CN111276791A

CN111276791A - Electronic equipment and cover plate thereof

Info

Publication number: CN111276791A
Application number: CN202010045135.5A
Authority: CN
Inventors: 唐根初; 陈禄禄; 杨伟庆; 许建勇
Original assignee: Nanchang OFilm Tech Co Ltd
Current assignee: Jiangxi Zhanyao Microelectronics Co ltd
Priority date: 2020-01-15
Filing date: 2020-01-15
Publication date: 2020-06-12

Abstract

The invention provides an electronic device and a cover plate thereof. The cover plate of the electronic equipment is used for covering the electronic equipment body, the cover plate comprises a cover plate body and an antenna structure, the cover plate body comprises a first plate body and a second plate body, the first plate body is stacked with the second plate body, the first plate body is close to the electronic equipment body, the antenna structure comprises an antenna, and the antenna is arranged on the surface of the second plate body away from the first plate body. The invention solves the technical problem that the cover plate in the prior art is difficult to maintain the strength and is convenient for surface processing and manufacturing of the metal grid antenna.

Description

Electronic equipment and cover plate thereof

Technical Field

The present invention relates to the field of electronic devices, and particularly to an electronic device and a cover plate thereof.

Background

Currently, antennas of electronic products are designed based on flexible circuit boards. With the higher and higher screen occupation ratio of the full screen, the requirement of the arrival of 5G on the position and the area of the antenna is more and more, and the existing electronic equipment can not meet the structural design requirement due to the fact that the antenna structure occupies too large internal effective space of the electronic equipment.

In addition, when the cover plate is made of a single material in the prior art, on one hand, the cover plate is made of a material with higher strength, and a groove is difficult to etch on the surface of the cover plate to manufacture the antenna; on the other hand, the cover plate is made of a material which is easy to process, and the requirements such as strength and the like cannot be met; therefore, a cover plate which has sufficient strength and toughness and is convenient for manufacturing a metal grid antenna on the surface cannot be obtained.

Disclosure of Invention

The invention aims to provide a cover plate of electronic equipment and the electronic equipment, and aims to solve the technical problem that the cover plate in the prior art is difficult to maintain the strength and is convenient for surface processing to manufacture a metal grid antenna.

The invention provides a cover plate of electronic equipment, which is used for covering an electronic equipment body and comprises a cover plate body and an antenna structure, wherein the cover plate body comprises a first plate body and a second plate body, the first plate body and the second plate body are arranged in a stacked mode, the first plate body is close to the electronic equipment body, the antenna structure comprises an antenna, and the antenna is arranged on the surface, far away from the first plate body, of the second plate body. This application is integrated with antenna structure in the surface that first plate body was kept away from to the second plate body, avoids antenna structure can occupy electronic equipment's inside effective space, has solved because antenna structure occupies electronic equipment's inside effective space too big and leads to the unsatisfied structural design requirement of electronic equipment's technical problem. The setting of two-layer plate body makes the intensity of apron increase, has reduced the apron and has taken place cracked risk.

The surface of the second plate body, which is far away from the first plate body, is provided with a groove, the groove is communicated with the grid, the antenna is in the grid, and the antenna structure is arranged in the groove. The antenna is arranged in the groove of the second plate body, the thickness of the second plate body occupied by the antenna structure is omitted, and the electronic equipment is more compact and convenient to lighten and thin.

The antenna structure comprises an antenna and an adhesive layer, the adhesive layer is stacked on the surface, far away from the first plate body, of the second plate body, and the antenna is integrated in the adhesive layer. The mode that the antenna structure is integrated in the glue film saves the thickness that the antenna structure occupies the glue film, and electronic equipment is more compact and is convenient for frivolousization.

The at least one board body further comprises a protective layer, and the protective layer is stacked on the surface, far away from the first board body, of the second board body and covers the antenna structure. The protective layer is used for protecting the plate structures below the protective layer, such as the antenna structure, the first plate body, the second plate body and the like.

