CN107267968A - A kind of thick process for copper of chemical plating for printed wiring board - Google Patents
A kind of thick process for copper of chemical plating for printed wiring board Download PDFInfo
- Publication number
- CN107267968A CN107267968A CN201610218466.8A CN201610218466A CN107267968A CN 107267968 A CN107267968 A CN 107267968A CN 201610218466 A CN201610218466 A CN 201610218466A CN 107267968 A CN107267968 A CN 107267968A
- Authority
- CN
- China
- Prior art keywords
- copper
- chemical plating
- electroless copper
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Abstract
The invention provides a kind of thick process for copper of chemical plating for printed wiring board.The thick process for copper of the chemical plating comprises the following steps：First by after electroless copper groove working solution completely discharge, rinsed well with running water；Continuation is circulated with deionized water；The electroless copper agent aqueous solution is added to electroless copper groove, and heating chemical copper plating groove is to 35 45 DEG C；Start cycle filter pump, the printed wiring board for treating electroless copper is put into the electroless copper agent aqueous solution, spray immersion；Printed wiring board is taken out, is cleaned with running water；Last hot blast drying is simultaneously transferred to pattern transfer process.The present invention improves the yields of electroless copper, scrappage is reduced to 0.01% by the 1% of the thin copper of chemical plating, using double complexing agents, bistable agent, improve the stability of electroless copper tank liquor → the change groove cycle extended to 1 week by three days of the thin copper of chemical plating, alleviated the labor intensity of operating personnel.
Description
Technical field
The invention belongs to printed wiring board processing technique field, specifically, it is related to a kind of for the thick process for copper of printed wiring board chemical plating.
Background technology
Printed wiring board chemical-copper-plating process, tradition is the thin copper of chemical plating, is had a disadvantage in that：1) need to carry out full plate copper facing after the thin copper of chemical copper, equipment investment is big, waste of manpower, water power, place and ample resources.2) due to being single complexing agent and stabilizer, bath stability is poor, and the production maintenance cycle is short, need to maintain down groove within general three days, labor intensity of operating staff is big；3) quality stability is poor, and scrappage is high, and copper facing cavity or Kong Wutong easily occurs in via hole, typically 1% or so, it is impossible to meet industrialization demand, is badly in need of new technique instead.
The content of the invention
In order to solve above-mentioned the deficiencies in the prior art part, it is used for the thick process for copper of printed wiring board chemical plating it is an object of the invention to provide one kind.To lift electroless copper quality, equipment investment, manpower, water power and material resource are saved.
To achieve these goals, it is used for the thick process for copper of printed wiring board chemical plating the invention provides one kind.The thick process for copper of the chemical plating comprises the following steps：1) by after electroless copper groove working solution completely discharge, rinsed well with running water；2) continue to use deionized water wash cycles；3) the electroless copper agent aqueous solution is added to electroless copper groove, the electroless copper agent includes copper sulphate, sodium hydroxide, formaldehyde, stabilizer and complexing agent, the stabilizer includes potassium ferrocyanide and α, and α-dipyridyl, the complexing agent includes disodium EDTA and sodium potassium tartrate tetrahydrate；4) heating chemical copper plating groove is to 35-45 DEG C；5) cycle filter pump is started；6) it will treat that electroless copper printed wiring board is put into the electroless copper agent aqueous solution, spray immersion；7) printed wiring board is taken out, is cleaned with running water；8) hot blast drying；And 9) it is transferred to pattern transfer process.
Further illustrated as to the thick process for copper of chemical plating of the present invention, preferably, copper sulphate is every liter 8-12 grams, sodium hydroxide is every liter 16-20 grams, and formaldehyde is every liter 10-15 milliliters, and disodium EDTA is every liter 30-40 grams, sodium potassium tartrate tetrahydrate is every liter 25-35 grams, potassium ferrocyanide is every liter 0.05-0.15 grams, α, and α-dipyridyl is every liter 0.05-0.15 grams.
