CN114520857A

CN114520857A - Camera module and assembling method thereof

Info

Publication number: CN114520857A
Application number: CN202011194732.0A
Authority: CN
Inventors: 张琼; 杨银凯; 曾俊杰; 钱佳敏
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-10-30
Filing date: 2020-10-30
Publication date: 2022-05-20

Abstract

Disclosed are a camera module and an assembling method of the camera module. This module of making a video recording includes: a photosensitive assembly; a lens assembly including a lens carrier mounted on the photosensitive assembly and the optical lens supported within the lens carrier; the photosensitive assembly and the lens assembly are contained in the outer frame, and a preset gap communicated with the outside is formed between the outer frame and the lens carrier; the packaging part of the photosensitive assembly is provided with an air escape channel which is concavely formed on the upper surface of the packaging part, a first port of the air escape channel is extended to and communicated with the closed space, a second port of the air escape channel is extended to the preset gap to be communicated with the preset gap, and the air escape channel and the preset gap form an air escape passage which is communicated with the closed space to the outside. Thus, the camera module can control the balance of the internal and external air pressures in the baking and curing process, and prevent the filter element from being damaged due to pressure unbalance.

Description

Camera module and assembling method thereof

Technical Field

The application relates to the field of camera modules, in particular to a camera module and an assembling method thereof.

Background

The module assembly industry is a precision machining industry, the product quality of which is related to a plurality of factors in the production and processing process, and the quality of the module can be seriously affected if any factor is not controlled within the standard, for example, the control of particles in the production environment, wherein the particles can be understood as dust or dirt in the production environment. If the management and control of particle is not up to standard, very easily cause the module of making a video recording formation of image the bad phenomenon that the blackspot appears, this kind of defect is not allowed, and the module can only scrap the processing or reprocess.

In addition to the effects of particulate matter on module assembly, other environmental factors that are difficult to observe substantially, such as temperature, humidity, and even atmospheric pressure, in the production environment, can affect module production to varying degrees. The air pressure is a special factor among many environmental factors, and is influenced by not only structural factors (the structure of the camera module) but also other environmental factors (such as temperature).

Nowadays, the performance requirements of camera modules are higher and higher, the photosensitive chips are developed towards high pixel and large size, and the areas of the color filters matched with the photosensitive chips are also increased continuously. However, due to the trend of miniaturization of camera modules, the thickness of the color filter is difficult to increase, and if the air pressure is not controlled well during the manufacturing process, the color filter is easily damaged (e.g., cracks or even broken). These technical problems are not only encountered by module manufacturers, but also by some terminal equipment manufacturers during the process of assembling modules into terminal equipment.

Therefore, a feasible solution is needed to solve such technical problems.

Disclosure of Invention

An advantage of the present application is to provide a camera module and an assembling method thereof, wherein the camera module is configured to control an internal and external pressure balance of a photosensitive assembly during a baking and curing stage of an assembling process thereof, so as to prevent a filter element disposed above a package portion from being damaged due to an imbalance of an upper and lower lateral pressures.

Another advantage of the present application is to provide a camera module and a method of assembling a camera module, wherein,

in the structural configuration of the camera module, the packaging part, the lens carrier and the outer frame are matched to form an air escape passage which is communicated with a closed space formed by the photosensitive assembly to the outside, so that the air escape passage controls the balance of the internal and external air pressures of the photosensitive assembly in the baking and curing process of the photosensitive assembly, and the damage of a filter element arranged on the packaging part due to the unbalance of the upper and lower lateral pressures is prevented.

Another advantage of the present application lies in providing a module of making a video recording and an assembly method of the module of making a video recording, wherein, encapsulation portion has an integrative sunken ground and forms the channel of fleing of its top surface, the lens carrier with it communicates in external predetermined clearance to have between the outer frame, flee the channel with it cooperatees and forms the intercommunication to predetermine the clearance airtight space is to external passageway of fleing, with by it toasts the in-process of solidification at its passageway control of fleing the inside and outside atmospheric pressure of photosensitive element is balanced.

Another advantage of the present application is to provide a camera module and an assembling method thereof, wherein the air escape path is designed to allow particles from the outside to deposit when traveling along the air escape path, so as to effectively prevent the particles from entering the interior of the photosensitive assembly. Also, therefore, in the present application, the air escape path need not be closed.

Another advantage of the present application is to provide a camera module and an assembling method thereof, wherein the air escape path does not need to be sealed after being cured by baking, and therefore the airtight space formed by the photosensitive assembly is always communicated with the outside, so as to ensure that the camera module can keep the balance of the internal and external air pressures in the subsequent process. For example, during the process of assembling the camera module in the terminal device or after the camera module is assembled in the terminal device, the air pressure inside and outside the camera module can still be kept balanced by the air escape path, so as to effectively prevent the filter element from being damaged during the process of assembling the camera module in the terminal device or after the camera module is assembled in the terminal device.

Another advantage of the present application is to provide a camera module and an assembling method of the camera module, in which the assembling method of the camera module does not need to perform a process of sealing an air escape hole after a baking and curing process, that is, the process of the assembling method can be reduced to reduce the cost and improve the efficiency.

