CN205792878U - Camera module based on moulding technology - Google Patents
Camera module based on moulding technology Download PDFInfo
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- CN205792878U CN205792878U CN201620336842.9U CN201620336842U CN205792878U CN 205792878 U CN205792878 U CN 205792878U CN 201620336842 U CN201620336842 U CN 201620336842U CN 205792878 U CN205792878 U CN 205792878U
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- optical filter
- encapsulation part
- camera module
- bearing
- camera
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Abstract
One camera module based on moulding technology, comprising: a camera lens, a sensitive chip and a circuit board module；Wherein said sensitive chip is installed in described circuit board module, and described camera lens is positioned at the photosensitive path of described sensitive chip；Described circuit board module includes a wiring board portion and an encapsulation part, and described encapsulation part is connected to described wiring board portion based on moulding technology integral packaging, and described encapsulation part has a through hole, provides photosensitive path for described sensitive chip.
Description
Technical field
This utility model relates to camera module field, further, relating to a camera module based on moulding technology.
Background technology
As it is shown in figure 1, be tradition COB (Chip On Board chip package) technique a camera module show
It is intended to.Described camera module includes a wiring board 1P, a sensitive chip 2P, a base 3P, an optical filter
4P, motor 5P and a camera lens 6P.Described sensitive chip 2P is installed in described wiring board 1P, described optical filtering
Sheet 4P is installed in described base 3P, described camera lens 6P and is installed in described motor 5P, described motor 5P
It is installed in described base 3P.
The optical system of shooting molding is the key factor of the image quality affecting described camera module, and optical system
System is prevented with described camera lens 6P, described optical filter 4P and the optical axis of described sensitive chip 2P and light
Line has very big relation.And in the camera module of transmission, described base 3P effect wherein is exactly for described
Optical filter 4P, described motor 5P or described camera lens 6P provide installation site, enable each parts by optical system
The light path arrangement of system.
The described base 3P of tradition COB technique is typically a plastic stent, solid by the way of bonding
Due to described wiring board 1P, wherein there is many unfavorable factors.
First, traditional described base 3P is due to the manufacture factor of himself, poor on planarization, therefore
Good mounting condition can not be provided for described motor 5P, described camera lens 6P and described optical filter 4P so that
Described motor 5P, described camera lens 6P and described optical filter 4P easily occur or bias phenomenon, thus right
Higher in the mounting process required precision of described motor 5P, described camera lens 6P and described optical filter 4P.
Secondly, traditional described base 3P is typically to be adhered to described wiring board 1P, therefore as described base 3P
When installing fixing, easily occur or deviation, further increase the cumulative error that camera module is overall.
Additionally, be usually installed some circuit devcies 11P, such as resistance, electricity on described wiring board 1P
Holding, these circuit devcies 11P protrudes from described wiring board 1P surface, and described base 3P then needs to be pacified
It is loaded on the described wiring board 1P with described circuit devcie 11P, and this wiring board in traditional COB technique
Assembling matching relationship between 1P, this circuit devcie 11P and this support 3P has some unfavorable factors, for
The installing space of described base 3P is less, thus adds the camera module demand for lateral dimension.
Summary of the invention
A purpose of the present utility model is to provide a camera module based on moulding technology, wherein said shooting
Module includes that a circuit board module, described circuit board module include an encapsulation part and a wiring board portion, described encapsulation
Portion one is shaped in described wiring board portion, and a camera lens, a motor or an optical filter for described camera module carry
For good mounting condition.
A purpose of the present utility model is to provide a camera module based on moulding technology, wherein said circuit
The described encapsulation part top of board component is plane, and described optical filter is installed in the top of described encapsulation part, from
And make the installation that described optical filter is flattened.
A purpose of the present utility model is to provide a camera module based on moulding technology, wherein said circuit
The described encapsulation part of board component has a mounting groove, and described optical filter is installed in described mounting groove, for described filter
Mating plate provides smooth, stable installation site.
A purpose of the present utility model is to provide a camera module based on moulding technology, wherein said shooting
Module includes that a bearing, described bearing are installed in described encapsulation part, and described optical filter is installed in described bearing.
A purpose of the present utility model is to provide a camera module based on moulding technology, wherein said camera lens
Including a lens barrel, described optical filter is installed in described lens barrel, from without providing extra parts to pacify
Fill described optical filter.
A purpose of the present utility model is to provide a camera module based on moulding technology, wherein said circuit
Plate portion includes that a wiring board main body, described wiring board main body have a path, and described optical filter is installed in described
Path upper end, thus reduce the back focal length of described camera module.
A purpose of the present utility model is to provide a camera module based on moulding technology, wherein said circuit
Portion includes one at least one component, and described component protrudes from described wiring board main body, described component
Be coated with by described encapsulation part, from without being directly exposed to outside, and increase described encapsulation part can installation space.
In order to realize above goal of the invention, one side of the present utility model provides a shooting mould based on moulding technology
Group, comprising: at least one camera lens, at least one sensitive chip and at least one circuit board module；Wherein said photosensitive
Chip is installed in described circuit board module, and described camera lens is positioned at the photosensitive path of described sensitive chip；Described line
Road board component includes a wiring board portion and an encapsulation part, and described encapsulation part is connected to based on moulding technology integral packaging
Described wiring board portion, described encapsulation part has a through hole, provides photosensitive path for described sensitive chip.
According to an embodiment of the present utility model, described camera module includes at least one optical filter, described optical filter
It is installed in described encapsulation part, so that described optical filter is installed with being flattened.
According to an embodiment of the present utility model, described in described camera module, encapsulation part has a top surface, flat
Ground, face extends, and described optical filter is installed in described top surface.
According to an embodiment of the present utility model, described camera module includes that at least one motor, described camera lens are pacified
Being loaded on described motor, described motor is installed in described encapsulation part.
According to an embodiment of the present utility model, described in described camera module, camera lens is installed in described encapsulation part.
According to an embodiment of the present utility model, described in described camera module, encapsulation part has at least one mounting groove,
Described mounting groove is communicated in described through hole, and described optical filter is installed in described mounting groove.
According to an embodiment of the present utility model, described in described camera module, mounting groove is communicated in U-shapedly
Outside.
According to an embodiment of the present utility model, described camera module includes at least one optical filter, at least one motor
At least one bearing, described optical filter is installed in described bearing, and described bearing is installed in described mounting groove,
Described camera lens is installed in described motor, and described motor is installed in described encapsulation part.
According to weighing an embodiment of the present utility model, described camera module includes at least one bearing and at least one optical filtering
Sheet, described optical filter is installed in described bearing, and described bearing is installed in described mounting groove.
According to an embodiment of the present utility model, described camera module includes a bearing and an optical filter, described filter
Mating plate is installed in described bearing, and described bearing is installed in described encapsulation part.