The cover plate further comprises a decorative ink layer, and the decorative ink layer is stacked between the electronic equipment body and the cover plate body. The decoration ink layer is used for shielding devices in a non-display area of the electronic equipment.

The cover plate further comprises a glare film layer, and the glare film layer is stacked between the electronic device body and the cover plate body. The dazzling film layer realizes the texture effect and the color effect of the decorative film.

The first plate body is made of one or more of acrylic polycarbonate, polymethyl methacrylate, a material formed by compounding acrylic polycarbonate and polymethyl methacrylate, glass or polyethylene terephthalate; the second plate body is made of one or more of acrylic polycarbonate, polymethyl methacrylate, a composite material of acrylic polycarbonate and polymethyl methacrylate, and glass or polyethylene terephthalate. Any one of the above-mentioned materials of first plate body and second plate body can reduce the cracked risk of apron emergence.

The first plate body is made of polycarbonate, and the second plate body is made of polymethyl methacrylate. The first plate body and the second plate body are made of the materials, so that the risk of fragmentation of the cover plate can be reduced.

The antenna structure is a conductive film formed on the surface of the second board body. The antenna structure of this mode has simple structure, easy manufacturing.

The antenna structure is a conductive film formed on the surface of the second plate body by a method of directly coating, evaporating, sputtering or electroplating a layer of transparent conductive material. The antenna structure is simple in manufacturing mode and high in efficiency.

The invention provides electronic equipment which comprises an electronic equipment body and the cover plate, wherein the cover plate covers the electronic equipment body.

In summary, the antenna layer is disposed inside the cover plate, so that the antenna structure is prevented from occupying the effective internal space of the electronic device, and the technical problem that the electronic device does not meet the structural design requirement due to the fact that the antenna structure occupies too much effective internal space of the electronic device is solved.

In addition, the cover plate made of the composite cover plate made of the two materials has the characteristics of strength, toughness and the like, and easy surface processing, so that the technical problem that the strength and the easy processing property of the cover plate made of a single material are difficult to be considered in the prior art is solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1a is a schematic view of a first structure of a cover plate provided by the present invention.

Fig. 1b is a schematic diagram of a second structure of the cover plate provided by the present invention.

Fig. 2a is a schematic view of a third structure of the cover plate provided by the present invention.

Fig. 2b is a schematic diagram of a fourth structure of the cover plate provided by the present invention.

Fig. 3a is a schematic view of a fifth structure of the cover plate provided by the present invention.

Fig. 3b is a schematic diagram of a sixth structure of the cover plate provided by the present invention.

Fig. 4a is a schematic diagram of a seventh structure of the cover plate provided by the present invention.

Fig. 4b is an eighth structural schematic diagram of the cover plate provided by the invention.

Fig. 4c is a schematic structural diagram of the cover plate provided with the protection layer.

Fig. 4d is a schematic view of a ninth structure of the cover plate provided by the present invention.

Fig. 5 is a schematic structural diagram of a structure in which a layered antenna structure is disposed in a cover plate according to the present invention.

Fig. 6 is a schematic view of another structure of a cover plate with a layered antenna structure.

Fig. 7 is a schematic view of the structure of the groove.

Fig. 8 is a schematic diagram of a first structure of the grid antenna structure provided by the present invention.

Fig. 9 is a schematic diagram of a second structure of the grid antenna structure provided by the present invention.

Fig. 10 is a schematic diagram of a third structure of the grid antenna structure provided by the present invention.

Fig. 11 is a schematic diagram of a first structure of a grid unit of the grid antenna structure provided by the present invention.

Fig. 12 is a schematic diagram of a second structure of a grid unit of the grid antenna structure provided by the present invention.

Fig. 13 is a schematic structural diagram of the cover plate body fully covered by the grid antenna structure provided by the present invention.

Fig. 14 is a schematic structural diagram of the grid antenna structure partially covering the cover plate body.

Fig. 15 is a schematic view of a tenth structure of the cover plate provided by the present invention.

Fig. 16 is a schematic view of an eleventh structure of the cover plate provided by the present invention.

