CN112638045A - Method for processing through hole and blind hole of multilayer flexible board - Google Patents

Method for processing through hole and blind hole of multilayer flexible board Download PDF

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Publication number
CN112638045A
CN112638045A CN202110252580.3A CN202110252580A CN112638045A CN 112638045 A CN112638045 A CN 112638045A CN 202110252580 A CN202110252580 A CN 202110252580A CN 112638045 A CN112638045 A CN 112638045A
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Prior art keywords
layer
plate
soft
multilayer
board
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CN202110252580.3A
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皇甫铭
周海松
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Fulaiying Electronics Co ltd
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Fulaiying Electronics Co ltd
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Priority to CN202110252580.3A priority Critical patent/CN112638045A/en
Publication of CN112638045A publication Critical patent/CN112638045A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention discloses a through hole processing method of a multilayer soft board, which comprises the following steps: baking the multilayer soft board at the temperature of 120-140 ℃ for 40-60 min; stacking the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate from bottom to top to form a fixed bag fixed at a preset positioning point; drilling holes from the cold punching cover plate to the multi-layer soft plate according to standard drilling parameters by using a drill for the preset position of the fixed bag, wherein the standard drilling parameters comprise: the cutting speed of the drill point entering the multi-layer soft board is 0.7-0.8 m/min, the rotating speed of the drill point in the multi-layer soft board is 60-70 Kr/min, and the cutting speed of the drill point exiting the multi-layer soft board is 5-8 m/min; the blind hole processing method for the multilayer soft board comprises the following steps: opening a copper window on the copper layer of the multilayer flexible board by using a UV laser machine; recycle of CO2The laser machine heats the substrate layer to a molten state and gasifies the substrate layer to form blind holes. The soft board has higher high-frequency signal transmission performance and high temperature resistance, so that the performance of the processed product is more stable and reliable.

Description

Method for processing through hole and blind hole of multilayer flexible board
Technical Field
The invention relates to the field of soft boards, in particular to a method for processing through holes and blind holes of a multilayer soft board.
Background
The existing soft board base material is generally selected from PI or MPI. PI is a conventional soft material dielectric layer, MPI is a high-frequency conventional PI material. The existing base material has high water absorption phenomenon in the using process, so that the existing base material cannot meet the use requirements of products needing high-speed transmission performance and cannot meet the increasingly high processing requirements of customers.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the invention provides a method for processing through holes and blind holes of a multilayer soft board, so that products such as a circuit board and the like manufactured by using the soft board can realize high-speed transmission, the performance is more stable and reliable, and the market competitiveness of manufacturers is improved.
In order to achieve the purpose, the invention adopts the technical scheme that: a through hole processing method of a multi-layer flexible printed circuit board comprises the following steps:
arranging a copper layer on one side of a base material layer made of a PTFE material, and processing to form a substrate with a circuit;
sequentially and outwardly stacking the glue layer and the outer layer plate from the side surface of the substrate and laminating the glue layer and the outer layer plate by a high-temperature laminating machine to form a soft plate; wherein the pressing temperature is 190-200 ℃, and the pressing time is 4-4.5 h;
arranging high-frequency glue among the plurality of soft plates and pressing the high-frequency glue into a plurality of soft plates;
baking the multilayer soft board at the temperature of 120-140 ℃ for 40-60 min;
stacking the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate from bottom to top to form a fixed bag fixed at a preset positioning point; the method specifically comprises the following steps: determining the preset positioning point on the table board of the drilling machine and arranging a PIN nail on the preset positioning point; sleeving the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate on the PIN nail by using positioning holes on the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate, and enabling the phenolic aldehyde base plate to be positioned on the table top of the drilling machine, the multilayer soft plate to be positioned on the phenolic aldehyde base plate, and the cold punching cover plate to be positioned on the multilayer soft plate; encapsulating and fixing the phenolic aldehyde base plate arranged on the PIN nail, the multilayer soft plate and the cold punching cover plate to form the fixing bag;
drilling holes on the multilayer soft board from the cold punching cover plate by using a drill according to the preset position of the fixed bag according to standard drilling parameters, wherein the standard drilling parameters comprise: the cutting speed of the drill point entering the multi-layer soft board is 0.7-0.8 m/min, the rotating speed of the drill point in the multi-layer soft board is 60-70 Kr/min, and the cutting speed of the drill point exiting the multi-layer soft board is 5-8 m/min;
the drill point is a double-edge double-groove ST-shaped drill point, the drill point angle of the drill point is 135 degrees, and the chip groove is 41 degrees; the drilling machine is a Hitachi drilling machine, and the type is as follows: HITACHI MARK50 ND.6Y220E;
before "drilling a hole from the cold punching cover plate to the multilayer soft board at the preset position of the fixed bag by using a drill", the method further comprises the following steps:
drilling the observation area of the fixed bag according to the standard drilling parameters to form an observation hole;
observing the quality of the observation hole under a pre-expansion and contraction program and adjusting the pre-expansion and contraction program according to the quality of the observation hole;
and circulating the operation steps until the quality of the formed observation hole meets the machining requirement, and setting the pre-expansion-contraction program as a standard expansion-contraction program.
