CN111465263B

CN111465263B - Heat dissipation device and mobile terminal

Info

Publication number: CN111465263B
Application number: CN202010228582.4A
Authority: CN
Inventors: 陈卫; 黄毅; 陈义炳
Original assignee: Huizhou TCL Mobile Communication Co Ltd
Current assignee: Yuanyuan Shenzhen Technology Transfer Co ltd
Priority date: 2020-03-27
Filing date: 2020-03-27
Publication date: 2022-08-05
Anticipated expiration: 2040-03-27
Also published as: CN111465263A

Abstract

The embodiment of the application provides a heat dissipation device and a mobile terminal. Wherein, heat abstractor includes: the PCB, the shielding cover and the radiating fin; the shielding cover is positioned above the PCB; the radiating fin covers the PCB and the shielding cover; the radiating fin is provided with a slot, and the slot is arranged on the periphery of the radiating fin corresponding to the position of the shielding cover bonding pad on the PCB so as to enable an interference signal to be radiated to the outside from the slot. The embodiment of the application enables the interference signal to be radiated to the outside from the groove through the peripheral groove corresponding to the position of the pad of the shielding cover on the PCB on the radiating fin without being blocked by the radiating fin, and multiple reflections are not formed between the radiating fin and the PCB, so that the receiving performance of the terminal antenna can not be influenced by the radiating fin on the basis of ensuring the radiating function, and the overall performance of the terminal is improved.

Description

Heat dissipation device and mobile terminal

Technical Field

The application relates to the technical field of communication, in particular to a heat dissipation device and a mobile terminal.

Background

At present, the electronic terminal generally uses a radiating fin for radiating, and the radiating fin is attached to the shell of an electronic product to achieve the radiating purpose. However, the high-thermal modules on the PCB of the electronic terminal are usually high-current high-interference modules, and when there is no heat sink, interference signals generated by each module are directly radiated to the outside and are emitted to the outside of the electronic terminal, and thus there is no interference to each antenna on the electronic terminal. However, when the heat sink exists, because the heat sink is a conductor, the interference signal is reflected back to the PCB after being shielded by the heat sink, and is radiated again after being excited by each module on the PCB, the interference signal vibrates many times between the PCB and the heat sink, and is finally radiated out at the edge of the heat sink, at this time, the intensity of the interference signal is increased by several times, which causes great interference to the receiving antenna on the electronic terminal, such as receiving diversity and GPS antenna.

Disclosure of Invention

The embodiment of the application provides a heat dissipation device and a mobile terminal, so that the heat dissipation fins can not influence the receiving performance of a terminal antenna on the basis of ensuring the heat dissipation function, and the overall performance of the terminal is improved.

The embodiment of the application provides a heat abstractor, includes: the PCB, the shielding cover and the radiating fin;

the shielding cover is positioned above the PCB;

the heat radiating fin covers the PCB and the shielding cover;

the PCB comprises a PCB board, a radiating fin and a shielding cover pad, wherein the radiating fin is provided with a slot, and the slot is arranged on the periphery of the radiating fin corresponding to the position of the shielding cover pad on the PCB board, so that an interference signal is radiated to the outside from the slot.

In the heat dissipation device of this embodiment, a first projection area formed by projecting the heat sink onto the PCB is larger than a second projection area formed by projecting the shielding cover onto the PCB, and a portion of the first projection area coinciding with the second projection area is larger than the second projection area.

In the heat dissipation device of this embodiment, the heat dissipation plate is covered with an insulating layer.

In the heat dissipation device of this embodiment, the width of the slot ranges from 2mm to 2.5 mm.

In the heat dissipation device of this embodiment, the length of the slot is at least 8 mm.

In the heat dissipation device of this embodiment, the shape of the slot includes any one of a single-side slot, a two-side slot, a U-shaped slot and a square-shaped slot.

In the heat dissipation device of this embodiment, one or more connection positions are provided at a local position of the slot, so that a part of the fins inside the slot and a part of the fins outside the slot are kept connected by the connection positions.

In the heat dissipation device of this embodiment, the width of the connection position ranges from 2 to 3 mm.

In the heat dissipation device of this embodiment, when the slotted local position is provided with a plurality of connection positions, a distance between every two adjacent connection positions is not less than 8 mm.

The embodiment of the application further provides a mobile terminal, which comprises a shell and a heat dissipation device, wherein the heat dissipation device is installed inside the shell, and the heat dissipation device is the heat dissipation device in any one of the above embodiments.