Other advantages and features of the present application will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

In order to realize above-mentioned at least one advantage, this application provides a module of making a video recording, and it includes:

the photosensitive assembly comprises a circuit board, a photosensitive element electrically connected to the circuit board, a packaging part arranged on the circuit board, and a light filtering element arranged on the packaging part, wherein a closed space is formed among the light filtering element, the circuit board and the packaging part;

a lens assembly including a lens carrier mounted to the encapsulation and the optical lens supported within the lens carrier; and

the photosensitive assembly and the lens assembly are contained in the outer frame, a preset gap is formed between the outer frame and the lens carrier, and the preset gap is communicated with the outside;

the sealing part is provided with an air escape channel which is concavely formed on the upper surface of the sealing part, a first port of the air escape channel is extended to and communicated with the closed space, a second port of the air escape channel, which is opposite to the first port, is extended to the preset gap to be communicated with the preset gap, and in this way, the air escape channel and the preset gap form an air escape passage which is communicated with the closed space to the outside.

In the camera module according to the application, the lower surface of the lens carrier is superposed on the upper surface of the packaging part, and the part of the air escape channel exceeding the preset proportion is covered by the lower surface of the lens carrier.

In the camera module according to the present application, the package portion has a support platform concavely formed on the upper surface, and the filter element is mounted on the support platform.

In the camera module according to the application, the packaging part is a molded packaging part which is integrally formed on the circuit board through a molding process.

In the camera module according to the present application, the inner side wall of the package portion has a gradually expanding shape.

In the camera module according to the present application, the first port is lower than the carrying platform.

In the camera module according to the present application, the second port has a size smaller than that of the other portion of the ventilation channel.

In a camera module according to the present application, the first port and/or the second port has a tapered shape.

In the camera module according to the present application, the air escape channel includes at least one dust blocking portion extending in a turning manner with respect to a direction in which air flows into the air escape channel.

In the camera module according to the present application, the at least one dust blocking portion includes a dust blocking portion extending in a direction perpendicular to a direction in which the gas flows into the second flow channel.

In the camera module according to the application, the air escape channel comprises a plurality of narrow sub-channels and a plurality of wide sub-channels which are alternately arranged.

In the camera module according to the present application, at least one pair of the narrow sub-channels and the wide sub-channels in the narrow sub-channels and the wide sub-channels is transited in a turning manner to form the at least one dust-blocking portion at the transition position of the narrow sub-channels and the wide sub-channels.

In the camera module according to the present application, the lens carrier is a lens holder.

In the camera module according to the present application, the lens carrier is a driving element.

According to another aspect of the present application, there is also provided a method for assembling a camera module, including:

providing a photosensitive assembly, wherein the photosensitive assembly comprises a circuit board, a photosensitive element electrically connected to the circuit board, a packaging part arranged on the circuit board, and a light filtering element arranged on the packaging part, wherein a closed space is formed among the light filtering element, the circuit board and the packaging part, and the packaging part is provided with an air escape channel concavely formed on the upper surface of the packaging part;

attaching a lens carrier to an upper surface of the encapsulation portion by an adhesive, wherein at least a portion of the air escape channel is covered by a lower surface of the lens carrier;

mounting an optical lens in the lens carrier; and

arranging an outer frame accommodating the photosensitive assembly and the lens carrier outside the photosensitive assembly and the lens carrier, wherein a preset gap is formed between the outer frame and the lens carrier, the preset gap is communicated with the outside, a first port of the air escape channel is extended to and communicated with the closed space, a second port of the air escape channel, which is opposite to the first port, is extended to the preset gap to be communicated with the preset gap, and in such a way, the air escape channel and the preset gap form an air escape passage communicating the closed space to the outside; and

curing the adhesive disposed between the lens carrier and the encapsulation, wherein curing the adhesive comprises: and exhausting the gas in the closed space to the outside along an air escape passage formed by the air escape channel and the preset gap so as to keep the air pressure of the upper side and the lower side of the filter element balanced.

In the method for assembling the camera module according to the present application, the air escape channel includes at least one dust blocking portion extending in a zigzag manner with respect to a direction in which air flows into the air escape channel.

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 illustrates an exploded view of a conventional camera module.

Fig. 2 illustrates a schematic diagram of a lens holder in a conventional camera module.

Fig. 3 illustrates a schematic diagram of a camera module according to an embodiment of the present application, wherein the camera module is a fixed-focus camera module.

Fig. 4 illustrates a schematic diagram of a camera module according to an embodiment of the present application, wherein the camera module is a moving focus camera module.

Fig. 5 is a schematic perspective view illustrating a package of a photosensitive assembly of the camera module according to an embodiment of the present application.

FIG. 6 illustrates a partial perspective view of the encapsulant according to an embodiment of the present application.

Figure 7 illustrates yet another partial perspective view of the encapsulant according to an embodiment of the present application.

Figure 8 illustrates a schematic view of a vent channel formed in an upper surface of the enclosure according to an embodiment of the present application.

Figure 9 illustrates a schematic diagram of a variant implementation of the vent channel formed in the upper surface of the encapsulation according to an embodiment of the present application.

Fig. 10 is a schematic diagram illustrating a modified implementation of the camera module according to an embodiment of the present application.

FIG. 11 illustrates an isometric view of a modified implementation of the encapsulant, according to an embodiment of the present application.

FIG. 12 illustrates a flow chart of a method of assembling the photosensitive assembly according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, if the pneumatic control is not performed during the manufacturing process of the camera module, the color filter is easily damaged (e.g., cracks or even broken). The camera module is subjected to a plurality of processes in the preparation process of the camera module, wherein the baking and curing process is closely related to the air pressure pipe.