A blind hole processing method of a multilayer soft board comprises the steps of processing a copper layer arranged on one side of a base material layer made of a PTFE material to form a substrate with a circuit;
sequentially and outwardly stacking the glue layer and the outer layer plate from the side surface of the substrate and laminating the glue layer and the outer layer plate by a high-temperature laminating machine to form a soft plate; wherein the pressing temperature is 190-200 ℃, and the pressing time is 4-4.5 h;
arranging high-frequency glue among the plurality of soft plates and pressing the high-frequency glue into a plurality of soft plates;
utilizing a UV laser machine to open a copper window on the copper layer of the multilayer flexible board;
using CO after completion of copper windowing2And heating the substrate layer to a molten state and gasifying the substrate layer by using a laser machine to form blind holes.
In the technical scheme, the step of opening the copper window on the copper layer of the multilayer flexible printed circuit board by using the UV laser machine is to set the copper window opening parameters of the UV laser machine according to the thickness of the copper layer.
The invention has at least the following beneficial effects:
1. according to the invention, the PTFE material is made into the substrate layer, the PTFE is a high molecular polymer, and the substrate layer has the characteristics of acid resistance, alkali resistance and various organic solvent resistance, is almost insoluble in all solvents, and has good high temperature resistance, so that a circuit in a flexible board manufactured by the substrate layer is more stable and reliable. And because the dielectric constant DK value of the PTFE material is 2.8, the tangent angle loss DF value is 0.0005 and both the DK value and the DF value of the PTFE material are smaller, the flexible printed circuit board made of the PTFE material has the advantage of high-speed signal transmission.
2. When the through hole is processed in the flexible printed circuit board manufactured by the base material layer made of PTFE material, the quality of the through hole is prevented from being influenced by the fact that the base material layer and the high-frequency glue arranged between the multilayer flexible printed circuit boards are pulled by the drill needle by controlling the cutting speed when the drill needle enters the multilayer flexible printed circuit board, the rotating speed in the multilayer flexible printed circuit board and the cutting speed when the drill needle exits the multilayer flexible printed circuit board.
3. When blind holes are machined in a flexible board manufactured by a base material layer made of PTFE material, the copper layer is windowed by using a UV laser machine, and the atomic energy of the copper layer and the base material layer below the copper layer can be increased by using the chemical energy generated by the UV laser machine, so that the atomic energy escapes from original molecules, and molecular chains in the base material layer are broken; recycle of CO2The cooperation of laser machine makes the substrate layer can arrive the molten state and gasify in the twinkling of an eye, guarantees that the interior PTFE material of blind hole is clear away totally.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a single-layer board according to an embodiment of the present invention
FIG. 2 is a schematic view of a double-layer plate in an embodiment of the present invention;
FIG. 3 is a schematic view of a multi-layer board in an embodiment of the invention;
reference numerals of the above figures: 1. a substrate layer; 2. a copper layer; 3. a glue layer; 4. an outer plate; 5. a through hole; 6. and (4) blind holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows: referring to fig. 1 to 3, a method for manufacturing a flexible printed circuit board includes:
arranging a copper layer 2 on one side of a base material layer 1 made of PTFE material, and processing to form a substrate with a circuit;
sequentially stacking the glue layer 3 and the outer layer plate 4 outwards from the side surface of the substrate and laminating the glue layer and the outer layer plate by a high-temperature laminating machine to form a soft plate; wherein the pressing temperature is 190-200 ℃, and the pressing time is 4-4.5 h.
