CN111315141B - Method for manufacturing explosion-proof plate of thick plate and thick copper plate, thick plate and thick copper plate - Google Patents
Method for manufacturing explosion-proof plate of thick plate and thick copper plate, thick plate and thick copper plate Download PDFInfo
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- CN111315141B CN111315141B CN202010208538.7A CN202010208538A CN111315141B CN 111315141 B CN111315141 B CN 111315141B CN 202010208538 A CN202010208538 A CN 202010208538A CN 111315141 B CN111315141 B CN 111315141B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing an explosion-proof plate of a thick plate and a thick copper plate, and the thick plate and the thick copper plate, wherein the method comprises the following steps: before drilling holes on the production plate after the pressing process is finished, baking the production plate; drilling holes on the production plate; continuously baking the production plate after drilling; then carrying out copper deposition, full-board electroplating and outer-layer circuit manufacturing on the production board, and then baking the production board before resistance welding; and finally, sequentially carrying out solder mask layer manufacturing, surface treatment and forming procedures on the production plate to obtain a thick plate or a thick copper plate. The method can effectively reduce the problem of abnormal plate explosion in the production process, improve the qualification rate and reduce the production cost.
Description
Technical Field
The invention relates to the technical field of manufacturing of printed circuit boards, in particular to a manufacturing method of an explosion-proof board of a thick plate and a thick copper plate, and the thick plate and the thick copper plate.
Background
At present, the process of manufacturing a platform on a printed circuit board is as follows: forming an inner layer plate through cutting, inner layer pattern transfer and etching; pressing the inner layer plates to form a multilayer plate; and then drilling, copper deposition, full-board electroplating, outer-layer pattern electroplating, outer-layer etching and solder resist coating are carried out on the multilayer board to form a multilayer circuit board with an outer-layer circuit, and finally, the multilayer circuit board is subjected to surface treatment and molding, and finally, the finished product is obtained through final inspection and the like.
When a thick plate with the thickness of more than 5.0mm or a thick copper plate with the thickness of 4OZ of inner layer copper is produced and manufactured by the existing method, the problem that the inner layer has abnormal plate explosion is often detected in a shipment test, the qualification rate is influenced, and the plate scrap caused by the plate explosion increases the production cost.
Disclosure of Invention
Aiming at the problem that the existing step plate has the defects, the invention provides the method for manufacturing the explosion-proof plate of the thick plate and the thick copper plate, and the method can effectively reduce the problem of abnormal plate explosion in the production process, improve the qualification rate and reduce the production cost.
In order to solve the technical problems, the invention provides a method for manufacturing an explosion-proof board of a thick plate and a thick copper plate, which is used for manufacturing a circuit board with the thickness of more than or equal to 5mm or the thickness of copper on the inner layer of more than or equal to 4OZ and comprises the following steps:
s1, before drilling holes on the production board after the pressing process is completed, baking the production board;
s2, drilling holes on the production plate;
s3, continuously baking the production board after drilling;
s4, performing copper precipitation, full-board electroplating and outer-layer circuit manufacturing on the production board, and baking the production board before solder resistance;
and S5, finally, sequentially carrying out solder mask layer manufacturing, surface treatment and forming procedures on the production board to obtain a thick plate or a thick copper plate.
Further, in steps S1, S3 and S4, the baking temperature is 180 ℃ and the baking time is 2 h.
Further, step S1 is preceded by the following steps:
s01, cutting the core board, the PP sheet and the outer layer copper foil according to the size required by production;
s02, manufacturing an inner layer circuit on the core board;
s03, firstly carrying out brown oxidation treatment on the core board, then sequentially overlapping the core board, the PP sheet and the outer layer copper foil according to requirements, and then pressing to form the production board.
Further, in step S01, after the core board is cut, the core board is baked at 180 ℃ for 4 hours.
Further, in step S03, after the core board is browned, the core board is baked for 2 hours at 110 ℃, and then the core board, the PP sheet and the outer copper foil are sequentially laminated and pressed.
