CN111455358A - Horizontal chemical copper plating process for printed circuit board - Google Patents
Horizontal chemical copper plating process for printed circuit board Download PDFInfo
- Publication number
- CN111455358A CN111455358A CN202010486274.1A CN202010486274A CN111455358A CN 111455358 A CN111455358 A CN 111455358A CN 202010486274 A CN202010486274 A CN 202010486274A CN 111455358 A CN111455358 A CN 111455358A
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- Prior art keywords
- copper plating
- horizontal
- circuit board
- printed circuit
- concentration
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
Abstract
The invention belongs to the technical field of printed circuit board processing, and particularly relates to a horizontal chemical copper plating process for a printed circuit board. The horizontal chemical copper plating process comprises the following steps: 1) cleaning a horizontal copper plating bath; 2) firstly, adding an electroless copper plating solution into the horizontal electroless copper plating tank, wherein the electroless copper plating solution comprises deionized water, CuSO 4.5H 2O, sodium potassium tartrate, sodium citrate, formaldehyde, sodium hydroxide, sodium thiosulfate, biquinoline, potassium ferrocyanide and 2-2 bipyridine; 3) heating the horizontal chemical copper plating tank to 35-45 ℃, and starting a circulating filter pump; 4) placing the printed circuit board subjected to catalytic and rapid water washing into the horizontal chemical copper plating tank, and spraying and soaking; 5) taking out the printed circuit board, cleaning the printed circuit board by using tap water, and drying the printed circuit board by using hot air; 6) and transferring to a whole-plate copper plating process.
Description
Technical Field
The invention belongs to the technical field of printed circuit board processing, and particularly relates to a horizontal chemical copper plating process for a printed circuit board.
Background
The metal of the via hole of the printed circuit board is usually chemically plated with copper by adopting a vertical hanging plate mode, and because the printed circuit board adopts a chemical copper plating process of the vertical hanging plate mode for high integration, high density and high aspect ratio, and micro aperture (aperture is less than or equal to 0.25mm), blind hole and buried hole, the chemical copper plating quality of the high-grade board is seriously influenced because chemical copper plating backlight cannot be ensured due to limited liquid medicine perforating capacity, so that a new process for chemically plating copper of micro apertures (aperture is less than or equal to 0.25mm), blind holes (aperture is less than or equal to 0.15mm), buried holes (aperture is less than or equal to 0.10mm) and high aspect ratio is urgently needed.
Therefore, it is necessary to provide a technical means to solve the above-mentioned drawbacks.
Disclosure of Invention
In order to solve the defects of the prior art, the invention aims to provide a horizontal electroless copper plating process for a printed circuit board, so as to solve the quality problems of hole metallization backlight of micro holes (the aperture is less than or equal to 0.25mm), blind holes (the aperture is less than or equal to 0.15mm) and buried holes (the aperture is less than or equal to 0.10mm), thereby improving the reliability of hole metallization conduction of micro holes (the aperture is less than or equal to 0.25mm), blind holes (the aperture is less than or equal to 0.15mm), buried holes (the aperture is less than or equal to 0.10mm) and buried holes.
In order to achieve the above object, the present invention provides a horizontal electroless copper plating process for a printed wiring board, comprising the steps of:
1) cleaning a horizontal copper plating bath;
2) firstly, adding an electroless copper plating solution into the horizontal electroless copper plating tank, wherein the electroless copper plating solution comprises deionized water, CuSO 4.5H 2O, sodium potassium tartrate, sodium citrate, formaldehyde, sodium hydroxide, sodium thiosulfate, biquinoline, potassium ferrocyanide and 2-2 bipyridine;
3) heating the horizontal chemical copper plating tank to 35-45 ℃, and starting a circulating filter pump;
4) placing the printed circuit board subjected to catalytic and rapid water washing into the horizontal chemical copper plating tank, and spraying and soaking;
5) taking out the printed circuit board, cleaning the printed circuit board by using tap water, and drying the printed circuit board by using hot air;
6) and transferring to a whole-plate copper plating process.
Preferably, in a specific technical solution, the step 1) includes:
a) after the residual liquid in the horizontal copper plating bath is completely discharged, washing the bath clean by tap water;
b) adding cleaning solution into the horizontal chemical copper plating tank, soaking for 1-2 hours, and starting a circulating filter pump; wherein the cleaning solution is a dilute solution of sulfuric acid and hydrogen peroxide;
c, completely discharging the cleaning solution, after completely discharging, washing the cleaning solution by using tap water, adding deionized water for cleaning for 1-2 hours, and starting a circulating filter pump;
d) and discharging residual liquid in the horizontal copper plating bath again.