The Chinese name of PTFE is polytetrafluoroethylene, which is a high molecular polymer prepared by polymerizing tetrafluoroethylene as a monomer. Polytetrafluoroethylene has the characteristics of acid resistance, alkali resistance and resistance to various organic solvents, and is almost insoluble in all solvents. Meanwhile, the polytetrafluoroethylene has the characteristic of high temperature resistance. Therefore, by utilizing the substrate layer 1 made of PTFE material and arranging the copper layer 2 on the substrate layer 1, a circuit is formed by processing, and in the using process, the substrate layer 1 has extremely low water absorption rate, so that the circuit arranged on the substrate layer can be ensured to run more stably. The polytetrafluoroethylene is an inert material, has a small dielectric constant value and a small dielectric loss value, can reduce the signal loss in the use process of a product, and has the advantage of high-speed transmission performance.
The high-temperature pressing machine is a movable full-pressing machine and is provided with ten openings, the pressing process is in a vacuum state, and the pressing temperature can be accurately controlled.
The soft board can be made into a single-layer board, a double-layer board or a multi-layer board according to the actual use requirement. As shown in fig. 1, a base material layer 1 made of PTFE material is used, and a copper layer 2 is provided on one side of the base material layer 1. And cutting, drilling an LDI exposure hole, roughening, pressing a dry film, exposing, developing and etching to form a circuit and an identification point, thereby finishing the processing of the substrate. And then the glue layer 3 and the outer layer plate 4 are stacked above the circuit and are pressed to form the soft board. As shown in fig. 2, a schematic view of a double-layer plate is shown. Compared with a single-layer board, the copper layer 2 is arranged on two sides of the base material layer 1 and is processed to form the circuit. Referring to fig. 3, the multilayer board is formed by laminating at least one single-layer board and at least one multilayer board by using a glue layer 3.
Preferably, the pressing temperature is 190 ℃, and the pressing time is 4.5 h. The pressing temperature is increased to 190 ℃, and the pressing time is prolonged to 4.5h, so that the high-temperature resistance of the PTFE material is overcome, and the effective connection between the layers in the laminated soft board is ensured.
The glue layer 3 is made of high frequency glue, which can enhance the adhesion between the substrate and the outer layer plate 4. The dielectric constant value and the dielectric loss value of the high-frequency adhesive are extremely low, and the signal loss can be reduced.
A through hole processing method of a multi-layer soft board is characterized in that each soft board in the multi-layer soft board is made of a PTFE material to form a substrate layer 1, and the multi-layer soft board is formed by arranging high-frequency glue among a plurality of soft boards and pressing the high-frequency glue. The processing method of the through hole 5 of the multilayer flexible board comprises the following steps:
baking the multilayer soft board at the temperature of 120-140 ℃ for 40-60 min;
stacking the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate from bottom to top to form a fixed bag fixed at a preset positioning point;
drilling holes on the multilayer soft board from the cold punching cover plate by using a drill according to the preset position of the fixed bag according to standard drilling parameters, wherein the standard drilling parameters comprise: the cutting speed of the drill point entering the multi-layer soft board is 0.7-0.8 m/min, the rotating speed of the drill point in the multi-layer soft board is 60-70 Kr/min, and the cutting speed of the drill point exiting the multi-layer soft board is 5-8 m/min.