It should be understood by those skilled in the art that the camera module can be regarded as a rectangular-like structure with a hollow structure on the structural level, and in order to prevent the module from being damaged (especially the color filter) or the module reliability is reduced due to the abrupt change of the air pressure difference between the inside and the outside of the module caused by the baking of the module, an air escape hole is generally formed on the module structure to control the balance of the air pressure between the inside and the outside of the module in the baking and curing process.

Fig. 1 illustrates an exploded view of a conventional camera module. As shown in fig. 1, the camera module, in the order from bottom to top as illustrated in the figure, first includes a circuit board 1P as a mounting substrate; a photosensitive chip 2P is arranged on the photosensitive chip, and the photosensitive chip 2P is electrically connected with the circuit board 1P and is used for imaging; a lens holder 3P is disposed above the photo chip 2P, covering the photo chip 2P, and the lens holder 3P has an optical window at least exposing the photo region of the photo chip to allow external light to reach the photo chip 2P through the optical window; above the lens mount 3P is a color filter 4P, which is attached to the lens mount 3P by an adhesive (e.g., in this example, the lens mount 3P is provided with a mount for mounting the color filter 4P at the edge of its light window, where the color filter 4P is attached by an adhesive); above the lens holder 3P is a lens carrier 5P, and usually the lens carrier 5P is attached to the lens holder 3P by an adhesive; the mount carrier 3P typically has a through hole, hollow and lens-mating, for carrying the optical lens 6P.

It will be appreciated that in a camera module, the connections between the various components are secured by adhesive, thereby forming a relatively sealed and compact overall structure, however, such a relatively closed structure is particularly affected by air pressure during its manufacture, and in particular, the encapsulation between the lens holder 3P, the circuit board 1P and the color filter 4P. Specifically, in the manufacturing process, a closed space is formed among the lens holder 3P, the wiring board 1P, and the color filter 4P, and the gas in the closed space is difficult to flow, and when the temperature changes, the gas expands (or contracts) to cause an imbalance in the gas pressure on the upper side and the lower side of the color filter, and the color filter 4P is damaged. Particularly, in the baking and curing process, the rapid temperature change causes the gas in the sealed space to expand rapidly, so that the color filter 4P is cracked, which is obviously not allowed in the manufacturing process. Therefore, in the conventional camera module and the manufacturing process thereof, the lens holder 3P is provided with the air escape hole 31P (as shown in fig. 2) communicating with the closed space, so that the air in the closed space can be circulated with the outside, thereby controlling the air pressure balance between the upper side and the lower side of the color filter 4P and preventing the color filter from being damaged. Furthermore, the air escape hole is sealed by the adhesive after the baking process is finished, so as to prevent particles from entering the module through the air escape hole (for example, falling onto the photosensitive chip) to cause poor imaging.

However, existing solutions also have a number of disadvantages.

First, in the process of sealing the air escape holes by the adhesive, if the amount of the applied adhesive is not properly controlled, the adhesive may flow into the module along the air escape holes to contaminate the photo chip.

Secondly, after the camera module is baked, cured and formed, the environment of the camera module may be changed, for example, during the process of assembling the camera module in the terminal device or during the process of operating the camera module. When the environmental temperature changes again, the gas sealed in the closed space will expand to burst the color filter. That is, the existing vent solution can only control the air pressure balance inside and outside the primary module, and is not a permanent solution.

It should also be mentioned that, in the existing solution, since the air escape hole needs to be sealed after the baking and curing process, in the existing preparation scheme of the camera module, the photosensitive assembly formed by the circuit board, the photosensitive chip, the lens holder and the color filter must be prepared first, and then the lens carrier and the optical lens assembly are assembled to the photosensitive assembly for baking and curing again, such an assembly scheme would increase the preparation process, thereby increasing the production cost. In other words, in the conventional solution, the baking and curing of the photosensitive element and the baking and curing between the photosensitive element and the optical lens must be performed in two steps, which reduces the assembly efficiency.

To the above technical problem, the basic idea of the present application is to form an air escape path communicating a sealed space formed by the photosensitive assembly to the outside through cooperation formed between the packaging part of the circuit board, the lens carrier and the outer frame, so as to control the inside and outside air pressure balance of the photosensitive assembly in the baking and curing process of the photosensitive assembly through the air escape path, thereby preventing the filter element arranged on the packaging part from being damaged due to the unbalance of the upper and lower lateral pressures. More specifically, the encapsulation portion has a vent channel integrally formed on a top surface thereof in a recessed manner, a preset gap communicated to the outside is provided between the lens carrier and the outer frame, and the vent channel and the preset gap cooperate to form an air escape passage communicating the enclosed space to the outside.

In addition, the air escape passage enables particles from the outside to be deposited when the particles travel along the air escape passage through the path design of the air escape passage, so that the particles are effectively prevented from entering the photosensitive assembly, the air escape passage is not required to be sealed after baking, curing and forming, and therefore, in the subsequent process, for example, when the camera module is assembled in terminal equipment, even if the environmental temperature changes, the air pressure inside and outside the camera module can be kept balanced through the air escape passage, and the filter element of the camera module is effectively prevented from being damaged.

