CN111554602A - 一种托盘装载芯片的翻转倒料装置 - Google Patents
一种托盘装载芯片的翻转倒料装置 Download PDFInfo
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- CN111554602A CN111554602A CN202010354869.1A CN202010354869A CN111554602A CN 111554602 A CN111554602 A CN 111554602A CN 202010354869 A CN202010354869 A CN 202010354869A CN 111554602 A CN111554602 A CN 111554602A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/901—Devices for picking-up and depositing articles or materials provided with drive systems with rectilinear movements only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010354869.1A CN111554602B (zh) | 2020-04-29 | 2020-04-29 | 一种托盘装载芯片的翻转倒料装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010354869.1A CN111554602B (zh) | 2020-04-29 | 2020-04-29 | 一种托盘装载芯片的翻转倒料装置 |
Publications (2)
Publication Number | Publication Date |
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CN111554602A true CN111554602A (zh) | 2020-08-18 |
CN111554602B CN111554602B (zh) | 2022-03-04 |
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Application Number | Title | Priority Date | Filing Date |
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CN202010354869.1A Active CN111554602B (zh) | 2020-04-29 | 2020-04-29 | 一种托盘装载芯片的翻转倒料装置 |
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CN (1) | CN111554602B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112827725A (zh) * | 2020-12-31 | 2021-05-25 | 江苏金陵智造研究院有限公司 | 一种全自动冲片喷胶智能化柔性生产线及其运行方法 |
CN112850275A (zh) * | 2021-02-02 | 2021-05-28 | 东莞市磐锐机电科技有限公司 | 一种具有自动上下盘功能的倒盘机 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100775054B1 (ko) * | 2006-09-13 | 2007-11-08 | (주) 인텍플러스 | 트레이 핸들링 장치 및 그를 이용한 반도체 소자 검사 방법 |
CN103426800A (zh) * | 2013-07-20 | 2013-12-04 | 福州派利德电子科技有限公司 | 半导体芯片自动上料双工位检测装置 |
CN104401648A (zh) * | 2014-10-27 | 2015-03-11 | 嘉兴职业技术学院 | 一种单片机芯片加工过程中的输送装置 |
CN207434491U (zh) * | 2017-11-17 | 2018-06-01 | 上海东富龙科技股份有限公司 | 一种托盘自动翻转倒料装置 |
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2020
- 2020-04-29 CN CN202010354869.1A patent/CN111554602B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100775054B1 (ko) * | 2006-09-13 | 2007-11-08 | (주) 인텍플러스 | 트레이 핸들링 장치 및 그를 이용한 반도체 소자 검사 방법 |
CN103426800A (zh) * | 2013-07-20 | 2013-12-04 | 福州派利德电子科技有限公司 | 半导体芯片自动上料双工位检测装置 |
CN104401648A (zh) * | 2014-10-27 | 2015-03-11 | 嘉兴职业技术学院 | 一种单片机芯片加工过程中的输送装置 |
CN207434491U (zh) * | 2017-11-17 | 2018-06-01 | 上海东富龙科技股份有限公司 | 一种托盘自动翻转倒料装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112827725A (zh) * | 2020-12-31 | 2021-05-25 | 江苏金陵智造研究院有限公司 | 一种全自动冲片喷胶智能化柔性生产线及其运行方法 |
CN112827725B (zh) * | 2020-12-31 | 2022-04-01 | 江苏金陵智造研究院有限公司 | 一种全自动冲片喷胶智能化柔性生产线及其运行方法 |
CN112850275A (zh) * | 2021-02-02 | 2021-05-28 | 东莞市磐锐机电科技有限公司 | 一种具有自动上下盘功能的倒盘机 |
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CN111554602B (zh) | 2022-03-04 |
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CB03 | Change of inventor or designer information |
Inventor after: Lu Sheng Inventor after: Zhao Kai Inventor after: Lin Haitao Inventor before: Lu Sheng |
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CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 201600 Building 1, No. 76, Jinma Road, Jiuting Town, Songjiang District, Shanghai Patentee after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201600 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |
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CP03 | Change of name, title or address |