The drill point enters the multi-layer soft board at a low speed of 0.7-0.8 m/min, the multi-layer soft board is drilled at a low speed of 60-70 Kr/min, and the multi-layer soft board is withdrawn at a low tool return speed of 5-8 m/min, so that the situation that the quality of the through hole 5 is abnormal due to the fact that PTFE has high expansion and contraction performance and good ductility and pulls the substrate layer 1 in the rotating process of the drill point can be prevented.
The preset position in the fixed bag is opposite to the through hole 5 which needs to be processed and formed in the multilayer soft board.
Before drilling, the multi-layer soft board is baked for 40min to 60min at the temperature of 120 ℃ to 140 ℃, so that moisture in the multi-layer soft board can be removed, and the expansion and contraction performance of the multi-layer soft board is improved, so that the multi-layer soft board can be in a stable state during drilling, and the quality of the through hole 5 is improved.
Preferably, the cutting speed of the drill point when entering the multi-layer soft board is 0.8m/min, the rotating speed of the drill point in the multi-layer soft board is 70Kr/min, and the cutting speed of the drill point when exiting the multi-layer soft board is 8 m/min.
Will the drill point keeps rotating with low rotational speed except can preventing substrate layer 1 takes place to drag the phenomenon, can also prevent to set up in the high frequency glue in the multilayer soft board is dragged.
In order to further improve the quality of the through hole 5, the drill point is a double-edge double-groove ST-shaped drill point, the drill point angle of the drill point is 135 degrees, and the chip groove is 41 degrees. The chip removal groove with the special drill point angle and the large angle is beneficial to removing chips quickly.
Stacking the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate from bottom to top to form a fixed bag fixed at a preset positioning point; "there are various arrangements. The method specifically comprises the following steps:
determining the preset positioning point on the table board of the drilling machine and arranging a PIN nail on the preset positioning point;
sleeving the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate on the PIN nail by using positioning holes on the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate, and enabling the phenolic aldehyde base plate to be positioned on the table top of the drilling machine, the multilayer soft plate to be positioned on the phenolic aldehyde base plate, and the cold punching cover plate to be positioned on the multilayer soft plate;
and encapsulating and fixing the phenolic aldehyde base plate arranged on the PIN nail, the multilayer soft plate and the cold punching cover plate to form the fixed bag.
The preset positioning point is used for determining the position of the subsequent multilayer soft board relative to the table top of the drilling machine. The multi-layer soft boards are placed at the same position during each processing, so that the position of the through hole 5 is conveniently and accurately determined, the through holes 5 formed in the processing mode are ensured to have the same position on each multi-layer soft board, and the efficiency of subsequent processing can be improved.
The phenolic aldehyde base plate is arranged on the table board of the drilling machine, the table board of the drilling machine can be protected by the phenolic aldehyde base plate, the glue residues in the drill point groove are cleaned, and the drill point is prevented from being too high in temperature in the drilling process. The cold punching cover plate is arranged on the multilayer soft board, and the surface of the multilayer soft board can be protected by the cold punching cover plate, so that the cold punching cover plate is prevented from being worn in the drilling process. Meanwhile, the drill point can determine the center of the preset position, and the center positioning effect is achieved. It can also help to remove smear from the grooves of the drill bit.
The fixing of the PIN nail is specifically as follows: and drilling a preset positioning hole in the preset positioning point of the table top of the drilling machine, wherein the aperture of the preset positioning hole is 2.0mm, and knocking the PIN nail into the preset positioning hole.
The drill is a Hitachi drill, and the model is HITACHIMARK50ND.6Y220E. And mounting the double-edge double-groove ST-type drill bit on the Hitachi drilling machine.
The standard drilling parameters are obtained by experimental design and repeated test and verification of multiple groups of parameters according to the properties of the PTFE material.
