CN110324989A - One kind being used for printed wiring board core material palm fibre oxidation technology - Google Patents
One kind being used for printed wiring board core material palm fibre oxidation technology Download PDFInfo
- Publication number
- CN110324989A CN110324989A CN201810264622.3A CN201810264622A CN110324989A CN 110324989 A CN110324989 A CN 110324989A CN 201810264622 A CN201810264622 A CN 201810264622A CN 110324989 A CN110324989 A CN 110324989A
- Authority
- CN
- China
- Prior art keywords
- palm fibre
- core material
- wiring board
- printed wiring
- oxidation technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Abstract
The present invention provides one kind to be used for printed wiring board core material palm fibre oxidation technology; include the following steps: after first discharging horizontal brownification tank liquor completely; it is rinsed well with tap water; continue with deionized water wash cycles; completely after discharge ejected wash water, deionized water, sulfuric acid are added into brownification slot; hydrogen peroxide and 2- dredge base benzothiazole, triamido propyl trimethoxy silicane, hexonic acid sodium, three ammonia azoles of 5- acetyl group benzo, heat the brownification tank liquor to 30-36 DEG C；Start circulating pump, will be put into brownification internal layer circuit plate in the brownification liquid 1-1.5 minutes；Internal layer circuit plate is taken out, is cleaned up with tap water and deionized water；70-80 DEG C of hot blast drying, internal layer circuit plate is transferred to sheet, pressing working procedure, the core material obtained for printed wiring board core material palm fibre oxidation technology of the invention can remove the quality hidden danger that subsequent handling generates pink circle, plate bursting be prevented, to improve the quality and reliability of process.
Description
Technical field
The invention belongs to printed wiring board multi-layer board processing technique fields, specifically, being related to a kind of for printed wiring
Inner cord core plate palm fibre oxidation technology.
Background technique
Printed wiring board multi-layer board core material mostly uses greatly black oxidation technology before interlayer pressing, to improve internal layer copper
Binding force between (route) and epoxy resin, however there are following quality hidden danger for black oxidation technology:
1, black oxidation technology is that copper face (route) is oxidized to copper oxide, cuprous oxide at high temperature using strong oxidizer,
And this grows needle-shaped copper oxide, cuprous oxide is easily broken in interlayer bonding processes, and with epoxy resin flows to make dielectric layer
Electrical problem is formed, signaling rate is influenced and causes line loss, simultaneous oxidation copper, cuprous oxide easily absorb moisture and makes
Multi-layer board is after pressing or production board plate bursting (i.e. interlaminar separation) easily occurs in thermal shock welding and seriously affects wiring board product
Matter and reliability.
2, the film layer of black oxidation technology be copper oxide, cuprous oxide resist strong acid ability it is poor, be easy to hole after piercing
It is destroyed during metallization and electro-coppering by strong acid, so that forming " pink circle " causes quality defect and functional issues.
3, black oxidation technology is that there are serious security risk and mistakes using production (85 DEG C ± 2 DEG C) under strong oxidizer high temperature
Divide the consumption energy.
4, black oxidation technology is the production of insert rack formula vertical line, and the low full production line of production efficiency needs two people's insert rack one man operations
Production equipment also needs manually to take plate after black oxidation, it is easy to spend black oxidation film layer wiping impaired, to influence to press quality.
5, black oxidation technology process is various, and the production cycle up to 90 minutes, is unable to satisfy growing production requirement
It follows that black oxidation technology has seriously affected product quality and reliability, seriously affect circuit board plant at
Sheet and delivery date, as the increasingly developed qualitative reliability requirement to printed wiring board of electronics industry is higher and higher, to printing
The cost of wiring board and the requirement at delivery date are also higher and higher, therefore solve core material copper before printed wiring board interlayer presses
Face (route) process of surface treatment is extremely urgent.
Summary of the invention
In place of solving above-mentioned the deficiencies in the prior art, the purpose of the present invention is to provide a kind of high-quality to show, high
Printed wiring board core material copper face (route) process of surface treatment of reliability, high production efficiency, high degree of automation,
To prevent black oxidation technology bring plate bursting (inner plating interlaminar separation), pink circle and the charging property problem of inner layer resin, life
The problems such as producing inefficiency.