According to an embodiment of the present utility model, described camera module includes that at least one motor, described motor are pacified
It is loaded on described bearing.
According to an embodiment of the present utility model, described in described camera module, camera lens is installed in described bearing.
According to an embodiment of the present utility model, described in described camera module, camera module includes at least one bearing
At least one optical filter, described encapsulation part has a mounting groove, and described bearing is installed in the institute of described encapsulation part
Stating mounting groove, described optical filter is installed in described bearing.
According to an embodiment of the present utility model, described in described camera module, bearing has one in the inner side at top
First seat slot and have one second seat slot in the outside of bottom, described first seat slot is used for installing described filter
Mating plate, described second seat slot make described base clip together in described encapsulation part so that described optical filter and described sense
The distance of optical chip reduces.
According to an embodiment of the present utility model, described in described camera module, camera module includes at least one motor
At least one optical filter, described optical filter is installed in described motor, and described motor is installed in described encapsulation part.
According to an embodiment of the present utility model, described camera module includes at least one optical filter, described camera lens bag
Including a lens barrel and at least one eyeglass, each described eyeglass is installed in described lens barrel, and described optical filter is by by being installed on
Described lens barrel, is positioned at the lower section of each described eyeglass.
According to an embodiment of the present utility model, described camera module includes at least one optical filter, described line part
Including a wiring board main body, described encapsulation part integral packaging is connected to described wiring board main body, described wiring board master
Body has a path, and described sensitive chip upside-down mounting is in described path, and described optical filter is covered in described wiring board master
The described path of body.
According to an embodiment of the present utility model, encapsulation part described in described camera module is with injection or the side of mold pressing
Formula integral packaging is connected to described wiring board portion.
According to an embodiment of the present utility model, wiring board portion described in described camera module includes a wiring board master
Body and at least one component, described component protrudes from described wiring board main body, and described encapsulation part is coated with institute
State component, so as not to be exposed to the space connected with described sensitive chip.
According to an embodiment of the present utility model, at least both sides at described encapsulation part top are respectively provided with at least one protruding platform
Rank, form a mounting groove inside it, described camera module also includes at least one bearing and at least one optical filter, institute
Stating bearing and be installed on the described mounting groove inside described raised step, described optical filter is installed on described bearing.
According to an embodiment of the present utility model, the top surface of at least side at described encapsulation part top is not provided with described
Raised step, for supporting described bearing.
According to an embodiment of the present utility model, described raised step top surface is higher than the surface of described bearing, institute
State camera module and also include that a motor, described motor are mounted on described raised step.
Accompanying drawing explanation
Fig. 1 is the camera module cross-sectional schematic of tradition COB technique.
Fig. 2 is that the camera module based on moulding technology according to first preferred embodiment of the present utility model cuts open
Depending on schematic diagram.
Fig. 3 is that the camera module based on moulding technology according to first preferred embodiment of the present utility model stands
Body decomposing schematic representation.
Fig. 4 is the camera module based on moulding technology according to first preferred embodiment of the present utility model
Another embodiment.
Fig. 5 is that the camera module based on moulding technology according to second preferred embodiment of the present utility model cuts open
Depending on schematic diagram.
Fig. 6 is that the camera module based on moulding technology according to the 3rd preferred embodiment of the present utility model cuts open
Depending on schematic diagram.
Fig. 7 is that shooting based on the moulding technology molding according to the 4th preferred embodiment of the present utility model cuts open
Depending on schematic diagram.
Fig. 8 is that the camera module based on moulding technology according to the 5th preferred embodiment of the present utility model cuts open
Depending on schematic diagram.
Fig. 9 is that the camera module based on moulding technology according to the 6th preferred embodiment of the present utility model cuts open
Depending on schematic diagram.
Figure 10 is that the camera module based on moulding technology according to the 7th preferred embodiment of the present utility model cuts open
Depending on schematic diagram.
Figure 11 A, 11B are the shootings based on moulding technology according to the 8th preferred embodiment of the present utility model
Module different angles cross-sectional schematic.
Figure 12 is the camera module based on moulding technology according to the 8th preferred embodiment of the present utility model
Partial perspective view.
Detailed description of the invention
Hereinafter describe and be used for disclosing this utility model so that those skilled in the art are capable of this utility model.With
Preferred embodiment in lower description is only used as citing, it may occur to persons skilled in the art that other obviously become
Type.The ultimate principle of the present utility model defined in the following description can apply to other embodiments, deformation
Scheme, improvement project, equivalent and the other technologies side without departing from spirit and scope of the present utility model
Case.
It will be understood by those skilled in the art that in exposure of the present utility model, term " longitudinally ", " laterally ",
On " ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward "
Being based on orientation shown in the drawings or position relationship in the orientation indicated or position relationship, it is for only for ease of retouches
State this utility model and simplify description rather than instruction or imply that the device of indication or element must have specifically
Orientation, with specific azimuth configuration and operation, the most above-mentioned term is it is not intended that to restriction of the present utility model.
As shown in Figures 2 to 4, according to first preferred embodiment of the present utility model based on moulding technology
Camera module.Described camera module can be applied to various electronic equipment, described to assist use to pass through
Camera module carries out shooting activity, the most described camera module can be used for shooting object or the image of personage or
Video image etc..Preferably, described camera module can be employed a mobile electronic device, the most described movement
Electronic equipment can be but not limited to mobile phone or panel computer equipment.
As shown in Figures 2 to 4, described camera module includes circuit board module 10, sensitive chip 30 and
One camera lens 50.
Further, described sensitive chip 30 is installed in described circuit board module 10, and described camera lens 50 is positioned at
On described circuit board module 10, and described camera lens 50 is positioned at the photosensitive path of described sensitive chip 30.Described
Circuit board module 10 can be coupled to described electronic equipment, thus with described electronic equipment with the use of.This
Skilled artisan understands that of field, described camera lens 50 and described chip can cooperate filmed image.
Specifically, subject, the reflection of object or person thing light by as described in after camera lens 50, by institute
State sensitive chip 30 to receive to carry out photoelectric conversion.In other words, optical signal can be turned by described sensitive chip 30
Turn to the signal of telecommunication, and the described signal of telecommunication can be transferred into described electronics by described circuit board module 10 and set
Standby, thus on described electronic equipment, generate the image relevant to described reference object.
Described circuit board module 10 includes encapsulation part 11 and a wiring board portion 12, described encapsulation part 11 one
Ground encapsulation be connected to described wiring board portion 12, molding be connected to as described in wiring board portion 12.More specifically,
Described encapsulation part 11 (Molding On Board, MOB) molding by the way of being molded into wiring board connects
In described wiring board portion, moulding technology can be the techniques such as injection or mold pressing.