Further, in step S03, when the thickness of the laminated production board is greater than or equal to 5mm, the baking is performed in ten stages:
the first stage is as follows: baking at 140 deg.C and 100Psi for 5 min;
and a second stage: baking at 140 deg.C and 200Psi for 10 min;
and a third stage: baking at 160 deg.C and 300Psi for 10 min;
a fourth stage: baking at 170 deg.C and 380Psi for 10 min;
the fifth stage: baking at 195 deg.C and 380Psi for 10 min;
the sixth stage: baking at 210 deg.C and 380Psi for 25 min;
a seventh stage: baking at 195 deg.C and 380Psi for 10 min;
an eighth stage: baking at 195 deg.C and 380Psi for 60 min;
the ninth stage: baking at 180 deg.C and 200Psi for 20 min;
the tenth stage: baking at 140 deg.C and 200Psi for 10 min.
Further, in step S2, when drilling on the production board, the rotation speed of the drill is controlled at 39-70kr/min, the feed speed is 20-30mm/sec, the withdrawal speed is 200-300mm/sec, and the limit drilling frequency of each drill is controlled within 800, and a new drill needs to be replaced when the drilling frequency of the drill reaches the upper limit.
Further, in step S03, when the inner layer copper thickness of the produced board is greater than or equal to 4OZ, the baking is divided into nine stages:
the first stage is as follows: baking at 140 deg.C and 100Psi for 10 min;
and a second stage: baking at 140 deg.C and 200Psi for 10 min;
and a third stage: baking at 160 deg.C and 250Psi for 10 min;
a fourth stage: baking at 195 deg.C and 360Psi for 20 min;
the fifth stage: baking at 210 deg.C and 360Psi for 25 min;
the sixth stage: baking at 195 deg.C and 360Psi for 10 min;
a seventh stage: baking at 195 deg.C and 360Psi for 60 min;
an eighth stage: baking at 180 deg.C and 300Psi for 15 min;
the ninth stage: baking at 140 deg.C and 200Psi for 10 min.
Further, in step S2, when drilling holes on the production board, the rotation speed of the drill bit is controlled at 30kr/min, the feed speed is 20mm/sec, the withdrawal speed is 150mm/sec, and the limit drilling frequency of each drill bit is controlled within 600, and a new drill bit needs to be replaced when the drilling frequency of the drill bit reaches the upper limit.
Also provided is a thick plate and a thick copper plate manufactured by the method for manufacturing an explosion-proof plate of a thick plate or a thick copper plate according to any one of claims 1 to 9.
Compared with the prior art, the invention has the following beneficial effects:
in the process of manufacturing the thick plate or the thick copper plate, the production plate is baked before and after drilling and before resistance welding, so that the problem of layered plate explosion caused by pressing and drilling before and after drilling and the problem of layered plate explosion caused by liquid medicine scouring in the process of manufacturing an outer layer circuit can be effectively solved; by optimizing the pressing parameters, the problem of layered board explosion caused by pressing is further reduced, the qualification rate is improved, and the production cost is reduced; drilling parameters are optimized for the thick plate and the thick copper plate respectively, and the problem of layered plate explosion caused by drill bit impact force during drilling is further reduced.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The method for manufacturing the circuit board with the plate thickness of more than or equal to 5mm, which is shown in the embodiment, sequentially comprises the following processing steps:
(1) cutting: cutting a core plate, a PP sheet and an outer copper foil according to the size of the jointed board of 320mm multiplied by 420mm, wherein the thickness of the core plate is 0.15mm (the thickness is the thickness without copper), and the thickness of the outer copper surface of the core plate is 1 OZ; the core plate is made of a joint IT180A plate material.
(2) And baking: and (3) baking the core plate for 4 hours at 180 ℃, completely melting the resin in the core plate through baking, better solidifying the core plate, releasing the stress in the plate and ensuring the dimensional stability of the core plate.
