CN111345021A - Photosensitive assembly and camera module based on metal support - Google Patents
Photosensitive assembly and camera module based on metal support Download PDFInfo
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- CN111345021A CN111345021A CN201880057898.2A CN201880057898A CN111345021A CN 111345021 A CN111345021 A CN 111345021A CN 201880057898 A CN201880057898 A CN 201880057898A CN 111345021 A CN111345021 A CN 111345021A
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/20—Undercarriages with or without wheels
- F16M11/22—Undercarriages with or without wheels with approximately constant height, e.g. with constant length of column or of legs
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/006—Filter holders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B11/00—Filters or other obturators specially adapted for photographic purposes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Studio Devices (AREA)
- Blocking Light For Cameras (AREA)
Abstract
The photosensitive assembly comprises a circuit board, a photosensitive element and a molding base, wherein the photosensitive element is electrically connected to the circuit board, and the module is integrally formed on the circuit board and the photosensitive element. The photosensitive assembly further comprises a filter element and a metal support, wherein the metal support is mounted on the top surface of the molding base and used for mounting the filter element, and an optical window for providing a light path for the photosensitive element is formed among the filter element, the filter element support and the molding base.
Description
The invention relates to the field of camera modules, in particular to a photosensitive assembly and a camera module based on a metal bracket for mounting a filter element.
The camera module is one of indispensable components of an intelligent electronic device, such as but not limited to an intelligent electronic device such as a smart phone, a camera, a computer device, and a wearable device. And in the development trend of intelligent light and thin and integration, the requirement on the camera module is higher and higher. Particularly, along with the popularization and the development of smart machine, it tends frivolousization increasingly, and the module of making a video recording correspondingly will adapt to the development, also more and more requires multi-functional integration, frivolousization, miniaturization to make a video recording the module and assemble in the required volume that occupies of intelligent electronic equipment and can correspondingly reduce, and satisfy the imaging requirement of equipment to the module of making a video recording. Therefore, manufacturers of camera modules are continuously dedicated to designing and manufacturing camera modules satisfying these requirements.
The mold packaging process is an emerging and developed packaging technology based on the traditional cob (chip on board) packaging process. As shown in fig. 1A, a circuit board assembly is prepared by using a conventional molding and packaging process. In the structure, a molding part 1 is packaged on a circuit board 2 in a molding and packaging mode to integrally coat at least one part of the circuit board and electronic components assembled on the circuit board, such as a photosensitive chip 3, a passive electronic component and the like, and an optical filter 4 is attached to the top side of the molding part 1, so that the space independently occupied by the electronic components of the camera module and the matching safety space reserved in the assembling process are reduced, and the problem that dust attached to the electronic components influences the imaging quality of the camera module is solved. However, this solution also brings new technical problems.
Those skilled in the art will appreciate that the optical filter 4 is an important component of the camera module, and can filter stray light such as infrared light in the light, so that the final imaging effect is better close to the visual effect observed by human eyes. Since the optical filter 4 is a delicate and highly sensitive precision electronic component, it occupies a large proportion of the cost of the entire image pickup module. Therefore, the filter 4 becomes a difficult point in the mold encapsulation technology.
More specifically, compared to the conventional COB package method, the mold part 1 prepared by the mold packaging process is configured to integrally cover the electronic components mounted on the circuit board 2, and uses the spatial positions of the electronic components. Therefore, the installation space provided to the filter 4 by the mold part 1 is increased correspondingly to the conventional COB packaging technique. At this time, if the filter 4 is selected to be directly mounted on the corresponding region of the top surface of the molding portion, the area required for the filter 4 is large. Accordingly, the manufacturing cost of the optical filter is proportional to the area required by the optical filter, and as the area of the optical filter increases, the manufacturing accuracy is more difficult to control and the hardness is correspondingly reduced. Therefore, when the area required for the filter 4 is increased, it not only means an increase in cost, but also means an increase in difficulty in installation and implementation.
Further, generally, the filter 4 is directly assembled on the top side of the mold part 1 to hold the filter 4 above the photosensitive area of the photosensitive chip 3 through the mold part 1. The filter 4 is made of a fragile material, so that when the filter 4 is assembled on the molding part 1, the surface of the filter 4 is broken or damaged easily due to uneven stress.
In order to solve the problems of high installation difficulty, easy breakage and high cost of the optical filter 4, an improved scheme exists in the prior art: a filter element holder 5 is additionally provided to improve the mounting condition of the filter 4. In a specific implementation, as shown in fig. 1B, the filter element mount 5 is mounted on the top surface of the mold part 1, so that the filter 4 is mounted through the filter element mount 5 instead of the mold part 1. Accordingly, the size of the filter 4 can be reduced by adjusting the size of the mounting groove of the filter holder 5, and the filter 4 can be prevented from being broken by providing the supporting force by the filter holder 5.
However, the filter element mount 5 is manufactured by an integral molding process, such as a molding process or an injection molding process, and has a large thickness. For example, in the circuit board assembly of the existing camera module, generally, for example, in one embodiment, the height of the molding part 1 is 0.3mm, the height of the circuit board 2 is 0.2mm, and the height of the filter lens holder 5 is about 0.3mm, which is more than half of the total height of the circuit board and the molding part. Therefore, the filter lens holder 5 increases the overall height of the circuit board assembly, so that the optical back focus of the camera module is correspondingly increased, and the reduction of the optical back focus is always pursued in the optical design of the camera module.
Disclosure of Invention
An object of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the camera module includes a metal bracket that cooperates with a molded base of the camera module to provide support for other components of the camera module.
Another object of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is mounted on a corresponding position on the top surface of the mold base, so as to replace the mold base to provide a suitable mounting position for the filter element of the camera module.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is made of a metal material and has a relatively thin thickness compared to the conventional filter mount, so that the overall height of the camera module can be reduced.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is made of a metal material and has a relatively thin thickness compared to the conventional filter mount, so that the optical back focus of the camera module can be reduced.
It is another object of the present invention to provide a photosensitive assembly and a camera module based on a metal bracket, wherein in some embodiments, the outer edge of the metal bracket is inside the outer edge of the top surface of the mold base, so as to avoid the metal bracket from being chipped by the impact of external force from the side and further possibly causing the damage of the filter element.
It is another object of the present invention to provide a photosensitive assembly and camera module based on a metal bracket, wherein in some embodiments, a portion of the outer edge of the metal bracket is located between the outer edge of the top surface of the mold base and the outer edge of the lens/driver/fixed barrel, so as to avoid the metal bracket from being chipped by the impact of external force from the side and further possibly causing damage to the filter element, and to conform to the arc or inclined surface of the edge of the electronic device when mounted on the electronic device.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal support, wherein a light absorbing layer is formed on an outer surface of the metal support to prevent stray light reflected by the metal support from being incident on a photosensitive area of the camera module, which affects image quality.
Another object of the present invention is to provide a photosensitive assembly and an image pickup module based on a metal holder, wherein a light shielding region is formed between a light absorbing layer on the outer surface of the metal holder and the inner surface of the mold base, so that light reflected by the inner surface of the mold base and reaching the light absorbing layer is absorbed by the light absorbing layer, thereby preventing the light from reaching the photosensitive element and affecting the image quality.
Another object of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein in some embodiments, due to the feature that the electronic components of the circuit board are higher than the leads, the step surface can be not higher than the electronic components of the circuit board but not lower than the leads, so as to further move down the position of the metal bracket.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein a light-passing region of the metal bracket is provided to provide a better light-passing channel for the camera module, so as to prevent external stray light from entering the photosensitive region of the camera module from a physical structure.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is made of a metal material, so that the metal bracket is not easily deformed during the subsequent baking and curing process of the camera module, so as to effectively ensure that the relative position relationship between the metal bracket and a device mounted on the metal bracket is kept stable.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is made of a metal material and has good thermal conductivity, so that heat generated in the circuit board can be conducted and dissipated through the metal bracket in a subsequent operation process of the camera module.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is formed with an air escape hole, and the air escape hole is suitable for providing an air outlet during the baking and fixing process of the camera module, so as to prevent the filter element from being damaged or broken due to thermal expansion of the enclosed space air in the camera module.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein in some embodiments, the metal bracket has a supporting slot, and the filter element is suitable for being mounted in the supporting slot of the filter element, so that the filter element is relatively sunk in position.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the height of the supporting groove is slightly greater than the thickness of the filter element, so that when the filter element is mounted in the supporting groove of the filter element, the filter element does not protrude from the top surface of the metal bracket, thereby effectively preventing the filter element from touching the last optical lens of the camera module.
It is another object of the present invention to provide a photosensitive assembly and a camera module based on a metal holder, wherein the metal holder made of a metal material has a relatively high flatness to facilitate the installation and calibration of the optical lens or the driver when the optical lens or the driver or the fixed lens barrel of the camera module is supported by the metal holder instead of the mold base.
Another object of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein when the filter element is assembled on the molding base through the metal bracket, the size of the filter element required can be reduced accordingly, so as to reduce the cost.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket is made of a metal material, the processing technology is relatively mature and simple, and the cost of the metal material is relatively low.