Fig. 17 is a schematic diagram of a twelfth structure of the cover plate provided by the invention.

Fig. 18 is a schematic diagram of a thirteenth structure of the cover plate provided by the present invention.

Fig. 19 is a schematic diagram of a fourteenth structure of the cover plate provided by the present invention.

Fig. 20 is a schematic diagram of a fifteenth structure of the cover plate provided by the invention.

Fig. 21 is a schematic diagram of a sixteenth structure of the cover plate provided by the present invention.

Fig. 22 is a seventeenth structural schematic diagram of the cover plate provided by the invention.

10. An electronic device body; 20. a cover plate; 201. a cover plate body; 202. an antenna; 205. a first plate body; 206. a second plate body; 201a, a groove; 203. a glue layer; 209. a protective layer; 207. decorating the ink layer; 208. a glare film layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides electronic equipment, which comprises an electronic equipment body 10 and a cover plate arranged on the electronic equipment body 10. The cover plate can be a front cover or a rear cover. The cover plate will be described in detail as follows.

Referring to fig. 1a to 4d, the cover plate 20 includes a cover plate body 201 and an antenna structure. That is, the antenna structure is provided inside the cover plate 20. The antenna structure includes an antenna 202, and the material of the antenna 202 is one of nano-silver particles, indium tin oxide, an alloy of indium tin oxide and silver, silver nanowires, and carbon nanotubes. The cover plate body 201 is made of one or more of acrylic Polycarbonate (PC), polymethyl methacrylate (PMMA), a composite material of PMMA and PC, and glass or PET. The antenna is formed by compounding two or more cover plates, and can integrate the advantages of various materials, such as a PMMA + PC compounding mode, namely, the rigidity and toughness of the PC material are kept, and the antenna structure is well manufactured on the surface by utilizing the high transmittance and the easy processability of PMMA. Compared with a cover plate made of a single-layer material, the cover plate has the advantages of being large in size and low in cost.

The shape of the antenna 202 includes two types: one is layered and the other is metal grid. Both the layered and metal mesh antennas 202 may be used as communication antennas. The formation process of the antenna 202 will be described later.

In the present invention, the antenna structure 202 is disposed in the cover plate 20, so as to prevent the antenna structure from occupying the effective internal space of the electronic device, and solve the technical problem that the electronic device does not meet the structural design requirement due to the fact that the antenna structure occupies too much effective internal space of the electronic device. And because the antenna structure is manufactured in the cover plate 20, the antenna structure is far away from the parts in the electronic device body 10, and the signal loss of the antenna structure can be effectively reduced. The structure of the cover plate 20 will be described as follows.

The cover plate body 201 includes at least one plate body, and the antenna structure is integrated in or formed on a surface of one of the at least one plate body. In this application, at least one plate body can be one deck plate body structure, also can be two-layer plate body structure or the multilayer plate body structure more than two-layer, and this application does not do the injecing here. That is, the cover plate body 201 may be a composite cover plate 20 formed by stacking a plurality of plate bodies. The strength of the cover plate is increased due to the arrangement of at least one plate body.

And the material of at least one plate body comprises polymer. The polymer includes but is not limited to acrylic Polycarbonate (PC), polymethyl methacrylate (PMMA), a composite material of PMMA and PC, glass or PET. That is, the material of the one, two or more layers of plate body includes, but is not limited to, acrylic Polycarbonate (PC), polymethyl methacrylate (PMMA), a composite material of PMMA and PC, and glass or PET, and the present application is not limited thereto. The flexibility of the cover plate is increased due to the polymer material of the plate body, and the risk of the cover plate being cracked is reduced.

The cover plate body 201 comprises two plate bodies made of different materials, so that the cover plate 20 can ensure the workability of the surface antenna and the groove and can ensure the corresponding strength, toughness and other characteristics. Moreover, the antenna structure can be arranged on the surface of a plate body, so that the space for accommodating the antenna structure in the cover plate body 201 is not needed, the cover plate body 201 is not needed to be damaged, and the flexibility and the strength of the cover plate 20 can be ensured.