Further illustrated as to the thick process for copper of chemical plating of the present invention, it is preferable that the pH of the electroless copper agent aqueous solution is 12.0-13.0, and proportion is 1.06-1.10g/cm3。
Further illustrated as to the thick process for copper of chemical plating of the present invention, it is preferable that step 2) in, the time of the deionized water cleaning is 30 minutes.
Further illustrated as to the thick process for copper of chemical plating of the present invention, it is preferable that step 6) in, the time of the spray immersion is 35-40 minutes.
Further illustrated as to the thick process for copper of chemical plating of the present invention, it is preferable that step 7) in, the time of the running water cleaning is 1-2 minutes.
Further illustrated as to the thick process for copper of chemical plating of the present invention, it is preferable that step 7) in, the temperature of the hot blast drying is 70-80 DEG C, and the time of the hot blast drying is 4-6 minutes.
The thick process for copper of the chemical plating of the present invention has the advantages that：(1) solve because tradition plating Bao Tonghou also needs to carry out full plate plating copper process, save the copper-plated production space of full plate, equipment investment, manpower and water power, the production procedure of printed wiring board is shortened, operating efficiency is improved, the various materials that full plate copper facing needs are saved；(2) quality is improved, the scrappage that traditional chemical plates thin copper is 1%, the scrappage of the thick copper of chemical plating of the invention is only 0.01%；(3) it is that subsequent etch alleviates pressure due to infull plate copper facing so that the printed wiring board production quality of highly dense circuit (line width and circuit spacing≤0.1mm) has guarantee；(4) due to using double complexing agents and bistable agent, solving the problem of thin copper stability of chemical plating is poor, electroless copper liquid medicine fall groove maintain the cycle also by the original working strength for being extended for weekly significantly reducing operating personnel once three days.Raw material sources are wide, and cheap, cost is low, and production process is pollution-free, therefore is with a wide range of applications in printed wiring board field.
Embodiment
In order that auditor can further appreciate that structure, feature and the other purposes of the present invention, as follows in conjunction with appended preferred embodiment detailed description, appended preferred embodiment is merely to illustrate technical scheme, and the non-limiting present invention.
Embodiment 1
First by after electroless copper groove working solution completely discharge, rinsed well with running water；Continuation deionized water is circulated 30 minutes.Configure 1 liter of electroless copper agent aqueous solution, wherein, electroless copper agent includes 8 grams of copper sulphate, 16 grams of sodium hydroxide, 10 milliliters of formaldehyde, 30 grams of disodium EDTA, 25 grams of sodium potassium tartrate tetrahydrate, 0.05 gram of potassium ferrocyanide, α, 0.05 gram of α-dipyridyl, the pH of the electroless copper agent aqueous solution is 12.0, and proportion is 1.06g/cm3.1 liter of electroless copper agent aqueous solution is added to electroless copper groove, heating chemical copper plating groove is to 35 DEG C.Start cycle filter pump, the printed wiring board for treating electroless copper is put into the electroless copper agent aqueous solution, spray immersion 35 minutes further takes out printed wiring board, and cleaned 1 minute with running water；Then 70 DEG C of hot blast dryings 4 minutes；Finally it is transferred to pattern transfer process.
From experimental result it can be seen that：The technique solves the problem of thin copper stability of chemical plating is poor (referring to table 1, the influence that different via hole apertures separate situation to thermal shock hole copper after backlight level after electroless copper and electro-coppering is listed in table 1) using double complexing agents and bistable agent.