Described wiring board portion 12 includes that a wiring board main body 121, described encapsulation part 11 are integrally connected to described line
Road plate main body 121.Described encapsulation part 11 forms a through hole 111, so that described encapsulation part 11 is around institute
State outside sensitive chip 30, and described camera lens 50 and the passage of light of described sensitive chip 30 are provided.Institute
State sensitive chip 30 and be arranged at the prime number wiring board main body 121 of described through hole 111 correspondence position.
Described wiring board portion 12 includes connecting line 31 road and at least one component 122, described connecting line 31
Road defaults in described wiring board main body 121, and described component 122 is electrically connected to described connection circuit, for
The photosensitive work process of described sensitive chip 30.Described component 122 it may be that citing ground but be not limited to,
Resistance, electric capacity, diode, audion, potentiometer, relay, driver etc..
It is noted that described component 122 element can be coated on inside by described encapsulation part 11,
Hence in so that described component 122 will not be directly exposed in space, more specifically, be not exposed to
In the enclosed environment that described sensitive chip 30 is connected.The existence of circuit devcie in different traditional camera modules
Mode, as capacitance resistance ware protrudes from the mode of wiring board, thus prevents dust, foreign material from staying in described circuit elements
Part 122 and pollute described sensitive chip 30.In this embodiment of the present utility model, with described circuit elements
Part 122 illustrates as a example by protruding from described wiring board main body 121, and in other embodiments of the present utility model
In, it is internal that described component 122 is embedded in described wiring board main body 121, and non-bulging described wiring board
Main body 121, those skilled in the art it should be appreciated that the structure of described component 122, type and
Provided position is not restriction of the present utility model.It is understood that in the camera module of transmission,
Circuit devcie protrudes from described wiring board, and base can only be installed in the outside of described component 122, because of
This described circuit devcie and described base are required for certain locus, therefore to wiring board in horizontal size
Require higher.And for camera module based on moulding technology of the present utility model, described encapsulation part 11 one
It is packaged in described wiring board main body 121, and is coated with described component 122, the most described encapsulation part 11 and institute
State component 122 overlapped in space, thus add the sky that described encapsulation part 11 can inwardly be arranged
Between, reduce extension demand outside to described wiring board main body 121, thus reduce the horizontal of described camera module
Size so that it is the equipment of miniature requirement can be met.
It is noted that described encapsulation part 11 is coated with described component 122 has the described circuit elements of protection
Part 122 so that it is avoid advantage that is contaminated and that by mistake touched, corresponding camera module is brought advantage simultaneously,
But those skilled in the art is it should be appreciated that described encapsulation part 11 is not limited to be coated with described component
122.It is to say, in other embodiments of the present utility model, described encapsulation part 11 can directly be molded into
The described wiring board main body 121 of the described component 122 not protruded, it is also possible to be to be molded into described circuit
The outside of element 122, the diverse location such as surrounding.
In this embodiment of this utility model, the protruding ground of described encapsulation part 11 is around described sensitive chip 30
Outside, especially, described encapsulation part 11 closes connection integratedly so that it is have good sealing, thus
When described camera lens 50 is installed in the photosensitive path of described sensitive chip 30, described sensitive chip 30 is close
It is encapsulated in inside, thus forms space in the closing of correspondence.
Specifically, when manufacturing described circuit board module 10, a traditional wiring board can be selected as described
Wiring board main body 121, molds on described wiring board main body 121 surface.Such as, in one embodiment,
Injection machine can be used, SMT technique (Surface will be carried out by insert molding (Insert Molding) technique
Mount Technology surface mount process) after wiring board carry out integral packaging, such as molded packages, shape
Become described encapsulation part 11, or form described encapsulation part 11 by mould pressing process conventional in semiconductor packages.Enter
One step, is mounted on described wiring board main body 121, then by each described photosensitive core by each described sensitive chip 30
Sheet 30 is electrically connected with described wiring board main body 121, such as plays gold thread electrical connection.Described wiring board main body
121 can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB
Hardboard (without soft board) etc..Described encapsulation part 11 formed mode can be chosen as, citing ground but be not limited to,
Shooting Technique, mould pressing process etc..The material that described encapsulation part 11 can select is, citing ground but be not limited to,
Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP
(Polypropylene, polypropylene) etc., mould pressing process can use epoxy resin.Those skilled in the art should
When being understood by, the aforementioned manufacture that can select and the material that can select, it is illustrative only this
Utility model can be not restriction of the present utility model in the way of enforcement.
In other embodiments of the present utility model, manufacture the process of described circuit board module 10 it is also possible that
First described wiring board main body 121 is carried out SMT technique, and then described sensitive chip 30 is mounted on described line
Road plate main body 121, and described sensitive chip 30 is electrically connected with described wiring board main body 121, than
As played gold thread electrical connection, then described wiring board main body 121 will be carried out integral packaging, such as molded packages,
Described encapsulation part 11 is formed by the way of insert molding, or by mould pressing process conventional in semiconductor packages
Form described encapsulation part 11.Those skilled in the art is it should be appreciated that the system of described circuit board module 10
Making order is not restriction of the present utility model.
Described camera module includes that an optical filter 40, described optical filter 40 are installed in described encapsulation part 11, with
It is easy to provide stable, smooth mounting condition for described optical filter 40.
More specifically, in an embodiment of the present utility model, described optical filter 40 is implemented as one infrared section
Only optical filter 40 (Infra-Red Cut Filter, IRCF), described cutoff filter 40 is to utilize precision
Optical coating technology alternately plates the blooming of high index of refraction on optical base-substrate, it is achieved visible region
(400-630nm) high saturating, the optical filter 40 that near-infrared (700-1100nm) ends, it can eliminate
The Infrared Imaging to described sensitive chip 30, such as CCD or CMOS.By in described shooting
The imaging system of module adds described cutoff filter 40, stops that imaging system portion disturbs into picture element
The infrared light of amount so that the become image of described camera module more conforms to the best perception of human eye.
It is noted that due to described sensitive chip 30, such as CCD or CMOS, sensing and the people to light
Eye is different, and human eye can only see the visible ray of 380-780nm wave band, and described sensitive chip 30 then can be felt
Should more multiband, such as infrared light and ultraviolet light, especially the most sensitive to infrared light, therefore at described camera module
In infrared light have to be suppressed, and keep the high transmission of visible ray so that described sensitive chip 30
Sense close to human eye, so that the image of described camera module shooting also complies with the sensing of eyes, therefore institute
It is indispensable for stating cutoff filter 40 for described camera module.
Especially, in embodiment of the present utility model, described optical filter 40 can be selected from combination: wafer scale
Cutoff filter, narrow band pass filter, smalt IRCF.Those skilled in the art it should be appreciated that
The type of described optical filter 40 is not restriction of the present utility model.
