CN111564385A - Rotary cleaning device - Google Patents

Rotary cleaning device Download PDF

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Publication number
CN111564385A
CN111564385A CN202010079693.3A CN202010079693A CN111564385A CN 111564385 A CN111564385 A CN 111564385A CN 202010079693 A CN202010079693 A CN 202010079693A CN 111564385 A CN111564385 A CN 111564385A
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CN
China
Prior art keywords
plate
cleaned
rotary table
scattering prevention
air
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Pending
Application number
CN202010079693.3A
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Chinese (zh)
Inventor
前岛信
大波豪
中塚敦
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Disco Corp
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Disco Corp
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Publication date
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Publication of CN111564385A publication Critical patent/CN111564385A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Sink And Installation For Waste Water (AREA)
  • Centrifugal Separators (AREA)
  • Power Steering Mechanism (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

Provided is a rotary cleaning device which ensures that a dry object to be cleaned is not wetted again. A rotary cleaning device (1) is provided with: a horizontally movable nozzle (60) for spraying a mixture of cleaning water and air; a scattering prevention cover (5) surrounding the table (30) so as to make the mixed liquid to be scattered from the rotating table flow downwards; and a unit (16) for lifting the prevention cover. The prevention cover includes: an annular surrounding plate (51) which is formed with a cross section inclined in a gradually expanding manner from an opening (50) through which the table can pass; a side plate (52) surrounding the plate and extending in the direction of lifting the worktable; and an upper plate (53) connecting the side plates and the surrounding plate, wherein the rotary washing device further comprises a scattering prevention part (7) which prevents the momentum of the air from acting on the water accumulated on the upper surface of the upper plate in order to prevent the water accumulated on the upper surface of the upper plate from scattering when the air is sprayed from the nozzle to dry the outer peripheral edge (Wd) of the washed object.

Description

Rotary cleaning device
Technical Field
The present invention relates to a rotary cleaning apparatus for cleaning an object to be cleaned such as a semiconductor wafer.
Background
A grinding apparatus for grinding a workpiece such as a semiconductor wafer by a grinding wheel and a polishing apparatus for polishing the workpiece by a polishing pad have a spin cleaning apparatus for cleaning the workpiece while supplying cleaning water to the workpiece by rotating a rotating table holding the processed workpiece at a high speed (see, for example, patent document 1).
Patent document 1: japanese patent laid-open No. 2014-180739
When the workpiece is supported by the base (support substrate), machining chips are accumulated between the outer periphery of the base and the outer periphery of the workpiece, and therefore the outer periphery of the workpiece needs to be actively cleaned. Therefore, the two fluid obtained by mixing water and washing water is blown to the outer periphery of the workpiece to remove the machining chips. One of the reasons why the machining chips are likely to accumulate between the outer periphery of the substrate and the outer periphery of the workpiece is, for example: the outer peripheral edge of the workpiece is chamfered so as to have an arc-shaped cross section, and a recess is formed at the boundary between the substrate and the workpiece.
In the spin cleaning apparatus, in order to prevent the blown two fluids from being rewound on the workpiece without being curled up on the upper surface of the workpiece, a slope surrounding the workpiece is provided around the spin table, and when the cleaning waste liquid subjected to the centrifugal force caused by the rotation of the spin table is radiated outward from the workpiece, the cleaning waste liquid descends on the slope, falls into a drain container, and is discharged. That is, the spin cleaning apparatus has a scatter prevention cover surrounding a spin table that holds a workpiece.
Further, after the cleaning with the two fluids, water droplets are likely to accumulate at the boundary between the outer periphery of the substrate and the outer periphery of the workpiece, and therefore, air is actively blown to the outer periphery of the cleaned workpiece, and the boundary between the outer periphery of the substrate and the outer periphery of the workpiece is dried.
However, when the outer peripheral portion of the workpiece is actively cleaned with the two fluids, a water pool may be formed in the scattering prevention cover. In addition, there are also problems as follows: in order to dry the outer peripheral portion of the workpiece, the air injected to the outer peripheral portion splashes the water accumulated on the scattering prevention cover, thereby rewetting the dried workpiece.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a rotary cleaning apparatus capable of preventing rewetting of a workpiece dried after cleaning.