(3) And manufacturing an inner layer circuit (negative film process): coating a photosensitive film on the core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of an inner layer circuit by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching an inner layer circuit on the exposed and developed core plate, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(4) And brown oxidation: firstly, performing brown oxidation treatment on a core plate, wherein the brown oxidation speed is brown according to the thickness of copper at the bottom; and (3) baking the core plate for 2 hours at 110 ℃ after the browning, and drying residual moisture in the gaps to prevent layering and plate explosion during pressing.
(5) And pressing: sequentially overlapping a plurality of core plates, PP sheets and outer copper foils according to requirements (the specific overlapping sequence is sequentially outer copper foils, PP sheets, core plates, PP sheets … core plates, PP sheets and outer copper foils), and selecting proper laminating conditions to carry out pressing according to the characteristics of the plates to form a production plate, wherein the thickness of the outer copper foil is 1.5 OZ; the specific pressing parameters are shown in the following table:
(6) and baking, namely baking the production plate at 180 ℃ for 2h, wherein the dielectric layer in the production plate is in a preliminary melting state through baking, and the dielectric layer has certain fluidity after preliminary melting, so that the lamination, cracks and the like caused by lamination can be well filled through the baking, the problem of lamination and plate explosion is reduced, the production plate can be better solidified, the stress in the plate is continuously released, and the dimensional stability of the production plate is ensured.
(7) The outer layer is drilled, namely, the drilling data are utilized to drill holes on the production plate, and in the embodiment, the impact force of a drill bit on the inner layer of the production plate can be effectively reduced by optimizing the drilling parameters during drilling, so that the problem of layered plate explosion caused by drilling is reduced; for different apertures, the drilling parameters used in the prior art and the drilling parameters optimized in this embodiment are shown in the following table:
(8) and baking, namely baking the production plate at 180 ℃ for 2h, wherein the dielectric layer in the production plate is in a preliminary melting state through baking, and the dielectric layer has certain fluidity after preliminary melting, so that the delamination, cracks and the like caused by the impact force of a drill bit during drilling can be well filled through the baking, the problem of delamination and plate explosion is reduced, the stress in the plate is continuously released, and the dimensional stability of the production plate is ensured.
(9) And depositing copper, namely metalizing the holes on the production board, and testing the backlight to 10 levels, wherein the thickness of the deposited copper in the holes is 0.5 mu m.
(10) And electroplating the whole plate: the plate was electroplated for 20min at a current density of 1.8 ASD.
(11) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; and (3) outer layer pattern electroplating, then respectively plating copper and tin on the production plate, wherein the copper plating is carried out for 60min by using a current density of 1.8ASD, the tin plating is carried out for 10min by using a current density of 1.2ASD, the tin thickness is 3-5 mu m, then sequentially stripping, etching and stripping the tin, etching an outer layer circuit and an outer layer AOI on the production plate, then checking the defects of the outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, carrying out defective scrapping treatment, and discharging the product without defects to the next process.
(12) And baking, namely baking the production plate at 180 ℃ for 2 hours, removing water on the production plate by baking, and enabling the dielectric layer in the production plate to be in a preliminary melting state, wherein the dielectric layer has certain fluidity after preliminary melting, so that the problem of layered plate explosion caused by liquid medicine scouring in the process of manufacturing an outer layer circuit can be effectively reduced by baking, the stress in the plate is continuously released, and the dimensional stability of the production plate is ensured.
(13) Solder resist and silk screen printing of characters: according to the prior art and according to design requirements, a solder mask is made on a production board and characters are silk-screened.
(14) And surface treatment: according to the prior art and the chemical principle of copper surface communication at the position of the solder mask windowing according to the design requirements, nickel and gold with certain required thickness are uniformly deposited.
(15) And forming: according to the prior art and according to the design requirement, the shape is milled to manufacture the circuit board with the thickness of more than or equal to 5 mm.