In the camera module that traditional COB assembles, optical filter is usually installed in plastic feet, and base
Being installed on wiring board typically by bonding mode, the most this plastic feet and corresponding mounting means are not
Skew easily occurs or tilts, and the surface smoothness of plastic stent is poor, therefore can not carry for optical filter 40
For good mounting condition.According to this preferred embodiment of this utility model, described optical filter 40 is installed in
Described encapsulation part 11, and based on moulding technology, it is possible to obtain the flat pin in good surface, therefore, it is possible to for institute
State the mounting condition that optical filter 40 provides smooth, and integrated mode so that described encapsulation part 11 is difficult to
Skew, tilt phenomenon occur, thus reduces cumulative limit when described optical filter 40 is installed.
In this embodiment of the present utility model, the top surface 112 one plane of described encapsulation part 11 extends,
Described optical filter 40 is installed in the described top surface 112 of described encapsulation part 11.Especially, described optical filter
The 40 described top surfaces 112 that can be connected to described encapsulation part 11 by the way of bonding.
In this embodiment of the present utility model, described camera module includes a motor 60, such as voice coil motor,
Described camera lens 50 is installed in described motor 60, in order to drive described camera lens 50 to transport by described motor 60
Dynamic, regulate the focal length of described camera module, say, that described camera module is a dynamic burnt module (Automatic
Focus Model, AFM).
Described motor 60 is installed in the described encapsulation part 11 of described circuit board module 10, further, described
Motor 60 is installed in the described top surface 112 of described encapsulation part 11, say, that described optical filter 40
The described top surface 112 that take described encapsulation part 11 mutually coordinated with described motor 60.
Described camera lens 50 is installed in described motor 60, and described motor 60 and described optical filter 40 are installed in
Described encapsulation part 11, thus described encapsulation part 11 is equivalent to the function of base of tradition camera module, for described
Motor 60 and described optical filter 40 provide the position supporting, fixing, but manufacture, assembling and form are the most not
It is same as tradition COB technique.The base of the camera module of traditional COB technique is fixed on line in the way of bonding
Road plate, and described encapsulation part 11 is fixed on described wiring board main body 121 by the way of being molded into wiring board,
Need not the process of being adhesively fixed, molding mode relative to adhering fixed mode have more preferable connective stability and
The controllability of technical process, planarization is higher, provides good for described motor 60 and described optical filter 40
Mounting condition, and described encapsulation part 11 and described wiring board main body 121 do not exist AA adjust glue space,
Therefore the headspace that tradition camera module AA adjusts is eliminated so that the thickness of described camera module is subtracted
Little；On the other hand, described encapsulation part 11 is coated with described component 122 so that conventional base space and electricity
Circuit component 122 installing space can be spatially overlapping, it is not necessary to as traditional camera module, at circuit devcie
The most reserved safe distance, so that the described encapsulation part 11 with base functions can be arranged on less
Size, thus further provide the space that camera module thickness can reduce.Additionally, described encapsulation part 11
Replace traditional base, it is to avoid the heeling error that base brings when pasting and assembling, reduce described shooting mould
The cumulative limit that group assembles.
It will also be appreciated that the shape of described encapsulation part 11 can more it needs to be determined that, such as at described electricity
Circuit component 122 position extends internally, and forms a protuberance, thus increases described encapsulation part 11 correspondence
Width, and there is no the position of described component 122, described disjunctor molded section as one man extends, and forms ratio
Relatively regular shape, and width is less.Those skilled in the art is it should be appreciated that described encapsulation part 11
Concrete shape be not restriction of the present utility model.
According to this embodiment of the present utility model, described sensitive chip 30 can be led to by least one connecting line 31
It is electrically connected to described wiring board main body 121, and can be energized and be connected to described connecting line 31 tunnel.Described connection
Line 31 may be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.Especially, institute
The described connecting line 31 stating sensitive chip 30 can be connected to described wiring board master by traditional COB mode
Body 121, citing ground but be not limited to, the mode of welding.It is to say, described sensitive chip 30 and described line
The connection of road plate main body 121 can make full use of existing ripe interconnection technique, to reduce the cost of improvement technology,
Traditional technique and equipment are made full use of, it is to avoid the wasting of resources.Certainly, those skilled in the art should
When it is understood that the connection of described sensitive chip 30 and described wiring board main body 121 can also pass through it
The connected mode of its any goal of the invention of the present utility model being capable of realizes, and this utility model is in this respect
Unrestricted.
It is noted that in this embodiment of this utility model, each described sensitive chip 30 is set
Being placed in the upper surface of described wiring board main body 121, described encapsulation part 11 is around outside described sensitive chip 30
Side.When manufacturing described circuit board module 10, different manufacturing sequence can be selected, citing ground but be not limited to,
In one embodiment, described sensitive chip 30 first can be installed in described wiring board main body 121, and
After outside described sensitive chip 30, the described wiring board main body 121 upper mold described encapsulation part of moulding one-tenth 11, and
And the described component 122 that will protrude above described wiring board main body 121 is coated on inside it.And in this practicality
In novel another embodiment, can be first in the described wiring board main body 121 upper mold described encapsulation part of moulding one-tenth
11, and the described component 122 that will protrude above described wiring board main body 121 is coated on inside it, then
Described sensitive chip 30 is installed on described wiring board main body 121 so that it is be positioned at the inner side of described encapsulation part 11.
With reference to Fig. 4, it is another embodiment party of camera module according to first preferred embodiment of the present utility model
Formula, described camera module can be one to focus module (Fix Focus Model, FFM).At described shooting mould
In group, described camera lens 50 is installed in the top surface 112 of described encapsulation part 11, Jiao of the most described camera module
Away from cannot freely be adjusted.Described camera lens 50 and described optical filter 40 are coordinated to configure described encapsulation part 11
Described top surface 112.Those skilled in the art it should be appreciated that described shooting molding type not
It it is restriction of the present utility model.
It is noted that according to this preferred embodiment of the present utility model, described encapsulation part 11 can be used
Support the described optical filter 40 of installation and described camera lens 50, there is the function of conventional base, and based on molding
Advantage, described encapsulation part 11 can control planarization and the concordance of described encapsulation part 11 by mould, from
And be that the described colour filter of described camera module provides smooth and consistent installation environment with described camera lens 50, from
And it being easier to ensure that the concordance of the optical axis of camera lens 50 and optical filter 40 and sensitive chip 30, this point is
Traditional camera module is not readily reachable by.