Based on this, this application has proposed a module of making a video recording, and it includes: the photosensitive assembly comprises a circuit board, a photosensitive element electrically connected with the circuit board, a packaging part arranged on the circuit board, and a light filtering element arranged on the packaging part, wherein a closed space is formed among the light filtering element, the circuit board and the packaging part; a lens assembly including a lens carrier mounted to the encapsulant and the optical lens supported within the lens carrier; the photosensitive assembly and the lens assembly are contained in the outer frame, a preset gap is formed between the outer frame and the lens carrier, and the preset gap is communicated with the outside; the packaging part is provided with an air escape channel concavely formed on the upper surface of the packaging part, a first port of the air escape channel is extended to and communicated with the closed space, a second port of the air escape channel, which is opposite to the first port, is extended to the preset gap to be communicated with the preset gap, and in this way, the air escape channel and the preset gap form an air escape passage communicated with the closed space to the outside.

Having described the general principles of the present application, various non-limiting embodiments of the present application will now be described with reference to the accompanying drawings.

Exemplary Camera Module

Fig. 3 illustrates a schematic diagram of a camera module according to an embodiment of the present application. As shown in fig. 3, the camera module according to the embodiment of the present application includes: the image sensor comprises a photosensitive component 10, a lens component 20 retained in a photosensitive path of the photosensitive component 10, and an outer frame 30 for accommodating the photosensitive component 10 and the lens component 20 therein to protect the photosensitive component 10 and the lens component 20. Generally, the lens assembly 20 is attached to the photosensitive assembly 10 by an adhesive to be held on the photosensitive path of the photosensitive assembly 10.

As shown in fig. 3, the lens assembly 20 includes a lens carrier 21 and an optical lens 22, wherein the lens carrier 21 is mounted on the photosensitive assembly 10 (for example, the lens carrier 21 is attached to the photosensitive assembly 10 by an adhesive), and the optical lens 22 is carried in the lens carrier 21. Here, in the camera module as illustrated in fig. 3, the lens carrier 21 is implemented as a lens holder, that is, the camera module is implemented as a fixed focus camera module, and the relative positional relationship between the optical lens 22 and the photosensitive member 10 is kept constant.

Of course, in other examples of the present application, the camera module may also be implemented as other types of camera modules. For example, the camera module may be implemented as a moving focus camera module, i.e., the lens carrier 21 is implemented as a driving element capable of carrying and driving the optical lens 22 to move along a photosensitive path to change the relative positional relationship between the optical lens 22 and the photosensitive assembly 10, as shown in fig. 4. As another example, the camera module may also be implemented as an anti-shake camera module, i.e., the lens carrier 21 is implemented as an anti-shake motor to realize an anti-shake function through the anti-shake motor. For another example, the camera module may further include a prism and other components to form a periscopic camera module.

As shown in fig. 3 and 4, the photosensitive assembly 10 according to the embodiment of the present application includes: the light-sensitive component comprises a circuit board 11, a light-sensitive chip 12, a packaging part 13 and a filter element 14, wherein the circuit board 11 is a mounting substrate of the light-sensitive component 10. As shown in fig. 3 and 4, in the embodiment of the present application, the photosensitive chip 12 is electrically connected to the wiring board 11 through an electrical connection medium such as a lead; the encapsulating portion 13 is disposed on the circuit board 11 to cover the photosensitive chip 12, wherein the encapsulating portion 13 has an optical window 130 at least corresponding to a photosensitive area of the photosensitive chip 12, so as to allow an imaging light from the outside to reach the photosensitive chip 12 through the optical window 130 for an imaging reaction; the filter element 14 is held on the photosensitive path of the photosensitive chip 12 for filtering out the stray light in the imaging light.

More specifically, in the embodiment of the present application, the encapsulating portion 13 is integrally combined with the circuit board 11 through an integral molding process (e.g., a molding process, etc.) and covers at least a portion of the circuit board 11, and preferably, in the embodiment of the present application, at least a portion of at least one electronic component (e.g., 15 in fig. 3 and 4) disposed on the circuit board 11 is covered by the encapsulating portion 13, so that the photosensitive assembly 10 has a more compact structure and a relatively smaller size. The at least one electronic component 15 includes a capacitor, an inductor, a resistor, and the like. It should be noted that in the photosensitive assembly 10 as illustrated in fig. 4, the encapsulating portion 13 encapsulates not only at least a portion of the circuit board 11 but also at least a portion of the non-photosensitive region of the photosensitive Chip 12, that is, in this example, the encapsulating portion 13 is integrally molded On the circuit board 11 by using MOC (Molding On Chip). Of course, in other examples of the present application, the encapsulating portion 13 may be combined with other positions of the circuit board 11, for example, only covers at least a portion of the circuit board 11 and does not cover any region of the photosensitive chip 12, which is not limited in this application.

In particular, it should be noted that, in the embodiment of the present application, as shown in fig. 3 and 4, the encapsulating portion 13 has an air escape channel 131 integrally and concavely formed on the top surface thereof, wherein the air escape channel 131 plays a role of participating in and constructing an air escape passage 200 for communicating the photosensitive assembly 10 to the outside (details will be developed in the following description with respect to the technology).