Another objective of the present invention is to provide a photosensitive assembly and a camera module based on a metal bracket, wherein the metal bracket with different specifications can be prepared by a metal processing process, such as a stamping process, so as to meet the requirements of different camera modules for different metal brackets.
Other advantages and features of the invention will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.
To achieve at least one of the above objects and to achieve at least one of the above objects, the present invention provides a photosensitive assembly, including:
a circuit board;
the photosensitive element is electrically connected with the circuit board;
a molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive element;
a light filtering element; and
a metal support, wherein the metal support is mounted on the top surface of the molding base for mounting the filter element, and an optical window for providing a light path for the photosensitive element is formed among the filter element, the metal support and the molding base.
According to an embodiment of the present invention, the metal holder includes a ring-shaped body, wherein the light passing hole is defined by the ring-shaped body, and the filter element is attached to a top side of the metal holder and extends toward an inner side of the mold base.
According to one embodiment of the invention, the outer edge of the metal holder is located inside the outer periphery of the molding base.
According to an embodiment of the present invention, the metal bracket includes a ring-shaped body, wherein the light passing hole is defined by the ring-shaped body, and the filter element is attached to a bottom side of the metal bracket.
According to an embodiment of the invention, the metal bracket further comprises at least one inwardly extending arm and at least one downwardly extending arm, wherein the inwardly extending arm and the inwardly extending arm form a downwardly mounting structure, wherein the downwardly extending arm integrally extends laterally and longitudinally from the ring body to reduce the mounting position height of the filter element, wherein the inwardly extending arm integrally extends laterally and laterally from the inwardly extending arm to provide a horizontal mounting position for the filter element.
According to one embodiment of the present invention, the metal bracket comprises four integrally connected said inwardly extending arms and four integrally connected said sinking arms, wherein each said inwardly extending arm and each corresponding said sinking arm extend at different positions forming said sinking mounting structure.
According to an embodiment of the invention, the size of the light passing hole is smaller than the size of the light window.
According to one embodiment of the present invention, an inner side surface of the light passing hole is an inclined surface, wherein the inclined surface faces the photosensitive element.
According to one embodiment of the present invention, the metal holder further comprises a light absorbing layer, wherein the light absorbing layer is disposed on an outer surface of the metal holder.
According to one embodiment of the present invention, the light absorbing layer is disposed to cover the entire outer surface of the metal holder.
According to one embodiment of the present invention, the light absorbing layer is disposed at a region of the metal holder near the light passing port.
According to one embodiment of the invention, the light absorbing layer is disposed on the bottom surface and/or the top surface of the filter element.
According to one embodiment of the invention, the filter element is provided with a light shielding layer to limit the light transmission range of the filter element through the light shielding layer, wherein the light shielding layer is arranged on the bottom surface and/or the top surface of the filter element.
According to an embodiment of the present invention, the metal holder has an air escape hole, wherein the air escape hole is communicated with an inner space formed by the filter element, the metal holder and the molding base.
According to an embodiment of the present invention, the air escape hole has a communication region and a sealing region, wherein the air escape hole overlaps the filter element to form the communication region and the sealing region, wherein the communication region extends into the formed sealed space for gas conduction, and wherein the sealing region corresponds to the top surface of the mold base for sealing with sealant.
According to one embodiment of the present invention, the finalization area integrally extends to the communication area, and an opening size of the finalization area is larger than an opening size of the communication area.
According to an embodiment of the invention, the opening depth of the cover area is larger than the opening depth of the communication area.
According to an embodiment of the present invention, the top surface of the mold base has a step surface on an inner side, wherein the step surface is formed on the inner side of the mold base for supporting the metal holder, wherein the annular body is partially overlapped to fit on the step surface.
According to an embodiment of the present invention, an outer peripheral edge of the metal holder is located inside the optical lens outer peripheral portion, and a length of the metal holder protruding from the mold base outer peripheral portion is smaller than a length of a corresponding optical lens protruding from the mold base.
According to one embodiment of the invention, the thickness of the metal support ranges from 0.03 mm to 0.2 mm.
In another aspect, the present invention further provides a camera module, including:
an optical lens; and
the optical lens is mounted on the top side of the photosensitive component, corresponding to the photosensitive path of the photosensitive element.
According to an embodiment of the present invention, the image capturing module further includes a driving element, wherein the driving element drives the optical lens to move so as to achieve optical focusing.
According to one embodiment of the invention, the outer edge of the metal holder is located between the outer edge of the mold base and the outer edge of the drive element.
In another aspect, the present invention further provides an array camera module, comprising:
at least two optical lenses;
at least one circuit board;
at least two photosensitive elements, wherein the photosensitive elements are respectively connected to the circuit board in a conducting manner;
at least one molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive elements and covers the circuit board and the edge parts of the photosensitive elements, and the molding base is provided with an optical window corresponding to a photosensitive path of each photosensitive element; and
at least one metal support, wherein the metal support is mounted on the top surface of the molding base for mounting at least two light filtering elements, wherein the metal support has at least two light passing holes corresponding to the light windows, and wherein light paths are provided among the light filtering elements, the metal support and the light windows of the molding base for the respective light sensing elements.
According to one embodiment of the invention, the wiring board is implemented as a unitary wiring board.
According to one embodiment of the present invention, the circuit board is implemented as a split type circuit board in which the circuit boards corresponding to the respective photosensitive elements are independent of each other.
According to one embodiment of the invention, the molded base is implemented as a one-piece molded base.
According to one embodiment of the present invention, the mold base is implemented as a split mold base, wherein the mold bases corresponding to the respective photosensitive elements are independent from each other.
According to one embodiment of the invention, the metal bracket is implemented as a one-piece metal bracket.
According to one embodiment of the invention, the metal holder is implemented as a split metal holder.
According to one embodiment of the invention, the filter element is implemented as a split filter element.
According to one embodiment of the invention, the filter element is embodied as a one-piece filter element.
Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.
These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.
Fig. 1A is a schematic cross-sectional view of a circuit board assembly of a camera module according to a prior art.
Fig. 1B is a schematic cross-sectional view of a circuit board assembly of a camera module according to another prior art.
Fig. 2 is a schematic cross-sectional view of a camera module according to a preferred embodiment.
Fig. 3 is a schematic cross-sectional view of a camera module according to a modified embodiment of the above preferred embodiment of the invention.
Fig. 4 is a schematic diagram of the optical path propagation of the camera module according to the above preferred embodiment of the invention. .
Fig. 5 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.
Fig. 6 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.
Fig. 7 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.
Fig. 8 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.
Fig. 9 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention. FIG. 10A
Is a schematic cross-sectional view according to a variant embodiment of the invention.
Fig. 10B is a schematic cross-sectional view according to another modified embodiment of the present invention.
Fig. 10C is a schematic cross-sectional view according to another variant embodiment of the invention.
Fig. 10D is a schematic cross-sectional view according to another variant embodiment of the invention.
Fig. 11 is a schematic cross-sectional view of a camera module according to a second preferred embodiment of the invention.
Fig. 12 is a schematic cross-sectional view of another variation of the camera module according to the second preferred embodiment of the invention.
Fig. 13 is a schematic cross-sectional view of a camera module according to a third preferred embodiment of the invention.
Fig. 14 is a perspective exploded view of a camera module according to a fourth preferred embodiment of the present invention.
Fig. 15 is a perspective exploded view of a modified embodiment of the camera module according to the fourth preferred embodiment.
Fig. 16A is a schematic view of one of the manufacturing steps of the camera module in the above preferred embodiment.
Fig. 16B is a schematic view of a second manufacturing step of the camera module in the above preferred embodiment.
Fig. 16C is a schematic view of a third manufacturing step of the camera module in the above preferred embodiment.
Fig. 17A is a schematic view of the fourth manufacturing step of the camera module in the above preferred embodiment.
Fig. 17B is a schematic view of a fifth manufacturing step of the camera module in the above preferred embodiment.
Fig. 18 is a schematic view of six steps of manufacturing the camera module in the preferred embodiment.
Fig. 19 is a schematic view of a seventh manufacturing step of the image pickup module in the above preferred embodiment.
Fig. 20 is a schematic view of an eighth manufacturing step of the image pickup module in the above preferred embodiment.
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
It is to be understood that the terms "a" and "an" are to be interpreted as meaning that a number of elements in one embodiment may be one and a number of elements in another embodiment may be plural, and the terms "a" and "an" are not to be interpreted as limiting the number.
Referring to fig. 2, a camera module according to a first preferred embodiment of the present invention is illustrated, wherein the camera module can be applied to various electronic devices, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, and the camera module can cooperate with the electronic devices to achieve the functions of capturing and reproducing the target image.
As shown in fig. 2, the camera module includes a photosensitive component 10 and an optical lens 20, wherein the optical lens 20 is located in a photosensitive path of the photosensitive component 10, so as to collect image information of a target to be detected through the optical lens 20. In particular, in this preferred implementation of the invention, the camera module is a fixed focus camera module, i.e. the focal length between the optical lens 20 and the photosensitive assembly 10 is not adjustable. Specifically, the optical lens 20 is assembled on the top of the photosensitive assembly 10 through a lens barrel 21 as a lens carrying element. It is understood that as the packaging process improves, the size of the camera module is continuously reduced, and in another modified embodiment, the optical lens 20 is assembled on the top of the photosensitive component 10 in a "bare lens" manner, i.e., at this time, the optical lens 20 is directly mounted on the top area of the photosensitive component 10 without the lens barrel 21 or the lens bearing element, as shown in fig. 10D.