(16) And electrical performance testing: detecting the electrical performance of the circuit board, and enabling the qualified circuit board to enter the next processing link; the method specifically comprises the following tests:
a. TG test: testing the TG value by referring to an IPC-TM-650TG test standard method, wherein the TG is more than or equal to 170 ℃, and the delta TG is less than or equal to 5 ℃ to be qualified, otherwise, the TG is not qualified.
b. Reflow, thermal shock test (thermal stability test): taking a test plate sample, baking the test plate at 125 ℃ for 4H according to the requirement of the IPC TM-650 heat resistance test, and then testing thermal stress (solder bleaching 288 ℃ 10S 3 times) and reflow soldering (290 ℃ 3 times) to test the heat resistance; the specific test results are shown in the following table (the test results of baking or not baking the board before and after drilling and before and after solder mask corresponding to drilling parameter optimization are given in the table):
analysis by the test results described above: 1. reflow soldering is carried out for 3 times, whether the board is baked or not and whether drilling parameters are optimized or not, and all board test results are qualified; 2. after the baking plate is tested for 3 times by thermal stress, the test result is qualified no matter whether the drilling parameters are optimized or not; 3. the sample without the baking plate is tested by the thermal stress for 3 times, and the heat resistance of the sample after the drilling parameters are optimized is slightly improved compared with the heat resistance of the original drilling parameters.
(17) And final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
Example 2
The manufacturing method of the thick copper plate with the inner copper thickness not less than 4OZ shown in the embodiment sequentially comprises the following processing procedures:
(1) cutting: cutting a core plate, a PP sheet and an outer copper foil according to the size of the jointed board of 320mm multiplied by 420mm, wherein the thickness of the core plate is 0.11mm (the thickness is the thickness without copper), and the thickness of the outer copper surface of the core plate is 4 OZ; the core plate is made of a joint IT180A plate material.
(2) And baking: and (3) baking the core plate for 4 hours at 180 ℃, completely melting the resin in the core plate through baking, better solidifying the core plate, releasing the stress in the plate and ensuring the dimensional stability of the core plate.
(3) And manufacturing an inner layer circuit (negative film process): coating a photosensitive film on the core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of an inner layer circuit by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching an inner layer circuit on the exposed and developed core plate, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(4) And brown oxidation: firstly, performing brown oxidation treatment on a core plate, wherein the brown oxidation speed is brown according to the thickness of copper at the bottom; and (3) baking the core plate for 2 hours at 110 ℃ after the browning, and drying residual moisture in the gaps to prevent layering and plate explosion during pressing.
(5) And pressing: sequentially overlapping a plurality of core plates, PP sheets and outer copper foils according to requirements (the specific overlapping sequence is sequentially outer copper foils, PP sheets, core plates, PP sheets … core plates, PP sheets and outer copper foils), and selecting proper laminating conditions to perform pressing according to the characteristics of the plates to form a production plate, wherein the thickness of the outer copper foil is 3 OZ; the specific pressing parameters are shown in the following table:
(6) and baking, namely baking the production plate at 180 ℃ for 2h, wherein the dielectric layer in the production plate is in a preliminary melting state through baking, and the dielectric layer has certain fluidity after preliminary melting, so that the lamination, cracks and the like caused by lamination can be well filled through the baking, the problem of lamination and plate explosion is reduced, the production plate can be better solidified, the stress in the plate is continuously released, and the dimensional stability of the production plate is ensured.
(7) The outer layer is drilled, namely, a through hole with the aperture of 2.05mm is drilled on the production plate by using the drilling data, and in the embodiment, the impact force of a drill bit on the inner layer of the production plate can be effectively reduced by optimizing the drilling parameters during drilling, so that the problem of layered plate explosion caused by drilling is reduced; the drilling parameters used in the prior art and the drilling parameters optimized in this embodiment are shown in the following table:
(8) and baking, namely baking the production plate at 180 ℃ for 2h, wherein the dielectric layer in the production plate is in a preliminary melting state through baking, and the dielectric layer has certain fluidity after preliminary melting, so that the delamination, cracks and the like caused by the impact force of a drill bit during drilling can be well filled through the baking, the problem of delamination and plate explosion is reduced, the stress in the plate is continuously released, and the dimensional stability of the production plate is ensured.