Further, as shown in fig. 3 and 4, in the embodiment of the present application, the package portion 13 has a supporting platform 139 concavely formed on the upper surface, and the filter element 14 is mounted on the supporting platform 139 by an adhesive. It should be understood that the bearing platform 139 may reduce the installation height of the filter element 14 relative to the package portion 13, and preferably, in the embodiment of the present application, the depth dimension of the bearing platform 139 is greater than the thickness dimension of the filter element 14 and the length and width dimension of the bearing platform 139 is slightly greater than the length and width dimension of the filter element 14, so that the filter element 14 can be fittingly fitted in the bearing platform 139. Moreover, when the filter element 14 is fittingly fitted on the supporting platform 139, the upper surface of the encapsulating portion 13 is higher than the upper surface of the filter element 14, so as to protect the filter element 14.

Of course, in other examples of the present application, the filter element 14 may be directly attached to the upper surface of the encapsulation portion 13 by an adhesive, as shown in fig. 10. That is, in other examples of the present application, the encapsulant 13 may not be configured with the carrier platform 139, or at least a portion of the upper surface of the encapsulant 13 forms a platform for carrying the filter element 14.

It is worth mentioning that in other examples of the present application, the filter element 14 may also be mounted on the upper surface of the encapsulation portion 13 in an indirect manner. For example, in other examples of the present application, a filter element holder (not shown) may be provided, the filter element holder being mounted on the carrying platform 139 or directly on the upper surface of the packaging portion 13, and the filter element 14 being mounted on the filter element holder.

Further, as shown in fig. 3 and 4, in order to prevent the photosensitive assembly 10 and the lens assembly 20 from being exposed to the outside, in the embodiment of the present application, the camera module further includes the outer frame 30 encapsulating the photosensitive assembly 10 and the lens assembly 20 therein. In particular, in the embodiment of the present application, the outer frame 30 and the lens carrier 21 have a predetermined gap 300 therebetween, and the predetermined gap 300 extends upward from the bottom of the lens carrier 21 and is always communicated with the outside. In a specific implementation, the outer frame 30 may be mounted on the circuit board 11 or the outer frame 30 may be combined with a sidewall of the lens carrier 21, which is not limited in this application.

It should be noted that, as shown in fig. 3 and 4, when the filter element 14 is mounted on the carrying platform 139 of the encapsulating portion 13, the circuit board 11, the encapsulating portion 13, and the filter element 14 enclose a closed space 100. Here, the space surrounded by the wiring board 11, the sealing portion 13, and the filter element 14 is defined as a sealed space 100, and this space is relatively sealed only for emphasis, and does not mean that the space is a completely sealed space.

Those skilled in the art will appreciate that the thickness of the filter element 14 (i.e., the color filter in the conventional camera module as described above) is typically between 0.1mm and 0.2mm, and the filter element 14 is a very weak element with respect to its area size. In the process of manufacturing the camera module, the filter element 14 is very easily broken by the influence of external environmental factors, and particularly, in the process of baking and curing, the gas (without a communication mechanism) in the enclosed space 100 rapidly expands to prop open the filter element 14.

In order to avoid the rupture of the filter element 14 due to the unbalanced pressures on the upper and lower sides thereof, in the embodiment of the present application, the image pickup module is provided with an air escape path 200 communicating with the enclosed space 100 to the outside, wherein the air escape path 200 can control the balanced pressure between the inside and outside of the photosensitive assembly 10 during the baking and curing process of the image pickup module (or the photosensitive assembly 10) on one hand, so as to prevent the filter element 14 disposed on the packaging part 13 from being damaged due to the unbalanced pressures on the upper and lower sides thereof; on the other hand, the path of the air escape path 200 is designed to allow particles from the outside to deposit while traveling along the air escape path 200, so as to effectively prevent the particles from entering the inside of the photosensitive assembly 10. Therefore, in the present embodiment, the air escape passage 200 does not need to be closed.

Accordingly, in the present embodiment, the escape passage 200 is formed by the package portion 13, the lens carrier 21, and the outer frame 30. More specifically, the air escape passage 200 is formed by the air escape passage 131 of the package portion 13 fitting a predetermined gap 300 between the lens carrier 21 and the outer frame 30.

As shown in fig. 3 to 7, in the embodiment of the present application, the first port 134 of the air escape channel 131 concavely formed on the upper surface of the sealing portion 13 is extended to and communicated with the sealed space 100, and the second port 135 of the air escape channel 131 opposite to the first port 134 is extended to the predetermined gap 300 to be communicated with the predetermined gap 300, so that the air escape channel 131 and the predetermined gap 300 form an air escape passage 200 communicating the sealed space 100 to the outside. Accordingly, when the lens carrier 21 is attached to the upper surface of the package portion 13, the main body of the air escape channel 131 is shielded by the lens carrier 21 and the second port 135 is not shielded by the lens carrier 21, so that the air in the sealed space 100 can enter the air escape channel 131 through the first port 134 and can be exhausted to the predetermined gap 300 through the second port 135, and further can be exhausted to the outside through the predetermined gap 300 communicated with the outside.

More specifically, as shown in fig. 3 to 7, in the embodiment of the present application, the first port 134 of the air escape channel extends to the position of the carrying platform 139 and is located below the carrying platform 139, and the position setting and extending manner are such that the first port 134 is communicated with the enclosed space 100 of the photosensitive device, so that the air in the enclosed space 100 can be exhausted from the enclosed space 100 through the first port 134 and exhausted to the outside through the air escape passage 200.