In a specific embodiment, at least one board includes a first board 205 and a second board 206, the first board 205 and the second board 206 are stacked, the first board 205 is close to the electronic device body, the antenna structure includes an antenna 202, and the antenna 202 is integrated in the first board 205 or the second board 206. In this embodiment, the first board 205 and the second board 206 are directly stacked and connected. The antenna 202 is integrated on a side of the first board 205 not connected to the second board 206, or integrated on a side of the second board 206 not connected to the first board 205. When the antenna 202 is integrated on the side of the second board 206 not connected to the first board 205, the antenna 202 is disposed on the surface of the cover plate 20, and the antenna 202 is further away from the components in the electronic device body 10, so that the signal loss of the antenna structure 202 can be further effectively reduced. In the present application, at least one of the first plate 205 and the second plate 206 is made of a polymer. Or the first plate body is made of one or more of acrylic polycarbonate, polymethyl methacrylate, a composite material of acrylic polycarbonate and polymethyl methacrylate, glass or polyethylene terephthalate; the second plate body is made of one or more of acrylic polycarbonate, polymethyl methacrylate, a composite material of acrylic polycarbonate and polymethyl methacrylate, and glass or polyethylene terephthalate. In one embodiment, the first plate 205 may be made of polymethyl methacrylate (PMMA) acrylic, and the second plate 206 is made of Polycarbonate (PC) acrylic; or the first plate 205 may be made of acrylic Polycarbonate (PC), and the second plate 206 is made of acrylic polymethyl methacrylate (PMMA). The first plate 205 and the second plate 206 are arranged to increase the strength of the cover plate 20, and when at least one of the first plate 205 and the second plate 206 is made of polymer, the risk of the cover plate 20 being cracked is reduced.

The positional relationship of the antenna structure and the cover body 201 will be described as follows. The positional relationship between the antenna structure 202 and the cover body 201 includes, but is not limited to, the following nine ways.

The first method is as follows:

referring to fig. 1a, a groove 201a is formed on a surface of the first board 205 away from the second board 206, the groove 201a is in a connected grid shape, the antenna structure includes an antenna 202, the antenna 202 is in a grid shape, and the antenna 202 is disposed in the groove 201 a. In this embodiment, the groove 201a is formed in a continuous mesh shape, and the antenna 202 is formed in the groove 201a by forming the antenna 202 material in a mesh shape. The groove 201a is formed by laser etching, chemical etching, or the like. The lattice-shaped antenna 202 is formed by filling a conductive material in the lattice-shaped grooves 201 a. That is, the groove 201a is formed on the surface of the first board body 205 away from the second board body 206, and the antenna 202 formed in the groove 201a is also formed on the surface of the first board body 205 away from the second board body 206.

The second method comprises the following steps:

referring to fig. 1b, the difference between the present embodiment and the first embodiment is: the surface of the first board 205 close to the second board 206 is provided with a groove 201a, and the antenna 202 is disposed in the groove 201 a. That is, the antenna 202 of the present embodiment is closer to the second board 206.

The third method comprises the following steps:

referring to fig. 2a, a groove 201a is formed on a surface of the second board 206 away from the first board 205, the groove 201a is in a connected grid shape, the antenna structure includes an antenna 202, the antenna 202 is in a grid shape, and the antenna 202 is disposed in the groove 201 a. In this embodiment, the groove 201a is formed in a continuous mesh shape, and the antenna 202 is formed in the groove 201a by forming the antenna 202 material in a mesh shape. The groove 201a is formed by laser etching, chemical etching, or the like. The lattice-shaped antenna 202 is formed by filling a conductive material in the lattice-shaped grooves 201 a. That is, the groove 201a is formed on the surface of the second board body 206 away from the first board body 205, and the antenna 202 formed in the groove 201a is also formed on the surface of the second board body 206 away from the first board body 205. Because the antenna 202 is arranged on the outer surface, the loss of the cover plate structure to signals can be avoided, and the signal strength of the equipment can be further improved.