According to the present invention, there is provided a rotary cleaning apparatus having: a rotary table having a holding surface for holding an object to be cleaned; a rotating unit that rotates the rotary table; a cleaning nozzle for spraying a mixture of cleaning water and air to the object to be cleaned held by the rotary table; a horizontal moving unit which horizontally moves the cleaning nozzle above the rotary table; a scattering prevention cover surrounding the rotary table so that the mixed liquid to be scattered radially from the rotary table flows downward by a centrifugal force generated by rotation of the rotary table due to the mixed liquid sprayed to the object to be cleaned from the cleaning nozzle; and a lifting unit for lifting the scattering prevention cover along the axial direction of a rotating shaft for rotating the rotating table, wherein the scattering prevention cover comprises: an opening through which the rotary table can pass; an annular surrounding plate formed to be inclined in a gradually expanding shape in cross section from the opening; a side plate surrounding the surrounding plate and extending in a lifting direction of the rotary table; and an upper plate connecting the side plates and a lower end of the surrounding plate, wherein the rotary washing apparatus further includes a scatter prevention unit that prevents a force of air injected from the washing nozzle from acting on water accumulated on the upper surface of the upper plate in order to prevent water accumulated on the upper surface of the upper plate of the scatter prevention cover from scattering when air is injected from the washing nozzle after washing and the outer peripheral edge of the object is dried in a series of washing and drying operations in which the opening is positioned above the upper surface of the object held by the rotary table, the mixed liquid is injected from the washing nozzle to wash the object, and then air is injected from the washing nozzle to dry the object.
Preferably, the scattering prevention section includes: a bevel plate extending from the opening of the splash prevention cover toward an outer peripheral edge on the upper plate along a moving trajectory of the cleaning nozzle, the bevel plate having a high opening side and a low outer peripheral edge side; and a drain port formed in the outer peripheral edge, for allowing water to fall from the edge of the lower end side of the slope plate.
Alternatively, the scattering prevention section may be formed of a porous member disposed on the upper plate of the scattering prevention cover along a movement path of the washing nozzle.
According to the spin washing apparatus of the present invention, the water accumulated on the upper surface of the upper plate of the scattering prevention cover can be prevented from being scattered by the air by the force of the air absorbed by the scattering prevention portion. Therefore, the water droplets splashed by the air can be prevented from being attached to the dried object to be washed again.
The scattering prevention section includes: a bevel plate extending from the opening of the splash prevention cover toward the outer peripheral edge along the moving track of the cleaning nozzle, the bevel plate having a high opening side and a low outer peripheral edge side; in this case, when the outer peripheral edge of the object to be cleaned is dried, the force of the air ejected from the cleaning nozzle is prevented from being applied to the water accumulated on the upper surface of the upper plate, and the water accumulated on the upper surface of the upper plate is prevented from being splashed by the air. Therefore, the water droplets splashed by the air can be prevented from being attached to the dried object to be washed again.
In the case where the scattering prevention section is formed of a porous member disposed on the upper plate of the scattering prevention cover along the movement locus of the washing nozzle, when the outer peripheral edge of the object to be washed is dried, the momentum of the air injected from the washing nozzle is prevented from acting on the water accumulated on the upper surface of the upper plate, and the water accumulated on the upper surface of the upper plate is prevented from being scattered by the air. Therefore, the water droplets splashed by the air can be prevented from being attached to the dried object to be washed again.
Drawings
Fig. 1 is a perspective view showing an example of a rotary cleaning apparatus in which a scatter prevention part has a slope plate and a drain opening.
Fig. 2 is a perspective view showing an example of the rotary cleaning apparatus in a state where the scatter prevention cover is pulled down.
Fig. 3 is a perspective view showing an example of a rotary cleaning apparatus in which the scattering prevention part is a porous member arranged on the upper plate of the scattering prevention cover.
Fig. 4 is a cross-sectional view illustrating a state where air is ejected from a cleaning nozzle to dry the outer peripheral edge of an object to be cleaned in a rotary cleaning apparatus having a bevel plate and a drain opening in a scatter prevention portion.
Fig. 5 is a cross-sectional view illustrating a state where air is injected from a cleaning nozzle to dry the outer peripheral edge of an object to be cleaned in a rotary cleaning apparatus in which a scattering prevention portion is a porous member disposed on an upper plate of a scattering prevention cover.
Fig. 6 is a cross-sectional view illustrating a state where a mixed liquid is ejected from a cleaning nozzle to clean an object to be cleaned in a conventional rotary cleaning apparatus.
Fig. 7 is a cross-sectional view illustrating a state where air is sprayed to dry the outer peripheral edge of an object to be cleaned in a conventional spin cleaning apparatus.
Description of the reference symbols
W: an object to be cleaned; wb: the upper surface of the object to be cleaned; and Wd: the outer periphery of the object to be cleaned; w1: a semiconductor wafer; w2: a substrate; 1: rotating the cleaning device; 16: a lifting unit; 30: rotating the working table; 300: an adsorption part; 300 a: a holding surface; 301: a frame body; 32: a rotation unit; 320: a rotating shaft; 321: an electric motor; 305: a skirt portion; 2: a container portion; 20: a housing; 200: an outer peripheral plate; 201: an inner peripheral plate; 202: a base plate; 21: a bracket cover; 22: an upper cover; 40: a horizontal moving unit; 400: a rotation shaft portion; 401: an arm portion; 402: a rotary motor; 60: cleaning the nozzle; 600: an ejection port; 69: a water source; 68: an air source; 5: a scatter prevention cover; 50: an opening; 51: a surrounding plate; 52: a side plate; 53: an upper plate; 7: a scatter prevention part; 70: an inclined plane plate; 71: a water outlet; 7A: a scattering prevention section formed of a porous member; 1B: a conventional rotary cleaning device.