It should be noted that, in the embodiment of the present application, when the lower surface of the lens carrier 21 overlaps the upper surface of the encapsulating portion 13, a portion of the air escape channel 131 exceeding a preset ratio is covered by the lower surface of the lens carrier 21, where the preset ratio exceeds 80% of the total length of the air escape channel 131.

Furthermore, in the embodiment of the present application, the air escape path 200 is designed to allow particles from the outside to deposit while traveling along the air escape path 200, so as to effectively prevent the particles from entering the interior of the photosensitive assembly 10, and thus the air escape path 200 does not need to be closed after the photosensitive assembly is baked and cured. Moreover, the path design of the air escape path 200 by itself can also effectively prevent particles from flowing into the sealed space 100 to cause the photosensitive chip 12 to be polluted. More specifically, in the embodiment of the present application, when considering the self-path design of the air escape path 200, two factors are mainly considered: flow channel shape and flow channel length.

Specifically, as shown in fig. 3 to 8, the air escape passage 13 is bent and extended between the first port 134 and the second port 135 thereof, in such a manner as to extend the flow path length of the air escape passage 131.

Of course, in other examples of the present application, the length of the flow path of the air escape path 200 may be extended by other means. For example, two ports 134,135 of the air escape channel 131 are respectively disposed at two adjacent sides of the packaging part 13, that is, the first port 134 of the air escape channel 131 is located at a first side of the packaging part 13, and the second port 135 of the air escape channel 131 extends from the first port 134 to a second side of the packaging part 13 adjacent to the first side. For another example, two ports 134,135 of the air escape channel 131 can be respectively disposed at two opposite sides of the packaging part 13, the first port 134 of the air escape channel 131 is located at a first side of the packaging part 13, and the second port 135 of the air escape channel 131 extends from the first port 134 and passes through a second side adjacent to the first side to a third side of the packaging part 13 opposite to the first side. For another example, the air escape channel 131 extends along the circumferential direction of the enclosure 13, for example, the first port 134 of the air escape channel 131 is located at the first side of the enclosure 13, and the second port 135 of the air escape channel 131 extends from the first port 134 along the circumferential direction set by the enclosure 13 and returns to the first side, as shown in fig. 11. And are not intended to limit the scope of the present application.

In terms of the flow channel shape, as shown in fig. 3 to 8, in the present embodiment, the air escape channel 131 includes a plurality of narrow sub-channels 133 and a plurality of wide sub-channels 132, and as the name suggests, in the present embodiment, the flow channel width of the wide sub-channels 132 is greater than the flow channel width of the narrow sub-channels 133. Also, in the present embodiment, the plurality of narrow sub-lanes 133 and the plurality of wide sub-lanes 132 are alternately disposed with each other such that the air escape passage 131 has a continuous serpentine structure, or the air escape passage 131 has a continuous multi-segment structure.

In some embodiments of the present invention, the first port 134 communicated with the enclosed space 100 is formed by the narrow sub-channel 133, and/or the second port 135 communicated with the predetermined gap 300 is formed by the narrow sub-channel 133, so that the first port 134 and the second port 135 have relatively smaller apertures to achieve a better dustproof effect. Preferably, in the embodiment of the present application, the size of the second port 135 and/or the first port 134 is smaller than that of other parts of the ventilation channel 131, as shown in fig. 9, that is, after the air escape channel 131 is covered by the lens carrier 21, the air escape channel 131 only leaves an air outlet hole (or an air inlet) with a minimum size for air exchange, so that a better dust-proof effect can be achieved.

To further provide better dust protection, in the present embodiment, the first port 134 and/or the second port 135 have a tapered shape. It should be appreciated that a sharp flow path size change is more conducive to gas deceleration and particle deposition.

Further, in the embodiment of the present application, as shown in fig. 8 and 9, a transition is made between at least one pair of the narrow sub-tracks 133 and the wide sub-tracks 132 in a turning manner to form at least one dust blocking portion 201 at the transition. That is, in the embodiment of the present application, the flow channel of the air escape channel 131 has a non-linear flow channel design to form the at least one dust blocking portion 201 at the turning point of the flow channel.

In a specific example of the present application, at least one pair of the narrow sub-tracks 133 and the wide sub-tracks 132 in the plurality of narrow sub-tracks 133 and the plurality of wide sub-tracks 132 forms a predetermined included angle therebetween, so as to form the dust blocking portion 201 at a turning point corresponding to the wide sub-tracks 132 and the narrow sub-tracks 133. For example, in the example illustrated in fig. 8 and 9, the predetermined included angle includes a 90-degree included angle, and it should be understood that when the predetermined included angle is 90-degree included angle, the extending direction of the dust-blocking portion 201 is perpendicular to the direction in which the gas flows into the gas escape channel 131, and by such a shape configuration, the dust-blocking portion 201 can achieve a better dust-proof effect. Of course, in other examples of the present application, the dust-proof portion 201 can extend in other manners relative to the direction of the gas flowing into the gas-escaping channel 131, for example, the at least one dust-proof portion 201 includes a dust-proof portion 201 extending in a curved manner relative to the direction of the gas flowing into the gas-escaping channel 131, which is not limited by the present application.