The method is as follows:

referring to fig. 2b, the difference between the present embodiment and the third embodiment is: the surface of the second board 206 close to the first board 205 is provided with a groove 201a, and the antenna 202 is disposed in the groove 201 a. That is, the antenna 202 of this embodiment is closer to the first board 205.

In other implementations, the antenna 202 may also be disposed on a surface of the second board 206 away from the first board 205, or the antenna 202 may also be disposed on a surface of the second board 206 close to the first board 205. So will need not to slot in second plate body 206, second plate body 206 structural integrity can guarantee the flexibility and the intensity of second plate body 206, and then guarantees the flexibility and the intensity of apron 20.

Therefore, the antenna 202 is disposed on either surface of the first board 205 or the second board 206, and the flexibility and strength of the cover plate 20 can be ensured.

The fifth mode is as follows:

referring to fig. 3a, the antenna structure includes an antenna 202 and a glue layer 203, the glue layer 203 is stacked on a surface of the first board 205 away from the second board 206, and the antenna 202 is disposed in the glue layer 203. In this embodiment, the glue layer 203 is disposed between the first board 205 and the electronic device body 10. The surface of the glue layer 203 close to the first board body 205 is provided with a groove 201a, the groove 201a is in a connected grid shape, and the antenna 202 material is formed in the groove 201a, so that the antenna 202 is in a grid shape. The groove 201a is formed on the glue layer 203 by a method such as nanoimprint. The lattice-shaped antenna 202 is formed by filling a conductive material in the lattice-shaped grooves 201 a. A groove 201a is formed on the surface of the glue layer 203 near the first board body 205, and an antenna 202 formed in the groove 201a is also formed on the surface of the glue layer 203 near the first board body 205. In other implementation manners, the grooves 201a may be disposed on two surfaces of the adhesive layer 203, and the antenna 202 is disposed in the groove 201a, which is not described herein again.

The method six:

referring to fig. 3b, the difference between the present method and the fifth method is: the adhesive layer 203 is laminated on the surface of the first board 205 close to the second board 206, and the antenna 202 is disposed in the adhesive layer 203. That is, the present adhesive layer 203 is disposed between the first board 205 and the second board 206. The antenna 202 is disposed in the adhesive layer 20, and the antenna 202 may be close to the first board 205 or close to the second board 206. The method is as follows:

referring to fig. 4a, the antenna structure includes an antenna 202 and a glue layer 203, the glue layer 203 is stacked on the surface of the second board 206 away from the first board 205, and the antenna structure 202 is integrated in the glue layer 203. In this embodiment, the adhesive layer 203 is disposed on the outer surface of the second board 206, the surface of the adhesive layer 203 close to the second board 206 is provided with the grooves 201a, the grooves 201a are in a connected grid shape, and the antenna 202 material is formed in the grooves 201a, so that the antenna junctions 202 are in a grid shape. The groove 201a is formed on the glue layer 203 by a method such as nanoimprint. The lattice-shaped antenna 202 is formed by filling a conductive material in the lattice-shaped grooves 201 a. A groove 201a is formed on the surface of the adhesive layer 203 near the second board body 206, and the antenna 202 formed in the groove 201a is also formed on the surface of the adhesive layer 203 near the second board body 206. In other implementation manners, the grooves 201a may be disposed on two surfaces of the adhesive layer 203, and the antenna 202 is disposed in the groove 201a, which is not described herein again.

The method eight:

referring to fig. 4b, the difference between the present method and the seventh method is: the adhesive layer 203 is laminated on the surface of the second board 206 close to the first board 205, and the antenna 202 is disposed in the adhesive layer 203. That is, the present adhesive layer 203 is disposed between the first board 205 and the second board 206. The antenna 202 is disposed in the adhesive layer 20, and the antenna 202 may be close to the first board 205 or close to the second board 206.