Detailed Description
The rotary cleaning apparatus 1 shown in fig. 1 has: a rotary table 30 having a holding surface 300a for holding an object to be cleaned W; a rotating unit 32 that rotates the rotating table 30; a cleaning nozzle 60 for spraying a mixed liquid (two fluids) of cleaning water and air onto the object W to be cleaned held by the rotary table 30; a horizontal moving unit 40 horizontally moving the cleaning nozzle 60 above the rotary table 30; a scattering prevention cover 5 surrounding the rotary table 30 so that the mixture liquid sprayed from the cleaning nozzle 60 to the object W to be cleaned flows downward due to a centrifugal force generated by the rotation of the rotary table 30; and an elevating unit 16 that elevates the scatter prevention cover 5 along an axial direction (Z-axis direction) of the rotating shaft 320 that rotates the rotating table 30. The spin cleaning apparatus 1 may be used alone, or may be used in combination with a grinding apparatus, a polishing apparatus, a cutting apparatus, a cluster type apparatus having a function of a plurality of these apparatuses, or the like.
The object W to be cleaned is, for example, a so-called bonded wafer. The bonded wafer is obtained by bonding a circular semiconductor wafer W1 to a substrate (support substrate) W2 having substantially the same diameter with an adhesive or the like, and by working the semiconductor wafer W1 and the substrate W2 as a single body, the workability of the thin semiconductor wafer W1 can be improved, and warping or breakage of the semiconductor wafer W1 during processing can be prevented.
The semiconductor wafer W1 is a circular wafer made of, for example, a silicon base material, and a plurality of devices are formed on the front side Wa of the semiconductor wafer W1 facing downward in fig. 1, and protected by a substrate W2 attached thereto. The back surface Wb of the semiconductor wafer W1 on the side opposite to the front surface Wa is a surface subjected to grinding, and is an upper surface Wb on which the object W to be cleaned is to be cleaned. The object W to be cleaned may be made of gallium arsenide, sapphire, ceramic, resin, gallium nitride, silicon carbide, or the like, in addition to silicon.
The object W to be cleaned may be, for example, only a circular semiconductor wafer W1 made of a silicon base material or the like. The object W to be cleaned may be a so-called TAIKO wafer: a region of the back surface Wb of the semiconductor wafer W1 on which devices are formed on the front surface Wa is ground to form a circular recess corresponding to the device region, and a reinforcing annular projection is formed in a region of the back surface Wb corresponding to the outer peripheral excess region surrounding the device region.
The rotary cleaning apparatus 1 includes a container portion 2 for housing the components. The container portion 2 has: a case 20 having an outer shape of, for example, a polygonal plan view; a holder cover 21 that is erected from an upper end surface of a rear side (+ X direction side) of the housing 20; and an upper cover 22 connected to the holder cover 21 and covering the housing 20 from above. The upper cover 22 has the same planar shape as the housing 20 when viewed from the + Z direction, and the end portion on the + Y direction side thereof is fixed to the upper end portion of the holder cover 21 by a fastener such as a bolt.
The housing 20 includes: an outer peripheral plate 200; an inner peripheral plate 201 shown in fig. 4; and a bottom plate 202 connected to the lower end of the outer peripheral plate 200 and the lower end of the inner peripheral plate 201. The space of the vertical cross-sectional concave shape surrounded by the outer peripheral plate 200, the inner peripheral plate 201, and the bottom plate 202 serves as a space capable of temporarily storing the used cleaning liquid. A drain pipe such as a drain hose is connected to the bottom plate 202, and the drain pipe can communicate with a drain tank, not shown.
The scattering prevention cover 5 includes: an opening 50 through which the rotary table 30 can pass; an annular surrounding plate 51 formed to be inclined so as to gradually expand in cross section from the opening 50 as shown in fig. 4; a side plate 52 surrounding the plate 51 and extending in the lifting direction (Z-axis direction) of the rotary table 30; and an upper plate 53 connecting the side plate 52 and the lower end of the surrounding plate 51. Fig. 1 shows a state in which the side plate 52 is raised and the upper end surface thereof is in contact with the lower surface of the upper cover 22 in order to clean the object W to be cleaned.
The side plate 52 is a polygonal tubular body in plan view similar to the case 20 and smaller than the case 20, and the side plate 52 is located inside the case 20 when viewed from the + Z direction. As shown in fig. 2, when the object W to be cleaned is attached to and detached from the rotary table 30, the side plate 52 is lowered into the casing 20 to be in the open state, and as shown in fig. 1, when the object W to be cleaned is cleaned and dried, the side plate 52 is raised from the casing 20 to be in the closed state, and the scattering of the mixed liquid and the like is prevented. The side plate 52 and the upper cover 22 may be made of a transparent member such as an acrylic plate, for example, in order to allow the operator to check the state of the object W being cleaned.