(9) And depositing copper, namely metalizing the holes on the production board, and testing the backlight to 10 levels, wherein the thickness of the deposited copper in the holes is 0.5 mu m.
(10) And electroplating the whole plate: the plate was electroplated for 20min at a current density of 1.8 ASD.
(11) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; and (3) outer layer pattern electroplating, then respectively plating copper and tin on the production plate, wherein the copper plating is carried out for 60min by using a current density of 1.8ASD, the tin plating is carried out for 10min by using a current density of 1.2ASD, the tin thickness is 3-5 mu m, then sequentially stripping, etching and stripping the tin, etching an outer layer circuit and an outer layer AOI on the production plate, then checking the defects of the outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, carrying out defective scrapping treatment, and discharging the product without defects to the next process.
(12) And baking, namely baking the production plate at 180 ℃ for 2 hours, removing water on the production plate by baking, and enabling the dielectric layer in the production plate to be in a preliminary melting state, wherein the dielectric layer has certain fluidity after preliminary melting, so that the problem of layered plate explosion caused by liquid medicine scouring in the process of manufacturing an outer layer circuit can be effectively reduced by baking, the stress in the plate is continuously released, and the dimensional stability of the production plate is ensured.
(13) Solder resist and silk screen printing of characters: according to the prior art and according to design requirements, a solder mask is made on a production board and characters are silk-screened.
(14) And surface treatment: according to the prior art and the chemical principle of copper surface communication at the position of the solder mask windowing according to the design requirements, nickel and gold with certain required thickness are uniformly deposited.
(15) And forming: according to the prior art and according to the design requirement, the shape is gong, and a thick copper plate with the inner layer copper thickness more than or equal to 4OZ is manufactured.
(16) And electrical performance testing: detecting the electrical performance of the thick copper plate, and enabling the qualified thick copper plate to enter the next processing link; the method specifically comprises the following tests:
a. TG test: testing the TG value by referring to an IPC-TM-650TG test standard method, wherein the TG is more than or equal to 170 ℃, and the delta TG is less than or equal to 5 ℃ to be qualified, otherwise, the TG is not qualified.
b. Reflow, thermal shock test (thermal stability test): taking a test plate sample, baking the test plate at 125 ℃ for 4H according to the requirement of the IPC TM-650 heat resistance test, and then testing thermal stress (solder bleaching 288 ℃ 10S 3 times) and reflow soldering (290 ℃ 3 times) to test the heat resistance; the specific test results are shown in the following table (the test results of baking or not baking the board before and after drilling and before and after solder mask corresponding to drilling parameter optimization are given in the table):
analysis by the test results described above: 1. testing the heat resistance of the thick copper plate, wherein the reflow soldering 3 suboptimal drilling parameters and the test result after baking the plate are qualified; 2. the thermal stress is 3 times, and the test results of all samples after baking the plates are qualified.
(17) And final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (9)
1. A method for manufacturing an explosion-proof board of a thick plate and a thick copper plate is used for manufacturing a circuit board with the thickness of more than or equal to 5mm or the thickness of inner layer copper of more than or equal to 4OZ, and is characterized by comprising the following steps:
s1, before drilling holes on the production board after the pressing process is completed, baking the production board at 180 ℃ for 2 hours;
s2, drilling holes on the production plate;
s3, continuously baking the production board after drilling, wherein the baking temperature is 180 ℃, and the baking time is 2 h;
s4, performing copper precipitation, full-board electroplating and outer-layer circuit manufacturing on the production board, and then baking the production board before resistance welding, wherein the baking temperature is 180 ℃ and the baking time is 2 hours;
and S5, finally, sequentially carrying out solder mask layer manufacturing, surface treatment and forming procedures on the production board to obtain a thick plate or a thick copper plate.