It should be understood by those skilled in the art that in another embodiment of the present invention, as shown in fig. 3, the image capturing module can also be implemented as a moving focus image capturing module, that is, in this embodiment, the image capturing module further includes a driving element 30, the driving element 30 is mounted on the top side of the photosensitive assembly 10, and the optical lens 20 is assembled to the driving element 30, so that when the driving element 30 is driven, the relative position relationship between the optical lens 20 and a photosensitive element 12 of the photosensitive assembly 10 is changed, in this way, the function of optical focusing is achieved. It is worth mentioning that the driving element 30 includes, but is not limited to, a voice coil motor, a stepping motor, a MEMS, etc.
More specifically, as shown in fig. 2, the photosensitive member 10 includes a circuit board 11, a photosensitive element 12, and a mold base 13. The photosensitive element 12 is conductively connected to the circuit board 11, wherein light from the target passes through the photosensitive assembly 10 and reaches the photosensitive element 12, so as to further convert the optical signal of the target into an electrical signal that can be recognized and operated by an electronic device through the photosensitive reaction of the photosensitive element 12, thereby realizing the functions of pattern acquisition and reproduction of the target. The molding base 13 is integrally formed on the circuit board 11 and the photosensitive element 12, and covers at least a part of the circuit board 11 and the photosensitive element 12, so that the photosensitive assembly 10 and the camera module have compact and miniaturized structures.
In the preferred embodiment of the present invention, the photosensitive element 12 can be mounted on the corresponding area of the circuit board 11 by, for example, SMT (Surface Mounting Technology), and further, the electrical connection between the circuit board 11 and the photosensitive element 12 is realized by a set of leads 14. That is, in the preferred embodiment of the present invention, the photosensitive assembly 10 further includes a set of leads 14, and the leads 14 extend between the photosensitive element 12 and the circuit board 11, so as to conduct the circuit board 11 and the photosensitive element 12 through the leads 14. Those skilled in the art will appreciate that the manner of conducting the wiring board 11 and the photosensitive element 12 is referred to as a "gold wire" process. It should be noted that, in the present invention, a forward "gold wire bonding" mode, that is, the lead 14 extends from the circuit board 11 to the photosensitive element 12, or a reverse "gold wire bonding" mode, that is, the lead 14 extends from the photosensitive element 12 to the circuit board 11, is selected, and the photosensitive element 12 and the circuit board 11 are conducted, which is not limited by the present invention. Of course, in another embodiment of the present invention, the light sensing element 12 may be mounted on the circuit board 11 by other methods, such as embedding, FC (Flip Chip), and the like. It will be appreciated by those skilled in the art that the manner of mounting and conducting between the photosensitive element 12 and the circuit board 11 in the present invention is not a limitation of the present invention.
Further, after the photosensitive element 12 is mounted on the circuit board 11 and electrically connected to the circuit board 11, a molding process is performed to form the molding base 13 on the photosensitive element 12 and the circuit board 11. As shown in fig. 2, the molding base 13 is integrally formed on the photosensitive element 12 and the circuit board 11, and covers at least a portion of the photosensitive element 12 and a series of electronic components mounted on the circuit board 11, so as to effectively reduce the overall size of the photosensitive assembly 10, and effectively prevent dust and impurities from adhering to the electronic components to contaminate the photosensitive element 12 and affect the imaging effect, similar to a conventional camera module. More specifically, the mold base 13 includes a mold base body 131 and an optical window 132 formed by the mold base body 131, wherein the optical window is a closed space and corresponds to at least a photosensitive area of the photosensitive element 12, so as to allow light from the outside to be incident on the photosensitive element 12 through the optical window 132 to complete image capturing. In particular, in this preferred embodiment of the present invention, the molded base body 131 has a closed ring-shaped structure so as to provide a closed inner environment for the photosensitive element 12, preventing external stray light from entering the photosensitive element 12 from the side.
It is worth mentioning that, preferably, in the present invention, the mold base body 131 has a central symmetrical structure, having an inner surface 1311, which is defined as the inner surface 1311 of the mold base. The molding base inner surface 1311 may extend upward from the circuit board 11 and the photosensitive element 12 with a constant slope, or the molding base inner surface 1311 may extend upward from the circuit board 11 and the photosensitive element 12 with no slope, i.e., the molding base inner surface 1311 is substantially perpendicular to the circuit board 11. It will be appreciated that in other embodiments of the invention, the mold base inner surface 1311 has multiple sections of surface that extend in a non-coplanar manner such that the mold base 13 has a multiple section configuration, e.g., may have an inclined extension and a vertical extension.
In order to make the imaging effect of the camera module closer to the vision of human eyes, the photosensitive assembly 10 further includes a filter element 40, and the filter element 40 is disposed between the optical lens 20 and the photosensitive element 12 for filtering the optical signal of the target to be detected collected by the optical lens 20. In particular, the filter element 40 is retained on a photosensitive path formed by the optical lens 20 and the photosensitive element 12, so that light passing through the optical lens 20 is filtered by the filter element 40, and the light entering the photosensitive element 12 does not contain stray light such as infrared light, and the final imaging effect is closer to the visual effect of human eyes. In the present invention, the filter element 40 is exemplified by, but not limited to, an infrared cut filter, a blue glass filter, a wafer level infrared cut filter. In further embodiments, a full transmission or visible light filter is also possible.
Accordingly, as shown in fig. 2, in the preferred embodiment of the present invention, the photosensitive assembly 10 further includes a metal bracket 50, and the metal bracket 50 is disposed between the filter element 40 and the mold base 13, so as to improve the installation condition and the installation environment of the filter element 40 by the metal bracket 50. More specifically, the metal holder 50 is mounted to the top surface of the mold base 13 for mounting the filter element 40. Therefore, in the preferred embodiment of the present invention, the filter element 40 is not directly mounted on the top surface of the mold base 13, so that the quality and size of the molding of the top surface of the mold base 13 do not directly affect the mounting of the filter element 40. That is, in the preferred embodiment of the present invention, the metal holder 50 provides a mounting position for the filter element 40 instead of the mold base 13, and thus, the mounting environment and the mounting condition of the filter element 40 depend on the characteristics of the metal holder 50. In addition, the thickness of the metal bracket 50 is 0.03-0.2mm, and the height can be reduced to below 0.1mm, for example, about 0.08mm, so as to significantly reduce the height of the photosensitive assembly.
In particular, as shown in fig. 2, in the preferred embodiment of the present invention, the metal bracket 50 is made of a metal material, which has a relatively high flatness. When the filter element 40 is mounted on the metal bracket 50, the contact surface between the filter element 40 and the metal bracket 50 is uniformly stressed, so that the probability that the filter element 40 is broken or damaged due to uneven stress in the mounting process is effectively reduced. Meanwhile, the filter element 40 and the metal holder 50 are disposed to overlap, and thus, the flatness of the filter element 40 depends on the flatness of the metal holder 50. Therefore, in the preferred embodiment of the present invention, the filter element 40 has a relatively high flatness, so that the light passing through the optical lens 20 can be effectively filtered at the filter element 40.
Further, as shown in fig. 2, the metal holder 50 has a closed planar ring structure, which includes a ring-shaped main body 51 and a light-passing opening 52 formed by the ring-shaped main body 51, wherein when the metal holder 50 is mounted on the molding base 13, the ring-shaped main body 51 is partially overlapped and attached to the top surface of the molding base 13, and meanwhile, the light-passing opening 52 corresponds to the light window 132 of the molding base main body 131 to form a complete light path. It will be appreciated that the annular body 51 partially fits over the top surface of the mold base 13 and extends inward of the mold base 13, and therefore, the area required for the filter element 40 mounted to the annular body 51 of the metal bracket 50 can be correspondingly reduced to reduce cost and installation difficulty.
In addition, the light passing opening 52 of the metal holder 50 corresponds to the light window 132 of the mold base 13, so that adjusting the characteristics of the light passing opening 52 of the metal holder 50 can change the light sensing angle and the light sensing range of the light sensing element 12. More specifically, in the preferred embodiment of the present invention, the metal holder 50 is partially suspended on the top surface of the mold base 13, and therefore, the size of the light-passing opening 52 of the metal holder 50 is slightly smaller than the light window 132 of the mold base 13, so that the light-passing opening 52 can further limit the photosensitive angle and the photosensitive range of the photosensitive element 12. Preferably, as shown in fig. 2, the inner side surface of the light passing opening 52 is an inclined surface 511, and the inclined surface 511 faces the light receiving element 12, in such a way that the light entrance angle and the light entrance range are defined to correspond to the light receiving area of the light receiving element 12. It should be noted that, in the present invention, the light admission port 52 can be formed by a metal etching process or a metal etching process, so that the inclined surface 511 of the light admission port 52 has a relatively high flatness. Of course, those skilled in the art will appreciate that the light-passing opening 52 of the filter element 40 can also be made by a metal stamping process, however, since a relatively large burr may be generated, the inner edge of the light-passing opening 52 and the inclined surface 511 need to be further finished.