In this embodiment, the grid-shaped antenna structure 202 is formed by filling one of nano-silver particles, indium tin oxide, an alloy of indium tin oxide and silver, silver nanowires, and carbon nanotubes in the grid-shaped groove 201 a.

Referring to fig. 4c, in the above manner, in a preferred embodiment, at least one board further includes a protective layer 209, and the protective layer 209 is laminated on a surface of the second board 206 away from the first board 205. The protection layer 209 is stacked on the second board 206 for protecting the structures below the second board, such as the antenna 202, the first board 205, the second board 206, and the like. The passivation layer 209 includes one or more of an Anti-fingerprint (AF) layer, a Hard Coating (HC) layer, a Diamond-Like carbon (DLC) layer, and a silicon nitride layer.

The method is nine:

referring to fig. 4d, the antenna 202 is integrated in the protection layer 209. In this embodiment, the antenna 202 may be directly formed on the surface of the second board 206, and then the protective layer 209 covers the surface of the antenna 202. The protective layer 209 serves to protect the antenna 202. The antenna 202 may be formed by evaporating, sputtering or plating a layer of conductive material (including all conductive metals and composite metals), and etching, developing, laser direct writing, etc. to obtain a grid-shaped conductive antenna 202. The conductive material is preferably a conductive metal material. The material of the protection layer 209 is the same as that of the protection layer 209, and the description thereof is omitted here.

The manner in which the antenna 02 is formed is described below. There are two ways of forming the antenna 202.

The first method is as follows: referring to fig. 5-6, the antenna 202 may be formed by physical deposition or chemical deposition. After the antenna 202 is manufactured, the entire antenna 202 may be attached to the surface of the cover body 201, or may be attached to the surface of the cover body 201 close to the electronic device body 10 (fig. 5), or may be attached to the surface of the cover body 201 remote from the electronic device body 10 (fig. 6). The antenna 202 may be completely paved on the surface of the cover body 201, or partially paved on the surface of the cover body 201. The specific manufacturing method comprises the following steps: a layer of transparent conductive antenna 202 is formed by directly coating, evaporating, sputtering or plating a layer of transparent conductive material (e.g., indium tin oxide, alloy of indium tin oxide and silver, silver nanowire, carbon nanotube, etc.). Therefore, the manufactured antenna 202 is directly attached to the surface of the cover plate body 201, the space is saved, the manufacturing mode of the antenna 202 is simple, and the efficiency is higher.

The second method comprises the following steps: referring to fig. 7, the antenna 202 may be formed by filling a conductive material in the nano-stamped, laser-etched or chemically-etched groove 201a to form a grid-shaped antenna 202. The grooves 201a are on the micro-nanometer scale, as required by the design. The antenna structure 202 is in a grid shape. Specifically, a groove 201a may be formed in the cover plate 20 by laser etching or chemical etching, and the groove 201a may be filled with a conductive material to form the grid-shaped antenna 202. When the groove 201a is formed on the adhesive layer 203, the adhesive layer 203 may be formed by coating, then the groove 201a is formed by using a nano imprinting technique, after the adhesive layer 203 is cured, a conductive material is filled in the groove 201a, and then blackening treatment is performed to form the antenna 202. The conductive material is preferably a conductive metal material. Alternatively, the conductive antenna 202 may be obtained by evaporating, sputtering or plating a layer of conductive material (including all conductive metals and composite metals), etching, developing, laser direct writing, etc.

When the groove 201a is formed, the pattern of the groove 201a matches the pattern of the antenna 202. In one particular implementation, the pattern of the groove 201a is a lattice-like channel that is interconnected so that the antenna 202 formed by the conductive material received into the groove 201a is in a lattice-like shape and can better match the groove 201 a. The shape of the latticed groove body can be square, the bottom edge of the latticed groove body is arc-shaped, the lower bottom of the latticed groove body is longer than the upper bottom of the latticed groove body, the upper bottom of the latticed groove body is longer than the lower bottom of the latticed groove body, or other shapes such as irregular shapes.