The heat dissipation device provided by the embodiment of the application comprises a PCB, a shielding cover and a heat dissipation sheet; the shielding cover is positioned above the PCB; the radiating fin covers the PCB and the shielding cover; the radiating fin is provided with a slot, and the slot is arranged on the periphery of the radiating fin corresponding to the position of the shielding cover bonding pad on the PCB so as to enable an interference signal to be radiated to the outside from the slot. The embodiment of the application enables the interference signal to be radiated to the outside from the groove through the peripheral groove corresponding to the position of the pad of the shielding cover on the PCB on the radiating fin without being blocked by the radiating fin, and multiple reflections are not formed between the radiating fin and the PCB, so that the receiving performance of the terminal antenna can not be influenced by the radiating fin on the basis of ensuring the radiating function, and the overall performance of the terminal is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application.

Fig. 2 is another schematic structural diagram of a mobile terminal according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application.

Fig. 4 is another schematic structural diagram of a heat dissipation device according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Further, the present application may repeat reference numerals and/or reference letters in the various examples for simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or arrangements discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the application provides a mobile terminal. The mobile terminal can be a smart phone, a tablet computer, a smart watch and other devices. Referring to fig. 1 to 2, the mobile terminal 100 includes a cover plate 10, a display 20, a heat sink 30, a battery 40, and a case 50.

Wherein the cover plate 10 is mounted to the display screen 20 to cover the display screen 20. The cover plate 10 may be a transparent glass cover plate. For example, the cover plate 10 may be a glass cover plate made of a material such as sapphire.

The display screen 20 is mounted on the housing 50 to form a display surface of the mobile terminal 100. The display screen 20 may include a display area and a non-display area. The display area is used for displaying information such as images and texts. The non-display area does not display information. Functional components such as a fingerprint module and a touch circuit can be arranged at the bottom of the non-display area.

For example, the display screen 20 may also be a full screen, with only display areas and no non-display areas. Wherein, functional components such as fingerprint module, touch-control circuit set up the below at the full screen. For example, the display screen 20 may also be a shaped screen.

Wherein the case 50 may form an outer contour of the mobile terminal 100. The cover plate 10 may be fixed to the case 50, and the cover plate 10 and the case 50 form a closed space to accommodate the display screen 20, the heat sink 30, the battery 40, and the like.

In some embodiments, the housing 50 may be made of a metal material such as magnesium alloy, stainless steel, etc. It should be noted that the material of the housing 50 according to the embodiment of the present application is not limited thereto, and other manners may also be adopted, for example, the housing 50 may include a non-metal portion and a metal portion. For example, the housing 50 may be a plastic housing. For example, the housing 50 may be a ceramic housing. For example, the housing 50 may be a metal and plastic mating housing structure. The shell 50 may be formed by cold working, hot working, injection molding, extrusion molding, press molding, blow molding, cast molding, and gas assist molding. For example, the shell 50 is made of aluminum or an aluminum alloy, and can be formed by cold working methods such as lathing, milling, planing, drilling, and drawing. For example, the housing 50 may be made of a non-metal material by a non-metal material molding method such as injection molding.

Wherein the heat sink 30 is installed in the closed space formed by the cover plate 10 and the housing 50, and the heat sink 30 may include a PCB board 31, a shield cover 32 and a heat sink 33. The shield cover 32 may be any one or more of a baseband shield cover, a radio frequency shield cover, and a memory shield cover. The PCB 31 may be a main board of the mobile terminal 100, and is an important component for providing electrical connection for each electronic component in the mobile terminal, and may be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board, and other multi-layer boards according to the number of layers of the circuit board. The PCB board 31 generally comprises a substrate, a metal coating, and a wiring layer. One, two or more of the functional components such as a motor, a microphone, a speaker, an earphone interface, a universal serial bus interface, a front camera, a rear camera, a distance sensor, an ambient light sensor, a receiver, a processor, and a radio frequency module can be integrated on the PCB 31. Wherein the shielding cover 32 is located above the PCB board 31; the heat sink 33 covers the PCB 31 and the shielding cover 32, a first projection area formed by projecting the heat sink 33 onto the PCB 31 is larger than a second projection area formed by projecting the shielding cover 32 onto the PCB 31, and an overlapping portion of the first projection area and the second projection area is larger than the second projection area. For example, when the shielding cover 32 is a Baseband (BB) shielding cover, the BB shielding cover is used to cover a Baseband (BB) chip and a Power Management Unit (PMU) chip on the PCB board 31. For example, when the shield cover 32 is a Radio Frequency (RF) shield cover, the RF shield cover is used to cover a Radio Frequency Power Amplifier (RFPA) located on the PCB board 31. For example, when the shield cover 32 is a memory (memory) shield cover, the memory shield cover is used to cover a memory chip on the PCB board 31.