It should be noted that, in the preferred embodiment of the present invention, when the metal holder 50 is mounted on the top surface of the mold base 13, the outer edge of the metal holder 50 is located inside the outer edge of the mold base 13, in this way, the metal holder 50 is prevented from being damaged or chipped due to a bending force generated by the side surface of the metal holder being pressed or impacted during the subsequent mounting and use processes. That is, in the preferred embodiment of the present invention, the outer edge of the metal holder 50 does not protrude beyond the outer periphery of the mold base 13, so that the side of the metal holder 50 is always in an unstressed state during the subsequent installation and use process, so as to avoid the breakage of the filter element 40 caused by the deformation of the metal holder 50.
More specifically, as shown in fig. 2, the outer side edge of the metal holder 50 is close to the outer periphery of the mold base 13, so that, on one hand, the metal holder 50 can be stably mounted on the top surface of the mold base 13 (with a relatively large contact area), and on the other hand, the mold base 13 can effectively block external mounting objects, such as a housing of a smart phone, from touching the side surface of the metal holder 50, so that the side surface of the metal holder 50 is always in an unstressed state, and thus the filter element 40 can be effectively prevented from being broken or damaged due to the bending of the metal holder 50. It is worth mentioning that the edge of the metal holder 50 is close to the outer periphery of the mold base 13, that is, the metal holder 50 covers almost all areas of the top surface of the mold base 13, so that the optical lens 20 can be directly assembled on the metal holder 50 in the subsequent process of assembling the optical lens 20, rather than being assembled on the top surface of the mold base 13 conventionally. It will be appreciated that the metal holder 50 is made of a metal material, which has a relatively high flatness, thus facilitating the alignment and adjustment of the optical lens 20. This will be explained in more detail in the following description of the optical lens 20.
Of course, those skilled in the art will appreciate that in another modified embodiment of the present invention, the metal bracket 50 may be disposed on the top surface of the mold base 13 and located inside the optical lens 20, in which case the optical lens 20 is assembled on the top surface of the mold base 13 and the metal bracket 50 is effectively isolated from the inside of the optical lens 20. That is, in this modified embodiment of the present invention, the metal bracket 50 does not provide a mounting support surface for the optical lens 20.
Fig. 8 shows a variant embodiment of the metal holder 50, wherein the metal holder 50 has a sunken mounting structure 53 such that the mounting position of the filter element 40 extends into the optical window 132. That is, in this modified embodiment of the present invention, the metal bracket 50 has a three-dimensional structure. More specifically, in this embodiment of the present invention, the metal bracket 50 includes a ring-shaped body 51, at least one inwardly extending arm 531 and at least one sunken arm 532, wherein the sunken arm 532 and the inwardly extending arm 531 form the sunken mounting structure 53. As shown in fig. 8, the sinking arm 532 is integrally extended longitudinally and rotatably from the ring body 51 to reduce the height of the installation position of the filter 40, so that the filter 40 is relatively far away from the optical lens 20 to prevent contact between the last lens of the optical lens 20, and is closer to the photosensitive element 12 to facilitate filtering stray light. The inwardly extending arm 531 integrally extends laterally and turnably from the depressed arm 532 so as to provide a horizontally installed position for the filter element 40, so that the optical axes of the filter element 40 and the photosensitive element 12 coincide. Specifically, in the implementation of the present invention, the metal bracket 50 includes four integrally connected inner extending arms 531 and four integrally connected sinking arms 532, and each inner extending arm 531 and each sinking arm 532 extend at different positions to form the sinking mounting structure 53.
It is worth mentioning that in this variant embodiment of the invention, the metal bracket 50 has a relatively good ductility, since it is made of a metallic material. Therefore, in the process of actually processing and forming the metal bracket 50, for example, through a metal stamping process, the metal bracket 50 can be stamped to form various height differences so as to meet the requirements of camera modules with different specifications. Thus, it is not necessary to replace the molding die of the lens holder of the filter element 40 as in the prior art to manufacture the lens holder of the filter element 40 with different specifications, so that the cost can be further reduced.
It should be noted that, in the present invention, the metal holder 50 is made of a metal material and has a relatively thin thickness, so that the height of the camera module as a whole can be further reduced. In particular, compared to the conventional lens holder of the filter element 40 formed by injection molding, the thickness of the metal bracket 50 made of metal material can be greatly reduced to reduce the optical back focus of the camera module and the overall height thereof.
Further, in the present invention, the metal bracket 50 is made of a metal material, for example, an iron-based, aluminum-based, or copper-based material, etc. For example, in one specific example, it is implemented as a steel sheet. As is well known, metal materials have high light reflection performance and generate more reflected stray light. In order to eliminate the influence of this factor on the imaging quality, a light absorption layer 54 is further disposed in the corresponding area between the filter elements 40 to prevent light from reflecting on the surface of the metal support 50 and entering the photosensitive element 12, thereby affecting the final imaging effect.
More specifically, as shown in fig. 2, in the preferred embodiment of the present invention, the light absorbing layer 54 covers the outer surface of the metal holder 50, so that the light passing through the optical lens 20 partially enters the photosensitive element 12 through the light passing port 52, and part of the light falling on the surface of the metal holder 50 is absorbed by the light absorbing layer 54, in such a way, the light falling on the surface of the metal holder 50 is effectively prevented from entering the photosensitive element 12 through multiple reflections, which affects the imaging quality. Preferably, as shown in fig. 4, the light absorbing layer 54 is disposed on both the bottom surface and the top surface of the filter element 40, so that both the stray light falling on the top surface of the metal holder 50 and the stray light incident on the bottom surface of the metal holder 50 can be effectively absorbed. The stray light incident on the inner surface of the mold base 13 and reflected to the bottom surface of the metal holder 50 can be absorbed by the light absorbing layer 54, so that a light shielding region is formed between the inner surface of the mold base 13 and the light absorbing layer 54 on the bottom surface of the metal holder 50. More preferably, in order to further secure the light absorbing effect of the light absorbing layer 54, the light absorbing layer 54 is provided to cover the entire outer surface of the metal holder 50. Of course, as shown in fig. 9, in another modified embodiment of the present invention, the light absorbing layer 54 may be disposed only on the area of the metal support 50 near the light passing opening 52 to reduce the probability of the reflected stray light entering the photosensitive element 12.
It is worth mentioning that the light absorbing layer 54 can be formed on the corresponding region of the metal bracket 50 by a plating or film pasting process. It will be understood by those skilled in the art that the light absorbing layer 54 is not limited to being formed in the manner of the present invention. It should be appreciated that the process of forming the light absorbing layer 54 is performed after the metal holder 50 is punch-formed to prevent the light absorbing layer 54 from being scratched to deteriorate its integrity during the process of punching the metal holder 50. Preferably, the light absorbing layer 54 is a black, absorptive, opaque material. In another modified embodiment, the surface of the metal holder 50 may be roughened to reduce stray light reflected from the metal holder 50 after incidence.
In order to further ensure that the metal bracket 50 can meet the requirement of certain stray light, as shown in fig. 10A, the filter element 40 includes a filter element main body 41 and a light shielding layer 42, i.e. a light shielding layer 42 is optionally additionally disposed in a corresponding region of the filter element 40, so as to limit the light transmission range of the filter element 40 through the light shielding layer 42. More specifically, in the preferred embodiment of the present invention, the light shielding layer 42 is formed on the top surface of the optical filter element 40, so that the optical filter element body 41 of the optical filter element 40 has a peripheral portion 411 and a light filtering portion 412 at the periphery, wherein the light collected by the optical lens 20 can enter the photosensitive element 12 through the light filtering portion 412. Therefore, the relative positional relationship between the outer peripheral portion 411 and the optical filter portion 412 can be set, and the lighting range and lighting angle can be further limited.
It should be noted that, in the present invention, the light shielding layer 42 may be made of a light absorbing material or a material capable of reducing light reflection, and the manufacturing process thereof may be a photoresist process or a silk screen process, and a black light absorbing and opaque material is formed on the surface of the filter element main body 41.
It will be appreciated that, in practical implementation, the position of the outer peripheral portion 411 may be adjusted accordingly according to practical requirements. For example, in another embodiment of the present invention, the light shielding layer 42 may be formed on the bottom surface of the filter element body 41 of the filter element 40, as shown in fig. 10B. That is, in this embodiment, the bottom surface of the filter element 40 is provided with the light shielding layer 42. In particular, the inner edge of the light-shielding layer 42 exceeds or is aligned with the inner edge of the metal bracket 50 to limit the size of the light-passing area of the camera module. Stray light incident on the inner surface of the mold base 13 is absorbed when reflected to the light shielding layer 42, thereby reducing stray light reaching the photosensitive element 12.
In another embodiment of the present invention, as shown in fig. 10C, the light shielding layer 42 may be disposed on both the front and back surfaces of the filter element 40, and preferably, the light shielding layer 42 formed on the front and back surfaces corresponds to each other, so as to further ensure that the filter element 40 can satisfy certain stray light requirements through a double safety mechanism.