Referring to fig. 8-10, in some embodiments, the antenna 202 may be formed of a grid of conductive wires. The antenna 202 includes a plurality of grid cells. The grid cells may be square, diamond, or regular hexagon or other shapes such as irregular shapes. The grid cells being square means that each grid cell of the antenna 202 is square. Grid cells have a similar meaning for rhombuses or regular hexagons. The irregular shape of the grid cells means that the grid cells constituting the antenna 202 may include a combination of two or more of a square, a diamond, a regular hexagon, a rectangle, and other random shapes. It is understood that the antenna 202 is in a grid shape to maintain the antenna 202 with high light transmittance.

In some embodiments, the antenna 202 integrally formed by the plurality of grid cells may be in the shape of a strip, an i-shape, or a "C" shape. In the present application, the specific shape of the antenna 202 is not limited herein, and may be other shapes than the above shapes, and may be determined according to specific practical situations.

In some embodiments, the grid unit is formed by solidifying the conductive material filled in the groove 201 a. The conductive material may be a metal material or Indium Tin Oxide (ITO). Preferably, the conductive material is a metal material selected from one of gold ((Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum ((Mo), aluminum (Al), and zinc (Zn), or an alloy of at least two of gold (Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum ((Mo), aluminum ((Al), and zinc (Zn).

Compared with expensive Indium Tin Oxide (ITO), the price of gold (Au), silver (Ag), copper (Cu), nickel (Ni), molybdenum (Mo), aluminum ((Al) and zinc (Zn) is low, which is beneficial to reducing the price of the decoration film 204, and the conductivity of the metals can meet the conductivity requirement.

Referring to FIG. 11, in some embodiments, the line width d1 of the grid may be 0.5um to 35 um. It is understood that the light transmittance of the antenna 202 is related to the line width of the grid, and the smaller the line width of the grid, the better the light transmittance of the cover plate 20. It will be appreciated that if the cover 20 does not require optical transparency, then the particular grid line width is set in a size that facilitates manufacture of the antenna.

In some embodiments, the grid spacing d2 may be 20um to 500 um. The mesh pitch may be set according to light transmittance, conductivity, cost, and the like.

Referring to fig. 12, in some embodiments, the aperture d3 of the mesh may be 20um to 500 um. It is understood that the aperture d3 of the mesh is provided in consideration of light transmittance, conductivity, cost, and the like. The aperture d3 of the mesh includes the distance between two sets of diagonal vertices.

In some embodiments, the grid lines are 0.5 um-20 um deep; further, it is preferably 0.5um to 4.5 um. It is understood that the depth of the grid lines is the thickness of the grid cells, the depth of the grid lines is related to the depth of the groove 201a, and the depth of the grid lines can be set according to the light transmittance, the electrical conductivity, the cost, and the like.

In some embodiments, the resistivity of the conductive material of the antenna 202 is low, and the sheet resistance of the antenna 202 may be 10 Ω/sq or less. Thus, the conductivity of the antenna 202 is ensured, and signal transmission is facilitated.

Referring to fig. 13-14, the antenna 202 is designed in a full-area structure or partially as required. In actual manufacturing, the antenna 202 may be designed to be a whole structure or a partial structure according to the design requirement of the antenna 202.

Referring to fig. 15-18, the cover plate 20 further includes a decoration ink layer 207, and the decoration ink layer 207 is stacked between the electronic device body and the cover plate body 201. In the present embodiment, the cover plate 20 may be a front cover of the electronic device.

When the cover plate 20 includes the decoration ink layer 207 and the adhesive layer 203 is absent, the antenna 202 is disposed in the first plate 205 and close to the decoration ink layer 207 (fig. 15), or disposed in the second plate 206 and close to the protection layer 209 (fig. 16).

When the cover plate 20 further includes the adhesive layer 203, the adhesive layer 203 is disposed between the second plate 206 and the protection layer 209, the antenna 202 is disposed in the adhesive layer 203, and the antenna 202 is close to the second plate 206 (fig. 17); or the adhesive layer 203 is disposed between the first plate 205 and the decoration ink layer 207, the antenna 202 is disposed in the adhesive layer 203, and the antenna 202 is close to the decoration ink layer 207 (fig. 18).