To achieve the goals above, the present invention is the technical solution for solving its technical problem and providing are as follows: one kind is for printing
Wiring board core material palm fibre oxidation technology processed, technique include the following steps:
(1) it after discharging palm fibre oxidation tank liquor completely, is first rinsed with tap water, it is then clean with deionized water wash cycles；
(2) brown oxidant is added to brownification slot in brown oxidation solution configuration, and the palm fibre oxidant includes sulfuric acid, hydrogen peroxide and 2-
Dredge base benzothiazole, triamido propyl trimethoxy silicane, hexonic acid sodium, three ammonia azoles of 5- acetyl group benzo；
(3) brown oxidation solution is heated in brown oxidation trough to 30-36 DEG C；
(4) start cycle filter pump；
(5) it will be put into spray in the brown oxidation solution that temperature after heating is 30-36 DEG C to palm fibre oxidation internal layer circuit plate and impregnate；
(6) internal layer circuit plate is taken out, is cleaned with tap water and is cleaned up again with deionized water；
(7) 70-80 DEG C of hot blast drying of internal layer circuit plate that will be cleaned up；
(8) it is transferred to multi-layer board and matches this and laminating process.
It is excellent as to a kind of further explanation for printed wiring board core material palm fibre oxidation technology of the present invention
The concentration of selection of land, brown oxidation solution configuration has following mass percentage composition: sulfuric acid 4-7wt%, hydrogen peroxide 4.5-
It is 0.5-0.8wt% that 9.5wt%, 2-, which dredge base benzothiazole, and triamido propyl trimethoxy silicane is 0.3-0.6wt%, pentahydroxy-
Sour sodium is 0.08-0.12wt% to base, and three ammonia azoles of 5- acetyl group benzo is 0.04-0.06wt%.
As the further explanation to horizontal brown oxidation technology of the present invention, it is preferable that the pH of horizontal palm fibre oxidant <
1, specific gravity 1.13-1.18g/cm3.
As the further explanation to horizontal brown oxidation technology of the present invention, it is preferable that in step (1), deionization
The time of water cleaning is 30 minutes.
As the further explanation to horizontal brown oxidation technology of the present invention, it is preferable that in step (5), spray leaching
The time of bubble is 1-2 minutes.
As the further explanation to horizontal brown oxidation technology of the present invention, it is preferable that in step (6), tap water
The time of cleaning is 15-20 seconds, temperature is room temperature, and deionized water scavenging period is 15-20 seconds.
As the further explanation to horizontal brown oxidation technology of the present invention, it is preferable that in step (7), hot wind is blown
The dry time is 25-35 seconds.
The brown oxidation technology of level of the invention has the advantages that
(1) between the copper face (route) and epoxy resin of black oxidation interlayer pressing binding force by physics molecular separating force
(small and weak binding force) combines, and changes the combination of the interlayer pressing between the copper face (route) and epoxy resin of horizontal palm fibre oxidation
Power is that chemistry builds (binding force is stronger), to prevent " because of plate bursting " (interlaminar separation) of the multilayer pole in welding and assembling process
And the quality hidden danger generated；
(2) copper face (route) of black oxidation is solved because of copper oxide, the long needle construction of cuprous oxide, because of fracture in pressing
And so that dielectric layer is influenced the transmission of electric signal with electrically and is increased dielectric loss throughout dielectric layer with epoxy resin,
Affect the functional quality of electronic product；
(3) copper face (route) of black oxidation is solved because copper oxide, cuprous oxide acid-resisting are poor, in subsequent mesoporous metal
The quality hidden danger of " pink circle " is generated in the processes such as change, copper facing due to by the erosion of acid,
(4) " interlayer is generated when solving due to copper oxide, cuprous oxide easily absorb moisture in subsequent wiring board assemble welding
The quality hidden danger of separation "；
(5) horizontal production method is used, automated production mode is realized, greatly improves production efficiency, is shortened
Production cycle (the black oxidation production cycle is 90 minutes, and horizontal palm fibre oxidation only needs 30 minutes) improves product quality and production
The reliability of product；
(6) since using immersion is sprayed in 30-36 DEG C of temperature of brown oxidation solution, lower temperature produces and do not use strong oxygen
Agent, therefore production cost is reduced, improve the safety of production；
(7) raw material sources are wide, cheap, at low cost, production process is pollution-free, have in printed wiring board field extensive
Application prospect.