Further, as will be understood by those skilled in the art, after the metal frame 50 is attached to the corresponding position on the top surface of the mold base 13 by an adhesive medium, such as glue, and the filter element 40 is mounted on the metal frame 50, the photosensitive assembly 10 needs to be baked and cured to fix the metal frame 50 on the mold base 13. It should be noted that the filter element 40, the metal holder 50 and the mold base 13 form a closed space, i.e., the optical window, so that during the baking and curing process, the gas in the closed space may impact the filter element 40 due to thermal expansion, which may cause the filter element 40 to be damaged or broken.
Accordingly, in order to solve this problem, referring to the manufacturing process of fig. 16A to 20, and as shown in fig. 18 or fig. 19 in particular, the metal bracket 50 is further provided with an air escape hole 55, wherein the air escape hole 55 is in communication with the closed space formed by the light window 132, so that the heated and expanded air can diffuse to the outside through the air escape hole 55 during the baking and curing process, so as to effectively prevent the unnecessary impact on the filter element 40 caused by the surge of the internal air pressure. More specifically, in the preferred embodiment of the present invention, the air escape hole 55 is disposed adjacent to the light opening 52 of the metal bracket 50, and when the metal bracket 50 is attached to the corresponding position of the molding base 13, the air escape hole 55 is communicated with the closed space formed by the light window 132. Further, when the filter element 40 is mounted on the metal bracket 50, the air escape hole 55 is partially shielded by the filter element 40 and partially exposed to the outside, so that the gas in the sealed space formed by the light window 132 can be diffused to the outside through the air escape hole area exposed to the outside.
It should be understood by those skilled in the art that after the photosensitive assembly 10 is baked and cured, the air escape hole 55 is preferably re-closed to prevent external dust from penetrating into the photosensitive assembly 10 through the air escape hole and affecting the image quality. Accordingly, in the preferred embodiment of the present invention, the escape aperture 55 has a communication region 551 and a seal region 552. When the filter element 40 is disposed on the metal bracket 50, the air escape hole 55 partially overlaps the filter element 40 to form the communication region 551 and the sealing region 552, wherein the communication region 551 extends into the closed space formed by the light window 132 for gas communication, and the sealing region 552 corresponds to the top surface of the mold base 13 for sealing with an adhesive.
Preferably, in the preferred embodiment of the present invention, the sealing region 552 integrally extends to the connecting region 551, and the opening size of the sealing region 552 is larger than that of the connecting region 551, so as to facilitate the subsequent glue application on the sealing region 552 for sealing fixation. More preferably, the opening depth of the cover area 552 is greater than the opening depth of the communication area 551, so as to avoid the glue applied to the cover area 552 from overflowing into the sealed space, thereby preventing the photosensitive element 12 from being contaminated.
It will be readily appreciated by those skilled in the art that in further embodiments of the present invention, the air escape passage may be provided at the top of the mold base 13. More specifically, the air escape channel is concavely formed on the top of the mold base 13, so that one end of the air escape channel is communicated with the enclosed space formed by the light window 132, and the opposite end of the air escape channel is communicated with the outside, so that during the baking and fixing process, the air in the enclosed space formed by the light window 132 can flow along the air escape channel, thereby preventing the damage of the filter original price caused by the increase of air pressure. Preferably, in this embodiment of the present invention, the air escape passage is provided on a flexible board side of the photosensitive assembly 10, because the molding base 13 on this side is relatively narrow, which facilitates the processing of the air escape passage.
It is worth mentioning that the metal bracket 50 is made of a metal material, so that the metal bracket 50 is not easily deformed during the baking and curing process, so as to effectively ensure that the relative positional relationship between the metal bracket 50 and the device mounted on the metal bracket 50 is kept stable.
Further, after the photosensitive element 10 is baked and cured, the optical lens 20 is assembled on the top side of the molding base 13. It will be appreciated that in this preferred embodiment of the invention, the metal bracket 50 may be assembled to the metal bracket 50 instead of the molded base 13. Therefore, the quality of the molding of the mold base 13 has no direct influence on the mounting and calibration of the optical lens 20. In particular, since the metal holder 50 is made of a metal material and has a relatively high flatness, the optical lens 20 can be assembled to the metal holder 50 by mechanical fixing with relatively high precision, so that the installation and calibration costs of the optical lens 20 can be greatly reduced. Of course, those skilled in the art should understand that the optical lens 20 can also be assembled to the metal bracket 50 by Active Alignment (Active Alignment) to ensure the installation accuracy of the optical lens 20.
Accordingly, when the optical lens 20 is assembled to the metal holder 50, the metal holder 50 is limited between the mold base 13 and the optical lens 20 to prevent the metal holder 50 from being displaced due to the vibration of the camera module during the subsequent use.
It should be noted that in another embodiment of the invention, the optical lens 20 is assembled to the metal bracket 50 through a driving element 30. Likewise, the metal bracket 50 having a relatively high flatness also facilitates the mounting and alignment of the driving element 30. Further, it should be easily understood by those skilled in the art that the metal bracket 50 may provide a corresponding solution for solving the difficulty in mounting and calibrating the dual lenses of the dual camera module.
Referring to fig. 11, a camera module according to a second preferred embodiment of the present invention is illustrated, wherein the structure of the camera module shown in the second preferred embodiment substantially corresponds to that shown in the first preferred embodiment except for the mounting position of the metal bracket 50A.
In particular, as shown in fig. 11, in the preferred embodiment of the present invention, the top surface of the mold base 13A has an inner stepped surface 133A, and the stepped surface 133A is formed inside the mold base 13A for supporting the metal holder 50. Accordingly, the metal holder 50A includes an annular main body 51A and a light-passing opening 52A formed by the annular main body 51, wherein when the metal holder 50A is mounted on the mold base 13A, the annular main body 51A partially overlaps and fits the step surface 133A of the mold base 13A, and meanwhile, the light-passing opening 52A corresponds to the light window 132A of the mold base main body 131A to form a complete light path. It will be appreciated that in the preferred embodiment of the present invention, the metal holder 50A is mounted on the step surface 133A, so that the metal holder 50A is far away from the optical lens 20A, thereby effectively avoiding the occurrence of contact between the filter element 40A and the last lens of the optical lens 20A. Preferably, by utilizing the feature that the electronic components of the circuit board are higher than the leads, the step surface 133A may not be higher than the electronic components of the circuit board but not lower than the leads, so as to further move the position of the metal bracket 50A downward.
The light passing opening 52A of the metal holder 50A corresponds to the light window 132A of the mold base 13A, and thus adjusting the characteristics of the light passing opening 52A of the metal holder 50A can change the angle and range of the light sensing element 12A. More specifically, in this preferred embodiment of the present invention, the metal holder 50A is partially supported on the step surface 133A of the mold base 13A, and therefore, the size of the light passing opening 52A of the metal holder 50A is slightly smaller than the light window 132A of the mold base 13A, so that the light passing opening 52A can further limit the photosensitive angle and the photosensitive range of the photosensitive element 12A. Preferably, the inner side surface of the light passing opening 52A is an inclined surface 511A, and the inclined surface 511A faces the photosensitive element 12A, in this way, a light entrance angle and a light entrance range are defined to correspond to the photosensitive area of the photosensitive element 12A.
It should be noted that, in the preferred embodiment of the present invention, the metal holder 50A is mounted on the step surface 133A of the molding base 13A, so that the metal holder 50A is located inside the molding base 13A in a protective manner, in such a manner that the metal holder 50A is prevented from being damaged or chipped due to a bending force generated by being pressed or impacted by the side surface thereof during subsequent mounting and use.
Further, as shown in fig. 12, a modified embodiment of the metal holder 50A is shown, wherein the metal holder 50A has a sunken mounting structure 53A such that the mounting position of the filter element 40A is deep into the optical window 132A. That is, in this modified embodiment of the present invention, the metal bracket 50A has a three-dimensional structure. More specifically, in this embodiment of the present invention, the metal bracket 50A includes a ring-shaped body 51A, at least one inwardly extending arm 531A and at least one sunken arm 532A, wherein the sunken arm 532A and the inwardly extending arm 531A form the sunken mounting structure 53A. As shown in fig. 12, the sinking arm 532A is integrally extended in a turning and longitudinal direction from the ring-shaped body 51A to reduce the height of the installation position of the filter element 40A, so that the filter element 40A is relatively far away from the optical lens 20A to prevent touching between the last lens of the optical lens 20A and is closer to the photosensitive element 12A to facilitate filtering of stray light. The inwardly extending arm 531A integrally extends from the depressed arm 532A in a direction of rotation and laterally so as to provide a horizontal mounting position for the filter element 40A, so that the optical axes of the filter element 40A and the photosensitive element 12A coincide with each other. Specifically, in the practice of the present invention, the metal bracket 50A includes four integrally connected inner extending arms 531A and four integrally connected sinker arms 532A, each of the inner extending arms 531A and each of the sinker arms 532A extending at different positions to form the sinker mounting structure 53A.
It is worth mentioning that in this variant embodiment of the invention, since the filter element 40A is made of a metallic material, it has a relatively good ductility. Therefore, in the process of actually processing and forming the metal bracket 50A, for example, through a metal stamping process, the metal bracket 50A can be stamped to form various height differences so as to meet the requirements of camera modules with different specifications. Therefore, it is not necessary to replace the molding die of the lens holder of the filter element 40A as in the prior art to manufacture the lens holder of the filter element 40A with different specifications, so that the cost can be further reduced.