The different positions of the antenna 202 allow the cover plate 20 to flexibly position the antenna 202 as desired.

Referring to fig. 19 to 22, the cover plate 20 further includes a glare film layer 208, and the glare film layer 208 is stacked between the electronic device body and the cover plate body 201. In the present embodiment, the cover plate 20 may be a front cover of the electronic device.

When the cover plate 20 includes the glare film layer 208 and the adhesive layer 203 is absent, the antenna structure 202 is disposed in the first plate 205 and adjacent to the glare film layer 208 (fig. 19), or disposed in the second plate 206 and adjacent to the protective layer 209 (fig. 20).

When the cover plate 20 further includes the adhesive layer 203, the adhesive layer 203 is disposed between the second plate 206 and the protective layer 209, the antenna 202 is disposed in the adhesive layer 203, and the antenna 202 is close to the glare film layer 208 (fig. 21); or the adhesive layer 203 is disposed between the second board 206 and the glare film layer 208, and the antenna 202 is disposed in the adhesive layer 203 and close to the second board 206 (fig. 22).

The different positions of the antenna 202 allow the cover plate 20 to flexibly position the antenna structure 202 as desired.

When the glare film layer 208 of the present application is applied to the back cover, the transparent antenna 202 (metal mesh antenna, transparent metal antenna, ITO transparent antenna) of the present invention is integrated in the cover plate 20, which has the advantage of integrating high transparency, low impedance, selectable antenna placement position, and other integrated designs.

In this way, by disposing the antenna 202 in the cover plate 20, the antenna 202 does not occupy the effective internal space of the electronic device, thereby solving the technical problem that the electronic product does not meet the structural design requirement due to the fact that the antenna 202 occupies too much effective internal space of the electronic device.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims

1. The utility model provides an electronic equipment's apron for on the lid fits the electronic equipment body, a serial communication port, the apron is including apron body and antenna structure, the apron body includes first plate body and second plate body, first plate body with the range upon range of setting of second plate body, first plate body is close to the electronic equipment body, antenna structure includes the antenna, the antenna is located the surface of first plate body is kept away from to the second plate body.

2. The cover plate according to claim 1, wherein a surface of the second plate body away from the first plate body is provided with a groove, the groove is in a connected grid shape, the antenna is in a grid shape, and the antenna structure is arranged in the groove.

3. The cover plate according to claim 1, wherein the antenna structure comprises an antenna and a glue layer, the glue layer is laminated on a surface of the second plate body away from the first plate body, and the antenna is integrated in the glue layer.

4. The cover sheet of claim 1, wherein the at least one board body further comprises a protective layer laminated to a surface of the second board body remote from the first board body and covering the antenna structure.

5. The cover sheet according to claim 1, further comprising a decorative ink layer laminated between the electronic device body and the cover sheet body.

6. The cover sheet of claim 1, further comprising a glare film layer laminated between the electronic device body and the cover sheet body.

7. The cover plate according to claim 1, wherein the first plate body is made of one or more of acrylic polycarbonate, polymethyl methacrylate, a composite material of acrylic polycarbonate and polymethyl methacrylate, glass or polyethylene terephthalate; the second plate body is made of one or more of acrylic polycarbonate, polymethyl methacrylate, a composite material of acrylic polycarbonate and polymethyl methacrylate, and glass or polyethylene terephthalate.

8. The cover plate according to claim 1, wherein the first plate is made of polycarbonate, and the second plate is made of polymethyl methacrylate.

9. The cover plate according to claim 1, wherein the antenna structure is a conductive film formed on a surface of the second plate body.

10. The cover plate according to claim 9, wherein the antenna structure is a conductive film formed on the surface of the second plate body by directly coating, evaporating, sputtering or electroplating a layer of transparent conductive material.

11. An electronic device, comprising an electronic device body and the cover plate according to any one of claims 1 to 10, wherein the cover plate covers the electronic device body.