced, the economic benefit is improved, and the good market application prospect and the market popularization value is realized.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a PCB board based on pulse VCP plating according to the present invention.
Fig. 2 is a schematic diagram of a local structure of a PCB board based on pulse VCP plating according to the present invention.
In the figure: 1. an inner heat dissipation fiber layer; 2. a glass fiber substrate layer; 3. a copper foil layer; 4. a solder resist ink layer; 5. a flame retardant ink layer; 6. a PCB element; 7. a heat dissipation protective layer; 8. a side flame retardant layer; 9. a thermal insulation layer; 10. and a heat conducting and radiating fin.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1 and 2, a PCB board based on pulse VCP electroplating includes a PCB carrier substrate, the PCB carrier substrate includes an inner layer heat dissipation fiber layer 1 and a glass fiber substrate layer 2, the glass fiber substrate layer 3 is coated on two sides of an outer layer of the inner layer heat dissipation fiber layer 1, copper foil layers 3 are coated on two sides of an outer layer of the glass fiber substrate layer 2, solder resist ink layers 4 are coated on two sides of an outer layer of the copper foil layers 3, a flame retardant ink layer 5 is coated on two sides of an outer layer of the solder resist ink layers 4, a plurality of PCB elements 6 are arranged on the surface of the PCB board, pins of the PCB elements 6 are connected with the copper foil layers 3, a heat dissipation protection layer 7 is arranged outside the PCB elements 6, side flame retardant layers 8 are arranged on two sides of the PCB board, an insulating and power blocking layer 9 is coated on the outer side of the side flame retardant layers 8, and a heat conducting fin 10 is coated on the outer side of the insulating and power blocking layer 9.
Based on the PCB, a preparation method of the PCB based on pulse VCP electroplating is further provided, and the preparation method specifically comprises the following steps:
s1, vacuum lamination: each layer of the PCB is: stacking the inner heat dissipation fiber layer 1, the glass fiber substrate layer 2 and the copper foil layer 3 in sequence, placing the stacked layers under a vacuum sub-pressing machine for vacuum pressing, controlling the vacuum pressing temperature to be less than or equal to 20 ℃, controlling the vacuum degree to be-0.1 MPa, and repeatedly pressing the stacked layers until the thickness of the stacked layers is not changed;
s2, horizontally depositing copper: the method comprises the steps of removing burrs from openings of pressed copper-clad plates, immersing the copper-clad plates in deoiling liquid to remove greasy dirt, ensuring uniform reflux circulating concentration of deoiling liquid during deoiling, opening micro pits on a base material at a drilling position after cleaning, horizontally placing the copper-clad plates in a copper precipitation tank, chemically drilling holes through colloid palladium to pretzel and secondarily electrochemically horizontally coppering, depositing copper on the surface of an insulating base material at the drilling holes, and realizing interlayer electrical connection;
s3, VCP electroplating: placing the copper-clad plate subjected to vacuum lamination in a VCP electroplating bath, adding a special copper plating brightening agent, a copper plating carrier and a copper solution mixed electroplating copper solution, carrying out VCP electroplating by using pulse waveform current, and carrying out electroplating copper on the surface of the copper-clad plate and a layer hole by controlling the positive and negative current proportion and the positive and negative current time and controlling the VCP electroplating temperature and the electroplating solution reflux ratio;
s4, self-adhesive dry film: flattening the VCP electroplated copper-clad plate, automatically covering the cut dry film with proper size on two sides of the copper-clad plate, extruding the dry film by a film pressing device, removing residual bubbles in the dry film by vacuumizing to enable the dry film to be in seamless lamination with the copper-clad plate, and performing secondary extrusion on the dry film and the copper-clad plate to enable the dry film to be firmly laminated;
s5, laser direct writing exposure: placing the copper-clad plate with the dry film under a laser direct-writing exposure machine, adopting a special camera for positioning and a camera to perform accurate automatic alignment control with a positioning hole on the real object copper-clad plate, and starting a laser light source to perform multi-light source scanning type accumulated direct-writing exposure;