Referring to fig. 13, a camera module according to a third preferred embodiment of the present invention is illustrated, wherein the structure of the camera module shown in the third preferred embodiment substantially corresponds to that shown in the first preferred embodiment except for the structural configuration of the metal bracket 50B.
Those skilled in the art will appreciate that as the molding process advances, the size of the photosensitive assembly 10B after molding becomes smaller and smaller, and there is even a case where the size of the optical lens 20B is larger than that of the photosensitive assembly 10B. At this time, if the optical lens 20B is assembled to the top side of the mold base 13B, the optical lens 20B is partially arranged in a suspended manner, and the structure is unstable.
Accordingly, as shown in fig. 13, in the preferred embodiment of the present invention, the metal bracket 50B extends protrudingly to the outer periphery of the mold base 13B for supporting the optical lens 20B with a suspended portion, so as to reinforce the supporting structure of the optical lens 20B. That is, in the preferred embodiment of the present invention, the metal holder 50B provides a support platform for the optical lens 20B.
In particular, in the preferred embodiment of the present invention, the outer periphery of the metal holder 50B is located inside the outer periphery of the optical lens 20B, so that when the camera module is assembled in an electronic device, such as a smart phone, the side surface of the metal holder 50B does not collide with the electronic device, thereby preventing the metal holder 50B from deforming to generate a bending force to damage the filter element 40B. That is, in the preferred embodiment of the present invention, the length of the metal holder 50B protruding from the outer peripheral portion of the mold base 13B is smaller than the length of the optical lens 20B protruding from the mold base 13B.
It should be appreciated that the camera module provided by the third preferred embodiment of the present invention is suitable for complying with the installation of the non-flat surface of the electronic device. For example, as shown in fig. 13, the camera module is mounted on an electronic device, wherein a housing 80B of the electronic device has an arc-shaped curved surface. At this time, the conventional square camera module is obviously not adaptable to the mounting condition at this time. Specifically, in the process of assembling the camera module to the electronic device, the mold base 13B is disposed on one side of the housing 80B, and the optical lens 20B of the camera module is disposed in a staggered and protruding manner and abuts against the other side of the housing 80B to form a stable fixing structure.
Referring to fig. 14, an array camera module according to a fourth preferred embodiment of the present invention is illustrated. The array camera module comprises a camera module which comprises a plurality of photosensitive assemblies 10C and a plurality of optical lenses 20C, wherein the optical lenses 20C are positioned on photosensitive paths of the photosensitive assemblies 10C so as to collect image information of a detected target through the optical lenses 20C. In particular, in this preferred implementation of the invention, the camera module is implemented as a binocular camera module or even more purpose camera modules, i.e. the camera module comprises two or more optical lenses 20C. This aspect is not limiting of the invention.
It is worth mentioning that the binocular camera module may be implemented as a fixed focus dual camera module, i.e., the focal length between the optical lens 20C and the photosensitive assembly 10C is not adjustable. In particular, the optical lens 20C can be assembled to the top of the photosensitive assembly 10C through a lens barrel 21C as a lens carrying element. It is understood that as the packaging process improves, the size of the camera module is reduced, and in another modified embodiment, the optical lens 20C is assembled on the top of the photosensitive component 10C in a "bare lens" manner, i.e., at this time, the optical lens 20C is directly mounted on the top area of the photosensitive component 10C without the lens barrel 21C or the lens bearing element. Or the double camera modules are moving-focus camera modules, and the optical lens 20C is assembled on a corresponding driver.
More specifically, as shown in fig. 14, the photosensitive member 10C includes at least one wiring board 11C, two photosensitive elements 12C, and at least one mold base 13C. The photosensitive elements 12C are respectively conductively connected to the circuit board 11C, wherein light from the object to be measured passes through the photosensitive assembly 10C and reaches each of the photosensitive elements 12C, so as to further convert the optical signal of the object to be measured into an electrical signal that can be recognized and operated by an electronic device through the photosensitive reaction of each of the photosensitive elements 12C, thereby realizing the functions of pattern acquisition and reproduction of the object to be measured. The molding base 13C is integrally formed on the circuit board 11C and the photosensitive element 12C, and covers at least a part of the circuit board 11C and the photosensitive element 12C, so that the photosensitive assembly 10C and the camera module have compact and miniaturized structures.
It should be noted that, in the present invention, the circuit board 11C may be an integrated circuit board or a split circuit board, wherein when the circuit board 11C is an integrated circuit board, the photosensitive element 12C is correspondingly attached to a corresponding area of the circuit board 11C, so as to provide a flat mounting surface for the photosensitive element 12C through the integrated circuit board 11C. When the circuit board 11C is a split circuit board, the circuit board 11C includes two split circuit boards, and the split circuit boards are respectively suitable for mounting the photosensitive element 12C. At the moment, the assembly and the working space between the two split circuit boards are independent.
In the preferred embodiment of the present invention, the light sensing elements 12C can be respectively mounted on the corresponding regions of the circuit board 11C by, for example, SMT (Surface Mounting Technology), and further, the electrical connection between the circuit board 11C and the light sensing elements 12C is realized by a set of leads 14C. Those skilled in the art will appreciate that the manner of conducting the wiring board 11C and the photosensitive element 12C is referred to as a "gold wire" process. It should be noted that, in the present invention, a forward "gold wire bonding" mode, that is, the lead 14C extends from the circuit board 11C to the photosensitive element 12C, or a reverse "gold wire bonding" mode, that is, the lead 14C extends from the photosensitive element 12C to the circuit board 11C, is selected, and the photosensitive element 12C and the circuit board 11C are conducted, which is not limited by the present invention.
Further, after the photosensitive element 12C is mounted on the circuit board 11C and electrically connected to the circuit board 11C, a molding process is performed to form the molding base 13C on the photosensitive element 12C and the circuit board 11C. The molding base 13C is integrally formed on the photosensitive element 12 and the circuit board 11C, and covers at least a part of the photosensitive element 12 and a series of electronic components mounted on the circuit board 11C, so that not only is the overall size of the photosensitive assembly 10C effectively reduced, but also dust and impurities adhered to the electronic components in a traditional camera module are effectively prevented from polluting the photosensitive element 12C and affecting the imaging effect. Accordingly, in the present invention, the mold base may be an integral mold base, that is, the mold base is integrally formed with the circuit board (integral circuit board or divided circuit board) and the photosensitive element. It is also possible that the molding base is a split molding base, that is, the molding base includes two separate molding bases, and the split molding bases are integrally formed on the circuit board and the photosensitive element, respectively.
More specifically, the molding base 13C includes a molding base body 131C and at least one light window 132C formed by the molding base body 131C, wherein the light windows 132C are closed spaces and respectively correspond to at least the photosensitive areas of the photosensitive elements 12C, so as to allow light energy from the outside to be radiated to the photosensitive elements 12C through the light windows 132C to complete image capturing. In particular, in this preferred embodiment of the present invention, the molded base body 131C has a closed ring-shaped structure so as to provide a closed internal environment for the photosensitive element 12C, preventing external stray light from entering the photosensitive element 12C from the side.
In order to make the imaging effect of the camera module closer to the vision of human eyes, the photosensitive assembly 10C further includes two filter elements 40C, and the filter elements 40C are respectively disposed between the optical lens 20C and the photosensitive element 12C for filtering the optical signal of the target to be detected collected by the optical lens 20C. In particular, the filter element 40C is retained on a photosensitive path formed by the optical lens 20C and the photosensitive element 12C, so that light passing through the optical lens 20C is filtered by the filter element 40C, and the light radiated to the photosensitive element 12C does not contain stray light such as infrared light, and the final imaging effect is closer to the visual effect of human eyes.
Further, the photosensitive assembly 10C further includes at least one metal bracket 50C, and the metal bracket 50C is disposed between the filter element 40C and the mold base 13C, so as to improve the installation condition and the installation environment of the filter element 40C by the metal bracket 50C. That is, at this time, the filter element is not directly mounted on the top surface of the mold base, and therefore, the quality and size of the molding of the top surface of the mold base do not directly affect the mounting of the filter element.
In particular, in this preferred embodiment of the invention, the metal holder is made of a metal material having a relatively high flatness, thereby facilitating the filter element 40C and
the above-mentionedThe mounting of the optical lens 20C is calibrated. More specifically, when the filter element 40C is mounted on the metal bracket 50C, the contact surface between the filter element 40C and the metal bracket 50C is uniformly stressed, so that the probability that the filter element 40C is broken or damaged due to uneven stress in the mounting process is effectively reduced. Meanwhile, the filter element 40C and the metal holder 50C are disposed to overlap, and thus, the flatness of the filter element 40C depends on the flatness of the metal holder 50C. Therefore, in the preferred embodiment of the present invention, the filter element 40C has a relatively high flatness, so that the light passing through the optical lens 20C can be effectively filtered at the filter element 40C.
When the optical lens is assembled on the metal holder, the metal holder has high flatness, so that the optical lens can be assembled on the metal holder 50C in a mechanical fixing manner, and the installation and calibration cost of the optical lens 20C is greatly reduced. Of course, those skilled in the art should understand that the optical lens 20C can also be assembled to the metal bracket 50C by Active Alignment (Active Alignment) to ensure the installation accuracy of the optical lens 20C.