In order to prevent waste of the multilayer flexible board and ensure that the quality of the through hole 5 formed under the set standard drilling parameters meets the requirements. Namely, the through hole 5 formed by machining can satisfy the S70F1.0U8 standard. Before "drilling a hole from the cold punching cover plate to the multilayer soft board at the preset position of the fixed bag by using a drill", the method further comprises the following steps:
drilling the observation area of the fixed bag according to the standard drilling parameters to form an observation hole;
observing the quality of the observation hole under a pre-expansion and contraction program and adjusting the pre-expansion and contraction program according to the quality of the observation hole;
and circulating the operation steps until the quality of the formed observation hole meets the machining requirement, and setting the pre-expansion-contraction program as a standard expansion-contraction program.
The harmomegathus program comprises a series of operations such as slicing modes of the observation hole and the like.
The observation area is a waste material area at the periphery of the multilayer flexible board. And the observation holes are processed in the observation area, so that no influence is caused on the internal circuit of the multilayer flexible printed circuit board, and the reutilization of waste materials is realized.
A blind hole processing method for a multi-layer soft board is characterized in that each soft board in the multi-layer soft board is made of a PTFE material and is a substrate layer 1, and the multi-layer soft board is formed by arranging high-frequency glue among a plurality of soft boards and pressing the high-frequency glue. The processing method of the blind hole 6 of the multilayer soft board comprises the following steps:
utilizing a UV laser machine to open a copper window on the copper layer 2 of the multilayer flexible board;
using CO after completion of the copper window2The laser machine heats the substrate layer 1 to a molten state and gasifies the substrate layer to form the blind holes 6.
Because PTFE is high frequency material, its ductility is good, if directly utilize the radium-shine machine of UV processes the blind hole 6, radium-shine machine of UV can not directly clean substrate layer 1 and the high frequency glue in the multilayer soft board to remain in the blind hole 6 substrate layer 1 and the high frequency glue has influenced the quality of blind hole 6.
In the process of windowing the copper layer 2 by the UV laser machine, the chemical energy generated by the UV laser machine can be used for increasing the atomic energy of the copper layer 2 and the atomic energy of the substrate layer 1 below the copper layer 2, so that the atomic energy escapes from original molecules, and molecular chains in the substrate layer 1 are broken. Then passing through the CO2And (3) the substrate layer 1 in a molecular chain breaking state is gasified by matching of a laser machine. Namely by using said CO2The substrate layer 1 is instantaneously heated to a molten state by the heat energy brought by the light beam generated by the laser machine, and is gasified, so that the substrate layer is removed to form the blind hole 6.
And setting copper window opening parameters of the UV laser machine according to the thickness of the copper layer 2. Such as: setting the number of copper window opening times as one time when the thickness of the copper layer 2 is 6 mu m; when the thickness of the copper layer 2 is 12 μm, the number of copper windows is set to two.
And (3) utilizing a UV laser machine to open a copper window on the copper layer 2 of the multilayer flexible board, and setting various parameters for the UV laser machine.
For example, when the blind via 6 is processed on the multi-layer flexible printed circuit board with the copper layer 2 having the thickness of 6 μm, the copper window opening parameters are set as follows: locator positioning time: 0; height of Z axis: 0; tool type: circle; frequency: 40; energy: 4.6; an energy monitor: TRUE; percentage energy tolerance: 10; light path: a GAU; speed: 346.3, respectively; effective spot size: 17; optical path times: 1; pulse distribution: TRUE.