Table 1
Embodiment 2
First by after electroless copper groove working solution completely discharge, rinsed well with running water；Continuation deionized water is circulated 30 minutes.Configure 1 liter of electroless copper agent aqueous solution, wherein, electroless copper agent includes 10 grams of copper sulphate, 18 grams of sodium hydroxide, 13 milliliters of formaldehyde, 40 grams of disodium EDTA, 30 grams of sodium potassium tartrate tetrahydrate, 0.1 gram of potassium ferrocyanide, α, 0.1 gram of α-dipyridyl, the pH of the electroless copper agent aqueous solution is 12.5, and proportion is 1.08g/cm3.1 liter of electroless copper agent aqueous solution is added to electroless copper groove, heating chemical copper plating groove is to 40 DEG C.Start cycle filter pump, the printed wiring board for treating electroless copper is put into the electroless copper agent aqueous solution, spray immersion 37 minutes further takes out printed wiring board, and cleaned 1.5 minutes with running water；Then 75 DEG C of hot blast dryings 5 minutes；Finally it is transferred to pattern transfer process.
From experimental result it can be seen that：The technique solves the problem of thin copper stability of chemical plating is poor (referring to table 2, the influence that different via hole apertures separate situation to thermal shock hole copper after backlight level after electroless copper and electro-coppering is listed in table 2) using double complexing agents and bistable agent.
Table 2
Embodiment 3
First by after electroless copper groove working solution completely discharge, rinsed well with running water；Continuation deionized water is circulated 30 minutes.Configure 1 liter of electroless copper agent aqueous solution, wherein, electroless copper agent includes 12 grams of copper sulphate, sodium hydroxide 20g, 15 milliliters of formaldehyde, 35 grams of disodium EDTA, 35 grams of sodium potassium tartrate tetrahydrate, 0.15 gram of potassium ferrocyanide, α, 0.15 gram of α-dipyridyl, the pH of the electroless copper agent aqueous solution is 13.0, and proportion is 1.10g/cm3.1 liter of electroless copper agent aqueous solution is added to electroless copper groove, heating chemical copper plating groove is to 45 DEG C.Start cycle filter pump, the printed wiring board for treating electroless copper is put into the electroless copper agent aqueous solution, spray immersion 40 minutes further takes out printed wiring board, and cleaned 2 minutes with running water；Then 80 DEG C of hot blast dryings 6 minutes；Finally it is transferred to pattern transfer process.
From experimental result it can be seen that：The technique solves the problem of thin copper stability of chemical plating is poor (referring to table 3, the influence that different via hole apertures separate situation to thermal shock hole copper after backlight level after electroless copper and electro-coppering is listed in table 3) using double complexing agents and bistable agent.
Table 3
In addition, through statistics, the scrappage of the thick copper of chemical plating of the invention is only 0.01%.
It is to be understood that, foregoing invention content and embodiment are intended to prove the practical application of technical scheme provided by the present invention, should not be construed as limiting the scope of the present invention.Those skilled in the art are in spirit and principles of the present invention, when can various modifications may be made, equivalent substitution or improvement.Protection scope of the present invention is defined by appended claims.
Claims (7)
1. the thick process for copper of a kind of chemical plating for printed wiring board, it is characterised in that described
Chemical plating thickness process for copper comprises the following steps：
1) by after electroless copper groove working solution completely discharge, rinsed well with running water；
2) continue to use deionized water wash cycles；
3) the electroless copper agent aqueous solution is added to electroless copper groove, the electroless copper agent includes
Copper sulphate, sodium hydroxide, formaldehyde, stabilizer and complexing agent, the stabilizer include ferrous iron
Potassium cyanide and α, α-dipyridyl, the complexing agent include disodium EDTA and winestone
Sour potassium sodium；
4) heating chemical copper plating groove is to 35-45 DEG C；
5) cycle filter pump is started；
6) printed wiring board for treating electroless copper is put into the electroless copper agent aqueous solution, sprayed
Immersion；
7) printed wiring board is taken out, is cleaned with running water；
8) hot blast drying；And
9) it is transferred to pattern transfer process.
2. the thick process for copper of chemical plating according to claim 1, it is characterised in that sulfuric acid
Copper is every liter 8-12 grams, and sodium hydroxide is every liter 16-20 grams, and formaldehyde is every liter of 10-15 milli
Rise, disodium EDTA is every liter 30-40 grams, sodium potassium tartrate tetrahydrate is every liter of 25-35
Gram, potassium ferrocyanide is every liter 0.05-0.15 grams, α, and α-dipyridyl is every liter 0.05-0.15 grams.