It should be noted that, as shown in fig. 14, in the preferred embodiment of the present invention, the metal bracket 50C has an integral structure, that is, the metal bracket 50C includes an annular main body 51C and two light-passing openings 52C, wherein when the metal bracket 50C is assembled on the top surface of the mold base 13C, the annular main body 51C is attached to the top surface of the mold base 13C, and the light-passing openings 52C correspond to the light window 132C and the photosensitive element 12C, respectively. Of course, it should be understood by those skilled in the art that in another modified embodiment of the present invention, as shown in fig. 15, the metal bracket 50C has a split structure, that is, the photosensitive assembly 10C includes two independent metal brackets 50C, the metal brackets 50C are respectively adapted to be attached to the top surface of the mold base 13C, and the light-passing openings 52C of the metal brackets 50C respectively correspond to the light windows 132 and the photosensitive elements 13C. In addition, the filter elements 40C of the plurality of photosensitive assemblies may be of an integral structure or may be independent of each other.
Further, in the present invention, the metal bracket 50C is made of a metal material, such as an iron-based, aluminum-based, or copper-based material. For example, in one specific example, it is implemented as a steel sheet. As is well known, metal materials have high light reflection performance and generate more reflected stray light. In order to eliminate the influence of this factor on the imaging quality, a light absorbing layer 54C is further disposed in the corresponding area between the filter elements 40C to prevent light from reflecting on the surface of the metal support 50C and entering the photosensitive element 12C, thereby affecting the final imaging effect.
More specifically, in the preferred embodiment of the present invention, the light absorbing layer 54C covers the outer surface of the metal holder 50C, so that part of the light collected by the optical lens 20C enters the photosensitive element 12C through the light passing port 52C, and part of the light falling on the surface of the metal holder 50C is absorbed by the light absorbing layer 54C, in this way, the light falling on the surface of the metal holder 50C is effectively prevented from entering the photosensitive element 12C through multiple reflections, which affects the imaging quality. Preferably, the light absorbing layer 54C is disposed on both the bottom surface and the top surface of the filter element 40C, so that both the stray light falling on the top surface of the metal holder 50C and the stray light radiated to the bottom surface of the metal holder 50C can be effectively absorbed. More preferably, in order to further ensure the light absorbing effect of the light absorbing layer 54C, the light absorbing layer 54C is provided to cover the entire outer surface of the metal holder 50C. Of course, those skilled in the art will appreciate that in other modified embodiments of the present invention, the light absorbing layer 54C may be disposed only in the region of the metal support 50C near the light passing opening 52C to reduce the probability of the reflected stray light entering the photosensitive element 12C.
It is worth mentioning that the light absorbing layer 54C may be formed on the corresponding region of the metal bracket 50C through a plating or film attaching process. It will be understood by those skilled in the art that the light absorbing layer 54C is not limited to be formed in the present invention. It should be appreciated that the process of forming the light absorbing layer 54C is performed after the metal holder 50C is press-formed to prevent the light absorbing layer 54C from being scratched to deteriorate its integrity during the process of punching the metal holder 50C.
In addition, it is understood that the structure of the single camera module in the above embodiments can be applied to the array camera module of the present invention.
On the other hand, referring to fig. 16A to 20, the present invention further illustrates a method for manufacturing a camera module, which is suitable for the camera module based on the metal bracket, and achieves the objects and advantages of the present invention.
Step 101: a circuit board 11 and at least one photosensitive element 12 of a photosensitive device 10 are accommodated in a molding space 903 of a molding mold 900, wherein the semi-finished product of the photosensitive device 10 is fixed to a lower mold 902, and the photosensitive element 12 of the photosensitive device 10 is attached to an inner bottom surface of an upper mold 901. In this step, the photosensitive element 12 is conductively attached to the surface of the circuit board 11 to form a semi-finished product of the photosensitive assembly 10. As will be appreciated by those skilled in the art, the circuit board 11 may be implemented as a circuit board panel or an integrated circuit board, and the plurality of light-sensitive elements 12 may be correspondingly mounted, i.e., a plurality of semi-finished panels may be accommodated in the molding space 903.
Step 102: a molding material in a fluid state is injected into the molding space 903.
The fluid-state forming material is not limited and may be a transparent material, a light-absorbing material, or the like. The manufacturer may use different materials as desired.
Step 103: and curing the molding material to form a molding base 13, wherein the molding base 13 covers the outer edge of the photosensitive element 12, and the molding base 13 has a light window 132 corresponding to the photosensitive element 12.
In this step, when the wiring board 11 is implemented as a wiring board patch or an integrated wiring board, the mold base 13 is formed to cover the wiring board patch or the integrated wiring board, and a plurality of light windows 132 are correspondingly formed to correspond to the light sensing elements 12. After the molding base 13 is formed, the formed makeup product can be divided into a plurality of single structures by cutting, or a connected structure required by the double camera modules.
Step 104: forming a metal support 50, wherein the metal support 50 is a planar ring structure, wherein the metal support 50 has a light hole 52, wherein the light hole 52 is smaller than the light window 132, and wherein the metal support 50 has an air escape hole 55 communicating with the space formed by the light window 132.
In this step, the structure of the metal bracket 50 is not limited, and may be the above-mentioned sinking installation structure or flat structure, which is not described in detail herein. The height dimension of the metal bracket 50 is various specifications according to different product size requirements, etc., and is not limited herein.
Step 105: the metal support 50 is partially overlapped and attached to the top surface of the molding base 13, wherein the light passing hole 52 corresponds to the light window 132, and the metal support 50 extends toward the inner side of the molding base 13.
As described above, when mounted, a part of the outer edge of the metal bracket 50 may be located inside the top surface of the mold base 13, or may be located outside the top surface of the mold base 13 but inside the outer edge of a lens, an actuator, or a fixed lens barrel to be mounted later.
Step 106: a light absorbing layer 54 is disposed on the outer surface of the metal support 50 for absorbing light.
The light absorbing layer 54 may be disposed on the entire outer surface of the metal holder 50, or may be disposed on the metal holder 50 in a region near the light passing hole 52. It will be appreciated that step 106 is not a necessary step and that the manufacturer may choose whether or not to perform it as desired.
Step 107: mounting a filter element 40 on the metal support 50, sealing
The above-mentionedAnd a light through hole 52 for forming the photosensitive assembly 10.
The sequence of steps 105 and 107 is not fixed, and the filter element 40 may be installed first and then the metal bracket 50 may be installed, or the sequence may be changed and the metal bracket 50 may be installed first and then the filter element 40 may be installed. The filter element 40 may be mounted on the top side or the bottom side of the metal holder 50.
Before said step 107, a step may also be performed; the light shielding layer is disposed on the outer surface of the filter element 40. For example, both on the bottom surface and the top surface of the filter element 40, so as to form the light-shielding region. This step is not essential and may be performed in the alternative to the step 106, or both.
Step 108: baking the photosensitive assembly 10, wherein the air inside the photosensitive assembly 10 expands due to heating and diffuses to the outside through the air escape hole 55.
Step 109: the air escape hole 55 is sealed.
Step 110: an optical assembly 20 is installed on the top side of the photosensitive assembly 10 corresponding to the photosensitive path of the photosensitive assembly 10.
It can thus be seen that the objects of the invention are sufficiently well-attained. The embodiments illustrated to explain the functional and structural principles of the present invention have been fully illustrated and described, and the present invention is not to be limited by changes based on the principles of these embodiments. Accordingly, this invention includes all modifications encompassed within the scope and spirit of the following claims.
Claims (45)
- A photosensitive assembly, comprising:a photosensitive element;a circuit board, wherein the photosensitive element is electrically connected to the circuit board;the molding base is integrally formed on the circuit board through a molding process and covers the edge of the photosensitive element, and the molding base is provided with an optical window corresponding to a photosensitive path of the photosensitive element; anda metal support, wherein the metal support is mounted on the top surface of the molding base for mounting a light filtering element, wherein the metal support has a light passing hole corresponding to the light window, and wherein the light filtering element, the metal support and the light window of the molding base are formed to provide light path for the light sensing element.
- The photosensitive assembly of claim 1, wherein said metal holder includes a ring-shaped body, wherein said light-passing hole is defined by said ring-shaped body, and said filter element is attached to a top side of said metal holder and extends toward an inner side of said mold base.
- The photosensitive assembly of claim 1 wherein the outer edge of the metal support is located inward of the outer perimeter of the mold base.
- The photosensitive assembly of claim 1, wherein the metal frame includes a ring-shaped body, wherein the light-passing hole is defined by the ring-shaped body, and the filter element is attached to a bottom side of the metal frame.
- A photosensitive assembly according to any one of claims 1 to 4, wherein the metal bracket further comprises at least one inwardly extending arm and at least one downwardly extending arm, wherein the downwardly extending arm and the inwardly extending arm form a downwardly mounting structure, wherein the downwardly extending arm integrally extends laterally and longitudinally from the ring body to reduce the mounting location height of the filter element, and wherein the inwardly extending arm integrally extends laterally and laterally from the downwardly extending arm to provide a horizontal mounting location for the filter element.