As it is shown in figure 5, be the camera module according to second preferred embodiment of the present utility model.It is different from
Stating preferred embodiment, described encapsulation part 11 has a mounting groove 113A, described mounting groove 113A connection
In described through hole 111, in order to provide sufficient installing space for described optical filter 40.It is to say, it is described
The described top surface 112 of encapsulation part 11 is in step-like structure, and is not that one extends, described top surface 112
Each step on can be used for described optical filter 40, described camera lens 50 or described motor 60 are installed.
Further, the height of described mounting groove 113A is more than the thickness of described optical filter 40, so that described
When optical filter 40 is installed in described mounting groove 113A, described optical filter 40 will not protrude from described encapsulation part
The top of 11.
Especially, according to this embodiment of the present utility model, described optical filter 40 is square, described installation
The shape of groove 113A adapts with the shape of described optical filter 40.It is to say, described mounting groove 113A in
Side's annular, is communicated in described through hole 111.
It is noted that in this embodiment of the present utility model, described mounting groove 113A may be used for
Described optical filter 40 is installed, and in of the present utility model other are implemented, described mounting groove 113A can be used to
The parts such as motor 60 or the described camera lens 50 of installing described camera module, those skilled in the art is to be understood that
, the purposes of described mounting groove 113 is not restriction of the present utility model.
It will also be appreciated that in this embodiment of the present utility model, accompanying drawing enters as a example by dynamic burnt module
Row explanation, and in other embodiments of the present utility model, described shooting can be one to focus module, this area
Skilled artisan understands that, the type of described camera module is not restriction of the present utility model.
As shown in Figure 6, it is the shooting based on moulding technology according to the 3rd preferred embodiment of the present utility model
Module cross-sectional schematic.Being different from above preferred embodiment, described camera module includes a bearing 70B,
Described bearing 70B is used for installing described optical filter 40.Described bearing 70B is installed in described encapsulation part 11,
Described optical filter 40 is installed in described encapsulation part 11, and described motor 60 or described camera lens 50 are installed in institute
State bearing 70B.
According to this embodiment of the present utility model, described bearing 70B has one first seat slot 71B and
Second seat slot 72B, described first seat slot 71B is used for installing described optical filter 40 so that described optical filtering
The surface of sheet 40 will not protrude from the top of described bearing 70B.Described second seat slot 72B, is used for installing
In described encapsulation part 11, so that described encapsulation part 11 upwardly extends along described bearing 70, and described optical filtering
The positional of sheet 40 is to downwards, thus reduces the back focal length of described camera module.
In other words, described bearing 70B extends in described through hole 111, and downwardly extends, thus by described
Optical filter 40 is supported in above described sensitive chip 30, and utilizes the space in described through hole 111 so that filter
While mating plate 40 is stably installed, described optical filter 40 will not take space outerpace.
It is noted that the distance that described bearing 70B extends internally is positioned at the photosensitive of described sensitive chip 30
Outside district, say, that described bearing 70B will not block the described photosensitive area of described sensitive chip 30, with
Avoiding affecting the photo-process of described sensitive chip 30, the size of described bearing 70B can design with real needs.
In this embodiment of the present utility model and respective drawings, illustrate as a example by dynamic burnt module, institute
Stating camera lens 50 by by being installed on described motor 60, described motor 60 is installed in described bearing 70B.The most just
Being to say, described bearing 70 provides installation site for described optical filter 40 and described motor 60.And it is real at book
With in other novel embodiments, described camera module can also is that one focuses module.Described camera lens 50 is pacified
It is loaded on described bearing 70B, say, that described bearing 70B is described optical filter 40 and described camera lens 50
There is provided installation site, those skilled in the art it should be appreciated that described bearing 70B concrete structure and
The type of described camera module is not restriction of the present utility model.
As it is shown in fig. 7, be the shooting based on moulding technology according to the 4th preferred embodiment of the present utility model
Molding cross-sectional schematic.Being different from above preferred embodiment, described encapsulation part 11 has a mounting groove 113C,
Described mounting groove 113C is communicated in described through hole 111.It is to say, the described top surface of described encapsulation part 11
112 in step-like structure, and is not that one extends.
Described camera module includes that a bearing 70C, described bearing 70C are used for installing described optical filter 40.Institute
Stating bearing 70C and be installed in described encapsulation part 11, described optical filter 40 is installed in described encapsulation part 11, institute
State motor 60 or described camera lens 50 is installed in described encapsulation part 11.
Further, described bearing 70C is installed in the described mounting groove 113C of described encapsulation part 11, and described
The height of the mounting groove 113C setting height(from bottom) more than described bearing 70C, so that described bearing 70C will not
Protrude from the described end of described encapsulation part 11.
According to this embodiment of the present utility model, described bearing 70C has one first seat slot 71C and
Second seat slot 72C, described first seat slot 71C is used for installing described optical filter 40 so that described optical filtering
The surface of sheet 40 will not protrude from the top of described bearing 70C.Described second seat slot 72C, is used for installing
In described encapsulation part 11, so that described encapsulation part 11 upwardly extends along described bearing 70C, and described optical filtering
The positional of sheet 40 is to downwards, thus reduces the back focal length of described camera module.It is understood that at it
In his variant embodiment, described bearing 70C can also not have above-mentioned second seat slot 72C, described bearing 72C
Smooth basal surface directly against being loaded on described encapsulation part 11.
In other words, described bearing 70C extends in described through hole 111, and downwardly extends, thus by described
Optical filter 40 is supported in above described sensitive chip 30, and utilizes the space in described through hole 111 so that filter
While mating plate 40 is stably installed, described optical filter 40 will not take space outerpace.
It is noted that the distance that described bearing 70C extends internally is positioned at the photosensitive of described sensitive chip 30
Outside district, say, that described bearing 70C will not block described sensitive chip 30, to avoid impact described
The photo-process of sensitive chip 30, the size of described bearing 70C can design with real needs.
It is different from the 3rd preferred embodiment, described second seat slot 71C and the described peace of described encapsulation
Tankage 113C cooperates, and forms the interface arrangment of coupling, so that what described bearing 70C was stabilized
It is installed in described mounting groove 113C.Relative 3rd preferred embodiment, the described optical filtering in this embodiment
Sheet 40 is less apart from described sensitive chip 30, it is possible to obtain have the described camera module of less back focal length.
In this embodiment of the present utility model and respective drawings, illustrate as a example by dynamic burnt module, institute
Stating camera lens 50 by by being installed on described motor 60, described motor 60 is installed in described bearing 70C.The most just
Being to say, described bearing 70C provides installation site for described optical filter 40 and described motor 60.And at book
In other embodiments of utility model, described camera module can also is that one focuses module.Described camera lens 50 quilt
It is installed on described bearing 70C, say, that described bearing 70C is described optical filter 40 and described camera lens 50
Thering is provided installation site, those skilled in the art is it should be appreciated that the concrete structure of described bearing 70 and institute
The type stating camera module is not restriction of the present utility model.