Preferably, in a specific technical scheme, in the step b), the concentration of the sulfuric acid is 2 wt%, and the concentration of the hydrogen peroxide is 4 wt%.
Preferably, in a specific embodiment, the concentration of the CuSO 4.5H 2O is 0.2 to 0.8 wt%, the concentration of the sodium potassium tartrate is 1.0 to 4.0 wt%, the concentration of the sodium citrate is 2.0 to 6.0 wt%, the concentration of the formaldehyde is 0.3 to 1.5 wt%, the concentration of the sodium hydroxide is 0.6 to 1.4 wt%, the concentration of the sodium thiosulfate is 0.01 to 0.08 wt%, the concentration of the biquinoline is 0.001 to 0.005 wt%, the concentration of the potassium ferrocyanide is 0.015 to 0.035 wt%, and the concentration of the 2-2 bipyridine is 0.002 to 0.006 wt%.
Preferably, in a specific technical scheme, the specific gravity of the electroless copper plating solution is 1.04-1.08g/cm3The pH value is 11-13.
Preferably, in a specific technical scheme, in the step 4), the time for the spray soaking is 4-6 minutes.
Preferably, in a specific technical scheme, in the step 5), the tap water cleaning time is 40-60 seconds, the cleaning temperature is room temperature, the hot air drying time is 30-40 seconds, and the hot air drying temperature is 70-80 ℃.
The horizontal chemical copper plating process has the following beneficial effects:
(1) the chemical copper plating solution has high activity and short chemical copper plating time, can reach the thickness of a copper layer of vertical chemical copper plating (the vertical chemical copper plating usually needs 15-18 minutes) in only 4-6 minutes, saves the production time of 1/3 and greatly improves the production efficiency.
(2) The chemical copper plating solution has high stability, and the normal production process only needs one maintenance for one week (while the vertical chemical copper plating needs one maintenance within three days).
(3) The quality problems of hole metallization of a via hole of a printed wiring board of a microporous board (the aperture is less than or equal to 0.25mm), a blind hole board (the aperture is less than or equal to 0.15mm) and a buried hole board (the aperture is less than or equal to 0.10mm) are solved (the hole has no copper and the resistance of the via hole is too high due to poor backlight), and the reject ratio of the boards is 0.1% of that of vertical electroless copper plating. The drop was 0.01%.
(4) The raw materials have wide sources, low price, low cost and no pollution in the production process, thereby having wide application prospect in the field of printed circuit boards.
Detailed Description
Example 1
Completely discharging the waste liquid of the horizontal chemical copper plating tank, completely washing the waste liquid by using tap water, adding tap water, 2 wt% of sulfuric acid and 4 wt% of hydrogen peroxide, starting a circulating filter pump to soak for 2 hours, completely discharging the waste liquid, completely washing the waste liquid by using tap water, adding deionized water, starting the circulating filter pump to soak for 2 hours, completely discharging the cleaning water, adding deionized water, 0.1 wt% of CuSO 4.5H2O, 2 wt% of potassium sodium tartrate, 3 wt% of sodium citrate, 0.5 wt% of formaldehyde, 0.8 wt% of sodium hydroxide, 0.05 wt% of sodium thiosulfate, 0.03 wt% of biquinoline, 0.002 wt% of potassium ferrocyanide and 0.004 wt% of 2-2 bipyridyl, wherein the specific gravity of the waste liquid is 1.05g/cm3And when the pH value is 12, heating the horizontal chemical copper plating solution to 40 ℃, starting a circulating filter pump, putting the catalyzed and accelerated printed circuit board into a tank, spraying and soaking for 5 minutes, washing the printed circuit board for 50 seconds, then carrying out 80 ℃ (drying for 40 seconds by hot air), and then transferring to a whole board copper plating process.
The experimental results show that the micro-hole (the aperture is less than or equal to 0.25mm) blind hole (the aperture is less than or equal to 0.15mm) and buried hole (the aperture is less than or equal to 0.10mm) are excellent in backlight grade, the horizontal chemical copper plating rate is moderate, and the hole copper separation phenomenon is not found after thermal shock after copper plating, so that the quality of the printed circuit board to be subjected to micro-hole, blind hole and buried hole is greatly improved (see table 1, and table 1 lists the backlight grade of different via holes for chemical copper plating and the copper separation condition standard of the thermal shock hole after electroplating).