Specific embodiment
In order to enable auditor to further appreciate that structure of the invention, feature and other purposes, now in conjunction with appended preferable
Detailed description are as follows for embodiment, and the embodiment of this explanation is only used to illustrate the technical scheme of the present invention, and the non-limiting present invention.
A kind of brown oxidation solution for printed wiring board core material palm fibre oxidation technology disclosed by the invention has following
Mass percentage composition:
Sulfuric acid is 4-7wt%；Hydrogen peroxide is 4.5-9.5wt%；It is 0.5-0.8wt% that 2-, which dredges base benzothiazole,；Triamido
Propyl trimethoxy silicane is 0.3-0.6wt%；Hexonic acid sodium is 0.08-0.12wt%；Three ammonia azoles of 5- acetyl group benzo
For 0.04-0.06wt%.
One mass percentage composition of preferred embodiment are as follows:
Sulfuric acid: 4wt%；Hydrogen peroxide: 5wt%；2- dredges base benzothiazole: 0.6wt%；Triamido propyl trimethoxy silicon
Alkane: 0.4wt%；Hexonic acid sodium: 0.09wt%；Three ammonia azoles of 5- acetyl group benzo: 0.05wt%.
Two mass percentage composition of preferred embodiment are as follows:
Sulfuric acid: 5wt%；Hydrogen peroxide: 7wt%；2- dredges base benzothiazole: 0.5wt%；Three ammonia azoles of 5- acetyl group benzo:
0.05wt%；Triamido propyl trimethoxy silicane: 0.4wt%；Hexonic acid sodium: 0.10wt%.
By taking preferred embodiment one as an example, the present invention matches according to the brown oxidation solution that various components are configured to by following processing step
Internal sandwich circuit board is set to be aoxidized, the specific steps are as follows:
(1) it cleans, after horizontal brown oxidation trough working solution is discharged completely, is first rinsed with tap water, then use deionized water
Wash cycles recycle 30 minutes；
(2) deionized water and pH < 1 is added to brownification slot in brown oxidation solution configuration, and specific gravity is the brown oxidant of 1.13g/cm3,
Mass percentage composition disclosed in one weighs and mixes each component according to the preferred embodiment；
(3) brown oxidation solution is heated in brown oxidation trough to 34 DEG C；
(4) start cycle filter pump；
(5) spray in the brown oxidation solution that temperature after heating is 34 DEG C will be put into palm fibre oxidation internal layer circuit plate impregnate 85
Second；
(6) internal layer circuit plate is taken out in brown oxidation solution, is then cleaned with tap water and is cleaned 30 seconds with deionized water again；
(7) palm fibre oxidation 75-80 DEG C of hot blast drying of internal layer circuit plate that will be cleaned up；
(8) the palm fibre oxidation internal layer circuit plate of drying is transferred to multi-layer board and matches this and laminating process.
Step can obtain from the process above, change the combination of the interlayer pressing between the copper face and epoxy resin of horizontal palm fibre oxidation
Power, to prevent the quality hidden danger that multi-layer board generates in welding and assembling process by " plate bursting ", (plate bursting is plate in the present embodiment
With plate interlaminar separation), it not only solves due to copper oxide, cuprous oxide easily absorb moisture in subsequent wiring board assemble welding
The quality hidden danger of " interlaminar separation " is generated, while being impregnated using being sprayed in 30-36 DEG C of temperature of brown oxidation solution, lower temperature is raw
It produces and does not use strong oxidizer, therefore reduce production cost, improve the safety of production.Please refer to table 1, table 1 be by
Carry out brown oxidation technology step operation horizontal to core material progress according to oxidation solution mass percentage composition brown in preferred embodiment one
The core material obtained afterwards, and the correlation that the core material influences multi-layer board inter-layer bonding force after multi-layer board presses
Performance is detected, and as shown in table 1, the core material after the horizontal palm fibre oxidation of the present invention is after multi-layer board presses to multi-layer board
The relevant parameter that inter-layer bonding force influences, by chart it is found that according to provided by the present invention for printed wiring board core material palm fibre
Oxidation technology can effectively solve copper oxide, cuprous oxide and easily absorb moisture and generate " interlayer in subsequent wiring board assemble welding
The quality hidden danger of separation ".