- The photosensitive assembly of claim 5, wherein said metal bracket includes four integrally connected said inwardly extending arms and four integrally connected said depressed arms, wherein each of said inwardly extending arms and each corresponding said depressed arm extend at different positions to form said depressed mounting structure.
- The photosensitive assembly according to any one of claims 1 to 4, wherein the size of the light passing hole is smaller than the size of the light window.
- The photosensitive assembly according to any one of claims 1 to 4, wherein an inner side surface of the light passing hole is an inclined surface, wherein the inclined surface faces the photosensitive element.
- The photosensitive assembly of any one of claims 1 to 4, wherein the metal support further comprises a light absorbing layer, wherein the light absorbing layer is disposed on an outer surface of the metal support.
- The photosensitive assembly of claim 9 wherein the light absorbing layer is disposed over the entire outer surface of the metal support.
- The photosensitive assembly of claim 9, wherein the light absorbing layer is disposed in a region of the metal support near the light admission port.
- The photosensitive assembly of claim 9, wherein the light absorbing layer is disposed on a bottom surface and/or a top surface of the filter element.
- The photosensitive assembly according to any one of claims 1 to 4, wherein the filter element has a light shielding layer to limit the light transmission range of the filter element through the light shielding layer, wherein the light shielding layer is disposed on the bottom surface and/or the top surface of the filter element.
- The photosensitive assembly according to any one of claims 1 to 4, wherein the metal holder has an air escape hole, wherein the air escape hole is communicated with an inner space formed by the filter element, the metal holder and the molding base.
- The photosensitive assembly of claim 14, wherein the air escape hole has a communication area and a sealing area, wherein the air escape hole overlaps the filter element to form the communication area and the sealing area, wherein the communication area extends into the formed sealed space for gas communication, and wherein the sealing area corresponds to the top surface of the molding base for sealing with sealant.
- The photosensitive assembly of claim 14, wherein the sealing region integrally extends to the connecting region, and an opening size of the sealing region is larger than an opening size of the connecting region.
- The photosensitive assembly of claim 14 wherein the opening depth of the land area is greater than the opening depth of the communication area.
- The photosensitive assembly according to any one of claims 1 to 4, wherein the top surface of the mold base has a step face on an inner side, wherein the step face is formed on the inner side of the mold base for supporting the metal holder, wherein the annular main body is partially overlapped to fit the step face.
- The photosensitive assembly of claim 5, wherein the top surface of the mold base has a step surface on an inner side, wherein the step surface is formed on the inner side of the mold base for supporting the metal holder, wherein the annular body partially overlaps and fits the step surface.
- The photosensitive assembly according to claim 1 or 2, wherein an outer peripheral edge of the metal holder is located inside the outer peripheral portion of the optical lens, and a length of the metal holder protruding from the outer peripheral portion of the mold base is smaller than a length of a corresponding optical lens protruding from the mold base.
- The photosensitive assembly according to any one of claims 1 to 4, wherein the thickness of the metal holder is in the range of 0.03 to 0.2 mm.
- A camera module, comprising:an optical lens; anda photosensitive assembly according to any one of claims 1 to 21, wherein said optical lens is mounted on a top side of said photosensitive assembly corresponding to a photosensitive path of said photosensitive element.
- The camera module of claim 22, further comprising a driving element, wherein the driving element drives the optical lens to move to achieve optical focusing.
- The camera module of claim 23, wherein an outer edge of the metal bracket is positioned between the molded base outer edge and the drive element outer edge.
- An array camera module, a serial communication port, include:at least two optical lenses;at least one circuit board;at least two photosensitive elements, wherein the photosensitive elements are respectively connected to the circuit board in a conducting manner;at least one molding base, wherein the molding base is integrally formed on the circuit board and the photosensitive elements and covers the circuit board and the edge parts of the photosensitive elements, and the molding base is provided with an optical window corresponding to a photosensitive path of each photosensitive element; andat least one metal support, wherein the metal support is mounted on the top surface of the molding base for mounting at least two light filtering elements, wherein the metal support has at least two light passing holes corresponding to the light windows, and wherein light paths are provided among the light filtering elements, the metal support and the light windows of the molding base for the respective light sensing elements.
- The array camera module of claim 25, wherein the wiring board is implemented as a unitary wiring board.
- The array camera module of claim 25, wherein the circuit board is implemented as a split circuit board, wherein the circuit boards for each photosensitive element are independent of each other.
- The array camera module of claim 25, wherein the molded base is implemented as a one-piece molded base.
- The array camera module of claim 25, wherein the molded base is implemented as a split molded base, wherein the molded bases for each photosensitive element are independent of each other.
- The array camera module of claim 25, wherein the metal bracket is implemented as a unitary metal bracket.
- The array camera module of claim 25, wherein the metal bracket is implemented as a split metal bracket.
- The array camera module of claim 25, wherein the filter element is implemented as a split filter element.
- The arrayed camera module of claim 25, wherein the filter element is implemented as a unitary filter element.
- The array camera module of any of claims 25-33, wherein the metal frame includes a ring-shaped body, wherein the light hole is defined by the ring-shaped body, and the filter element is attached to a top side of the metal frame and extends toward an inner side of the mold base.
- The photosensitive assembly of claim 34 wherein the outer edge of the metal bracket is located inward of the outer perimeter of the mold base.
- The photosensitive assembly of claim 34 wherein said metal frame includes a ring-shaped body, wherein said light-passing hole is defined by said ring-shaped body, and said filter element is attached to a bottom side of said metal frame.
- A photosensitive assembly according to claim 35 or 36, wherein the metal bracket further comprises at least one inwardly extending arm and at least one downwardly extending arm, wherein the downwardly extending arm and the inwardly extending arm form a downwardly mounting structure, wherein the downwardly extending arm integrally extends rotationally and longitudinally from the ring body to reduce the mounting location height of the filter element, wherein the inwardly extending arm integrally extends rotationally and laterally from the downwardly extending arm to provide a horizontally oriented mounting location for the filter element.
- A photosensitive assembly according to claim 37 wherein said metal bracket includes four integrally connected said inwardly extending arms and four integrally connected said depressed arms, wherein each said inwardly extending arm and each corresponding said depressed arm extend at different positions to form said depressed mounting structure.
- The photosensitive assembly of claim 35 or 36, wherein the metal support further comprises a light absorbing layer, wherein the light absorbing layer is disposed on the outer surface of the metal support.
- The photosensitive assembly of claim 39 wherein the light absorbing layer is disposed over the entire outer surface of the metal support.
- The photosensitive assembly of claim 39 wherein the light absorbing layer is disposed in an area of the metal support proximate the light admission port.
- The photosensitive assembly of claim 39, wherein the light absorbing layer is disposed on a bottom surface and/or a top surface of the filter element.
- A method of manufacturing a photosensitive assembly, comprising:(a) accommodating a circuit board of a photosensitive assembly and at least one photosensitive element in a molding space of a molding die, wherein a semi-finished product of the photosensitive assembly 1 is fixed on a lower die, and the photosensitive element of the photosensitive assembly is attached to the inner bottom surface of an upper die;(b) injecting a molding material in a fluid state into the molding space;(c) solidifying the molding material to form a molding base, wherein the molding base covers the outer edge of the photosensitive element, and the molding base is provided with a light window corresponding to the photosensitive component;(d) forming a metal support, wherein the metal support is a planar annular structure, wherein the metal support has a light through hole, wherein the size of the light through hole is smaller than that of the optical window, and wherein the metal support has an air escape hole which is communicated with a space formed by the optical window;(e) partially attaching the metal support to the top surface of the molding base in an overlapping manner, wherein the light-passing hole corresponds to the light window, and wherein the metal support extends towards the inner side of the molding base;(f) installing a light filtering element on the metal bracket, and sealing the light through hole to form the photosensitive assembly;(g) baking the photosensitive assembly, wherein air inside the photosensitive assembly expands when heated and diffuses to the outside through the air escape hole; and(h) and sealing the air escape hole.
- The photosensitive assembly manufacturing method according to claim 43, further comprising, after said step (d), the step of:(i) and arranging a light absorption layer on the outer surface of the metal support for absorbing light.
- The photosensitive assembly manufacturing method according to claim 43, further comprising, before said step (side), the step of:(k) and arranging the light shielding layer on the outer surface of the light filtering element.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710985806.4A CN109698894B (en) | 2017-10-20 | 2017-10-20 | Photosensitive assembly and camera module based on metal support |
| CN2017109858064 | 2017-10-20 | ||
| PCT/CN2018/110912 WO2019076352A1 (en) | 2017-10-20 | 2018-10-19 | Photosensitive assembly based on metal support, and camera module |
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| CN111345021A true CN111345021A (en) | 2020-06-26 |
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| CN201880057898.2A Pending CN111345021A (en) | 2017-10-20 | 2018-10-19 | Photosensitive assembly and camera module based on metal support |
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| US20220278150A1 (en) * | 2019-08-01 | 2022-09-01 | Ningbo Sunny Opotech Co., Ltd. | Photosensitive assembly, camera module and manufacturing methods therefor |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2019076352A1 (en) | 2019-04-25 |
| CN109698894A (en) | 2019-04-30 |
| CN109698894B (en) | 2023-06-30 |
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