As shown in Figure 8, it is the shooting based on moulding technology according to the 5th preferred embodiment of the present utility model
Module cross-sectional schematic.Being different from above preferred embodiment, described optical filter 40 is installed in a motor
60D, described motor 60D are installed in described encapsulation part 11, from without providing extra parts to pacify
Fill described optical filter 40.
Described motor 60D includes that a bottom 61D, described bottom 61D are adapted to be mounted to described optical filter
40.It is to say, described camera lens 50 is installed in the upper end of described motor 60D, described optical filter 40 quilt
It is installed on the described bottom 61D of described motor 60D, is positioned at the lower section of described camera lens 50.
In this embodiment of the present utility model, described optical filter 40 is installed in described motor 60D, thus
Need not provide extra parts to install described optical filter 40, and described motor 60D is directly mounted to institute
State encapsulation part 11, provide smooth mounting condition for described motor 60D.
As it is shown in figure 9, be the shooting based on moulding technology according to the 6th preferred embodiment of the present utility model
Module cross-sectional schematic.Being different from above preferred embodiment, described camera lens 50E includes a lens barrel 51E
At least one eyeglass 52E, each described eyeglass 52E are installed in described lens barrel 51E.
According to this embodiment of the present utility model, described optical filter 40 by by being installed in described lens barrel 51E,
It is positioned at the lower section of each described eyeglass 52E, from without providing extra parts to install described optical filter 40.
More specifically, described lens barrel 51E includes that 511E bottom, described bottom 511E are used for installing described filter
Mating plate 40.The base of described lens barrel 51E adapts with the shape of described optical filter 40, say, that described
Base is hollow square structure, in order to be installed on wherein by described optical filter 40.Described lens barrel 51E top
For installing described eyeglass 52E, and the shape of described eyeglass 52E adapts, and bottom is used for installing described filter
Mating plate 40, and adapt with the shape of described optical filter 40, therefore, described lens barrel 51E entirety top is circle
Tubular cylinder, and the inside of bottom is square, and described pipe and described square one connect.
Described motor 60 is installed in described encapsulation part 11, and described optical filter 40 is installed in described lens barrel 51E,
From without providing extra parts to install described optical filter 40.
As shown in Figure 10, it is to take the photograph according to the based on moulding technology of the 7th preferred embodiment of the present utility model
As module cross-sectional schematic.Being different from above preferred embodiment, described circuit board module 10 includes a line
Road plate main body 121F, described wiring board main body 121F has a path 1211F, under described path 1211F
Portion is suitable to install described sensitive chip 30.Each described path makes described wiring board main body 121F upper and lower both sides phase
Connection, thus when described sensitive chip 30 by the back side of described wiring board main body 121F and photosensitive area upward
When being installed on described wiring board main body 121F, the photosensitive area of described sensitive chip 30 is able to receive that by described
The light that camera lens 50 enters.
Further, described wiring board main body 121F has external groove 1212F, described external groove 1212F
It is communicated in the described path of correspondence, it is provided that the installation site of described sensitive chip 30.Especially, when described sense
When optical chip 30 is installed in described external groove 1212F, the outer surface of described sensitive chip 30 and described circuit
The outer surface of plate main body 121F is consistent, is generally aligned in the same plane, thus ensures the surface of described circuit board module 10
Planarization.
In this embodiment of the present utility model, described path is step-like, consequently facilitating install described photosensitive
Chip 30, provides stable installation site for described sensitive chip 30, and makes its photosensitive area represent in interior space.
It is noted that in this embodiment of the present utility model, it is provided that a kind of be different from traditional chip
Mounting means, i.e. flip-chip mode (Flip Chip, FC).By described sensitive chip 30 from described circuit
The direction, the back side of plate main body 121F is installed on described wiring board main body 121F rather than needs as in above-described embodiment
Will be from the front of described wiring board main body 121F, i.e. from the top of described wiring board main body 121F and described
The photosensitive area of sensitive chip 30 is installed on described wiring board main body 121F upward.Such structure and installation
Mode so that described sensitive chip 30 and described encapsulation part 11 are relatively independent, the peace of described sensitive chip 30
Dress will not be affected by described encapsulation part 11, described encapsulation part 11 molded to described sensitive chip
The impact of 30 is the least.Additionally, described sensitive chip 30 is embedded in the lateral surface of described wiring board main body 121F,
And the medial surface of described wiring board main body 121F will not be protruded from, so that described wiring board main body 121F
Inner side reserves bigger space so that the height of described encapsulation part 11 will not be by the height of described sensitive chip 30
Degree limits so that described encapsulation part 11 can reach less height.
It is noted that in this embodiment of the present utility model, described filter is installed in the upper end of described path
Mating plate 40, say, that described optical filter 40 is covered in the described path of described wiring board main body 121F,
Need not be installed on described optical filter 40 described encapsulation part 11, thus greatly reduce described array shooting mould
The back focal length of group, reduces the height of described shooting.Especially, described optical filter 40 can be carried out example is red
Outer edge filter IRCF.It is to say, described optical filter 40 is installed in described wiring board main body 121F,
Without the parts that offer is extra, such as bearing.
If Figure 11 A is to shown in 12, be according to the 8th preferred embodiment of the present utility model based on molding work
The camera module of skill.Being different from above preferred embodiment, described encapsulation part 11 has a mounting groove 113G,
Described mounting groove 113G is communicated in described through hole 111.It is to say, the described top surface of described encapsulation part 11
112G is step-like structure, and is not that one extends.
Further, described camera module includes that a bearing 70G, described bearing 70G are used for installing described optical filtering
Sheet 40.Described bearing 70G is installed in described encapsulation part 11, and described optical filter 40 is installed in described
Seat 70G, described motor 60 or described camera lens 50 are installed in described encapsulation part 11.
Further, described encapsulation part 11 has raised step 114G at least two sides of top side, at least side
Face does not has above-mentioned raised step 114, and forms mounting groove 113G, and described bearing 70G is installed in described
The described mounting groove 113G of encapsulation part 11, and the height of described mounting groove 113G is more than described bearing 70G's
Setting height(from bottom), so that described bearing 70G will not protrude from the top of described encapsulation part 11.Such as, institute
State the big 0.05mm of the height of bearing 70G described in the aspect ratio of mounting groove 113G, thus when described motor 60 quilt
When being installed on described encapsulation part 11, the bottom of described motor 60 will not be directly contacted with described bearing 70G, and
Described camera lens in motor 60 described in mounted also will not be contacted with described bearing 70G.It is noted that
In this embodiment of the present utility model, illustrating as a example by dynamic burnt camera module, described motor is mounted
In described encapsulation part 11, and in other embodiments of the present utility model, described camera module can also is that fixed
Burnt module, described camera lens 50 is installed in described encapsulation part 11, especially, described bearing 70G and described mirror
Lens barrel and the eyeglass of 50 are all not directly contacted with.