Wherein the battery 40 is installed in the sealed space formed by the cover plate 10 and the case 50, and the battery 50 is electrically connected to the heat sink 30 to provide power to the mobile terminal 100.

The embodiment of the application also provides a heat dissipation device. Referring to fig. 3 to 5, the heat sink 30 includes a PCB board 31, a shield cover 33, and a heat sink 32.

Shield cover wherein the shield cover 33 is located above the PCB board 31. The shielding cover 32 is used to cover the Baseband circuit on the PCB 31, main devices of the Baseband circuit include a Baseband (Baseband, BB) chip and a Power Management Unit (PMU) chip, and the shielding cover 32 may be used to prevent the external electromagnetic radiation of the chip from affecting the rf circuit, and also prevent the interference of the rf circuit from affecting the normal operation of devices in the Baseband circuit. The baseband circuit has a high operating frequency and a large current, and usually has a large amount of interference radiation, and although the baseband circuit is shielded by the shielding cover 32, a part of the interference signal radiates outward in a gap at the edge of the shielding cover 32.

Wherein the heat sink 32 is covered over the PCB board 31 and the shield cover 33;

the heat sink 32 is provided with a slot 321, and the slot 321 is disposed on the heat sink 32 at a periphery corresponding to a pad position of the shielding cover 33 on the PCB 31, so that an interference signal is radiated from the slot 321 to the outside. Through the slot 321, an interference signal formed by the outward radiation of the baseband circuit is radiated to the outside from the slot 321 through the slot 321, the interference signal is not blocked by the heat sink 32, multiple reflections are not formed between the heat sink 3232 and the PCB 31, and the receiving performance of the terminal antenna is not affected.

In some embodiments, the slots 321 can be filled with a quantity of absorbing material. For example, the slot 321 is filled with ferrite, and the ferrite wave-absorbing material has the best performance, and has the characteristics of high absorption frequency band, high absorptivity, thin matching thickness and the like. The material can be applied to electronic equipment to absorb leaked electromagnetic radiation and achieve the aim of eliminating electromagnetic interference. Even if the wave-absorbing material filled in the slot 321 can not completely absorb all interference signals, the remaining unabsorbed interference signals can be radiated to the outside from the slot 321.

The heat sink 32 is covered above the PCB 31 and the shielding cover 33 in a massive manner, and the heat sink 32 may be a graphite sheet or other metal foil such as copper foil. Because graphite belongs to light material, adopt it to dispel the heat and can reduce mobile terminal's overall quality and be convenient for realize mobile terminal's frivolousization. Furthermore, graphite materials are highly plastic and can be smoothly attached to any flat or curved surface. Wherein the heat sink 32 may be adapted to the base band shield cover. The heat sink 32 may also be adapted for use with other heat sink designs over shield covers, such as shield covers for covering RF PAs, memories, etc.

In some embodiments, a first projection area 35 formed by projecting the heat sink 32 onto the PCB 31 is larger than a second projection area 34 formed by projecting the shielding cover 33 onto the PCB 31, and an overlapping portion of the first projection area 35 and the second projection area 34 is larger than the second projection area 34. The purpose is to ensure that the peripheral edge of the heat sink 32 corresponding to the pad position of the shielding cover 33 on the PCB 31 can be notched 321, so that the interference signal can be better radiated from the notch 321 to the outside.

In some embodiments, the heat sink 32 is covered with an insulating layer 36. The function of the insulating layer 36 is to prevent shorting of the heat sink 32 and the devices on the PCB board 31. The insulating layer 36 may cover the slot 321, or other slots may be disposed on the insulating layer 36 corresponding to the slot 321, which does not affect the radiation of the interference signal from the slot 321 to the outside.

In some embodiments, the width of the slot 321 ranges from 2mm to 2.5 mm. Since in this width range it is ensured that the interfering signal is better radiated from the slot 321 to the outside without affecting the receiving performance of the terminal antenna.

In some embodiments, the slot 321 has a length of at least 8 mm. Since in this length range it is ensured that the interfering signal is better radiated from the slot 321 to the outside without affecting the reception performance of the terminal antenna.

In some embodiments, the slot 321 shape includes any one of a single-sided slot, a two-sided slot, a U-shaped slot, and a square-shaped slot.