s6, developing a dry film: placing the copper-clad plate subjected to laser direct writing exposure in a developing machine added with a developing solution for dry film development, and controlling the developing temperature to be not more than 30 ℃ by the reflux circulation of the developing solution during development, and developing under low pressure and low oxygen to avoid bubbles generated by the developing solution;
s7, secondary electroplating: performing secondary VCP copper electroplating on the developed copper-clad plate, performing VCP tin electroplating after the thickness of the electroplated layer fish dry film is the same, controlling the forward and reverse current proportion, the forward and reverse current time, the temperature and the reflux ratio of electroplating to be the same as those of primary electroplating, removing the residual dry film of the developed copper-clad plate by adopting a film removing liquid after the electroplating is completed, and reserving a tin layer and a copper layer at the lower part;
s8, alkaline etching: placing the copper-clad plate subjected to secondary electroplating in an etching machine added with etching liquid for etching, controlling the etching temperature to be not more than 30 ℃ during etching, etching under the conditions of vacuum low pressure and low oxygen to avoid bubbles generated by the etching liquid, discharging the etching liquid after etching, cleaning, adding tin stripping liquid for stripping tin, and carrying out the reflux circulation of the tin stripping liquid during stripping tin to keep the VCP copper electroplated layer;
s9, welding elements: welding the etched PCB board with the required PCB element 6 according to a schematic diagram, cleaning redundant solder, coating a lateral flame-retardant layer 8 and a heat-insulating and electricity-blocking layer 9 on the lateral part of the PCB board, connecting a heat-conducting radiating fin 10 with the lateral part of the inner-layer heat-radiating fiber layer 1, enabling the inner-layer heat-radiating fiber layer 1 and the heat-conducting radiating fin 10 to mutually conduct heat, performing AIO middle inspection on the copper-clad plate, and maintaining an inert gas environment or vacuumizing the whole AIO middle inspection process;
s10, solder resist printing: and (3) coating a layer of solder resist on the surface of the copper-clad plate qualified in AIO by adopting a screen printing mode, performing laser direct writing exposure and development on the solder resist, performing secondary screen printing, secondary exposure and development to form a solder resist ink layer 4, coating a flame-retardant ink layer 5 on the surface of the solder resist ink layer 4, curing the solder resist ink layer by exposure, fixing a prepared heat radiation protection layer 7 on a PCB board after character printing baking, surface treatment, binding formation, electrical measurement and inspection, and connecting the heat radiation protection layer 7 with a heat conduction heat radiation fin 10, so that heat conduction can be performed between the heat radiation protection layer and the solder resist ink layer, and performing finished product test and appearance machine inspection again.
Wherein, the copper solution for VCP electroplating is: 35g/L copper sulfate, 15g/L potassium dihydrogen phosphate, 10g/L dipotassium hydrogen phosphate, 20g/L artificial plasma, 8g/L ammonium bromide and deionized water.
Wherein, the special copper plating brightening agent for VCP electroplating is as follows: 3.5g/L of copper sulfate, 70g/L of zinc sulfate, 80g/L of sulfuric acid, 2.0g/L of saccharin, 4g/L of citric acid, 0.01g/L of diammine blue, 3g/L of sodium dodecyl sulfate and deionized water.
Wherein, the positive and negative current ratio of VCP plating is 1:1, the positive and negative current time is 1:1, the VCP plating temperature is controlled to be 5 ℃, and the reflux ratio of the plating solution is 1:3.
The laser direct writing exposure speed is 10s, and the number of times of multi-light source scanning type accumulated direct writing exposure is 5.
The developing solution for developing the dry film comprises the following components: 12g/L of sodium hydroxide, 8g/L of diglycolamine, 7g/L of dipotassium hydrogen phosphate, 6g/L of monopotassium phosphate, 4g/L of citric acid, 4g/L of sodium dodecyl benzene sulfonate, 3g/L of sodium lauryl sulfate and deionized water.
Wherein, the etching liquid for alkaline etching is as follows: 30g/L of sodium hydroxide, 20g/L of sodium sulfide, 15g/L of dipotassium hydrogen phosphate, 15g/L of monopotassium phosphate, 10g/L of sodium dodecyl benzene sulfonate, 8g/L of sodium lauryl sulfate, 4g/L of polyalcohol, 15g/L of sodium pyrophosphate, 15g/L of 1, 5-pentamethylene tetrazole, 15g/L of artificial blood plasma and deionized water.