2. The method for manufacturing an explosion-proof plate of thick plate and thick copper plate according to claim 1, wherein step S1 is preceded by the steps of:
s01, cutting the core board, the PP sheet and the outer layer copper foil according to the size required by production;
s02, manufacturing an inner layer circuit on the core board;
s03, firstly carrying out brown oxidation treatment on the core board, then sequentially overlapping the core board, the PP sheet and the outer layer copper foil according to requirements, and then pressing to form the production board.
3. The method for manufacturing an explosion-proof plate of thick plate and thick copper plate according to claim 2, wherein in step S01, after the core plate is cut, the core plate is baked at 180 ℃ for 4 h.
4. The method for manufacturing an explosion-proof plate of a thick plate and a thick copper plate according to claim 2, wherein in step S03, the core plate is baked at 110 ℃ for 2 hours after being browned, and then the core plate is laminated with the PP sheet and the outer copper foil in sequence and then pressed.
5. The method for manufacturing an explosion-proof plate of thick plate and thick copper plate as claimed in claim 2, wherein in step S03, when the thickness of the laminated production plate is not less than 5mm, the baking is performed in ten stages:
the first stage is as follows: baking at 140 deg.C and 100Psi for 5 min;
and a second stage: baking at 140 deg.C and 200Psi for 10 min;
and a third stage: baking at 160 deg.C and 300Psi for 10 min;
a fourth stage: baking at 170 deg.C and 380Psi for 10 min;
the fifth stage: baking at 195 deg.C and 380Psi for 10 min;
the sixth stage: baking at 210 deg.C and 380Psi for 25 min;
a seventh stage: baking at 195 deg.C and 380Psi for 10 min;
an eighth stage: baking at 195 deg.C and 380Psi for 60 min;
the ninth stage: baking at 180 deg.C and 200Psi for 20 min;
the tenth stage: baking at 140 deg.C and 200Psi for 10 min.
6. The method for manufacturing an explosion-proof plate of thick plate and thick copper plate as claimed in claim 5, wherein in step S2, the rotation speed of the drill is controlled at 39-70kr/min, the feed speed is 20-30mm/sec, the retreat speed is 200-300mm/sec, the limit number of drilling for each drill is controlled within 800, and a new drill needs to be replaced when the number of drilling for the drill reaches the upper limit.
7. The method for manufacturing an explosion-proof plate of thick plate and thick copper plate according to claim 2, wherein in step S03, when the inner layer copper thickness of the produced plate is greater than or equal to 4OZ, the baking is divided into nine stages:
the first stage is as follows: baking at 140 deg.C and 100Psi for 10 min;
and a second stage: baking at 140 deg.C and 200Psi for 10 min;
and a third stage: baking at 160 deg.C and 250Psi for 10 min;
a fourth stage: baking at 195 deg.C and 360Psi for 20 min;
the fifth stage: baking at 210 deg.C and 360Psi for 25 min;
the sixth stage: baking at 195 deg.C and 360Psi for 10 min;
a seventh stage: baking at 195 deg.C and 360Psi for 60 min;
an eighth stage: baking at 180 deg.C and 300Psi for 15 min;
the ninth stage: baking at 140 deg.C and 200Psi for 10 min.
8. The method for manufacturing an explosion-proof panel of thick plate and thick copper plate according to claim 7, wherein in step S2, the rotation speed of the drill is controlled at 30kr/min, the feed speed is 20mm/sec, the retreat speed is 150mm/sec, the limit number of drilling for each drill is controlled within 600, and a new drill needs to be replaced when the number of drilling for the drill reaches the upper limit.
9. A thick plate, thick copper plate, characterized by being produced by the method for producing an explosion-proof plate for a thick plate, thick copper plate according to any one of claims 1 to 8.
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| CN202010208538.7A CN111315141B (en) | 2020-03-23 | 2020-03-23 | Method for manufacturing explosion-proof plate of thick plate and thick copper plate, thick plate and thick copper plate |
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