A sealing member such as rubber, not shown, for example, may be disposed on the upper end surface of the side plate 52, and when the side plate 52 is lifted to be in the closed state, the bottom surface of the peripheral edge portion of the upper cover 22 may contact the sealing member to seal the space between the side plate 52 and the upper cover 22.
The opening 50 of the scattering prevention cover 5 is formed in a circular shape in accordance with the circular outer shape of the rotary table 30. As shown in fig. 4, the surrounding plate 51 is formed in a ring shape in plan view, with a gradually expanding cross section, inclined from the opening 50. In the example shown in fig. 1, the area of the surrounding plate 51 is set smaller than the area of the upper plate 53, but the present invention is not limited thereto. The inclination angle of the surrounding plate 51 is set to an appropriate value in view of the discharge amount of the mixed liquid discharged from the cleaning nozzle 60. As shown in fig. 1 and 4, the upper plate 53 connects the side plate 52 and the lower end of the surrounding plate 51, and forms a bottom portion of the scatter shield 5 by the surrounding plate 51 and the upper plate 53.
The rotary table 30, which is disposed in the container portion 2 and holds the object to be cleaned W, has, for example, a circular outer shape, and the rotary table 30 includes: an adsorption unit 300, which is made of a porous member or the like, and adsorbs the object W to be cleaned; and a housing 301 that supports the suction unit 300. The suction unit 300 communicates with a suction source, not shown, and sucks and holds the object to be cleaned W on a flat holding surface 300a, which is an exposed surface of the suction unit 300 and is flush with the upper end surface of the housing 301.
The rotating unit 32 has: a rotary shaft 320 having an upper end connected to a bottom surface side of the rotary table 30; and a motor 321 connected to the lower end side of the rotating shaft 320 and generating a rotational driving force; and so on. The axial direction of the rotary shaft 320 for rotating the rotary table 30 is the Z-axis direction (vertical direction).
For example, as shown in fig. 4, the rotary shaft 320 has a skirt portion 305 extending horizontally from the outer peripheral surface thereof and hanging down in the-Z direction, and the mixed liquid flowing down from the rotary table 30 does not enter between the rotary shaft 320 and the inner peripheral plate 201 by the skirt portion 305.
The lifting unit 16 for lifting and lowering the scattering prevention cover 5 in the axial direction (Z-axis direction) of the rotary shaft 320 for rotating the rotary table 30 is an air cylinder, an electric cylinder, a ball screw mechanism, or the like, and for example, the lifting unit 16 is connected to the lower end side of the side plate 52 or the lower surface of the surrounding plate 51, which is shown in fig. 1 for simplicity.
The horizontal movement unit 40 shown in fig. 1 has, for example: a rotation shaft portion 400 that penetrates the upper plate 53 of the scatter prevention cover 5 via a bearing, a sealing material, or the like, not shown, and is provided upright on the upper plate 53; an arm portion 401 extending in the horizontal direction from the upper end side of the rotation shaft portion 400; and a rotation motor 402 having a shaft coupled to the lower end side of the rotation shaft 400. The cleaning nozzle 60 is fixed to the tip end of the arm 401.
Thus, when the rotation motor 402 rotates the rotation shaft 400 about the axis in the Z-axis direction, the arm 401 and the cleaning nozzle 60 are horizontally moved (rotated) in the horizontal direction in accordance with the rotation. Therefore, the moving trajectory of the cleaning nozzle 60 is in an arc shape in plan view, and the cleaning nozzle 60 can position the ejection port 600 formed at the lower end portion thereof above the holding surface 300a of the rotary table 30 from the retracted position. For example, it is preferable that the rotation center of the rotary table 30 is located under the moving locus of the washing nozzle 60.
The cleaning nozzle 60 is connected to a water source 69 via a joint 690 and a water flow path 691 such as a flexible resin tube, and the water source 69 is constituted by a pump or the like and supplies, for example, pure water as cleaning water. A water passage opening/closing valve 692 is disposed in the water passage 691. The cleaning nozzle 60 is connected to an air source 68 via an air passage 681 such as a flexible resin tube or a joint 680, and the air source 68 is constituted by a compressor or the like and supplies compressed air. An air flow path on-off valve 682 is disposed in the air flow path 681. The cleaning water supplied from the water source 69 and the air supplied from the air source 68 are mixed in the cleaning nozzle 60 to be a mixed liquid, and are ejected downward from the ejection port 600.