When the single side is grooved, only one connecting position 322 can be opened; when two sides are grooved, if two opposite sides are provided, a connecting position 322 can be respectively arranged at the middle position of each side, and if two adjacent sides are provided, a connecting position 322 can be arranged at the intersection of the two adjacent sides; when the U-shaped slot is opened, a plurality of connecting positions can be arranged and distributed at each slot position, but the connecting positions and the connecting positions cannot be too dense, and the distance interval of more than 8-10mm is needed; when the square is grooved, a connecting position 322 can be arranged in the middle of each side of the square. The purpose of this arrangement is to ensure that part of the heat dissipation fins inside the slot 321 and part of the heat dissipation fins outside the slot 321 are tightly connected through the connection position 322, and at the same time, the connection position does not occupy more slot area, and it is ensured that the interference signal can be sufficiently radiated from the slot 321 to the outside.

For example, the heat sink 32 may be provided with a groove 321 on any side corresponding to the pad position of the shield cover 33 on the PCB 31, or may be provided with a groove 321 on any side, or may be provided with either a U-shaped groove 321 or a square-shaped groove 321.

In some embodiments, one or more connection sites 322 are provided at a local position of the slot 321, so that a part of the heat sink inside the slot 321 and a part of the heat sink outside the slot 321 are connected through the connection sites 322.

In some embodiments, the width of the connecting bits 322 ranges from 2 to 3 mm. Because in this range, it can be ensured that the part of the heat sink inside the slot 321 is tightly connected with the part of the heat sink outside the slot 321 through the connecting portion 322, and at the same time, the length of the slot 321 is not occupied.

In some embodiments, when the slot 321 is provided with a plurality of connecting positions 322 at local positions, the distance between every two adjacent connecting positions 322 is not less than 8 mm. Since the connection bits 322 occupy the length of the slot 321 if the distance is too small, it cannot be guaranteed that the interference signal is better radiated from the slot 321 to the outside, and the receiving performance of the terminal antenna is not affected.

In summary, the heat dissipation device 30 provided in the embodiment of the present application includes: PCB board 31, shield cover 33, and heat sink 32; the shield cover 33 is positioned above the PCB board 31; the heat sink 32 is covered over the PCB board 31 and the shield cover 33; the heat sink 32 is provided with a slot 321, and the slot 321 is disposed on a periphery of the heat sink 32 corresponding to a pad position of the shielding cover 33 on the PCB 31, so that the interference signal is radiated from the slot 321 to the outside. In the embodiment of the application, the peripheral slot 321 corresponding to the pad position of the shielding cover 32 on the PCB 31 on the heat sink 32 allows an interference signal to be radiated to the outside from the slot 321 without being blocked by the heat sink 32, and multiple reflections are not formed between the heat sink 32 and the PCB 31, so that the heat sink 32 does not affect the receiving performance of the terminal antenna, and can play a role in heat dissipation.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The foregoing describes in detail a heat dissipation device and a mobile terminal provided in an embodiment of the present application, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the foregoing embodiment is only used to help understand the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A heat dissipation device is characterized by comprising a PCB, a shielding cover and a heat dissipation sheet;

the shielding cover is positioned above the PCB;

the radiating fin covers the PCB and the shielding cover, and a first projection area formed by projecting the radiating fin on the PCB is larger than a second projection area formed by projecting the shielding cover on the PCB;

the PCB comprises a PCB board, a radiating fin and a shielding cover pad, wherein the radiating fin is provided with a slot, the slot is arranged on the radiating fin and corresponds to the periphery of the position of the shielding cover pad on the PCB board, so that an interference signal is radiated to the outside from the slot, and the slot shape comprises any one of a single-side slot, two-side slots, a U-shaped slot and a square-shaped slot.

2. The heat dissipating device as claimed in claim 1, wherein a first projected area of the heat dissipating plate projected onto the PCB is larger than a second projected area of the shield cover projected onto the PCB, and an overlapping portion of the first projected area with the second projected area is larger than the second projected area.

3. The heat dissipating device of claim 1, wherein the heat sink is covered with an insulating layer.

4. The heat dissipating device of claim 1, wherein the slot has a width in the range of 2mm to 2.5 mm.

5. The heat dissipating device of claim 1, wherein said slot has a length of at least 8 mm.

6. A heat sink according to any one of claims 1-5, wherein one or more attachment sites are provided at localized positions of the slot such that portions of the fins inside the slot remain attached to portions of the fins outside the slot via the attachment sites.

7. The heat dissipating device of claim 6, wherein the width of the connecting site ranges from 2mm to 3 mm.

8. The heat dissipating device of claim 6, wherein when the slot is partially provided with a plurality of connecting portions, the distance between every two adjacent connecting portions is not less than 8 mm.

9. A mobile terminal comprising a housing and a heat sink, the heat sink being mounted inside the housing, the heat sink being according to any one of claims 1 to 8.