Wherein, the solder resist printing ink of solder resist printing is: 50g/L of beta-hydroxyethyl acrylate modified melamine formaldehyde resin, 50g/L of linear polyester with carboxyl end groups, 30g/L of hyperbranched resin, 11g/L of reactive diluent, 16g/L of photoinitiator and 9g/L, feTiO of pigment 3 MgTiO 3 14g/L, 40g/L of solvent, 6g/L of flexibilizer, 6g/L of curing agent and 3g/L of dispersing agent.
Example 2
This embodiment differs from embodiment 1 in that:
the VCP plated copper solution was: 45g/L copper sulfate, 20g/L potassium dihydrogen phosphate, 15g/L dipotassium hydrogen phosphate, 25g/L artificial plasma, 10g/L ammonium bromide and deionized water.
The special copper plating brightening agent for VCP electroplating comprises the following components: 4.5g/L of copper sulfate, 50g/L of zinc sulfate, 50g/L of sulfuric acid, 1.5g/L of saccharin, 5g/L of citric acid, 0.015g/L of diammine blue, 4g/L of sodium dodecyl sulfate, 2g/L of sodium dodecyl sulfate and deionized water.
The ratio of positive current to negative current of VCP plating is 1:1, the time of positive current to negative current is 1:1, the VCP plating temperature is controlled to be 10 ℃, and the reflux ratio of plating solution is 1:3.
The exposure speed of the laser direct-writing exposure is 15s, and the number of times of the multi-light source scanning type accumulated direct-writing exposure is 5.
The developing solution for dry film development is as follows: 15g/L of sodium hydroxide, 5g/L of diglycolamine, 5g/L of dipotassium hydrogen phosphate, 5g/L of monopotassium phosphate, 5g/L of citric acid, 6g/L of sodium dodecyl benzene sulfonate, 2g/L of sodium lauryl sulfate and deionized water.
The etching liquid for alkaline etching is as follows: sodium hydroxide 20g/L, sodium sulfide 10g/L, dipotassium hydrogen phosphate 15g/L, potassium dihydrogen phosphate 25g/L, sodium dodecyl benzene sulfonate 5g/L, sodium lauryl sulfate 8g/L, polyalcohol 9g/L, sodium pyrophosphate 20g/L, 1,5 pentamethylene tetrazole 5g/L, artificial blood plasma 10g/L and deionized water.
The solder resist ink for solder resist printing is: 70g/L of beta-hydroxyethyl acrylate modified melamine formaldehyde resin, 30g/L of linear polyester with carboxyl end groups, 20g/L of hyperbranched resin, 10g/L of reactive diluent, 15g/L of photoinitiator and 8g/L, feTiO of pigment 3 MgTiO 3 20g/L, 50g/L of solvent, 5g/L of flexibilizer, 4g/L of curing agent and 3g/L of dispersing agent.
Example 3
The VCP plated copper solution was: 30g/L copper sulfate, 20g/L monopotassium phosphate, 10g/L dipotassium phosphate, 25g/L artificial plasma, 5g/L ammonium bromide and deionized water.
The special copper plating brightening agent for VCP electroplating comprises the following components: 4.5g/L of copper sulfate, 50g/L of zinc sulfate, 100g/L of sulfuric acid, 1.5g/L of saccharin, 5g/L of citric acid, 0.005g/L of diammine blue, 4g/L of sodium dodecyl sulfate, 2g/L of sodium dodecyl sulfate and deionized water.
The positive and negative current ratio of VCP electroplating is 1:1, the positive and negative current time is 1:1, the VCP electroplating temperature is controlled to be 15 ℃, and the reflux ratio of electroplating solution is 1:3.
The exposure speed of the laser direct-writing exposure is 20s, and the number of times of the multi-light source scanning type accumulated direct-writing exposure is 4.
The developing solution for dry film development is as follows: 10g/L of sodium hydroxide, 12g/L of diglycolamine, 5g/L of dipotassium hydrogen phosphate, 7g/L of monopotassium phosphate, 2g/L of citric acid, 6g/L of sodium dodecyl benzene sulfonate, 2g/L of sodium lauryl sulfate and deionized water.