The rotary cleaning apparatus 1 shown in fig. 1 includes a scattering prevention unit 7 (hereinafter referred to as the scattering prevention unit 7 of embodiment 1), and in a series of cleaning and drying operations in which the opening 50 is positioned above the upper surface Wb of the object W held by the rotary table 30, a mixed liquid of water and air is ejected from the cleaning nozzle 60 to clean the object W, and then air is ejected from the cleaning nozzle 60 to dry the object W, the scattering prevention unit 7 prevents the momentum of the air ejected from the cleaning nozzle 60 from acting on the water accumulated on the upper surface of the upper plate 53 so that the water accumulated on the upper surface of the upper plate 53 of the scattering prevention cover 5 does not scatter when the air is ejected from the cleaning nozzle 60 after cleaning to dry the outer peripheral edge Wd of the object W.
In the example shown in fig. 1, the scattering prevention portion 7 includes: a slope plate 70 extending from the opening 50 of the scatter prevention cover 5 toward the outer peripheral edge of the upper plate 53 along the arc-shaped moving trajectory of the cleaning nozzle 60 on the upper plate 53, the slope plate 70 having a high opening 50 side and a low outer peripheral edge side of the upper plate 53; and a drain opening 71 formed in the outer peripheral edge of the upper plate 53, for allowing water to fall from the lower edge of the inclined plate 70.
The slope plate 70 has, for example, a substantially rectangular outer shape, and is fixed by a bolt or the like, not shown, with its upper end side frame provided on the upper end side of the surrounding plate 51. The lower end side of the bevel plate 70 is cut obliquely, for example, and in the example shown in fig. 1, one side of the lower end of the bevel plate 70 reaches the outer peripheral edge of the upper plate 53. The lower end side of the slope plate 70 is fixed to the upper surface of the upper plate 53 by a bolt or the like, not shown.
The drain opening 71 is formed by cutting the upper plate 53 of the scatter cover 5 in a triangular shape so that a part of the outer peripheral edge of the upper plate 53 forms one side thereof, for example, and is connected to the lower end of the slope plate 70. The drain port 71 communicates with a space having a concave shape in vertical section of the housing 20, and the space can store the used mixed liquid.
The outer shapes of the inclined plate 70 and the drain opening 71 are not limited to the illustrated example, and for example, the inclined plate 70 may extend in an arc shape from the opening 50 of the splash prevention cover 5 toward the outer peripheral edge of the upper plate 53 along the arc-shaped moving trajectory of the cleaning nozzle 60.
In the example shown in fig. 1, only one scattering prevention section 7 is disposed on the upper plate 53, and for example, another scattering prevention section similar to the scattering prevention section 7 may be disposed at a position symmetrical to the arrangement position of the scattering prevention section 7 with respect to the center of the rotary table 30 in the arc-shaped movement locus of the cleaning nozzle 60.
The spin washing apparatus 1 of the present invention may have a scatter prevention unit 7A shown in fig. 3 (hereinafter referred to as a scatter prevention unit 7A according to embodiment 2) instead of the scatter prevention unit 7 shown in fig. 1. The scattering prevention section 7A is a porous member disposed on the upper plate 53 of the scattering prevention cover 5 along the movement trajectory of the washing nozzle 60. As the porous member, for example, porous ceramics, porous metal, porous carbon, or a body obtained by rolling up and folding a metal mesh or a resin mesh into a plurality of layers can be used. The scatter prevention unit 7A has, for example, a substantially triangular prism shape, extends from the opening 50 of the scatter prevention cover 5 toward the outer peripheral edge of the upper plate 53 along the movement locus of the cleaning nozzle 60 so as to straddle the upper surfaces of the upper plate 53 and the plate 51, and is fixed to the upper surface of the upper plate 53 with an adhesive or the like.
In the example shown in fig. 3, the upper surface of the scattering prevention section 7A facing the washing nozzle 60 is an inclined surface that is lowered toward the outer peripheral edge of the upper plate 53, but the upper surface is not limited thereto, and may be a flat surface toward the outer peripheral edge. The outer shape of the scattering prevention section 7A is not limited to a substantially triangular prism shape. In the example shown in fig. 3, only one scattering prevention section 7A is disposed on the upper plate 53, but for example, another scattering prevention section similar to the scattering prevention section 7A may be disposed at a position symmetrical to the position of the scattering prevention section 7A with respect to the center of the rotary table 30 on the circular arc-shaped moving trajectory of the cleaning nozzle 60.
For example, as shown in fig. 5, a drain port 75 is formed through the upper plate 53 at a position below the scattering prevention portion 7A, and the drain port 75 communicates with a space of a vertical sectional concave shape of the housing 20, and the space can store a used mixed liquid. The position of the drain port 75 is not limited to the example shown in the present embodiment.
The operation of the rotary cleaning apparatus 1 in the case where the upper surface Wb of the object W to be cleaned is cleaned with a mixed liquid (two fluids) of air and cleaning water, and then the object W to be cleaned is dried by ejecting air from the cleaning nozzle 60 using the rotary cleaning apparatus 1 will be described below.