Table 1 is for the core material after the horizontal palm fibre oxidation of the present invention to multi-layer board inter-layer bonding force shadow after multi-layer board presses
Loud relevant parameter
By taking preferred embodiment two as an example, the present invention matches according to the brown oxidation solution that various components are configured to by following processing step
Internal sandwich circuit board is set to be aoxidized, the specific steps are as follows:
(1) it after discharging horizontal brown oxidation trough working solution completely, is first rinsed with tap water, then uses deionized water circulation cleaning
Wash circulation 30 minutes；
(3) deionized water and pH=0.1 is added to brownification slot, specific gravity is the brown oxidant of 1.15g/cm3, according to preferred reality
Mass percentage composition disclosed in example one is applied to weigh and mix each component；
(4) brown oxidation solution is heated in brown oxidation trough to 32 DEG C；
(5) start cycle filter pump；
(6) spray in the brown oxidation solution that temperature after heating is 32 DEG C will be put into palm fibre oxidation internal layer circuit plate impregnate 75
Second；
(7) internal layer circuit plate is taken out in brown oxidation solution, is then cleaned with tap water and is cleaned 20 seconds with deionized water again；
(8) palm fibre oxidation 75-80 DEG C of hot blast drying of internal layer circuit plate that will be cleaned up；
(9) the palm fibre oxidation internal layer circuit plate of drying is transferred to multi-layer board and matches this and laminating process.
From the process above step obtain palm fibre oxidation internal layer circuit plate copper face (route) formed one layer of uniform brown oxidation film,
To improve the binding force of inner plating and epoxy resin, for promoting product quality and product reliability after multi-layer board presses,
It solves because copper oxide, cuprous oxide acid-resisting are poor, because of the erosion by acid in the processes such as subsequent hole metallization, copper facing
And generate the quality hidden danger of " pink circle ".Please refer to table 2, table 2 is brown oxidation solution mass percent in two according to the preferred embodiment
It forms come to the core material obtained after the horizontal brown oxidation technology step operation of core material progress, and the core material is passed through
The correlated performance that crossing influences multi-layer board inter-layer bonding force after multi-layer board pressing detects, and as shown in table 2, the present invention is horizontal
The relevant parameter that core material after palm fibre oxidation influences multi-layer board inter-layer bonding force after multi-layer board presses, can by chart
Know, can effectively solve according to provided by the present invention for printed wiring board core material palm fibre oxidation technology because of copper oxide, oxidation
Cuprous acid-resisting is poor, generates the quality of " pink circle " due to by the erosion of acid in the processes such as subsequent hole metallization, copper facing
Hidden danger.
Table 2 is for the core material after the horizontal palm fibre oxidation of the present invention to multi-layer board inter-layer bonding force shadow after multi-layer board presses
Loud relevant parameter
It is to be understood that foregoing invention content and specific embodiment are intended to illustrate technical solution provided by the present invention
Practical application should not be construed as limiting the scope of the present invention.Those skilled in the art are in spirit and principles of the present invention
It is interior, when can various modifications may be made, equivalent replacement or improvement.Protection scope of the present invention is subject to the appended claims.
Claims (7)
1. one kind is used for printed wiring board core material palm fibre oxidation technology, which is characterized in that the palm fibre oxidation technology includes as follows
Step:
(1) it after discharging palm fibre oxidation tank liquor completely, is first rinsed with tap water, it is then clean with deionized water wash cycles；
(2) brown oxidant is added to brownification slot, the palm fibre oxidant includes that sulfuric acid, hydrogen peroxide and 2- dredge base benzothiazole, three ammonia
Base propyl trimethoxy silicane, hexonic acid sodium, three ammonia azoles of 5- acetyl group benzo；
(3) brown oxidation solution is heated in brown oxidation trough to 30-36 DEG C；
(4) start cycle filter pump；
(5) it will be put into spray in the brown oxidation solution that temperature after heating is 30-36 DEG C to palm fibre oxidation internal layer circuit plate and impregnate；
(6) the internal layer circuit plate in brown oxidation solution is taken out, is cleaned with tap water and is cleaned up again with deionized water；
(7) 70-80 DEG C of hot blast drying of internal layer circuit plate that will be cleaned up；
(8) it is transferred to multi-layer board and matches this and laminating process.