The etching liquid for alkaline etching is as follows: 30g/L of sodium hydroxide, 10g/L of sodium sulfide, 15g/L of dipotassium hydrogen phosphate, 25g/L of monopotassium phosphate, 5g/L of sodium dodecyl benzene sulfonate, 5g/L of sodium lauryl sulfate, 9g/L of polyalcohol, 15g/L of sodium pyrophosphate, 15g/L of 1, 5-pentamethylene tetrazole, 10g/L of artificial blood plasma and deionized water.
The solder resist ink for solder resist printing is: 70g/L of beta-hydroxyethyl acrylate modified melamine formaldehyde resin, 30g/L of linear polyester with carboxyl end groups, 40g/L of hyperbranched resin, 10g/L of reactive diluent, 20g/L of photoinitiator and 8g/L, feTiO of pigment 3 MgTiO 3 20g/L of solvent, 20g/L of flexibilizer, 8g/L of curing agent, 4g/L of dispersing agent and 6g/L of dispersing agent.
Example 4
The VCP plated copper solution was: 45g/L of copper sulfate, 10g/L of monopotassium phosphate, 15g/L of dipotassium phosphate, 15g/L of artificial plasma, 10g/L of ammonium bromide and deionized water.
The special copper plating brightening agent for VCP electroplating comprises the following components: copper sulfate 2.5g/L, zinc sulfate 90g/L, sulfuric acid 50g/L, saccharin 2.5g/L, citric acid 2g/L, diammine blue 0.015g/L, sodium dodecyl sulfate 2g/L, sodium dodecyl sulfate 5g/L and deionized water.
The positive and negative current ratio of VCP electroplating is 1:1, the positive and negative current time is 1:1, the VCP electroplating temperature is controlled to be 20 ℃, and the reflux ratio of electroplating solution is 1:3.
The exposure speed of the laser direct-writing exposure is 10s, and the number of times of the multi-light source scanning type accumulated direct-writing exposure is 3.
The developing solution for dry film development is as follows: 15g/L of sodium hydroxide, 5g/L of diglycolamine, 9g/L of dipotassium hydrogen phosphate, 5g/L of monopotassium phosphate, 5g/L of citric acid, 3g/L of sodium dodecyl benzene sulfonate, 4g/L of sodium lauryl sulfate and deionized water.
The etching liquid for alkaline etching is as follows: sodium hydroxide 20g/L, sodium sulfide 20g/L, dipotassium hydrogen phosphate 10g/L, potassium dihydrogen phosphate 15g/L, sodium dodecyl benzene sulfonate 5g/L, sodium lauryl sulfate 8g/L, polyalcohol 4g/L, sodium pyrophosphate 20g/L, 1,5 pentamethylene tetrazole 5g/L, artificial blood plasma 10g/L and deionized water.
The solder resist ink for solder resist printing is: 40g/L of beta-hydroxyethyl acrylate modified melamine formaldehyde resin, 60g/L of linear polyester with carboxyl end groups, 20g/L of hyperbranched resin, 15g/L of reactive diluent, 15g/L of photoinitiator and 15g/L, feTiO of pigment 3 MgTiO 3 10g/L, 50g/L of solvent, 5g/L of flexibilizer, 7g/L of curing agent and 3g/L of dispersing agent.