When processing the blind hole 6 on the multilayer soft board with the copper layer 2 with the thickness of 12 μm, the copper window opening parameters are set as follows: locator positioning time: 0; height of Z axis: 0; tool type: circle; frequency: 40; energy: 4.6; an energy monitor: TRUE; percentage energy tolerance: 10; light path: a GAU; speed: 346.3, respectively; effective spot size: 17; optical path times: 2; pulse distribution: TRUE.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (3)

1. A through hole processing method of a multi-layer flexible printed circuit board is characterized by comprising the following steps:
arranging a copper layer on one side of a base material layer made of a PTFE material, and processing to form a substrate with a circuit;
sequentially and outwardly stacking the glue layer and the outer layer plate from the side surface of the substrate and laminating the glue layer and the outer layer plate by a high-temperature laminating machine to form a soft plate; wherein the pressing temperature is 190-200 ℃, and the pressing time is 4-4.5 h;
arranging high-frequency glue among the plurality of soft plates and pressing the high-frequency glue into a plurality of soft plates;
baking the multilayer soft board at the temperature of 120-140 ℃ for 40-60 min;
stacking the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate from bottom to top to form a fixed bag fixed at a preset positioning point; the method specifically comprises the following steps: determining the preset positioning point on the table board of the drilling machine and arranging a PIN nail on the preset positioning point; sleeving the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate on the PIN nail by using positioning holes on the phenolic aldehyde base plate, the multilayer soft plate and the cold punching cover plate, and enabling the phenolic aldehyde base plate to be positioned on the table top of the drilling machine, the multilayer soft plate to be positioned on the phenolic aldehyde base plate, and the cold punching cover plate to be positioned on the multilayer soft plate; encapsulating and fixing the phenolic aldehyde base plate arranged on the PIN nail, the multilayer soft plate and the cold punching cover plate to form the fixing bag;
drilling holes on the multilayer soft board from the cold punching cover plate by using a drill according to the preset position of the fixed bag according to standard drilling parameters, wherein the standard drilling parameters comprise: the cutting speed of the drill point entering the multi-layer soft board is 0.7-0.8 m/min, the rotating speed of the drill point in the multi-layer soft board is 60-70 Kr/min, and the cutting speed of the drill point exiting the multi-layer soft board is 5-8 m/min;
the drill point is a double-edge double-groove ST-shaped drill point, the drill point angle of the drill point is 135 degrees, and the chip groove is 41 degrees; the drilling machine is a Hitachi drilling machine, and the type is as follows: HITACHI MARK50 ND.6Y220E;
before "drilling a hole from the cold punching cover plate to the multilayer soft board at the preset position of the fixed bag by using a drill", the method further comprises the following steps:
drilling the observation area of the fixed bag according to the standard drilling parameters to form an observation hole;
observing the quality of the observation hole under a pre-expansion and contraction program and adjusting the pre-expansion and contraction program according to the quality of the observation hole;
and circulating the operation steps until the quality of the formed observation hole meets the machining requirement, and setting the pre-expansion-contraction program as a standard expansion-contraction program.
2. A blind hole processing method of a multilayer soft board is characterized by comprising the following steps:
arranging a copper layer on one side of a base material layer made of a PTFE material, and processing to form a substrate with a circuit;
sequentially and outwardly stacking the glue layer and the outer layer plate from the side surface of the substrate and laminating the glue layer and the outer layer plate by a high-temperature laminating machine to form a soft plate; wherein the pressing temperature is 190-200 ℃, and the pressing time is 4-4.5 h;
arranging high-frequency glue among the plurality of soft plates and pressing the high-frequency glue into a plurality of soft plates;
utilizing a UV laser machine to open a copper window on the copper layer of the multilayer flexible board;
using CO after completion of copper windowing2And heating the substrate layer to a molten state and gasifying the substrate layer by using a laser machine to form blind holes.
3. The blind hole processing method of the multi-layer soft board as claimed in claim 2, wherein: the method comprises the following steps of 'utilizing a UV laser machine to open a copper window on a copper layer of a multilayer flexible board' to set copper window opening parameters of the UV laser machine according to the thickness of the copper layer.
CN202110252580.3A 2021-03-09 2021-03-09 Method for processing through hole and blind hole of multilayer flexible board Pending CN112638045A (en)

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CN202110252580.3A CN112638045A (en) 2021-03-09 2021-03-09 Method for processing through hole and blind hole of multilayer flexible board

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CN202110252580.3A CN112638045A (en) 2021-03-09 2021-03-09 Method for processing through hole and blind hole of multilayer flexible board

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CN114340161A (en) * 2021-12-20 2022-04-12 安捷利电子科技（苏州）有限公司 5G high-frequency multilayer FPC and preparation method thereof
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