TABLE I (horizontal electroless copper plating rate 0.4 μm/5 min, standard range: 0.35-0.55 μm/5 min)
Example 2
Completely discharging the waste liquid of the horizontal chemical copper plating tank, completely washing the waste liquid by using tap water, adding tap water, 2 wt% of sulfuric acid and 4 wt% of hydrogen peroxide, starting a circulating filter pump to soak for 2 hours, completely discharging the waste liquid, completely washing the waste liquid by using tap water, adding deionized water, starting the circulating filter pump to soak for 2 hours, completely discharging the washing water, adding deionized water, 0.8 wt% of CuSO 4.5H2O, 4 wt% of potassium sodium tartrate, 6 wt% of sodium citrate, 1.5 wt% of formaldehyde, 1.4 wt% of sodium hydroxide, 0.08 wt% of sodium thiosulfate, 0.05 wt% of biquinoline, 0.0035 wt% of potassium ferrocyanide and 0.006 wt% of 2-2 bipyridyl, wherein the specific gravity of the waste liquid is 1.08g/cm3And when the pH value is 13, heating the horizontal chemical copper plating solution to 45 ℃, starting a circulating filter pump, putting the catalyzed and accelerated printed circuit board into a tank, spraying and soaking for 6 minutes, washing the printed circuit board for 40 seconds, then carrying out hot air drying for 35 seconds at 70 ℃, and then transferring to a whole board copper plating process.
The experimental results show that the micro-hole (the aperture is less than or equal to 0.25mm) blind hole (the aperture is less than or equal to 0.15mm) and buried hole (the aperture is less than or equal to 0.10mm) are excellent in backlight grade, the horizontal chemical copper plating rate is moderate, and the copper separation phenomenon is not found after the copper plating, so that the quality of the printed circuit board to be subjected to micro-hole, blind hole and buried hole is greatly improved (see table 2, and table 2 lists the backlight grade of the chemical copper plating through different via holes and the copper separation condition standard of the thermal impact hole after the electroplating).
TABLE II (horizontal electroless copper plating rate 050 μm/6 min, standard range: 0.35-0.55 μm/5 min)
Example 3
Completely discharging the waste liquid of the horizontal chemical copper plating tank, washing the waste liquid with tap water, adding tap water, 2 wt% of sulfuric acid and 4 wt% of hydrogen peroxide, starting a circulating filter pump to soak for 2 hours, completely discharging the waste liquid, and using the tap waterWashing with water, adding deionized water, starting a circulating filter pump to soak for 2 hours, completely draining the washing water, adding deionized water, 0.1 wt% of CuSO4 & 5H2O, 2 wt% of sodium potassium tartrate, 3 wt% of sodium citrate, 0.5 wt% of formaldehyde, 0.8 wt% of sodium hydroxide, 0.05 wt% of sodium thiosulfate, 0.03 wt% of biquinoline, 0.002 wt% of potassium ferrocyanide and 0.004 wt% of 2-2 bipyridyl, wherein the specific gravity of the mixture is 1.05g/cm3And when the pH value is 12, heating the horizontal chemical copper plating solution to 35 ℃, starting a circulating filter pump, putting the catalyzed and accelerated printed circuit board into a tank, spraying and soaking for 4 minutes, washing the printed circuit board for 60 seconds, then carrying out hot air drying for 30 seconds at 75 ℃, and then transferring to the whole board copper plating process.
The experimental results show that the micro-hole (the aperture is less than or equal to 0.25mm) blind hole (the aperture is less than or equal to 0.15mm) and buried hole (the aperture is less than or equal to 0.10mm) are excellent in backlight grade, the horizontal chemical copper plating rate is moderate, and the copper separation phenomenon is not found after the copper plating, so that the quality of the printed circuit board to be subjected to micro-hole, blind hole and buried hole is greatly improved (see table 3, and table 3 lists the backlight grade of the chemical copper plating through different via holes and the copper separation condition standard of the thermal impact hole after the electroplating).
Watch III
The above description is only exemplary of the present invention, and the structure is not limited to the above-mentioned shapes, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A horizontal chemical copper plating process for a printed circuit board is characterized in that: the horizontal chemical copper plating process comprises the following steps:
1) cleaning a horizontal copper plating bath;
2) firstly, adding an electroless copper plating solution into the horizontal electroless copper plating tank, wherein the electroless copper plating solution comprises deionized water, CuSO 4.5H 2O, sodium potassium tartrate, sodium citrate, formaldehyde, sodium hydroxide, sodium thiosulfate, biquinoline, potassium ferrocyanide and 2-2 bipyridine;
3) heating the horizontal chemical copper plating tank to 35-45 ℃, and starting a circulating filter pump;
4) placing the printed circuit board subjected to catalytic and rapid water washing into the horizontal chemical copper plating tank, and spraying and soaking;
5) taking out the printed circuit board, cleaning the printed circuit board by using tap water, and drying the printed circuit board by using hot air;
6) and transferring to a whole-plate copper plating process.