According to the PCB based on pulse VCP electroplating, through arranging the heat dissipation parts in the interior, the side parts and the top of the PCB, the heat dissipation efficiency of the whole PCB is greatly improved, the possibility of thermal deformation of the PCB is reduced, the VCP electroplating and the laser direct writing exposure are combined, the production cost is reduced by adopting a mode of combining the VCP electroplating with the laser direct writing exposure, the copper plating depth capability reaches 100%, the thickness of plating hole copper and surface copper is 1:1, the product quality is remarkably improved, the problem of circuit exposure caused by circuit film manufacturing and the expansion and contraction of a circuit negative film is not required by laser direct writing exposure, the problem of underexposure or overexposure caused by insufficient energy is not caused, the exposure speed is high, the efficiency is high, the final product quality of the PCB is remarkably improved by secondary electroplating, the PCB is scientific and reasonable in design, the production is realized by adopting the most advanced mode, the production is facilitated, the production cost is reduced, the economic benefit is improved, and the good market application prospect and the market popularization value is realized.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The preparation method of the PCB based on pulse VCP electroplating is characterized by comprising the following steps:
s1, vacuum lamination: each layer of the PCB is: stacking the inner heat dissipation fiber layer (1), the glass fiber substrate layer (2) and the copper foil layer (3) in sequence, placing the stacked plate layers under a vacuum sub-pressing machine for vacuum pressing, controlling the vacuum pressing temperature to be less than or equal to 20 ℃ and the vacuum degree to be minus 0.1MPa, repeatedly pressing the stacked plate layers until the plate thickness is not changed, and carrying out cutting, rounding, edge planing and drilling treatment on the pressed plate;
s2, horizontally depositing copper: the method comprises the steps of removing burrs from openings of pressed copper-clad plates, immersing the copper-clad plates in deoiling liquid to remove greasy dirt, ensuring uniform reflux circulating concentration of deoiling liquid during deoiling, opening micro pits on a base material at a drilling position after cleaning, horizontally placing the copper-clad plates in a copper precipitation tank, chemically drilling holes through colloid palladium to pretzel and secondarily electrochemically horizontally coppering, depositing copper on the surface of an insulating base material at the drilling holes, and realizing interlayer electrical connection;
s3, VCP electroplating: placing the copper-clad plate subjected to vacuum lamination in a VCP electroplating bath, adding a special copper plating brightening agent, a copper plating carrier and a copper solution mixed electroplating copper solution, carrying out VCP electroplating by using pulse waveform current, and carrying out electroplating copper on the surface of the copper-clad plate and a layer hole by controlling the positive and negative current proportion and the positive and negative current time and controlling the VCP electroplating temperature and the electroplating solution reflux ratio;
s4, self-adhesive dry film: flattening the VCP electroplated copper-clad plate, automatically covering the cut dry film with proper size on two sides of the copper-clad plate, extruding the dry film by a film pressing device, removing residual bubbles in the dry film by vacuumizing to enable the dry film to be in seamless lamination with the copper-clad plate, and performing secondary extrusion on the dry film and the copper-clad plate to enable the dry film to be firmly laminated;
s5, laser direct writing exposure: placing the copper-clad plate with the dry film under a laser direct-writing exposure machine, adopting a positioning camera and a positioning hole on the camera and the real object copper-clad plate for precise automatic alignment control, and starting a laser light source to perform multi-light source scanning type accumulated direct-writing exposure;
s6, developing a dry film: placing the copper-clad plate subjected to laser direct writing exposure in a developing machine added with a developing solution for dry film development, and controlling the developing temperature to be not more than 30 ℃ by the reflux circulation of the developing solution during development, and developing under low pressure and low oxygen to avoid bubbles generated by the developing solution;
s7, secondary electroplating: performing secondary VCP copper electroplating on the developed copper-clad plate, performing VCP tin electroplating after the thickness of the electroplated layer fish dry film is the same, controlling the forward and reverse current proportion, the forward and reverse current time, the temperature and the reflux ratio of electroplating to be the same as those of primary electroplating, removing the residual dry film of the developed copper-clad plate by adopting a film removing liquid after the electroplating is completed, and reserving a tin layer and a copper layer at the lower part;