First, as shown in fig. 2, the lifting unit 16 of the spin washing apparatus 1 operates to lower the scattering prevention cover 5 to bring the side plate 52 into an open state. That is, the rotary cleaning apparatus 1 opens a space between the upper cover 22 and the housing 20 in the Z-axis direction, and the object W to be cleaned can enter the inside.
The object W to be cleaned is conveyed onto the rotary table 30, and is placed on the holding surface 300a so that the upper surface Wb thereof faces upward. Then, a suction force generated by a suction source, not shown, connected to the spin table 30 is transmitted to the holding surface 300a, and the spin table 30 sucks and holds the object to be washed W on the holding surface 300 a.
Next, as shown in fig. 1, the lift unit 16 operates to lift the scattering prevention cover 5 from the inside of the housing 20, and the upper end surface of the side plate 52 abuts against the lower surface of the peripheral edge portion of the upper cover 22 to stop. The space between the upper cover 22 and the housing 20 is sealed by the side plate 52, so that a closed space for washing and drying the object W to be washed is formed by the upper cover 22 and the scattering prevention cover 5. The opening 50 of the scattering prevention cover 5 is positioned above the upper surface Wb of the object W held by the rotating table 30. That is, the upper surface Wb of the object W to be cleaned is positioned below the upper end surface of the surrounding plate 51.
Next, the horizontal movement unit 40 rotationally moves the cleaning nozzle 60, and the ejection port 600 of the cleaning nozzle 60 is positioned above the center of the upper surface Wb of the object W to be cleaned, which is aligned with the center of the rotating table 30 and is sucked and held. In this state, the cleaning nozzle 60 is supplied with cleaning water from the water source 69 and the cleaning nozzle 60 is supplied with compressed air from the air source 68, and a mixed liquid (two fluids) of the air and the cleaning water is jetted toward the center of the upper surface Wb of the object W to be cleaned from the jet port 600 of the cleaning nozzle 60. The cleaning nozzle 60 for spraying the mixture liquid is rotationally moved above the object W to be cleaned so as to reciprocate at a predetermined angle around the axis in the Z-axis direction. The rotating table 30 is rotated at a predetermined rotation speed by the rotating unit 32, and the mixed liquid is sprayed from the cleaning nozzle 60 onto the entire upper surface Wb of the object W to be cleaned.
The cleaning nozzle 60 may be linearly moved in the horizontal direction without being rotated.
The cleaning nozzle 60 may not be positioned above the center of the object W to be cleaned. That is, the center and the central portion of the object W to be cleaned are not cleaned, and only the outer peripheral edge Wd is cleaned.
This removes the adhering matter such as grinding chips adhering to the upper surface Wb of the object W to be cleaned with the mixed liquid. Then, the mixed liquid to which the centrifugal force generated by the rotation of the rotary table 30 is applied flows from the center side toward the outer peripheral side on the upper surface Wb of the object W to be cleaned, flows from above the upper surface Wb into a space having a concave shape in vertical cross section surrounded by the outer peripheral plate 200, the inner peripheral plate 201 (see fig. 4), and the bottom plate 202 (see fig. 1) of the housing 20, and is stored in the space.
Further, the mixed liquid sprayed from the cleaning nozzle 60 to the object W to be cleaned is given a centrifugal force by the rotation of the rotary table 30, and the mixed liquid radially scattered from the rotary table 30 or the object W to be cleaned collides with the lower surface side of the surrounding plate 51 of the scattering prevention cover 5 shown in fig. 4, flows downward along the lower surface, and flows into the space having a concave shape in the vertical cross section surrounded by the outer peripheral plate 200, the inner peripheral plate 201, and the bottom plate 202 (see fig. 1) of the housing 20.
After the entire upper surface Wb of the object W to be cleaned is cleaned for a predetermined time, the outer peripheral edge Wd of the object W to be cleaned, which is the bonded wafer, is actively cleaned with the mixed liquid. This is because deposits such as grinding chips are often deposited on the outer peripheral edge Wd of the bonded wafer. The horizontal movement unit 40 rotationally moves the cleaning nozzle 60, thereby positioning the jet port 600 of the cleaning nozzle 60 above the outer peripheral edge Wd of the object W to be cleaned sucked and held by the rotary table 30 and stopping the movement of the cleaning nozzle 60.
In this state, a mixed liquid of air and washing water is ejected from the ejection port 600 of the washing nozzle 60. Then, the rotary table 30 is rotated at a predetermined rotation speed to spray the mixture liquid to the entire outer peripheral edge Wd of the object W to be cleaned. In the outer peripheral edge cleaning, most of the mixture flows into the space of the vertical section concave shape of the housing 20 through the surrounding plate 51 of the scattering prevention cover 5, but a part of the mixture sprayed from the cleaning nozzle 60 flows onto the upper surface of the upper plate 53, or the mixture radially scattered from the spin table 30 or the object W to be cleaned by applying a centrifugal force flies onto the upper surface of the upper plate 53. Therefore, water accumulates on the upper surface of the upper plate 53, and a water pool V shown in fig. 4 or 5 may be formed.