2. The horizontal electroless copper plating process for the printed wiring board as claimed in claim 1, wherein: the step 1) comprises the following steps:
a) after the residual liquid in the horizontal copper plating bath is completely discharged, washing the bath clean by tap water;
b) adding cleaning solution into the horizontal chemical copper plating tank, soaking for 1-2 hours, and starting a circulating filter pump; wherein the cleaning solution is a dilute solution of sulfuric acid and hydrogen peroxide;
C) completely discharging the cleaning solution, after completely discharging, washing the cleaning solution by using tap water, adding deionized water for cleaning for 1-2 hours, and starting a circulating filter pump;
d) and discharging residual liquid in the horizontal copper plating bath again.
3. The horizontal electroless copper plating process for the printed wiring board as claimed in claim 2, wherein: in the step b), the concentration of the sulfuric acid is 2 wt%, and the concentration of the hydrogen peroxide is 4 wt%.
4. The horizontal electroless copper plating process for the printed wiring board as claimed in claim 1, wherein: the concentration of CuSO 4.5H 2O is 0.2-0.8 wt%, the concentration of potassium sodium tartrate is 1.0-4.0 wt%, the concentration of sodium citrate is 2.0-6.0 wt%, the concentration of formaldehyde is 0.3-1.5 wt%, the concentration of sodium hydroxide is 0.6-1.4 wt%, the concentration of sodium thiosulfate is 0.01-0.08 wt%, the concentration of biquinoline is 0.001-0.005 wt%, the concentration of potassium ferrocyanide is 0.015-0.035 wt%, and the concentration of 2-2 bipyridine is 0.002-0.006 wt%.
5. A horizontal electroless copper plating process for printed wiring boards as claimed in claim 1 wherein: the specific gravity of the electroless copper plating solution is 1.04-1.08g/cm3The pH value is 11-13.
6. The horizontal electroless copper plating process for the printed wiring board as claimed in claim 1, wherein: in the step 4), the time for spraying and soaking is 4-6 minutes.
7. The horizontal electroless copper plating process for the printed wiring board as claimed in claim 1, wherein: in the step 5), the tap water cleaning time is 40-60 seconds, the cleaning temperature is room temperature, the hot air blow-drying time is 30-40 seconds, and the hot air blow-drying temperature is 70-80 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010486274.1A CN111455358A (en) | 2020-06-01 | 2020-06-01 | Horizontal chemical copper plating process for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010486274.1A CN111455358A (en) | 2020-06-01 | 2020-06-01 | Horizontal chemical copper plating process for printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN111455358A true CN111455358A (en) | 2020-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010486274.1A Pending CN111455358A (en) | 2020-06-01 | 2020-06-01 | Horizontal chemical copper plating process for printed circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220267906A1 (en) * | 2021-02-24 | 2022-08-25 | Jetchem International Co., Ltd. | Solution and process for the activation of nonconductive area for electroless process |
| CN115679305A (en) * | 2023-01-03 | 2023-02-03 | 湖南源康利科技有限公司 | Chemical copper plating treatment process for surface of aluminum foil for printed board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56156750A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
| JPS6179775A (en) * | 1984-09-27 | 1986-04-23 | Toshiba Corp | Chemical copper plating solution |
| CN104040025A (en) * | 2011-10-10 | 2014-09-10 | 恩索恩公司 | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
| CN107267968A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of thick process for copper of chemical plating for printed wiring board |
| CN108165959A (en) * | 2018-01-24 | 2018-06-15 | 永星化工(上海)有限公司 | Chemical bronze plating liquid |
-
2020
- 2020-06-01 CN CN202010486274.1A patent/CN111455358A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56156750A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
| JPS6179775A (en) * | 1984-09-27 | 1986-04-23 | Toshiba Corp | Chemical copper plating solution |
| CN104040025A (en) * | 2011-10-10 | 2014-09-10 | 恩索恩公司 | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
| CN107267968A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of thick process for copper of chemical plating for printed wiring board |
| CN108165959A (en) * | 2018-01-24 | 2018-06-15 | 永星化工(上海)有限公司 | Chemical bronze plating liquid |
Non-Patent Citations (1)
| Title |
|---|
| 梁志杰等: "《非金属刷镀技术》", 30 September 1993, 机械工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220267906A1 (en) * | 2021-02-24 | 2022-08-25 | Jetchem International Co., Ltd. | Solution and process for the activation of nonconductive area for electroless process |
| CN115679305A (en) * | 2023-01-03 | 2023-02-03 | 湖南源康利科技有限公司 | Chemical copper plating treatment process for surface of aluminum foil for printed board |
| CN115679305B (en) * | 2023-01-03 | 2023-03-10 | 湖南源康利科技有限公司 | Chemical copper plating treatment process for surface of aluminum foil for printed board |
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