Further, as shown in fig. 8 and 9, in the embodiment of the present application, a plurality of pairs of narrow sub-channels 133 and wide sub-channels 132 in the plurality of narrow sub-channels 133 and the plurality of wide sub-channels 132 are transitioned in a turning manner, so that the ambient gas turns around in the air escape channel 131 (i.e., the air flow channel is not smooth but turns around repeatedly) during the process of flowing through the air escape channel 131 from the second port 135 to the air escape channel 131, and the ambient gas is forced to collide and decelerate at the turning corners (i.e., the dust blocking portion 201) so that the particles carried by the ambient gas are fully deposited in the air escape channel 131. In addition, the air escape channel 131 has different flow channel widths at different positions, so as to further restrict the flow velocity of the external air through the different flow channel widths, thereby achieving a better dustproof effect. Moreover, the multi-stage structure of the air escape channel 131 has a multi-turn path design to form the at least one dust-proof portion 201 at the corresponding turn, wherein the extending direction of the at least one dust-proof portion 201 is not consistent with the direction of the air flowing into the air escape channel 131, so that when the external air with particles flowing into the photosensitive assembly 10 through the air escape channel 200, the at least one dust-proof portion 201 can effectively slow down the flow of the external air and deposit the particles on the dust-proof portion 201, thereby effectively preventing the particles from entering the photosensitive assembly 10.

Of course, the multi-section structure of the air escape channel 131 can also extend the length of the channel, so as to increase the difficulty of the external air flowing into the interior of the photosensitive assembly 10 (because the required energy is larger).

It should be noted that, in the embodiment of the present application, in order to further enhance the dust-proof effect in the reflow, a certain amount of adhesive may be further disposed inside the air escape channel 131 to adhere some particles in the external air through the adhesive, so as to further effectively prevent the particles from entering the interior of the photosensitive assembly 10 and causing the photosensitive chip 12 to be contaminated. Preferably, in the embodiment of the present application, the adhesive 16 is disposed on the inner surface of the wide portion sub-flow passage to form a dust-catching glue, so that the dust-catching glue can adhere particles therein during the process of the gas with the particles entrained therein flowing back to the inside of the photosensitive assembly 10 to prevent the particles from contaminating the photosensitive chip 12.

It should be noted that, in the embodiment of the present application, the shapes of the narrow sub-tracks 133 and the wide sub-tracks 132 are not limited to the present application, and may be implemented as a rectangle, a circle, etc. Of course, the positions and sizes of the narrow sub-tracks 133 and the wide sub-tracks 132 can be adjusted, and the application is not limited thereto.

In summary, the image pickup module and the photosensitive element 10 thereof according to the embodiment of the present application are illustrated, the sealing portion 13 formed on the circuit board 11, the lens carrier 21 mounted on the sealing portion 13, and the outer frame 30 cooperate to form the air escape path 200 communicating the sealed space 100 formed by the photosensitive element 10 to the outside, so as to control the internal and external air pressure balance of the photosensitive element 10 during the adhesive curing process through the air escape path 200, so as to prevent the filter element 15 disposed on the sealing portion 13 from being damaged due to the imbalance of the upper and lower lateral pressures. More specifically, the package portion 13 has an air escape channel 131 integrally formed on the top surface thereof in a recessed manner, and the lens carrier 21 and the outer frame 30 have a predetermined gap 300 therebetween, and when the lens carrier is mounted on the package portion 13, the air escape channel 131 and the predetermined gap 300 cooperate to form an air escape passage 200 communicating the enclosed space 100 to the outside. Moreover, the air escape path 200 is designed to allow particles from the outside to be deposited when the particles travel along the air escape path, so as to effectively prevent the particles from entering the interior of the photosensitive element 10, and thus the air escape path 200 does not need to be sealed after baking, curing and molding, and therefore, in the subsequent process, for example, when the camera module is assembled in a terminal device, even if the environmental temperature changes, the air pressure inside and outside the module can still be kept balanced by the air escape path 200, so as to effectively prevent the filter element 14 of the camera module from being damaged.

Assembling method of exemplary camera module

According to another aspect of the present application, a method for assembling a photosensitive assembly is also provided.

As shown in fig. 12, the assembly process of the photosensitive assembly 10 according to the embodiment of the present application includes: s110, providing a photosensitive assembly 10, where the photosensitive assembly 10 includes a circuit board 11, a photosensitive element 12 electrically connected to the circuit board 11, an encapsulation portion 13 disposed on the circuit board 11, and a filter element 14 mounted on the encapsulation portion 13, where a closed space 100 is formed among the filter element 14, the circuit board 11, and the encapsulation portion 13 has an air escape channel 131 concavely formed on an upper surface thereof; s120, attaching a lens carrier 21 to the upper surface of the package portion 13 by an adhesive, wherein at least a portion of the air escape channel 131 is covered by the lower surface of the lens carrier 21; s130, mounting an optical lens 22 in the lens carrier 21; s140, disposing an outer frame 30 for accommodating the photosensitive element 10 and the lens carrier 21 outside the photosensitive element 10 and the lens carrier 21, wherein a predetermined gap 300 is formed between the outer frame 30 and the lens carrier 21, the predetermined gap 300 is communicated with the outside, a first port 134 of the air escape channel 131 is extended to and communicated with the enclosed space 100, and a second port 135 of the air escape channel 131 opposite to the first port 134 is extended to the predetermined gap 300 to be communicated with the predetermined gap 300, so that the air escape channel 131 and the predetermined gap 300 form an air escape passage 200 for communicating the enclosed space 100 with the outside; and S150, curing the adhesive disposed between the lens carrier 21 and the encapsulation portion 13, wherein the process of curing the adhesive includes: the air escape passage 200 formed along the air escape passage 131 and the predetermined gap 300 exhausts the air in the enclosed space 100 to the outside, so that the air pressure on the upper and lower sides of the filter element 14 is kept balanced.