Next, the object W to be cleaned is dried in the spin cleaning apparatus 1. In the drying of the object W to be cleaned, for example, the upper surface Wb is first dried. The horizontal movement means 40 rotationally moves the cleaning nozzle 60, positions the ejection port 600 of the cleaning nozzle 60 above the center of the object W to be cleaned sucked and held by the rotary table 30, and stops the movement of the cleaning nozzle 60. The cleaning nozzle 60 may be rotationally moved to reciprocate horizontally above the object W to be cleaned. Compressed air is supplied from the air source 68 to the cleaning nozzle 60, and the air is ejected from the ejection port 600 of the cleaning nozzle 60 toward the center of the upper surface Wb of the object W to be cleaned. Further, by rotating the rotary table 30 at a predetermined rotation speed, the air flowing on the upper surface Wb of the object W in the radial direction from the center and the centrifugal force applied by the rotation of the rotary table 30 cause the washing water remaining on the upper surface Wb of the object W to flow from the upper surface Wb into the space having a concave shape in vertical cross section surrounded by the outer peripheral plate 200, the inner peripheral plate 201 (see fig. 4 and 5), and the bottom plate 202 of the casing 20.
After the entire upper surface Wb of the object W to be cleaned is dried for a predetermined time, the outer peripheral edge Wd of the object W to be cleaned, which is a bonded wafer, is actively dried by air. This is because the cleaning water often accumulates on the outer peripheral edge Wd of the bonded wafer.
As shown in fig. 4 or 5, the horizontal movement unit 40 rotationally moves the cleaning nozzle 60, so that the injection port 600 of the cleaning nozzle 60 is positioned on the side of the scattering prevention unit 7 and above the outer peripheral edge Wd of the object W to be cleaned sucked and held by the rotary table 30, and the movement of the cleaning nozzle 60 is stopped. Then, air is ejected from the ejection port 600 of the cleaning nozzle 60. The rotary table 30 is rotated at a predetermined rotation speed to spray air over the entire outer peripheral edge Wd of the object W to be cleaned.
Here, problems in the conventional spin cleaning apparatus 1B in the case where the outer peripheral edge Wd of the object W to be cleaned is actively dried by air will be briefly described with reference to fig. 6 and 7. Unlike the spin washing apparatus 1 of the present invention, the spin washing apparatus 1B shown in fig. 6 and 7 does not have the scattering prevention section 7 of embodiment 1 shown in fig. 4 or the scattering prevention section 7A of embodiment 2 shown in fig. 5.
Similarly to the case of positively cleaning the outer peripheral edge Wd of the object W with the mixed liquid using the spin cleaning apparatus 1 of the present invention described above, when the outer peripheral edge Wd of the object W is positively cleaned with the mixed liquid using the conventional spin cleaning apparatus 1B shown in fig. 6, a part of the mixed liquid injected from the cleaning nozzle 60 flows onto the upper surface of the upper plate 53, or the mixed liquid radially scattered from the spin table 30 or the object W by centrifugal force is applied to the upper surface of the upper plate 53. Therefore, water accumulates on the upper surface of the upper plate 53, and a water pool V shown in fig. 6 may be formed.
In addition, similarly to the case where the peripheral edge Wd of the object W after washing is actively air-dried by using the spin cleaning apparatus 1 of the present invention described above, when the peripheral edge Wd of the object W is actively air-dried by using the conventional spin cleaning apparatus 1B shown in fig. 7, there is a problem as follows: as shown in fig. 7, the air injected from the injection port 600 of the cleaning nozzle 60 splashes water in the water pool V on the upper surface of the upper plate 53 of the splash prevention cover 5, and the splashed water turns into droplets to be rolled up and falls onto the upper surface Wb of the dried object W to be cleaned, thereby rewetting the upper surface Wb.
On the other hand, in the spin washing apparatus 1 of the present invention shown in fig. 4, the splash preventing unit 7 is provided to prevent the force of the air injected from the washing nozzle 60 from acting on the water accumulated on the upper surface of the upper plate 53, and the splash preventing unit 7 includes: a slope plate 70 extending from the opening 50 of the scatter prevention cover 5 toward the outer peripheral edge of the upper plate 53 along the moving trajectory of the cleaning nozzle 60 on the upper plate 53, the slope plate 70 having a higher opening 50 side and a lower outer peripheral edge side of the upper plate 53; and a drain opening 71 formed in the outer peripheral edge of the upper plate 53, for allowing water to fall from the edge of the lower end side of the bevel plate 70, so that when the outer peripheral edge Wd of the object W to be washed is dried, the force of the air injected from the cleaning nozzle 60 flows along the slope (upper surface) of the bevel plate 70 without acting on the water pool V on the upper surface of the upper plate 53, thereby preventing the water accumulated on the upper surface of the upper plate 53 from being splashed by the air. Therefore, the water droplets splashed by the air can be prevented from being attached again to the dried object W to be washed. Since the upper surface of the inclined plate 70 is inclined, water droplets and the like adhering to the upper surface of the inclined plate 70 flow downward and are discharged from the drain opening 71 when the object W to be cleaned is cleaned with the mixed liquid, and therefore, when the air on the outer peripheral edge Wd of the object W to be cleaned is dried, the water droplets do not remain on the inclined surface of the inclined plate 70, and water is not splashed by the air.