s8, alkaline etching: placing the copper-clad plate subjected to secondary electroplating in an etching machine added with etching liquid for etching, controlling the etching temperature to be not more than 30 ℃ during etching, etching under the conditions of vacuum low pressure and low oxygen to avoid bubbles generated by the etching liquid, discharging the etching liquid after etching, cleaning, adding tin stripping liquid for stripping tin, and carrying out the reflux circulation of the tin stripping liquid during stripping tin to keep the VCP copper electroplated layer;
s9, welding elements: welding a required PCB element (6) on the etched PCB according to a schematic diagram, cleaning redundant solder, coating a side flame-retardant layer (8) and a heat-insulating and electricity-blocking layer (9) on the side part of the PCB, connecting a heat-conducting radiating fin (10) with the side part of an inner heat-radiating fiber layer (1), enabling the inner heat-radiating fiber layer (1) and the heat-conducting fin (10) to mutually conduct heat, performing AIO intermediate inspection on the copper-clad plate, and maintaining an inert gas environment or vacuumizing the whole AIO intermediate inspection process;
s10, solder resist printing: coating a layer of solder resist on the surface of a copper-clad plate qualified in AIO by adopting a screen printing mode, performing laser direct writing exposure and development on the solder resist, performing secondary screen printing, secondary exposure and development to form a solder resist ink layer (4), coating a flame-retardant ink layer (5) on the surface of the solder resist ink layer (4), curing the solder resist ink layer by exposure, fixing a prepared heat radiation protection layer (7) on a PCB (printed circuit board) and connecting the heat radiation protection layer with a heat conduction radiating fin (10) after character printing baking, surface treatment, binding edge molding, electric measurement and inspection, so that heat conduction can be performed between the solder resist ink layer and the heat radiation protection layer, and performing finished product test and appearance machine inspection again;
the VCP electroplated copper solution in the step 3 of the preparation method is as follows: 30-45g/L of copper sulfate, 10-20g/L of monopotassium phosphate, 10-15g/L of dipotassium phosphate, 15-25g/L of artificial plasma, 5-10g/L of ammonium bromide and deionized water;
the special copper plating brightening agent for VCP electroplating in the step 3 of the preparation method comprises the following components: 2.5-4.5g/L of copper sulfate, 50-90g/L of zinc sulfate, 50-100g/L of sulfuric acid, 1.5-2.5g/L of saccharin, 2-5g/L of citric acid, 0.005-0.015g/L of diammine blue, 2-4g/L of sodium dodecyl sulfate, 2-5g/L of sodium dodecyl sulfate and deionized water;
in the step 3 of the preparation method, the forward and reverse current ratio of VCP electroplating is 1:1, the forward and reverse current time is 1:1, the VCP electroplating temperature is controlled to be less than or equal to 20 ℃, and the reflux ratio of electroplating solution is 1:3.
2. The method for preparing the PCB based on pulse VCP electroplating according to claim 1, wherein the exposure speed of laser direct writing exposure in the step 5 of the preparation method is 10-20s, and the number of times of multi-light source scanning accumulated direct writing exposure is more than or equal to 3.
3. The method for preparing a PCB board based on pulse VCP plating according to claim 1, wherein the developing solution for dry film development in step 6 of the preparing method is: 10-15g/L of sodium hydroxide, 5-12g/L of diglycolamine, 5-9g/L of dipotassium hydrogen phosphate, 5-7g/L of monopotassium phosphate, 2-5g/L of citric acid, 3-6g/L of sodium dodecyl benzene sulfonate, 2-4g/L of sodium lauryl sulfate and deionized water.
4. The method for preparing a PCB board based on pulse VCP plating according to claim 1, wherein the etching solution for alkaline etching in step 8 of the preparation method is: 20-30g/L of sodium hydroxide, 10-20g/L of sodium sulfide, 10-15g/L of dipotassium hydrogen phosphate, 15-25g/L of monopotassium phosphate, 5-10g/L of sodium dodecyl benzene sulfonate, 5-8g/L of sodium lauryl sulfate, 4-9g/L of polyalcohol, 15-20g/L of sodium pyrophosphate, 5-15g/L of 1, 5-pentamethylene tetrazole, 10-15g/L of artificial blood plasma and deionized water.
5. The method for preparing a PCB based on pulse VCP plating according to claim 1, wherein the solder resist ink for solder resist printing in step 10 of the preparation method is: 40-70g/L of beta-hydroxyethyl acrylate modified melamine formaldehyde resin, 30-60g/L of linear polyester with carboxyl end group, 20-40g/L of hyperbranched resin, 10-15g/L of reactive diluent, 15-20g/L of photoinitiator and 8-15g/L, feTiO of pigment 3 MgTiO 3 10-20g/L, 20-50g/L of solvent, 5-8g/L of flexibilizer, 4-7g/L of curing agent and 3-6g/L of dispersing agent.
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