In particular, in the embodiment of the present application, the air escape path 200 enables particles from the outside to be deposited when traveling along the air escape path 200 through its own path design, so as to effectively prevent the particles from entering the interior of the photosensitive element 10, and thus the air escape path 200 does not need to be sealed after baking, curing and molding, and therefore, in the subsequent process, for example, when the camera module is assembled in a terminal device, even if the ambient temperature changes, the air pressure inside and outside the camera module can be kept balanced by the air escape path 200, so as to effectively prevent the filter element 14 of the camera module from being damaged.

In one example, in an assembly method according to the present application, the air escape passage 131 includes at least one dust blocking portion 201 extending inflected in a direction opposite to a direction in which air flows into the air escape passage.

In summary, the assembling method of the camera module according to the embodiment of the present application is illustrated, in which the sealing portion 13 formed on the circuit board 11, the lens carrier 21 mounted on the sealing portion 13, and the outer frame 30 are matched to form the air escape path 200 for communicating the sealed space 100 formed by the photosensitive element 10 to the outside, so as to control the internal and external air pressure balance of the photosensitive element 10 during the curing process of the adhesive thereof through the air escape path 200, thereby preventing the filter 1415 disposed on the sealing portion 13 from being damaged due to the imbalance of the upper and lower lateral pressures. More specifically, the package portion 13 has an air escape channel 131 integrally formed on the top surface thereof in a recessed manner, and the lens carrier 21 and the outer frame 30 have a predetermined gap 300 therebetween, and when the lens carrier 21 is attached to the package portion 13, the air escape channel 131 and the predetermined gap 300 cooperate to form an air escape passage 200 communicating the enclosed space 100 to the outside. Moreover, the air escape path 200 enables particles from the outside to be deposited when traveling along the air escape path 200 through its own path design, so as to effectively prevent the particles from entering the interior of the photosensitive assembly 10, and thus the air escape path 200 does not need to be closed after baking, curing and molding, and therefore, in the subsequent process, for example, when the camera module is assembled in a terminal device, even if the ambient temperature changes, the air pressure inside and outside the module can still be balanced by the air escape path 200, so as to effectively prevent the filter element 14 of the camera module from being damaged.

It should be noted that the air escape path 200 does not need to be closed after baking and curing, and therefore, the enclosed space 100 formed by the photosensitive assembly 10 is always communicated with the outside, so as to ensure that the photosensitive assembly 10 can keep balance of internal and external air pressures in the subsequent process. For example, during the process of assembling the camera module into the terminal device or after the camera module is assembled into the terminal device, the air pressure inside and outside the camera module can still be balanced by the air escape path 200, so as to effectively prevent the filter element 14 from being damaged during the process of assembling the camera module into the terminal device or after the camera module is assembled into the terminal device.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. The utility model provides a module of making a video recording which characterized in that includes:

the packaging part is provided with an air escape channel concavely formed on the upper surface of the packaging part, a first port of the air escape channel is extended to and communicated with the closed space, a second port of the air escape channel, which is opposite to the first port, is extended to the preset gap to be communicated with the preset gap, and in this way, the air escape channel and the preset gap form an air escape passage communicated with the closed space to the outside.

2. The camera module according to claim 1, wherein a lower surface of the lens carrier is superposed on an upper surface of the package portion, and a portion of the air escape passage exceeding a preset proportion is covered by the lower surface of the lens carrier.

3. The camera module according to claim 1, wherein the package portion has a support platform concavely formed on the upper surface, the filter element being mounted on the support platform.

4. The camera module of claim 3, wherein the encapsulant is a molded encapsulant integrally formed with the circuit board by a molding process.

5. The camera module of claim 4, wherein the interior sidewall of the enclosure portion has a diverging shape.

6. The camera module of claim 4, wherein the first port is lower than the load-bearing platform.

7. The camera module of claim 1, wherein the second port is smaller in size than other portions of the vent channel.

8. The camera module of claim 1, wherein the first port and/or the second port has a tapered shape.

9. The camera module of claim 1, wherein the air escape passage comprises at least one dust shield extending in a direction opposite to the direction of air flow into the air escape passage.

10. The camera module of claim 9, wherein the at least one dust guard comprises a dust guard extending in a direction perpendicular to the direction of gas flow into the second flow channel.

11. The camera module of claim 9, wherein the air escape passage comprises a plurality of narrow sub-passages and a plurality of wide sub-passages alternately arranged with each other.

12. The camera module of claim 11, wherein at least one pair of the narrow sub-tracks and the wide sub-tracks is turned to form the at least one dust-blocking portion at the transition.

13. The camera module of claim 1, wherein the lens carrier is a lens holder.

14. The camera module of claim 1, wherein the lens carrier is a drive element.

15. An assembling method of a camera module is characterized by comprising the following steps:

mounting an optical lens in the lens carrier; and

16. The method of assembling a camera module of claim 15, wherein the air escape channel includes at least one dust guard extending inflected in a direction opposite to a direction in which air flows into the air escape channel.