It is understood that when described sensitive chip 30 size is relatively big, and when described encapsulation part 11 wall thickness is less,
Above-mentioned design still can make described encapsulation part 11 provide space to install described bearing 70G, thus for peace
Fill described optical filter.As shown in Figure 11 A to Figure 12, the top of described encapsulation part 11 can be three sides
Face forms described raised step 114, and opposite side does not has described raised step 114 to be directly used in described of support
Seat 70G.Cut-away view as illustrated in figure 11A, it can be seen that there is described raised step 114 left and right sides,
It is used for inside it described bearing 70G is installed.And in the other sectional view shown in Figure 11 B, the described encapsulation in left side
The top surface in portion 11 directly supports described bearing 70G, and the inner side of the described raised step 114 on right side is used for
Described bearing 70G is carried out spacing.
And, in this embodiment, the top surface of described raised step 114 can be higher than described bearing 70G
Top surface, the most described motor 60 is mounted on described raised step 114, thus because described encapsulation part 11
Integrally formed, and described motor 60 only described raised step 114 with described encapsulation part 11 contacts, thus
The inclination of described motor can be reduced.
It is noted that described component 122 can not be is arranged in described wiring board main body equably
121, therefore reserved in the described wiring board main body position arranging described encapsulation part 11 is not the right of rule
Title relation, that such as reserves in the side with described component 122 is wider, and does not has described component
The side relative narrower of 122, there is problems of in this case, in the narrower position of described encapsulation part relatively
Difficulty arranges described mounting groove, and in this embodiment of the present utility model, described mounting groove 113G is U-shaped,
It is to say, at the narrower side of described encapsulation part 11, described mounting groove connects 113G and leads in outside, and
Described encapsulation part 11 is wider, and described mounting groove 113G is only communicated in described through hole 111, and outside not being communicated in
Portion's environment, thus form a U-shaped described mounting groove 113G.Described bearing 70G is installed in described peace
Tankage 113G, and stable support can be obtained in the region that described encapsulation part 11 is wider or narrower, thus
Described optical filter 40 is stably mounted.
It is noted that according to an embodiment of the present utility model, the height of described mounting groove 113G is more than
The height of described bearing 70G, therefore in the U-shaped open area of described mounting groove 113G, when described bearing
When 70G is installed in described mounting groove 113G, deposit between described bearing 70G and the side of described motor 60
In gap, therefore in described camera module, by a sealer, described gap is sealed so that described
Sensitive chip 30 is mutually isolated with outside.Especially, in one embodiment, described sealer is colloid.Also
That is, after having assembled described camera module, by described colloid by described bearing in described encapsulation part 11
Seal.
According to this embodiment of the present utility model, described bearing 70G has one first seat slot 71G and
Second seat slot 72G, described first seat slot 71G is used for installing described optical filter 40 so that described optical filtering
The surface of sheet 40 will not protrude from the top of described bearing 70G.Described second seat slot 72G, is used for installing
In described encapsulation part 11, so that described encapsulation part 11 upwardly extends along described bearing 70G, and described optical filtering
The positional of sheet 40 is to downwards, thus reduces the back focal length of described camera module.
In other words, described bearing 70G extends in described through hole 111, and downwardly extends, thus by institute
State optical filter 40 to be supported in above described sensitive chip 30, and utilize the space in described through hole 111 so that
While optical filter 40 is stably installed, described optical filter 40 will not take space outerpace.
It is noted that the distance that described bearing 70G extends internally is positioned at the photosensitive of described sensitive chip 30
Outside district, say, that described bearing 70G will not block described sensitive chip 30, to avoid impact described
The photo-process of sensitive chip 30, the size of described bearing 70G can design with real needs.
It is different from the 3rd preferred embodiment, described second seat slot 71G and the described peace of described encapsulation
Tankage 113G cooperates, and forms the interface arrangment of coupling, so that what described bearing 70G was stabilized
It is installed in described mounting groove 113G.Relative 3rd preferred embodiment, the described optical filtering in this embodiment
Sheet 40 is less apart from described sensitive chip 30, it is possible to obtain have the described camera module of less back focal length.
In this embodiment of the present utility model and respective drawings, illustrate as a example by dynamic burnt module, institute
Stating camera lens 50 by by being installed on described motor 60, described motor 60 is installed in described bearing 70G.The most just
Being to say, described bearing 70C provides installation site for described optical filter 40 and described motor 60.And at book
In other embodiments of utility model, described camera module can also is that one focuses module.Described camera lens 50 quilt
It is installed on described bearing 70G, say, that described bearing 70G is described optical filter 40 and described camera lens 50
There is provided installation site, those skilled in the art it should be appreciated that described bearing 70G concrete structure and
The type of described camera module is not restriction of the present utility model.
In above-described embodiment and accompanying drawing, as a example by dynamic burnt module, illustrate principle of the present utility model, and
In other embodiments of the present utility model, described camera module can also is that and focuses molding, those skilled in the art
Member is it should be appreciated that the type of described camera module is not restriction of the present utility model.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only
It is not limiting as this utility model as an example.The purpose of this utility model is completely and be effectively realized.This
The function of utility model and structural principle are shown the most in an embodiment and illustrate, without departing under described principle,
Embodiment of the present utility model can have any deformation or amendment.
Claims (24)
1. a camera module based on moulding technology, it is characterised in that including:
At least one camera lens；
At least one sensitive chip；With
At least one circuit board module；Wherein said sensitive chip is installed in described circuit board module, and described camera lens is positioned at the photosensitive path of described sensitive chip；Described circuit board module includes a wiring board portion and an encapsulation part, and described encapsulation part is connected to described wiring board portion based on moulding technology integral packaging, and described encapsulation part has a through hole, provides photosensitive path for described sensitive chip.
Camera module the most according to claim 1, wherein said camera module includes that at least one optical filter, described optical filter are installed in described encapsulation part, so that described optical filter is installed with being flattened.
Camera module the most according to claim 2, wherein said encapsulation part has a top surface, and plane earth extends, and described optical filter is installed in described top surface.
Camera module the most according to claim 2, wherein said camera module includes that at least one motor, described camera lens are installed in described motor, and described motor is installed in described encapsulation part.
Camera module the most according to claim 2, wherein said camera lens is installed in described encapsulation part.
Camera module the most according to claim 2, wherein said encapsulation part has a mounting groove, and described mounting groove is communicated in described through hole, and described optical filter is installed in described mounting groove.