2. according to claim 1 be used for printed wiring board core material palm fibre oxidation technology, which is characterized in that the palm fibre oxygen
The concentration for changing liquid configuration has following mass percentage composition: sulfuric acid 4-7wt%, hydrogen peroxide 4.5-9.5wt%, 2- dredge base
Benzothiazole is 0.5-0.8wt%, and triamido propyl trimethoxy silicane is 0.3-0.6wt%, and hexonic acid sodium is 0.08-
Three ammonia azoles of 0.12wt%, 5- acetyl group benzo is 0.04-0.06wt%.
3. according to claim 1 be used for printed wiring board core material palm fibre oxidation technology, which is characterized in that the palm fibre oxygen
PH < 1 of agent, specific gravity 1.13-1.18g/cm3.
4. according to claim 1 be used for printed wiring board core material palm fibre oxidation technology, which is characterized in that the step
(1) in, the time of the deionized water cleaning is 30 minutes.
5. according to claim 1 be used for printed wiring board core material palm fibre oxidation technology, which is characterized in that the step
(6) in, the time that the spray impregnates is 1-2 minutes.
6. according to claim 1 be used for printed wiring board core material palm fibre oxidation technology, which is characterized in that the step
(7) in, the time of the tap water and deionized water cleaning is 15-20 seconds.
7. according to claim 1 be used for printed wiring board core material palm fibre oxidation technology, which is characterized in that the step
(8) in, the time of the hot blast drying is 25-35 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810264622.3A CN110324989A (en) | 2018-03-28 | 2018-03-28 | One kind being used for printed wiring board core material palm fibre oxidation technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810264622.3A CN110324989A (en) | 2018-03-28 | 2018-03-28 | One kind being used for printed wiring board core material palm fibre oxidation technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110324989A true CN110324989A (en) | 2019-10-11 |
Family
ID=68109955
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810264622.3A Pending CN110324989A (en) | 2018-03-28 | 2018-03-28 | One kind being used for printed wiring board core material palm fibre oxidation technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402040A (en) * | 2018-04-25 | 2019-11-01 | 东莞市斯坦得电子材料有限公司 | One kind being used for printed wiring board core material palm fibre oxidation technology |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1564650A (en) * | 2004-04-13 | 2005-01-12 | 广东光华化学厂有限公司 | Brownized treatment liquid for increasing adhesion of internal copper surface of circuit board and polymer material |
| CN102424964A (en) * | 2011-12-23 | 2012-04-25 | 广东东硕科技有限公司 | Browning conditioning fluid containing sulfydryl compound |
| CN105714280A (en) * | 2016-04-06 | 2016-06-29 | 武汉创新特科技有限公司 | Browning treatment liquid for printed circuit board |
-
2018
- 2018-03-28 CN CN201810264622.3A patent/CN110324989A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1564650A (en) * | 2004-04-13 | 2005-01-12 | 广东光华化学厂有限公司 | Brownized treatment liquid for increasing adhesion of internal copper surface of circuit board and polymer material |
| CN102424964A (en) * | 2011-12-23 | 2012-04-25 | 广东东硕科技有限公司 | Browning conditioning fluid containing sulfydryl compound |
| CN105714280A (en) * | 2016-04-06 | 2016-06-29 | 武汉创新特科技有限公司 | Browning treatment liquid for printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 叶绍明等: "应用于棕化液中的新型缓蚀添加剂", 《印制电路信息》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402040A (en) * | 2018-04-25 | 2019-11-01 | 东莞市斯坦得电子材料有限公司 | One kind being used for printed wiring board core material palm fibre oxidation technology |
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Application publication date: 20191011 |