3. the thick process for copper of chemical plating according to claim 1, it is characterised in that described
Electroless copper agent aqueous solution pH is 12.0-13.0, and proportion is 1.06-1.10g/cm3。
4. the thick process for copper of chemical plating according to claim 1, it is characterised in that step
2) in, the time of the deionized water cleaning is 30 minutes.
5. the thick process for copper of chemical plating according to claim 1, it is characterised in that step
6) in, the time of the spray immersion is 35-40 minutes.
6. the thick process for copper of chemical plating according to claim 1, it is characterised in that step
7) in, the time of the running water cleaning is 1-2 minutes.
7. the thick process for copper of chemical plating according to claim 1, it is characterised in that step
7) in, the temperature of the hot blast drying is 70-80 DEG C, and the time of the hot blast drying is 4-6
Minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610218466.8A CN107267968A (en) | 2016-04-08 | 2016-04-08 | A kind of thick process for copper of chemical plating for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610218466.8A CN107267968A (en) | 2016-04-08 | 2016-04-08 | A kind of thick process for copper of chemical plating for printed wiring board |
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| Publication Number | Publication Date |
|---|---|
| CN107267968A true CN107267968A (en) | 2017-10-20 |
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| CN201610218466.8A Pending CN107267968A (en) | 2016-04-08 | 2016-04-08 | A kind of thick process for copper of chemical plating for printed wiring board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866521A (en) * | 2018-09-04 | 2018-11-23 | 广东天承科技有限公司 | A kind of chemical bronze plating liquid |
| CN111455358A (en) * | 2020-06-01 | 2020-07-28 | 东莞市斯坦得电子材料有限公司 | Horizontal chemical copper plating process for printed circuit board |
| CN115679305A (en) * | 2023-01-03 | 2023-02-03 | 湖南源康利科技有限公司 | Chemical copper plating treatment process for surface of aluminum foil for printed board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103422079A (en) * | 2012-05-22 | 2013-12-04 | 比亚迪股份有限公司 | Chemical copper plating solution and preparation method thereof |
| CN104651814A (en) * | 2014-11-28 | 2015-05-27 | 广东致卓精密金属科技有限公司 | Chemical copper plating solution and chemical copper plating method |
| CN105112893A (en) * | 2015-08-04 | 2015-12-02 | 永利电子铜陵有限公司 | Highly-stable electroless copper plating process of PCB (Printed circuit board) |
-
2016
- 2016-04-08 CN CN201610218466.8A patent/CN107267968A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103422079A (en) * | 2012-05-22 | 2013-12-04 | 比亚迪股份有限公司 | Chemical copper plating solution and preparation method thereof |
| CN104651814A (en) * | 2014-11-28 | 2015-05-27 | 广东致卓精密金属科技有限公司 | Chemical copper plating solution and chemical copper plating method |
| CN105112893A (en) * | 2015-08-04 | 2015-12-02 | 永利电子铜陵有限公司 | Highly-stable electroless copper plating process of PCB (Printed circuit board) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866521A (en) * | 2018-09-04 | 2018-11-23 | 广东天承科技有限公司 | A kind of chemical bronze plating liquid |
| CN111455358A (en) * | 2020-06-01 | 2020-07-28 | 东莞市斯坦得电子材料有限公司 | Horizontal chemical copper plating process for printed circuit board |
| CN115679305A (en) * | 2023-01-03 | 2023-02-03 | 湖南源康利科技有限公司 | Chemical copper plating treatment process for surface of aluminum foil for printed board |
| CN115679305B (en) * | 2023-01-03 | 2023-03-10 | 湖南源康利科技有限公司 | Chemical copper plating treatment process for surface of aluminum foil for printed board |
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Application publication date: 20171020 |
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