Camera module the most according to claim 6, wherein camera module includes that at least one motor, described motor are installed in described encapsulation part.
Camera module the most according to claim 6, wherein said camera lens is installed in described encapsulation part.
Camera module the most according to claim 6, wherein said mounting groove is communicated in outside U-shapedly.
Camera module the most according to claim 9, wherein said camera module includes at least one optical filter, at least one motor and at least one bearing, described optical filter is installed in described bearing, described bearing is installed in described mounting groove, described camera lens is installed in described motor, and described motor is installed in described encapsulation part.
11. camera modules according to claim 9, wherein said camera module includes at least one bearing and at least one optical filter, and described optical filter is installed in described bearing, and described bearing is installed in described mounting groove.
12. camera modules according to claim 1, wherein said camera module includes at least one bearing and at least one optical filter, and described optical filter is installed in described bearing, and described bearing is installed in described encapsulation part.
13. camera modules according to claim 12, wherein said camera module includes that at least one motor, described motor are installed in described bearing.
14. camera modules according to claim 12, wherein said camera lens is installed in described bearing.
15. camera modules according to claim 1, wherein said camera module includes at least one bearing and at least one optical filter, described encapsulation part has a mounting groove, and described bearing is installed in the described mounting groove of described encapsulation part, and described optical filter is installed in described bearing.
16. camera modules according to claim 15, wherein said bearing has one first seat slot and has one second seat slot in the outside of bottom in the inner side at top, described first seat slot is used for installing described optical filter, described second seat slot make described base clip together in described encapsulation part so that the distance of described optical filter and described sensitive chip reduces.
17. camera modules according to claim 1, wherein said camera module includes at least one motor and at least one optical filter, and described optical filter is installed in described motor, and described motor is installed in described encapsulation part.
18. camera modules according to claim 1, wherein said camera module includes that at least one optical filter, described camera lens include that a lens barrel and at least one eyeglass, each described eyeglass are installed in described lens barrel, described optical filter, by by being installed on described lens barrel, is positioned at the lower section of each described eyeglass.
19. camera modules according to claim 1, wherein said camera module includes at least one optical filter, described line part includes a wiring board main body, described encapsulation part integral packaging is connected to described wiring board main body, described wiring board main body has a path, described sensitive chip upside-down mounting is in described path, and described optical filter is covered in the described path of described wiring board main body.
20. according to the arbitrary described camera module of claim 1 to 19, and wherein said encapsulation part integral packaging in the way of injection or mold pressing is connected to described wiring board portion.
21. camera modules according to claim 20, wherein said wiring board portion includes a wiring board main body and at least one component, described component protrudes from described wiring board main body, described encapsulation part is coated with described component, so as not to be exposed to the space connected with described sensitive chip.
22. camera modules according to claim 1, the at least both sides at wherein said encapsulation part top are respectively provided with at least one raised step, a mounting groove is formed inside it, described camera module also includes at least one bearing and at least one optical filter, described bearing is installed on the described mounting groove inside described raised step, and described optical filter is installed on described bearing.
23. camera modules according to claim 22, the top surface of at least side at wherein said encapsulation part top is not provided with described raised step, for supporting described bearing.
24. camera modules according to claim 23, wherein said raised step top surface is higher than the surface of described bearing, and described camera module also includes that a motor, described motor are mounted on described raised step.
Priority Applications (23)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620336842.9U CN205792878U (en) | 2016-04-21 | 2016-04-21 | Camera module based on moulding technology |
| PCT/CN2016/092020 WO2017140092A1 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| JP2018543321A JP6829259B2 (en) | 2016-02-18 | 2016-07-28 | Integrated packaging process-based camera module, its integrated base parts, and how to manufacture them |
| KR1020187026982A KR102282687B1 (en) | 2016-02-18 | 2016-07-28 | Camera module based on integrated packaging process, integrated base part thereof, and manufacturing method thereof |
| US15/999,858 US11877044B2 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof |
| KR1020217023290A KR102465474B1 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| EP16890320.1A EP3419275A4 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| KR1020187033639A KR102152517B1 (en) | 2016-04-21 | 2016-11-18 | Camera module and array camera module based on integrated packaging process |
| JP2018555482A JP6952052B2 (en) | 2016-04-21 | 2016-11-18 | Camera modules and array camera modules based on integrated packaging technology |
| PCT/CN2016/106402 WO2017181668A1 (en) | 2016-04-21 | 2016-11-18 | Camera module and array camera module based on integration packaging process |
| US15/512,065 US10477088B2 (en) | 2016-04-21 | 2016-11-18 | Camera module and array camera module based on integral packaging technology |
| TW106204229U TWM561225U (en) | 2016-04-01 | 2017-03-26 | Integral packaging process-based camera module and integral base component of same |
| TW106110049A TWI648587B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process and integrated base assembly and manufacturing |
| TW108100078A TWI708987B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process and integrated base assembly and manufacturing method thereof |
| TW108100066A TWI743429B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof |
| US15/627,418 US10110791B2 (en) | 2016-04-21 | 2017-06-19 | Camera module and array camera module based on integral packaging technology |
| US15/627,425 US9900487B2 (en) | 2016-04-21 | 2017-06-19 | Camera module and array camera module based on integral packaging technology |
| US15/627,408 US10129452B2 (en) | 2016-04-21 | 2017-06-19 | Camera module and array camera module based on integral packaging technology |
| US15/627,437 US10194064B2 (en) | 2016-04-21 | 2017-06-19 | Array camera module based on integral packaging technology |
| US15/627,429 US9848109B2 (en) | 2016-04-21 | 2017-06-19 | Camera module and array camera module based on integral packaging technology |
| US16/575,357 US11533416B2 (en) | 2016-04-21 | 2019-09-18 | Camera module and array camera module based on integral packaging technology |
| JP2021007710A JP2021073520A (en) | 2016-02-18 | 2021-01-21 | Integral package process base camera module, integral base component thereof, and manufacturing method thereof |
| US17/833,025 US20220303441A1 (en) | 2016-04-21 | 2022-06-06 | Camera module and array camera module based on integral packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620336842.9U CN205792878U (en) | 2016-04-21 | 2016-04-21 | Camera module based on moulding technology |
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| Publication Number | Publication Date |
|---|---|
| CN205792878U true CN205792878U (en) | 2016-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620336842.9U Active CN205792878U (en) | 2016-02-18 | 2016-04-21 | Camera module based on moulding technology |
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| CN105898120A (en) * | 2016-04-21 | 2016-08-24 | 宁波舜宇光电信息有限公司 | Shooting module based on molding technology |
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| US11877044B2 (en) | 2016-02-18 | 2024-01-16 | Ningbo Sunny Opotech Co., Ltd. | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof |
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