Further, in the spin washing apparatus 1 of the present invention shown in fig. 5, since the scattering prevention portion 7A for preventing the momentum of the air injected from the washing nozzle 60 from acting on the water accumulated on the upper surface of the upper plate 53 is provided, and the scattering prevention portion 7A is a porous member arranged on the upper plate 53 of the scattering prevention cover 5 along the movement locus of the washing nozzle 60, when the outer peripheral edge Wd of the object W to be washed is dried, the momentum of the air injected from the washing nozzle 60 is weakened by the scattering prevention portion 7A as the porous member, and the air does not strongly act on the water pool V on the upper surface of the upper plate 53, so that the water accumulated on the upper surface of the upper plate 53 can be prevented from being scattered by the air. Therefore, the water droplets splashed by the air can be prevented from being attached again to the dried object W to be washed.
The spin washing apparatus 1 of the present invention is not limited to the example having the scattering prevention section 7 of embodiment 1 or the scattering prevention section 7A of embodiment 2, and may be implemented in various different ways within the scope of the technical idea thereof. The shapes and the like of the respective components of the rotary cleaning apparatus 1 shown in the drawings are not limited thereto, and may be appropriately modified within a range in which the effects of the present invention can be exhibited.

Claims (3)

1. A rotary cleaning device, having:
a rotary table having a holding surface for holding an object to be cleaned;
a rotating unit that rotates the rotary table;
a cleaning nozzle for spraying a mixture of cleaning water and air to the object to be cleaned held by the rotary table;
a horizontal moving unit which horizontally moves the cleaning nozzle above the rotary table;
a scattering prevention cover surrounding the rotary table so that the mixed liquid to be scattered radially from the rotary table flows downward by a centrifugal force generated by rotation of the rotary table due to the mixed liquid sprayed to the object to be cleaned from the cleaning nozzle; and
a lifting unit for lifting the scattering prevention cover along the axial direction of the rotating shaft for rotating the rotating table,
wherein the content of the first and second substances,
the scattering prevention cover comprises:
an opening through which the rotary table can pass;
an annular surrounding plate formed to be inclined in a gradually expanding shape in cross section from the opening;
a side plate surrounding the surrounding plate and extending in a lifting direction of the rotary table; and
an upper plate connecting the side plates and the lower end of the surrounding plate,
the rotary cleaning device also has a scatter prevention part,
in a series of cleaning and drying operations in which the opening is positioned above the upper surface of the object to be cleaned held by the rotary table, the mixed liquid is ejected from the cleaning nozzle to clean the object to be cleaned, and then air is ejected from the cleaning nozzle to dry the object to be cleaned,
the scattering prevention part prevents the momentum of the air injected from the washing nozzle from acting on the water stored on the upper surface of the upper plate in order to prevent the water stored on the upper surface of the upper plate of the scattering prevention cover from scattering when the air is injected from the washing nozzle after the washing to dry the outer peripheral edge of the object to be washed.
2. The rotary cleaning device according to claim 1,
the scattering prevention section includes:
a bevel plate extending from the opening of the splash prevention cover toward an outer peripheral edge on the upper plate along a moving trajectory of the cleaning nozzle, the bevel plate having a high opening side and a low outer peripheral edge side; and
and a water outlet formed in the outer peripheral edge for allowing water to fall from the edge of the lower end side of the slope plate.
3. The rotary cleaning device according to claim 1,
the scattering prevention part is formed of a porous member disposed on the upper plate of the scattering prevention cover along a movement trajectory of the washing nozzle.
CN202010079693.3A 2019-02-13 2020-02-04 Rotary cleaning device Pending CN111564385A (en)

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CN114101166A (en) * 2021-10-29 2022-03-01 郑州大学第一附属医院 Paediatrics cardiovascular medical equipment processing apparatus
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CN112222062A (en) * 2020-09-21 2021-01-15 南通大学 Rotary corrosion cleaning equipment for substrate and cleaning method thereof
CN113035743A (en) * 2021-02-25 2021-06-25 无锡亚电智能装备有限公司 Wafer cleaning method for gradually lifting wafer
CN114101166A (en) * 2021-10-29 2022-03-01 郑州大学第一附属医院 Paediatrics cardiovascular medical equipment processing apparatus
CN114551303A (en) * 2022-02-24 2022-05-27 江苏京创先进电子科技有限公司 Wafer cleaning device, wafer cleaning method and Taizhou ring cutting equipment

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